CA1132694A - 'led' assembly and method of manufacture - Google Patents
'led' assembly and method of manufactureInfo
- Publication number
- CA1132694A CA1132694A CA321,595A CA321595A CA1132694A CA 1132694 A CA1132694 A CA 1132694A CA 321595 A CA321595 A CA 321595A CA 1132694 A CA1132694 A CA 1132694A
- Authority
- CA
- Canada
- Prior art keywords
- led
- portions
- strip
- contacts
- spring arms
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title claims description 6
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000000463 material Substances 0.000 claims abstract description 15
- 229910052751 metal Inorganic materials 0.000 claims abstract description 4
- 239000002184 metal Substances 0.000 claims abstract description 4
- 238000005538 encapsulation Methods 0.000 claims description 6
- 230000000712 assembly Effects 0.000 claims description 5
- 238000000429 assembly Methods 0.000 claims description 5
- 230000005499 meniscus Effects 0.000 claims description 4
- 230000000694 effects Effects 0.000 claims description 2
- 230000002040 relaxant effect Effects 0.000 claims description 2
- 238000005476 soldering Methods 0.000 description 4
- 101100310856 Drosophila melanogaster spri gene Proteins 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
Abstract
9091 CAN ABSTRACT Contact springs are stamped from flat sheet metal in strip form and are bent up to face lengthwise of a carrier strip portion. Two strip portions are positioned with respective contact springs facing in pairs, the carrier strip portions being adjusted in relative lengthwise position to control the relative position of the facing spring portions and ensure a gap less than that of an LED to be gripped. Facing spring portions are biased apart to receive and grip an LED which is suitably then flow soldered to the springs before encapsulating the LED and portions of the springs in a light transmitting material, and severing carrier strip portions from the contacts.
Description
-`` ll~Z~9~
9~9 This invention relates to a light emittin~ diode, LED, assembly and to its method of manufacture.
A method of making an LED assemhly comprising an LED
conn~cted between a pair of contacts and encapsulated within lisht transmittin~ mcaterial, portions of the contacts extending externally of the encapsulation for connection to circuitry according to the present invention comprises forming a plurality of icdentical contacts integral ~lith a carrier strip from sheet metal, each contact having a yenerally flat elongate portion extending from a side edge of the carrier strip in coplanar fashion, normal to the length of the strip and a spring arm bent up from a side of the elongate portion at an end thereo di3tal from the strip, ahout an axis extending lengthwise of the el.ongate portion and normally of the strip, positioning two sec~ions or carrier strip in spaced, parallel coplanar relation with contacts of each strip extending towards the other strip and with ends o spring arms of one strip overlapping ends of corresponding spring arms of the other str.ip in face to face relation, adjusting the relative positions of the strip, lengthwise, to reduce the gap between each pair o~ ~acing spring arm ends to less than that ~f an LED to be gripped therebetween t springing the arms apart and insertln~ the cdiode between the free ends, relaxing the arms res.illen~ly to encJage and grip the LED between them, electrically conne~ti.lg the ree end~ to respective side3 of the LED, enca~sulating the gripped di~de and portions of thQ arms .' ' ' ~.
- . . . . .. .
. . ~-, .. : . : : , . ~ - . , .. ., , . ~ -:
, , - . . ~ .
Z~9~
within transluscent material and severing the contacts from the strips.
The invention also includes an IED assembly comprising a pair of identical contacts each having a spring arm extending from a lead portion and disposed substantially at right angles relative to said lead portion, free ends of the spring arms overlapping in face-to-face relation and resiliently engaging an LED between them, the LE~ and portions of the spring arms being encapsulated in light-transmitting material, the lead portions of the contacts extending externally of the encapsulation for connection to circuitry.
The invention will ncw be described by way o~ example with reference to the acccmpanying drawings, in which:-Figure 1 is an enlarged fragmentary perspective view of a pair of contacts positioned fo~ receptio~ of an LED between them and each extending .from a respective carrier strip;
Figure 2 is a plan view of the eontacts of Figure l;
Figure 3 is a side elevation of the contacts of Figures 1 and 2;
Figure 4 is a section taken on the line 4-4 of Figure 2 and viewed in the direction of the arrows;
Figure 5 is a fragmentary perspeetive view of an.lED
assembly incorporating eontacts as diselosed in Figures 1 to 4;
Figure 6 is a section:taken on the line 6 6 of Figure 5 and viewed in the direction of the arrows;
~ 3 --,. ~ , ~ .. . , - .. . -,, . . :
, . .. . : ~. .-: :. ~ . . : . . . -:. . ~ .
