CA1274939A - High-temperature adhesive of polyimide - Google Patents
High-temperature adhesive of polyimideInfo
- Publication number
- CA1274939A CA1274939A CA000530420A CA530420A CA1274939A CA 1274939 A CA1274939 A CA 1274939A CA 000530420 A CA000530420 A CA 000530420A CA 530420 A CA530420 A CA 530420A CA 1274939 A CA1274939 A CA 1274939A
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- dianhydride
- radical
- polyimide
- bis
- formula
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-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
- C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
HIGH-TEMPERATURE ADHESIVE OF POLYIMIDE
ABSTRACT
This invention discloses high-temperature adhesives having a good light-transmittance and excellent high-temperature flowability which comprises polyimide having recurring units represented by the following formula (I) (I) (where R is a tetra-valent radical selected form the group consisting of aliphatic radical having not less than two carbons, cyclo aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function).
The polyimide is obtained by preparing polyamic acid through the reaction of 2,2-bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3,-hexafluoropropane as a diamine component with tetracarboxylic dianhydride such as pyromellitic dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, bis(3,4-dicarboxyphenyl) ether dianhydride and 3,3'4,4'-benzophenonetetracarboxylic dianhydride, and further conducting the ring-closing reaction of resultant polyamic acid by dehydration.
ABSTRACT
This invention discloses high-temperature adhesives having a good light-transmittance and excellent high-temperature flowability which comprises polyimide having recurring units represented by the following formula (I) (I) (where R is a tetra-valent radical selected form the group consisting of aliphatic radical having not less than two carbons, cyclo aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function).
The polyimide is obtained by preparing polyamic acid through the reaction of 2,2-bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3,-hexafluoropropane as a diamine component with tetracarboxylic dianhydride such as pyromellitic dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, bis(3,4-dicarboxyphenyl) ether dianhydride and 3,3'4,4'-benzophenonetetracarboxylic dianhydride, and further conducting the ring-closing reaction of resultant polyamic acid by dehydration.
Description
L~3~9 BACKGROUND OF T}l~ INV~NTION
This invention relates to high-temperatule adhesives and particularly to adhesives having excellent adheslve strength and high-temperature stability.
P~ly~
-~e~ obtained by the reaction of tetracarboxylic dianhydride with diamine have known up to this time to have various outstanding properties and good high-temperature stability.
Therefore polyimide is expected to develop a wide application in those fields which require stability at high temperatures.
A varlety of polyimide has recently been developed and found a use also as adhesives. For example, in TOKKAlSHO 58-157190 polyl~ idæ
(1983), -~olymid~ derived from various diamines and tetracarboxylic dianhydrides is disclosed to have application to adhesive between a polyimide film and a copper foil in a flexible copper-clad circuit substrate.
Although polyimide adheslve is excellent in the high-temperature stability and adhesive strength, it is further required to be good in high-temperature flowability and easy to process at the time of adhesion.
Since traditional polyimide is generally poor in the l:lght-transmi.ttance and, itl add:Ltion, has a tinge oE brown, it has been unsatisfactory for use as the adhesives having a good transparency.
This invention relates to high-temperatule adhesives and particularly to adhesives having excellent adheslve strength and high-temperature stability.
P~ly~
-~e~ obtained by the reaction of tetracarboxylic dianhydride with diamine have known up to this time to have various outstanding properties and good high-temperature stability.
Therefore polyimide is expected to develop a wide application in those fields which require stability at high temperatures.
A varlety of polyimide has recently been developed and found a use also as adhesives. For example, in TOKKAlSHO 58-157190 polyl~ idæ
(1983), -~olymid~ derived from various diamines and tetracarboxylic dianhydrides is disclosed to have application to adhesive between a polyimide film and a copper foil in a flexible copper-clad circuit substrate.
Although polyimide adheslve is excellent in the high-temperature stability and adhesive strength, it is further required to be good in high-temperature flowability and easy to process at the time of adhesion.
Since traditional polyimide is generally poor in the l:lght-transmi.ttance and, itl add:Ltion, has a tinge oE brown, it has been unsatisfactory for use as the adhesives having a good transparency.
(2)
3~
Therefore the object of thls invention is to prov:Lde a novel polyimide adhesive having the high llght-transmittance, good transparency9 outstanding high-temperature flowability and excellent processability in addition to the ability of keeping adhesive strength during and after use at high temperatures.
SUMMARY OF THE INVENTION
The inventors have investigated earnestly to achieve the above-mentioned object and completed the present invention.
~ ~ aspec~
That is, one~of the present lnvention is a high-temperature adhesive which comprises polyimide having recurring units of the formula (I):
O O
_ ~ o ~ I ~O ~ N/ ~ N ( I ) (where ~ is a tetra-valent rad:lcal 9elected :from the group consist:lng of aliphat:lc radical havl.ng not less than two carbons, cyclo-aliphatic rad:Lcal, monoaromatic rndical, condensed polyaromatlc radlcal, and non condensed polyaromatic radical whereln aromatic radicals are mutually connected with a bond or a crossl:lnking as~ec~ ~-f~-~h~
~ nd another~ invention is a method for adheslon whlch comprises applying poly:Lmide having recurring units of the formula (I) (3) g o o _ - ~ O ~ C ~ O ~ N\ R/\ ~N- (I) (where R is the same as above) on a substrate, overlapping the applied surface of the substrate with the surface of another substrate and heating under pressure above the glass transition temperature of said polyimide.
BRIEF DESCRIPTION OF THE DP~WING
Figure 1 illustrates an IR absorption spectrum atlas on an example of polyimide for use in the practice of this invention.
Polyimlde of the present invention has the above-descrlbed formula(I) and is prepared by the follow:Lng method.
That is, 2,2-bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, an ether diamine having the Eormula (II):
(~) ~3~
~ C- ~ 0 ~ (II) is reacted as a diamine component with one or more of tetracarboxylic dianhydride and resultant polyamic acid having recurring units oE the following formula (III):
0 ~ C ~ 0 ~ NH-C C-NH
0 0 (III) (where R is the same as above) is further conducted the ring-closing reaction by dehydration to give ployimide.
Polyimide of this invention has an improvement in using 2,2-bis[~-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane as the diamine component. It has been quite unknown to use polyimide for the adhesives which is derived from the ether-diamine having ether-linkages and aromatic am:lno radicals in the same mo:Lecule as described above.
In the afore-said TOICK~IS~I0 58-157190(1983), it is disclosed that polyimide prepared Erom 2,2-bis~4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane and pyromellltic dianhydride may be used as adhesives. Polyimide derived Erom this diamine, however, has a high glass transition temperature of above 300C. Therefore, the adhesives prepared from this polyimide are very poor in (5) ~3~
processability, ancl hence cause many troubles and defects in bond:Lng operations and propert:les of bonded artlcles, Besides in TOKK~ISHO 59-76451(1984), polyimide is disclosed which is deri.ved from diamine having the above formula (II) and pyromellitic dianhydride. This literature, however, describes no suggestion at all concerning the use of said polyimide for adhesives, Polyimide of this invention can afford adhesives having excellent transparency, good flowability at high temperatures and outstanding processabitliy in ~ddition to substantial characteristics of high-temperature stability.
Polyimide used in the present invention can be normally prepared by reacting 2,2-bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane with tetracarboxylic dianhydride in organic solvents.
Tetracarboxylic dianhydride for use in the method of this invention has the formula(IV):
O O
Il 11 O\ R/ /0 Il 11 (IV) (where R is a tetra-valent radical selected from the group consisting of aliphatic radical hav:Lng not less than two carbons, cycloaliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromfltic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function).
Tetracarboxyl:lc dianhydride used in the method includes, for (6) example~ ethylene tetracarboxyli.c dianhydride, cyclopentane tetracarboxylic dianhydride, pyromellitic dianhydride, 3,3',4,4'~
benæophenone tetracarboxylic dianhydride, 2,2',3,3'-benzophenone-tetracarboxylic di.anhydride, 3~3',4,4'-bipilenyltetracarboxylic dianhydride, 2,2',3,3'-biphenyltetracarboxylic dianhydride, 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride, 2,2-bis(2,3-dicarboxyphenyl)propane dianhydride, bis(3,4-dicarboxyphenyl) ether dianhydride, bis(3,4-dicarboxyphenyl) sulfone dianhydride, 1,1-bis-(2,3-dicarboxyphenyl)ethane dianhydride, bis(2,3-dicarboxyphenyl)methane dianhydride, bis(3,4-dicarboxyphenyl)methane dianhydride, 2,3,6,7-naphthalenetetracarboxylic dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, 1,2,5,6-naphthalene-tetracarboxylic dianhydride, 1,2,3,4-benzenetetracarboxylic dianhydride, 3,4,9,10-perylenetetracarboxylic dianhydride, 2,3,6,7-anthracenetetracarboxylic dianhydride and 1,2,7,8-phenanthrenetetracarboxylic dianhydride, Tetracarboxylic di.anhydride can be used alone or in mixtures of two or more.
