CA1313216C - Silicon micromachined compound nozzle - Google Patents
Silicon micromachined compound nozzleInfo
- Publication number
- CA1313216C CA1313216C CA000603191A CA603191A CA1313216C CA 1313216 C CA1313216 C CA 1313216C CA 000603191 A CA000603191 A CA 000603191A CA 603191 A CA603191 A CA 603191A CA 1313216 C CA1313216 C CA 1313216C
- Authority
- CA
- Canada
- Prior art keywords
- plate
- opening
- silicon
- openings
- fluid flow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/34—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to influence the nature of flow of the liquid or other fluent material, e.g. to produce swirl
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02M—SUPPLYING COMBUSTION ENGINES IN GENERAL WITH COMBUSTIBLE MIXTURES OR CONSTITUENTS THEREOF
- F02M61/00—Fuel-injectors not provided for in groups F02M39/00 - F02M57/00 or F02M67/00
- F02M61/16—Details not provided for in, or of interest apart from, the apparatus of groups F02M61/02 - F02M61/14
- F02M61/18—Injection nozzles, e.g. having valve seats; Details of valve member seated ends, not otherwise provided for
- F02M61/1853—Orifice plates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49428—Gas and water specific plumbing component making
- Y10T29/49432—Nozzle making
Abstract
ABSTRACT OF THE DISCLOSURE
A silicon compound nozzle has two generally planar parallel plates with offset openings coupled by a shear gap. Fluid flow in the shear gap is generally parallel to the plates and increases fluid dispersion.
A silicon compound nozzle has two generally planar parallel plates with offset openings coupled by a shear gap. Fluid flow in the shear gap is generally parallel to the plates and increases fluid dispersion.
Description
~32~L6 This invention relates to micromachlned silicon nozzles.
Silicon nozzles of various types are known for controlling fluid flow. For exa~ple, u.æ. Patent No~
4,007,464 issued to Bassou~ teaches the use o~ a si~gle silicon plate with ope~ing~ therethrough for controlling fluid flow.
U.S. Patent No. 4,628,576 issuad to Giachino et al and assiyned to the assignee her~o~ teaches a valve wherein two ~ilicon plates move with re~pect to each other and control fluid ~low through an openiny in one of the silicon plates.
In applîcations such as injecting fluid into combustion cylinders it is often desirable to have a very fine atomized disp~rsed fuel spray. Although ~nown nozzles provide some such atomizati~n, improvement~
would be desired. Further, it would be desirable to have a relatively simple nozæle structure which is easily fabricated to produce such a spray. These are some o~ the problems which this invenk~on oYerCome~.
In accordance wikh one a~p~ct o~ th~ pr~sent invention, th~re is providad a silicon compound nozzle for guiding ~luid ~low, including a first and a ~econ~
generally planar ~ilicon plate with opani.ng~ ~or guiding ~luid flow, with the second Rilicon plate ad~acent to, parall~l to and in fixed r(ilationship to th~ first silicon plate. A first opening in the first ilicon plate is offset ~rom a second opening in ~he second silicon plate. In the area between the first and second openings the silicon plates have a reduced thickness so as to form a ~hear gap for shear fluid flow substantially parallel to the plane of the fir~t and ~econd plates. Such shear flow cau~es turbulence and fluid di~persion advan~ageous ~or a~omizing fuel in ,. . .,~,~, . .
... .
`` 1~132~6 a combustion cylinder. In one embodimen~, two ~hear flows are opposed to each other and collide 60 as ko increase fluid dispersion.
A nozzle in aacordance with an embodiment of this i~ention is advantageous because it is relatively ea~ily ~abricated using silicon mirromachining techniques and produces a fluid flow with a hlgh velocity exiting characteristic.
In another aspect, the present invention provides a method of forming a fixed gap compound silicon nozzle, including forming a gen~rally planar first silicon plate with an opening; forming a generally planar second silicon plate with a second opening, offset from the first opening, the serond plate being held in a fixed relationship to said first plate;
forming a fixed gap fluid flow path between the first and the second opening at the interface between the first and second silicon plates.