. : . : ~:
: ' . :: .
Figure 7 is a side ele~ation of part of a modified assembly embodying ~lo LED's, and Figure 8 is a fragmentary plan vie~J of the upper part o~ the assen~ly o~ Figure 7.
In Figu.re l a pai.r of carrier strips l, l' are arranged in spaced, parallel, coplanar relation. Each carrier strip l, l' is formed along its length ~ith a series of uniformly spaced contact portions 2, 2' of ldentlcal form extencling from a side edge of the associated carrier strip. Suitably the carrier strips l, l' and associated contact portions 2~ 2' are stamped and ormed ~rom a continuous strip of sheet metal in a high speed stamping press, and lengths of strip, so formed, are arxanged in a suitable jig, not sho~m, in the Figure l lS condition. Adjacent contact portions 2, 2' of respective carriers l, l' are ioined by integral support strips 3, 3 extending pa~allel ~o the carrier strips l, l'.
Each contact portion 2, 2' comprises on a side of the support strip 3, 3' proximal to the associated carrier l, ~0 l1 a narrow lead portion 4, 4' suitably ormed with a longitudinal embossment and joined at one end to the caxrier strip ~y a reduced section, readily severable portion, and ~t ~he support strip 3, 3', enlarging in ~7idth, as seen in plan in Fiyure 2, to a generally rectangular web section 5, 5' extending on the opposite side o~ the support ~trip 3, 3'. The ends o~ we~ sectlon ~, 5' are formecl with 2 contact finger-ll1ce sprinc3 6, 61 ~ent up froin the pl~e of ~L ' .
- :: , . ,- . .. . . .. . .
-! - ' ~ ~ :
3 ~3'~1694 the web, about an axis extending noxmall~ to the length of the carrier 1, 1'. Each contact spring 6, G', as seen in side elevation in Figure 3, extends upwardl~l fro.~ the plane oE the web S, 5' at an inclination away from the carrier 1, 1' an~ at its free end is formed with an upright contact plate portion 7, 7' having a central slot 8, 8' extending downwardly rom an upper edge.
The carrier ~trips 1, 1' are mounted in the jig in coplanar fashion, with the contacts 2, 2' extending towards each other and the contact plate portions 7, 7' overlapping in face to face relation. As seen in Figure 2, the finger-llke spring portions 6, 6' extend from web portions 9, 9' of reduced ~lidth, so that the spring portions 6, 6' are disposed generally centrally of the widths of the contacts, L5 and the opposed contacts 2,2' are generally in alignment.
The carrier strips 1, 1' are adjusted in position in the jig, lengthwise of the strips 1, 1' to determine the spacing between facing contact plate portions 7, 7' and the eventual spring pressure to be applied to an LED to be clamped between them. The adjustment may be such as to leave a small clearance between the plate portions 7, 7' or to engase the plate portions and effect flexure of the springs 6, 6' to give a "pre loading".
Trial and error pre~loading may be required to ensure that the LED is properly gripped ~ithoui excessive forces being generated which might displace the L~D before the soldering and potting is perfor~ed, and yet sufici,~nt to . , . ~
~ ~ .
.:~ , ~ , . .. .
1~269~ 7, hold the LED dur~n~ the manufacturing process a~ainst any xelaxation which migh~ occur.
When the adjustment is completed, the facing plate portions 7,7' are deflected apart by flexure of the springs, an LED 10 inserted bet~een the plate portions and the springs 6, 6' allowed to relax a~ainst opposite fac~s of the LED to clamp it between the plate portions 7, 7' unde.r spring pressure as seen in Figure 4. Subse~uently ! -the plate portions 7, 7' are soldered to respective ~, engaged ac~s of the LED and to this end the opposed fac2s of the plate portions are suitably pretinned and soldering is effected by a reflow process. The LED insertion and soldering o2erations are suitably e~fected at a series of pairs of plate portions 7, 7' len~thwise of the carrier strips 1, 1' to produce a ladder-like arxay of LED
assemblies each comprising an LED secured to a pair of contacts 2, 2' and the contacts 2, 2' of each assembly being integrally joined to adjacent assemblies by the carrier strips 1, 1' and support strips 3, 3'.
