CA2018900C - Packaging method and package for edge-coupled optoelectronic device - Google Patents
Packaging method and package for edge-coupled optoelectronic deviceInfo
- Publication number
- CA2018900C CA2018900C CA002018900A CA2018900A CA2018900C CA 2018900 C CA2018900 C CA 2018900C CA 002018900 A CA002018900 A CA 002018900A CA 2018900 A CA2018900 A CA 2018900A CA 2018900 C CA2018900 C CA 2018900C
- Authority
- CA
- Canada
- Prior art keywords
- substrate
- contacts
- conductors
- optoelectronic device
- edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000005693 optoelectronics Effects 0.000 title claims abstract description 65
- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 97
- 239000004020 conductor Substances 0.000 claims abstract description 44
- 239000000919 ceramic Substances 0.000 claims description 11
- 238000012544 monitoring process Methods 0.000 claims 2
- 230000003287 optical effect Effects 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 238000005219 brazing Methods 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 230000013011 mating Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
- H01S5/02345—Wire-bonding
Abstract
PACKAGING METHOD AND PACKAGE FOR EDGE-COUPLED OPTOELECTRONIC DEVICE Abstract of the Disclosure An edge-coupled optoelectronic device is mounted in a TO-style package which comprises a substrate assembly, a circular header and a cylindrical cap. A substrate and an insulating cover of the substrate assembly extend through an opening of the circular header and are secured in that opening. The optoelectronic device is secured to the substrate at a device support location. Electrical conductors are wire-bonded at contacts of the optoelectronic device and at corresponding device contacts of the substrate assembly to electrically connect the contacts of the optoelectronic device to respective conductors of the substrate assembly. The cylindrical cap is secured onto the header over the optoelectronic device. -i-
Description
20~890~
PACKAGING METHOD AND PACKAGE FOR
EDGE-COUPLED OPTOELECTRONIC DEVICE
Field of the Invention This invention relates generally to packaging methods and packages for optoelectronic devices. More particularly, this invention relates to packaging methods and packages for edge-coupled optoelectronic devices, such as edge-emitting semiconductor lasers, edge-emitting Light Emitting Diodes (LEDs), and edge-receiving semiconductor photodetectors.
Backaround of the Invention "TO packages" are commonly used for a variety of electronic and optoelectronic devices. A TO package has a circular metallic header having a lip on its outer circumference and a plurality of through holes spaced around its circumference. A terminal pin extends through each hole and i5 held in the hole and separated from the header by an insulating spacer. The TO package also has a cylindrical cap which fits onto the header with a circular edge of the cap mating with the lip of the header. In TO packages intended for use with optoelectronic devices, the cap has a transparent window which is located over the header when the cap is installed on the header. TO packages come in several TO-standard diameters with several TO-standard pin counts.
A surface-coupled optoelectronic device, such as a surface-emitting laser, a surface-emitting LED, or a surface-receiving photodetector is mounted in a TO package by securing to the header a substrate on which the device is formed, wire-bonding electrical connections from the terminal pin~ to contact pads on an upper surface of the device, mating the cap with the header, and sealing the cap to the header at the lip of the header. In the packaged device, the window of the cap is aligned with the surface of the device, so that the device can be optically coupled to external components through the window.
However, if an edge-coupled optoelectronic device, such as an edge-emitting laser, an edge-emitting LED or an edge-receiving photodetector were mounted in a T0 package as described above for a surface-coupled optoelectronic device, the device would not be properly oriented for optical coupling through the window. The edge-coupled device must be mounted perpendicular to the header for optical coupling through the window.
The required perpendicular mounting is conventionally achieved by securing a block to the surface of the header, and securing the edge-coupled device to a lateral surface of the block. Electrical connections are wire-bonded to contact pads of the device but, because the wire-bonding surfaces of the terminal pins are perpendicular to the contact pads of the device when the device is mounted perpendicular to the header, the electrical connections cannot be wire-bonded to the terminal pins. Instead the electrical connections must be connected to the terminal pins with solder or conductive epoxy. Unlike wire-bonding which can be totally automated, the soldering or epoxying operation is performed manually. The cap is then fixed to the header with the window over the edge of the edge-coupled device.
The requirement for a manual soldering or epoxying operation significantly increases the production time and cost associated with the packaging of edge-emitting optoelectronic devices in T0 packages.
Edge-coupled optoelectronic devices have also been mounted in "flat pack" or "butterfly" packages having optical connectors or optical fiber pigtails built into an end wall of the package for optical coupling to the edge-coupled device. In these packages, contact pads of the devices can be wire-bonded to terminal pins of the packages in an automated wire-bonding operation. However, these packages are several times more expensive than T0 packages. Moreover, 20~89~0 TO packages are standardized for many cost-sensitive applications and are compatible with readily available and inexpensive connector adaptors.