The invention is described further, by way of illustration, with reference ~o the accompanying drawings, in which:
Figur~ 1 is a plan view of a compound nozzle aæ~embly in accordance with an embodiment o~ this invention;
Figure 2 i~ a ~ection along ~-2 o~ Figure l;
Figure 3 i~ a p~rspective, partly broken away view o~ tha nozzle ass~mbly of Figure 1;
Figure 4 is a tOpl p~rspective view o~ the flow plate o~ the nozzle ass~mbl.y of Figure 3 in accordance with an embodiment o~ this i~vention;
Figure 5 is a bot~om perspective view of the flow plate of Figure 4 in accordance with an embodiment of this in~ention:
Figure 6 is a top peræpective view of the ori~ice plate o~ the nozzle assembly o~ Figure 3 in accordance with an embodiment of this inventi~n; and , ~` ~3~32~
Pigure 7 is a persE~ective view of the bo~tom side of the oriïics~ plate o~ Figure 6.
Referring to Figures 1, 2 and 3, a compourld silicon nozzle assembly includes a ~enerally planar flow 5 plate 10 cooperating with a gensrally planar ori~ice ~ '''"' ' -', ' ,` :, ':~,.
.,:. "~ :,,.`
.
~3132~6 plate 30. Flow plate 10 is a symmetrical square silicon member with supply orifices 11, 12, 13 and 14 formed through flow plate 10 and positioned about the center of flow plate lO. Each opening has its longer side parallel to the closest edye 4f flow plate 10.
As shown in Figures 2, 4 and 5 the surface of flow plate lO facing orifice plate 30 has a generally rectangular annular trough 15 formed around a mesa 16 and spaced from the edges o ~low plate lO.
Figures 6 and 7 show orifice plate 30.
central exhaust orifice 31 is formed through the middle of orîfice plate 30 and tapers so as to have increasing cross-sectional area with increasing distance from the top surface of orifice plate 30 which faces flow plate lO. A raised wall 33 e~tends around the edge of orifice plate 30. Wall 33 of orifice plate 30 abuts the perimeter portion of flow plate 10 adjacent trough 15. A
recessed sh~ar orifice portion 32 of orifice plate 30 is bounded by wall 33 so that when orifice plate 30 is placed adjacent to flow plate 10, oriice plate 30 doss not touch flow plate lO within the boundaries of wall 33.
Re~erring to ~igure 2, exhaust oriEice 31 of orifice plate 30 is aligned with flow mesa 16 of 10w plate 10. Recessed shear ori~ice portion 32 spaces adjacent surfaces of orifice plat~ 30 from ~low plate 10. Each of suppl~ oriEice 11, 12, 13 and 14 acts in conjunction with trough 15 to provide a fluid flow to shear ori~ice portion 32 and then through exhaust orifice 31 thereby passing through the combination of flow plate 10 and orifice plate 30.
As can best be seen in Figure 2, the size of.
e~haust orifice 31 adjacent mesa 16 is smaller than the size of mesa 16. A shear gap is formed to the extent to which mesa 16 extends over shear orifice portion 32 of .
. .
~ 3~32~
orifice plate 30. For example, ater fluid flow enters supply orifice 14 it enters trough 15 and has a generally horizontal 10w adjacent shear ori~ice portion 32 beore passing through exhaust orifice 31.
To fabricate the co~pound nozzle assembly, two separate silicon plate configurations are micromachined and then bonded together. Fabrication includes known masking techniques of silicon wafers which are then exposed to etching to produce the orifices. The tapering nature of the orifices is a result of etching from one side. A typical taper is the etch angle for silicon material with a clO0> crystallographic orientation.
Double tapers, such as found in the combination of trough 15 and supply orifices 11, 12, 13 and 14 are the result of double sided etching. Mesa 16 is formed by masking and protecting the mesa area during etching. Similarly, wall 33 is formed by masking and protecting the area of wall 33 during etching of shear orifice portion 32.
Shear orifice 32 and e~haust ori~ice 31 are etched from opposing sides so that they have opposing tapers. The fluid shear gap is produced by the overlap o~ the mesa and the bottom plate adjacent the exhaust oriice. This gap determines the flow rate and dispersion characteristics of the nozzle for ~lui~ ~low at a given pressure.
Various moclifications and variations will no doubt occur to those skilled in the art to which this invention pertains. For e~ample, the particular shape of the openings can be varied from that disclosed herein.
These and all other variations which basically xely on the teachings through which this disclosure has advanced the art are properly considered within the scope of this invention.
Silicon nozzles of various types are known for controlling fluid flow. For exa~ple, u.æ. Patent No~
4,007,464 issued to Bassou~ teaches the use o~ a si~gle silicon plate with ope~ing~ therethrough for controlling fluid flow.