~0 As shown in Figures 5 and 6, after the soldering operation, the carrier strips 1, 1' and contacts 2, 2' with the connected LED' 5 are removed from the jig and the spri.ng pairs 6, 6' with the respecklve LED's 10 are individually enca~sulaked within respective lens members 11.
A plurality of lens m~mbers ].1 is formed as a skrip-liXe : series spaced at intervals corresponding to the spacing of conkacts 2~ 2' along the strips 1, 1' by pairs o moulded .~.
,; ~i . ! ~ ' ' '' ' : ' ' , ' ~ ' ':' . ' , : ; ~ ' : ' :
.' ` ' ' . ' ~, : ' ' ' ' ~3Z~
webs 12. Each lens shell 11 is formed with a cavity 13, adapted to receive a complementary pair of springs 6, 6' and the associated LED 10, with the web por-tions 5,5' engaging a basal surface of the lens shell. With the series of lens shells 11 registered with the ladder-like array of LED assemblies on the carrierstrips 1, 1', the cavities 13 are at least partially filled with a transluscent encapsulating material 14, which is set within the cavities 13 to embed the LED's 10 and spring pairs 6, 6' within respective cavities. The body of encap-sulating material is suitably set with a concave meniscus surface 15 at the opening to the cavity 13, and the surface 15 is suitably coated with a reflector16 to reflect light radiated downwardly as seen in Figure 6, upwardly through the lens. A suitable material is a titanium oxide paint. The upper surface 17 of the lens shell is centrally of upwardly convex form at 18 and the central por-tion is bordered by upwardly and inwardly facing surfaces, 19, 19' extending generally radially of the surface la which assists in reflection of diode emitted light into a strip-like diffusion across the lens. The leads 4 and web portions 5 are disposed externally of the lens shell cavities and the leads 4 project from the shells 11. The carrier strips l, l' are severed to separate the leads 4, 4' and the support strips 3, 3' may be selectively severed to separate desired single or grouped LED assemblies for connection to circuitry.
The leads 4, 4' are suitably bent at right angles to the ~ ' - , :, : , :: ,~:::
,, : : :
., ,, , ~ ~:
~ 9091 weh portions 5, 5' as shown in Figures 5 and 6 to extend below the lens shells ll or convenience of asserQbly into sockets or printed circuit board apertures, not sho-,m, for B connection of ~*~-e~ each LED assembly into circuitry.
Xn the modified embodiment of Figures 7 and 8, like r~ference numerals are used i.n relation to parts corresponcling to those of Figures l to 4. A pair of LED's 20, 21 is trapped between the opposed contact plate portions 7, 7', one on each side of the slots 8, 8'. The LED's are suitahly arransed with opposite polarity in relation to the plate portions 7, t' and are or differen~
liyht emitting colours. In operation, reversal of polarity of a voltag~ applied is indicated by illumination of a different one of the LED's and corresponding colour change.
.
~s; .
.. . . . . .
: , ,, ,, ; ' , :
.
.'~'~ ', ' ' ' '' ' .
'' i
9~9 This invention relates to a light emittin~ diode, LED, assembly and to its method of manufacture.
A method of making an LED assemhly comprising an LED
conn~cted between a pair of contacts and encapsulated within lisht transmittin~ mcaterial, portions of the contacts extending externally of the encapsulation for connection to circuitry according to the present invention comprises forming a plurality of icdentical contacts integral ~lith a carrier strip from sheet metal, each contact having a yenerally flat elongate portion extending from a side edge of the carrier strip in coplanar fashion, normal to the length of the strip and a spring arm bent up from a side of the elongate portion at an end thereo di3tal from the strip, ahout an axis extending lengthwise of the el.ongate portion and normally of the strip, positioning two sec~ions or carrier strip in spaced, parallel coplanar relation with contacts of each strip extending towards the other strip and with ends o spring arms of one strip overlapping ends of corresponding spring arms of the other str.ip in face to face relation, adjusting the relative positions of the strip, lengthwise, to reduce the gap between each pair o~ ~acing spring arm ends to less than that ~f an LED to be gripped therebetween t springing the arms apart and insertln~ the cdiode between the free ends, relaxing the arms res.illen~ly to encJage and grip the LED between them, electrically conne~ti.lg the ree end~ to respective side3 of the LED, enca~sulating the gripped di~de and portions of thQ arms .' ' ' ~.
