CA1214585A

CA1214585A - Epoxy modified structural adhesives having improved heat resistance

Info

Publication number: CA1214585A
Application number: CA000436513A
Authority: CA
Inventors: Terrance H. Dawdy
Original assignee: Lord Corp
Current assignee: Lord Corp
Priority date: 1982-09-13
Filing date: 1983-09-12
Publication date: 1986-11-25
Also published as: US4467071A; NO833256L; FR2532944A1; DE3333006C2; EP0106160A2; ATE31728T1; DE3333006A1; DK412483A; GB8324415D0; GB2127034B; EP0106160A3; DK412483D0; JPS5974177A; KR910004792B1; GB2127034A; KR840006186A; ZA836793B; EP0106160B1; JPH0126387B2; FR2532944B1

Abstract

ABSTRACT OF THE DISCLOSURE

Structural adhesive systems having improved heat resistance comprising a solution or dispersion of a polymeric material in a mono-mer copolymerizable therewith, an unsaturated organophosphorus partial ester and an epoxy resin are disclosed.

Description

The present invention relates to structural adhesive combo-sessions. More particularly, the invention relates to improving heat resistance of structural adhesive compositions.
Structural adhesive compositions are well-known articles of commerce which are extensively used commercially for bonding metal and plastic materials. The load-bearing and stress-relieving properties of structural adhesives, as well as their bond strength, which can exceed the strength of the engineering materials which are being bonded, make these adhesives attractive alternatives to or replacements for motion-eel methods, such as riveting or spot welding, of joining engineering materials, especially where it is preferable to distribute load sires-sues over larger areas rather than to concentrate such stresses at a few points. Their use can reduce or eliminate costly finishing operations necessitated by mechanical joining methods, present a more pleasing exterior and at least reduce the possibility of corrosion of assemblies containing one or more metal components. Additionally, they can be I` used to bond a diversity of metals without extensive surface pro parathion. For example, Zilch et at U.S.A. Patent 4,223,115 and Brings et at U.S.A. Patent 3,890,407 disclose acrylic structural adhesive compositions which are effective bonding materials for oily metal surfaces.
Despite the attractiveness of acrylic structural adduces they are not without deficiency. For example, a burgeoning application us area for such adhesives is in the bonding of lightweight metal and plastic materials in the transportation industry in the fabrication of '.

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s85 vehicle bodies and component parts. In such applications, the final assembly is typically painted after the adhesive has been cured, prefer-ably at ambient conditions of temperature, and the painted surfaces are exposed to a bake cycle at temperatures above Luke to augment set-tying and adhesion of the paint film. While the acrylic adhesives provide excellent bond characteristics at ambient conditions of temper-azure, it has been found that assemblies bonded with such adhesives, when exposed to elevated temperature bake cycles suffer a significant loss of adhesive strength when tested at temperatures corresponding to those employed in the bake cycle and suffer a reduction in initial adhesion values when tested at ambient temperature following exposure to such elevated temperatures. Quite obviously, improvements in elevated temperature performance without otherwise detracting from adhesive performance, would significantly enhance the use of acrylic structural adhesives.
In accordance with the present invention, it has been discovered that the heat resistance, that is, thy ability to resist thermal degradation as evidenced by the recovery of initial properties after exposure to elevated temperatures, of acrylic structural adhesives can be significantly improved by incorporating into such adhesives at least one epoxy resin and at least one olefinically unsaturated organic partial ester of a phosphorus acid. According to the invention, the amount of epoxy resin is greater than stoichiometric with respect to the acid hydroxyl function of the organophosphorus partial ester that is, the epoxy resin is employed in an amount so as to provide more than one equivalent of epoxide functionality per equivalent of acid -OH moieties and no catalytic hardener for the epoxy resin it employed, in order to enhance epoxide phosphate ester formation without full reaction of all epoxide groups. Adhesive compositions prepared in accordance with the invention afford increased initial adhesion values, better recovery of initial properties follow-in exposure to elevated temperatures improved heat resistance) and increased hot strength, that is, adhesive strength at elevated tempera-lures, than are afforded by the same adhesives which do not contain both the epoxy resin and the organophosphorus partial ester.

I

SWISS

In accordance with the present invention, acrylic structural adhesives having improved elevated temperature properties have been discovered More particularly, the novel acrylic structural adhesive compositions of the invention comprise, in combination, A. at least one polymeric material selected from the group consisting of l. at least one olefinically unsaturated urethane reaction product of at least Oh isocyante-functional prepolymer and at least one hydroxy-functional monomer having at least one unit of polymeri~able olefinic unsatur'ation, such reaction product being characterized by the presence of at least two units of olefinic unsaturation and the substantial absence of free isocyanate groups;

2. a least one butadiene-based elastomeric polymeric material selected from the group consisting of (a) homopolymer of butadiene;
(b) copolymer of butadiene and at least one moo-men copoly~erizable therewith selected from the group consisting of styrenes acrylonitrile, methacrylonitrile and mixtures thereof;
(c) modified''elastomeric polymeric material select ted from the group consisting of butadiene homopolymer and copolymer as previously defined, such homopolymer and copolymer having been modified by copolymerization therein of trace amounts up to 5 percent by weight, based on weight of modified elastomeric polymeric material, of at least one functional monomer and (d) mixtures thereof;

3. ' at least one polymer-in-monomer syrup consisting essentially of (a) from 2 to 90 percent by weight of at least one : polymerizable addition polymer;
(b) from lo to 98 percent by weight of at least one polymerizable olefinically unsaturated monomeric compound having at least one - C = C - group; and (c) from 0 to 30 percent by weight of a polymer containing the group (CH2CCl Shoeshine, wherein n is an integer;
wherein tax and (b) are present as a partial polymerization product of (b) or of (b) in the presence of (c), the mixture of (a) and (b) or of (a), (b) and (c) being a syrup of polymer ~2~5~S
dissolved or dispersed in unpolymerized monomer, in which syrup the amount of (a) derived from (b) is in the range from 2 to 90 percent by weight, based on the total weight of (a), (b) and (c ) .

4. at least one polymerizable polymeric material selected from the group consisting of polyvinyl a]kyl ether, s-tyrene-acrylonitrile resin, unsaturated polyester resin and mixtures thereof, the alkyd moiety of such ether containing from one to 8 carbon atoms;

5. a-t least one homopolymer or copolymer of at least one monomer selected from the group consisting of Sterno and alkyd or hydroxyalkyl esters of acrylic or methacrylic acid, said ester having from one to I carbon atoms in the alkyd moiety; and

6. mixtures of such polymers;
B. a-t least one polymerizable material selected from the group consisting of styrenes acrylic or substituted acrylic monomer, and mixture Thor, -the amount of such polymerizable monomer being in addition to any such monomer present in I
C. at least one phosphorus-containing compound having a-t least one olefinically unsaturated group and at least one P-OEIgroup;
D. at least one epoxy resin; and E. room temperature-active redo catalyst system.
More specifically, the room temperature-curable acrylic structural adhesive of the invention comprise:
A. at least one polymerizable polymeric material selected from the group consisting of:
1. at least one olefinically unsaturated urethane I reaction product of at least one isocyanate-functional pro-polymer and at least one hydroxy-functional monomer having at least one unit of polymerizable olefinic unsaturation, such ~L2~4$~5 reaction product being characterized by the presence of at least two units of olefinic unsaturation and the substantial absence of free isocyana-te groups;
2. at least one butadiene-based elastomeric polymeric material selected from the group consisting of (a) homopolymer of butadiene;
(b) copolymer of butadiene and at least one monomer copolymerizable therewith selected from the group consisting of styrenes acrylonitrile, methacrylonitrile and mixtures thereof;
(c) modified elastomeric polymeric material selected from the group consisting of butadiene homopolymer and Capella-men as previously defined, such homopolymer and copolymer having - pa -been modified by copolymeri~ation therein ox trace amounts up to 5 percent by weight, based on weight of modified elastomeric polymeric material, of at least one functional monomer; and (d) mixtures thereof;
3. at least one polymer-in-monomer syrup consisting essentially of (a) from 2 to 90 percent by weight of at least one addition polymer;
(b) from 10 to 98 percent by weight of at least one .polymerizab1e olefinically unsaturated compound having at least one C a C - group; and (c) from O to 30 percent by weight of a polymer containing the group (CH2CCl = Shoeshine, wherein n is an integer;
wherein (a) and (b) are present as a partial polymerization product of by or of (b) in the presence of (c); the mixture of (a) and (b) or of (a), (b) and (c) being a syrup of polymer dissolved or dispersed in monomer, in which syrup the amount of (a) derived from (b) is in the range from 2 to 90 percent by weight, based on the total weight of (a), (b) and (c);
4. at least one polymeric material selected from the group consisting of polyvinyl alkyd ether, styrene-acrylonitrile resin, unsaturated polyester resin and mixtures thereof, the alkyd moiety of such ether containing from one to 8 carbon atoms;
5. at least one homopolymer or copolymer of at least one monomer selected from the group consisting of styrenes and alkyd or hydroxyalkyl esters of acrylic or methacrylic acid, said ester having from one to 18 carbon atoms in the alkyd moiety; and 6. mixtures of such polymers;
: B. at least one polymerizable material selected from the group consisting of styrenes acrylic or substituted acrylic monomer, and mixtures thereof;
C. at least one phosphorus-containing compound having at least one olefinically unsaturated group and at least one P-OH group;
D. at-least one epoxy resin;
E. at least one reducing agent of a room temperature-active redo couple catalyst system; and US

_ -6-F. a bonding accelerator containing at least one oxidizing agent of a room temperature-active redo couple catalyst system, said oxidizing agent being reactive at room temperature with said reducing agent to produce free radicals effective to initiate polymerization of said addition-polymerizable polymeric material and said polymerizable olefinically unsaturated monomer polymer of one or more such monomers or partially polymerized syrup of one or more such monomers, wherein the amount of such olefinically unsaturated urethane reaction product is in the range from 10 to 90, preferably 13 to R3, percent by weight, based on total sleight of polymerizable materials and reducing agent; the amount of such butadiene-based elastomeric polymeric material is in the range from 1 to 30, preferably