Thus, there is a need for a simpler method for mounting an edge-coupled optoelectronic device in a "TO-style" package and a need for a "~O-style" package adapted to such a method.
Summary of the Invention One aspect of this invention provides a novel TO-style package for an edge-coupled optoelectronic device. The package comprises a substrate assembly, a circular header, and a cylindrical cap. The substrate assembly comprises an electrically insulating substrate, electrical conductors which are supported by the substrate and electrically lS insulating cover. The conductors define and extend between device contacts which are adjacent to a device support location on the substrate and terminal contacts which are remote from the device support location. The electrically insulating cover extends across the conductors between the device contacts and the terminal contacts. The circular header has a through opening for receiving the substrate and cover of the substrate assembly. The cylindrical cap fits onto the header over the substrate assembly and has a central transparent window.
Another aspect of this invention provides a novel method for mounting an edge-coupled optoelectronic device in a TO-style package. The method comprises providing a substrate assembly, a circular header and a cylindrical cap as defined above, with the substrate and cover of the substrate assembly extending through and secured in the opening o~ the circular header. The method further comprises securing the optoelectronic device to the substrate at the device support location, bonding electrical conductors at contacts of the optoelectronic device and at corresponding device contacts of the substrate assembly to electrically 20~g~a connect the contacts of the optoelectronic device to respective conductors of the substrate assembly, and securing the cylindrical cap onto the header over the optoelectronic device.
The inventive package and packaging method permit electrical connection of an edge-coupled optoelectronic device to terminals of a TO-style package without time consuming and expensive manual soldering or epoxying operations. In particular, the inventive package and packaging method permit electrical connection of an edge-coupled optoelectronic device to terminals of a TO-style package using only automated bonding operations such as wire-bonding and Tape Automated Bonding (TAB).
Another aspect of the invention provides a packaged edge-coupled optoelectronic device. The packaged device comprises a circular header, a substrate assembly, the edge-coupled optoelectronic device, and a cylindrical cap. The header has a through opening. The substrate assembly comprises an electrically insulating substrate, electrical conductors which are supported by the substrate, and an electrically insulating cover. The conductors define device contacts which are adjacent to a device support location on the substrate and terminal contacts which are remote from the device support location. The conductors also extend between the device contacts and the terminal contacts. The electrically insulating cover extends across the conductors between the device contacts and the terminal contacts. The substrate and the cover extend through and are secured in the opening of the header. The edge-coupled optoelectronic device is secured to the substrate in the device support location. The optoelectronic device has electrical contacts which are electrically connected to respective conductors of the substrate assembly. The cylindrical cap is secured to the header over the optoelectronic device. The cap has a central transparent window over the optoelectronic device.
PACKAGING METHOD AND PACKAGE FOR
EDGE-COUPLED OPTOELECTRONIC DEVICE
Field of the Invention This invention relates generally to packaging methods and packages for optoelectronic devices. More particularly, this invention relates to packaging methods and packages for edge-coupled optoelectronic devices, such as edge-emitting semiconductor lasers, edge-emitting Light Emitting Diodes (LEDs), and edge-receiving semiconductor photodetectors.
Backaround of the Invention "TO packages" are commonly used for a variety of electronic and optoelectronic devices. A TO package has a circular metallic header having a lip on its outer circumference and a plurality of through holes spaced around its circumference. A terminal pin extends through each hole and i5 held in the hole and separated from the header by an insulating spacer. The TO package also has a cylindrical cap which fits onto the header with a circular edge of the cap mating with the lip of the header. In TO packages intended for use with optoelectronic devices, the cap has a transparent window which is located over the header when the cap is installed on the header. TO packages come in several TO-standard diameters with several TO-standard pin counts.
A surface-coupled optoelectronic device, such as a surface-emitting laser, a surface-emitting LED, or a surface-receiving photodetector is mounted in a TO package by securing to the header a substrate on which the device is formed, wire-bonding electrical connections from the terminal pin~ to contact pads on an upper surface of the device, mating the cap with the header, and sealing the cap to the header at the lip of the header. In the packaged device, the window of the cap is aligned with the surface of the device, so that the device can be optically coupled to external components through the window.
However, if an edge-coupled optoelectronic device, such as an edge-emitting laser, an edge-emitting LED or an edge-receiving photodetector were mounted in a T0 package as described above for a surface-coupled optoelectronic device, the device would not be properly oriented for optical coupling through the window. The edge-coupled device must be mounted perpendicular to the header for optical coupling through the window.