- . . . . .. .
. . ~-, .. : . : : , . ~ - . , .. ., , . ~ -:
, , - . . ~ .
Z~9~
within transluscent material and severing the contacts from the strips.
The invention also includes an IED assembly comprising a pair of identical contacts each having a spring arm extending from a lead portion and disposed substantially at right angles relative to said lead portion, free ends of the spring arms overlapping in face-to-face relation and resiliently engaging an LED between them, the LE~ and portions of the spring arms being encapsulated in light-transmitting material, the lead portions of the contacts extending externally of the encapsulation for connection to circuitry.
The invention will ncw be described by way o~ example with reference to the acccmpanying drawings, in which:-Figure 1 is an enlarged fragmentary perspective view of a pair of contacts positioned fo~ receptio~ of an LED between them and each extending .from a respective carrier strip;
Figure 2 is a plan view of the eontacts of Figure l;
Figure 3 is a side elevation of the contacts of Figures 1 and 2;
Figure 4 is a section taken on the line 4-4 of Figure 2 and viewed in the direction of the arrows;
Figure 5 is a fragmentary perspeetive view of an.lED
assembly incorporating eontacts as diselosed in Figures 1 to 4;
Figure 6 is a section:taken on the line 6 6 of Figure 5 and viewed in the direction of the arrows;
~ 3 --,. ~ , ~ .. . , - .. . -,, . . :
, . .. . : ~. .-: :. ~ . . : . . . -:. . ~ .
. : . : ~:
: ' . :: .
Figure 7 is a side ele~ation of part of a modified assembly embodying ~lo LED's, and Figure 8 is a fragmentary plan vie~J of the upper part o~ the assen~ly o~ Figure 7.
In Figu.re l a pai.r of carrier strips l, l' are arranged in spaced, parallel, coplanar relation. Each carrier strip l, l' is formed along its length ~ith a series of uniformly spaced contact portions 2, 2' of ldentlcal form extencling from a side edge of the associated carrier strip. Suitably the carrier strips l, l' and associated contact portions 2~ 2' are stamped and ormed ~rom a continuous strip of sheet metal in a high speed stamping press, and lengths of strip, so formed, are arxanged in a suitable jig, not sho~m, in the Figure l lS condition. Adjacent contact portions 2, 2' of respective carriers l, l' are ioined by integral support strips 3, 3 extending pa~allel ~o the carrier strips l, l'.
Each contact portion 2, 2' comprises on a side of the support strip 3, 3' proximal to the associated carrier l, ~0 l1 a narrow lead portion 4, 4' suitably ormed with a longitudinal embossment and joined at one end to the caxrier strip ~y a reduced section, readily severable portion, and ~t ~he support strip 3, 3', enlarging in ~7idth, as seen in plan in Fiyure 2, to a generally rectangular web section 5, 5' extending on the opposite side o~ the support ~trip 3, 3'. The ends o~ we~ sectlon ~, 5' are formecl with 2 contact finger-ll1ce sprinc3 6, 61 ~ent up froin the pl~e of ~L ' .
- :: , . ,- . .. . . .. . .
-! - ' ~ ~ :
3 ~3'~1694 the web, about an axis extending noxmall~ to the length of the carrier 1, 1'. Each contact spring 6, G', as seen in side elevation in Figure 3, extends upwardl~l fro.~ the plane oE the web S, 5' at an inclination away from the carrier 1, 1' an~ at its free end is formed with an upright contact plate portion 7, 7' having a central slot 8, 8' extending downwardly rom an upper edge.
The carrier ~trips 1, 1' are mounted in the jig in coplanar fashion, with the contacts 2, 2' extending towards each other and the contact plate portions 7, 7' overlapping in face to face relation. As seen in Figure 2, the finger-llke spring portions 6, 6' extend from web portions 9, 9' of reduced ~lidth, so that the spring portions 6, 6' are disposed generally centrally of the widths of the contacts, L5 and the opposed contacts 2,2' are generally in alignment.
The carrier strips 1, 1' are adjusted in position in the jig, lengthwise of the strips 1, 1' to determine the spacing between facing contact plate portions 7, 7' and the eventual spring pressure to be applied to an LED to be clamped between them. The adjustment may be such as to leave a small clearance between the plate portions 7, 7' or to engase the plate portions and effect flexure of the springs 6, 6' to give a "pre loading".