U.S. Patent No. 4,628,576 issuad to Giachino et al and assiyned to the assignee her~o~ teaches a valve wherein two ~ilicon plates move with re~pect to each other and control fluid ~low through an openiny in one of the silicon plates.
In applîcations such as injecting fluid into combustion cylinders it is often desirable to have a very fine atomized disp~rsed fuel spray. Although ~nown nozzles provide some such atomizati~n, improvement~
would be desired. Further, it would be desirable to have a relatively simple nozæle structure which is easily fabricated to produce such a spray. These are some o~ the problems which this invenk~on oYerCome~.
In accordance wikh one a~p~ct o~ th~ pr~sent invention, th~re is providad a silicon compound nozzle for guiding ~luid ~low, including a first and a ~econ~
generally planar ~ilicon plate with opani.ng~ ~or guiding ~luid flow, with the second Rilicon plate ad~acent to, parall~l to and in fixed r(ilationship to th~ first silicon plate. A first opening in the first ilicon plate is offset ~rom a second opening in ~he second silicon plate. In the area between the first and second openings the silicon plates have a reduced thickness so as to form a ~hear gap for shear fluid flow substantially parallel to the plane of the fir~t and ~econd plates. Such shear flow cau~es turbulence and fluid di~persion advan~ageous ~or a~omizing fuel in ,. . .,~,~, . .
... .
`` 1~132~6 a combustion cylinder. In one embodimen~, two ~hear flows are opposed to each other and collide 60 as ko increase fluid dispersion.
A nozzle in aacordance with an embodiment of this i~ention is advantageous because it is relatively ea~ily ~abricated using silicon mirromachining techniques and produces a fluid flow with a hlgh velocity exiting characteristic.
In another aspect, the present invention provides a method of forming a fixed gap compound silicon nozzle, including forming a gen~rally planar first silicon plate with an opening; forming a generally planar second silicon plate with a second opening, offset from the first opening, the serond plate being held in a fixed relationship to said first plate;
forming a fixed gap fluid flow path between the first and the second opening at the interface between the first and second silicon plates.
The invention is described further, by way of illustration, with reference ~o the accompanying drawings, in which:
Figur~ 1 is a plan view of a compound nozzle aæ~embly in accordance with an embodiment o~ this invention;
Figure 2 i~ a ~ection along ~-2 o~ Figure l;
Figure 3 i~ a p~rspective, partly broken away view o~ tha nozzle ass~mbly of Figure 1;
Figure 4 is a tOpl p~rspective view o~ the flow plate o~ the nozzle ass~mbl.y of Figure 3 in accordance with an embodiment o~ this i~vention;
Figure 5 is a bot~om perspective view of the flow plate of Figure 4 in accordance with an embodiment of this in~ention:
Figure 6 is a top peræpective view of the ori~ice plate o~ the nozzle assembly o~ Figure 3 in accordance with an embodiment of this inventi~n; and , ~` ~3~32~
Pigure 7 is a persE~ective view of the bo~tom side of the oriïics~ plate o~ Figure 6.
Referring to Figures 1, 2 and 3, a compourld silicon nozzle assembly includes a ~enerally planar flow 5 plate 10 cooperating with a gensrally planar ori~ice ~ '''"' ' -', ' ,` :, ':~,.
.,:. "~ :,,.`
.
~3132~6 plate 30. Flow plate 10 is a symmetrical square silicon member with supply orifices 11, 12, 13 and 14 formed through flow plate 10 and positioned about the center of flow plate lO. Each opening has its longer side parallel to the closest edye 4f flow plate 10.
As shown in Figures 2, 4 and 5 the surface of flow plate lO facing orifice plate 30 has a generally rectangular annular trough 15 formed around a mesa 16 and spaced from the edges o ~low plate lO.
Figures 6 and 7 show orifice plate 30.
central exhaust orifice 31 is formed through the middle of orîfice plate 30 and tapers so as to have increasing cross-sectional area with increasing distance from the top surface of orifice plate 30 which faces flow plate lO. A raised wall 33 e~tends around the edge of orifice plate 30. Wall 33 of orifice plate 30 abuts the perimeter portion of flow plate 10 adjacent trough 15. A
recessed sh~ar orifice portion 32 of orifice plate 30 is bounded by wall 33 so that when orifice plate 30 is placed adjacent to flow plate 10, oriice plate 30 doss not touch flow plate lO within the boundaries of wall 33.