The required perpendicular mounting is conventionally achieved by securing a block to the surface of the header, and securing the edge-coupled device to a lateral surface of the block. Electrical connections are wire-bonded to contact pads of the device but, because the wire-bonding surfaces of the terminal pins are perpendicular to the contact pads of the device when the device is mounted perpendicular to the header, the electrical connections cannot be wire-bonded to the terminal pins. Instead the electrical connections must be connected to the terminal pins with solder or conductive epoxy. Unlike wire-bonding which can be totally automated, the soldering or epoxying operation is performed manually. The cap is then fixed to the header with the window over the edge of the edge-coupled device.
The requirement for a manual soldering or epoxying operation significantly increases the production time and cost associated with the packaging of edge-emitting optoelectronic devices in T0 packages.
Edge-coupled optoelectronic devices have also been mounted in "flat pack" or "butterfly" packages having optical connectors or optical fiber pigtails built into an end wall of the package for optical coupling to the edge-coupled device. In these packages, contact pads of the devices can be wire-bonded to terminal pins of the packages in an automated wire-bonding operation. However, these packages are several times more expensive than T0 packages. Moreover, 20~89~0 TO packages are standardized for many cost-sensitive applications and are compatible with readily available and inexpensive connector adaptors.
Thus, there is a need for a simpler method for mounting an edge-coupled optoelectronic device in a "TO-style" package and a need for a "~O-style" package adapted to such a method.
Summary of the Invention One aspect of this invention provides a novel TO-style package for an edge-coupled optoelectronic device. The package comprises a substrate assembly, a circular header, and a cylindrical cap. The substrate assembly comprises an electrically insulating substrate, electrical conductors which are supported by the substrate and electrically lS insulating cover. The conductors define and extend between device contacts which are adjacent to a device support location on the substrate and terminal contacts which are remote from the device support location. The electrically insulating cover extends across the conductors between the device contacts and the terminal contacts. The circular header has a through opening for receiving the substrate and cover of the substrate assembly. The cylindrical cap fits onto the header over the substrate assembly and has a central transparent window.
Another aspect of this invention provides a novel method for mounting an edge-coupled optoelectronic device in a TO-style package. The method comprises providing a substrate assembly, a circular header and a cylindrical cap as defined above, with the substrate and cover of the substrate assembly extending through and secured in the opening o~ the circular header. The method further comprises securing the optoelectronic device to the substrate at the device support location, bonding electrical conductors at contacts of the optoelectronic device and at corresponding device contacts of the substrate assembly to electrically 20~g~a connect the contacts of the optoelectronic device to respective conductors of the substrate assembly, and securing the cylindrical cap onto the header over the optoelectronic device.
The inventive package and packaging method permit electrical connection of an edge-coupled optoelectronic device to terminals of a TO-style package without time consuming and expensive manual soldering or epoxying operations. In particular, the inventive package and packaging method permit electrical connection of an edge-coupled optoelectronic device to terminals of a TO-style package using only automated bonding operations such as wire-bonding and Tape Automated Bonding (TAB).
Another aspect of the invention provides a packaged edge-coupled optoelectronic device. The packaged device comprises a circular header, a substrate assembly, the edge-coupled optoelectronic device, and a cylindrical cap. The header has a through opening. The substrate assembly comprises an electrically insulating substrate, electrical conductors which are supported by the substrate, and an electrically insulating cover. The conductors define device contacts which are adjacent to a device support location on the substrate and terminal contacts which are remote from the device support location. The conductors also extend between the device contacts and the terminal contacts. The electrically insulating cover extends across the conductors between the device contacts and the terminal contacts. The substrate and the cover extend through and are secured in the opening of the header. The edge-coupled optoelectronic device is secured to the substrate in the device support location. The optoelectronic device has electrical contacts which are electrically connected to respective conductors of the substrate assembly. The cylindrical cap is secured to the header over the optoelectronic device. The cap has a central transparent window over the optoelectronic device.
2 ~
Brief Description of the Drawin~s Embodiments of the invention are described below by way of example only. The description refers to accompanying drawings, in which:
Figure 1 is a cross-sectional view of an edge-coupled optoelectronic device mounted in a package according to a first embodiment of the invention; and Figure 2 is a cross-sectional view of an edge-coupled optoelectronic device mounted in a package according to a second embodiment of the invention.
Description of Embodiment~s Referring to Figure 1, a TO-style package 100 according to a first embodiment of the invention comprises a substrate assembly 110, a circular header 120 which has a TO-standard diameter, and a cylindrical cap 130 which has a TO-standard diameter.