Trial and error pre~loading may be required to ensure that the LED is properly gripped ~ithoui excessive forces being generated which might displace the L~D before the soldering and potting is perfor~ed, and yet sufici,~nt to . , . ~
~ ~ .
.:~ , ~ , . .. .
1~269~ 7, hold the LED dur~n~ the manufacturing process a~ainst any xelaxation which migh~ occur.
When the adjustment is completed, the facing plate portions 7,7' are deflected apart by flexure of the springs, an LED 10 inserted bet~een the plate portions and the springs 6, 6' allowed to relax a~ainst opposite fac~s of the LED to clamp it between the plate portions 7, 7' unde.r spring pressure as seen in Figure 4. Subse~uently ! -the plate portions 7, 7' are soldered to respective ~, engaged ac~s of the LED and to this end the opposed fac2s of the plate portions are suitably pretinned and soldering is effected by a reflow process. The LED insertion and soldering o2erations are suitably e~fected at a series of pairs of plate portions 7, 7' len~thwise of the carrier strips 1, 1' to produce a ladder-like arxay of LED
assemblies each comprising an LED secured to a pair of contacts 2, 2' and the contacts 2, 2' of each assembly being integrally joined to adjacent assemblies by the carrier strips 1, 1' and support strips 3, 3'.
~0 As shown in Figures 5 and 6, after the soldering operation, the carrier strips 1, 1' and contacts 2, 2' with the connected LED' 5 are removed from the jig and the spri.ng pairs 6, 6' with the respecklve LED's 10 are individually enca~sulaked within respective lens members 11.
A plurality of lens m~mbers ].1 is formed as a skrip-liXe : series spaced at intervals corresponding to the spacing of conkacts 2~ 2' along the strips 1, 1' by pairs o moulded .~.
,; ~i . ! ~ ' ' '' ' : ' ' , ' ~ ' ':' . ' , : ; ~ ' : ' :
.' ` ' ' . ' ~, : ' ' ' ' ~3Z~
webs 12. Each lens shell 11 is formed with a cavity 13, adapted to receive a complementary pair of springs 6, 6' and the associated LED 10, with the web por-tions 5,5' engaging a basal surface of the lens shell. With the series of lens shells 11 registered with the ladder-like array of LED assemblies on the carrierstrips 1, 1', the cavities 13 are at least partially filled with a transluscent encapsulating material 14, which is set within the cavities 13 to embed the LED's 10 and spring pairs 6, 6' within respective cavities. The body of encap-sulating material is suitably set with a concave meniscus surface 15 at the opening to the cavity 13, and the surface 15 is suitably coated with a reflector16 to reflect light radiated downwardly as seen in Figure 6, upwardly through the lens. A suitable material is a titanium oxide paint. The upper surface 17 of the lens shell is centrally of upwardly convex form at 18 and the central por-tion is bordered by upwardly and inwardly facing surfaces, 19, 19' extending generally radially of the surface la which assists in reflection of diode emitted light into a strip-like diffusion across the lens. The leads 4 and web portions 5 are disposed externally of the lens shell cavities and the leads 4 project from the shells 11. The carrier strips l, l' are severed to separate the leads 4, 4' and the support strips 3, 3' may be selectively severed to separate desired single or grouped LED assemblies for connection to circuitry.
The leads 4, 4' are suitably bent at right angles to the ~ ' - , :, : , :: ,~:::
,, : : :
., ,, , ~ ~:
~ 9091 weh portions 5, 5' as shown in Figures 5 and 6 to extend below the lens shells ll or convenience of asserQbly into sockets or printed circuit board apertures, not sho-,m, for B connection of ~*~-e~ each LED assembly into circuitry.
Xn the modified embodiment of Figures 7 and 8, like r~ference numerals are used i.n relation to parts corresponcling to those of Figures l to 4. A pair of LED's 20, 21 is trapped between the opposed contact plate portions 7, 7', one on each side of the slots 8, 8'. The LED's are suitahly arransed with opposite polarity in relation to the plate portions 7, t' and are or differen~
liyht emitting colours. In operation, reversal of polarity of a voltag~ applied is indicated by illumination of a different one of the LED's and corresponding colour change.
.
~s; .
.. . . . . .
: , ,, ,, ; ' , :
.
.'~'~ ', ' ' ' '' ' .