7 to 27, percent by weight, based on total weight of polymerizable materials and reducing agent; the amount of such polymer-in-monomer syrup is in the range from 2 to 60, preferably 5 to 60, percent by weight based on total weight of polymerizable materials and reducing agent; the anoint of said polyvinyl alkyd ether, styrene-acrylonitrile resin and unsaturated polyester resin is in the range from 5 to 75, preferably Tao 75, percent by weight, based on total weight of polymerizable materials and reducing agent; the amount of said home-polymer or copolymer of at least one of styrenes and esters of acrylic or substituted acrylic acids is on the range from 2 to 60, preferably 5 to 60, percent by weight, based on total weight of polymerizable materials and reducing agent; the amount of such styrenes and acrylic or us substituted acrylic monomers is in the range from 10 to 90, preferably 17 to 87, percent by weight, based on total weight of polymerizable : materials and reducing agent; the amount of said phosphorus-containing compound is in the range from 0.1 to 20, preferably 2 to 10, percent by weight, based on total weight of polymerizable materials and reducing agent; the epoxy resin is present in an amount sufficient to provide :: from 1 to 5, preferably 1.75 to 4.259 epoxide equivalents per equip valet of P-OH; said reducing agent is present in an amount of 0.05 to 10, preferably 0.1: to 6, percent by weight, based on total weight of polymerizable materials; and the amount of said oxidizing agent is in the range from I to 30, preferably 1 to 10, percent by weight, based on total weight of bonding accelerator.
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I

The adhesive systems of the invention can optionally contain up to 50, preferably not more than 25, percent by weight, based on total weight of polymerizable material and reducing agent, of at least one pol~nerizable olefinically unsaturated non-acrylic monomer; up Jo 60, preferably not more than 30, percent by weight, based on total weight of polymerizable material and reducing agent, of at least one polymerizable polymeric material having an intrinsic viscosity in the range from 0.1 to 1.3, such polymeric material being obtained from the polymerization of at least one styrenes monomer, acrylic monomer, sub-lo stituted acrylic monomer, olefinically-unsaturated non-acrylic monomer or mixtures thereof; up to 40, preferably not more than 30, percent by weight, based on total weight of polymerizable materials and reducing agent, of at least one addition-polymerizable elastomeric material having a second order glass transition temperature below 5C; up to 5 percent by weight of at least one unsaturated dicarboxylic acid ester;
up to 10 percent by weight of at least one unsaturated polyester resin;
up to 20 percent by weight of at least one unsaturated carboxylic acid having one or more, preferably one, carboxylic acid group; and up to 1 percent by weight of at least one waxy substance selected from the group consisting of paraffin wax, Montana wax, beeswax, ceresin wax and spermaceti wax.
Polymer-in-monomer syrups suitable for use in the present invention, compositional as well as their preparation, are well known in the art. Representative syrups, including precursor liquid monomer compounds containing at least one olefinically unsaturated group, and their preparation are disclosed in U.S.A. Patents Nos. 3,333,025;
3,725,504; and 3,873,640. Briefly, such syrups are conveniently prepared by de-aerating the starling mixture consisting essentially of at least one poly~erizable liquid olefinically unsaturated compound and, when used, polymer containing the group (CH2-CCl = Shoeshine for a short period at about 40C under vacuum and then heating the mixture to about 75C under an inert gas atmosphere. A catalyst for example, a free radical-generating catalyst such as bouncily peroxide or azodiisobutyric acid dinitrile, is then added, preferably in the form of a solution. The quantity of catalyst added is such that it will be completely consumed when the desired viscosity is reached. After the reaction is completed, the polymer-in-monomer syrup is cooled. Prefer-ably, the syrups have a viscosity in the range from about 500 to about 1,000,000 maps at 20C.

5~5 Monomeric liquid olefinically unsaturated compounds suitable for use in the adhesive compositions of the invention for forming polymer-in-monomer syrups and as additional polymerizable materials are characterized by the presence of at least one - C = C - group. The olefinically unsaturated group is preferably a vinyl group, more preferably terminally located, with acrylic and substituted acrylic monomers being currently preferred. Representative olefinically us-saturated monomers include, without limitation, methyl methacrylate, bottle methacrylate, ethyl acrylate, diethylene glyco1 dimethacryla~e, methacrylic acid, acrylic acid, acrylonitrile, methacrylonitrile, styrenes vinyl styrenes vinyl acetate, chlorostyrene, glycidyl moth-acrylate, itaconic acid, acrylamide, methacrylamide, vinylidene chloride, 2,3-dichloro-1,3-butadiene, 2-chloro-1,3-butadiene, methyl-styrenes and n-butylstyrene.
Polymers containing the grouping (CH2-CCl = Shoeshine, wherein n is an integer, are well-kno~n in the art under the name neoprene, which is produced by the polymerization of sheller-butadiene. Further elucidation would be superfluous.
The isocyanate-functional prepolymers which are suitable for use in the practice ox this invention are well Nolan. Typically, such prepolymers are adduces or condensation products of polyisocyanate compounds having at least two free isocyanate groups and monomeric or polymeric polyols having at least two hydroxy groups, including mix-lures of such polyols. The reaction between the polyisocyanate and the polyols is effected employing an excess amount of polyisocyanate to ensure that the reaction product will contain at least two free, us-reacted isocyanate groups.
Polyols useful in preparing isocyanate-funct;onal prepolymer used in the present invention preferably have an average molecular weight of about 300 to about 3,000. Suitable polyols include polyp alkaline glycols such as polyethylene glycols; polyetherpolyols such as those prepared by addition polymerization of ethylene oxide and a polyol such as trimethylol propane in a ratio to provide unrequited hydroxyl groups in the product; organic hydroxylated elastomers exhibiting second order glass transition temperatures below about 5C
., . , I s such as poly(butadiene-styrene) polyols and poly(butadiene) polyols;
polyester polyols such as are prepared by polymerizing polyols, such as diethylene glycol, ~rimethylo1 propane or 1,4-butanediol, with polyp carboxylic acids, such as phthalic, terephthalic, adipic, malefic or succinic acids, in a ratio to provide unrequited hydroxyl groups in the product; glyceride esters of hydroxyla~ed fatty acids such as castor oil, glycerol monoricinoleate, blown linseed oil and blown soya oil;
and polyesterpolyols such as are prepared by the polymerization of a lactose such as epsilon caprolactone.
- Polyisocyanates which can be reacted with polyols to form isocyanate-functional prepolymers for use in the present invention can be any monomeric; that is, non-polymeric, isocyanate compound having at least two free isocyanate groups, including aliphatic, cycloaliphatic and aromatic compounds. Representative polyisocyanates include, without limitation thereto, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 4,4'-diphenylmethane diisocyanate, m- and p-phenylene dilsocyanate, polyethylene polytphenyl isocyanate), hexamethylene diisocyanatel 4,4'-methylene-bis(cyclohexyl isocyanate), isophorone diisocyanate, and other aliphatic cycloaliphatic and aromatic polyp isocyanates, and including mixtures of such polyisocyanates. Cur-gently, cycloaliphatic and aromatic polyisocyanates are preferred.
Hydroxy-functional compounds which can be employed to intro-dupe olefinic unsaturation into the isocyanate-functional prepolymer include, without limitation, hydroxyethyl acrylate, hydroxyethyl moth-acrylate, ally alcohol, and vinyl alcohol.
The butadiene-based elastomeric polymeric materials which are suitable for use in the practice of this invention are also well known and can be any elastomers derived from 1,3-butadiene or its halogenated analogs which has a glass transition temperature below ambient temper-azure and preferably not above about 5 C. Suitable elastomers in-elude butadiene homopoly0er, copolymers of butadiene with styrenes acrylonitrile and methacrylonitrile, and such homopoly~ers and copolymers modified by copolymerization therein of trace amounts (0.05 to I of a Junctional comonomer, such as acrylic acid, methacrylic acid, malefic android, fumaric acid styrenes and methyl methacrylate.
Polyvinyl alkyd ethers suitable for use in the adhesive compositions which are described herein are well-known in the art.

58~i Such ethers will preferably contain 1 to 8, more preferably 1 to 4, carbon atoms in the alkyd moiety ox said ether. Likewise, styrenes acrylonitrile polymers which are suitable for use in the invention are well known.
Elastomeric polymeric materials having second order glass transition temperatures below about 5C can be effective in modifying room temperature flexibility of the adhesive bond. Especially pro-furred of such elastomers are polychloroprene rubber; polybutadiene rubber; butadiene copolymer rubbers such as acrylonitrile-butadiene, Jo carboxylated acrylonitrile-butadiene and styrene-butadiene rubbers;
polyacrylate rubbers such as poly(ethyl acrylate) and poly-(ethyl acrylate-halogenated vinyl ether-acrylic acid) rubbers; and ethylene copolymers such as ethylene-vinyl acetate rubbers. Other elastomeric polymers having a glass transition temperature about 5C can be employed since, other than the low glass transition temperature, there are no other limitations on the identity of the elastomers except for the specific requirements of the particular adhesive being formulated, such as suitable molecular weight, viscosity characteristics and compatibility with the other ingredients of the adhesives.
Such elastomeric polymeric materials are particularly bone-filial when incorporated in acrylic adhesives comprising at least one olefinically unsaturated polyurethane.
Non-acrylic monomers which can be employed in the herein-described adhesive systems include styrenes chlorostyrene, vinyl ; 25 styrenes and vinyl acetate.
Polymeric materials having an intrinsic viscosity of 0.1 to about 1.3 which are suitable for use in the present invention can be obtained by the polymerization of one or more acrylic and non acrylic monomers, including mixtures thereof. Exemplary polymeric materials include poly(methyl methacrylate/n-butylacrylate/ethyl acrylate) (90/S/5%); poly(n-butyl methacrylate/isobutyl methacrylate) (~0/50~);
poly(n-butyl methacrylate) and pothole methacrylate). Preferably, the viscosity will be about midway in the recited range.
The use ox polymeric materials having such intrinsic disco-sties is especially beneficial in acrylic adhesives containing home-polymers and copolymers of 1,3-butadiene.