The substrate assembly 110 comprises an electrically insulating ceramic substrate 112, electrical conductors in the form of metallic tracks 114 which are supported by the substrate 112 and an electrically insulating cover in the form of a ceramic member 118. The metallic tracks 114 define device contacts 115 which are adjacent to a device support location 113 on the substrate 112 and terminal contacts 116 which are remote from the device support location 113. The metallic tracks 114 extend between corresponding device contacts 115 and terminal contacts 116 to electrically connect respective device contacts 115 to respective terminal contacts 116. The ceramic cover member 118 extends across the metallic tracks 114 between the device contacts 115 and the terminal contacts 116. Metal terminal pins 119 are brazed to the terminal contacts 116. A similar substrate assembly for use in packaging hybrid electronic circuits is described in copending US Patent Application Serial Number 275,887 filed November 25, 1988 (Canadian Patent Application Serial Number 583,943 filed November 23, 1988) in the names o~ Tibor Kovats et al.
20~9~
The circular header 120 has a through opening 122 through which the ceramic substrate 112 and the ceramic cover member 118 extend. The ceramic substrate 112 and the ceramic cover member 118 are secured in the opening 122 by brazing.
The circular header 120 also has a peripheral lip 124.
The cylindrical cap 130 fits onto the header 120 over the substrate assembly 110 and is secured to the header 120 at the lip 124 of the header 120 by brazing, welding, soldering or any other securing method which would provide a seal between the header 120 and the cap 130. The cap 130 has a central transparent window 132.
An edge-coupled optoelectronic device in the form of an edge-emitting semiconductor laser 150 is secured to the ceramic substrate 112 at the device support location 113. An emitting edge 152 of the laser 150 is aligned with the window 132 of the ~ap 130 so that light emitted by the laser 150 is coupled through the window 132. Electrical contacts 154 of the laser 150 are connected to corresponding terminal pins 119 via the metallic tracks 114 and electrical conductors in the form of wires 160 which are wire-bonded at one end to the device contacts 115 of the metallic tracks 114 and wire-bonded at the other end to the contacts 154 of the laser 150.
Normally, the package 100 would be pre-assembled by extending the substrate 112 and cover member 118 of the substrate assembly 110 through the opening 122 of the header 120 and securing them in that opening 122 by brazing. The laser 150 is packaged by securing it to the substrate 112 at the device support location 113 and wire-bonding the wires 160 at the contacts 154 of the laser 150 and at the corresponding device contacts 115 of the substrate assembly 110 to electrically connect the contacts of the laser 150 to respective metallic tracks 114 of the substrate assembly 110.
The cap 130 is fitted onto the header 122 over the laser 150 and secured on the header 120 by brazing at the lip 124.
2 ~ 0 ~
The package 100 and packaging method described above permit electrical connection of an edge-coupled optoelectronic device to terminals of a TO-style package without time consuming and expensive manual soldering or epoxying operations. In particular, the described package and packaging method permit electrical connection of an edge-coupled optoelectronic device to terminals of a TO-style package using only automated wire-bonding operations.
Other automated bonding techniques can be substituted for wire-bonding in the method described above.
For example, the wires 160 can be replaced by metallic tracks on a flexible plastic substrate, and the wire-bonding operations can be replaced by Tape Automated Bonding (TAB) operations.
Other modifications are also within the scope of the invention as claimed below. For example, the edge-emitting laser 150 could be replaced by an edge-emitting LED
or an edge-receiving photodetector. The edge-coupled optoelectronic device could be mounted on a subcarrier, and the subcarrier could be mounted on the substrate 112 at the device support location 113. Other electronic or optoelectronic devices could be mounted on the same subcarrier as the edge-coupled optoelectronic device. Other electronic or optoelectronic devices could also be mounted on separate subcarriers or directly on the substrate 112. The subcarriers could be provided with bonding pads and metallic tracks for interconnecting the electronic and optoelectronic devices, and bonding techniques such as wire-bonding and TAB
could be used to electrically connect such tracks with contacts of the devices and with contacts 115 of the sub6trate 112. The substrate 112 could have metallic tracks provided at several levels, the metallic tracks at different levels being interconnected through vias where desired, and cros~ing without interconnection where desired. Such a multilevel substrate could have metallic ground planes at one or more levels to provide electromagnetic shielding or to 2 9 ~
provide controlled impedance of the metallic tracks.
Subcarriers which carry surface-coupled optoelectronic devices could be mounted perpendicular to the substrate 112 for optical coupling through the window 132 or with edge-coupled optoelectronic devices in the same package.
For example, in a package 200 according to a second embodiment of the invention, the edge-emitting laser 150 is mounted on a subcarrier 210 which is mounted at the device support location 113 of the substrate 112. Wire-bonded wires 212 connect contacts 154 of the laser 150 to metallic tracks 214 on the subcarrier 210, and further wire-bonded wires 216 connect the tracks 214 to corresponding tracks 114 on the substrate 112. A surface-receiving photodetector 220 integrated with a monitor circuit is mounted on another subcarrier 230 which extends perpendicular to the substrate 112 behind the laser 150 to monitor operation of the laser 150 by means of its rearward emission. Wire-bonded wires 232 connect contacts 222 of the photodetector 220 to metallic tracks 234 on the subcarrier 230, and further wire-bonded wires 236 connect the tracks 234 to corresponding tracks 114 on the substrate 112. The tracks 234 run over an edge 238 of the subcarrier 230 to an end surface 239 of the subcarrier 230, 80 that both ends of the wires 236 can be wire-bonded.