'' i
Claims (9)
1. A method of making an LED assembly comprising an LED
connected between a pair of contacts and encapsulated within a light transmitting material, portions of the contacts extending from the encapsulation for connection to circuitry characterised by forming a plurality of identical contacts integral with a carrier strip from sheet metal, each contact having a generally flat elongate portion extending from a side edge of the carrier strip in coplanar fashion, normal to the length of the strip and a spring arm bent up from a side of the elongate portion at an end thereof distal from the strip, about an axis extending lengthwise of the elongate portion and normally of the strip, positioning two sections of carrier strip in spaced, parallel, coplanar relation with contacts of each strip extending towards the other strip and with ends of spring arms of one strip overlapping ends of corresponding spring arms of the other strip in face to face relation, adjusting the relative positions of the strips, lengthwise, to reduce the gap between each pair of facing spring arm ends to less than that of an LED to be gripped therebetween, springing the arms apart and inserting the diode between the free ends, relaxing the arms resiliently to engage and grip the LED
between them, electrically connecting the free ends to respective sides of the LED, encapsulating the gripped diode and portions of the arms within light transmitting material and severing the contacts from the strips.
connected between a pair of contacts and encapsulated within a light transmitting material, portions of the contacts extending from the encapsulation for connection to circuitry characterised by forming a plurality of identical contacts integral with a carrier strip from sheet metal, each contact having a generally flat elongate portion extending from a side edge of the carrier strip in coplanar fashion, normal to the length of the strip and a spring arm bent up from a side of the elongate portion at an end thereof distal from the strip, about an axis extending lengthwise of the elongate portion and normally of the strip, positioning two sections of carrier strip in spaced, parallel, coplanar relation with contacts of each strip extending towards the other strip and with ends of spring arms of one strip overlapping ends of corresponding spring arms of the other strip in face to face relation, adjusting the relative positions of the strips, lengthwise, to reduce the gap between each pair of facing spring arm ends to less than that of an LED to be gripped therebetween, springing the arms apart and inserting the diode between the free ends, relaxing the arms resiliently to engage and grip the LED
between them, electrically connecting the free ends to respective sides of the LED, encapsulating the gripped diode and portions of the arms within light transmitting material and severing the contacts from the strips.
2. A method as claimed in claim 1, in which the carrier strips are adjusted to engage pairs of facing ends of the spring arms to effect flexure of the spring arms and preloading of the springs.
A method as claimed in claim 1, in which adjacent contacts are initially integrally joined by support strip portions extending in spaced, parallel relation to the carrier strip and after the encapsulation of a pluality of LED spring arm pairs in respective enclosures the support strips are selectively severed to separate encapsulated LED assemblies singly or in desired groups.
4. A method as claimed in claim 1, in which portions of a pair of spring arms and the associated LED are encapsulated within a recess of a lens shell by light transmitting material, the meniscus surface of the encapsulating material being arcuately convex towards the LED and coated with reflective material.
5. An LED assembly comprising a pair of identical contacts each having a spring arm extending from a lead portion and disposed substantially at right angles relative to said lead portion, free ends of the spring arms overlapping in face-to-face relation and resiliently engaging an LED between them, the LED and portions of the spring arms being encapsulated in light-transmitting material, the lead portions of the contacts extending externally of the encapsulation for connection to circuitry.
6. An assembly as claimed in claim 5, in which the overlapping portions of the spring arms are formed with respective slots extend-ing inwardly from the free ends to define end portions on each side of the slots, and a pair of LED's is secured between a pair of overlapping portions, one on each side of the slots, the LED's being arranged with reverse polarity in rela-tion to the contacts.
7. An assembly as claimed in claim 5, in which an LED and portions of the associated spring arms are encapsulated within a concave recess of a lens shell, the meniscus surface of the encapsulating material being arcuately con-vex towards the LED and being coated with reflective material.
8. An assembly as claimed in claim 7 in which the lens shell is formed with a central convex lens portion and on each side with a projection having a surface facing the convex lens portion and inclined generally radially of the meniscus surface of the encapsulation.