I

The epoxy compounds which are suitable for use in the invention can be any monomeric or polymeric compound or mixture of compounds having 1,2-epoxy equivalency greater than one, that is, wherein the average number of 1,2-epoxy groups per molecule is greater than 1; with polymeric epoxide compounds having a molecular weight in the range from 400 to 10,000 being currently preferred. Epoxy come pounds are well-known, see, for example, U.S.A. Patents Nos. 2,467,171;
2~615,007; 2,716,123; 39030,336 and 39053,855. Useful epoxy compounds include the polygiycidyl ethers of polyhydric alcohols, such as ethyl lo tone glycol, triethylene glycol, propylene glycol, 1,5-pentanediol, 1,2,6-hexanetriol, glycerol and 2,2-bis(4-hydroxy-cyclohexyl) propane;
the polyglycidyl esters of aliphatic or aromatic polycarboxylic acids, such as oxalic acid, succinic acid, glutaric acid, terephthalic acid, 2,6-naphthalene dicarboxylic acid and dimerized linolenic acid; and the polyglycidyl ethers of polyphenols, such as Bisphenol A, l,l-bis(A-hydroxy-phenyl)ethane, l,l-bis(hydroxy-phenyl) isobutane, Boyce-hydroxy-t-butyl-phenyl) propane, I,5-dihydroxynaphthalene and novolak resins; with cycloaliphatic polyglycidyl compounds being currently preferred.
Phosphorous-containing compounds which are suitable for use in the adhesive compositions of the invention are selected from the group consisting of derivatives of phosphinic acid, phosphoric acid and pros-phonic acid having at least one -POX group and at lest one organic mow-eta characterized by the presence of at least one olefinically unseater-axed group, which is preferably terminally located. More particularly, such olefinicall~ unsaturated organophosphorus compounds have the char-acteristic formula I. X - R - P - R - X 9 OH
wherein each R is the same or different, and each R is index pendently a diva lent organic radical directly bonded to the phosphorus atom through a carbon-phosphorus bond, said diva lent radical being selected from the group consisting of diva lent unsubstituted organic radical and diva lent organic radical having at least one substituent group selected from the class consisting of halogen, hydroxyl, amino, alkyd radical containing from 1 to 8, preferably 1 to I carbon atoms and aureole radical having at least one moiety containing at least one ~2~4~$

aromatic nucleus; at least one X is SHEA = C and the other X is a functional group selected from the group consisting of hydrogen, hydroxyl, amino, Marquette, halogen and SHEA = C , II. X - R - P - O -OH
2 wherein R is as previously defined; Al is hydrogen or -R -X, wherein R2 is a diva lent organic radical directly bonded to the oxygen radical through a carbon oxygen bond, said diva lent radical being selected from the group consisting of diva lent unsubstituted organic radical and diva lent organic radical having at least one sub-lo . stituent group selected from the class consisting of halogen, hydroxyl, amino, alkyd radical containing from 1 to 8 carbon atoms and aureole radical having at least one moiety containing at least one aromatic nucleus; and wherein X is as previously defined, with the proviso that at least one X moiety must be SHEA - C ;
R
III. R - O - - O - R, OH
wherein Al is as previously described, with the proviso that at least one Al group contains at least one SHEA = C moiety.
A currently preferred group of phosphorus-containing compound has the formula Of O
IV. (SHEA = O - C - O A) - P or ) R OH
: wherein R3 it selected from the group consisting of hydra-gent halogen, an alkyd group having from one to 8, preferably one to 4, carbon atoms, and SHEA = OH - ; R4 is selected from the group con-sitting of hydrogen, an alkyd group having from one to 8, preferably one to 4 carbon atoms, and a haloalkyl group having one to 8, prefer-ably one to 4, carbon atoms; A is selected from the group consisting Ox - R5 0 - an (R6 on wherein R is an aliphatic or cycloali-phatic alkaline group containing From one to 9, preferably 2 to 6, carbon atoms; R6 is an alkaline group having from one to 7, prefer-ably 2 to 4, carbon atoms; n is an integer from 2 to 10, and m is on or 2, preferably one.

3L2~S~5 -lo-In the several formulae I-IV, the diva lent organic radicals R and R can have a compound structure, that is, the radical can contain at least one, or a series of at least two, unsubstituted or substituted hydrocarbon group(s) containing or separated from each other by -O-, -S-, -COO-, -NH-, -NHCOO-, and I Ox wherein R7 is an alkaline group containing from 2 to 7, preferably 2 to 4 carbon atoms, and p is an integer from 2 to lo Preferably, the diva lent radical is an alkaline radical having a straight chain or ring of from one to 22, preferably one to 9, carbon atoms in any non-repeating unit. It will be understood that diva lent radicals having a come pound structure would have two or more of such straight chains or rungs. The diva lent radicals can be saturated or unsaturated; elf-phatic, cycloaliphatic or aromatic; and, with compound structures, can include mixtures thereof; and generally have from l to about 22 carbon atoms In each chain or ring of carbon atoms.
In the several Formulae I-III, representative X-R- and X-R2-radicals include, without limitation thereto, lower al~enyl, cycle-hexenyl, hydroxy-lower alkenyl, halo-lo~er alkenyl, carboxy-lower alkenyl, lower alkyd, amino-lower alkyd, hydroxy-lower alkyd, Marquette-lower alkyd, alkoxy-lower alkyd, halo-lower alkyd, di-phosphonomethyl-amino-lower alkyd, phenyl-hydroxy-phosphonomethyl, aminophenyl-hydroxy-phosphonomethyl, halophenyl-hydroxy-phosphonomethyl, phenyl-amino-phosphonomethyl, halophenyl-amino-phosphonomethyl, hydroxy-phos-phonomethyl, lower alkyl-hydroxy-phosphonomethyl, halo-lower alkyd-hydroxy-phos-phonomethyl and amino-lower alkyl-hydrox~phosphono-methyl; the term "lower" referring to a group containing from l to 8, preferably l to 4 carbon atoms.
Phosphorous-containing compounds having vinyl unsaturation are preferred over such compounds having allylic unsaturation, with monstrous of phosphinic, phosphoric and phosphoric acids having one unit of vinyl or allylic, especially vinyl, unsaturation presently being preferred. Representative phosphorus-containing compounds include, without limitation, phosphoric acid; 2-methacryloyl oxyethyl phosphate; bis-(2-methacryloyloxYethyl) phosphate; 2-acryloyloxyethyl phosphate; bis-(2-acryloyloxyethyl) phosphate; methyl methacryl-oyloxyethyl~ phosphate; ethyl methacryloyloxyethyl phosphate; methyl ` J' acryloyloxyethyl phosphate; ethyl acryloyloxyethyl phosphate; compounds I

l I, of Formula IVY wherein R3 is hydrogen or methyl and R4 is propel, isobutyl, ethylhexyl 9 halopropyl, haloisobutyl or haloethylhexyl; vinyl phosphoric acid; cyclohexene-3-phosphonic acid; alphahydroxybutene-2-phosphoric acid; l-hydroxy-l-phenylmethane-l,l-diphosphonic acid, l-hydroxy-l-methyl~ diphosphonic acid; l-amino-l-phenyl-l,l-diphosphonic acid; 3-amino-l-hydroxypropane-l,l-diphosphonic acid;
amino-tris(methylenephosphonic acid); gamma-aminopropylphosphonic acid;
gamma-glycidoxypropylphosphonic acid; phosphoric acid-mono-2-aminoethyl ester; ally phosphoric acid; ally phosphinic acid; -methacryloy-loxyethyl phosphinic acid; diallylphosphinic acid; bus -methacryloy-loxyethyl) phosphinic acid and ally methacryloyloxyethyl phosphinic acid.
Regardless of whether incorporated into the polymerizable adhesive composition or bonding activator, infer the phosphorus-containing compound will be present in an amount in the range from about Owl to about 20, preferably about 2 to about lo weight percent, based on total weight of poly~erizable adhesive composition, including reducing agent.
The bonding activators which are employed in the adhesive I systems of this invention consist essentially of (l) from about 0.5 to about 30, preferably about l to about lo weight percent, based on total weight of bonding activator, of at least one oxidizing agent which can function as an oxidant of a redo couple catalyst system; and (2) from about 70 to about 99.5 weight percent, based on total weight of bonding accelerator, of carrier vehicle. In addition, the bonding accelerator also contains either the epoxy resin or the unsaturated organophosphorus compound, infer.
The room temperature-reactiYe redo couple catalyst systems which are employed in the adhesive systems of this invention are well-known and need not be discussed herein in detail. Basically, such systems comprise at least one oxidizing agent and at least one reducing gent which/are co-reactive at room temperature to generate free radix eels effective in the present invention, to initiate addition polyp merization reactions. Substantially any of the known oxidizing and reducing agents which are so co-reactive can be employed in the practice of the present invention. Representative oxidizing agents include, without limitation, organic peroxides such as bouncily peroxide and other dozily peroxides hydroperoxides such as cumin hydra-4Q peroxide, per esters such as -butylperoxybenzoate, kitten hydra-peroxides such as methyl ethyl kitten, organic salts of transition metals such as cobalt naphthenate, and compounds containing a labile chlorine such as sulfonyl chloride. Representative reducing agents include, without limitation, sulfinic acids, ago compounds such as azoisobutyric acid dinitrile; alpha-aminosulfones such as bis(tolyl-~ulfonmethyl) amine, bis-(tolylsulfonmethyl) ethyl amine and bus-(tolylsulfonmethyl)-benzyl amine; tertiary amine such as diisopropyl-p-Teledyne, dim ethyl aniline and dimethyl-p-toluidine; and amine-alluded condensation products, for example, the condensation products of aliphatic aldehydes such as butyraldehyde with primary amine such as aniline or butylamine. The use of known accelerators and promoters with the redo couple catalyst systems can be advantageous. Pro-fireball, the oxidizing agent will be present in an amount in the range from about 0.5 to about 30, preferably about one to about lo percent by weight of bonding accelerator, with the amount of reducing agent being in the range from about 0.05 to about lo preferably about Owl to about 6, percent by weight of polymerizable adhesive composition.
The carrier vehicles which are suitable for use in the bonding activators of the present invention can be a simple inert solvent or delineate such as ethylene chloride, or bottle bouncily phthalate, in-eluding mixtures of such solvents or delineates. The carrier vehicle should contain not more than 5% by weight of any moiety which is react live with the oxidizing agent at room temperature. The carrier vehicle can be a more complex mixture including at least one film-forming bin-don in addition to inert solvent or delineate. In this case, the film-forming binder is preferably substantially inert with respect to the oxidant which is present in the accelerator composition. A portico-laxly preferred carrier vehicle comprising at least one film-forming binder is an admixture comprising about 0.05 to about 50 percent by weight of, (lo, at least one saturated organic polymeric film-forming binder having a glass transition temperature in the range from about 0C to about 150 C or (2), at least one polymer-in-monomer syrup as described herein; and from about 40 to about 99 percent by weight of at least one organic solvent capable of maintaining the film-forming binder, phosphorus-containing compound when incorporated into the bond-in activator composition, and oxidizing agent as a stable solution or dispersion. Among the polymeric film forming binder materials which can be employed in the carrier vehicle are, without limitation polyp alkylacrylates and methacrylates and copolymers thereof, polystyrene and copolymers thereof, vinyl polymers and copolymers, polyesters, polyketones, polysulfones, finlike resins, polyvinyl betrayals, and polycarbonates. The carrier vehicle can contain, in addition to solverlt or solvent and film-forming binder, additives such as external plasticizers, flexibilizers, suspenders and stabilizer;, providing that any such additives do not unacceptably adversely affect the stability of the activator compositions.
lo Because the addition of phosphorus-containing compounds to polymerizable acrylic adhesive compositions can have a retarding effect which is directly proportional to the amount of such compounds, the addition of from 0.01 to lo preferably I to 5, prevent by weight of polymerizable materials of tertiary amine having the formula V. Y Z) N