Preferred in particular among these dianhydrides are pyromellitic dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride and bis(3,4-dicarboxyphenyl~ ether d:Lanhydride.
Polyimide obtained Erom these dianhydrides has extraordinarily excellent transparency and good high-temperature flowability.
3,3'4,4'-ben~ophenoneteracarboxylic dlanhydride :Ls also a preferable dianhydride which can produce polyimide having prominent flowability in high temperatures.
The organic solvents used in the reaction lnclude, Eor example, N,N-dimethylformamide, N,N-dimethylacetamide, (7) ~2~
N,N-diethylacetamide, N,N-dimethylmethoxyacetamide, N-methyl-2-pyrrolldone, 1,3--dimethyl-2-imidazolidlnone, N-methylcaprolactam, 1,2~dimethoxyethane, bis(2-methoxyethyl) ether, 1,2-bis(2-methoxyethoxy)ethane, bis[2-(2-methoxyethoxy)ethyl] ether, tetrahydrofuran, 1,3-dioxane, 1,4-dioxane, pyridine, picoline, dimethylsulfoxide, dimethyl sulfone, tetramethylurea, hexamethylphosphoramide~ m-creaol, p-chlorophenol and anisole.
These solvents can be used alone or in mixtures of two or more.
The reaction temperature is normaliy 200C or less, preferably 50C or less. The reaction pressure is not restricted in particular and atmospheric pressure is sufficient for carrying out the reaction. The reaction time depends upon the type of solvents, reaction temperature, and tetracarboxylic dianhydrides, and is normally enough to complete the formation of polyamic acid.
Reaction for 4 to 24 hours is normally sufficient.
Such reaction affords polyamic acid having recurring units of the following formula (I):
_ ~ ~ I ~ ~ /R\ _ 0 (III) (where R is the same as above).
In the next step, thermal dehydratlon oE the polyamic acid solution at 100 to 300C or chemical dehydratlon by treatlng with imidizing agent such as acetic anhydride afford the corresponding polyimide having recurr:Lng units of the formula (I):
(8) ~3~3 o o _ ~ -0 ~ C ~ 0 ~ N\ ~/ /N - (I) The method of applying the polymide of this invention Eor adhesive is roughly divided into two procedures.
(1) The polyamic acid precursor dissolved in organic solvent is used as adhesive solution, and imidized before adhesion.
(2) The ployimide is used in the form as it is.
In the procedure (1), the adhesive solution is an organic solvents solution of polyamic acid. It may be the resultant reaction mixture of polyamic acid obtained by reacting 2,2-bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane with tetracarboxylic dianhydride in the organic solvents. It also may be the solution contaning polyamic acid as the main component and polyimide which is a cyclized product of polyamic acid. Thus the adhesive solution containing polyamic acid may be the solution or suspension containing polyimide as an auxiliary ingredient.
When applying the solutlon conta:lning such polyamic acid, a thin layer of polyamic acid solution ls formed on the substrate to be bonded, Eollowed by preheating the coated substrate ln air for a desired period at 130 to 350C preferably about 220C. Excess solvents are remove.d and the polyamic acid is converted to polyimide on the substrate. The coated substrate is overlapped with another substrate and then strongly bonded by pressing under pressure of 1 -(9) g 1,000 kg/cm2 at temperature of 50 - 400C, followed by curing at temperature of 100 - 400C.
In the procedure (2), above described polyimide is a film previously prepared by thermal dehydration or chemical dehydration with a dehydrating agent such as acetic anhydride. The polyimide is also the powder substantially consisting of polyimide as it is.
In these cases, some of said polyamic acid may be contained in said polyimide.
To apply the polyimide films or the powder for adhesion, these are inserted between the substrates and pressed under pressure of 1 - 1,000 kg/cm2 at temperature of 50 - 400C. The adherends can be strongly bonded by curing at temperature of 100 - 400C.
EXAMPLES
The present inventi.on will be illustrated with respect to following Synthetic example, Examples and Comparative example.
Synthetic example 2,2-Bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoro-propane for use in this inventlon was prepared by the ~ollowing process.
~ 200 ml glass reaction vessel was charged with 20 grams (0.059 mol) of 2,2-bis(4-hydroxyphenyl)-1,1,l,3,3,3-hexafluoro-propane, 24 grams (0.14 mol) of m-dlnitrobenzene, 19.4 grams of (10) ~%~ ~33~
potassium carbonate and lO0 ml of N, N-dimethy]formam:Lde. The mixture was reacted for 7 hours at 1~0 to 150C. ~fter endlng the reactlon, the resultant reaction mixture was cooled and poured into 1000 ml of water. Crude 2,2-bis~4-(3-nitrophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane was separated as tarry material. The tarry material was dissolved in benzene and washed with water. The benzene layer was dried with magnesium sulEate and column-chromatographed over silica gel. Purified 2,2-bis[4-(3-nitrophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane obtained as yellow oil was 28.3 grams (83% yield).
In the next step, a 300 ml glass reaction vessel was charged with 20 grams (0.035 mol) of 2,2-bis[4-(3-nitrophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropane, 2 grams of active carbon, 0.2 gram of ferric chloride hexahydrate and 100 ml of isopropyl alcohol. The mixture was stirred under reflux for 30 minutes and then 7 grams (0.14 mol) of hydrazine hydrate was added dropwise over 2 hours at 60 to 70C, tollowed by further stirring for 5 hours under reflux, The resultant reaction mixture was cooled, filtered to remove the catalyst and 60 ml oE isopropyl alcohol was distilled off from the filtrate. The residue was added with 80 grams of 17.5%
hydrochloric ac:Ld, followed by further adding 10 grams oE sodium chlorlde and cooled to 20 to 25C wlth stirrlng. The precipitated crystals were fi:Ltered, recrysta]lized again by using 40 ml oE
isopropyl alcohol and 80 grams oE 17.5% hydrochloric acid. The filtered crystals were dissolved in 50% isopropyl alcohol and neutralized with aqueous ammonia.
(11) ~`~D
The separated crystals were filtered, washed wlth water, dried and recrystallized from a solvent mlxture oE benzene and n-hexane. 2,2-Bis[~-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane thus obta~ned was 13,6 grams (75% yield) and was colorless crystals having a melting point of 137 to 139C and purity of 99.2% according to high speed liquld chromatography.
Elementary analysis (C27 H20 N2 F602) -C H N F
Calculated (%) 62.55 3.86 5.41 22.00 Found (%) 69.86 5.20 5.20 21.95 .
~R(KBr, cm ): 3480 and 3380 (amino group) 12~0 (ether linkage) Example 1 ~ reaction vessel equipped wlth a stirrer, reElux condenser and nitrogen inlet tube was charged with 10.36 grams (0.02 mol) oE
2,2-bis[4(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane and 44.16 grams of N,N-dimethylacetmide, and added with 4.273 grams (0,0196 mol) oE pyromellitic dianhydride in portions at room temperature under nitrogen atmosphere with care not to raise the solution temperature above 30C. The reaction mixture was further stirred for 20 hours at room temperature.
Polyamic acid thus obtained had an inherent viscosity of (12) ~2~
0.55 dl/g at 35~C in 0.5% ~,N-climethylacetamide solutlon.
~ fter diluting the polyamic acid solution by z.dding 88.3 grams of N,N-dimethylacetamide and stirring for 30 minutes, 8.08 grams (0.08 mol) of triethylamine and 12.24 grams (0.12 mol) of acetic anhydride were dropwise added and stirring was further continued at room temperature under nitrogen atmosphere.
Light yellow polyimide powder was started to precipitate at about 7 hours aEter the addition, and the stirring was further continued for 20 hours.
The separated polyimide powder was Eiltered, washed with methanol, and dried at 180C for 24 hours under reducsd pressure, The polyimide powder thus obtained was 13.68 grams (97%
yield) and had crystallinity of 28.2% according to X-ray analysis.
Figure 1 illustrates the IR absorption spectrum atlas of polyimide thus obtained. In the spectrum atlas, remarkable absorption is found at 1780cm and 1720cm 1 which are charactereistic absorption bands of imide ring and 12~0cm 1 which is characteristic absorption band of ether linkage.
The powder had a glass transitlon temperature of 231C, melting poLnt of 387C in accordance with DSC method and 5% weight decrease temperature in air of 528C ln accordance with DTA-TG.
