CA1284207C - Shielding apparatus for a printed circuit board - Google Patents
Shielding apparatus for a printed circuit boardInfo
- Publication number
- CA1284207C CA1284207C CA000532605A CA532605A CA1284207C CA 1284207 C CA1284207 C CA 1284207C CA 000532605 A CA000532605 A CA 000532605A CA 532605 A CA532605 A CA 532605A CA 1284207 C CA1284207 C CA 1284207C
- Authority
- CA
- Canada
- Prior art keywords
- circuit board
- printed circuit
- trace
- circuitry
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
Abstract
ABSTRACT OF THE INVENTION
A shielding apparatus for use on a printed circuit board shields electronic circuitry mounted on the printed circuit board against interfering electric waves. The shielding apparatus com-prises a multi-layer printed circuit board having a circuit trace printed on a middle layer and a ground trace printed on each of the surface layers. Circuity blocks consisting of a plurality of electrical elements are mounted on the top surface of the printed circuit board and are electrically connected to one another by the circuit trace.
Metallic cases are provided on the top and bottom surfaces of the printed circuit board for covering the circuitry blocks and are in contact with the ground trace.
A shielding apparatus for use on a printed circuit board shields electronic circuitry mounted on the printed circuit board against interfering electric waves. The shielding apparatus com-prises a multi-layer printed circuit board having a circuit trace printed on a middle layer and a ground trace printed on each of the surface layers. Circuity blocks consisting of a plurality of electrical elements are mounted on the top surface of the printed circuit board and are electrically connected to one another by the circuit trace.
Metallic cases are provided on the top and bottom surfaces of the printed circuit board for covering the circuitry blocks and are in contact with the ground trace.
Description
4;~7 SHIELDING APPARATUS FOR A PRINTED CIRCUIT BOARD
The present invention relates generally to a shielding appara-tus for use on a printed circuit board and, more particularly, to an apparatus for shielding circuitry on a printed circuit board against disturbances due to interfering electric waves.
BACKGROUND OF TEIE INVENTION
It is well known in some types of electrical apparatus, such as radio apparatus, to provide a shielding structure for the printed cir-cuit board, such as shown in Figures 1 and 2. Figure 1 is a cross sec-tional view of the shielding structure and Figure 2 is a cross sec-tional view of the structure taken along line A-A of Figure 1.
As shown in the figures, printed circuit board 1 comprises a dielectric substrate 11 which serves as a support for the printed wir-ing, including circuit trace 12 and ground trace 13. Ground trace 13 is that portion of the printed wiring which is adapted to be 1~4;~(J7 connected to a source of ground potential and circuit trace 12 is the remainder of the printed wiring on printed circuit board 1 and is usu-ally operated at potentials other than ground potential. Circuit trace 12 is only printed on the bottom surface of dielectric substrate 11 and ground trace 13 is printed on both the top and bottom sur-faces of the dielectric substrate. The top surface of printed circuit board 1 is coated with a material that is resistant to solder, except for a part of the land of circuit trace 12 and a part of ground trace 13 which is in contact with metallic cases 2a and 2b. The method of construction of printed circuit board 1 and the materials from which it is made are well known and will not be discussed here.
Circuitry blocks 3 comprise a plurality of electrical elements, such as transistors, amplifiers, etc., and are mounted on the top sur-face of printed circuit board 1 with the input and output terminals in circuitry blocks 3 being connected to the land of circuit trace 12 with solder via through holes (not shown). Circuitry blocks 3 are also isolated from one another by metallic cases 2a and 2b.
Narrow grooves 2c are formed in a portion of metallic case 2b proximate circuit trace 12 to prevent contact between metallic case 2b and circuit trace 12, as best shown in Figure 2. The portions of metallic cases 2a and 2b adjacent ground trace 13 are held in con-tact with ground trace 13 by securing elements, e.g., screws, (not 4;~0'7 shown). Contacting material 4, formed of an elastic material in-serted into a cylindrical wire netting, is inserted into grooves formed in metallic cases 2a and 2b and is sandwiched between cases 2a and 2b and ground trace 13 to ensure firm contact between ground trace 13 and metallic cases 2a and 2b. The effect of thls arrangement is that each of circuitry blocks 3 is covered by metallic cases 2a and 2b and is shielded against interfering electric waves, such as high fre-quency radio waves, from another circuitry block 3.
