CA2030259A1

CA2030259A1 - Copolymer for use in preparing prepregs, printed circuit wiring boards prepared from such prepregs, and process for preparing such printed circuit wiring boards

Info

Publication number: CA2030259A1
Application number: CA002030259A
Authority: CA
Inventors: Linwood P. Tenney; Robert J. Minchak; Timothy J. Kettering; George M. Benedikt; David J. Smith
Original assignee: Linwood P. Tenney; Robert J. Minchak; Timothy J. Kettering; George M. Benedikt; David J. Smith; The B.F. Goodrich Company
Current assignee: Goodrich Corp
Priority date: 1989-11-22
Filing date: 1990-11-19
Publication date: 1991-05-23
Also published as: EP0430026A3; CN1081189A; CN1077919A; NO905042L; BR9005896A; JPH03227331A; EP0430026A2; NO905042D0; KR910009441A; CN1051921A; US5071701A

Abstract

ABSTRACT OF THE DISCLOSURE

Copolymers for use in preparing prepregs, which in turn are used to prepare printed circuit wiring boards are provided, as well as processes for producing the prepregs and wiring boards. The copolymers comprise repeating units derived from cycloolefin monomers, e,g., norbornene-type monomers, e.g., dicyclopentadiene-type monomers. Some of the monomers are silane-substituted while others are non silane-substituted. The silane-substituted monomers provide copolymers which exhibit improved properties when employed as the copolymers in prepregs for printed circuit wiring boards. For example, improved adhesion is achieved between the noncellulosic substrate and the polymers of components used in the wiring boards. These properties include, but are not limited to improved dielectric properties, improved adhesion to glass cloth substrates, etc.

Description

~3~3, 3~.

BFG-87014AUSl SR
Code 102689 TIT~E OF TH~ I~YENTI~N
COPOLYMER FOR USE IN PRE2~RING PREPREGS, PRINTED
CIRCUIT WIRING ~OA~DS P~EPAR~D FROM SUC~ P~EPREGS
AND PROCESSES FOR PREPA~ING SUCH PRINTED CIRCUIT
WIRING BOARDS

~CKGROUND OF T~ INVENTION
This invention relates to printed circuit wiring board,~, prepregs ~rom which they are prepared and to copolymers from which the prepregs are prepared. The copolymer~ comprise repeating units of polynorbornene structures. Some of th~ structures have been substituted with a silane substitutent and some have not been substituted. The silane substitution provides increased adhesion to various substrates, for example, glass cloth and copper.
Printed circuit wiring boards generally comprise at lea t one layer of glass cloth whirh has heen impregnated with a polymer or copolymer. These wiring boards are fabricat2d from prepregs. Pr~pregs are generally formed of glass cloth which has been impregnated with a polymer or copolymer and tilen partially cured so that ~urther curing can take place.
The prepregs are th~n generally arranged in a stacking sequence and subjected to heat and pressur~ so as to form a cured laminat~.
The laminates generally comprise at least one layer of prepreg and at least one layer of a conductive film, - . ~, .