yearn is ethylene; Y is selected from the group consisting of hydrogen, hydroxy, amino, halogen, alkyd of l to 8, preferably 1 to 4, carbon atoms, and alkoxy having from 1 to 8, preferably l to 4, carbon atoms; a is zero, or l; and b is 1 or 2 is advantageous in accelerating the cure of such compositions containing the unsaturated organophosphorus compounds. Especially preferred of such tertiary amine are N,N-dimethyl aniline and N,N-dimethylamino-methyl phenol. It is significant to note that tertiary amine which do not have the formula Y are not effective as cure accelerators for polymerizable acrylic adhesive compositions containing unsaturated organophosphorus compounds having the formulae IVY
It has further been found that the environmental resistance of the herein-described adhesive systems can be improved by the addition of from about 0.005 to about 15, preferably about 0.1 to about 10, percent by weight, based on total weight of polymerizable adhesive composition of a mixture of a metal mo1ybdate selected from the group consisting of zinc molybdate, calcium molybdate, barium molybdate, strontium molybdate and mixtures thereof, and a metal phosphate selected from the group consisting of zinc phosphate, calcium pros-plate, magnesium phosphate and mixtures thereof said metal molybdate I

being present on a volume concentration basis of from about 2 to about 3 parts per part of said metal phosphate. Such mixtures, including their preparation, are more fully described in Us Patent No.
~,017,315.
It has also been discovered that polybasic lead salts of phosphorus acid and saturated and unsaturated organic dicarboxylic acids and acid androids particularly dibasic lead phthalate, menders tribasic lead Malta, tetrabasic lead fumarate, dibasic lead phosphate and mixtures thereof; and zinc oxide, in an amount in lo the range from about 0.1 to about 15, preferably about 1 to about 10, percent by weight, based on total weight of polymerizable adhesive composition, are effective in improving environmental resistance.
Other additives conventionally employed in adhesive come positions, such as fillers, pigments and the live can be added to the I herein-described adhesive systems.
The base adhesive compositions and bonding accelerators are prepared by conventional methods, such as are disclosed, for example, in US. Patents No. 3,832,274 and No. 3,890,~07.
The adhesive systems of the present invention are provided as mulkipack adhesive systems where one part contains the polymerizable adhesive composition and a second part contains the bonding acceder-atop, with the two parts being mixed at the time of use. It is necessary that the epoxy compound be kept separate from compounds having acidic moieties, such as the unsaturated organophosphorus compound and methacrylic acid to inhibit premature reaction between these components. Thus, prior to using the compositions, one pack will contain the unsaturated organophosphorus partial ester and the other pack will contain the epoxy resin. Preferably, the epoxy resin will be incorporated into the bonding accelerator which contains the oxidant of 30~ the redo couple catalyst system, with the organophosphorus compound being incorporated into the pack containing the polymeri,~able adhesive composition. While other multi pack systems are available, e.g., the bonding accelerator can contain the reluctant of the redo couple catalyst system and the epoxy resin with the oxidant and polymerization inhibitors being incorporated into the pack containing the polymerize able adhesive mass, they are less preferable with respect to shelf stability. After mixing the individual parts, one or both surfaces to ::

~2~;8~

be joined are coated with the mixed adhesive system and the surfaces are placed in contact with each other. The adhesive systems of the invention may be used to bond metal surfaces, such as steel, aluminum and copper to a variety of substrates, including metal, plastics, and other polymers, reinforced plastics, fibers, glass, ceramics, wood and the like.
It is a particular feature of the present invention that the - herein-described adhesive compositions can be employed to bond metal substrates such as steel, aluminum and copper with little, if any, pro-treatment of the metal surface prior to application ox the adhesive.
Thus, bonding can be effected even to oily metal surfaces which are otherwise clean without an extensive pretreatment as is usually no-squired with the vast majority of currently available primers and ache-sizes. Additionally, the adhesive systems ox this invention provide effective bonding at room temperature, thus heat is not required either for applying the adhesive systems to the substrates or for curing.
They can also be employed on porous substrates, unlike the anaerobic adhesives which require the exclusion of air and thus cannot be used on surfaces containing air in their pores.
The invention is illustrated by the following examples, wherein all parts, proportions and percentages are by weight unless otherwise indicated.

Example I

An adhesive resin, hereinafter identified as AR-I, was prepared by reacting 1.0 mole of polycaprolactone trio having an average molecular weight of 54uO, 0.65 mole of polycaprolactone dill having an average molecular weight of 2000 and 4.3 moles of Tulane diisocyanate in the presence of a catalytic amount of dibutyltin dilaurate and methyl methacrylate delineate until all hydroxy groups had been reacted, yielding isocyanate-functional urethane prepolymer dissolved in methyl methacrylate delineate. To the reaction was added 4.3 moles of hydroxyethyl acrylate and the reaction continued until all isocyanate moieties had been reacted, yielding acrylated polyurethane resin AR-I at 65~ resin solids in methyl methacrylate (MA) monomer delineate.

I

,9 Example II

Adhesive systems were prepared in a conventional manner having the following compositions (amounts are in parts by weight):

Adhere elk II-A II-B

AR-I (En. I, 65% AR-I in MA) 20.6 23.8 Carboxylated poly(l,3-butadiene/
acrylonitrile) elastomers 38.3 45.6 Methylmethacrylate 5.7 7.4 Methacrylic acid 0.0 7.6 Diisopropyl-p-toluidine 1.0 1. 3 Dimethylaniline 1.6 1.8 Milled glass fibers 15.3 0.0 Calcium carbonate (3 vol.)/zinc phosphate (1 vol.) 3.7 4.3 Silica 3.8 5.0 Paraffin wax 0.3 0.0 2-Methacryloyloxyethyl phosphate (70% in MA) 5.2 4.2 Bouncily peroxide (40~ in dibutyl 4.0 4.0 phthalate) Bisphenol A epoxy resin Variable Ox a = the amount of epoxy resin varied from O POW to 40.5 POW
to provide II-A adhesive systems having equivalent of epoxy/equivalent of POX values - of 0, 1, 2, 3, 4 and 6.
The equivalent of epoxy/equivalent of POX value for adhesive system II-B is zero.

After blending the ingredients to obtain homogeneous compost-lions, the adhesive systems were used for steel-steel (annealed 1010 cold-rolled steel) metal bonding. The fully-mixed adhesives were coated onto one mating surface and a second uncoated mating surface was pressed onto the adhesive to complete the test assemblies. The total gluellne thickness was approximately 20 miss for each test assembly, ~29~5~5 The test pieces were cured at room temperature for 12 hours. Following the cure cycle, one third of the test assemblies were subjected to a two-step post bake heat treatment (30 min. @ 138C/30 min. @ 204C) and cooled to room temperature; and one-third of the test assemblies were conditioned for 30 minutes @ 204C and not cooled. Lap shear tests were performed at room temperature and at 204C on the cured assemblies according to the procedure of ASTM D-1002-72. The test results, in pounds/in (psi), are reported in Table II.

able II

Equip. Epoxy/ Lap Shear Strength (psi) Adhesive Equip POX Rub pB/RTc 2040cd .

b = test pieces, after cure cycle, evaluated at room temperature.

c = test pieces, after cure cycle, subjected to post bake cycle ~30 min. @ 138C/30 min. @ 204 C), cooled to room temperature, and evaluated at room temperature.

d = test pieces, after cure cycle, conditioned 30 min. @
~25 204C and evaluated at 204C.

