CA1203862A - Connector and packaging structure of semiconductor device employing the same - Google Patents
Connector and packaging structure of semiconductor device employing the sameInfo
- Publication number
- CA1203862A CA1203862A CA000456685A CA456685A CA1203862A CA 1203862 A CA1203862 A CA 1203862A CA 000456685 A CA000456685 A CA 000456685A CA 456685 A CA456685 A CA 456685A CA 1203862 A CA1203862 A CA 1203862A
- Authority
- CA
- Canada
- Prior art keywords
- contactor
- female
- connector
- contactors
- shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/82—Coupling devices connected with low or zero insertion force
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0308—Shape memory alloy [SMA]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0397—Tab
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1059—Connections made by press-fit insertion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
Abstract
Abstract:
A connector comprises an insulating substrate having a plurality of through-holes and a first circuit pattern formed on the substrate. Female contactors are located and fixed around the edges of such through-holes to form openings having edges that extend inwardly of the holes.
These female contactors are electrically connected to said first pattern. A male contactor comprises an insulating substrate having a second circuit pattern thereon and a plurality of male contactor pins fixed to the substrate and electrically connected to the second pattern. These pins are located in positions corresponding to the openings of the female contactors. The female contactors are made of a thin film of a shape memory alloy and the edge of each female contactor is given, before inserting each of the pins, such a shape memory that the contactor is returned to a position to close the opening when the contactor is subjected to a temperature above the martensitic transition temperature. The arrangment facilitates the miniaturization of connectors.
A connector comprises an insulating substrate having a plurality of through-holes and a first circuit pattern formed on the substrate. Female contactors are located and fixed around the edges of such through-holes to form openings having edges that extend inwardly of the holes.
These female contactors are electrically connected to said first pattern. A male contactor comprises an insulating substrate having a second circuit pattern thereon and a plurality of male contactor pins fixed to the substrate and electrically connected to the second pattern. These pins are located in positions corresponding to the openings of the female contactors. The female contactors are made of a thin film of a shape memory alloy and the edge of each female contactor is given, before inserting each of the pins, such a shape memory that the contactor is returned to a position to close the opening when the contactor is subjected to a temperature above the martensitic transition temperature. The arrangment facilitates the miniaturization of connectors.
Description
)3~2 Connector and packaging structure of semiconductcr device employing the same The present invention relates to a novel electric connector and to a packaging structure for a semiconductor device (LSI) employing such connector.
A pin connector typically consists of a pin, a socket in which it is inserted and a portion that packages them, and is extensively used as an electric or electronic connection component. With increases in the density of computers, connectors have again been recognized as important aspects of the packaging techniques. A conventional pin connector has a socket portion constructed of a spring member made principally of a Cu-Be alloy. A pin when inserted is engaged by the spring force of the socket portion. This socket portion is arranged to extend in parallel with the direction of insertion of the pin, and has a structure whereby the pin is held between resilient parts of the spring member (or in the cylinder thereo~. In recent years, with increases in the packaging densities of electric and electronic components in computers and the like, there has developed a need to compact and miniaturize the connectors. However, conventional socket shapes pose a serious problem when it csmes to compàction, for the reason that, since a certain distance is needed in the pin insertion direction, the ~7all of the socket package becomes thick. In addition, since the socket shape is complicated, the manufacture of miniaturized connectors becomes difficult, for which reason the shape needs to be simplified.
,~
~2~3~2 On the other hand, the increased d~nsity of the computer leads to an increase in the number of pins required in the connector. When the number of pins becomes large, the force required for joining the connector parts increases.
With a large num~er of pins, joining manually may become dif~icult or impossible for a prior-art connector employing spring force. It has therefore been proposed ~o develop a low insertion force or even zero insertion force connector in which pins can be readily inserted or drawn out while nevertheless achieving reliable connection.
Japanese Laid-open Patent Application No. 57-185680 discloses a connector wherein a hole is provided in a central part of a flat spring member, a male contactor being inserted into the hole. This connector, however, presents difficulties when trying to remove the male portion.
The official gazette summary of Japanese ~aid-open Patent Application No. 58-71572 or No. 58-73973 teaches an electric connector for a Josephson element semiconductor device, which is operated at a very low temperature by the deformation of a bimetal with temperature change. The electric connector employing the bimetal, however, cannot produce a large deformation unless it has a pre-determined size; hence, it cannot be e~fectively miniaturized.
An electric connector wherein a cylindrical socket is made of a shape-memorizing alloy is taught in 'Kinzoku Binran (Handbook of Metals)' (fourth revised edition, issued in December 1982). However, this connector also cannot be miniaturized.
An object of the present invention is to provide a connector in which contact members can be inserted and withdrawn using only small forces, and also to provide a packaging structure for a semiconductor device employing such connector.
The present invention consists of a connector comprising an insulating substrate having a pluralit~ of through-holes and a first circuit pattern formed on the substrate; female contactors each located and fixed around _ 3 _ the edge of a said through-hole and havin~ an opening, an edge of which extends inwardly of the through-hole, said female contactors being electrically connected to said first pattern; and a male contactor comprising an insulating substrate having a second circuit pattern thereon and a plurality of male contactor pins fixed to the substrate and electrically connected to said second pattern, said pins each being located in a position corresponding to each of the openings of said female contactors, wherein said female contactors are made of a thin film of a shape memory alloy and the edge of each of the female contactors is given, before inserting each of the male contactor pins, such a shape memory that the contactor is returned to a position to close the opening when said contactor is subjected to a temperature above the martensitic transistion temperature, whereby said female contactors and said male contactor can be electrically connected and mechanically joined securely.
Generally known as shapc ~orizing alloys are a Cu alloy contA;ning 0 - 10~ of Al and 10 - 40%~of Zn, a Cu alloy containing 23 - 26~ o Sn, a Cu alloy containing 12 - 15% of Al and 3 - 5% of Ni, an alloy consisting of 42 - 48% of Ti and the balance of ~i, and so forth. Besides, an Fe-Mn system, an Fe-Cr-Ni system, a U-Mo system, an Mn-Cu system, an Au-Cd system, etc. are usable.
The ollowing table lists the compositions ~weight %~ and characteris~ics of the Cu-Al-Ni alloy and the Ni-Ti alloy, by way of example. Since each of these alloys can memorize the inal shape at temperatures below the Mf point and the final shape at temperatures above the ~f point, it undergoes cycles of the final shapes when subjected to these temperature cycles. It may accordingly be subjected to shape memory so that a male contactor and a female contactor may be in contact and electric conduction with each other in desired parts at the temperature used in service, e.g. room temperature.
~L2~38~2 Table Characteristics/ Cu - 14.0~ 4.0% Ni Ni - 44.3% Ti Compositions Transformation temperature (,C) 5 Ms -124 -23 Mf -140 -41 As -117 -12 Af -71 3 Electric 10resistance 11 70 ~Q-cm~
Rupture strengt~ 40 60 ,(,kg~'mm ) 15 Ms: Parent phase ~ martensitic transformation starting temperature Mf: Martensitic transformation finishing temperature A : Martensite ~ parent phase transormation starting s temperature Af: Parent phase transformation finishing temperature The female contactor used in the present invention is preferably made of a flat thin film. The thickness of the thin film is preerred to be 100 ~m or less.
In such a female contactor the part forming the hole is preferably subjected to shape memory, so as to be capable of bending deformation in the direction in which the female contactor comes into contact with the male contactor, when changed to the parent phase transformation temperature of the shape-memorizing allo~. Further, the connector of the present invention is preferably such that the male contactor is inserted into the hole at a low temperature, i.e. below the martensitic transformation temperature of the alloy, after which the connector has its ~203~é2 temperature raised to the parent phase transformation temperature of the allo~ to produce return to the original memorized shape. Since the male contactor is inserted into the female contactor when it is in its soft martensite state, such insertion requires only a low force. However, during service the female contactor returns to its original state to afford a rigid connection.
With this connector an increase in the number of pins can be realized for a higher density, and miniaturization also becomes possible. Although the number of pins in LSI
packaging for a present-day computer is 100 - 200, it is expected to become 1000 - 2000 for a substrate of lOcm square in the future. The present invention can cope with even such a large number of pins.
Fig. 1 shows a series of sectional views illus~rative of the connection situation of a connector according to an embodiment of the present invention;
Fig. 2 shows a series of sectional views illustrative of the connection situation of such a connector utilizing a unidirectional shape-memorizing effect;
Fig. 3 shows a series of sectional views illustrative of the connection situation of such a connector utilizing a bidirectional shape-memorizing effect;
Fig. 4 shows four plan views of female contactors for use in embodiments of the present invention;
Fig. 5 shows two plan views illustrative of female contactors in other examples o the present invention and the situation of upon insertion and withdrawal of male contactors;
Fig. 6 is a perspective view illustrative of the functioning of the arrangement of Fig. 5(b);
Fig. 7 shows connector components illustrative of other examples of the present invention, in each of which a female contactor is formed on an insulating sub-strate;
Fig. 8 shows a series of perspective views illustrative of a manufacturing process in which female contactors are unitarily formed by bonding and chemiral ~03~
etching;
Fig 9 shows a series of sectional views o connectors components, in each of which e~amples a female contactor is held between insulating substrates;
Figs~ 10 and 11 are perspective views showing multi-pin connector structures having the arrangements of Fig. 9;
Fig. 12 is a perspective view showing an LSI
packaging arrangement that uses a connector according to the present invention;
Figs. 13 - 16 are sections of similar applications of electric connectors according to the present invention to LSI packaging; and Fig. 17 is a schematic view of a molten metal quenching apparatus for producing shape-memorizing composite materïal for use in the prese~t invention.