, such as copper, which when image~ and etched serve to provide a printed circuit wiring board substrate.
Typical printed circuit wiring boards ars single layer or multilayer in configuration. The t~pical single layer printed circui~ ~iring ~oard comprises a central prepreg/substrate layer to which have been laminated two layers of conductive film (optionally only a single layer of conductive film may be laminated to the substrate layer). The conductive film is then imaged and etched to form the printed circuit mentioned above. If a multilayer printed circuit wiring board is desired, this procedure can be r~p~a~ed. Thus, typically, a structure similar to a single layer printed circuit wiring board is fabricated comprising a prepreg substrate aore and imaged and etched conductive film patterns on each major surface of the substrate.
SubsequQntly, additional layers of prepreg are configured in a stacking sequence on each major surface together with one or two layers of conductive film on the exterior major surfaces of the additional prepreg layers. The sequence is then subjected to heat and pressure in order to form a multilayer laminate comprising layers of conductive fil~, prepreg, conductive film, prepreg, etc Cellulosic and fiberglass cloths have long been used to reinforce polymeric substrate~ such as the prepregs discussed abov~. It is known that silane coupling agents can be applied directly to glass filaments to improve the properties, such as the strength o~ laminates such as those discussed above, often by as much as 300~ for compression molded test samples. It is believe~ that silane coupling agents at the interface allow many particulate ~aterials to act as reinforcing fillers in such laminate~ to increase various properties, such a~ strength, hardn~ss, modulus, heat distortion and impact strength. Flb~rglass cloth . . .
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is usually treated with a solution of a coupling agent.
This coupling agent can be a silane coupling agent and can be applied directly to the ~lass cloth.
The precise natur~ of th~ mechanism in which silane increases adhesion is not entirely understood. Silane coupling agents modi~y the interface between organic resin sur~aces and non-resins to improve adhesion. The physical properties are improved as a result. It is possible that the silan~ coupling agents form bonds with lo the non-resin ~urfaces and resin surfaceR through the silane functional group. Hydrolyzed silanes condense to oligomeric siloxanols and eventually to rigid cross-linked structures. Contact with a polymer matrix should take place while the siloxanol~ ~till have some solubility. The bonding to a polymer matrix may take various different forms. Bonding may be covalent where the siloxanol is compatible with the liquid matrix resin. The solu~ions might also form ~n interpanetrating polymer network as the siloxanols and the resins s2parately cur~ with only li~ited copolymerization.
It is well known that not all silanes or mixtures of silanes will bond all metals to all substrates. In McGae, U.S. 4,315,970, it is stated that:
ti]t is generally accepted that specific ~ilanes can be used for adhesion of specific materials to specific s~bstrates. That is, the silane must be matched to the application and it cannot be assumed that all silane~ will work in all applications.
This statement illustrates the unpredictability o~ the suitability of silane coupling agentq in improving adhesion of a metal to a subs~rate. Thus, this suitability must be determined by exp~rimentationO
While ~uitable coupling agents are commercially available for bonding of many common pla~tics with a variety of metals, th~ application of silane coupling agents for bonding of polynorbornenes to metals has only J
~4~

r~cently been developed (~ee U.S. Serial No. 228,034, ~iled August 4, 1988 and commonly assigned to the same assignee as the present invention). Norbornene-type monomers are polymerized by either a ring-opening mechanism or by an addition reaction whersin the cyclic ring structure remains intact. Ring-opening polymerization generally yields unsaturated linear polymers while addition poly~erization yields polycycloaliphatics. It is desirable to produce polymers havin~ high molecular weight repeating units incorporated ~herein to provide good temperature resistance, i.e~, high heat di~tortion temperatures and high yla s transition temperatures.
CA98:162025n and ~:162026p disclose laminates for .
use in preparing printed circuit boards. The laminates comprise an assembly of prepregs of paper-reinforcPd phenolic resin and copper foil. Polyethylene may be employed as an intermediate layer between the copper foil and the prepregs. Tha polyethylene layer is silane-modified in the presence of a radical-generating agent and is employed as an adhesive layer.
CA10?:8574p discloses laminates of glass fibers impregnated with silicon-modified epoxy resins which also contain polyethylene. A six-layered wiring board is prepared from 15 sheets o~ the prepreg and 6 sheets of coppar foil. CA107:8575q discloses similar laminates wherein epoxy resins, guanidine derivatives, fluoro plastics or polyolefins are employed as the resin.
"Some Approaches to Low-dielectric Constant Matrix Resins for Printed Circuit Boards~, Butler, et al., 15th National SAMPE Technical Con~erence, 1983, discloses general design consideratlon~ in the preparation of printed circuit boards. It discloses that the thermal cyclization of ~aterials to ~orm multicyclic structures has been employed in the pr~paration of print~d circuit boards. It discloses that "convent$onal silan~

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reaction~" may be employed to overcome the shortcomings of silicon and ~hat siloxane is a '3de~irable group~s]
for pol~mer segment structures'~. It al~o discloses hat coupling agents to improve adhesion can be employed.
Although printed circuit wiring board employing various materials, e.g., tho~e discussed above, are available, serious deficiencies in propertie~ still exist, ~uch as good adhe~ion, low dielectric constant, good punchability, good molten solder resistance characteristics and improved peel ~trength. Prior art printed circuit wiring board substrates fall short of optimizing these parameters and providing a spectrum of properties which is optimal. Thus, there has be~n a continuing need for improvement.