As explained above, in the prior art shielding apparatus, it is necessary to form narrow grooves 2c in metallic case 2b to prevent contact between metallic case 2b and circuit trace 12. Because electric waves may be transmitted from one circuitry block to an-other circuitry block via narrow grooves 2c, interference between circuitry blocks may occur, particularly in the case of high fr~
quency radio waves. Ln addition, the manufacturing process is also complicated because of the need to suitably adjust the length of con-tacting material 4, to account for narrow grooves 2c, so that con-tacting material 4 can be positioned within the area between metal-lic case 2b and ground trace 13. It is also necessary in manufactur-ing metallic case 2b to accurately position narrow grooves 2c to pre-vent con~act between metallic case 2b and circuit trace 12.
()7 SUNMARY OF THE INVENTION
It is an object of an aspect of the present invention to provide a shielding apparatus for shielding electric circuitry on a printed circuit board against interfering electric waves.
It is an object of an aspect of the present invention to provide a shielding apparatus which can be easily and inexpensively manufactured.
An aspect of the invention is as follows:
A shielding apparatus for shielding electric circuitry mounted on a printed circuit board against interfering electric waves comprising:
a multi-layer printed circuit board having a circuit trace printed on middle layer:
a first circuitry block mounted on an outer surface of said multi-layer printed circuit board, said first circuitry block being electrically connected to said circuit trace, so that said first circuitry block is connected to at least one other circuitry block mounted on said multi-layer printed circuit block via said circuit trace: and metallic plate means covering said first circuitry block to thereby isolate said first circuitry block from said other circuitry block.
. .
l4~U7 -4a-By way of added explanation, in accordance with an aspect of the present invention, there is provided a shielding apparatus for use on a printed circuit board which shields the electric circuitry from disturbances due to interfering waves. The apparatus comprises a multi-layer printed circuit board including a circuit trace and a ground trace. The circuit trace is printed on a middle surface layer of the circuit board and the ground trace is printed on each of the surface layers.
Circuitry blocks comprising a plurality of electronic circuit elements are mounted on the top surface of the multi-layer printed circuit board and the input and out-put terminals in the circuitry blocks are connected to the circuit trace with solder via through holes. Metal-lic cases are provided for covering the circuitry blocks and portions of each of the metallic cases are in contact with the ground trace, via contacting material, on the top and bottom surfaces of the circuit board. In a preferred embodiment, at least one circuitry block is covered by the metallic A
4;~0~
cases. The covered circuitry block is electrically connected to a second circuitry block via the circuit trace on the middle layer and the second circuitry block may or may not be covered by the metal-lic cases. 8ecause it is not necessary to form narrow grooves in the metallic case to prevent contact with the circuit trace, the cir-cuitry block is effectively shielded.
BREF DESCRlPllON OF THE DRAWINGS
Figure 1 is a cross-sectional view of a shielding apparatus known in the prior art.
Figure 2 is a cross-sectional view taken along line A-A of Fig-ure 1.
Figure 3 is a cross~.ectional view of a shielding apparatus ac-cording to a first embodiment of the present invention.
Figure 4 is a cross~ectional view taken along line B-B of Fig-ure 3.
Figure S is a cross~.ectional view of a shielding apparatus ac-cording to second embodiment of the present invention.
DETAILED DESCRIPTION OF THE PREFERED EMBODIMENT
With reference to Figure 3, there is shown a multi-layer printed circuit board 20, including printed circuit trace 22 and ground trace 23. Circuitry blocks 30 comprising a plurality of elec-tronic elements, such as transistors, amplifiers etc., are mounted on 1~4;~()7 the top surface of printed circuit board 20 and metallic cases 40a, 40b are provided on the top and bottom surfaces of the printed cir-cuit board for shielding circuitry blocks 30. As shown in Figure 4, which is a cross~ectional view taken along line B-B of Figure 3, multi-layer printed circuit 20 comprises dielectric substrates 21 which serve as supports for the printed wiring, including circuit trace 22 and ground trace 23. Circuit trace 22 is printed on a middle layer of multi-layer printed circuit board 20 and ground trace 23 is printed on the top, middle and bottom layers. Ground trace 23 sur-rounds each of circuitry blocks 30 so that circuit trace 22 may also be printed on the top or bottom layers within the area of circuitry blocks 30, if desired.
The top surface of multi-layer printed circuit board 20 is coated with a material that is resistant to solder, except for a part of ground trace 23 which is in contact with metallic cases 40a and 40b. A plurality of through holes 60 are formed in ground trace 23 between circuitry blocks 30 to electrically interconnect ground trace 23 on each of the surface layers and thus increase the shield-ing effect. Through holes 60 are preferably arranged with a separa-tion distance of less than ~l /100, where ~ represents the wave length of shielding. For example, if 1 equals 30 cm. and the fre-quency of shielding is 1,000 MHz, through holes 60 are arranged with ~4;~()7 a separation distance of under 3 mm. (30 cm/100). This technique is well known to those skilled in the art.