Preferred Embodiments of the Invention (Embodiment 1) Fig. 1 shows sectional views of an electric con-nector having a simplified flattened structure in thedirection 4 of insertion of a pin 1 acting as a male contactor, i.e. in the direction of the thickness of a female contactor 2. This arrangement simplifies compaction and miniaturiæation. As a characterizing feature, the female contactor 2 is given the shape of a thin plate or thin film extending orthogonally to the direction 4 o insertion of the pin 1 into a hole 6 of an insulating substrate 3. The contactor 2 is made of a shape-memorizing alloy and is provided with a space, such as a slit 5, into which the pin 1 is pushed. Since the contactor 2 is subject to shape mèmory the force on the pin can act like a spring force above a parent phase transformation temperature or below a martensitic transformation temperaturè. The contactor 2 is fastened to the substrate 3 by a kno~n method such as bonding~
This structure can reduce the dimension in the wall thick-ness direction as compared with the prior art, and is thus effective for compaction of the connector. Further, since ~2~38~;2 the contactor 2 is disposed on the substrate in planar fashion, it can be produced and unitarily formed on the substrate directly from a vapor or liquid phase, such as a PVD process (evaporation, sputtering, etc.), CVD process, molten-metal quenching process or flame spraying. The thin plate or thin film to become the female contactor is bonded or formed and can be unitarily formed into a predetermined shape by photolithography, chemical etching or the like.
These considerations are very useful for the miniaturization of the connector because all the parts o a multi-pin arrangement can be made simultaneously, and very fine working is possible and relatively easy.
When a shape-memorizing alloy based on the thermally elastic type martensitic transformation is used for a female contactor in a connector structure according to the present invention, an effect to be described below is achieved. As shape-memorizing alloys, Cu-Al-Zn, Cu-Al-~i and Ti-Ni alloys are generally known, but all these materials are difficult to work, e.g. rolling and forming.
Figs 2 and 3 are sectional views showing the steps of joining processes for connectors in each of which a shape-memorizing alloy is formed on an insulating sub-strate 3. It is known that the shapc ~s~riæing effect has several kinds. The example of Fig. 2 exploits a uni-dixectional shape-memorizing eifect, and that of Fiy. 3 a bidirectional shape-memorizing effect. In either case, a shape-memorizing alloy is used whose martensitic t.rans-ormation temperature is below the operating temperature of the connector (in general, room temperature). In Fig. 2(a), a female contactor 2 made of shape-memorizing alloy is caused to memorize a flat condition at the operating temperature, while in 2(b), it has its temperature lowered to below the martensitic transformation temperature now shown as the COntaCtQr 2'. At this temperature, the alloy undergoes martensitic transformation.
It becomes very soft although the shape does not change. In 2~c), a pin l has been inserted while in the . .
soft state. When the operating temperature is restored in
A pin connector typically consists of a pin, a socket in which it is inserted and a portion that packages them, and is extensively used as an electric or electronic connection component. With increases in the density of computers, connectors have again been recognized as important aspects of the packaging techniques. A conventional pin connector has a socket portion constructed of a spring member made principally of a Cu-Be alloy. A pin when inserted is engaged by the spring force of the socket portion. This socket portion is arranged to extend in parallel with the direction of insertion of the pin, and has a structure whereby the pin is held between resilient parts of the spring member (or in the cylinder thereo~. In recent years, with increases in the packaging densities of electric and electronic components in computers and the like, there has developed a need to compact and miniaturize the connectors. However, conventional socket shapes pose a serious problem when it csmes to compàction, for the reason that, since a certain distance is needed in the pin insertion direction, the ~7all of the socket package becomes thick. In addition, since the socket shape is complicated, the manufacture of miniaturized connectors becomes difficult, for which reason the shape needs to be simplified.
,~
~2~3~2 On the other hand, the increased d~nsity of the computer leads to an increase in the number of pins required in the connector. When the number of pins becomes large, the force required for joining the connector parts increases.
With a large num~er of pins, joining manually may become dif~icult or impossible for a prior-art connector employing spring force. It has therefore been proposed ~o develop a low insertion force or even zero insertion force connector in which pins can be readily inserted or drawn out while nevertheless achieving reliable connection.
Japanese Laid-open Patent Application No. 57-185680 discloses a connector wherein a hole is provided in a central part of a flat spring member, a male contactor being inserted into the hole. This connector, however, presents difficulties when trying to remove the male portion.
The official gazette summary of Japanese ~aid-open Patent Application No. 58-71572 or No. 58-73973 teaches an electric connector for a Josephson element semiconductor device, which is operated at a very low temperature by the deformation of a bimetal with temperature change. The electric connector employing the bimetal, however, cannot produce a large deformation unless it has a pre-determined size; hence, it cannot be e~fectively miniaturized.
An electric connector wherein a cylindrical socket is made of a shape-memorizing alloy is taught in 'Kinzoku Binran (Handbook of Metals)' (fourth revised edition, issued in December 1982). However, this connector also cannot be miniaturized.
An object of the present invention is to provide a connector in which contact members can be inserted and withdrawn using only small forces, and also to provide a packaging structure for a semiconductor device employing such connector.
The present invention consists of a connector comprising an insulating substrate having a pluralit~ of through-holes and a first circuit pattern formed on the substrate; female contactors each located and fixed around _ 3 _ the edge of a said through-hole and havin~ an opening, an edge of which extends inwardly of the through-hole, said female contactors being electrically connected to said first pattern; and a male contactor comprising an insulating substrate having a second circuit pattern thereon and a plurality of male contactor pins fixed to the substrate and electrically connected to said second pattern, said pins each being located in a position corresponding to each of the openings of said female contactors, wherein said female contactors are made of a thin film of a shape memory alloy and the edge of each of the female contactors is given, before inserting each of the male contactor pins, such a shape memory that the contactor is returned to a position to close the opening when said contactor is subjected to a temperature above the martensitic transistion temperature, whereby said female contactors and said male contactor can be electrically connected and mechanically joined securely.
Generally known as shapc ~orizing alloys are a Cu alloy contA;ning 0 - 10~ of Al and 10 - 40%~of Zn, a Cu alloy containing 23 - 26~ o Sn, a Cu alloy containing 12 - 15% of Al and 3 - 5% of Ni, an alloy consisting of 42 - 48% of Ti and the balance of ~i, and so forth. Besides, an Fe-Mn system, an Fe-Cr-Ni system, a U-Mo system, an Mn-Cu system, an Au-Cd system, etc. are usable.
The ollowing table lists the compositions ~weight %~ and characteris~ics of the Cu-Al-Ni alloy and the Ni-Ti alloy, by way of example. Since each of these alloys can memorize the inal shape at temperatures below the Mf point and the final shape at temperatures above the ~f point, it undergoes cycles of the final shapes when subjected to these temperature cycles. It may accordingly be subjected to shape memory so that a male contactor and a female contactor may be in contact and electric conduction with each other in desired parts at the temperature used in service, e.g. room temperature.
~L2~38~2 Table Characteristics/ Cu - 14.0~ 4.0% Ni Ni - 44.3% Ti Compositions Transformation temperature (,C) 5 Ms -124 -23 Mf -140 -41 As -117 -12 Af -71 3 Electric 10resistance 11 70 ~Q-cm~
Rupture strengt~ 40 60 ,(,kg~'mm ) 15 Ms: Parent phase ~ martensitic transformation starting temperature Mf: Martensitic transformation finishing temperature A : Martensite ~ parent phase transormation starting s temperature Af: Parent phase transformation finishing temperature The female contactor used in the present invention is preferably made of a flat thin film. The thickness of the thin film is preerred to be 100 ~m or less.
In such a female contactor the part forming the hole is preferably subjected to shape memory, so as to be capable of bending deformation in the direction in which the female contactor comes into contact with the male contactor, when changed to the parent phase transformation temperature of the shape-memorizing allo~. Further, the connector of the present invention is preferably such that the male contactor is inserted into the hole at a low temperature, i.e. below the martensitic transformation temperature of the alloy, after which the connector has its ~203~é2 temperature raised to the parent phase transformation temperature of the allo~ to produce return to the original memorized shape. Since the male contactor is inserted into the female contactor when it is in its soft martensite state, such insertion requires only a low force. However, during service the female contactor returns to its original state to afford a rigid connection.
With this connector an increase in the number of pins can be realized for a higher density, and miniaturization also becomes possible. Although the number of pins in LSI
packaging for a present-day computer is 100 - 200, it is expected to become 1000 - 2000 for a substrate of lOcm square in the future. The present invention can cope with even such a large number of pins.
Fig. 1 shows a series of sectional views illus~rative of the connection situation of a connector according to an embodiment of the present invention;
Fig. 2 shows a series of sectional views illustrative of the connection situation of such a connector utilizing a unidirectional shape-memorizing effect;
Fig. 3 shows a series of sectional views illustrative of the connection situation of such a connector utilizing a bidirectional shape-memorizing effect;
Fig. 4 shows four plan views of female contactors for use in embodiments of the present invention;
Fig. 5 shows two plan views illustrative of female contactors in other examples o the present invention and the situation of upon insertion and withdrawal of male contactors;
Fig. 6 is a perspective view illustrative of the functioning of the arrangement of Fig. 5(b);
Fig. 7 shows connector components illustrative of other examples of the present invention, in each of which a female contactor is formed on an insulating sub-strate;
Fig. 8 shows a series of perspective views illustrative of a manufacturing process in which female contactors are unitarily formed by bonding and chemiral ~03~
etching;
Fig 9 shows a series of sectional views o connectors components, in each of which e~amples a female contactor is held between insulating substrates;
Figs~ 10 and 11 are perspective views showing multi-pin connector structures having the arrangements of Fig. 9;
Fig. 12 is a perspective view showing an LSI
packaging arrangement that uses a connector according to the present invention;
Figs. 13 - 16 are sections of similar applications of electric connectors according to the present invention to LSI packaging; and Fig. 17 is a schematic view of a molten metal quenching apparatus for producing shape-memorizing composite materïal for use in the prese~t invention.