The eubstrate 112 is a multilayer ceramic member having metallic tracks 114 at several levels, including a ground plane 115.
Brief Description of the Drawin~s Embodiments of the invention are described below by way of example only. The description refers to accompanying drawings, in which:
Figure 1 is a cross-sectional view of an edge-coupled optoelectronic device mounted in a package according to a first embodiment of the invention; and Figure 2 is a cross-sectional view of an edge-coupled optoelectronic device mounted in a package according to a second embodiment of the invention.
Description of Embodiment~s Referring to Figure 1, a TO-style package 100 according to a first embodiment of the invention comprises a substrate assembly 110, a circular header 120 which has a TO-standard diameter, and a cylindrical cap 130 which has a TO-standard diameter.
The substrate assembly 110 comprises an electrically insulating ceramic substrate 112, electrical conductors in the form of metallic tracks 114 which are supported by the substrate 112 and an electrically insulating cover in the form of a ceramic member 118. The metallic tracks 114 define device contacts 115 which are adjacent to a device support location 113 on the substrate 112 and terminal contacts 116 which are remote from the device support location 113. The metallic tracks 114 extend between corresponding device contacts 115 and terminal contacts 116 to electrically connect respective device contacts 115 to respective terminal contacts 116. The ceramic cover member 118 extends across the metallic tracks 114 between the device contacts 115 and the terminal contacts 116. Metal terminal pins 119 are brazed to the terminal contacts 116. A similar substrate assembly for use in packaging hybrid electronic circuits is described in copending US Patent Application Serial Number 275,887 filed November 25, 1988 (Canadian Patent Application Serial Number 583,943 filed November 23, 1988) in the names o~ Tibor Kovats et al.
20~9~
The circular header 120 has a through opening 122 through which the ceramic substrate 112 and the ceramic cover member 118 extend. The ceramic substrate 112 and the ceramic cover member 118 are secured in the opening 122 by brazing.
The circular header 120 also has a peripheral lip 124.
The cylindrical cap 130 fits onto the header 120 over the substrate assembly 110 and is secured to the header 120 at the lip 124 of the header 120 by brazing, welding, soldering or any other securing method which would provide a seal between the header 120 and the cap 130. The cap 130 has a central transparent window 132.
An edge-coupled optoelectronic device in the form of an edge-emitting semiconductor laser 150 is secured to the ceramic substrate 112 at the device support location 113. An emitting edge 152 of the laser 150 is aligned with the window 132 of the ~ap 130 so that light emitted by the laser 150 is coupled through the window 132. Electrical contacts 154 of the laser 150 are connected to corresponding terminal pins 119 via the metallic tracks 114 and electrical conductors in the form of wires 160 which are wire-bonded at one end to the device contacts 115 of the metallic tracks 114 and wire-bonded at the other end to the contacts 154 of the laser 150.
Normally, the package 100 would be pre-assembled by extending the substrate 112 and cover member 118 of the substrate assembly 110 through the opening 122 of the header 120 and securing them in that opening 122 by brazing. The laser 150 is packaged by securing it to the substrate 112 at the device support location 113 and wire-bonding the wires 160 at the contacts 154 of the laser 150 and at the corresponding device contacts 115 of the substrate assembly 110 to electrically connect the contacts of the laser 150 to respective metallic tracks 114 of the substrate assembly 110.
The cap 130 is fitted onto the header 122 over the laser 150 and secured on the header 120 by brazing at the lip 124.
2 ~ 0 ~
The package 100 and packaging method described above permit electrical connection of an edge-coupled optoelectronic device to terminals of a TO-style package without time consuming and expensive manual soldering or epoxying operations. In particular, the described package and packaging method permit electrical connection of an edge-coupled optoelectronic device to terminals of a TO-style package using only automated wire-bonding operations.
Other automated bonding techniques can be substituted for wire-bonding in the method described above.
For example, the wires 160 can be replaced by metallic tracks on a flexible plastic substrate, and the wire-bonding operations can be replaced by Tape Automated Bonding (TAB) operations.