The shielding effect in the present arrangement is also enhanced by the fact that circuit trace 22 is sandwiched between ground traces 23. Thus, the arrangement functions like a coaxial cable, such as that used in high frequency radio apparatus, with the ground trace acting as an outer conductor and the circuit trace becoming an inner conductor.
As described above and best shown in Figure 3, metallic cases 40a and 40b are provided on the top and bottom surfaces of printed circuit board 20 and are held in contact with ground trace 23 by securing elements, e.g. screws. In addition, contacting material 50 is inserted into grooves in metallic cases 40a and 40b and sandwiched between metallic cases 40a and 40b and ground trace 23 to ensure firm contact between ground trace 13 and metallic cases 40a and 40b. In this way, each of the circuitry blocks 30 is covered by metallic cases 40a and 40b and is shielded against interfering elec-tric wave from another circuitry block 30.
Figure 5 illustrates a second embodiment of the present invention. In Figure 5, two circuitry blocks 30 are shown which are electrically connected by circuit trace 22. The shielding structure of Figure 5 is substantially identical to that of Figures 3 and 4 1~4~:()7 except that only one of circuitry blocks 30 is covered by metallic cases 40a and 40b.
In the above-described embodiments, through holes 60 are formed in the ground trace between adjacent circuitry blocks 30.
However, it is understood that through holes 60 may be formed wherever ground trace 23 is in contact with metallic cases 40a and 40b. Further, though in the above described embodiments, a three-layer printed circuit board is used, multi-layer printed circuit board 20 may have any number of layers.
This invention has been described in detail in connection with the preferred embodiments. These embodiments are examples only and the invention is not restricted thereto. It will be easily under-stood by those skilled in the art that variations and modifications can be made to the invention within the scope of the appended claims.
The present invention relates generally to a shielding appara-tus for use on a printed circuit board and, more particularly, to an apparatus for shielding circuitry on a printed circuit board against disturbances due to interfering electric waves.
BACKGROUND OF TEIE INVENTION
It is well known in some types of electrical apparatus, such as radio apparatus, to provide a shielding structure for the printed cir-cuit board, such as shown in Figures 1 and 2. Figure 1 is a cross sec-tional view of the shielding structure and Figure 2 is a cross sec-tional view of the structure taken along line A-A of Figure 1.
As shown in the figures, printed circuit board 1 comprises a dielectric substrate 11 which serves as a support for the printed wir-ing, including circuit trace 12 and ground trace 13. Ground trace 13 is that portion of the printed wiring which is adapted to be 1~4;~(J7 connected to a source of ground potential and circuit trace 12 is the remainder of the printed wiring on printed circuit board 1 and is usu-ally operated at potentials other than ground potential. Circuit trace 12 is only printed on the bottom surface of dielectric substrate 11 and ground trace 13 is printed on both the top and bottom sur-faces of the dielectric substrate. The top surface of printed circuit board 1 is coated with a material that is resistant to solder, except for a part of the land of circuit trace 12 and a part of ground trace 13 which is in contact with metallic cases 2a and 2b. The method of construction of printed circuit board 1 and the materials from which it is made are well known and will not be discussed here.
Circuitry blocks 3 comprise a plurality of electrical elements, such as transistors, amplifiers, etc., and are mounted on the top sur-face of printed circuit board 1 with the input and output terminals in circuitry blocks 3 being connected to the land of circuit trace 12 with solder via through holes (not shown). Circuitry blocks 3 are also isolated from one another by metallic cases 2a and 2b.
Narrow grooves 2c are formed in a portion of metallic case 2b proximate circuit trace 12 to prevent contact between metallic case 2b and circuit trace 12, as best shown in Figure 2. The portions of metallic cases 2a and 2b adjacent ground trace 13 are held in con-tact with ground trace 13 by securing elements, e.g., screws, (not 4;~0'7 shown). Contacting material 4, formed of an elastic material in-serted into a cylindrical wire netting, is inserted into grooves formed in metallic cases 2a and 2b and is sandwiched between cases 2a and 2b and ground trace 13 to ensure firm contact between ground trace 13 and metallic cases 2a and 2b. The effect of thls arrangement is that each of circuitry blocks 3 is covered by metallic cases 2a and 2b and is shielded against interfering electric waves, such as high fre-quency radio waves, from another circuitry block 3.