The data clearly demonstrate the improvement on heat resist-ante and high temperature performance when the adhesive systems contain both epoxy resin and unsaturated organophosphorus partial ester and demonstrate also the effect of epoxy content epoxy: POX ratio) on adhesive performance.

, .

58~i Example III

Adhesive systems were prepared in a conventional manner by blending the following ingredients (amounts are in parts by weight:

Adhesive III-A III-B III-~

AR-I (En. I, 65~ in MA) 20.5 20.6 Carboxylated poly(lJ3-butadiene/acrylonitrile) rubber 38.3 38.3 Methylmethacrylate 5.7 So Trimethylolpropdne trimeth- .
acrylate 4.6 4.6 Diisopropyl-p-toluidine 1.0 1.0 Dimethylaniline 1.6 1.6 Milled glass fibers 15.3 15.3 lo Calcium carbonate (3 vol.)/zinc phosphate (1 vol.) 3.7 3.7 Silica 3.8 3~8 Paraffin wax 0.3 0-3 2-Methacryloyloxyethyl pros-plate (70g in methyl-methacrylate) 5.2 5.2 3.6 Bouncily peroxide (40X in dibutyl phthalate) 4.0 4.0 Bisphenol A epoxy resin, equip. wt. 185 0.0 2~.8 25.8 :
Equivalents, epoxy 0.0 0.13 0013 P-OH 0.034 0.034 0.034 The thus-prepared adhesive systems were used to bond annealed 1010 cold-rolled steel elements following the procedure of Example II, including preparation of test samples, adhesive cure cycle, heat treatment (if any) and testing of adhesive bond. The test results, in psi, are reported in Table I I I .

Table Ill Lap Shear Strength, psi Adhesive RUT PORT 204C

The data, which compare the performance of epoxy, epoxy/acrylic and acrylic adhesive systems containing unsaturated organophosphorus partial esters, are self-explanatory.

E mule IV

Adhesive systems were prepared in a conventional manner having the following compositions (amounts are in parts by weight):

Adhesive IV-A IY-B IV-C IV D IRE IV-F IV-G

AR-I (En. I, 65~ in MA) 20.6 20.6 20.6 20.6 20.6 20.6 20.6 Cdrboxylated poly(buta-diene/acrylonitrile) elastomers 38.3 38.3 38.3 38.3 38.3 38.3 38.3 Methylmethacrylate 5.7 5.7 5.7 5.7 5.7 5.7 5.7 Trimethylolpropane trimethacrylate 4.6 4.6 4~6 4.6 4~6 4.6 4.6 Diisopro~pyl-p-toluidine 1.0 1~0 1.0 1.0 1.0 1.0 1.0 Dimethylaniline 1.6 1.6 1.6 1.6 1.6 1.6 1.6 Milled glass fibers 15.3 15.3 15.3 15.3 15.3 15.3 15.3 Calcium carbonate (3 - vol.)/zinc pros-plate (1 vol.) 3.7 3.7 3.7 3.7 3.7 3.7 3.7 ~2~9~5~S

Example IV
(continued) Audis Ye IV-A IY-B IV-C IDEA IRE IFFY IV-G
Silica 3.8 3.8 3.8 3.8 3.8 3.8 3.8 Paraffin wax 0.3 0.3 0.3 0.3 0.3 0.3 0.3 2-Methacryloyloxy-ethyl phosphate ~70~ in lima 5.2 5.2 5.2 5.2 5.2 5.2 5.2 . Bouncily peroxide (40~
in dibutyl phthalate) 4.0 4.0 4.0 4.0 4.0 4.0 4.0 Bisphenol A epoxy Rosen 25.8 25.8 25.8 25.8 25.8 2-Methacryl oyloxyethyl phosphate (70~ in MOE) 0.0 lo 2.0 0.0 0.0 0.0 0.0 Phosphoric acid 0.0 0.0 0.0 lo 2.0 0.0 0.0 2-Hydroxyethyl moth-acrylate 0.0 0.0 0.0 0.0 0.0 Lowe 0.0 Methacrylic acid 0.0 0.0 0 0 0.0 0.0 0.0 3.0 The thus-prepared adhesives were mixed, applied, cured and tested following the procedure of Examples II and III, except that the metal was non annealed loo cold-rolled steel. The data are reported in Table IVY.
Table IV
:
Lap Shear Strength, psi Adhesive RUT PORT 204C

2 5 IV-A 3l40 4546 l64 IY-B 3606 4760 l40 ICKY 3500 4626 ll4 IFFY 4480 4772 l 24 IVY G Al Ox 4540 284 , The data are self-explanatory.

~2~S~5 Example Adhesive compositions were prepared in a conventional manner by blending the following ingredients (amounts are in parts by weight):

Adhesive V-A Yo-yo __ _ _ AR-I Rex. I, 65% AR-I in MA) 20.6 23.8 Carboxylated poly(l,3-butadiene/
acrylonitrile) elastomers 38.3 45.6 Methylmethacrylate 5.7 7.4 Me~hacrylic acid 0.0 7.6 Diisopropyl-p-toluidine 1.0 lo Dimethylaniline lo lo Milled glass fibers l5.3 0.0 Calcium carbonate (3 vol.)/zinc phosphate (l vol.) 3.7 4.3 Silica 3.8 5.0 Paraffin wax 0.3 0-0 2-Methacryloyloxyethyl phosphate (70% in MA) 5.2 4.2 Bouncily peroxide (40~ in dibutyl phthalate) 4.5 4.0 Bisphenol A epoxy resin, equip.
wt. ~50 Al 0.0 Bisphenol A epoxy resin, equip.
wt. lo 24.4 0.0 Calcium carbonate 24.5 0.0 Silica 0.6 0.0 The thus-prepared adhesives were used to bond non annealed cold rolled steel metal assemblies, following the application and cure procedures of Example II. Following the cure cycle, the bonded metal assemblies were conditioned at 204 C at variable times and tested at 204C following the procedure of ASTM D-1002-72. The test results are reported in Table Y.

I

/

Table Y

Exposure Time Lap Shear Strength (psi) at 204C, His. Adhesive Y-A Adhesive Y-B
_. ___ _ Ox 4530 5940 4 3380 1480 Dub

8 3920 1740 Dub 16 4880 540 Dub 24 4460 780 Dub 72 4360 980 Dub a = Initial test values made at room temperature.
b = Adhesive discolored and gassed.
The data are self-explanatory.
Example VI

Adhesive Y-A from Example 5 was used to bond the following metal assemblies: annealed cold-rolled steel; 6061 To aluminum; 302 stainless steel, and G-90 galvanized annealed cold-rolled steel. The test assemblies were prepared and cured according to the procedures of Example II. Following the cure cycle, the test assemblies were post-baked as follows:

a) heat 10 min. @ 163 C and cool to room temperature;
b) heat 23 min. @ 121 C and cool to room temperature;
; c) heat 45 min. @ 163 C and cool to room temperature;
d) heat 45 min. @ 135 C and cool to room temperature;
en heat 30 min. @ 121 C and cool to room temperature;
; f) heat 40 min. @ 121 C and cool to room temperature; and g) heat 45 min. @ 163C and cool to room temperature.

I

Following the post bake cycle, lap shear jests were performed fang the procedure of ASTM D-1002-72 at various temperatures. The results are reported in Table YIP

Table VI

Lap Shear Strength, psi Substrate 29C RUT 85C 204C
___ _ Annealed cold-rolled steel 933(CM) 3240(CM) 2293(CM) 271(C) 6061 To aluminum917(CM) 3440(CM) 2654~C) 234(C) 302 stainless steel 1550(CM) 4293(CM) 2280(C) 244(C) G-90 galvanized 1207(CM) 3160(CM) 2827(C) 263(C) steel CM = indicates failure at adhesive-metal interface.
C = indicates cohesive failure of the adhesive.

The data demonstrate the utility of the adhesives of this invention on a variety of metal substrates.

Example VII

The following two-part primer composition was prepared, amounts are in parts by weight.

Ingredient Part A Part B
Polyethylene polyp (phenol isocyanate) 16.0 Hexakismethoxy-mailmen amino resin - 1.0 Dibutyltin dilaurate - 0.15 Ethylene chloride 84.0 98.85 . I. .

I

The individual parts A and B of the primer composition were mixed and applied to polyester-based fiberglass reinforced plastic stock. The plastic stock was coated with an Owl mix wet film thickness of primer, which was allowed to dry for 30 minutes at ambient condo-lions of temperature and humidity. The primed plastic stock was bonded to, (l), annealed loo cold-rolled steel; (2), G-90 galvanized annealed cold-rolled steel; and, (3), identical plastic stock which had been identically primed; substrates which were coated with a 20 mix thick-news of adhesive Yo-yo from Example Y. All test assemblies were cured following the procedure of Example II. Subsequent to the cure cycle, the test assemblies were subjected to the post bake cycle of Example YIP
and tested according to the procedure of that Example. The results are reported in Table YIP.

Table VII

Lap Shear Strength, psi Substrate -29C RUT 85C 204C

Plastic/plastic 646/FT 730/FT 893/FT 56/66 Fat Plastic/lOlO steel 660/CM Lafayette 950/FT 48/33 Fat Plastic/galvanlzed 853/CM ~30/FT 810/FT 22 P

FIT Lowe fiber-tearing bond, failure of substrate.
CAM lo% failure at adhesive-metal interface.
.
P = Lowe failure at primer-plastic interface.
a - percent fiber-tearing bond, balance of failure is primer-plastic interface.
: :
The data demonstrate the utility of adhesive compositions prepared in accordance with the invention to bond plastic as well as metal material s.