Other modifications are also within the scope of the invention as claimed below. For example, the edge-emitting laser 150 could be replaced by an edge-emitting LED
or an edge-receiving photodetector. The edge-coupled optoelectronic device could be mounted on a subcarrier, and the subcarrier could be mounted on the substrate 112 at the device support location 113. Other electronic or optoelectronic devices could be mounted on the same subcarrier as the edge-coupled optoelectronic device. Other electronic or optoelectronic devices could also be mounted on separate subcarriers or directly on the substrate 112. The subcarriers could be provided with bonding pads and metallic tracks for interconnecting the electronic and optoelectronic devices, and bonding techniques such as wire-bonding and TAB
could be used to electrically connect such tracks with contacts of the devices and with contacts 115 of the sub6trate 112. The substrate 112 could have metallic tracks provided at several levels, the metallic tracks at different levels being interconnected through vias where desired, and cros~ing without interconnection where desired. Such a multilevel substrate could have metallic ground planes at one or more levels to provide electromagnetic shielding or to 2 9 ~
provide controlled impedance of the metallic tracks.
Subcarriers which carry surface-coupled optoelectronic devices could be mounted perpendicular to the substrate 112 for optical coupling through the window 132 or with edge-coupled optoelectronic devices in the same package.
For example, in a package 200 according to a second embodiment of the invention, the edge-emitting laser 150 is mounted on a subcarrier 210 which is mounted at the device support location 113 of the substrate 112. Wire-bonded wires 212 connect contacts 154 of the laser 150 to metallic tracks 214 on the subcarrier 210, and further wire-bonded wires 216 connect the tracks 214 to corresponding tracks 114 on the substrate 112. A surface-receiving photodetector 220 integrated with a monitor circuit is mounted on another subcarrier 230 which extends perpendicular to the substrate 112 behind the laser 150 to monitor operation of the laser 150 by means of its rearward emission. Wire-bonded wires 232 connect contacts 222 of the photodetector 220 to metallic tracks 234 on the subcarrier 230, and further wire-bonded wires 236 connect the tracks 234 to corresponding tracks 114 on the substrate 112. The tracks 234 run over an edge 238 of the subcarrier 230 to an end surface 239 of the subcarrier 230, 80 that both ends of the wires 236 can be wire-bonded.
The eubstrate 112 is a multilayer ceramic member having metallic tracks 114 at several levels, including a ground plane 115.
Claims (19)
PROPERTY OR PRIVILEGE IS CLAIMED ARE DEFINED AS FOLLOWS:
1. A package for an edge-coupled optoelectronic device, comprising:
a substrate assembly comprising:
an electrically insulating substrate;
electrical conductors which are supported by the substrate, the conductors defining and extending between device contacts which are adjacent to a device support location on the substrate and terminal contacts which are remote from the device support location; and an electrically insulating cover which extends across the conductors between the device contacts and the terminal contacts;
a circular header which has a through opening for receiving the substrate and cover of the substrate assembly;
and a cylindrical cap for fitting onto the header over the substrate assembly, the cap having a central transparent window.
a substrate assembly comprising:
an electrically insulating substrate;
electrical conductors which are supported by the substrate, the conductors defining and extending between device contacts which are adjacent to a device support location on the substrate and terminal contacts which are remote from the device support location; and an electrically insulating cover which extends across the conductors between the device contacts and the terminal contacts;
a circular header which has a through opening for receiving the substrate and cover of the substrate assembly;
and a cylindrical cap for fitting onto the header over the substrate assembly, the cap having a central transparent window.
2. A package as defined in claim 1, wherein the substrate comprises a ceramic substrate, the conductors comprise metallic tracks on the substrate, and the cover comprises a ceramic cover member which extends across the tracks.
3. A package as defined in claim 1, wherein the substrate is a multilayer substrate having conductors at a plurality of levels.
4. A package as defined in claim 1, wherein the substrate carries a conducting ground plane.
5. A package as defined in claim 1, further comprising terminal pins which are electrically connected to respective terminal contacts of the electrical conductors.
6. A package as defined in claim 1, wherein the header and the cap have TO-standard diameters.
7. A method for packaging an edge-coupled optoelectronic device, comprising:
providing a circular header which has a through opening, a cylindrical cap which has a central transparent window, and a substrate assembly which comprises:
an electrically insulating substrate;
electrical conductors which are supported by the substrate, the conductors defining and extending between device contacts which are adjacent to a device support location on the substrate and terminal contacts which are remote from the device support location; and an electrically insulating cover which extends across the conductors between the device contacts and the terminal contacts:
the substrate and cover of the substrate assembly extending through and secured in the opening of a circular header;
securing the optoelectronic device to the substrate at the device support location;
bonding electrical conductors at contacts of the optoelectronic device and at corresponding device contacts of the substrate assembly to electrically connect the contacts of the optoelectronic device to respective conductors of the substrate assembly; and securing the cylindrical cap onto the header over the optoelectronic device.
providing a circular header which has a through opening, a cylindrical cap which has a central transparent window, and a substrate assembly which comprises:
an electrically insulating substrate;
electrical conductors which are supported by the substrate, the conductors defining and extending between device contacts which are adjacent to a device support location on the substrate and terminal contacts which are remote from the device support location; and an electrically insulating cover which extends across the conductors between the device contacts and the terminal contacts:
the substrate and cover of the substrate assembly extending through and secured in the opening of a circular header;
securing the optoelectronic device to the substrate at the device support location;
bonding electrical conductors at contacts of the optoelectronic device and at corresponding device contacts of the substrate assembly to electrically connect the contacts of the optoelectronic device to respective conductors of the substrate assembly; and securing the cylindrical cap onto the header over the optoelectronic device.