As explained above, in the prior art shielding apparatus, it is necessary to form narrow grooves 2c in metallic case 2b to prevent contact between metallic case 2b and circuit trace 12. Because electric waves may be transmitted from one circuitry block to an-other circuitry block via narrow grooves 2c, interference between circuitry blocks may occur, particularly in the case of high fr~
quency radio waves. Ln addition, the manufacturing process is also complicated because of the need to suitably adjust the length of con-tacting material 4, to account for narrow grooves 2c, so that con-tacting material 4 can be positioned within the area between metal-lic case 2b and ground trace 13. It is also necessary in manufactur-ing metallic case 2b to accurately position narrow grooves 2c to pre-vent con~act between metallic case 2b and circuit trace 12.
()7 SUNMARY OF THE INVENTION
It is an object of an aspect of the present invention to provide a shielding apparatus for shielding electric circuitry on a printed circuit board against interfering electric waves.
It is an object of an aspect of the present invention to provide a shielding apparatus which can be easily and inexpensively manufactured.
An aspect of the invention is as follows:
A shielding apparatus for shielding electric circuitry mounted on a printed circuit board against interfering electric waves comprising:
a multi-layer printed circuit board having a circuit trace printed on middle layer:
a first circuitry block mounted on an outer surface of said multi-layer printed circuit board, said first circuitry block being electrically connected to said circuit trace, so that said first circuitry block is connected to at least one other circuitry block mounted on said multi-layer printed circuit block via said circuit trace: and metallic plate means covering said first circuitry block to thereby isolate said first circuitry block from said other circuitry block.
. .
l4~U7 -4a-By way of added explanation, in accordance with an aspect of the present invention, there is provided a shielding apparatus for use on a printed circuit board which shields the electric circuitry from disturbances due to interfering waves. The apparatus comprises a multi-layer printed circuit board including a circuit trace and a ground trace. The circuit trace is printed on a middle surface layer of the circuit board and the ground trace is printed on each of the surface layers.
Circuitry blocks comprising a plurality of electronic circuit elements are mounted on the top surface of the multi-layer printed circuit board and the input and out-put terminals in the circuitry blocks are connected to the circuit trace with solder via through holes. Metal-lic cases are provided for covering the circuitry blocks and portions of each of the metallic cases are in contact with the ground trace, via contacting material, on the top and bottom surfaces of the circuit board. In a preferred embodiment, at least one circuitry block is covered by the metallic A
4;~0~
cases. The covered circuitry block is electrically connected to a second circuitry block via the circuit trace on the middle layer and the second circuitry block may or may not be covered by the metal-lic cases. 8ecause it is not necessary to form narrow grooves in the metallic case to prevent contact with the circuit trace, the cir-cuitry block is effectively shielded.
BREF DESCRlPllON OF THE DRAWINGS
Figure 1 is a cross-sectional view of a shielding apparatus known in the prior art.
Figure 2 is a cross-sectional view taken along line A-A of Fig-ure 1.
Figure 3 is a cross~.ectional view of a shielding apparatus ac-cording to a first embodiment of the present invention.
Figure 4 is a cross~ectional view taken along line B-B of Fig-ure 3.
Figure S is a cross~.ectional view of a shielding apparatus ac-cording to second embodiment of the present invention.
DETAILED DESCRIPTION OF THE PREFERED EMBODIMENT
With reference to Figure 3, there is shown a multi-layer printed circuit board 20, including printed circuit trace 22 and ground trace 23. Circuitry blocks 30 comprising a plurality of elec-tronic elements, such as transistors, amplifiers etc., are mounted on 1~4;~()7 the top surface of printed circuit board 20 and metallic cases 40a, 40b are provided on the top and bottom surfaces of the printed cir-cuit board for shielding circuitry blocks 30. As shown in Figure 4, which is a cross~ectional view taken along line B-B of Figure 3, multi-layer printed circuit 20 comprises dielectric substrates 21 which serve as supports for the printed wiring, including circuit trace 22 and ground trace 23. Circuit trace 22 is printed on a middle layer of multi-layer printed circuit board 20 and ground trace 23 is printed on the top, middle and bottom layers. Ground trace 23 sur-rounds each of circuitry blocks 30 so that circuit trace 22 may also be printed on the top or bottom layers within the area of circuitry blocks 30, if desired.
The top surface of multi-layer printed circuit board 20 is coated with a material that is resistant to solder, except for a part of ground trace 23 which is in contact with metallic cases 40a and 40b. A plurality of through holes 60 are formed in ground trace 23 between circuitry blocks 30 to electrically interconnect ground trace 23 on each of the surface layers and thus increase the shield-ing effect. Through holes 60 are preferably arranged with a separa-tion distance of less than ~l /100, where ~ represents the wave length of shielding. For example, if 1 equals 30 cm. and the fre-quency of shielding is 1,000 MHz, through holes 60 are arranged with ~4;~()7 a separation distance of under 3 mm. (30 cm/100). This technique is well known to those skilled in the art.