:':

:

Example VIII

Adhesive compositions were prepared by blending the following ingredients (amounts are parts by weight) Adhesive VIII-A YIII-B VIII-C YIII-D
___ _ _ Carboxylated poly(l,3-butadiene/
acrylonitrile) elastomers (2570 in methyl methacrylate) 40.0 40.0 40.0 40.0 Styrene/1,3-butadiene elastomers (30~ in methyl methacrylate) 40.0 40.0 40~0 40.0 lo 2-Methacryloyl oxyekhyl phosphate (70~ in methyl methacrylate) 6.3 6.3 6.3 6.3 Methacrylic acid 3.0 3.0 3.0 3.0 Methyl methacrylate 4.0 3.5 3.0 2,5 Trimethylolpropane trimethacrylate 0.0 0.5 lo 1.5 lo Diisopropyl-p-toluidine 1.3 1.3 1.3 1.3 Dimethylaniline 1.5 1.5 1.5 1.5 Paraffin way 0.3 0.3 0.3 0.3 Silica 2.4 2.4 2.4 2.4 Bouncily peroxide (OWE in dibutyl phthalate) 4.5 4.5 4.5 4.5 Cycloaliphatic epoxy resin 30.0 30.0 30- 30-Calcium carbonate 24,0 24.0 24,0 24,0 Silica 1.5 1.5 1,5 1,5 The thus-prepared adhesives (it should be noted that the ingredients did not blend readily) were used to bond annealed cold-rolled steel, The test assemblies were prepared and cured according to the procedures of Example II. Subsequent to the cure cycle, the test assemblies were post baked for 30 minutes at 94C and 30 minutes at 204C. Lap shear tests were performed at 204C
following the procedure of ASSET D-1002-7~, The results are reported in Table VIII.

'"' :

r AL So , Table VIII
Adhesive Performance at Elevated Temperature Lap Shear Strength, psi Adhesive 204C

The data show effect of cross linking on adhesive performance.

E mule IX

Adhesive compositions were prepared by blending the following ingredients (amounts are in parts by weight):

Adhesive IX-A IX-B IX-C IX-D IX-E IX-F

Carboxylated poly(l,3-butadiene/
acrylonitrile) elastomers (25~
in methyl methacrylate) 35.0 35.0 35.0 35.0 30.0 30.0 Styrene/1,3-butadiene of as tower (30~ in methyl methacrylate) 25.0 25.0 30.0 30.0 30.0 30.0 2-Methacryloyloxyethyl phosphate (70~ in methyl methacrylate) 6.3 6.3 6.3 6.3 6.3 6.3 Methacrylic acid 3.0 3.0 3.0 3.0 3.0 3.0 Methyl methacrylate 23.5 23.5 18.5 18.5 23.5 23.5 Trimethylolpropane trimeth-acrylate 0.5 0.5 0.5 0.5 0.5 0.5 Diisopropyl-p-toluidine 1.3 1.3 1.3 1.3 1.3 1.3 Dimethyl;aniSine 1.5 1.5 1.5 1-5 1.5 1.5 Paraffin wax - 0.3 0.3 0.3 0.3 0.3 0.3 Silica 2.4 2.4 2.4 2.4 2.4 2.4 Cycloaliphatic epoxy resin 50.0 40.0 50.0 40.0 50.0 40.Q
CBTN modified bisphenol A
epoxy retina 0.0 10.0 0.0 Lou 0.0 10.0 ~2~d~5~35 Example IX
(continued) Adhesive IX-A IX-B IX-C IX-D IX-E IX-F
. _ _ , , Calcium carbonate 24.0 24.0 24.0 24.0 24~0 24.0 Silica 1.5 1.5 1.5 1.5 1.5 1.5 5 Bouncily peroxide (40~ in dibutyl phthalate) 4.5 4.5 4.5 4.5 4-5 4-5 a = carboxyl-terminated poly(l,3-butadiene/acrylonitrile) elastomer-modified bisphenol A epoxy resin.

The thus-prepared adhesives (it should be noted that the lo ingredients did not blend readily) were used to bond annealed cold-rolled steel. The test assemblies were prepared and cured according to the procedures of Example II. Subsequent to the cure cycle, the test assemblies were post baked for 30 minutes at 94C and 30 minutes at 204C. Lap shear tests were performed at 204C
following the procedure of ASTM D-1002-72. The results are reported in Table IX.

Table IX

Lap Shear Strength, psi Adhesive 204C

` IX-D 144 The data are sel~:-explana~ory.
,' : :
: :

:

I

Exempt e X

Adhesive compositions were prepared by blending the following ingredients (amounts are in parts by weight):

Adhesive X-A X-B X-C X-D X-E

Carboxylated poly(l,3-butadiene/
acrylonitrile) elastomers (25%
in MA) 35.0 35.0 35.0 35.0 35.0 Sternly 9 3-butadiene elastomers (30% in MA) 30.0 30.0 30.0 30.0 30.0 2-Methacryloyloxyethyl phosphate (70~ in MA) 6.3 6.3 6.3 6.3 6.3 Methacrylic act d 3 . 0 3. 0 3. 0 3.0 3.0 Methyl methacrylate 18.5 18.5 18.5 18.5 18.5 Trimethylolpropane trimethacrylate 0.5 0.5 0.5 0.5 0.5 Diisopropyl-p-~olui do no 1. 3 1 . 3 1.3 1.3 1.3 Dimethylaniline 1.5 1.5 1.5 1.5 1.5 Paraffin wax 0.3 0.3 0.3 0.3 0-3 Silica 2.4 2.4 2.4 2.4 2.4 Bouncily peroxide (40% in dibutyl phthalate) 2.4 2.4 2.4 2.4 2.4 Cycloaliphatic epoxy resin 60. 0 57.75 47.5 41.25 33.0 CBTN-modified bisphenol A epoxy retina 6.0 0.0 0.0 0.0 0.0 I: : CBT-modified cycle oaf i phi tic ;; 25 resin 0.0 8.25 16.5 24.75 33.0 : calcium carbonate 7.1 7.1 7.1 7.1 7.1 Silica 0.8 0.8 0.8 0.8 0.8 a - carboxyl-terminated poly(l,3-butadiene/acrylonitrile) : elastomer-modified bisphenol A epoxy resin.

b = carboxyl-terminated poly(l,3-butadiene) elastomer-modified cyclocarboxylic epoxy resin.

58~

The thus-prepared adhesives (it should be noted that the ingredients did not blend readily) were used to bond annealed cold-rolled steel. The test assemblies were prepared and cured according to the procedures of Example II. subsequent to the cure cycle the test assemblies were post baked following the procedure of Example VI. Impact test were made at -29C following the General Motors Torsion Impact Test procedures. The results are reported in Table X.

Table X

lo Impact Strength,.in-lbs Adhesive -29C
_ " .

X-A 39,4 X-B 44.7 X-C 48.6 X-D 76.6 X-E ~5,3 The data demonstrate the effect of employing elastomers modified epoxy resins on low temperature adhesive properties.

.
./

:

Claims

THE EMBODIMENTS OF THE INVENTION TO WHICH AN EXCLUSIVE PROPERTY OR PRIVILEGE
IS CLAIMED ARE DEFINED AS FOLLOWS:

1. An adhesive composition comprising A. at least one polymerizable polymeric material selected from the group consisting of:
(1) at least one olefinically unsaturated urethane reaction product of at least one isocyanate-functional prepolymer and at least one hydroxy-functional monomer having at least one unit of polymerizable olefinic unsaturation, said reaction product being characterized by the presence of at least two units of olefinic unsaturation and the substantial absence of free isocyanate groups;
(2) at least one butadiene-based elastomeric polymeric material selected from the group consisting of (a) homopolymer of butadiene;
(b) copolymer of butadiene and at least one monomer co-polymerizable therewith selected from the group consisting of styrene, acrylonitrile, methacrylonitrile and mixtures thereof;
(c) modified elastomeric material selected from the group consisting of butadiene homopolymer and copolymer as previously described, such homopolymer and copolymer having been modified by copolymerization therein of trace amounts up to 5 percent by weight, based on weight of modified elastomeric material, of at least one functional monomer selected from the group consisting of acrylic acid, methacrylic acid, maleic anhydride, fumaric acid and methyl methacrylate; and (d) mixtures thereof;
(3) at least one polymer-in-monomer syrup consisting essentially of (a) from 2 to 90 percent by weight of at least one polymerizable addition polymer;
(b) from 10 to 98 percent by weight of at least one polymerizable olefinically unsaturated monomeric compound having at least one - C = C - group; and (c) from 0 to 30 percent by weight of a polymer containing the group (CH2CC1 = CHCH2)n, wherein n is an integer;
wherein (a) and (b) are present as a partial polymerization product of (b) or of (b) in the presence of (c);

the mixture of (a) and (b), or of (a), (b) and (c), being a syrup of polymer dissolved or dispersed in unpolymerized monomer, in which syrup the amount of (a) derived from (b) is in the range from 2 to 90 percent by weight, based on the total weight of (a), (b) and (c);
(4) at least one polymerizable polymeric material selected from the group consisting of polyvinyl alkyl ether, styrene-acrylonitrile resin, unsaturated polyester resin and mixtures thereof, the alkyl moiety of said polyvinyl alkyl ether containing from one to 8 carbon atoms;
(5) at least one homopolymer or copolymer of at least one monomer selected from the group consisting of styrene and alkyl or hydroxy alkyl esters of acrylic or methacrylic acid, said ester having from one to 18 carbon atoms in the alkyl moiety; and (6) mixtures of such polymers;
B. at least one polymerizable material selected from the group consisting of styrene, acrylic or substituted acrylic monomer and mixtures thereof, the amount of such polymerizable monomer being in addition to any such monomer present in (A)(3);
C. at least one phosphorus-containing compound having at least one olefinically unsaturated group and at least one P-OH group;
D. at least one epoxy resin; and E. room temperature-active redox couple catalyst system.

2. An adhesive composition according to claim 1 containing up to 10 percent by weight, based on total weight of said adhesive composition of at least one tertiary amine having the formula wherein Z is methylene, Y is selected from the group consisting of hydrogen, hydroxy, amino, halogen, alkyl radical having from 1 to 8 carbon atoms, and alkoxy radical wherein the alkyl moiety has from 1 to 8 carbon atoms; a is zero or 1; and b is 1 or 2.