Preferred Embodiments of the Invention (Embodiment 1) Fig. 1 shows sectional views of an electric con-nector having a simplified flattened structure in thedirection 4 of insertion of a pin 1 acting as a male contactor, i.e. in the direction of the thickness of a female contactor 2. This arrangement simplifies compaction and miniaturiæation. As a characterizing feature, the female contactor 2 is given the shape of a thin plate or thin film extending orthogonally to the direction 4 o insertion of the pin 1 into a hole 6 of an insulating substrate 3. The contactor 2 is made of a shape-memorizing alloy and is provided with a space, such as a slit 5, into which the pin 1 is pushed. Since the contactor 2 is subject to shape mèmory the force on the pin can act like a spring force above a parent phase transformation temperature or below a martensitic transformation temperaturè. The contactor 2 is fastened to the substrate 3 by a kno~n method such as bonding~
This structure can reduce the dimension in the wall thick-ness direction as compared with the prior art, and is thus effective for compaction of the connector. Further, since ~2~38~;2 the contactor 2 is disposed on the substrate in planar fashion, it can be produced and unitarily formed on the substrate directly from a vapor or liquid phase, such as a PVD process (evaporation, sputtering, etc.), CVD process, molten-metal quenching process or flame spraying. The thin plate or thin film to become the female contactor is bonded or formed and can be unitarily formed into a predetermined shape by photolithography, chemical etching or the like.
These considerations are very useful for the miniaturization of the connector because all the parts o a multi-pin arrangement can be made simultaneously, and very fine working is possible and relatively easy.
When a shape-memorizing alloy based on the thermally elastic type martensitic transformation is used for a female contactor in a connector structure according to the present invention, an effect to be described below is achieved. As shape-memorizing alloys, Cu-Al-Zn, Cu-Al-~i and Ti-Ni alloys are generally known, but all these materials are difficult to work, e.g. rolling and forming.
Figs 2 and 3 are sectional views showing the steps of joining processes for connectors in each of which a shape-memorizing alloy is formed on an insulating sub-strate 3. It is known that the shapc ~s~riæing effect has several kinds. The example of Fig. 2 exploits a uni-dixectional shape-memorizing eifect, and that of Fiy. 3 a bidirectional shape-memorizing effect. In either case, a shape-memorizing alloy is used whose martensitic t.rans-ormation temperature is below the operating temperature of the connector (in general, room temperature). In Fig. 2(a), a female contactor 2 made of shape-memorizing alloy is caused to memorize a flat condition at the operating temperature, while in 2(b), it has its temperature lowered to below the martensitic transformation temperature now shown as the COntaCtQr 2'. At this temperature, the alloy undergoes martensitic transformation.
It becomes very soft although the shape does not change. In 2~c), a pin l has been inserted while in the . .
soft state. When the operating temperature is restored in
2(d), the martensite transformation ret~rns the alloy to its original parent phase and the contactor 2' revexts to becoming the contactor 2. Accordingly the alloy hardens and a orce trying to restore the part to its original shape as in 2(a) exerts a large binding force on the pin 1.
The example of Fig. 3 exploits a reversible shape memory conforming to the transformation shown in states (a) and ~b~. The shape memory is so established that state (a) applies at the operating temperature of the connector and state (b) applies at or below the martensitic transformation temperature. When the connector is cooled to the martensitic transformation temperature, the gap in the pin receiving slit 5' is opened by the shape memorizing effect. The pin 1 is inserted therein as shown in tc). When the operating temperature condition is restored, as shown in (d), the alloy returns to the parent phase state owing to the shape-memorizing effect, to become hard and try to return to the (a) state, generating a gripping force. As illustrated in
The example of Fig. 3 exploits a reversible shape memory conforming to the transformation shown in states (a) and ~b~. The shape memory is so established that state (a) applies at the operating temperature of the connector and state (b) applies at or below the martensitic transformation temperature. When the connector is cooled to the martensitic transformation temperature, the gap in the pin receiving slit 5' is opened by the shape memorizing effect. The pin 1 is inserted therein as shown in tc). When the operating temperature condition is restored, as shown in (d), the alloy returns to the parent phase state owing to the shape-memorizing effect, to become hard and try to return to the (a) state, generating a gripping force. As illustrated in
3(e), when the connector is again cooled to or below the martensitic transformation temperature, the slit opens and the pin can be readily pulled out. In this manner, when the bidirectional shape-memorizing effect is applied to a connector according to the present invention, a structure requiring substantially no withdrawal force can be realized.
~he shape-memorizing alloy is difficult to work, as described above, so that if it were miniaturized while re-tainin~ the prior-art shape, manufacture would be difficult.
However, in contrast, the structure of the present invention provides for simple application of the shape-memorizing alloy~
(Embodiment 2) For further embodiments the preferred shapes for the female contactors were studied. Spring material made of a Cu-Be alloy and having a plate thickness of 0.08mm (JIS C1700) was used for the female contactors, while molten-metal quenching ribbon materials of the Cu-Al-Ni alloy and Ni Ti alloy as indicated in the foregoing table were used ~2Q381~
for the shape-memorizing alloys. The ~uenched materials were prepared by a two-roll ~uenching apparatus and were thin plates 0.06 - O.O9mm thick and 5 - lOmm wide. A nozzle made of silica and provided with a round port having a diameter of 0.3 - l.Omm was used and molten metal was spurted between rolls of Cu-Be (diameter: 120mm) at a peripheral speed of about 10 m/s by Ar gas at high pressure (pressure: 1.0 -1.5 kg/cm2), thereb~ to be quenched and solidified. Various characteristics in the table were measured at room temperature.
Fig. 4 shows plan views of four shapes of female contactors 2 of thin alloy plates with circular peripheries.
~he shape-memorizing alloy is difficult to work, as described above, so that if it were miniaturized while re-tainin~ the prior-art shape, manufacture would be difficult.
However, in contrast, the structure of the present invention provides for simple application of the shape-memorizing alloy~
(Embodiment 2) For further embodiments the preferred shapes for the female contactors were studied. Spring material made of a Cu-Be alloy and having a plate thickness of 0.08mm (JIS C1700) was used for the female contactors, while molten-metal quenching ribbon materials of the Cu-Al-Ni alloy and Ni Ti alloy as indicated in the foregoing table were used ~2Q381~
for the shape-memorizing alloys. The ~uenched materials were prepared by a two-roll ~uenching apparatus and were thin plates 0.06 - O.O9mm thick and 5 - lOmm wide. A nozzle made of silica and provided with a round port having a diameter of 0.3 - l.Omm was used and molten metal was spurted between rolls of Cu-Be (diameter: 120mm) at a peripheral speed of about 10 m/s by Ar gas at high pressure (pressure: 1.0 -1.5 kg/cm2), thereb~ to be quenched and solidified. Various characteristics in the table were measured at room temperature.
Fig. 4 shows plan views of four shapes of female contactors 2 of thin alloy plates with circular peripheries.
4(a) and 4(b) correspond to cases where the section of the male contactors is circular, and 4tc) and 4(d) apply to cases where they are rectangular. As manufacturin~
techniques electrospark machining with a wire, chemical etching and punching were tried. In electrospark machining with wire, a hole or passing the wire through was first drilled. Such a drill could form a hole with a diameter of O.lmm at ~he ~; n; mll~. Copper wire with a diameter of O.lmm at the ~;ni~llm or tungsten wire having a diameter of 0.05mm was used. As a result, the width of the slit 7 was able to be as small as Q.lmm. With chemical etching a slit shape printed on a photographic film was placed on a ribbon whose surface was coated with a photo-hardening resin. The ribbon was exposed to light and only the unexposed resin of the surface corresponding to the slit portion was washed away, with only this slit portion not being covered with resin.
The ribbon was immersed in a solution of ferr c chloride for etching. In this way the width of the slit 7 could also be made as small as O.lmm. Punching was performed in a condition in which the clearance was zero by using a metal mold made of die steel SKDll. Also by this method the slit width could be made O.lmm at the minimum.
Pins were inserted into female contactors so formed and the gripping forces assessed. Regarding the shapes of the female contactors, the slit 7 had a length of 3mm and a width of 0.2mm and the central hole 5 had a diameter of 0.5mm in the cases of Figs. 4(a~ and (b), and a rectangle had one side of 3mm and the slit 7 had a width of O.2mm in ~20~æ
(c) and (d) (in the case of (d), the length of the middle slit 7 was 1.5mm). A rod-like pin 0.8mm in diameter was used to engage the female contactors in (a) and (b), and a rod-like pin of rectangular cross-section of 0.4mm x lmm for those in (c) and (d). The female contactors were subjected to shape memory so as to flatten in the operating state, and the pins were inserted in liquid nitrogen. After such Cu - 14% Al - 4~ Ni alloy thin plates formed with the slits had been deformed in the liquid nitrogen, the shape recovery based on the shape-memorizing effect with the rise in temperature was continuously observed using an optical microscope. The plate was deformed into the open state as shown in Fig. 3(b~ by a pin having a diameter of 1.5mm in liquid nitrogen, whereupon it was restored to the original lS condition at room temperature, with the original shape being recovered substantially perfectly. ~hen the pins and the female contactors were joined under these conditions, the forces needed ~o pull the parts apart were 200 gr in (a) and (b~ and 150 gr in (c) and (d). No significant difference in these forces was noted depending upon the materials. The contact resistance at the pin contact part was 10 m~ or above.