It is an object of this invention to provide printed circuit wiring boards having improved inter-layer adhesion. It is a ~urther object o~ ~his inven~ion to provide such printed circuit wiring boards having an improved spectxum of ov~rall properties, such as improved dielectric activities, molten solder resistance, peel strength, punchability, etc.. In vne aspect of this invention, these objects are obtained by providing a printed circuit wiring board comprising a conductive ~ilm laminated to 2 prepreg layer comprising a glass cloth impregnated with a polycycloolefin copolymer comprising silane-substituted repeating uni~s X'.-itJ
-derived by ring-opening poly~rization from monomers of th~ ~ormula R ~ R or ~ R6 I~

R3 ~5 wherein Rl and R6 is each independently sel~cted fro~ H, halogen, C~3, or C2-C~o alkyl;

R3 and R5 is each independently s~lected from H, halogen, CH3, C2-C10 alkyl, C2-C10 alkene, C6-C12 cycloalkyl, C6-Cl2 cycloalkene, C6-Cl2 aryl, or C6 Cl2 aryl substituted by Cl-C10 alkyl, or a silane group, or R3 and R5 25 - together for~ a satura~ed or unsaturated cyclic or mul~icyclic alkylen~ group o~
- from 2-10 carbon ato3s; and R2 and R4 i~ each independently selected ~rom ~ or 30 . a silane group.

It will be understood that at least on~ of R2 and Rb i~ sub~tituted by a silane group when R3 and Rs do not together for~ a cyclic alkylen~ group. When R3 and R5 form a cyclic alkylene group, this group i~ preferably silan~ substitut~d.

~ , ~. ' , It will al~o be under~tood that the cyclic or multicyclic alkylenQ group o~ R3-R3 i~ ~ean~ to include compounds wherein R3 R5 form cyclohe~yl-~ype s~ructures fuse~ to th~ ring o~ the ~truc~ure ~et ~orth in the formula. Thus, R3 and R5 can ~or~ a norbornyl-~ype structure.

R2 thrsugh R5 can al o be a polar sub~tituent surh o as a nitrile-, ester-, acrylate-, halog~n- or sulfur-containing groupO

In another, preferred a~pect of this inv~ntion, these objects are obtained by providing a printed circuit wiring board comprising a conductive fil~
laminated to a prepreg layer comprising a glass cloth impregnated wi~h a polycyclic copoly~er co~pri~ing silane-sub~tituted repeating units derived ~rom monomers of the fo~mulas ~ ~ III

~ ~ IV

wherein n=1-4 and R' and R8 are independently selected from hydrogen, halogen, Cl-~12 alkyl group~t C2-Cl2 alkylene group~, C6~C12 cycloalkyl group , C6-C12 cycloalkylen~ group3 and C6 C12 aryl group~, ~ilana or R7 and R8 toge~h2r form ~aturated or unsaturat~d cyclic group~ of from 4 to 12 carbon atoms with the two ring carbon atom~ connect~d th~r~to, said ring carbon ato~

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~orming part of and contributing to the 4 to 12 carbon atom~ in the cyclic group. At least one of R' and Ra is substituted by a ~ilane group/ when R7 and RB do not together form a cyclic group or groups. When R7 and R8 do together Porm a cyclic group or groups, the R7-R8 cyclic structure is silane substituted.
The prepregs produced from the copolymers of this invention hav~ low dielectric con~tants, e.g., from 3.5 - 2.6, preferably from 3.3 ~ 2.6. In highly pre~erred embodiments, dielectric constants of 3.0 or lower are obtained. The prepregs of this invention also have low dissipation factor~, for example, the prepregs of this invention have dissipation factors of from 0.01 - 0.001, preferably from 0.007 - O.001. In highly preferred embodiments of thi~ invention, the prepregs of this invention have a dissipation factor of 0.003 or lower.
The invention also provides related laminates, as well as copolymers derived ~rom the above-identified monomers.
DETAILED_DESCRIP~ION OF THE INVENTION
- This invention provides laminates, particularlyprinted circuit wiring boards, having a superior spectrum of propertie~. In particular, the printed circuit wiring boards of this invention have a superior spectrum of dielectric and structural properties, including lower dielectric constants and increased adhesion. They are prepared by laminating a sub~trate layer, such as one or more prepregs of fiberglass-reinforced ~ilane-~ubstituted polynorbornene copolymer to a conductive foil, for example, a copper foil, utilizing a silane coupling agent and optionally an intermediate layer of polyethylene.
In pre~erred embodiments of this invention, the prepre~s are prepared ~rom glass fibers which are impregnated with a polynorbornene by the u~e of a . . ~ .