3. An adhesive composition according to claim 2 wherein said phosphorus-containing compound has the formula wherein R3 is selected from the group consisting of hydrogen, halogen, an alkyl group having from 1 to 8 carbon atoms, and CH2 = CH -; R4 is selected from the group consisting of hydrogen, an alkyl group having from 1 to 8 carbon atoms, and a haloalkyl group having from 1 to 8 carbon atoms; A is selected from the group consisting of -R50- and (R60)n, wherein R5 is an aliphatic or cycloaliphatic alkylene group containing from 1 to 9 carbon atoms, R6 is an alkylene group having from 1 to 7 carbon atoms, n is an integer from 2 to 10, and m is 1 or 2.

4. An adhesive composition according to claim 1 where-in said polymerizable polymeric material (A) is selected from the group consisting of (1) at least one butadiene-based elastomeric polymeric material selected from the group consisting of (a) homo-polymer of butadiene; (b) copolymer of butadiene and at least one monomer copolymerizable therewith selected from the group con-sisting of styrene, acrylonitrile, methacrylonitrile and mixtures thereof, (c) modified elastomeric material selected from the group consisting of butadiene homopolymer and copolymer as pre-viously described, such homopolymer and copolymer having been modified by copolymerization therein of trace amounts up to 5 percent by weight, based on weight of modified elastomeric material, of at least one functional monmer selected from having been modified by copolymerization therein of trace amounts up to 5 percent by weight, based on weight of modi-fied elastomeric material, of at least one functional mono-mer slelected from the group consisting of acrylic acid, methacrylic acid, maleic anhydride, fumaric acid and methyl methacrylate; and (d) mixtures thereof; and (2) an admixture of (i) at least one olefinically unsaturated urethane reac-tion product of at least one isocyanate-functional prepolymer ?d at least one hydroxy-functional monomer having at least one unit of polymerizable olefinic unsaturation, said reaction pro-duct being characterized by the presence of at least two units of olefinic unsaturation and the substantial absence of free isocy-anate groups; and (ii) at least one butadiene-based elastomeric polymeric material selected from the group consisting of (a) homo-polymer of butadiene; (b) copolymer of butadiene and at least one monomer copolymerizable therewith selected from the group con-sisting of styrene, acrylonitrile, methacrylonitrile and mixtures thereof; (c) modified elastomeric material selected from the group consisting of butadiene homopolymer and copolymer as pre-viously described, such homopolymer and copolymer having been modified by copolymerization therein of trace amounts up to 5 percent by weight, based on weight of modified elastomeric mater-ial, of at least one functional monomer selected from the group consisting of acrylic acid, methacrylic acid, maleic anhydride, fumaric acid and methyl methacrylate; and (d) mixtures thereof.

5. An adhesive composition according to claim 4 con-taining up to 10 percent by weight, based on total weight of said adhesive composition of at least one tertiary amine having the formula wherein Z is methylene, Y is selected from the group consisting of hydrogen, hydroxy, amino, halogen, alkyl radical having from 1 to 8 carbon atoms, and alkoxy radical wherein the alkyl moiety has from 1 to 8 carbon atoms; a is zero or 1; and b is 1 or 2.

6. An adhesive composition according to claim 5 where-in said phosphorus-containing compound has the formula wherein R3 is selected from the group consisting of hydrogen, halogen, and alkyl group having from 1 to 8 carbon atoms, and Ch2 = CH -;
R4 is selected from the group consisting of hydrogen, an alkyl group having from 1 to 8 carbon atoms; and a haloalkyl group having from 1 to 8 carbon atoms; A is selected from the group consisting of - R50 - and (R60)n, wherein R5 is an aliphatic or cycloaliphatic alkylene group containing from 1 to 9 carbon atoms, R6 is an alylene group having from 1 to 7 carbon atoms, n is an integer from 2 to 10, and m is 1 or 2.

7. A room temperature polymerizable adhesive composition comrpsing I. as a polymerizable adhesive composition, a mixture comprising A. at least one polymerizable polymeric material selected from the group consisting of 1. at least one olefinically unsaturated urethane reaction product of at leat one isocyanate-functional prepolymer and at least one hydroxy-functional monomer having at least one unit of polymerizable olefinic unsaturation, such reaction product being characterized by the presence of at least two units of olefinic unsaturation and the substantial absence of free isocyanate groups;
2. at least one butadiene-based elastomeric polymeric material selected from the group consisting of (a) homopolymer of butadiene;
(b) copolymer of butadiene and at least one monomer copolymerizable therewith selected from the group consisting of styrene, acrylonitrile, methacrylonitrile and mixtures thereof;
(c) modified elastomeric polymeric material selected from the group consisting of butadiene homopolymer and copolymer as previously defined, such homopolymer and copolymer having been modified by copolymerization therein of trace amounts up to 5 percent by weight, based on weight of modified elastomeric polymeric material, of at least one functional monomer selected from the group consisting of acrylic acid, methacrylic acid, maleic anhydride, fumaric acid and methyl methacrylate; and (d) mixtures thereof;
3. at least one polymer-in-monomer syrup consisting essenti-ally of (a) from 2 to 90 percent by weight of at least one polymerizable addition polymer;
(b) from 10 to 98 percent by weight of at least one polymerizable olefinically unsaturated monomeric compound having at least one - ? = ? - group; and (c) from 0 to 30 percent by weight of a polymer containing the group (CH2CC1 = CHCH2)n, wherein n is an integer wherein (a) and (b) are present as a partial polymerization product of (b) or of (b) in the presence of (c);
the mixture of (a) and (b) or of (a), (b) and (c) being a syrup of polymer dissolved or dispersed in monomer, in which syrup the amount of (a) derived from (b) is in the range from 2 to 90 percent by weight, based on the total weight of (a), (b) and (c);
4. at least one polymerizable polymeric material selected from the group consisting of polyvinyl alkyl ether, styrene-acrylonitrile resin, unsaturated polyester resin and mixtures thereof, the alkyl moiety of such ether containing from one to 8 carbon atoms;
5. at least one polymerizable homopolymer or copolymer of at least one monomer selected from the group consisting of styrene and alkyl or hydroxyalkyl esters of acrylic or methacrylic acid, said ester having from one to 18 carbon atoms in the alkyl moiety; and 6. mixtures of such polymers;
B. at least one polymerizable monomeric material selected from the group consisting of styrene, acrylic or substituted acrylic monomer, and mixtures thereof, the amount of such monomer being in addition to the amount of any such monomer in (A)(3);
C. at least one phosphorus-containing compound having at least one olefinically unsaturated group and at least one P-OH group;
D. at least one reducing agent of a roam temperature-active redox couple catalyst system; and II. a bonding accelerator comprising an admixture of at least one epoxy resin and at least one oxidizing agent of a room temperature-active redox couple catalyst system, said oxidizing agent being reac-tive in combination with the reducing agent of said catalyst system to produce free radicals effective to initiate polymerization of said polymerizable adhesive composition;

wherein the amount of such olefinically unsaturated urethane reaction product is in the range from 10 to 90 percent by weight, based on total weight of components A through D; the amount of such butadiene-based elastomeric polymeric material is in the range from 1 to 30 percent by weight, based on total weight of components A through D; the amount of such polymer-in-monomer syrup is in the range from 2 to 60 percent by weight, based on total weight of compounds A through D; the amount of said polyvinyl alkyl ether, styrene-acrylonitrile resin and unsaturated polyester resin is in the range from 5 to 75 percent by weight, based on total weight of components A
through D; the amount of said homopolymer or copolymer of at least one of styrene and esters of acrylic or substituted acrylic acids is in the range.
from 2 to 60 percent by weight, based on total weight of components A through D; the amount of such styrene and acrylic or substituted acrylic monomers is in the range from 10 to 90 percent by weight, based on total weight of components A through D; the amount of said phosphorus-containing compound is in the range from 0.1 to 20 percent by weight, based on total weight of components A through D; the epoxy resin is present in an amount of 1 to 5 epoxide equivalents per equivalent of P-OH; said reducing agent is present in an amount of 0.05 to 10 percent by weight, based on total weight of components A through D; and the amount of said oxidizing agent is in the range from 0.5 to 30 percent by weight, based on total weight of bonding accelerator.

8. An adhesive composition according to claim 7 wherein said poly-merizable adhesive composition I contains up to 10 percent by weight, based on total weight of I and II, of at least one tertiary amine having the formula wherein Z is methylene, Y is selected from the group consisting of hydrogen, hydroxy, amino, halogen, alkyl radical having from 1 to 8 carbon atoms, and alkoxy radical wherein the alkyl moiety has from 1 to 8 carbon atoms; a is zero or 1; and b is 1 or 2.

9. An adhesive composition according to claim 8 wherein said phosphorus-containing compound has the formula wherein R is selected from the group consisting of hydrogen, halogen, an alkyl group having from 1 to 8 carbon atoms, and CH2 = CH -;
R4 is selected from the group consisting of hydrogen, an alkyl group having from 1 to 8 carbon atoms, and a haloalkyl group having from 1 to 8 carbon atoms; A is selected from the group consisting of - R50 - and (R60)n, wherein R5 is an aliphatic or cycloaliphatic alkylene group containing from 1 to 9 carbon atoms, R6 is an alkylene group having from 1 to 7 carbon atoms, n is an integer from 2 to 10, and m is 1 or 2.