Fig. 5 shows plan views of slits in structures in which pin connectors can be easily pulled out~ 5(a) shows a wide sectoral slit formed from three slits 7 of the arrange-ment in Fig. 4(b), and (b) shows a shape in which the left hand half of the rectangle in Fig. ~c) has been removed.
The pin is inserted into a hatched part 8 in each figure, while it is withdrawn by sliding it in the direction of the arrow, thus releasing it from the gripped state. The shape of 5(b) is shown in perspective in Fig. 6. The force needed to slide is about 1/10 of the gripping force, so that the pin can be readily pulled out. Moreover, in a case where the shape-memorizing alloy is slid at the liquid nitrogen temperature, the material is soft. It was therefore possible to slide the pin with a force of about 1/50 or less.
~2~3~æ
It was attempted to insert and remove pins on the basis of the bidirectional shape-memorizin~ effect as applied to the slit shapes shown in Figs. 4(a) and ~c). For bi-directional shape memory, a pin of 2mm diameter or having a rectangular section of 1.2 x lmm was first inserted at the liquid nitrogen temperature. This step was repeated 2 - 3 times for the shape memory. The pin in this condition was inserted into the female contactor. Then, since a gap was formed between the pin and the engaging parts during insertion or removal no force was needed for this operation.
It has been found that a connector in the engaged condition can endure a pulling-out force of up to 150 gr.
(Embodiment 3) A method was studied for ixing a female contactor of Embodiment 2 to a substrate having a pin inserting hole.
The materials of the female contactors were the same as in Embodiment 2, and a glass ~poxy resin, an epoxy resin and an alumina plate were used as the substrate materials. Forming the holes of these substrates was carried out wlth a conventional drill for the former and with a CO2 laser for the latter. A fixing method using bonding was first studied.
Fig. 7 shows sectional views of female contactors bonded in different ways. 7~a~ illustrates a method in which the female contactor 2 is fixed on the substrate 3 simply by an adhesive 9. In general, any adhesive may be used as long as the bonding strength is sufficient. However, when a shape memorizing alloy is used, the adhesive must endure the heat cycle from room temperature to liquid nitrogen temperature.
Ordinary organic adhesives cannot endure this cycle. An in-organic adhesive made of alumina or zirconia and water glass,by way of example, can endure this cycle. Further, when dried sufficiently, a silver paste afforded a satisfactory bonding strength of about 150 gr in terms of stripping strength. In the case of an alumina substrate, when the bonded structure is baked at 500 - 600C for 1 h, the bonding strength was enhanced more by about 50~. Fig. 7(b) illustrates a method in which, for the bonding to endure the ~3~
heat cycle, a ceramics substrate is metalized and is provided with a plating layer 10, on which the female contactor 2 is bonded by means of a brazing material 11. In this example, the substrate was metalized with an Mo-Mn paste at 1100C
for 1 h and was subjected to Ni plating. The female contactor was bonded with a silver solder. Both the alloys attained good bonding of at least 300 gr in terms of stripping strength.
Using such brazing bonding and the chemical etching o~ the foregoin~ embodiment, it was possible to directly form female contactors in hole portions on a substrate having pin insertion holes. Used as brazing materials were an indium solder, a silver solder, a lead solder, etc. Perspective views illustrative of the steps are shown in Fig. 8. 8ta) shows an alumina substrate 3 provided with holes 6. As shown in 8(b), a thin plate 12 of a Cu - 14wt-% Al - 4wt-~ Ni allo~
to form female contactors was bonded on the substrate by brazing. As shown in 8(c), the thin plate was etched by chemical etching so that parts to orm the female contactors were left around the holes. In this state, masking was further changed, and the slits of the pin receiving parts were formed by etching. By this process it has been ound that a large number of female contactors corresponding to a large number of pins can be manufactured at one time.
As another example of the ixing method, there was studied a system in which a female contactor is interposed between two substrates as shown in Fig. 9. 9(a) shows a situation where the diameters of pin receiving holes in the upper and lower substrates are e~ual, 9(b) where upper and lower holes have diameters somewhat larger than the diameter of a pin and function to guide the pin, and 9(c) where in order to bring the upper and lower substrates into perfect adhesion the lower substrate is provided with a groove in which the female contactor is arranged. These are somewhat complicated in structure as compared with the bonding method, but are high in reliability of fixation. In addition, after the female contactor was simply bonded as shown in Fig. 7(a), ~zo;~
it had the substrate applied from above into the sandwiched structure, whereb~ fixation enduring even the heat cycle was realized. Perspective views o~ pin connectors applying this fixation system are shown in Figs. 10 and 11. Fig. 10 adopts the system of Fig. 9(b), and Fig. 11 the system o Fig. 9(c). The number of pins is 30, and the pitch interval between the pins is 2 inches. The pin is circular and 0.8mm in diameter, and the slit shape of the female contactor is that of Fig. 4(b) having a length of 3mm. The substrates are of acrylic resin. The example of Fig. 10 shows a structure in which the substrates are fixed by screws 18.
The example of Fig. 11 has a structure in which guide slots 16 receive the upper substrate 15 between the ends of the lower substrate 17, the upper substrate being inserted laterally as indicated by the arrow. In the case of Fig. 10, the female contactors need to be fixed on the lower sub-strate by simple bonding in order to fix their positions. In contrast, in the case of Fig. ll, the pOSitiQnS are ~ixed merely by placing the female contactors in the ~roove of the lower substrate. This brings forth the advantage that, even when the engaging part of only one pin has a drawback such as damage, the female contactors can be immediately exchanged.
~Embodiment 4~
A Cu-Ni-Al-system shape-memorizing alloy was stacked and compounded on Cu and Al oils placed on various insulating substrates having pin insertion holes, by sputtering. Oxygen-free copper (JIS, ~irst class~, electro-lytic Ni (purity: 99.5%) and Al (purity: 99.8~) were mixed, and one charge of 2.5 kg was dissolved at high fre~uency in vacuum (10 5 - 10 4 Torr). It was cast in a metal mold having a diameter of 95mm. Discs 90mm in diameter and 5mm in thickness were cut out of the resulting ingot by machining and were used as sputtering targets. The sputtering equip-ment employed was of the bipolar DC - magnetron type. A~ter the interior of a vessel in the e~uipment was evacuated to 3 x 10 7 Torr, Ar was introduced up to a pressure of 30 ~mHg, and the alloy was deposited on one side of a Cu foil or Al z - 14 ~
foil (20 ~m ~hick) under the sputtering conditions of an interelectrode distance of 60mm, an Ar partial pxessure of S mTorr and electric power of 200 W. The sputtering time-dependency of the thickness of the sputtered film at the time when the alloy was deposited on the substrate increased substantially rectilinearly with time. The alloy could be stacked near to 50 ~m in 4.5 h, and was in favorable close contact with the Al foil even in the stacked state left intact.
On the Cu foils, substantially the same time-dependency of the thickness of the sputtered film and films of high adhesion were attained. The martensitic transformation starting temperature (Ms) of these sputtered films was -123C as determined by four-termin~l measurement of electric resistance. Accordingly, the shape-memorizing alloy exhibits a remarkable shape memorizing effect between liquid nitrogen and room temperature$, and can be employed for a member that is operated between the temperatures.
When the quenched structure was observed with a scanning electron microscope, a layer of very fine crystals about 2 - 3 ~m in diameter was noted at the surface and moderated the stress concentration on a yrain boundary against bending deformation, so that the bending ductility was enhanced.
Using substrates on which shape-memorizing alloy was deposited on the Al and Cu foils in this manner, female contactors were manufa~tured by the process based on chemical etching as shown in Fig. 9. A ~ood shape-memorizin~ effect was noted when the shape-memorizing alloy was stacked to thicknesses of at least about 2 ~m in the composite material, with the Al foils being 50 ~m thick and to thicknesses of at least about 4 ~m in the composite material with the Cu foils.
In addition, composite materials in which both the constituents were in close contact with each other were formed.
In the present embodiment, a female contactor which was lmm in outside diameter, 0.5mm in the diameter of the central hole 5, and 3mm and 0.2mm in the length and width of the slit 7, respectively, was produced by chemical etching.
~2~æ
A pin having a diameter of 0.8mm was inserted therein in liquid nitrogen to open the central hole 5. Subsequently, the connector was restored to room temperature. It was then confirmed that the contacting parts of the female contactor had returned to the original flat state. The female contactor was next again immersed in liquid nitrogen and the pin inserted, which could be done with no resistance.
When the pin was withdrawn at room temperature, the force needed was about 100 gr.
(Embodiment 5) The present e~bodiment exemplifies application of the invention to the packaging of an LSI. Fig. 12 is a perspective view of a printed circuit board 22 on which LSI
packages 19, 19' employing an electric connector of the present invention are installed. The LSIs 19, 19l are soldered to a ceramic, multilayer, print-wired substrate 20, and are further connected to the connector 21 o the present invention. The connector of the present invention is joined to the printed circuit board 22 by solder 25~
Fig. 13 is a sectional view showing the connector located on the printed circuit board 22 and the substrate 20 mounted on the connector. A conductive film 23 electrically ~onnects a female contactor 2 and a pin 1" inserted into the printed circuit board 22. A pin 1' is inserted into a hole 6 in a ceramic substrate 15, and the female contactor 2, which is made of shape-memorizing alloy, is fixed on the conductive film by an upper ceramics insulating substrate 14.