The polyimide powder obtained by the practice of thls example had a melt viscoslty of 9.9~;103 poises at ~20C measured wi~h a Japan High Polymer Society type flow tester (CFT-500, from Shimadzu Seisakusho) by use of an orlfice having a diameter of O.lcm under 300 kg load. The strand obtained was light brown, transparent and had a high flexibility.
(13) ~2~
The polyimide powder was inserted between co:Ld rolled steel panels (JlS 3141, spec/SD, 25 x 100 x 1.6mm) which were preheated at 130C and pressed for fiva mLnutes at 340C with pressure oE 20 kg/cm .
The bonded specimen had a lap shear strength of 285 kg/cm at room temperature and 195 kg/cm at 200C in accordance with JIS
K-6848 and K-6850.
Example 2 A reaction vessel equipped with a stirrer, reflux condenser and nitrogen inlet tube was charged with 5.18 grams (0.01 mol) of 2,2-bis[4-(3-aminophenoxy)phenyll-1,1,1,3,3,3-hexafluoropropane and 22.1 grams of N,N-dimethylacetamide, and added with 2.18 grams (0.01 mol) of pyromellitic dianhydride in portions at room temperature under nitrogen atmosphere with care not to raise the solution temperature above 30C. The reaction mixture was further stirred for 20 hours at room temperature.
Polyamic acid thus obtained had an inherent viscosity of 2.1 dl/g.
The polyamic acid solut:Lon was applied Oll a cold rolled stee]. panel which was previously washed with trichloroethylene and dried for one hour each at 100C and 220C. The coated panel was overlapped wlth another co:ld rolled steel p~mel and pressed for five minutes at 340C wLth pressure of 20 kg/cm , The bonded speciman thus obtained had a lap shear strength of 280 kg/cm2 at room temperature and 204 kg/cm2 at 200C.
(14) 3~3 A part of the polyamic acid solution was casted on a glass plate and heated Eor one hour each at 100C, 200C and 300C.
The polyimide film thus obtained had a thickness oE about 50 microns, a glass transition temperature of 2~!8C in accordance w:Lth TMA penetration method and 5% weight decrease temperature in air of 526C in accordance with DTA-TG.
The po]yimide film also had tensile strength of 12.0 kg/mm2 and elongation of 10% in accordance with ASTM D-882.
Furthermore, the polyimide film had light-transmittance of 85% and ha~e of 0.65% in accordance with ASTM D-1003.
The polyimide film was inserted between cold rolled steel panels which were preheated at 130C and pressed for five minutes at 340C with pressure of 20 kg/cm . The bonded specimen had a lap shear strength of 290 kg/cm at room temperature and 200 kg/cm2 at 200C.
Example 3 ~ reaction vessel equipped with a st:Lrrer, a reflux condenser and a nitrogen inlet tube was charged with 10.36 grams (0.02 mol) of 2,2-bis[~-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane,
Therefore the object of thls invention is to prov:Lde a novel polyimide adhesive having the high llght-transmittance, good transparency9 outstanding high-temperature flowability and excellent processability in addition to the ability of keeping adhesive strength during and after use at high temperatures.
SUMMARY OF THE INVENTION
The inventors have investigated earnestly to achieve the above-mentioned object and completed the present invention.
~ ~ aspec~
That is, one~of the present lnvention is a high-temperature adhesive which comprises polyimide having recurring units of the formula (I):
O O
_ ~ o ~ I ~O ~ N/ ~ N ( I ) (where ~ is a tetra-valent rad:lcal 9elected :from the group consist:lng of aliphat:lc radical havl.ng not less than two carbons, cyclo-aliphatic rad:Lcal, monoaromatic rndical, condensed polyaromatlc radlcal, and non condensed polyaromatic radical whereln aromatic radicals are mutually connected with a bond or a crossl:lnking as~ec~ ~-f~-~h~
~ nd another~ invention is a method for adheslon whlch comprises applying poly:Lmide having recurring units of the formula (I) (3) g o o _ - ~ O ~ C ~ O ~ N\ R/\ ~N- (I) (where R is the same as above) on a substrate, overlapping the applied surface of the substrate with the surface of another substrate and heating under pressure above the glass transition temperature of said polyimide.
BRIEF DESCRIPTION OF THE DP~WING
Figure 1 illustrates an IR absorption spectrum atlas on an example of polyimide for use in the practice of this invention.
Polyimlde of the present invention has the above-descrlbed formula(I) and is prepared by the follow:Lng method.
That is, 2,2-bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, an ether diamine having the Eormula (II):
(~) ~3~
~ C- ~ 0 ~ (II) is reacted as a diamine component with one or more of tetracarboxylic dianhydride and resultant polyamic acid having recurring units oE the following formula (III):
0 ~ C ~ 0 ~ NH-C C-NH
0 0 (III) (where R is the same as above) is further conducted the ring-closing reaction by dehydration to give ployimide.
Polyimide of this invention has an improvement in using 2,2-bis[~-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane as the diamine component. It has been quite unknown to use polyimide for the adhesives which is derived from the ether-diamine having ether-linkages and aromatic am:lno radicals in the same mo:Lecule as described above.
In the afore-said TOICK~IS~I0 58-157190(1983), it is disclosed that polyimide prepared Erom 2,2-bis~4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane and pyromellltic dianhydride may be used as adhesives. Polyimide derived Erom this diamine, however, has a high glass transition temperature of above 300C. Therefore, the adhesives prepared from this polyimide are very poor in (5) ~3~
processability, ancl hence cause many troubles and defects in bond:Lng operations and propert:les of bonded artlcles, Besides in TOKK~ISHO 59-76451(1984), polyimide is disclosed which is deri.ved from diamine having the above formula (II) and pyromellitic dianhydride. This literature, however, describes no suggestion at all concerning the use of said polyimide for adhesives, Polyimide of this invention can afford adhesives having excellent transparency, good flowability at high temperatures and outstanding processabitliy in ~ddition to substantial characteristics of high-temperature stability.
Polyimide used in the present invention can be normally prepared by reacting 2,2-bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane with tetracarboxylic dianhydride in organic solvents.
Tetracarboxylic dianhydride for use in the method of this invention has the formula(IV):
O O
Il 11 O\ R/ /0 Il 11 (IV) (where R is a tetra-valent radical selected from the group consisting of aliphatic radical hav:Lng not less than two carbons, cycloaliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromfltic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function).
Tetracarboxyl:lc dianhydride used in the method includes, for (6) example~ ethylene tetracarboxyli.c dianhydride, cyclopentane tetracarboxylic dianhydride, pyromellitic dianhydride, 3,3',4,4'~
benæophenone tetracarboxylic dianhydride, 2,2',3,3'-benzophenone-tetracarboxylic di.anhydride, 3~3',4,4'-bipilenyltetracarboxylic dianhydride, 2,2',3,3'-biphenyltetracarboxylic dianhydride, 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride, 2,2-bis(2,3-dicarboxyphenyl)propane dianhydride, bis(3,4-dicarboxyphenyl) ether dianhydride, bis(3,4-dicarboxyphenyl) sulfone dianhydride, 1,1-bis-(2,3-dicarboxyphenyl)ethane dianhydride, bis(2,3-dicarboxyphenyl)methane dianhydride, bis(3,4-dicarboxyphenyl)methane dianhydride, 2,3,6,7-naphthalenetetracarboxylic dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, 1,2,5,6-naphthalene-tetracarboxylic dianhydride, 1,2,3,4-benzenetetracarboxylic dianhydride, 3,4,9,10-perylenetetracarboxylic dianhydride, 2,3,6,7-anthracenetetracarboxylic dianhydride and 1,2,7,8-phenanthrenetetracarboxylic dianhydride, Tetracarboxylic di.anhydride can be used alone or in mixtures of two or more.
Preferred in particular among these dianhydrides are pyromellitic dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride and bis(3,4-dicarboxyphenyl~ ether d:Lanhydride.
Polyimide obtained Erom these dianhydrides has extraordinarily excellent transparency and good high-temperature flowability.
3,3'4,4'-ben~ophenoneteracarboxylic dlanhydride :Ls also a preferable dianhydride which can produce polyimide having prominent flowability in high temperatures.
The organic solvents used in the reaction lnclude, Eor example, N,N-dimethylformamide, N,N-dimethylacetamide, (7) ~2~
N,N-diethylacetamide, N,N-dimethylmethoxyacetamide, N-methyl-2-pyrrolldone, 1,3--dimethyl-2-imidazolidlnone, N-methylcaprolactam, 1,2~dimethoxyethane, bis(2-methoxyethyl) ether, 1,2-bis(2-methoxyethoxy)ethane, bis[2-(2-methoxyethoxy)ethyl] ether, tetrahydrofuran, 1,3-dioxane, 1,4-dioxane, pyridine, picoline, dimethylsulfoxide, dimethyl sulfone, tetramethylurea, hexamethylphosphoramide~ m-creaol, p-chlorophenol and anisole.