10. An adhesive composition according to claim 7 wherein said polymerizable polymeric material I.A is selected from the group consisting of (1) at least one butadiene-based elastomeric polymeric material selected from the group consisting of (a) homopolymer of butadiene;
(b) copolymer of butadiene and at least one monomer copoly-merizable therewith selected from the group consisting of styrene, acrylonitrile, methacrylonitrile and mixtures thereof;
(c) modified elastomeric material selected from the group consisting of butadiene homopolymer and copolymer as previously described, such homopolymer and copolymer having been modified by copolymerization therein of trace amounts up to 5 percent by weight, based on weight of modified elastomeric material, of at least one functional monomer selected from the group consisting of acrylic acid, methacrylic acid, maleic anhydride, fumaric acid and methyl methacrylate, and (d) mixtures thereof; and (2) an admixture of (i) at least one olefinically unsaturated urethane reaction product of at least one isocyanate-functional prepolymer and at least one hydroxy-functional monomer having at least one unit of polymerizable olefinic unsaturation, such reaction product being characterized by the presence of at least two units of olefinic unsaturation and the substantial absence of free isocyanate groups; and (ii) at leat one butadiene-based elastomeric polymeric material selected from the group consisting of (a) homopolymer of butadiene;
(b) copolymer of butadiene and at least one monomer copolymerizable therewith selected from the group consisting of styrene, acrylonitrile, methacrylonitrile and mixtures thereof, (c) modified elastomeric polymeric material selected from the group consisting of butadiene homopolymer and copolymer as previously defined, such homopolymer and copolymer having been modified by copolymerization therein of trace amounts up to 5 percent by weight, based on weight of modified elastomeric polymeric material, of at least one functional monomer; and (d) mixtures thereof.

11. An adhesive composition according to claim 10 wherein said polymerizable composition I contains up to 10 percent by weight, based on total weight of I and II of at least one tertiary amine having the formula wherein Z is methylene, Y is selected from the group consisting of hydrogen, hydroxy, amino, halogen, alkyl radical having from 1 to 8 carbon atoms, and alkoxy radical wherein the alkyl moiety has from 1 to 8 carbon atoms; a is zero or 1; and b is 1 or 2.

12. An adhesive composition according to claim 11 wherein said phosphorus-containing compound has the formula wherein R3 is selected from the group consisting of hydrogen, halogen, an alkyl group having from 1 to 8 carbon atoms, and CH2 = CH -; R4 is selected from the group consisting of hydrogen, an alkyl group having from 1 to 8 carbon atoms, and a haloalkyl group having from 1 to 8 carbon atoms; A is selected from the group consist-ing of - R5O - and (R6O)n, wherein R5 is an aliphatic or cyclo-aliphatic alkylene group containig from 1 to 9 carbon atoms; R6 is an alkylene group having from 1 to 7 carbon atoms, n is an integer from 2 to 10, and m is 1 or 2.

13. A room temperature-curable adhesive system comprising I. as a polymerizable adhesive composition, a mixture comprising A. at least one polymerizable polymeric material selected from the group consisting of 1. at least one olefinically unsaturated urethane reaction product of at least one isocyanate-functional prepolymer and at least one hydroxy-functional monomer having at least one unit of polymerizable olefinic unsaturation, such reaction product being characterized by the presence of at least two units of olefinic unsaturation and the substantial absence of free isocyanate groups;
2. at least one butadiene-based elastomeric polymeric material selected from the group consisting of (a) homopolymer of butadiene;
(b) copolymer of butadiene and at least one monomer copolymerizable therewith selected from the group consisting of styrene, acrylonitrile, methacrylonitrile and mixtures thereof;
(c) modified elastomeric polymeric material selected from the group consisting of butadiene homopolymer and copolymer as previously defined, such homopolymer and copolymer having been modified by copolymerization therein of trace amounts up to 5 percent by weight, based on weight of modified elastomeric polymeric material, of at least one functional monomer selected from the group consisting of acrylic acid, methacrylic acid, maleic anhydride, fumaric acid and methyl methacrylate; and (d) mixtures thereof;
3. at least one poymer-in-monomer syrup consisting essentially of (a) from 2 to 90 percent by weight of at least one polymerizable addition polymer;
(b) from 10 to 98 percent by weight of at least one polymerizable olefinically unsaturated monomeric compound having at least one - C = C - group; and (c) from 0 to 30 percent by weight of a polymer containing the group (CH2CC1 = CHCH2)n, wherein n is an integer wherein (a) and (b) are present as a partial polymerization produce of (b) or of (b) in the presence of (c); the mixture of (a) and (b) or of (a), (b) and (c) being a syrup of polymer dissolved or dispersed in monomer, in which syrup the amount of (a) derived from (b) is in the range from 2 to 90 percent by weight, based on the total weight of (a), (b) and (c);
4. at least one polymerizable polymeric material selected from the group consisting of polyvinyl alkyl ether, styreneacrylonitrile resin, un-saturated polyester resin and mixtures thereof, the alkyl moiety of such ether containing from one to 8 carbon atoms;
5. at least one polymerizable homopolymer or copolymer of at least one monomer selected from the group consisting of styrene and alkyl or hydroxyalkyl esters of acrylic or metharylic acid, said ester having from one to 18 carbon atoms in the alkyl moiety; and 6. mixtures of such polymers;
B. at least one polymerizable monomeric material selected from the group consisting of styrene, acrylic or substituted acrylic monomer, and mixtures thereof, the amount of such monomer being in addition to the amount of any such monomer in (A) (3);
C. at least one epoxy compound;
D. at least one reducing agent of a room temperature-active redox couple catalyst system; and II. a bonding accelerator comprising an admixture of at least one phosphorus-containing compound having at least one olefinically unsaturated group and at least one P-OH group and at least one oxidizing agent of a room temperature-active redox couple catalyst system, said oxidizing agent being reactive in combination with the reducing agent of said catalyst system to produce free radicals effective to initiate polymerization of said polymerizable adhesive composition;
wherein the amount of such olefinically unsaturated urethane reaction product is in the range from 10 to 90 percent by weight, based on total weight of components A, B and D; the amount of such butadiene-based elastomeric polymeric material is in the range from 1 to 30 percent by weight, based on total weight of components A, B and D; the amount of such polymer-in-monomer syrup is in the range from 2 to 60 percent by weight, based on total weight of components A, B and D; the amount of said polyvinyl alkyl ether, styrene-acrylonitrile resin and unsaturated polyester resin is in the range from 5 to 75 percent by weight, based on total weight of components A, B
and D; the amount of said homopolymer or copolymer of at least one of styrene and esters of acrylic or substituted acrylic acids is in the range from 2 to 60 percent by weight, based on total weight of components A, B and D; the amount of such styrene and acrylic or substituted acrylic monomers is in the range from 10 to 90 percent by weight, based on total weight of components A, B and D; the amount of said phosphorus-containing compound is in the range from 0.1 to 20 percent by weight, based on total weight of components A, B and D; the epoxy resin is present in an amount of 1 to 5 epoxide equivalents per equivalent of P-OH; said reducing agent is present in an amount of 0.05 to 10 percent by weight, based on total weight of components A and B; and the amount of said oxidizing agent is in the range from 0.5 to 30 percent by weight, based on total weight of bonding accelerator.

14. An adhesive composition according to claim 13 wherein said phosphorus-containing compound has the formula wherein R3 is selected from the group consisting of hydrogen, halogen, an alkyl group having from 1 to 8 carbon atoms, and CH2 = CH -;
R4 is selected from the group consisting of hydrogen, an alkyl group having from 1 to 8 carbon atoms, and a haloalkyl group having from 1 to 8 carbon atoms; A is selected from the group consisting of - R50 - and (R60)n, wherein R5 is an aliphatic or cycloaliphatic alkylene group containing from 1 to 9 carbon atoms, R6 is an alkylene group having from 1 to 7 carbon atoms, n is an integer from 2 to 10, and m is 1 or 2.

15. An adhesive composition according to claim 13 wherein said polymerizable polymeric material I.A is selected from the group consisting of (1) at lest one butadiene-based elastomeric polymeric material selected from the group consisting of (a) homopolymer of butadiene;
(b) copolymer of butadiene and at least one monomer copolymerizable therewith selected from the group consisting of styrene, acrylonitrile, methacrylonitrile and mixtures thereof;
(c) modified elastomeric material selected from the group consisting of butadiene homopolymer and copoymer as previously described, such homopolymer and copolymer having been modified by copolymerization therein of trace amounts up to 5 percent by weight, based on weight of modified elastomeric material, of at least one functional monomer selected from the group consisting of acrylic acid, methacrylic acid, maleic anhydride, fumaric acid and methyl methacrylate; and (d) mixtures; thereof; and (2) an admixture of (i) at least one olefinically unsaturated urethane reaction product of at least one isocyanate-functional prepolymer and at least one hydroxy-functional monomer having at lest one unit of polymerizable olefinic unsaturation, such reaction product being characterized by the presence of at least two units of olefinic unsaturation and the substantial absence of free isocyanate groups; and (ii) at least one butadiene-based elastomeric polymeric material selected from the group consisting of (a) homopolymer of butadiene;
(b) copolymer of butadiene and at least one monomer copolymerizable therewith selected from the group consisting of styrene, acrylonitrile, methacrylonitrile and mixtures thereof;
(c) modified elastomeric material selected from the group consisting of butadiene homopolymer and copolymer as previously described, such homopolymer and copolymer having been modified by copolymerization therein of trace amounts up to 5 percent by weight, based on weight of modified elastomeric material, of at least one functional monomer selected from the group consisting of acrylic acid, methacrylic acid, maleic anhydride, fumaric acid and methyl methacrylate; and (d) mixtures thereof.

16. An adhesive system according to claim 15 wherein said phosphorus-containing compound has the formula wherein R3 is selected from the group consisting of hydrogen, halogen, an alkyl group having from 1 to 8 carbon atoms, and CH2 = CH -;
R4 is selected from the group consisting of hydrogen, an alkyl group having from 1 to 8 carbon atoms, and a haloalkyl group having from 1 to 8 carbon atoms; A is selected from the group consisting of - R50 - and (R60)n, wherein R5 is an aliphatic or cycloaliphatic alkylene group containing from 1 to 9 carbon atoms, R6 is an alkylene group having from 1 to 7 carbon atoms, n is an integer from 2 to 10, and m is 1 or 2.