Fig. 14 is a sectional view o an example in which the female contactor 2 is mounted on the printed circuit board 22 and the multilayer print-wired substrate 20 is placed thereon. The circuit board 22 is formed with wiring leads in a conventional manner and the female contac~or 2, which is made of a shape-memorizing alloy, is located at the hole therein as be~ore. The wiring film 24 and the female contactor 2 are joined by conductive paste or the like. The female contactor 2 is coated with a resin as indicated by numeral 26. In both the examples of Figs. 13 and 14, the p:ins ~2~ æ
_ 16 _ l' can be inserted with low insertion forces, because the insertion is performed when the female contactors are in the soft martensite state.
In order to form the female contactors 2 in the vapor phase by sputtering, evaporation or the like in the examples of Fig. 13 or 14, the pin receiving holes need to be closed up. Therefore a metal foil is fastened on the insulating substrate or the printed circuit board 22 and the shape-memorizing alloy is formed thereon and etched into the desired shape.
Fig. 15 is a sectional view showing another example of the present invention suited to the packaging of an LSI.
Female contactors 2, 2' of shape-memorizing alloy are disposed on both surfaces of an insulating substrate 3. A
conductive film 23 is provided so that the contactors 2, 2' are electrically connecte~ with each other. A pin 1' disposed on a multilayer, print-wired substrate 20 is inserted into the female contactor 2, while a pin l''' disposed on a printed circuit board 22 is inserted into the female contactor 2'.
Fig. 16 is a sectional view showing an LSI packaging structure in which a multilayer, print-wired substrate 20 is~provided with the contactor 2. As before the connector 2 is formed on the substrate 20 by thin band produced by melting and quenching the shape-memorizing alloy.
Alternatively, the thin film can be directly formed on the substrate fabricated by an ordinary method, being placed in electrical connection therewith by a process employing the vapor phase such as evaporation or sputtering, where-upon it is formed into the desired shape by etching.(Embodiment 6) A Cu-Ni-Al-system shape-memorizing alloy was stacked and compounded on various substrates (Cu, Al) by sputtering. The alloy had a composition of Cu - 4% Ni - 14 Al (by weight). Oxygen-free copper (JIS, first class), electrolytic Ni (purity: 99.5~) and Al (purity: 99.8~) were mixed, and one charge of 2.5 kg was dissolved at high frequency in vacuum (10 - 10 ~ Torr). Xt was cast in a ~20~
metal mold having a diameter o~ 95mm. Discs 90mm in diameter and Smm in thickness were cut out of the resulting ingot by machining and were used as sputtering targets. The sputtering equipment employed was of the bipolar DC -magnetron type. After the interior of a vessel in theequipment was evacuated to 3 x 10 7 Torr, Ar was introduced up to a pressure of 30 ~mHg, and the alloy was deposited on one side of a Cu foil or Al foil ~20 ~m thick) under the sputtering conditions of an interelectrode distance of 60mm, an Ar partial pressure of 10 2 Torr and an electric power of 200 W.
The alloy was deposited on the substrate of the Al foil by sputtering. The thickness of-the shape-memorizing alloy film increased substantially rectilinearly with sputtering time. The alloy can be stacked near to 50 ~Im in 4.5 h., and is in favorably close contact with the Al oil even in the stacked state left intact. On the Cu foils, substantially the same time-dependency of the thickness of the sputtered film and films of high adhesion were attained.
The martensitic transformation starting temperature (Ms) of these sputtered films was -123C. Accordingly, the shape-memorizing alloy exhibits a remarkable shape-memorizing effect between liquid nitrogen and room temperatures, and can be employed for a member that is operated between these temperatures. When the quenched structure was observed with a scanning electron microscope, a layer of very fine crystals about 2 - 3 ~m in diameter was ~ound at the sur~ace and moderated the stress concentration on a grain boundary against bending deformation, so that the bending ductility was enhanced.
~ est pieces each Smm wide and 50mm long were cut out of the composite materials in which the alloy was sputtered and deposited on the Al and Cu foils to various thicknesses in this manner, and the presence or absence of the phenomenon of the shape-memorizing efect therein was ~x~;ned. In the shape-memorizing alloy film, the condition formed during sputtering is stored. Aceordingly, the ~2~3ag~
desired shape can be stored in conformity with the shape of the film. The test piece was bent to a radius of 3mm so that the side of the shape-memorizing alloy layer might be subjected to tensile stress. In that condition the test piece was immersed in liquid nitrogen and was plastically deormed.
Thereafter, the test piece was returned to room temperature and the shape recovery condition thereof was ex~m;ned. As a result, good shape recovery was noted when the shape-memorizing alloy was stacked to thicknesses of at least about 2 ~m as indicated in a hatched part in the composite material with the Al foils being 50 ~m thick and to thicknesses of at least about 4 ~m in the composite material with the Cu foils. Thus, according to the present example, the sputter-deposited shape-memorizing alloy favorably adhered to the substrates, and the composite materials exhibit~d good shape-memorizing effects~ When emale contactors having the shape in Fig. 5(a) were formed by electrospark machining, chemical etching and punching by the use of these composite materials, favorable shape-memorizing effects were attained.
~Embodiment 7) A shape memorizing composite material was produced by compounding Cu and a Cu-based shape-memorizing alloy using a method of quenching molten metals as shown in ~ig. 17. The Cu was inserted in a nozzle 31 and the Cu - 4% Ni - 14~ Al alloy in a nozzle 32 and they were melted by a high frequency coil 33. Using argon gas under high pressure, the molten metals were spurted onto a roll 34 rotating at high speed, to be quenched and solidified. A composite ribbon of the Cu and the shape-memorizing alloy, in which the Cu-based shape-memorizing alloy was stacked on a Cu ribbon, was fabricatedby this method. The nozzles were made of transparent silica.
At the tips, the nozzle 31 was provided with a slit of 0.5 x 5mm and the nozzle 32 with an aperture 0.5mm in diameter.
The distance between the two nozzles was set at 120mm.
Oxygen-free copper (JIS, first class) was employed. The roll used was made of tool steel and had a diameter of 300mm, and was set at a rotational frequency of 2000 r.p.m. The gap ~2~39~62 _ 19 between each nozzle and the roll was set at 0.02mm, and the molten metals were spurted under a jet gas pressure of 0.4 kg/cm2. In the fabricated composite material, Cu was 50 ~m ~hick, and Cu-Al-Ni was 90 ~m thick, and they adhered favorably. When the shape-memorizing effect was assessed by the method indicated in Example 6, good shape recovery was noted. The boundary between the compounded ribbons could not be observed because of the absence of any means for detecting the alloy phase. However, the atoms were physically joined in close contact with each other so as to have a force enough to endure a bimetal~like action.
Further, when female contactors having the shape in Fig. 5(a) were formed by electrospark machining etc., favorable connections as connectors were achieved.
techniques electrospark machining with a wire, chemical etching and punching were tried. In electrospark machining with wire, a hole or passing the wire through was first drilled. Such a drill could form a hole with a diameter of O.lmm at ~he ~; n; mll~. Copper wire with a diameter of O.lmm at the ~;ni~llm or tungsten wire having a diameter of 0.05mm was used. As a result, the width of the slit 7 was able to be as small as Q.lmm. With chemical etching a slit shape printed on a photographic film was placed on a ribbon whose surface was coated with a photo-hardening resin. The ribbon was exposed to light and only the unexposed resin of the surface corresponding to the slit portion was washed away, with only this slit portion not being covered with resin.
The ribbon was immersed in a solution of ferr c chloride for etching. In this way the width of the slit 7 could also be made as small as O.lmm. Punching was performed in a condition in which the clearance was zero by using a metal mold made of die steel SKDll. Also by this method the slit width could be made O.lmm at the minimum.
Pins were inserted into female contactors so formed and the gripping forces assessed. Regarding the shapes of the female contactors, the slit 7 had a length of 3mm and a width of 0.2mm and the central hole 5 had a diameter of 0.5mm in the cases of Figs. 4(a~ and (b), and a rectangle had one side of 3mm and the slit 7 had a width of O.2mm in ~20~æ
(c) and (d) (in the case of (d), the length of the middle slit 7 was 1.5mm). A rod-like pin 0.8mm in diameter was used to engage the female contactors in (a) and (b), and a rod-like pin of rectangular cross-section of 0.4mm x lmm for those in (c) and (d). The female contactors were subjected to shape memory so as to flatten in the operating state, and the pins were inserted in liquid nitrogen. After such Cu - 14% Al - 4~ Ni alloy thin plates formed with the slits had been deformed in the liquid nitrogen, the shape recovery based on the shape-memorizing effect with the rise in temperature was continuously observed using an optical microscope. The plate was deformed into the open state as shown in Fig. 3(b~ by a pin having a diameter of 1.5mm in liquid nitrogen, whereupon it was restored to the original lS condition at room temperature, with the original shape being recovered substantially perfectly. ~hen the pins and the female contactors were joined under these conditions, the forces needed ~o pull the parts apart were 200 gr in (a) and (b~ and 150 gr in (c) and (d). No significant difference in these forces was noted depending upon the materials. The contact resistance at the pin contact part was 10 m~ or above.