.

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polynorbs~ n~ dipping solution. This ~olution compri~e~ ~olubilized pol~,rnorbornene polymer~3 . The polym~r~ ar~ obtained fro3l1 metathe8i~ ring-opening polymerization of cyclc)ol~afin ~snolaers having ~t least one norbornene functional group.
The norbornene monomer~ (cycloolefin mono~ers~ are characteriz~d by the presence o~ at least one norborn~ne ~oiety, for example, a moiety having a structure o~
Fo~mula I or II. At l~ast ~o~ o~ the monomer moi~ties contain a silane substituent, e.g., a substi~u~nt of ~he ~ormula -SiRRRlRll whe~in ~ach o~ R~ Rl Rll i~ qelect d independently from the group which lncludes H; halogen;
Cl-C12 alkyl; C6-C12 aryl; C6-Cl2 aryl ubstituted by Cl-C12 alkyl; Cl-C~2 alkoxy; halogen; or hydroxyl- The alkyl and alkoxy substituent~ preferably contain 1-4 carbon atoms, most preferably 1-2.
Small amounts of silane-sub~tituted norborn~n~s containing hetero atom~, (e.g. -o-, -C-, -NH-) c~n al~o be included. When smployed these compounds comprise 1 -10% of the composition based on the total weight of monomeric units present in the polymeric composition, pref~rably from 1 - 5%.
These compounds include monomers o~ the formula ~ X - Z -y - SiR9R R

wherein X i~ selec~ed ~ro~ C~, -C6H~-CH2 or alXylene of from 1-~ carbon atom~, pre~erably fro~ 1-2 carbon a~oms, and ~03t pre~erably -CH2-:

h ~

Z is selec~ed ~rom -0-, ~NH~, -O-CH2CH2-O-, or ~NH CHq~CH2~NH ;
Y is select~d from alkylene of ~rom 1-4 car~on atoms, preferably ~rom 1-3 carbon atoms~ and most preferably 3 carbon atom~; and R9, R' and R11 are each indep~ndently selected from hydrogen; Cl-C12 a1kyl, pre~erably Cl-C4 alkyl, most preferably Cl-c2 alkyl; C6-C12 aryl; C6-C~2 aryl substituted by cl-rl2 alkyl; C1-C~ alkoxy; and most pref2rably Cl-C2 alkoxy; halogen; or hydroxyl.

The cycloolefin copolymers comprise repeating units derived from silane-substituted and non silane-subs~ituted cycloolefin monomers. Suitable silane-substituted and non silane substituted cycloole~in monomers (for clarity the following nomenclature does not name the silane substitutent, although, when silane substituted, these mono~ers can be the silane-substituted mono~ers employed in the invention~ include substituted and unsubstituted norborneneæ, dicyclopentadienes, dihydrodicyclopentadienes, trim~rs of cyclopen1:adiene, tetracyclo-dodecenes, hexacycloheptadecenes, ethylidenyl norbornene~ and vinylnorbornenes. 5ub~tituents on the cycloolefin 2 5 monomers include hydrogen, alkyl, alkenyl, and aryl groups of 1 to 20 carbon atoms, and saturated and unsaturated cyclic groups of 3 to 12 carbon atoms which can be for~ed with one or more, pref~rably two, ring carbon atoms. In a preferred embodiment, ~he substituents (exclusive of the silane substitutents) are selected from hydrogen and zlkyl group~ of 1 to 2 carbon atoms. Generally ~peaking, ths substituents on the cycloolefi~ monomers can be any which do not poison or deactivate the polymerization cataly~t. Example~ of th~
preferred monomers re~erred to herein include dicyclopentadiene, ' ' '' , J