The shielding effect in the present arrangement is also enhanced by the fact that circuit trace 22 is sandwiched between ground traces 23. Thus, the arrangement functions like a coaxial cable, such as that used in high frequency radio apparatus, with the ground trace acting as an outer conductor and the circuit trace becoming an inner conductor.
As described above and best shown in Figure 3, metallic cases 40a and 40b are provided on the top and bottom surfaces of printed circuit board 20 and are held in contact with ground trace 23 by securing elements, e.g. screws. In addition, contacting material 50 is inserted into grooves in metallic cases 40a and 40b and sandwiched between metallic cases 40a and 40b and ground trace 23 to ensure firm contact between ground trace 13 and metallic cases 40a and 40b. In this way, each of the circuitry blocks 30 is covered by metallic cases 40a and 40b and is shielded against interfering elec-tric wave from another circuitry block 30.
Figure 5 illustrates a second embodiment of the present invention. In Figure 5, two circuitry blocks 30 are shown which are electrically connected by circuit trace 22. The shielding structure of Figure 5 is substantially identical to that of Figures 3 and 4 1~4~:()7 except that only one of circuitry blocks 30 is covered by metallic cases 40a and 40b.
In the above-described embodiments, through holes 60 are formed in the ground trace between adjacent circuitry blocks 30.
However, it is understood that through holes 60 may be formed wherever ground trace 23 is in contact with metallic cases 40a and 40b. Further, though in the above described embodiments, a three-layer printed circuit board is used, multi-layer printed circuit board 20 may have any number of layers.
This invention has been described in detail in connection with the preferred embodiments. These embodiments are examples only and the invention is not restricted thereto. It will be easily under-stood by those skilled in the art that variations and modifications can be made to the invention within the scope of the appended claims.
Claims (4)
1. A shielding apparatus for shielding electric circuitry mounted on a printed circuit board against interfering electric waves comprising:
a multi-layer printed circuit board having a circuit trace printed on middle layer;
a first circuitry block mounted on an outer surface of said multi-layer printed circuit board, said first circuitry block being electrically connected to said circuit trace, so that said first circuitry block is connected to at least one other circuitry block mounted on said multi-layer printed circuit block via said circuit trace: and metallic plate means covering said first circuitry block to thereby isolate said first circuitry block from said other circuitry block.
a multi-layer printed circuit board having a circuit trace printed on middle layer;
a first circuitry block mounted on an outer surface of said multi-layer printed circuit board, said first circuitry block being electrically connected to said circuit trace, so that said first circuitry block is connected to at least one other circuitry block mounted on said multi-layer printed circuit block via said circuit trace: and metallic plate means covering said first circuitry block to thereby isolate said first circuitry block from said other circuitry block.
2. A shielding apparatus according to Claim 1 wherein said multi-layer printed circuit board further includes a ground trace printed on each of the outer surface layers of the circuit board, said ground trace being in contact with said metallic means.
3. A shielding apparatus according to Claim 2 further comprising a contacting material sandwiched between and contacting both said ground trace and said metallic means to ensure firm contact between the ground trace and the metallic means.
4. A shielding apparatus according to Claim 1 wherein said first circuitry block is mounted on the top surface layer of said printed circuit board and said metallic means comprises first and second metallic means, said first metallic means covering said first circuitry block and said second metallic means being provided on the bottom surface layer of the printed circuit board at a location corresponding to the location of said first metallic means.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986041632U JPH0627995Y2 (en) | 1986-03-20 | 1986-03-20 | Shield structure |