Re~erring to ~igure 2, exhaust oriEice 31 of orifice plate 30 is aligned with flow mesa 16 of 10w plate 10. Recessed shear ori~ice portion 32 spaces adjacent surfaces of orifice plat~ 30 from ~low plate 10. Each of suppl~ oriEice 11, 12, 13 and 14 acts in conjunction with trough 15 to provide a fluid flow to shear ori~ice portion 32 and then through exhaust orifice 31 thereby passing through the combination of flow plate 10 and orifice plate 30.
As can best be seen in Figure 2, the size of.
e~haust orifice 31 adjacent mesa 16 is smaller than the size of mesa 16. A shear gap is formed to the extent to which mesa 16 extends over shear orifice portion 32 of .
. .
~ 3~32~
orifice plate 30. For example, ater fluid flow enters supply orifice 14 it enters trough 15 and has a generally horizontal 10w adjacent shear ori~ice portion 32 beore passing through exhaust orifice 31.
To fabricate the co~pound nozzle assembly, two separate silicon plate configurations are micromachined and then bonded together. Fabrication includes known masking techniques of silicon wafers which are then exposed to etching to produce the orifices. The tapering nature of the orifices is a result of etching from one side. A typical taper is the etch angle for silicon material with a clO0> crystallographic orientation.
Double tapers, such as found in the combination of trough 15 and supply orifices 11, 12, 13 and 14 are the result of double sided etching. Mesa 16 is formed by masking and protecting the mesa area during etching. Similarly, wall 33 is formed by masking and protecting the area of wall 33 during etching of shear orifice portion 32.
Shear orifice 32 and e~haust ori~ice 31 are etched from opposing sides so that they have opposing tapers. The fluid shear gap is produced by the overlap o~ the mesa and the bottom plate adjacent the exhaust oriice. This gap determines the flow rate and dispersion characteristics of the nozzle for ~lui~ ~low at a given pressure.
Various moclifications and variations will no doubt occur to those skilled in the art to which this invention pertains. For e~ample, the particular shape of the openings can be varied from that disclosed herein.
These and all other variations which basically xely on the teachings through which this disclosure has advanced the art are properly considered within the scope of this invention.
Claims (15)
1. A silicon compound nozzle for guiding fluid flow, including:
a generally planar first silicon plate having a first opening formed therethrough;
a generally planar second silicon plate, adjacent to, parallel to, and in a fixed relationship to said first silicon plate, having a second opening formed therethrough and offset from said first opening in said first silicon plate, and said silicon compound nozzle having a first area of reduced thickness between said first and second openings so as to form a first shear gap for fluid flow-substantially parallel to the plane of aid first and second plates.
a generally planar first silicon plate having a first opening formed therethrough;
a generally planar second silicon plate, adjacent to, parallel to, and in a fixed relationship to said first silicon plate, having a second opening formed therethrough and offset from said first opening in said first silicon plate, and said silicon compound nozzle having a first area of reduced thickness between said first and second openings so as to form a first shear gap for fluid flow-substantially parallel to the plane of aid first and second plates.
2. A silicon nozzle as recited in claim 1 further comprising a third opening in said first plate offset from said first opening;
said third and second openings being offset from each other and acting in cooperation with a second area of reduced thickness between said third and second openings in said silicon compound nozzle forming a second shear gap for fluid flow substantially parallel to the plane of said first and second plates so that fluid flow going through said first shear gap hits fluid flow going through said second shear gap and exits through said second opening.
said third and second openings being offset from each other and acting in cooperation with a second area of reduced thickness between said third and second openings in said silicon compound nozzle forming a second shear gap for fluid flow substantially parallel to the plane of said first and second plates so that fluid flow going through said first shear gap hits fluid flow going through said second shear gap and exits through said second opening.
3. A silicon nozzle as recited in claim 2 further comprising a fourth opening in said first plate offset from said first, second and third openings and acting in cooperation with a third area of reduced thickness between said fourth and second openings in said silicon compound nozzle forming a third shear gap for fluid flow substantially parallel to the plane of said first and second plates so that fluid flow going through said first and second shear gaps hits fluid flow going through said third shear gap and exits through said second opening.
4. A silicon nozzle as recited in claim 3 wherein said first plate contains said first, second, third and a fourth generally rectangular openings positioned around a central mesa area, said central mesa area being aligned with said second opening in said second plate and said first, second and third shear gaps being defined by the surface of said mesa and the adjacent surface of said second silicon plate.
5. A silicon nozzle as recited in claim 4 where in the extent of the shear gap overlap between said mesa and said second silicon plate adjacent said second opening is relatively small compared to the size of said second opening.
6. A silicon nozzle as recited in claim 5 wherein the surface of said second silicon plate facing said first silicon plate has a recess adjacent each opening in said first silicon plate.
7. A silicon nozzle as recited in claim 6 wherein said first plate includes an annular recess around said central mesa, said recess being aligned with each of said openings in said first plate.
8. A silicon nozzle as recited in claim 7 wherein each of said openings in said first plate tapers and decreases in cross sectional area with decreasing distance to said second plate.
9. A silicon nozzle as recited in claim 8 wherein said annular recess in said first plate tapers and decreases in cross sectional area with increasing distance from said second plate.
10. A silicon compound nozzle for guiding fluid flow includes:
a generally planar silicon flow plate having a plurality of supply orifices formed therethrough arranged generally symmetrically about the center of said flow plate, an annular trough formed on the underside of said flow plate intersecting said supply orifices, and a mesa at the centex of said trough;
a generally planar silicon orifice plate having an exhaust orifice formed therethrough, said orifice plate having a fixed relationship to said flow plate, the opening of said exhaust orifice at the upper side of said orifice plate being aligned with and smaller in lateral extent than said mesa, a raised perimeter wall around said orifice plate, and a reduced thickness shear gap area; and a portion of said mesa and said shear gap area being aligned, and the region adjacent said mesa and said shear gap area being in communication with said exhaust orifice and said supply orifices.
a generally planar silicon flow plate having a plurality of supply orifices formed therethrough arranged generally symmetrically about the center of said flow plate, an annular trough formed on the underside of said flow plate intersecting said supply orifices, and a mesa at the centex of said trough;
a generally planar silicon orifice plate having an exhaust orifice formed therethrough, said orifice plate having a fixed relationship to said flow plate, the opening of said exhaust orifice at the upper side of said orifice plate being aligned with and smaller in lateral extent than said mesa, a raised perimeter wall around said orifice plate, and a reduced thickness shear gap area; and a portion of said mesa and said shear gap area being aligned, and the region adjacent said mesa and said shear gap area being in communication with said exhaust orifice and said supply orifices.
11. A silicon compound nozzle for guiding fluid flow includes:
a generally planar first silicon plate having first, second, third and fourth openings formed therethrough and offset from each other;
a generally planar second silicon plate having a fifth opening therethrough and offset from said first, second, third and fourth opening in said first silicon plate, said second plate having a fixed relationship to said first plate;
said silicon compound nozzle having an area of reduced thickness between said fifth opening and each of said first, second, third and fourth openings so as to form a shear gap for fluid flow substantially parallel to the plane of said first and second plates, and so that fluid flow going through said shear gap from said first, second, third and fourth opening collides and exits through said fifth opening;
said first, second, third and fourth openings being generally rectangular and positioned around a central mesa area, said central mesa area being aligned with said fifth opening in said second plate and said shear gap being defined by the surface of said mesa and the adjacent surface of said second silicon plate, the extent of the shear gap overlap between said mesa and said second silicon plate adjacent said fifth opening being relatively small compared to the size of said fifth opening:
said first plate including an annular recess around said central mesa, said annular recess being aligned with each of said first, second, third and fourth openings in said first plate, said annular recess in said first plate tapering and decreasing in cross sectional area with increasing distance from said second plate; and each of said first, second, third and fourth openings in said first plate tapering and decreasing in cross sectional area with decreasing distance to said second plate.
a generally planar first silicon plate having first, second, third and fourth openings formed therethrough and offset from each other;
a generally planar second silicon plate having a fifth opening therethrough and offset from said first, second, third and fourth opening in said first silicon plate, said second plate having a fixed relationship to said first plate;
said silicon compound nozzle having an area of reduced thickness between said fifth opening and each of said first, second, third and fourth openings so as to form a shear gap for fluid flow substantially parallel to the plane of said first and second plates, and so that fluid flow going through said shear gap from said first, second, third and fourth opening collides and exits through said fifth opening;
said first, second, third and fourth openings being generally rectangular and positioned around a central mesa area, said central mesa area being aligned with said fifth opening in said second plate and said shear gap being defined by the surface of said mesa and the adjacent surface of said second silicon plate, the extent of the shear gap overlap between said mesa and said second silicon plate adjacent said fifth opening being relatively small compared to the size of said fifth opening:
said first plate including an annular recess around said central mesa, said annular recess being aligned with each of said first, second, third and fourth openings in said first plate, said annular recess in said first plate tapering and decreasing in cross sectional area with increasing distance from said second plate; and each of said first, second, third and fourth openings in said first plate tapering and decreasing in cross sectional area with decreasing distance to said second plate.
12. A method of forming a fixed gap compound silicon nozzle, including:
forming a generally planar first silicon plate with an opening;
forming a generally planar second silicon plate with a second opening, offset from the first opening, said second plate being held in a fixed relationship to said first plate;
forming a fixed gap fluid flow path between the first and the second opening at the interface between the first and second silicon plates.
forming a generally planar first silicon plate with an opening;
forming a generally planar second silicon plate with a second opening, offset from the first opening, said second plate being held in a fixed relationship to said first plate;
forming a fixed gap fluid flow path between the first and the second opening at the interface between the first and second silicon plates.
13. A method as recited in claim 12 wherein the offset between the first and second openings is such that the opening surface of the first opening does not overlap the opening surface of the second opening.
14. A method as recited in claim 13 wherein the step of forming a fluid path between the first and the second openings includes:
forming in the first silicon plate a mesa adjacent the first opening and sized to be sufficiently large to extend beyond the edge of the second opening;
forming in the second plate a shear gap recess of reduced thickness adjacent the second opening;
positioning the first and second silicon plates adjacent each other so that the mesa is positioned to extend beyond the second opening over the shear gap recess thereby forming a gap for fluid flow generally parallel to the plane of the first and second silicon plates.
forming in the first silicon plate a mesa adjacent the first opening and sized to be sufficiently large to extend beyond the edge of the second opening;
forming in the second plate a shear gap recess of reduced thickness adjacent the second opening;
positioning the first and second silicon plates adjacent each other so that the mesa is positioned to extend beyond the second opening over the shear gap recess thereby forming a gap for fluid flow generally parallel to the plane of the first and second silicon plates.
15. A method as recited in claim 14 further comprising the steps of:
forming a third opening in said first silicon plate offset from both said first and second openings:
forming a shear fluid flow path between the first and second openings so that fluid flow from the first opening to the second opening intersects fluid flow from the third opening to the second opening.
forming a third opening in said first silicon plate offset from both said first and second openings:
forming a shear fluid flow path between the first and second openings so that fluid flow from the first opening to the second opening intersects fluid flow from the third opening to the second opening.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US231,365 | 1988-08-12 | ||
| US07/231,365 US4828184A (en) | 1988-08-12 | 1988-08-12 | Silicon micromachined compound nozzle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1313216C true CA1313216C (en) | 1993-01-26 |
Family
ID=22868924
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000603191A Expired - Fee Related CA1313216C (en) | 1988-08-12 | 1989-06-19 | Silicon micromachined compound nozzle |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US4828184A (en) |
| EP (1) | EP0354660B1 (en) |
| JP (1) | JP2788064B2 (en) |
| CA (1) | CA1313216C (en) |
| DE (1) | DE68909145T2 (en) |
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| FR2229306A5 (en) * | 1973-01-17 | 1974-12-06 | Ishikawajima Harima Heavy Ind | |
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-
1988
- 1988-08-12 US US07/231,365 patent/US4828184A/en not_active Expired - Fee Related
-
1989
- 1989-06-19 CA CA000603191A patent/CA1313216C/en not_active Expired - Fee Related
- 1989-07-07 EP EP89306938A patent/EP0354660B1/en not_active Expired - Lifetime
- 1989-07-07 DE DE89306938T patent/DE68909145T2/en not_active Expired - Fee Related
- 1989-07-11 JP JP1178922A patent/JP2788064B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE68909145T2 (en) | 1994-01-13 |
| DE68909145D1 (en) | 1993-10-21 |
| JPH0283051A (en) | 1990-03-23 |
| EP0354660B1 (en) | 1993-09-15 |
| US4828184A (en) | 1989-05-09 |
| JP2788064B2 (en) | 1998-08-20 |
| EP0354660A1 (en) | 1990-02-14 |
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