9. An assembly as claimed in claim 5 and comprising a plurality of pairs of contacts each pair being associated with a respective LED, the LED and portions of the spring arms of the associated contacts being encapsulated in light transmitting material and corresponding contacts of respective pairs being integrally joined by support strip portions.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US883,559 | 1978-03-06 | ||
| US05/883,559 US4247864A (en) | 1978-03-06 | 1978-03-06 | Light emitting diode assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1132694A true CA1132694A (en) | 1982-09-28 |
Family
ID=25382836
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA321,595A Expired CA1132694A (en) | 1978-03-06 | 1979-02-15 | 'led' assembly and method of manufacture |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US4247864A (en) |
| JP (1) | JPS54126490A (en) |
| BE (1) | BE874462A (en) |
| CA (1) | CA1132694A (en) |
| DE (1) | DE2908460A1 (en) |
| ES (1) | ES478286A1 (en) |
| FR (1) | FR2419589A1 (en) |
| GB (1) | GB2015387B (en) |
| IT (1) | IT1110792B (en) |
| NL (1) | NL7901166A (en) |
| SE (1) | SE7902026L (en) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2940769A1 (en) * | 1979-10-08 | 1981-04-16 | Siemens AG, 1000 Berlin und 8000 München | Contacting of LED with light emitting chip - using complete metallising of chip surfaces for its insertion between anode and cathode which form shanks of metal system support |
| US4404582A (en) * | 1980-11-28 | 1983-09-13 | Westinghouse Electric Corp. | Mounting arrangement for disc mounted semiconductor devices |
| EP0079161A3 (en) * | 1981-11-06 | 1985-04-24 | AMP INCORPORATED (a New Jersey corporation) | Led lamp and mounting base therefor |
| US4471158A (en) * | 1981-12-11 | 1984-09-11 | Advanced Circuit Technology, Inc. | Programmable header |
| JPS5991764U (en) * | 1982-12-10 | 1984-06-21 | ロ−ム株式会社 | light emitting diode lamp |
| IT1212708B (en) * | 1983-02-28 | 1989-11-30 | Ates Componenti Elettron | SEMICONDUCTOR POWER DEVICE CONSISTING OF A MULTIPLICITY OF EQUAL ACTIVE ELEMENTS CONNECTED IN PARALLEL. |
| FR2565726B1 (en) * | 1984-06-08 | 1987-11-27 | Radiotechnique Compelec | METHOD FOR PRODUCING A LIGHT SIGNALING PANEL WITH LIGHT EMITTING DIODES AND A PANEL OBTAINED THEREBY. |
| DE3777785D1 (en) * | 1986-12-26 | 1992-04-30 | Idec Izumi Corp | CARRIER TAPE FOR ELECTRONIC COMPONENTS AND PRODUCTION METHOD. |
| DE19621124A1 (en) * | 1996-05-24 | 1997-11-27 | Siemens Ag | Optoelectronic converter and its manufacturing process |
| US6083768A (en) * | 1996-09-06 | 2000-07-04 | Micron Technology, Inc. | Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components |
| US6521916B2 (en) * | 1999-03-15 | 2003-02-18 | Gentex Corporation | Radiation emitter device having an encapsulant with different zones of thermal conductivity |
| KR20020045694A (en) * | 2000-12-09 | 2002-06-20 | 이택렬 | An Optical semiconductive device and the manufacturing method thereof |
| US7510400B2 (en) * | 2007-03-14 | 2009-03-31 | Visteon Global Technologies, Inc. | LED interconnect spring clip assembly |
| US7621752B2 (en) * | 2007-07-17 | 2009-11-24 | Visteon Global Technologies, Inc. | LED interconnection integrated connector holder package |
| JP4726882B2 (en) * | 2007-11-15 | 2011-07-20 | 株式会社阪村研究所 | Method for producing stimulating granules for use in a patch treatment device |
| JP2009152227A (en) * | 2007-12-18 | 2009-07-09 | Pearl Lighting Co Ltd | Reflection type light emitting diode |
| US20090207617A1 (en) * | 2008-02-20 | 2009-08-20 | Merchant Viren B | Light emitting diode (led) connector clip |
| DE102011087709B4 (en) * | 2011-12-05 | 2022-03-03 | Ledvance Gmbh | SEMICONDUCTOR DEVICE AND METHOD OF MAKING SEMICONDUCTOR DEVICE |