| JPU-61-41632 | 1986-03-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1284207C true CA1284207C (en) | 1991-05-14 |
Family
ID=12613705
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000532605A Expired - Lifetime CA1284207C (en) | 1986-03-20 | 1987-03-20 | Shielding apparatus for a printed circuit board |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4739453A (en) |
| JP (1) | JPH0627995Y2 (en) |
| KR (1) | KR900007859Y1 (en) |
| CA (1) | CA1284207C (en) |
Families Citing this family (69)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0669120B2 (en) * | 1986-06-20 | 1994-08-31 | 松下電器産業株式会社 | Shield device |
| FI82169C (en) * | 1987-08-21 | 1991-01-10 | Nokia Mobira Oy | RF-SKYDDAD HYBRIDKRETS. |
| JPS6480094A (en) * | 1987-09-19 | 1989-03-24 | Nippon Cmk Kk | Printed wiring board |
| DE3823469A1 (en) * | 1988-07-11 | 1990-01-18 | Bodenseewerk Geraetetech | FILTER ARRANGEMENT |
| JPH02187093A (en) * | 1989-01-13 | 1990-07-23 | Toshiba Corp | Printed wiring board |
| IT1231457B (en) * | 1989-04-03 | 1991-12-07 | Selenia Spazio Spa | PROCEDURE FOR THE REALIZATION OF THE MASSING OF MULTI-LAYER INSULATIONS (THERMAL BLANKETS) FOR SPATIAL APPLICATIONS |
| US5107404A (en) * | 1989-09-14 | 1992-04-21 | Astec International Ltd. | Circuit board assembly for a cellular telephone system or the like |
| GB2237147A (en) * | 1989-10-13 | 1991-04-24 | Electricity Council | Printed circuit board arrangement. |
| FR2654891A1 (en) * | 1989-11-20 | 1991-05-24 | Alcatel Radiotelephone | SHIELD FOR RADIO FREQUENCY CIRCUIT. |
| US5043848A (en) * | 1990-02-01 | 1991-08-27 | Cryptec, Inc. | Shielded printed circuit board |
| JPH06505597A (en) * | 1991-03-04 | 1994-06-23 | モトローラ・インコーポレーテッド | Shielding device for non-conductive electronic circuit packages |
| FR2674078B1 (en) * | 1991-03-12 | 1994-10-07 | Thomson Trt Defense | MICROWAVE TRANSCEIVER USING MULTI-LAYER PRINTED CIRCUIT TECHNIQUE. |
| US5166864A (en) * | 1991-05-17 | 1992-11-24 | Hughes Aircraft Company | Protected circuit card assembly and process |
| US5165055A (en) * | 1991-06-28 | 1992-11-17 | Digital Equipment Corporation | Method and apparatus for a PCB and I/O integrated electromagnetic containment |
| EP0682322B1 (en) * | 1991-09-09 | 2001-09-26 | Itt Manufacturing Enterprises, Inc. | An IC card |
| JPH05243774A (en) * | 1991-09-23 | 1993-09-21 | Otis Elevator Co | Emi filter for printed circuit board and shield device |
| FI915242A (en) * | 1991-11-06 | 1993-05-07 | Nokia Mobile Phones Ltd | Rf-screening of the kretskort |
| US5252782A (en) * | 1992-06-29 | 1993-10-12 | E-Systems, Inc. | Apparatus for providing RFI/EMI isolation between adjacent circuit areas on a single circuit board |
| US5369552A (en) * | 1992-07-14 | 1994-11-29 | Ncr Corporation | Multi-chip module with multiple compartments |
| US5397861A (en) * | 1992-10-21 | 1995-03-14 | Mupac Corporation | Electrical interconnection board |
| JPH06164265A (en) * | 1992-11-16 | 1994-06-10 | Toshiba Corp | Microwave amplifier |
| US5376759A (en) * | 1993-06-24 | 1994-12-27 | Northern Telecom Limited | Multiple layer printed circuit board |
| US5383097A (en) * | 1993-10-27 | 1995-01-17 | Welch Allyn, Inc. | Conductive path ESD shield |
| DE4407492A1 (en) * | 1994-03-07 | 1995-09-14 | Bodenseewerk Geraetetech | Device for shielding electronic components arranged on an electronic card against external electromagnetic fields |
| FR2720216B1 (en) * | 1994-05-18 | 1996-06-14 | Snecma | Protection device for an electronic device sensitive to electromagnetic radiation. |
| JPH088573A (en) * | 1994-06-21 | 1996-01-12 | Nec Corp | Structure for shield case |
| ES2122491T3 (en) * | 1995-02-24 | 1998-12-16 | Hewlett Packard Co | DEVICE TO PREVENT ELECTROMAGNETIC INTERFERENCE. |
| JP2785753B2 (en) * | 1995-06-30 | 1998-08-13 | 日本電気株式会社 | High frequency shield structure and method of manufacturing printed board used for high frequency shield structure |
| DE29514398U1 (en) * | 1995-09-07 | 1995-10-19 | Siemens Ag | Shielding for printed circuit boards |