Fig. 5 shows plan views of slits in structures in which pin connectors can be easily pulled out~ 5(a) shows a wide sectoral slit formed from three slits 7 of the arrange-ment in Fig. 4(b), and (b) shows a shape in which the left hand half of the rectangle in Fig. ~c) has been removed.
The pin is inserted into a hatched part 8 in each figure, while it is withdrawn by sliding it in the direction of the arrow, thus releasing it from the gripped state. The shape of 5(b) is shown in perspective in Fig. 6. The force needed to slide is about 1/10 of the gripping force, so that the pin can be readily pulled out. Moreover, in a case where the shape-memorizing alloy is slid at the liquid nitrogen temperature, the material is soft. It was therefore possible to slide the pin with a force of about 1/50 or less.
~2~3~æ
It was attempted to insert and remove pins on the basis of the bidirectional shape-memorizin~ effect as applied to the slit shapes shown in Figs. 4(a) and ~c). For bi-directional shape memory, a pin of 2mm diameter or having a rectangular section of 1.2 x lmm was first inserted at the liquid nitrogen temperature. This step was repeated 2 - 3 times for the shape memory. The pin in this condition was inserted into the female contactor. Then, since a gap was formed between the pin and the engaging parts during insertion or removal no force was needed for this operation.
It has been found that a connector in the engaged condition can endure a pulling-out force of up to 150 gr.
(Embodiment 3) A method was studied for ixing a female contactor of Embodiment 2 to a substrate having a pin inserting hole.
The materials of the female contactors were the same as in Embodiment 2, and a glass ~poxy resin, an epoxy resin and an alumina plate were used as the substrate materials. Forming the holes of these substrates was carried out wlth a conventional drill for the former and with a CO2 laser for the latter. A fixing method using bonding was first studied.
Fig. 7 shows sectional views of female contactors bonded in different ways. 7~a~ illustrates a method in which the female contactor 2 is fixed on the substrate 3 simply by an adhesive 9. In general, any adhesive may be used as long as the bonding strength is sufficient. However, when a shape memorizing alloy is used, the adhesive must endure the heat cycle from room temperature to liquid nitrogen temperature.
Ordinary organic adhesives cannot endure this cycle. An in-organic adhesive made of alumina or zirconia and water glass,by way of example, can endure this cycle. Further, when dried sufficiently, a silver paste afforded a satisfactory bonding strength of about 150 gr in terms of stripping strength. In the case of an alumina substrate, when the bonded structure is baked at 500 - 600C for 1 h, the bonding strength was enhanced more by about 50~. Fig. 7(b) illustrates a method in which, for the bonding to endure the ~3~
heat cycle, a ceramics substrate is metalized and is provided with a plating layer 10, on which the female contactor 2 is bonded by means of a brazing material 11. In this example, the substrate was metalized with an Mo-Mn paste at 1100C
for 1 h and was subjected to Ni plating. The female contactor was bonded with a silver solder. Both the alloys attained good bonding of at least 300 gr in terms of stripping strength.
Using such brazing bonding and the chemical etching o~ the foregoin~ embodiment, it was possible to directly form female contactors in hole portions on a substrate having pin insertion holes. Used as brazing materials were an indium solder, a silver solder, a lead solder, etc. Perspective views illustrative of the steps are shown in Fig. 8. 8ta) shows an alumina substrate 3 provided with holes 6. As shown in 8(b), a thin plate 12 of a Cu - 14wt-% Al - 4wt-~ Ni allo~
to form female contactors was bonded on the substrate by brazing. As shown in 8(c), the thin plate was etched by chemical etching so that parts to orm the female contactors were left around the holes. In this state, masking was further changed, and the slits of the pin receiving parts were formed by etching. By this process it has been ound that a large number of female contactors corresponding to a large number of pins can be manufactured at one time.
As another example of the ixing method, there was studied a system in which a female contactor is interposed between two substrates as shown in Fig. 9. 9(a) shows a situation where the diameters of pin receiving holes in the upper and lower substrates are e~ual, 9(b) where upper and lower holes have diameters somewhat larger than the diameter of a pin and function to guide the pin, and 9(c) where in order to bring the upper and lower substrates into perfect adhesion the lower substrate is provided with a groove in which the female contactor is arranged. These are somewhat complicated in structure as compared with the bonding method, but are high in reliability of fixation. In addition, after the female contactor was simply bonded as shown in Fig. 7(a), ~zo;~
it had the substrate applied from above into the sandwiched structure, whereb~ fixation enduring even the heat cycle was realized. Perspective views o~ pin connectors applying this fixation system are shown in Figs. 10 and 11. Fig. 10 adopts the system of Fig. 9(b), and Fig. 11 the system o Fig. 9(c). The number of pins is 30, and the pitch interval between the pins is 2 inches. The pin is circular and 0.8mm in diameter, and the slit shape of the female contactor is that of Fig. 4(b) having a length of 3mm. The substrates are of acrylic resin. The example of Fig. 10 shows a structure in which the substrates are fixed by screws 18.
The example of Fig. 11 has a structure in which guide slots 16 receive the upper substrate 15 between the ends of the lower substrate 17, the upper substrate being inserted laterally as indicated by the arrow. In the case of Fig. 10, the female contactors need to be fixed on the lower sub-strate by simple bonding in order to fix their positions. In contrast, in the case of Fig. ll, the pOSitiQnS are ~ixed merely by placing the female contactors in the ~roove of the lower substrate. This brings forth the advantage that, even when the engaging part of only one pin has a drawback such as damage, the female contactors can be immediately exchanged.
~Embodiment 4~
A Cu-Ni-Al-system shape-memorizing alloy was stacked and compounded on Cu and Al oils placed on various insulating substrates having pin insertion holes, by sputtering. Oxygen-free copper (JIS, ~irst class~, electro-lytic Ni (purity: 99.5%) and Al (purity: 99.8~) were mixed, and one charge of 2.5 kg was dissolved at high fre~uency in vacuum (10 5 - 10 4 Torr). It was cast in a metal mold having a diameter of 95mm. Discs 90mm in diameter and 5mm in thickness were cut out of the resulting ingot by machining and were used as sputtering targets. The sputtering equip-ment employed was of the bipolar DC - magnetron type. A~ter the interior of a vessel in the e~uipment was evacuated to 3 x 10 7 Torr, Ar was introduced up to a pressure of 30 ~mHg, and the alloy was deposited on one side of a Cu foil or Al z - 14 ~
foil (20 ~m ~hick) under the sputtering conditions of an interelectrode distance of 60mm, an Ar partial pxessure of S mTorr and electric power of 200 W. The sputtering time-dependency of the thickness of the sputtered film at the time when the alloy was deposited on the substrate increased substantially rectilinearly with time. The alloy could be stacked near to 50 ~m in 4.5 h, and was in favorable close contact with the Al foil even in the stacked state left intact.
On the Cu foils, substantially the same time-dependency of the thickness of the sputtered film and films of high adhesion were attained. The martensitic transformation starting temperature (Ms) of these sputtered films was -123C as determined by four-termin~l measurement of electric resistance. Accordingly, the shape-memorizing alloy exhibits a remarkable shape memorizing effect between liquid nitrogen and room temperature$, and can be employed for a member that is operated between the temperatures.
When the quenched structure was observed with a scanning electron microscope, a layer of very fine crystals about 2 - 3 ~m in diameter was noted at the surface and moderated the stress concentration on a yrain boundary against bending deformation, so that the bending ductility was enhanced.
Using substrates on which shape-memorizing alloy was deposited on the Al and Cu foils in this manner, female contactors were manufa~tured by the process based on chemical etching as shown in Fig. 9. A ~ood shape-memorizin~ effect was noted when the shape-memorizing alloy was stacked to thicknesses of at least about 2 ~m in the composite material, with the Al foils being 50 ~m thick and to thicknesses of at least about 4 ~m in the composite material with the Cu foils.
In addition, composite materials in which both the constituents were in close contact with each other were formed.
In the present embodiment, a female contactor which was lmm in outside diameter, 0.5mm in the diameter of the central hole 5, and 3mm and 0.2mm in the length and width of the slit 7, respectively, was produced by chemical etching.
~2~æ
A pin having a diameter of 0.8mm was inserted therein in liquid nitrogen to open the central hole 5. Subsequently, the connector was restored to room temperature. It was then confirmed that the contacting parts of the female contactor had returned to the original flat state. The female contactor was next again immersed in liquid nitrogen and the pin inserted, which could be done with no resistance.
When the pin was withdrawn at room temperature, the force needed was about 100 gr.
(Embodiment 5) The present e~bodiment exemplifies application of the invention to the packaging of an LSI. Fig. 12 is a perspective view of a printed circuit board 22 on which LSI
packages 19, 19' employing an electric connector of the present invention are installed. The LSIs 19, 19l are soldered to a ceramic, multilayer, print-wired substrate 20, and are further connected to the connector 21 o the present invention. The connector of the present invention is joined to the printed circuit board 22 by solder 25~
Fig. 13 is a sectional view showing the connector located on the printed circuit board 22 and the substrate 20 mounted on the connector. A conductive film 23 electrically ~onnects a female contactor 2 and a pin 1" inserted into the printed circuit board 22. A pin 1' is inserted into a hole 6 in a ceramic substrate 15, and the female contactor 2, which is made of shape-memorizing alloy, is fixed on the conductive film by an upper ceramics insulating substrate 14.