8. A method as defined in claim 7, wherein the bonding step comprises wire-bonding operations.
9. A method as defined in claim 7, wherein the bonding step comprises Tape Automated Bonding (TAB) operations.
10. A method as defined in claim 7, wherein the edge-coupled optoelectronic device is mounted on a subcarrier, and the step of securing the optoelectronic device to the substrate at the device support location comprises securing the subcarrier to the substrate at the device support location.
11. A method as defined in claim 7, comprising securing a surface-coupled optoelectronic device mounted on another subcarrier to the same substrate by securing the other subcarrier to the substrate to extend perpendicular to the substrate.
12. A method as defined in claim 10, comprising:
securing to the substrate an edge-emitting laser mounted on a first subcarrier; and securing to the substrate a surface-receiving photodetector on a second subcarrier with the second subcarrier oriented perpendicular to the substrate and the photodetector aligned with and optically coupled to the laser.
securing to the substrate an edge-emitting laser mounted on a first subcarrier; and securing to the substrate a surface-receiving photodetector on a second subcarrier with the second subcarrier oriented perpendicular to the substrate and the photodetector aligned with and optically coupled to the laser.
13. A packaged edge-coupled optoelectronic device, comprising:
a circular header which has a through opening;
a substrate assembly comprising:
an electrically insulating substrate;
electrical conductors which are supported by the substrate, the conductors defining and extending between device contacts which are adjacent to a device support location on the substrate and terminal contacts which are remote from the device support location; and an electrically insulating cover which extends across the conductors between the device contacts and the terminal contacts;
the substrate and the cover extending through and being secured in the opening of the header;
an edge-coupled optoelectronic device which is secured to the substrate in the device support location, the optoelectronic device having electrical contacts which are electrically connected to respective conductors of the substrate assembly; and a cylindrical cap which is secured to the header over the optoelectronic device, the cap having a central transparent window over the optoelectronic device.
a circular header which has a through opening;
a substrate assembly comprising:
an electrically insulating substrate;
electrical conductors which are supported by the substrate, the conductors defining and extending between device contacts which are adjacent to a device support location on the substrate and terminal contacts which are remote from the device support location; and an electrically insulating cover which extends across the conductors between the device contacts and the terminal contacts;
the substrate and the cover extending through and being secured in the opening of the header;
an edge-coupled optoelectronic device which is secured to the substrate in the device support location, the optoelectronic device having electrical contacts which are electrically connected to respective conductors of the substrate assembly; and a cylindrical cap which is secured to the header over the optoelectronic device, the cap having a central transparent window over the optoelectronic device.
14. A packaged device as defined in claim 13, wherein the edge-coupled optoelectronic device is mounted on a subcarrier which is secured to the substrate in the device support location.
15. A packaged device as defined in claim 14, wherein:
the subcarrier comprises an electrically insulating member and electrical conductors supported by the insulating member; and electrical contacts of the edge-coupled optoelectronic device are electrically connected to respective conductors of the substrate assembly by electrical conductors which connect the contacts of the device to respective conductors of the subcarrier and electrical conductors which connect the conductors of the subcarrier to respective conductors of the substrate assembly.
the subcarrier comprises an electrically insulating member and electrical conductors supported by the insulating member; and electrical contacts of the edge-coupled optoelectronic device are electrically connected to respective conductors of the substrate assembly by electrical conductors which connect the contacts of the device to respective conductors of the subcarrier and electrical conductors which connect the conductors of the subcarrier to respective conductors of the substrate assembly.
16. A packaged device as defined in claim 15, further comprising a surface-coupled optoelectronic device which is mounted on a subcarrier which is oriented perpendicular to the substrate.
17. A packaged device as defined in claim 16, wherein:
the subcarrier of the surface-coupled optoelectronic device comprises an electrically insulating member and electrical conductors supported by the insulating member, the electrical conductors extending from a device-carrying surface of the insulating member over an edge of the insulating member to an end surface of the insulating member;
and electrical contacts of the surface-coupled optoelectronic device are electrically connected to respective conductors of the substrate assembly by electrical conductors which connect the contacts of the device to respective conductors on the device-carrying surface of the subcarrier and electrical conductors which connect conductors on the end surface of the subcarrier to respective conductors of the substrate assembly.
the subcarrier of the surface-coupled optoelectronic device comprises an electrically insulating member and electrical conductors supported by the insulating member, the electrical conductors extending from a device-carrying surface of the insulating member over an edge of the insulating member to an end surface of the insulating member;
and electrical contacts of the surface-coupled optoelectronic device are electrically connected to respective conductors of the substrate assembly by electrical conductors which connect the contacts of the device to respective conductors on the device-carrying surface of the subcarrier and electrical conductors which connect conductors on the end surface of the subcarrier to respective conductors of the substrate assembly.