These solvents can be used alone or in mixtures of two or more.
The reaction temperature is normaliy 200C or less, preferably 50C or less. The reaction pressure is not restricted in particular and atmospheric pressure is sufficient for carrying out the reaction. The reaction time depends upon the type of solvents, reaction temperature, and tetracarboxylic dianhydrides, and is normally enough to complete the formation of polyamic acid.
Reaction for 4 to 24 hours is normally sufficient.
Such reaction affords polyamic acid having recurring units of the following formula (I):
_ ~ ~ I ~ ~ /R\ _ 0 (III) (where R is the same as above).
In the next step, thermal dehydratlon oE the polyamic acid solution at 100 to 300C or chemical dehydratlon by treatlng with imidizing agent such as acetic anhydride afford the corresponding polyimide having recurr:Lng units of the formula (I):
(8) ~3~3 o o _ ~ -0 ~ C ~ 0 ~ N\ ~/ /N - (I) The method of applying the polymide of this invention Eor adhesive is roughly divided into two procedures.
(1) The polyamic acid precursor dissolved in organic solvent is used as adhesive solution, and imidized before adhesion.
(2) The ployimide is used in the form as it is.
In the procedure (1), the adhesive solution is an organic solvents solution of polyamic acid. It may be the resultant reaction mixture of polyamic acid obtained by reacting 2,2-bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane with tetracarboxylic dianhydride in the organic solvents. It also may be the solution contaning polyamic acid as the main component and polyimide which is a cyclized product of polyamic acid. Thus the adhesive solution containing polyamic acid may be the solution or suspension containing polyimide as an auxiliary ingredient.
When applying the solutlon conta:lning such polyamic acid, a thin layer of polyamic acid solution ls formed on the substrate to be bonded, Eollowed by preheating the coated substrate ln air for a desired period at 130 to 350C preferably about 220C. Excess solvents are remove.d and the polyamic acid is converted to polyimide on the substrate. The coated substrate is overlapped with another substrate and then strongly bonded by pressing under pressure of 1 -(9) g 1,000 kg/cm2 at temperature of 50 - 400C, followed by curing at temperature of 100 - 400C.
In the procedure (2), above described polyimide is a film previously prepared by thermal dehydration or chemical dehydration with a dehydrating agent such as acetic anhydride. The polyimide is also the powder substantially consisting of polyimide as it is.
In these cases, some of said polyamic acid may be contained in said polyimide.
To apply the polyimide films or the powder for adhesion, these are inserted between the substrates and pressed under pressure of 1 - 1,000 kg/cm2 at temperature of 50 - 400C. The adherends can be strongly bonded by curing at temperature of 100 - 400C.
EXAMPLES
The present inventi.on will be illustrated with respect to following Synthetic example, Examples and Comparative example.
Synthetic example 2,2-Bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoro-propane for use in this inventlon was prepared by the ~ollowing process.
~ 200 ml glass reaction vessel was charged with 20 grams (0.059 mol) of 2,2-bis(4-hydroxyphenyl)-1,1,l,3,3,3-hexafluoro-propane, 24 grams (0.14 mol) of m-dlnitrobenzene, 19.4 grams of (10) ~%~ ~33~
potassium carbonate and lO0 ml of N, N-dimethy]formam:Lde. The mixture was reacted for 7 hours at 1~0 to 150C. ~fter endlng the reactlon, the resultant reaction mixture was cooled and poured into 1000 ml of water. Crude 2,2-bis~4-(3-nitrophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane was separated as tarry material. The tarry material was dissolved in benzene and washed with water. The benzene layer was dried with magnesium sulEate and column-chromatographed over silica gel. Purified 2,2-bis[4-(3-nitrophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane obtained as yellow oil was 28.3 grams (83% yield).
In the next step, a 300 ml glass reaction vessel was charged with 20 grams (0.035 mol) of 2,2-bis[4-(3-nitrophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropane, 2 grams of active carbon, 0.2 gram of ferric chloride hexahydrate and 100 ml of isopropyl alcohol. The mixture was stirred under reflux for 30 minutes and then 7 grams (0.14 mol) of hydrazine hydrate was added dropwise over 2 hours at 60 to 70C, tollowed by further stirring for 5 hours under reflux, The resultant reaction mixture was cooled, filtered to remove the catalyst and 60 ml oE isopropyl alcohol was distilled off from the filtrate. The residue was added with 80 grams of 17.5%
hydrochloric ac:Ld, followed by further adding 10 grams oE sodium chlorlde and cooled to 20 to 25C wlth stirrlng. The precipitated crystals were fi:Ltered, recrysta]lized again by using 40 ml oE
isopropyl alcohol and 80 grams oE 17.5% hydrochloric acid. The filtered crystals were dissolved in 50% isopropyl alcohol and neutralized with aqueous ammonia.
(11) ~`~D
The separated crystals were filtered, washed wlth water, dried and recrystallized from a solvent mlxture oE benzene and n-hexane. 2,2-Bis[~-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane thus obta~ned was 13,6 grams (75% yield) and was colorless crystals having a melting point of 137 to 139C and purity of 99.2% according to high speed liquld chromatography.
Elementary analysis (C27 H20 N2 F602) -C H N F
Calculated (%) 62.55 3.86 5.41 22.00 Found (%) 69.86 5.20 5.20 21.95 .
~R(KBr, cm ): 3480 and 3380 (amino group) 12~0 (ether linkage) Example 1 ~ reaction vessel equipped wlth a stirrer, reElux condenser and nitrogen inlet tube was charged with 10.36 grams (0.02 mol) oE
2,2-bis[4(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane and 44.16 grams of N,N-dimethylacetmide, and added with 4.273 grams (0,0196 mol) oE pyromellitic dianhydride in portions at room temperature under nitrogen atmosphere with care not to raise the solution temperature above 30C. The reaction mixture was further stirred for 20 hours at room temperature.
Polyamic acid thus obtained had an inherent viscosity of (12) ~2~
0.55 dl/g at 35~C in 0.5% ~,N-climethylacetamide solutlon.
~ fter diluting the polyamic acid solution by z.dding 88.3 grams of N,N-dimethylacetamide and stirring for 30 minutes, 8.08 grams (0.08 mol) of triethylamine and 12.24 grams (0.12 mol) of acetic anhydride were dropwise added and stirring was further continued at room temperature under nitrogen atmosphere.
Light yellow polyimide powder was started to precipitate at about 7 hours aEter the addition, and the stirring was further continued for 20 hours.
The separated polyimide powder was Eiltered, washed with methanol, and dried at 180C for 24 hours under reducsd pressure, The polyimide powder thus obtained was 13.68 grams (97%
yield) and had crystallinity of 28.2% according to X-ray analysis.
Figure 1 illustrates the IR absorption spectrum atlas of polyimide thus obtained. In the spectrum atlas, remarkable absorption is found at 1780cm and 1720cm 1 which are charactereistic absorption bands of imide ring and 12~0cm 1 which is characteristic absorption band of ether linkage.
The powder had a glass transitlon temperature of 231C, melting poLnt of 387C in accordance with DSC method and 5% weight decrease temperature in air of 528C ln accordance with DTA-TG.
The polyimide powder obtained by the practice of thls example had a melt viscoslty of 9.9~;103 poises at ~20C measured wi~h a Japan High Polymer Society type flow tester (CFT-500, from Shimadzu Seisakusho) by use of an orlfice having a diameter of O.lcm under 300 kg load. The strand obtained was light brown, transparent and had a high flexibility.
(13) ~2~
The polyimide powder was inserted between co:Ld rolled steel panels (JlS 3141, spec/SD, 25 x 100 x 1.6mm) which were preheated at 130C and pressed for fiva mLnutes at 340C with pressure oE 20 kg/cm .
The bonded specimen had a lap shear strength of 285 kg/cm at room temperature and 195 kg/cm at 200C in accordance with JIS
K-6848 and K-6850.
Example 2 A reaction vessel equipped with a stirrer, reflux condenser and nitrogen inlet tube was charged with 5.18 grams (0.01 mol) of 2,2-bis[4-(3-aminophenoxy)phenyll-1,1,1,3,3,3-hexafluoropropane and 22.1 grams of N,N-dimethylacetamide, and added with 2.18 grams (0.01 mol) of pyromellitic dianhydride in portions at room temperature under nitrogen atmosphere with care not to raise the solution temperature above 30C. The reaction mixture was further stirred for 20 hours at room temperature.