Fig. 14 is a sectional view o an example in which the female contactor 2 is mounted on the printed circuit board 22 and the multilayer print-wired substrate 20 is placed thereon. The circuit board 22 is formed with wiring leads in a conventional manner and the female contac~or 2, which is made of a shape-memorizing alloy, is located at the hole therein as be~ore. The wiring film 24 and the female contactor 2 are joined by conductive paste or the like. The female contactor 2 is coated with a resin as indicated by numeral 26. In both the examples of Figs. 13 and 14, the p:ins ~2~ æ
_ 16 _ l' can be inserted with low insertion forces, because the insertion is performed when the female contactors are in the soft martensite state.
In order to form the female contactors 2 in the vapor phase by sputtering, evaporation or the like in the examples of Fig. 13 or 14, the pin receiving holes need to be closed up. Therefore a metal foil is fastened on the insulating substrate or the printed circuit board 22 and the shape-memorizing alloy is formed thereon and etched into the desired shape.
Fig. 15 is a sectional view showing another example of the present invention suited to the packaging of an LSI.
Female contactors 2, 2' of shape-memorizing alloy are disposed on both surfaces of an insulating substrate 3. A
conductive film 23 is provided so that the contactors 2, 2' are electrically connecte~ with each other. A pin 1' disposed on a multilayer, print-wired substrate 20 is inserted into the female contactor 2, while a pin l''' disposed on a printed circuit board 22 is inserted into the female contactor 2'.
Fig. 16 is a sectional view showing an LSI packaging structure in which a multilayer, print-wired substrate 20 is~provided with the contactor 2. As before the connector 2 is formed on the substrate 20 by thin band produced by melting and quenching the shape-memorizing alloy.
Alternatively, the thin film can be directly formed on the substrate fabricated by an ordinary method, being placed in electrical connection therewith by a process employing the vapor phase such as evaporation or sputtering, where-upon it is formed into the desired shape by etching.(Embodiment 6) A Cu-Ni-Al-system shape-memorizing alloy was stacked and compounded on various substrates (Cu, Al) by sputtering. The alloy had a composition of Cu - 4% Ni - 14 Al (by weight). Oxygen-free copper (JIS, first class), electrolytic Ni (purity: 99.5~) and Al (purity: 99.8~) were mixed, and one charge of 2.5 kg was dissolved at high frequency in vacuum (10 - 10 ~ Torr). Xt was cast in a ~20~
metal mold having a diameter o~ 95mm. Discs 90mm in diameter and Smm in thickness were cut out of the resulting ingot by machining and were used as sputtering targets. The sputtering equipment employed was of the bipolar DC -magnetron type. After the interior of a vessel in theequipment was evacuated to 3 x 10 7 Torr, Ar was introduced up to a pressure of 30 ~mHg, and the alloy was deposited on one side of a Cu foil or Al foil ~20 ~m thick) under the sputtering conditions of an interelectrode distance of 60mm, an Ar partial pressure of 10 2 Torr and an electric power of 200 W.
The alloy was deposited on the substrate of the Al foil by sputtering. The thickness of-the shape-memorizing alloy film increased substantially rectilinearly with sputtering time. The alloy can be stacked near to 50 ~Im in 4.5 h., and is in favorably close contact with the Al oil even in the stacked state left intact. On the Cu foils, substantially the same time-dependency of the thickness of the sputtered film and films of high adhesion were attained.
The martensitic transformation starting temperature (Ms) of these sputtered films was -123C. Accordingly, the shape-memorizing alloy exhibits a remarkable shape-memorizing effect between liquid nitrogen and room temperatures, and can be employed for a member that is operated between these temperatures. When the quenched structure was observed with a scanning electron microscope, a layer of very fine crystals about 2 - 3 ~m in diameter was ~ound at the sur~ace and moderated the stress concentration on a grain boundary against bending deformation, so that the bending ductility was enhanced.
~ est pieces each Smm wide and 50mm long were cut out of the composite materials in which the alloy was sputtered and deposited on the Al and Cu foils to various thicknesses in this manner, and the presence or absence of the phenomenon of the shape-memorizing efect therein was ~x~;ned. In the shape-memorizing alloy film, the condition formed during sputtering is stored. Aceordingly, the ~2~3ag~
desired shape can be stored in conformity with the shape of the film. The test piece was bent to a radius of 3mm so that the side of the shape-memorizing alloy layer might be subjected to tensile stress. In that condition the test piece was immersed in liquid nitrogen and was plastically deormed.
Thereafter, the test piece was returned to room temperature and the shape recovery condition thereof was ex~m;ned. As a result, good shape recovery was noted when the shape-memorizing alloy was stacked to thicknesses of at least about 2 ~m as indicated in a hatched part in the composite material with the Al foils being 50 ~m thick and to thicknesses of at least about 4 ~m in the composite material with the Cu foils. Thus, according to the present example, the sputter-deposited shape-memorizing alloy favorably adhered to the substrates, and the composite materials exhibit~d good shape-memorizing effects~ When emale contactors having the shape in Fig. 5(a) were formed by electrospark machining, chemical etching and punching by the use of these composite materials, favorable shape-memorizing effects were attained.
~Embodiment 7) A shape memorizing composite material was produced by compounding Cu and a Cu-based shape-memorizing alloy using a method of quenching molten metals as shown in ~ig. 17. The Cu was inserted in a nozzle 31 and the Cu - 4% Ni - 14~ Al alloy in a nozzle 32 and they were melted by a high frequency coil 33. Using argon gas under high pressure, the molten metals were spurted onto a roll 34 rotating at high speed, to be quenched and solidified. A composite ribbon of the Cu and the shape-memorizing alloy, in which the Cu-based shape-memorizing alloy was stacked on a Cu ribbon, was fabricatedby this method. The nozzles were made of transparent silica.
At the tips, the nozzle 31 was provided with a slit of 0.5 x 5mm and the nozzle 32 with an aperture 0.5mm in diameter.
The distance between the two nozzles was set at 120mm.
Oxygen-free copper (JIS, first class) was employed. The roll used was made of tool steel and had a diameter of 300mm, and was set at a rotational frequency of 2000 r.p.m. The gap ~2~39~62 _ 19 between each nozzle and the roll was set at 0.02mm, and the molten metals were spurted under a jet gas pressure of 0.4 kg/cm2. In the fabricated composite material, Cu was 50 ~m ~hick, and Cu-Al-Ni was 90 ~m thick, and they adhered favorably. When the shape-memorizing effect was assessed by the method indicated in Example 6, good shape recovery was noted. The boundary between the compounded ribbons could not be observed because of the absence of any means for detecting the alloy phase. However, the atoms were physically joined in close contact with each other so as to have a force enough to endure a bimetal~like action.
Further, when female contactors having the shape in Fig. 5(a) were formed by electrospark machining etc., favorable connections as connectors were achieved.
Claims (17)
1. A connector comprising:
an insulating substrate having a plurality of through-holes and a first circuit pattern formed on the sub-strate;
female contactors each located and fixed around the edge of a said through-hole and having an opening, an edge of which extends inwardly of the through-hole, said female contactors being electrically connected to said first pattern; and a male contactor comprising an insulating sub-strate having a second circuit pattern thereon and a plurality of male contactor pins fixed to the substrate and electrically connected to said second pattern, said pins each being located in a position corresponding to each of the openings of said female contactors, wherein said female contactors are made of a thin film of a shape memory alloy and the edge of each of the female contactors is given, before inserting each of the male contactor pins, such a shape memory that the contactor is returned to a position to close the opening when said contactor is subjected to a temperature above the martensitic transistion temperature, whereby said female contactors and said male contactor can be electrically connected and mechanically joined securely.
an insulating substrate having a plurality of through-holes and a first circuit pattern formed on the sub-strate;
female contactors each located and fixed around the edge of a said through-hole and having an opening, an edge of which extends inwardly of the through-hole, said female contactors being electrically connected to said first pattern; and a male contactor comprising an insulating sub-strate having a second circuit pattern thereon and a plurality of male contactor pins fixed to the substrate and electrically connected to said second pattern, said pins each being located in a position corresponding to each of the openings of said female contactors, wherein said female contactors are made of a thin film of a shape memory alloy and the edge of each of the female contactors is given, before inserting each of the male contactor pins, such a shape memory that the contactor is returned to a position to close the opening when said contactor is subjected to a temperature above the martensitic transistion temperature, whereby said female contactors and said male contactor can be electrically connected and mechanically joined securely.
2. A connector as defined in Claim 1, wherein said male contactor is inserted in said hole of said female contactor at a temperature not higher than the martensitic transformation temperature of said alloy, whereupon said connector is held at the parent phase transformation temperature of said alloy.
3. A connector as defined in Claim 1, wherein the part of said female contactor forming said hole has a shape memory based on a bending deformation so as to be bending-deformed into a space larger than the occupying space of said male contactor in the contact part between said female and male contactors at a temperature not higher than the martensitic transformation temperature of said alloy, and so as to become a space smaller than the occupying space of said male contactor in the contact part in the parent phase transformation condition after said male contactor has been inserted in the bending-transformed state.
4. A connector as defined in Claim 1, wherein said hole is provided with a slit of a width smaller than the occupying space of said male contactor in the contact part between said female and male contactors.
5. A connector as defined in Claim 4, wherein the insulating substrate is fastened to one surface or both surfaces of said female contactor.
6. A connector as defined in Claim 1, wherein said female contactors are provided on one side of said insulating substrate, while said male contactor is provided on the opposite side thereof.
7. A connector as defined in Claim 5, wherein said female contactors on said upper and lower surfaces are electrically connected through a conductive film formed at said hole provided in said insulating substrate.
8. A connector as defined in any of Claims 1 to 3, wherein said female contactors are formed of a composite member in which thin metal films are stacked and fastened, and at least one of said thin metal films is made of the shape-memorizing alloy.