| EP0986293A1 (en) * | 1998-09-08 | 2000-03-15 | Lucent Technologies Inc. | Radio frequency electronic apparatus |
| US6037846A (en) * | 1998-10-09 | 2000-03-14 | Nortel Networks Corporation | Surface mount EMI gasket filter |
| TW379824U (en) * | 1998-12-28 | 2000-01-11 | Foxconn Prec Components Co Ltd | Heat radiating apparatus |
| US6219258B1 (en) | 1999-01-29 | 2001-04-17 | Ericsson Inc. | Electronic enclosure with improved environmental protection |
| US6483719B1 (en) * | 2000-03-21 | 2002-11-19 | Spraylat Corporation | Conforming shielded form for electronic component assemblies |
| JP2002094689A (en) * | 2000-06-07 | 2002-03-29 | Sony Computer Entertainment Inc | Program execution system, program execution device, relay device, and recording medium |
| US6949992B2 (en) * | 2002-03-20 | 2005-09-27 | Powerwave Technologies, Inc. | System and method of providing highly isolated radio frequency interconnections |
| FR2840505A1 (en) * | 2002-05-31 | 2003-12-05 | Thomson Multimedia Broadband F | SHIELDING DEVICE FOR PRINTED CIRCUIT BOARDS |
| US20040048420A1 (en) * | 2002-06-25 | 2004-03-11 | Miller Ronald Brooks | Method for embedding an air dielectric transmission line in a printed wiring board(PCB) |
| DE10228981A1 (en) * | 2002-06-28 | 2004-01-15 | Automotive Lighting Reutlingen Gmbh | Electromagnetic screening device for electrical modules e.g. in motor vehicle, has electromagnetically screening housing enclosing screening chambers that are formed integrally with housing |
| US7109830B2 (en) * | 2002-08-26 | 2006-09-19 | Powerwave Technologies, Inc. | Low cost highly isolated RF coupler |
| WO2004032588A1 (en) * | 2002-10-03 | 2004-04-15 | Amplus Communication Pte Ltd | Radio frequency transceivers |
| DE50306934D1 (en) * | 2003-01-03 | 2007-05-10 | Rohde & Schwarz | METER MODULES AND MEASURING DEVICE |
| US7005573B2 (en) | 2003-02-13 | 2006-02-28 | Parker-Hannifin Corporation | Composite EMI shield |
| US7326862B2 (en) * | 2003-02-13 | 2008-02-05 | Parker-Hannifin Corporation | Combination metal and plastic EMI shield |
| US7120398B2 (en) * | 2003-09-18 | 2006-10-10 | Kyocera Wireless Corp. | Mobile communication devices having high frequency noise reduction and methods of making such devices |
| US20050236171A1 (en) * | 2004-04-23 | 2005-10-27 | Garcia Jorge L | Shield frame for a radio frequency shielding assembly |
| FR2870429B1 (en) * | 2004-05-11 | 2006-07-28 | Sagem | SHIELDING DEVICE FOR RADIO ELECTRONIC MODULE |
| JP4454388B2 (en) * | 2004-05-20 | 2010-04-21 | 日本電気株式会社 | Semiconductor module |
| CN1707698A (en) * | 2004-06-12 | 2005-12-14 | 鸿富锦精密工业（深圳）有限公司 | Electronic device capable of shielding electromagnetic interference |
| JP4556174B2 (en) * | 2004-12-15 | 2010-10-06 | 日本電気株式会社 | Portable terminal device and heat dissipation method |
| US7446265B2 (en) * | 2005-04-15 | 2008-11-04 | Parker Hannifin Corporation | Board level shielding module |
| NL1030295C2 (en) * | 2005-10-28 | 2007-05-03 | Fei Co | Hermetically sealed housing with electrical lead-through. |
| US7733659B2 (en) | 2006-08-18 | 2010-06-08 | Delphi Technologies, Inc. | Lightweight audio system for automotive applications and method |
| US9237685B2 (en) | 2006-08-18 | 2016-01-12 | Delphi Technologies, Inc. | Lightweight audio system for automotive applications and method |
| US8305773B2 (en) | 2006-08-18 | 2012-11-06 | Delphi Technologies, Inc. | Lightweight audio system for automotive applications and method |
| US8264856B2 (en) | 2006-08-18 | 2012-09-11 | Delphi Technologies, Inc. | Lightweight audio system for automotive: applications and method |
| DE102009007123B4 (en) * | 2009-02-02 | 2011-05-19 | Bavaria Digital Technik Gmbh | Housing for receiving electrical components |
| TWM380706U (en) * | 2009-12-10 | 2010-05-11 | Wistron Corp | Metal shielding casing and the combination thereof with circuit board |
| US8599575B1 (en) | 2010-02-03 | 2013-12-03 | DJM Electronics, Inc | Methods, devices, and systems for filtering electromagnetic interference |
| JP6138410B2 (en) * | 2011-03-14 | 2017-05-31 | 三菱電機株式会社 | High frequency module |
| TW201351175A (en) * | 2012-06-01 | 2013-12-16 | Wistron Corp | Circuit layout method for printed circuit board, eletronic device and computer readable recording media |