Polyamic acid thus obtained had an inherent viscosity of 2.1 dl/g.
The polyamic acid solut:Lon was applied Oll a cold rolled stee]. panel which was previously washed with trichloroethylene and dried for one hour each at 100C and 220C. The coated panel was overlapped wlth another co:ld rolled steel p~mel and pressed for five minutes at 340C wLth pressure of 20 kg/cm , The bonded speciman thus obtained had a lap shear strength of 280 kg/cm2 at room temperature and 204 kg/cm2 at 200C.
(14) 3~3 A part of the polyamic acid solution was casted on a glass plate and heated Eor one hour each at 100C, 200C and 300C.
The polyimide film thus obtained had a thickness oE about 50 microns, a glass transition temperature of 2~!8C in accordance w:Lth TMA penetration method and 5% weight decrease temperature in air of 526C in accordance with DTA-TG.
The po]yimide film also had tensile strength of 12.0 kg/mm2 and elongation of 10% in accordance with ASTM D-882.
Furthermore, the polyimide film had light-transmittance of 85% and ha~e of 0.65% in accordance with ASTM D-1003.
The polyimide film was inserted between cold rolled steel panels which were preheated at 130C and pressed for five minutes at 340C with pressure of 20 kg/cm . The bonded specimen had a lap shear strength of 290 kg/cm at room temperature and 200 kg/cm2 at 200C.
Example 3 ~ reaction vessel equipped with a st:Lrrer, a reflux condenser and a nitrogen inlet tube was charged with 10.36 grams (0.02 mol) of 2,2-bis[~-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane,
4.273 grams (0.0196 mol) of pyromel:Litic dianhydride and 133.8 grams of m-cresol and heated to ra:Lse its temperature w:Lth stirring under nitrogen atmosphere. ~ light orange, transparent and homogeneous solution was obtained at about 60C. The so:Lution was heated up to 150C and Eurther stirred for an hour. Light yellow polyimide powder started to precipitate slowly. The mixture was further heated for 5 hours with stirring and filtered. The resulting (15) ~2~ L~ ~ 3~
polyimide powder was washed with methanol ancl acetone and dried Eor 24 hours at 180C under reduced pressure to give 13.03 grams (92.3%
yield) oE polyimide powder. The polyimide powder thus obtained had the same IR absorption spectrum as shown in Figure 1. X ray analysis of the polyimide powder indicated crystallinity of 44.7%.
The polyimide powder was absolutely insoluble in aliphatic halogenated hydrocarbon solvents such as methylene chloride, chlorsform and the like.
The polyimide ?owder had a glass transition temperature of 232C, a melting point of 388C and 5% weight decrease temperature of 530C.
The polyimide powder also had a melt viscosity of 7.3 x 103 poises. The strand obtained was light brown, transparent and highly fLexible.
Comparative Example_ The same polymerization procedure as described in Example 2 was repeated except 2,2-bis[4-(4-aminophenoxy)phenyl]-1,1,1~3,3,3-hexafluoropropane was used in place of 2,2-bis[4-(3-aminophenoxy)phenyll-1,1,1,3,3,3-hex1fluoropropane.
Polyamic acid thus ob~ained had an :Lnherent viscoslty of 1.25 dl/g.
The po]yamic acld solutlorl Wc18 fur~her lmldlzed chemlcal:Ly by the same procedure as descrlbed in Examp:Le 1. The polyimide powder thus obtained was failed in measurlng melt viscosity because the powder was infusible and no strand was obtained.
(16) ~27~3~3 Besides a part of the polyamic acid solution was casted on a glass plate and heated an hour each at 100C, 200C and 300C to obtain a polyimide film. The glass transition temperature of the polyimide film was high and indicated 310C.
Example 4 A reaction vessel equipped with a stirrer, reflux condenser and nitrogen inlet tube was charged with 5.18 grams (0.01 mol) of 2,2-bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane and 25.2 grams of N,N-dimethylacetamide, and added with 3.188 grams (0.0099 mol) of 3,3~,~,4',-benzophenonetetracarboxylic dianhydride in portions at room temperature under nitrogen atmosphere with care not to raise the solution temperature above 30C. The reaction mixture was further stirred for 20 hours at room temperature.
Polyamic acid thus obtained had an inherent viscosity of 1.1 dl/g.
A part of the polyamic acid solution was casted on a glass plate and heated for one hour each at 100C, 200C and 300C.
The light yellow and transparent polylmide film thus obtained had a glass transition temperature of 206c and 5% weight decrease temperature in alr of 531C.
The polyim~.de fi.lm also had tensile strength of 13.1 kg/mm2 and elongation oE 7%.
The polyimide fil.m was lnserted between cold rol.Led steel panels which were preheated at ].30C and pressed for five minutes at 3~0C with pressure of 20 kg/cm . The bonded specimen had a lap (17) P~ L9~9 shear strengtll of 3~l9 kg/cm at room temperature and 210 kg/cm at 150 C.
~xample 5 A reac~ion ve3sel equipped wlth a stirrer, reflux condenser and nltrogen :Ln.Let tube was charged wlth 10.36 grams (0.02 mol) oE
2,2-bis[~-(3-amlrlopllerloxy)phellyl]-.l~1,1>3,3~3-llexafluoropropane and 147.3 grams of N,N-dlmetllyl.acetamide, and added with 6.01 grams (0.0194 mol) oE bLs(3,~-dicnrbo~ypheDyl) ether dianhydride in portions at room temperature under nitrogen atmosphere with care not to raise the solut-Lon temper-ature above 30C. The reaction mixture was further ~tirred for 20 hours at room temperature.
Polyamic acid thus obtained had an inherent viscosity of 0.62 dl/g.
To the polyamic acid solution 8.08 grams (0.08 mol) of triethylamine and l2.24 grams (0.12 mol.) of acetic anhydride were dropwise added and stirr;.ng was further contimled at room temperature under nitrogen atmosphere.
Light yellow polyimide powder was started to precipitate at about 10 hours a:Eter the additlorl, and the stlrri.ng was furtller contiaued Eor 20 hours.
The ~pnrated polyim.Lde powder wa~ flltered, wa.slled wlth me~hanol, and ~rl.ed at 180C .Eor 24 hours under re.duced pressure.
Thc poly:Lmlde powder thu~ ol~tained was 14.37 grams (95 y:leld) and had melt v:Lsco3lty oE 3.2 x 103 poises.
~2~
The powder was inserted between cold rolLed steel panels which were preheated at 130C and pressed at 340C for 5 minutes with pressure oE 20 kg/cm . The bonded specimen had a lap shear strength of 355 kg/cm2 at room temperature ancl 200 kg/cm at 150C.
Example 6 ~ reaction vessel equipped with a stirrer, reflux condenser and nitrogen inlet tube was charged with 5.18 grams (0.01 mol) of 2,2-bis[4-(3-aminophenoxy)phenyl~-1,1,1,3,3,3-hexafluoropropane and 24.6 grams of N,N-dimethylacetamide, and added with 3.01 grams (0.0097 mol) of bis(3,4-dicarboxyphenyl) ether dianhydride in portions at room temperature under nitrogen atmosphere with care not to raise the solution temperat~lre above 30C. The reaction mlxture was further stirred for 20 hours at room temperature.
Polyamic acld thus obtained had an inherent viscosity oE
0.68 dl/g.
The polyamlc acid solution was applied on a cold rol]ed steel panel which was previously washed with trlchloroethylene and drled for one hour each at 100C ancl 220~C. Tlle coated panel was overlapped wlth another cold rolled steel panel and pressed Eor Elve mlnutes at 340(' with pressure oE 20 kg/cm2.
The bonded spec:Lmen thus obta:lned had a lap shear strength oE 360 kg/cm at room temperature.
~ part of ~he polyamlc ac:ld solutlotl was casted on a glass plate and heated for one hour each at 100C, 200C and 300C.
The colorless and transparent polylmlde fllm thus obtalned (19) had a thlckness oE about 50 microns, a glass transition temperature of 191 C and 5% weigilt decrease temperature in alr of 538 ~C.
The polyimide film also had tensile strength of 12.5 kg/mm and elongation of 8%.
Furthermore, the polyimid film had light-transmittance of 89% and haze of 0.52%, The polyimide film was inserted between cold rolled steel panels which were preheated at 130C and pressed for five minutes at 340C with pressure of 20 kg/cm . The bonded specimen had a lap shear strength of 362 kg/cm at room temperature and 220 kg/cm at 150C.