18. A packaged device as defined in claim 16, wherein the edge-coupled optoelectronic device comprises an edge-emitting laser and the surface-coupled optoelectronic device comprises a surface-receiving photodetector which is aligned with and optically coupled to the laser.
19. A packaged device as defined in claim 18, further comprising a monitoring circuit which is mounted to the same subcarrier as the photodetector and which is electrically connected to the photodetector for monitoring the performance of the laser.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US385,599 | 1989-07-27 | ||
| US07/385,599 US4953006A (en) | 1989-07-27 | 1989-07-27 | Packaging method and package for edge-coupled optoelectronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2018900A1 CA2018900A1 (en) | 1991-01-27 |
| CA2018900C true CA2018900C (en) | 1993-08-17 |
Family
ID=23522090
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002018900A Expired - Fee Related CA2018900C (en) | 1989-07-27 | 1990-06-13 | Packaging method and package for edge-coupled optoelectronic device |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US4953006A (en) |
| CA (1) | CA2018900C (en) |
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| US6789235B1 (en) * | 2001-09-05 | 2004-09-07 | National Semiconductor Corporation | Bond program verification system |
| US7439449B1 (en) | 2002-02-14 | 2008-10-21 | Finisar Corporation | Flexible circuit for establishing electrical connectivity with optical subassembly |
| US7446261B2 (en) | 2001-09-06 | 2008-11-04 | Finisar Corporation | Flexible circuit boards with tooling cutouts for optoelectronic modules |
| AU2003209132A1 (en) * | 2002-02-14 | 2003-09-04 | Finisar Corporation | Header assembly having integrated cooling device |
| US7526207B2 (en) * | 2002-10-18 | 2009-04-28 | Finisar Corporation | Flexible circuit design for improved laser bias connections to optical subassemblies |
| US7061025B2 (en) * | 2003-03-10 | 2006-06-13 | Mccolloch Lawrence R | Optoelectronic device packaging assemblies and methods of making the same |
| US6860652B2 (en) * | 2003-05-23 | 2005-03-01 | Intel Corporation | Package for housing an optoelectronic assembly |
| US7255494B2 (en) * | 2003-05-23 | 2007-08-14 | Intel Corporation | Low-profile package for housing an optoelectronic assembly |
| US7275937B2 (en) * | 2004-04-30 | 2007-10-02 | Finisar Corporation | Optoelectronic module with components mounted on a flexible circuit |
| US7425135B2 (en) * | 2004-04-30 | 2008-09-16 | Finisar Corporation | Flex circuit assembly |
| US7311240B2 (en) * | 2004-04-30 | 2007-12-25 | Finisar Corporation | Electrical circuits with button plated contacts and assembly methods |
| US7629537B2 (en) * | 2004-07-09 | 2009-12-08 | Finisar Corporation | Single layer flex circuit |
| US7473889B2 (en) * | 2004-12-16 | 2009-01-06 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Optical integrated circuit package |
| US8033684B2 (en) * | 2007-08-31 | 2011-10-11 | The Boeing Company | Starry sky lighting panels |
| JP6576665B2 (en) * | 2015-04-01 | 2019-09-18 | 新光電気工業株式会社 | Optical device package and optical device |
| US10727144B2 (en) * | 2016-03-02 | 2020-07-28 | Sny Corporation | Light emitting apparatus and method of manufacturing light emitting apparatus |
| JP7311301B2 (en) * | 2019-04-19 | 2023-07-19 | シャープ株式会社 | light emitting device |
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| US3715635A (en) * | 1971-06-25 | 1973-02-06 | Bendix Corp | High frequency matched impedance microcircuit holder |
| US4410874A (en) * | 1975-03-03 | 1983-10-18 | Hughes Aircraft Company | Large area hybrid microcircuit assembly |
| JPS5586144A (en) * | 1978-12-25 | 1980-06-28 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Semiconductor device |
| JPS55148482A (en) * | 1979-05-08 | 1980-11-19 | Canon Inc | Semiconductor laser device |
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Also Published As
| Publication number | Publication date |
|---|---|
| CA2018900A1 (en) | 1991-01-27 |
| US4953006A (en) | 1990-08-28 |
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| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| MKLA | Lapsed | ||
| MKLA | Lapsed |
Effective date: 20050613 |