| JP5622906B1 (en) * | 2013-08-09 | 2014-11-12 | 太陽誘電株式会社 | Circuit module manufacturing method |
| KR102172314B1 (en) * | 2013-11-12 | 2020-10-30 | 삼성전자주식회사 | Semiconductor device |
| KR20160126160A (en) * | 2015-04-22 | 2016-11-02 | 삼성디스플레이 주식회사 | Display device and manufacturing method thereof |
| WO2018010814A1 (en) * | 2016-07-15 | 2018-01-18 | Hewlett-Packard Development Company, L.P. | Electrical device and shielding method |
| KR102425999B1 (en) * | 2017-03-17 | 2022-07-28 | 삼성전자주식회사 | Electronic device for including shield can |
| CN110463372A (en) * | 2017-03-30 | 2019-11-15 | 日立汽车系统株式会社 | Electronic control unit |
| JP2021039958A (en) * | 2017-10-26 | 2021-03-11 | 株式会社村田製作所 | Internal constitution of electronic apparatus |
| JP6584569B1 (en) * | 2018-04-06 | 2019-10-02 | 三菱電機株式会社 | Printed board |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3680005A (en) * | 1966-03-24 | 1972-07-25 | Burroughs Corp | Integral electrical power distribution network having stacked plural circuit planes of differing characteristic impedance with intermediate ground plane for separating circuit planes |
| US3533023A (en) * | 1967-09-19 | 1970-10-06 | Motorola Inc | Multilayered circuitry interconnections with integral shields |
| JPS5887896A (en) * | 1981-11-20 | 1983-05-25 | アルプス電気株式会社 | Assembling structure of high frequency circuit device |
| US4498122A (en) * | 1982-12-29 | 1985-02-05 | At&T Bell Laboratories | High-speed, high pin-out LSI chip package |
| JPS59180514A (en) * | 1983-03-31 | 1984-10-13 | Toshiba Corp | Light receiving module |
| JPS60109362U (en) * | 1983-12-28 | 1985-07-25 | アルプス電気株式会社 | Earth structure of multilayer printed circuit board |
-
1986
- 1986-03-20 JP JP1986041632U patent/JPH0627995Y2/en not_active Expired - Lifetime
-
1987
- 1987-03-18 KR KR2019870003438U patent/KR900007859Y1/en not_active IP Right Cessation
- 1987-03-19 US US07/027,879 patent/US4739453A/en not_active Expired - Lifetime
- 1987-03-20 CA CA000532605A patent/CA1284207C/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| KR900007859Y1 (en) | 1990-08-24 |
| KR870015683U (en) | 1987-10-26 |
| JPS62154697U (en) | 1987-10-01 |
| JPH0627995Y2 (en) | 1994-07-27 |
| US4739453A (en) | 1988-04-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA1284207C (en) | Shielding apparatus for a printed circuit board | |
| US4954929A (en) | Multi-layer circuit board that suppresses radio frequency interference from high frequency signals | |
| US5488540A (en) | Printed circuit board for reducing noise | |
| US7518884B2 (en) | Tailoring impedances of conductive traces in a circuit board | |
| US5150086A (en) | Filter and electrical connector with filter | |
| US5120258A (en) | Low inductance shielded cable to printed circuit board connection apparatus | |
| JP3786746B2 (en) | Shielding assembly and shielding method suitable for use in a communication device | |
| US6777620B1 (en) | Circuit board | |
| US6473314B1 (en) | RF power amplifier assembly employing multi-layer RF blocking filter | |
| KR100700235B1 (en) | Printed circuit board arrangement with a multipole plug-in connector | |
| CA2146139A1 (en) | Electromagnetic radiation reduction technique using grounded conductive traces circumscribing internal planes of printed circuit boards | |
| EP0193156B1 (en) | Flexible cable and method of manufacturing thereof | |
| US4945323A (en) | Filter arrangement | |
| WO2005065000B1 (en) | Electromagnetically shielded slot transmission line | |
| US20050174749A1 (en) | Integrated filter construction | |
| US7269032B2 (en) | Shielding for EMI-sensitive electronic components and or circuits of electronic devices | |
| JPH08242078A (en) | Printed board | |
| JPH08204377A (en) | Shielding body | |
| JP3082579B2 (en) | Shield case | |
| US5880938A (en) | Circuit board with screening arrangement against electromagnetic interference | |
| JPH05129789A (en) | Electronic equipment shielding structure | |
| JPH0720943Y2 (en) | Multilayer printed wiring board | |
| JPH09148776A (en) | Module structure for electronic device | |
| JPS58123201A (en) | Shield structure of microwave circuit | |
| KR200302854Y1 (en) | Splitter |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |