CA2009799A1 - Heat exchanger having piezoelectric fan means - Google Patents
Heat exchanger having piezoelectric fan meansInfo
- Publication number
- CA2009799A1 CA2009799A1 CA002009799A CA2009799A CA2009799A1 CA 2009799 A1 CA2009799 A1 CA 2009799A1 CA 002009799 A CA002009799 A CA 002009799A CA 2009799 A CA2009799 A CA 2009799A CA 2009799 A1 CA2009799 A1 CA 2009799A1
- Authority
- CA
- Canada
- Prior art keywords
- fluid
- blades
- base
- housing
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D33/00—Non-positive-displacement pumps with other than pure rotation, e.g. of oscillating type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
HEAT EXCHANGER HAVING PIEZOELECTRIC FAN MEANS
Abstract of the Disclosure A fluid heat exchanger for cooling an electronic component including a housing having a fluid inlet and fluid outlet. Piezoelectric means are connected to a plurality of flexible blades for pumping fluid from the inlet to the outlet. A heat conductive structure is connected to the housing base for conducting heat to the fluid. The heat conductive structure may include the flexible blades and/or fixed metal fins.
Abstract of the Disclosure A fluid heat exchanger for cooling an electronic component including a housing having a fluid inlet and fluid outlet. Piezoelectric means are connected to a plurality of flexible blades for pumping fluid from the inlet to the outlet. A heat conductive structure is connected to the housing base for conducting heat to the fluid. The heat conductive structure may include the flexible blades and/or fixed metal fins.
Description
2~
HEAT EXCHANGER HAVING PIEZOELECTRIC FAN MEANS
Backaround of the Invention Piezoelectric fans for blowing air over an electronic circuit board have been used for cooling. TI~e present invention is directed to providing a high efficiency finned heat exchanger in which at least some of the fins include piezoelectric drive means for pumping cooling fluid through the heat exchanger. Such a structure provides several advantages. First, such a heat exchanger does not require a separate fan or pump for the cooling fluid. Secondly, the heat transfer from the electronic component to be cooled is greatly increased by the use of a heat exchanger having heat conducting means for conducting heat from the electronic component to the cooling fluid. Thirdly, the heat conducting means may include a plurality of flexible blades which are vi~rated by piezoelectric drive means and/or fixed metal fins posit1oned adjacent the flexible blades.
; Summar~
The present invention is directed to a fluid heat exchanger for cooling an electronic component and includes -2- 2~0~
1 a housing having a base for receiving heat from an electronic component. The housing also includes a fluid inlet and a fluid outlet. A plurality of flexible blades are positioned in the housing and piezoelectric means are connected to the blades for vibrating the blades to flow fluid from the inlet to the outlet. Means are provided in the housing connected to the base for conducting heat from the base to the flowing fluid.
Still a further object of the present invention is wherein the means for conducting heat from the base to the cooling fluid are flexible blades which include a heat conductive material.
Still a further object of the present invention is wherein the means for conducting heat from the base to the fluid includes fixed metal fins positioned adjacent the flexible blades and generally parallel to the blades.
Other and further objects, features and advantages will be apparent from the following description of a presently preferred embodiment of the invention, given for the purpose of disclosure, and taken in conjunction with the accompanying drawing.
Brief DescriptionQ E the Drawinq Fig. 1 is a fragrnentary elevational view, in cross section, of the present invention, and Fig. 2 is a cross-sectional view taken along the line 2-2 of Fig. 1.
Description of the _ eferred Embodiment Referring now to the drawing, and particularly to Fig. 2, the heat exchanger of the present invention is generally indicated by the reference numeral 10 and includes a housing 12 having a base 14 for receiving heat from an electronic component such as an electronic chip 16. The housing 12 may include one or more fluid inlets _3_ ~0 ~ ~
1 1~ and 20 and a fluid outlet 22. Cooling fluid, such as air or liquid, is drawn through the inlets lB and 20 and out the outlet 22 as indicated by the arrows.
~ plurality of fle~ible blades generally indicated by the reference numeral 30 are positioned in the housinq 12 for acting as fan elements. A
piezoelectric coating is connected to the sides of the blades making them pie~oelectric bimorphs which are capable of deflecting and bending when a voltage is applied. As an example, the blades 30 may be comprised of con~entional ferroelectric or PVDF (polyvinylidene fluoride) layers 32 and 34 connected to a brass base 31.
Thus, when varying voltage means are connected to the layers 32 and 34, the blades 30 vibrate thereby acting a~
fans to pump or flow fluid from the inlets 18 and 20 to the outlet 22. ~owever, any suitable piezo driven fan blades 30 could be used such as any suitable two element or three element piezoelectric fan unit. Electrical leads 36 and 38 are positioned on opposite sides 32 and 34, respectively, of the blades 30 for providing the electrical supply for driving the piezoelectric blades 30 between the position shown in solid outline and the position shown in dotted outline. Electrically insulating shims 42 are provided for insulating the electrical leads 36 and 38 from other electrical components in the heat exchanger 10.
In order to transmit the heat from the electrical component 16 to the cooling fluid, means are provided for conducting heat from the base 14 to the inside of the housing 12 for contact with the cooling fluid.
Preferably, the flexible blades 30 include a heat conductive material 31 such as copper or aluminum whereby the blades 30 not only circulate the cooling fluid but act to remove the heat from the chip i6. The blades 30 may be driven at any suitable speed such as a frequency from 20 -4- ~0~7~
1 to 1000 hertz and it rnay be possible to increase fluid flow by operating at either the first or second resonant frequencies of the flexible blades 30. It may be advantageous to place piezoelectric material on only part of the flexible base 31 to allow the blades 30 to conduct as much heat as possible.
As an alternative to the heat conducting flexible blades 30, and preferabl~ as an additional structure for conducting heat from the base 1~, a plurality of fixed heat conductive fins 40 are provided. The fins 40 may be of any suitable conductive material such as copper and are preferably positioned generally parallel to the flexible blades 30 and on each side of each flexible blade 30.
Thus the fixed fins 40 conduct heat from the electronic chip 16 and are subjected to the moving cooling fluid flow caused by the action of the flexible blades 30 to incr~ase the efficiency of cooling of the heat exchanger 10.
Therefore, the present invention provides a heat exchanger with a plurality of fins and flexible blades used as an integral fan and cooling heat exchanger for cooling electronic chips.
The present invention, therefore, is well adapted to carry out the objects and attain the ends and advantages mentioned as well as others inherent therein.
While a presently preferred embodiment of the invention has been given for the purpose of disclosure, numerous changes in the details of construction and arran~ement of parts will be readily apparent to those skilled in the art and which are encompassed within the spirit of the invention and the scope of the appended claims~
What is claimed is:
.~
HEAT EXCHANGER HAVING PIEZOELECTRIC FAN MEANS
Backaround of the Invention Piezoelectric fans for blowing air over an electronic circuit board have been used for cooling. TI~e present invention is directed to providing a high efficiency finned heat exchanger in which at least some of the fins include piezoelectric drive means for pumping cooling fluid through the heat exchanger. Such a structure provides several advantages. First, such a heat exchanger does not require a separate fan or pump for the cooling fluid. Secondly, the heat transfer from the electronic component to be cooled is greatly increased by the use of a heat exchanger having heat conducting means for conducting heat from the electronic component to the cooling fluid. Thirdly, the heat conducting means may include a plurality of flexible blades which are vi~rated by piezoelectric drive means and/or fixed metal fins posit1oned adjacent the flexible blades.
; Summar~
The present invention is directed to a fluid heat exchanger for cooling an electronic component and includes -2- 2~0~
1 a housing having a base for receiving heat from an electronic component. The housing also includes a fluid inlet and a fluid outlet. A plurality of flexible blades are positioned in the housing and piezoelectric means are connected to the blades for vibrating the blades to flow fluid from the inlet to the outlet. Means are provided in the housing connected to the base for conducting heat from the base to the flowing fluid.
Still a further object of the present invention is wherein the means for conducting heat from the base to the cooling fluid are flexible blades which include a heat conductive material.
Still a further object of the present invention is wherein the means for conducting heat from the base to the fluid includes fixed metal fins positioned adjacent the flexible blades and generally parallel to the blades.
Other and further objects, features and advantages will be apparent from the following description of a presently preferred embodiment of the invention, given for the purpose of disclosure, and taken in conjunction with the accompanying drawing.
Brief DescriptionQ E the Drawinq Fig. 1 is a fragrnentary elevational view, in cross section, of the present invention, and Fig. 2 is a cross-sectional view taken along the line 2-2 of Fig. 1.
Description of the _ eferred Embodiment Referring now to the drawing, and particularly to Fig. 2, the heat exchanger of the present invention is generally indicated by the reference numeral 10 and includes a housing 12 having a base 14 for receiving heat from an electronic component such as an electronic chip 16. The housing 12 may include one or more fluid inlets _3_ ~0 ~ ~
1 1~ and 20 and a fluid outlet 22. Cooling fluid, such as air or liquid, is drawn through the inlets lB and 20 and out the outlet 22 as indicated by the arrows.
~ plurality of fle~ible blades generally indicated by the reference numeral 30 are positioned in the housinq 12 for acting as fan elements. A
piezoelectric coating is connected to the sides of the blades making them pie~oelectric bimorphs which are capable of deflecting and bending when a voltage is applied. As an example, the blades 30 may be comprised of con~entional ferroelectric or PVDF (polyvinylidene fluoride) layers 32 and 34 connected to a brass base 31.
Thus, when varying voltage means are connected to the layers 32 and 34, the blades 30 vibrate thereby acting a~
fans to pump or flow fluid from the inlets 18 and 20 to the outlet 22. ~owever, any suitable piezo driven fan blades 30 could be used such as any suitable two element or three element piezoelectric fan unit. Electrical leads 36 and 38 are positioned on opposite sides 32 and 34, respectively, of the blades 30 for providing the electrical supply for driving the piezoelectric blades 30 between the position shown in solid outline and the position shown in dotted outline. Electrically insulating shims 42 are provided for insulating the electrical leads 36 and 38 from other electrical components in the heat exchanger 10.
In order to transmit the heat from the electrical component 16 to the cooling fluid, means are provided for conducting heat from the base 14 to the inside of the housing 12 for contact with the cooling fluid.
Preferably, the flexible blades 30 include a heat conductive material 31 such as copper or aluminum whereby the blades 30 not only circulate the cooling fluid but act to remove the heat from the chip i6. The blades 30 may be driven at any suitable speed such as a frequency from 20 -4- ~0~7~
1 to 1000 hertz and it rnay be possible to increase fluid flow by operating at either the first or second resonant frequencies of the flexible blades 30. It may be advantageous to place piezoelectric material on only part of the flexible base 31 to allow the blades 30 to conduct as much heat as possible.
As an alternative to the heat conducting flexible blades 30, and preferabl~ as an additional structure for conducting heat from the base 1~, a plurality of fixed heat conductive fins 40 are provided. The fins 40 may be of any suitable conductive material such as copper and are preferably positioned generally parallel to the flexible blades 30 and on each side of each flexible blade 30.
Thus the fixed fins 40 conduct heat from the electronic chip 16 and are subjected to the moving cooling fluid flow caused by the action of the flexible blades 30 to incr~ase the efficiency of cooling of the heat exchanger 10.
Therefore, the present invention provides a heat exchanger with a plurality of fins and flexible blades used as an integral fan and cooling heat exchanger for cooling electronic chips.
The present invention, therefore, is well adapted to carry out the objects and attain the ends and advantages mentioned as well as others inherent therein.
While a presently preferred embodiment of the invention has been given for the purpose of disclosure, numerous changes in the details of construction and arran~ement of parts will be readily apparent to those skilled in the art and which are encompassed within the spirit of the invention and the scope of the appended claims~
What is claimed is:
.~
Claims (7)
1. A fluid heat exchanger for cooling an electronic component comprising, a housing having a base for receiving heat from an electronic component, said base having a fluid inlet and a fluid outlet, a plurality of flexible blades positioned in the housing, piezoelectric means connected to the blades for vibrating the blades to flow fluid from the inlet to the outlet, means in the housing connected to the base for conducting heat from the base to the flow of fluid, and said means for conducting heat from its base are the flexible blades which are of a heat conductive material.
2. The apparatus of claim 1 wherein the piezoelectric means partially cover the blades.
3. The apparatus of claim 1 wherein the means for conducting heat from the base includes fixed metal fins positioned adjacent the flexible blades.
4. The apparatus of claim 3 wherein the fixed metal fins are generally parallel to the flexible blades.
5. The apparatus of claim 4 wherein a fixed metal fin is positioned on each side of each flexible blade.
6. A fluid heat exchanger for cooling an electronic component comprising, a housing having a base for receiving heat from an electronic component, said housing having a fluid inlet and a fluid outlet, a plurality of flexible blades positioned in the housing, piezoelectric means connected to the blades for vibrating the blades to flow fluid from the inlet to the outlet, means in the housing connected to the base for conducting heat from the base to the flow of fluid including fixed metal fins positioned adjacent the flexible blades, said fixed metal fins being positioned generally parallel to the flexible blades, and wherein a fixed metal fin is positioned or each side of each flexible blade.
7. A fluid heat exchanger for cooling an electronic component comprising, a housing having a base for receiving heat from an electronic component, said housing having a fluid inlet and a fluid outlet, a plurality of flexible blades positioned in the housing, piezoelectric means connected to the blades for vibrating the blades to flow fluid from the inlet to the outlet, means in the housing connected to the base for conducting heat from the base to the flow of fluid, and said means for conducting heat from its base are the flexible blades which include a heat conductive material.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US318,297 | 1989-03-03 | ||
| US07/318,297 US4923000A (en) | 1989-03-03 | 1989-03-03 | Heat exchanger having piezoelectric fan means |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2009799A1 true CA2009799A1 (en) | 1990-09-03 |
Family
ID=23237560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002009799A Abandoned CA2009799A1 (en) | 1989-03-03 | 1990-02-12 | Heat exchanger having piezoelectric fan means |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4923000A (en) |
| EP (1) | EP0385090A1 (en) |
| JP (1) | JPH0340462A (en) |
| CA (1) | CA2009799A1 (en) |
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| CN112351634B (en) * | 2019-08-07 | 2022-08-23 | 杭州海康威视数字技术股份有限公司 | Heat dissipation device and electronic equipment |
| KR20220082053A (en) | 2019-10-30 | 2022-06-16 | 프로리 시스템스 인코포레이티드 | MEMS based airflow system |
| US11510341B2 (en) | 2019-12-06 | 2022-11-22 | Frore Systems Inc. | Engineered actuators usable in MEMs active cooling devices |
| US11796262B2 (en) | 2019-12-06 | 2023-10-24 | Frore Systems Inc. | Top chamber cavities for center-pinned actuators |
| JP2023544160A (en) | 2020-10-02 | 2023-10-20 | フロー・システムズ・インコーポレーテッド | active heat sink |
| US11696420B2 (en) * | 2021-07-08 | 2023-07-04 | Eaton Intelligent Power Limited | Cooling device for circuit breakers using parasitic magnetic fields based forced air flow generator |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS542870A (en) * | 1977-05-26 | 1979-01-10 | Rca Corp | Fan apparatus utilizing high molecular weight piezoelectric bimolf material |
| US4498851A (en) * | 1980-05-02 | 1985-02-12 | Piezo Electric Products, Inc. | Solid state blower |
| US4520425A (en) * | 1982-08-12 | 1985-05-28 | Mitsubishi Denki Kabushiki Kaisha | Control apparatus with improved structure for cooling circuit elements |
| US4780062A (en) * | 1985-10-09 | 1988-10-25 | Murata Manufacturing Co., Ltd. | Piezoelectric fan |
-
1989
- 1989-03-03 US US07/318,297 patent/US4923000A/en not_active Expired - Lifetime
-
1990
- 1990-01-22 EP EP90101229A patent/EP0385090A1/en not_active Ceased
- 1990-02-12 CA CA002009799A patent/CA2009799A1/en not_active Abandoned
- 1990-03-02 JP JP2051629A patent/JPH0340462A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0340462A (en) | 1991-02-21 |
| US4923000A (en) | 1990-05-08 |
| EP0385090A1 (en) | 1990-09-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Discontinued |