| CN102496825B (en) * | 2011-12-14 | 2013-09-04 | 番禺得意精密电子工业有限公司 | Manufacturing method for electric connector |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3702954A (en) * | 1967-07-21 | 1972-11-14 | Siemens Ag | Semiconductor component and method of its production |
| US3500136A (en) * | 1968-01-24 | 1970-03-10 | Int Rectifier Corp | Contact structure for small area contact devices |
| DE1907075B2 (en) * | 1969-02-13 | 1974-07-04 | Semikron Gesellschaft Fuer Gleichrichterbau Und Elektronik Mbh, 8500 Nuernberg | Process for the production of small semiconductor rectifiers |
| DE1916554B2 (en) * | 1969-04-01 | 1974-07-04 | Semikron Gesellschaft Fuer Gleichrichterbau Und Elektronik Mbh, 8500 Nuernberg | Method for manufacturing semiconductor rectifier arrangements |
| US3914786A (en) * | 1974-04-19 | 1975-10-21 | Hewlett Packard Co | In-line reflective lead-pair for light-emitting diodes |
-
1978
- 1978-03-06 US US05/883,559 patent/US4247864A/en not_active Expired - Lifetime
-
1979
- 1979-02-14 NL NL7901166A patent/NL7901166A/en not_active Application Discontinuation
- 1979-02-15 CA CA321,595A patent/CA1132694A/en not_active Expired
- 1979-02-20 IT IT20359/79A patent/IT1110792B/en active
- 1979-02-26 BE BE0/193705A patent/BE874462A/en not_active IP Right Cessation
- 1979-02-27 FR FR7904980A patent/FR2419589A1/en active Granted
- 1979-02-28 JP JP2209479A patent/JPS54126490A/en active Pending
- 1979-03-05 DE DE19792908460 patent/DE2908460A1/en not_active Withdrawn
- 1979-03-05 GB GB7907697A patent/GB2015387B/en not_active Expired
- 1979-03-05 ES ES478286A patent/ES478286A1/en not_active Expired
- 1979-03-06 SE SE7902026A patent/SE7902026L/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| FR2419589B1 (en) | 1981-01-09 |
| BE874462A (en) | 1979-08-27 |
| FR2419589A1 (en) | 1979-10-05 |
| JPS54126490A (en) | 1979-10-01 |
| SE7902026L (en) | 1979-09-07 |
| US4247864A (en) | 1981-01-27 |
| GB2015387A (en) | 1979-09-12 |
| IT7920359A0 (en) | 1979-02-20 |
| IT1110792B (en) | 1986-01-06 |
| NL7901166A (en) | 1979-09-10 |
| DE2908460A1 (en) | 1979-09-13 |
| ES478286A1 (en) | 1979-11-01 |
| GB2015387B (en) | 1982-02-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA1132694A (en) | 'led' assembly and method of manufacture | |
| US4679889A (en) | Solder-bearing leads | |
| US4737115A (en) | Solderable lead | |
| US10066813B2 (en) | LED socket assembly | |
| US3827005A (en) | Electrical connector | |
| US4478588A (en) | Light emitting diode assembly | |
| US6042429A (en) | Continuous press-fit knurl pin | |
| US5957739A (en) | Continuous electronic stamping with offset carrier | |
| KR20050071369A (en) | Light-emitting module | |
| EP0555726B1 (en) | Alignment member for use with surface mount contacts | |
| JPH07254462A (en) | Electric connector | |
| NL8600224A (en) | TERMINAL CONNECTOR AND EDGE CONNECTOR CONSTRUCTED FROM MULTIPLE TERMINAL CONNECTORS FOR CONNECTING CONDUCTORS. | |
| EP2592336B1 (en) | LED socket assembly | |
| KR100344050B1 (en) | Low profile electrical connector for a pga package and terminals therefore | |
| CN109973837B (en) | LED module with stabilized lead frame | |
| US4728305A (en) | Solder-bearing leads | |
| EP0079161A2 (en) | LED lamp and mounting base therefor | |
| US10868377B2 (en) | Electrical spring contact with integrated extending carrier portion | |
| US4952156A (en) | Connector and a method of manufacturing a plurality of contact terminals mounted on a continuous carrier strip | |
| EP0213820B1 (en) | Adaptable terminal assembly for multi-contact electrical connector | |
| AU583396B2 (en) | Solder bearing leads | |
| JPH067184U (en) | LED mounting structure | |
| CA1123490A (en) | Electrical component and method of making same | |
| ATE118657T1 (en) | ELECTRICAL PRESS-IN CONNECTOR PIN. | |
| CA1129514A (en) | Press-fit terminal with spring arm contact for edgecard connector |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry | ||
| MKEX | Expiry |
Effective date: 19990928 |