9. In a packaging structure for a semiconductor device wherein a multilayer print-wired substrate on which the semiconductor device is mounted is connected to a connector, and the connector is then mounted on a printed circuit board;
a connector characterised by comprising:
an insulating substrate having a plurality of through-holes and a first circuit pattern formed on the substrate;
female contactors each located and fixed around the edge of a said through-hole and having an opening, an edge of which extends inwardly of the through-hole, said female contactors being electrically connected to said first pattern; and male contactor disposed in said multilayer print-wired substrate and comprising an insulating substrate having a second circuit pattern thereon and a plurality of male contactor pins fixed to the substrate and electrically connected to said second pattern, said pins each being located in a position corresponding to each of the openings of said female contactors, wherein said female contactors are made of a thin film of a shape memory alloy and the edge of each of the female contactors is given, before inserting each of the male contactor pins, such a shape memory that the contactor is returned to a position to close the opening when said contactor is subjected to a temperature above the martensitic transition temperature, whereby said female contactors and said male contactor can be electrically connected and mechanically joined securely.
a connector characterised by comprising:
an insulating substrate having a plurality of through-holes and a first circuit pattern formed on the substrate;
female contactors each located and fixed around the edge of a said through-hole and having an opening, an edge of which extends inwardly of the through-hole, said female contactors being electrically connected to said first pattern; and male contactor disposed in said multilayer print-wired substrate and comprising an insulating substrate having a second circuit pattern thereon and a plurality of male contactor pins fixed to the substrate and electrically connected to said second pattern, said pins each being located in a position corresponding to each of the openings of said female contactors, wherein said female contactors are made of a thin film of a shape memory alloy and the edge of each of the female contactors is given, before inserting each of the male contactor pins, such a shape memory that the contactor is returned to a position to close the opening when said contactor is subjected to a temperature above the martensitic transition temperature, whereby said female contactors and said male contactor can be electrically connected and mechanically joined securely.
10. In a packaging structure for a semiconductor device wherein a multilayer print-wired substrate on which the semiconductor device is mounted is connected to a connector, and the connector is then mounted on a printed circuit board;
a connector characterized by comprising:
an insulating substrate as said printed circuit board having a plurality of through-holes and a first circuit pattern formed on the substrate;
female contactors each located and fixed around the edge of a said through-hole and having an opening, an edge of which extends inwardly of the through-hole, said female contactors being electrically connected to said first pattern; and a male contactor disposed in said multilayer print-wired substrate and comprising an insulating substrate having a desired second circuit pattern thereon and a plurality of male contactor pins fixed to the substrate and electrically connected to said second pattern, said pins each being located in a position corresponding to each of the openings of said female contactors, wherein said female contactors are made of a thin film of a shape memory alloy and the edge of each of the female contactors is given, before inserting each of the male contactor pins, such a shape memory that the contactor is returned to a position to close the opening when said contactor is subjected to a temperature above the martensitic transition temperature, whereby said female contactors and said male contactor can be electrically connected and mechanically joined securely.
a connector characterized by comprising:
an insulating substrate as said printed circuit board having a plurality of through-holes and a first circuit pattern formed on the substrate;
female contactors each located and fixed around the edge of a said through-hole and having an opening, an edge of which extends inwardly of the through-hole, said female contactors being electrically connected to said first pattern; and a male contactor disposed in said multilayer print-wired substrate and comprising an insulating substrate having a desired second circuit pattern thereon and a plurality of male contactor pins fixed to the substrate and electrically connected to said second pattern, said pins each being located in a position corresponding to each of the openings of said female contactors, wherein said female contactors are made of a thin film of a shape memory alloy and the edge of each of the female contactors is given, before inserting each of the male contactor pins, such a shape memory that the contactor is returned to a position to close the opening when said contactor is subjected to a temperature above the martensitic transition temperature, whereby said female contactors and said male contactor can be electrically connected and mechanically joined securely.
11. In a packaging structure for a semiconductor device wherein a multilayer print-wired substrate on which the semiconductor device is mounted is connected to a connector, and the connector is then mounted on a printed circuit board;
a connector characterized by comprising:
an insulating substrate as said multilayer print-wired substrate having a plurality of through-holes and a first circuit pattern formed on the substrate;
female contactors each located and fixed around the edge of a said through-hole and having an opening, an edge of which extends inwardly of the through-hole, said female contactors being electrically connected to said first pattern; and a male contactor disposed in said semiconductor device and comprising an insulating substrate having a second circuit pattern thereon and a plurality of male contactor pins fixed to the substrate and electrically connected to said second pattern, said pins each being located in a position corresponding to each of the openings of said female contactors, wherein said female contactors are made of a thin film of a shape memory alloy and the edge of each of the female contactors is given, before inserting each of the male contactor pins, such a shape memory that the contactor is returned to a position to close the opening when said contactor is subjected to a temperature above the martensitic transition temperature, whereby said female contactors and said male contactor can be electrically connected and mechanically joined securely.
a connector characterized by comprising:
an insulating substrate as said multilayer print-wired substrate having a plurality of through-holes and a first circuit pattern formed on the substrate;
female contactors each located and fixed around the edge of a said through-hole and having an opening, an edge of which extends inwardly of the through-hole, said female contactors being electrically connected to said first pattern; and a male contactor disposed in said semiconductor device and comprising an insulating substrate having a second circuit pattern thereon and a plurality of male contactor pins fixed to the substrate and electrically connected to said second pattern, said pins each being located in a position corresponding to each of the openings of said female contactors, wherein said female contactors are made of a thin film of a shape memory alloy and the edge of each of the female contactors is given, before inserting each of the male contactor pins, such a shape memory that the contactor is returned to a position to close the opening when said contactor is subjected to a temperature above the martensitic transition temperature, whereby said female contactors and said male contactor can be electrically connected and mechanically joined securely.
12. A packaging structure for a semiconductor device as defined in any of Claims 9 to 11, wherein said female contactors are formed as a composite member in which thin metal films are stacked and fastened, at least one of said thin metal films being made of shape-memorizing alloy.
13. In a composite material in which thin metal films are stacked and fastened together; a shape-memorizing composite member characterized in that at least one of said thin metal films is made of a shape-memorizing alloy.
14. A shap-memorizing composite member as defined in Claim 13, wherein a non-shape-memorizing material and the shape-memorizing alloy are stacked alternately.
15. A shape-memorizing composite member as defined in Claim 14, wherein said non-shape-memorizing material is a pure metal of copper, silver, gold or aluminum.
16. A shape-memorizing composite member as defined in Claim 15, wherein said non-shape-memorizing material is a ferromagnetic material.
17. A shape-memorizing composite member as defined in Claim 13 or 16, wherein shape-memorizing materials of unequal transformation points are stacked and fastened together.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP105652/83 | 1983-06-15 | ||
| JP58105652A JPS59230741A (en) | 1983-06-15 | 1983-06-15 | Shape memory composite material |
| JP135883/83 | 1983-07-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1203862A true CA1203862A (en) | 1986-04-29 |
Family
ID=14413375
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000456685A Expired CA1203862A (en) | 1983-06-15 | 1984-06-15 | Connector and packaging structure of semiconductor device employing the same |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US4950173A (en) |
| EP (1) | EP0130719B1 (en) |
| JP (1) | JPS59230741A (en) |
| CA (1) | CA1203862A (en) |
| DE (1) | DE3480681D1 (en) |
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| US3528173A (en) * | 1966-08-15 | 1970-09-15 | Andrew S Gall | Making circuit boards |
| DE1915780A1 (en) * | 1969-03-27 | 1970-10-08 | Standard Elek K Lorenz Ag | Electrical connector |
| US3748108A (en) * | 1970-04-07 | 1973-07-24 | Us Army | Thermally activated spring with improved thermal properties |
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| DE2540943B2 (en) * | 1975-09-13 | 1978-02-02 | W.C. Heraeus Gmbh, 6450 Hanau | CONTACT BODY FOR AN ELECTRIC CONNECTOR |
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| JPS57185680A (en) * | 1981-05-08 | 1982-11-15 | Fujitsu Ltd | Method of coupling flexible printed board |
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| US4487465A (en) * | 1981-12-07 | 1984-12-11 | Raychem Corporation | Heat recoverable connecting device |
| JPS58105652A (en) * | 1981-12-18 | 1983-06-23 | Meidensha Electric Mfg Co Ltd | Relieving method for system down in a loop type data highway system |
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| GB2130025A (en) * | 1982-11-08 | 1984-05-23 | Control Data Corp | Memory board stacking module |
| JPS59146175A (en) * | 1983-02-10 | 1984-08-21 | 株式会社日立製作所 | Electric connector |
-
1983
- 1983-06-15 JP JP58105652A patent/JPS59230741A/en active Pending
-
1984
- 1984-06-14 DE DE8484304015T patent/DE3480681D1/en not_active Expired - Lifetime
- 1984-06-14 EP EP84304015A patent/EP0130719B1/en not_active Expired
- 1984-06-15 CA CA000456685A patent/CA1203862A/en not_active Expired
-
1986
- 1986-03-24 US US06/843,004 patent/US4950173A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59230741A (en) | 1984-12-25 |
| EP0130719A3 (en) | 1986-02-05 |
| EP0130719A2 (en) | 1985-01-09 |
| EP0130719B1 (en) | 1989-12-06 |
| US4950173A (en) | 1990-08-21 |
| DE3480681D1 (en) | 1990-01-11 |
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| MKEX | Expiry | ||
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Effective date: 20040615 |