Example 7 A reaction vessel equipped with a stirrer, reflux condenser and nitrogen inlet tube was charged with 5.18 grams (0.01 mol) of 2,2-bis[4-(3-aminophenoxy)phenyl~ 1,1,3,3~3-hexaEluoropropane and 72.0 grams of N,N-dimethylacetamide, and added with 2.82 grams (0.0096 mol) of 3,3',4,4'-biphenyltetracarboxylic dianhydrlde in portion at room temperature under nitrogen atmosphere wlth care not to raise the solution temperature above 30C. The reaction mixture was furtller stirred for 20 hours at room temperature.
Polyamic ac:l.d thus obtained had an inherent viscosity of 0.52 dl/g, To the polyamic acid solution 8.08 grams (0.08 mol) of triethylam:Lne and 12.24 grams (0.12 mol) of acetic anhydride were dropwise added and sti.rring was further continued at room temperatùre under nitrogen atmosphere.
(20) 3~
Light yellow polyimide powder was started to prec-Lpitate at about 9 hours after the addition, and the stirring was Eurtller continued Eor 20 hours.
The separated polyimide powder was filtered, washed with methanol~ and dried at 180C for 24 hours under reduced pressure.
The polyimide powder thus obtained was 6.99 grams (96%
yield) and had melt viscosity of 5.5 x 103 poises, The powder was inserted between cold rolled steel panels which were preheated at 130C and pressed at 340C for 5 minutes with pressure of 20 kg/cm . The bonded specimen had a lap shear strength of 350 kg/cm at room temperature and 218 kg/cm at 150C.
Example 8 A reaction vessel equipped with a stirrer, reElux condenser and nitrogen inlet tube was charged with 5.18 grams t0.01 mol) of 2,2-bis[4-(3-aminophenoxy)phenyl~-1,1,1,3,3,3-hexafluoropropane and 24.3 grams of N,N-dimethylacetamideJ and added with 2.91 grams (0.0099 mol) oE 3,3',4,4'-biphenyltetracarboxyllc dianhydr:Lde in portions at room temperature under n:Ltro~en atmosphere wlth care not to ralse the solutLon temperature above 30C. The reaetlon mLxture was further stlrred Eor 20 hours at room temperature.
Polyamic acid thus obta:Lned ha(l an inherent vlscoslty oE 1.0 dl/g.
The poLyamic ac:Ld so:Lution was applLecl on a cold ro:Lled steel panel wh:Lc'tl was previously washed wlth trlchloroethylene and drled Eor one hour each at 100C and 220C. The coated p~mel was overlapped with another cold rolled steel panel and pressed for five (21) minutes at 3~l0C with pressure of 20 kg/cm2 The bonded spec.imen thus obtained had a lap shear strength of 350 kg/cm at room temperature and 218 kg/cm at l50C.
~ part of the polyamic acid solution was casted on a glass plate and heated for one hour each at 100C, 200C and 300C.
The polyimide film thus obtalned had a thickness of about 50 microns, a glass transition temperature of 220 C and 5% weight decrease temperature in ai.r of 538C.
The polyimide film also had tensile strength of 13.2 kg/mm2 and elongation of 36 %.
~ urthermore, the polyimide film had light-transmittance of 85% and ha~e of 0.~ %.
The polyimide fllm was inserted between cold rolled steel panels which were preheated at 130C and pressed for five minutes at 3~l0C with pressure of 20 kg/cm , The bonded specimen had a lap shear strength of 355 kg/cm at room temperature and 220 kg/cm at 150C.
(22)
polyimide powder was washed with methanol ancl acetone and dried Eor 24 hours at 180C under reduced pressure to give 13.03 grams (92.3%
yield) oE polyimide powder. The polyimide powder thus obtained had the same IR absorption spectrum as shown in Figure 1. X ray analysis of the polyimide powder indicated crystallinity of 44.7%.
The polyimide powder was absolutely insoluble in aliphatic halogenated hydrocarbon solvents such as methylene chloride, chlorsform and the like.
The polyimide ?owder had a glass transition temperature of 232C, a melting point of 388C and 5% weight decrease temperature of 530C.
The polyimide powder also had a melt viscosity of 7.3 x 103 poises. The strand obtained was light brown, transparent and highly fLexible.
Comparative Example_ The same polymerization procedure as described in Example 2 was repeated except 2,2-bis[4-(4-aminophenoxy)phenyl]-1,1,1~3,3,3-hexafluoropropane was used in place of 2,2-bis[4-(3-aminophenoxy)phenyll-1,1,1,3,3,3-hex1fluoropropane.
Polyamic acid thus ob~ained had an :Lnherent viscoslty of 1.25 dl/g.
The po]yamic acld solutlorl Wc18 fur~her lmldlzed chemlcal:Ly by the same procedure as descrlbed in Examp:Le 1. The polyimide powder thus obtained was failed in measurlng melt viscosity because the powder was infusible and no strand was obtained.
(16) ~27~3~3 Besides a part of the polyamic acid solution was casted on a glass plate and heated an hour each at 100C, 200C and 300C to obtain a polyimide film. The glass transition temperature of the polyimide film was high and indicated 310C.
Example 4 A reaction vessel equipped with a stirrer, reflux condenser and nitrogen inlet tube was charged with 5.18 grams (0.01 mol) of 2,2-bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane and 25.2 grams of N,N-dimethylacetamide, and added with 3.188 grams (0.0099 mol) of 3,3~,~,4',-benzophenonetetracarboxylic dianhydride in portions at room temperature under nitrogen atmosphere with care not to raise the solution temperature above 30C. The reaction mixture was further stirred for 20 hours at room temperature.
Polyamic acid thus obtained had an inherent viscosity of 1.1 dl/g.
A part of the polyamic acid solution was casted on a glass plate and heated for one hour each at 100C, 200C and 300C.
The light yellow and transparent polylmide film thus obtained had a glass transition temperature of 206c and 5% weight decrease temperature in alr of 531C.
The polyim~.de fi.lm also had tensile strength of 13.1 kg/mm2 and elongation oE 7%.
The polyimide fil.m was lnserted between cold rol.Led steel panels which were preheated at ].30C and pressed for five minutes at 3~0C with pressure of 20 kg/cm . The bonded specimen had a lap (17) P~ L9~9 shear strengtll of 3~l9 kg/cm at room temperature and 210 kg/cm at 150 C.
~xample 5 A reac~ion ve3sel equipped wlth a stirrer, reflux condenser and nltrogen :Ln.Let tube was charged wlth 10.36 grams (0.02 mol) oE
2,2-bis[~-(3-amlrlopllerloxy)phellyl]-.l~1,1>3,3~3-llexafluoropropane and 147.3 grams of N,N-dlmetllyl.acetamide, and added with 6.01 grams (0.0194 mol) oE bLs(3,~-dicnrbo~ypheDyl) ether dianhydride in portions at room temperature under nitrogen atmosphere with care not to raise the solut-Lon temper-ature above 30C. The reaction mixture was further ~tirred for 20 hours at room temperature.
Polyamic acid thus obtained had an inherent viscosity of 0.62 dl/g.
To the polyamic acid solution 8.08 grams (0.08 mol) of triethylamine and l2.24 grams (0.12 mol.) of acetic anhydride were dropwise added and stirr;.ng was further contimled at room temperature under nitrogen atmosphere.
Light yellow polyimide powder was started to precipitate at about 10 hours a:Eter the additlorl, and the stlrri.ng was furtller contiaued Eor 20 hours.
The ~pnrated polyim.Lde powder wa~ flltered, wa.slled wlth me~hanol, and ~rl.ed at 180C .Eor 24 hours under re.duced pressure.
Thc poly:Lmlde powder thu~ ol~tained was 14.37 grams (95 y:leld) and had melt v:Lsco3lty oE 3.2 x 103 poises.
~2~
The powder was inserted between cold rolLed steel panels which were preheated at 130C and pressed at 340C for 5 minutes with pressure oE 20 kg/cm . The bonded specimen had a lap shear strength of 355 kg/cm2 at room temperature ancl 200 kg/cm at 150C.
Example 6 ~ reaction vessel equipped with a stirrer, reflux condenser and nitrogen inlet tube was charged with 5.18 grams (0.01 mol) of 2,2-bis[4-(3-aminophenoxy)phenyl~-1,1,1,3,3,3-hexafluoropropane and 24.6 grams of N,N-dimethylacetamide, and added with 3.01 grams (0.0097 mol) of bis(3,4-dicarboxyphenyl) ether dianhydride in portions at room temperature under nitrogen atmosphere with care not to raise the solution temperat~lre above 30C. The reaction mlxture was further stirred for 20 hours at room temperature.
Polyamic acld thus obtained had an inherent viscosity oE
0.68 dl/g.
The polyamlc acid solution was applied on a cold rol]ed steel panel which was previously washed with trlchloroethylene and drled for one hour each at 100C ancl 220~C. Tlle coated panel was overlapped wlth another cold rolled steel panel and pressed Eor Elve mlnutes at 340(' with pressure oE 20 kg/cm2.
The bonded spec:Lmen thus obta:lned had a lap shear strength oE 360 kg/cm at room temperature.
~ part of ~he polyamlc ac:ld solutlotl was casted on a glass plate and heated for one hour each at 100C, 200C and 300C.
The colorless and transparent polylmlde fllm thus obtalned (19) had a thlckness oE about 50 microns, a glass transition temperature of 191 C and 5% weigilt decrease temperature in alr of 538 ~C.
The polyimide film also had tensile strength of 12.5 kg/mm and elongation of 8%.
Furthermore, the polyimid film had light-transmittance of 89% and haze of 0.52%, The polyimide film was inserted between cold rolled steel panels which were preheated at 130C and pressed for five minutes at 340C with pressure of 20 kg/cm . The bonded specimen had a lap shear strength of 362 kg/cm at room temperature and 220 kg/cm at 150C.
Example 7 A reaction vessel equipped with a stirrer, reflux condenser and nitrogen inlet tube was charged with 5.18 grams (0.01 mol) of 2,2-bis[4-(3-aminophenoxy)phenyl~ 1,1,3,3~3-hexaEluoropropane and 72.0 grams of N,N-dimethylacetamide, and added with 2.82 grams (0.0096 mol) of 3,3',4,4'-biphenyltetracarboxylic dianhydrlde in portion at room temperature under nitrogen atmosphere wlth care not to raise the solution temperature above 30C. The reaction mixture was furtller stirred for 20 hours at room temperature.
Polyamic ac:l.d thus obtained had an inherent viscosity of 0.52 dl/g, To the polyamic acid solution 8.08 grams (0.08 mol) of triethylam:Lne and 12.24 grams (0.12 mol) of acetic anhydride were dropwise added and sti.rring was further continued at room temperatùre under nitrogen atmosphere.
(20) 3~
Light yellow polyimide powder was started to prec-Lpitate at about 9 hours after the addition, and the stirring was Eurtller continued Eor 20 hours.
The separated polyimide powder was filtered, washed with methanol~ and dried at 180C for 24 hours under reduced pressure.
The polyimide powder thus obtained was 6.99 grams (96%
yield) and had melt viscosity of 5.5 x 103 poises, The powder was inserted between cold rolled steel panels which were preheated at 130C and pressed at 340C for 5 minutes with pressure of 20 kg/cm . The bonded specimen had a lap shear strength of 350 kg/cm at room temperature and 218 kg/cm at 150C.
Example 8 A reaction vessel equipped with a stirrer, reElux condenser and nitrogen inlet tube was charged with 5.18 grams t0.01 mol) of 2,2-bis[4-(3-aminophenoxy)phenyl~-1,1,1,3,3,3-hexafluoropropane and 24.3 grams of N,N-dimethylacetamideJ and added with 2.91 grams (0.0099 mol) oE 3,3',4,4'-biphenyltetracarboxyllc dianhydr:Lde in portions at room temperature under n:Ltro~en atmosphere wlth care not to ralse the solutLon temperature above 30C. The reaetlon mLxture was further stlrred Eor 20 hours at room temperature.
Polyamic acid thus obta:Lned ha(l an inherent vlscoslty oE 1.0 dl/g.
The poLyamic ac:Ld so:Lution was applLecl on a cold ro:Lled steel panel wh:Lc'tl was previously washed wlth trlchloroethylene and drled Eor one hour each at 100C and 220C. The coated p~mel was overlapped with another cold rolled steel panel and pressed for five (21) minutes at 3~l0C with pressure of 20 kg/cm2 The bonded spec.imen thus obtained had a lap shear strength of 350 kg/cm at room temperature and 218 kg/cm at l50C.
~ part of the polyamic acid solution was casted on a glass plate and heated for one hour each at 100C, 200C and 300C.
The polyimide film thus obtalned had a thickness of about 50 microns, a glass transition temperature of 220 C and 5% weight decrease temperature in ai.r of 538C.
The polyimide film also had tensile strength of 13.2 kg/mm2 and elongation of 36 %.
~ urthermore, the polyimide film had light-transmittance of 85% and ha~e of 0.~ %.
The polyimide fllm was inserted between cold rolled steel panels which were preheated at 130C and pressed for five minutes at 3~l0C with pressure of 20 kg/cm , The bonded specimen had a lap shear strength of 355 kg/cm at room temperature and 220 kg/cm at 150C.
(22)
Claims (18)
1) A high-temperature adhesive of polyimide having recurring units of the formula:
(where R is a tetra-valent radical selected from the group consisting of aliphatic radical having not less than two carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function).
(where R is a tetra-valent radical selected from the group consisting of aliphatic radical having not less than two carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function).
2) The high-temperature adhesive as claimed in Claim 1 wherein is a tetra valent radical selected from the group consisting of:
, and (23)
, and (23)
3) The high-temperature adhesive as claimed in Claim 1 or Claim 2 wherein R is a tetra valent radical represented by the formula:
.
.
4) The high-temperature adhesive as claimed in Claim 1 or Claim 2 wherein R is a tetra valent radical represented by the formula:
.
.
5) The high-temperature adhesive as claimed in Claim 1 or Claim 2 wherein R is a tetra valent radical represented by the formula:
.
.
6) The high-temperature adhesive as claimed in Claim 1 wherein R is a tetra valent radical represented by the formula:
.
(24)
.
(24)
7) A method for adhesion which comprises applying polyimide having recurring units of the formula:
(where R is a tetra-valent radical selected from the group consisting of aliphatic radical having not less than two carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function) on a substrate, overlapping the applied surface of the substrate with the surface of another substrate and heating under pressure above the glass transition temperature of said polyimide.
(where R is a tetra-valent radical selected from the group consisting of aliphatic radical having not less than two carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function) on a substrate, overlapping the applied surface of the substrate with the surface of another substrate and heating under pressure above the glass transition temperature of said polyimide.
8) The method for adhesion as claimed in Claim 7 wherein said polyimide is polyimide powder.
9) The method for adhesion as claimed in Claim 7 wherein said polyimide is a polyimide film.
(25)
(25)
10) The method for adhesion as claimed in Claim 7 wherein said polyimide is obtained by applying the polyamic acid precursor of said polyimide having recurring units of the formula:
(where R is a tetra-valent radical selected from the group consisting of aliphatic radical having not less than two carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function) on the substrate and imidizing said precursor.
(where R is a tetra-valent radical selected from the group consisting of aliphatic radical having not less than two carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function) on the substrate and imidizing said precursor.
11) The method for adhesion as claimed in one of Claim 7 or 10 wherein R is a tetra valent radical selected from the group consisting of:
, and .
, and .
12) The method for adhesion as claimed in one of Claim 7 or wherein R is a tetra valent radical represented by the formula:
(26) .
(26) .
13) The method for adhesion as claimed in one of Claim 7 or 10 wherein R is a tetra valent radical represented by the formula:
.
.
14) The method for adhesion as claimed in one of Claim 7 or 10 wherein R is a tetra valent radical represented by the formula:
.
.
15) The method for adhesion as claimed in one of Claim 7 or 10 wherein R is a tetra valent readical represented by the formula:
.
(27)
.
(27)
16. An adhesive which is stable and flowable at a high temperature, is transparent and consists essentially of a polyimide having recurring units of the formula:
(I) (wherein R is a tetravalent radical which can be derived from a tetracarboxylic dianhydride selected from the group consisting of ethylene tetracarboxylic dianhydride, cyclopentane tetracarboxylic dianhydride, pyromellitic dianhydride, 3,3',4,4'-benzophenone-tetracarboxylic dianhydride, 2,2',3,3'-benzophenonetetracarboxylic dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, 2,2',3,3'-biphenyltetracarboxylic dianhydride, 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride, 2,2-bis(2,3-dicarboxyphenyl)-propane dianhydride, bis(3,4-dicarboxyphenyl)ether dianhydride, bis(3,4-dicarboxyphenyl)sulfone dianhydride, 1,1-bis-(2,3-dicarboxyphenyl)ethane dianhydride, bis(2,3-dicarboxyphenyl)-methane dianhydride, bis(3,4-dicarboxyphenyl)methane dianhydride, 2,3,6,7-naphthalenetetracarboxylic dianhydride, 1,4,5,8-naphtha-lenetetracarboxy:Lic dianhydride, 1,2,5,6-naphthalenetetra-carboxylic dianhydride, 1,2,3,4-benzenetetracarboxylic dianhydride, 3,4,9,10-perylenetetracarboxylic dianhydride, 2,3,6,7-anthracene-tetracarboxylic dianhydride and 1,2,7,8-phenanthrenetetra-carboxylic dianhydride)or its precursor polyamic acid.
(28)
(I) (wherein R is a tetravalent radical which can be derived from a tetracarboxylic dianhydride selected from the group consisting of ethylene tetracarboxylic dianhydride, cyclopentane tetracarboxylic dianhydride, pyromellitic dianhydride, 3,3',4,4'-benzophenone-tetracarboxylic dianhydride, 2,2',3,3'-benzophenonetetracarboxylic dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, 2,2',3,3'-biphenyltetracarboxylic dianhydride, 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride, 2,2-bis(2,3-dicarboxyphenyl)-propane dianhydride, bis(3,4-dicarboxyphenyl)ether dianhydride, bis(3,4-dicarboxyphenyl)sulfone dianhydride, 1,1-bis-(2,3-dicarboxyphenyl)ethane dianhydride, bis(2,3-dicarboxyphenyl)-methane dianhydride, bis(3,4-dicarboxyphenyl)methane dianhydride, 2,3,6,7-naphthalenetetracarboxylic dianhydride, 1,4,5,8-naphtha-lenetetracarboxy:Lic dianhydride, 1,2,5,6-naphthalenetetra-carboxylic dianhydride, 1,2,3,4-benzenetetracarboxylic dianhydride, 3,4,9,10-perylenetetracarboxylic dianhydride, 2,3,6,7-anthracene-tetracarboxylic dianhydride and 1,2,7,8-phenanthrenetetra-carboxylic dianhydride)or its precursor polyamic acid.
(28)
17. A method of bonding two substrates, which comprises:
applying the adhesive as defined in claim 16 onto a surface of one of the substrate, laying the applied surface on a surface of the other substrate, and heating the surfaces under pressure of 1 to 1,000 kg/cm at a temperature above the glass transition temperature of the polyimide but not higher than 400°C.
applying the adhesive as defined in claim 16 onto a surface of one of the substrate, laying the applied surface on a surface of the other substrate, and heating the surfaces under pressure of 1 to 1,000 kg/cm at a temperature above the glass transition temperature of the polyimide but not higher than 400°C.
18. The method as claimed in claim 17, wherein the substrates are made of steel.
(29)
(29)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61038390A JPS62197426A (en) | 1986-02-25 | 1986-02-25 | Heat-resistant adhesive |
| JP61-038390 | 1986-02-25 | ||
| JP61084945A JPS62241923A (en) | 1986-04-15 | 1986-04-15 | Polyimide |
| JP61-084945 | 1986-04-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1274939A true CA1274939A (en) | 1990-10-02 |
Family
ID=26377633
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000530420A Expired - Fee Related CA1274939A (en) | 1986-02-25 | 1987-02-24 | High-temperature adhesive of polyimide |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US4795798A (en) |
| EP (1) | EP0234882B1 (en) |
| KR (1) | KR900008964B1 (en) |
| AU (1) | AU6924587A (en) |
| CA (1) | CA1274939A (en) |
| DE (1) | DE3783477T2 (en) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4847349A (en) * | 1985-08-27 | 1989-07-11 | Mitsui Toatsu Chemicals, Inc. | Polyimide and high-temperature adhesive of polyimide from meta substituted phenoxy diamines |
| US5278276A (en) * | 1985-08-27 | 1994-01-11 | Mitsui Toatsu Chemicals, Incorporated | Polyimide and high-temperature adhesive of polyimide |
| JP2585552B2 (en) * | 1986-11-19 | 1997-02-26 | 三井東圧化学株式会社 | Polyimide |
| US5288843A (en) * | 1987-05-20 | 1994-02-22 | Mitsui Toatsu Chemicals, Inc. | Polyimides, process for the preparation thereof and polyimide resin compositions |
| GB2210618B (en) * | 1987-10-08 | 1991-10-16 | British Bio Technology | Synthetic egf gene |
| AU599517B2 (en) * | 1987-10-23 | 1990-07-19 | Mitsui Toatsu Chemicals Inc. | Method for preparing polyimide and composite material thereof |
| JPH0794555B2 (en) * | 1988-10-20 | 1995-10-11 | 三井東圧化学株式会社 | Method for manufacturing polyimide sheet |
| US4879182A (en) * | 1988-10-24 | 1989-11-07 | Ethyl Corporation | Method of coating carbon bodies |
| US4943682A (en) * | 1988-12-15 | 1990-07-24 | Ethyl Corporation | Production of particulate polyimide polymers |
| EP0387450B1 (en) * | 1988-12-27 | 1996-10-23 | MITSUI TOATSU CHEMICALS, Inc. | Process for making an IC Socket |
| EP0376592B1 (en) * | 1988-12-28 | 1995-02-08 | MITSUI TOATSU CHEMICALS, Inc. | Polyimide foam |
| US5069848A (en) * | 1989-04-05 | 1991-12-03 | Mitsui Toatsu Chemicals, Inc. | Extrusion process of polyimide and polyimide pellet used for the process |
| US5206339A (en) * | 1989-04-05 | 1993-04-27 | Mitsui Toatsu Chemicals, Inc. | Extrusion process of polyimide and polyimide pellet used for the process |
| US4962183A (en) * | 1989-05-08 | 1990-10-09 | Hoechst Celanese Corp. | Polyimide-polyamide polymer having fluorine-containing linking groups |
| US5260407A (en) * | 1989-07-17 | 1993-11-09 | Mitsui Toatsu Chemicals, Incorporated | Polyimide film and preparation process of the film |
| US5202411A (en) * | 1990-04-06 | 1993-04-13 | W. R. Grace & Co.-Conn. | Tri-component polyimide composition and preparation thereof |
| JP5246983B2 (en) * | 2000-03-13 | 2013-07-24 | 三井化学株式会社 | Method for producing polyimide |
| DE60127110T2 (en) * | 2000-04-20 | 2007-11-08 | Teijin Ltd. | POLYIMIDE FILM AND METHOD FOR THE PRODUCTION THEREOF |
| US6808818B2 (en) * | 2001-10-11 | 2004-10-26 | Ube Industries, Ltd. | Fusible polyimide and composite polyimide film |
| US11746259B2 (en) | 2020-01-10 | 2023-09-05 | Oprocessor Inc | Optical module and method for manufacturing the same |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1934889A1 (en) * | 1969-07-10 | 1971-01-14 | Bayer Ag | Novel pyridine bis (hydroxyarylaether) and process for their preparation |
| US4203922A (en) * | 1976-07-19 | 1980-05-20 | Trw Inc. | Fluorinated aromatic diamine |
| US4111906A (en) * | 1976-07-19 | 1978-09-05 | Trw Inc. | Polyimides prepared from perfluoroisopropylidene diamine |
| JPS58157190A (en) * | 1982-03-12 | 1983-09-19 | 日立化成工業株式会社 | Method of producing substrate for flexible printed circuit |
| JPS5976451A (en) * | 1982-10-26 | 1984-05-01 | Hitachi Ltd | Semiconductor device |
| US4535101A (en) * | 1984-04-03 | 1985-08-13 | Imi-Tech Corporation | Polyimide of 2,2-bis(4-(4-aminophenoxy)phenyl)-hexafluoropropane and process for the preparation of same |
| GB2174399B (en) * | 1985-03-10 | 1988-05-18 | Nitto Electric Ind Co | Colorless transparent polyimide shaped articles and their production |
-
1987
- 1987-02-20 EP EP87301478A patent/EP0234882B1/en not_active Expired - Lifetime
- 1987-02-20 DE DE8787301478T patent/DE3783477T2/en not_active Expired - Fee Related
- 1987-02-24 CA CA000530420A patent/CA1274939A/en not_active Expired - Fee Related
- 1987-02-25 US US07/018,496 patent/US4795798A/en not_active Expired - Lifetime
- 1987-02-25 AU AU69245/87A patent/AU6924587A/en not_active Abandoned
- 1987-02-25 KR KR1019870001612A patent/KR900008964B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| EP0234882B1 (en) | 1993-01-13 |
| EP0234882A2 (en) | 1987-09-02 |
| US4795798A (en) | 1989-01-03 |
| KR870007998A (en) | 1987-09-23 |
| DE3783477D1 (en) | 1993-02-25 |
| AU6924587A (en) | 1987-08-27 |
| KR900008964B1 (en) | 1990-12-15 |
| EP0234882A3 (en) | 1989-03-15 |
| DE3783477T2 (en) | 1993-06-17 |
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