2-norbornene, and other norbornene mono~er~ such as 5-methyl~2-nor~ornene, 5,6~dimethyl-2-norbornene, 5-ethyl-2-norbornene, g-ethylidenyl 2-norbornenetor5-ethylidene norbornene), 5-butyl-2-norbornene, 5-hexyl-2-norborne~e, 5-octyl-2-norbornene, 5-phenyl-2-norbornene, 5-dodecyl-~-norbornene, 5-isobutyl-2-norbornene, 5-octadecyl-2-norbornene, 5-isopropyl-2-norbornene, 5-phenyl-2-norbornene, 5-p-toluyl-~-norbornene, 5-~-naphthyl-2-norbornene, 5-cyclohexy1-2-norbornene, 5-isopropenyl-norbornene, 5-vinyl-norbornene, 5,5-dimethyl-2-norbornene, tricyclopentadiene (or cyclopentadiene trimer), tetracyclopen~adiene (or cyclopent~diene tetramer), dihydrodicyclopentadien@ (or cyclopentene-cyclopentadiene co-dimer~, methyl-cyclopentadien~ dimer, ethyl-cyclopentadiene dimer, tetracyclododecene, 9-methyl-tetracyclo[6~2~ll 13 ~ 6, o2~ 7 ] dodecene~4 (or methyl-tetracyclododecene), 9-ethyl-tetracyc:lo[6,2~ 36~o2~7]dodecene-4 (or ethyl-tetracyclododecen~), 9-propyl-tetracycloC6,2,1, 13 ~ 6 ~ o2~ 7 ] dodecene~4, 9-hexyl-tetracyclo~6,2,1, 13 ~ ~, o2, 7 ~dodecene-4, 9-decyl-tetracyclot6,~ 3 ~ 6 ~ o2~ 7 ] dodecen~-4, 9,10-dimethyl-tetracyclo[6,2,1,13~6,02~7]dodecene-4, ~ ~r~
12~

9-methyl,10 ethyl-tetracyclo[6,2,1, 13~6, o2~7]
dod~cen~-4, 9-cyclohexyl-tetracyclot6,2,1, 13 ~ 6 ~ o2, 7 ]dodecene-4, 9-chloro-tetracyclo[6,2,1, 13 ~ 6, o2 , 7 ] dodecene-4, 9-bromo-tetracyclo[6,2,l,l3~6,02~7]dodecene-4, 9-fluoro-tetracyclo[6,2,l,13~6,02~7]dodecene-4, 9-isobutyl-tetracyclo[6,2,l,l3~6,02~7]dodecene 4, and 9~10-dichloro-tetracyclo[6~2~1,13~6~02~7]dodecene-4.
This invention e~pecially conte~pla~es the use of one or more of the~e monomers so as to provide either homopolymers or copol~mers upon polymerization.
Other monomers can for~ part of the poly-norbornenes ~uch as non-conjugated acyclic olefins, monocyclic olefins and diolefins. The non conjugated acyclic olefinY act as chain ter~inators in the ring opening polymerization. Terminal olefins are most preferred, e.g., alpha-olefins. Thus monomers like hexene-l are preferred while l-butene, 2-pentene, 4-methyl-2-pentene, and 5-ethyl 3-octene are suitable also. They are typically used at a molar ratio o~
0.001:1 to 0.5:1 acyclic olefin to cycloolefin monomer.
The polynorbornenes used in forming the printed wire boards of the present invention are obtained by solution polymerization. For solution polymerization, the catalyst preferably comprises molybdenum or tungsten salt~ and the co-catalyst preferably comprises dialkylaluminum halides, alkylaluminum dihalides, alkylalkoxy halides or a mixture of ~rialkylaluminum with an iodine source.
Examples of useful molybden~m and tungst~n salts includ~ the halide~ su h as chlorides, bromides, iodides, and fluorides. Specific examples of such halidQs include molybd~num pentachloride, molybdenum hexachloride, molybdenum pentabromide, molybdenum hexabromide, molybdenum pentaiodid~, molybdenum hexafluoride, tungsten hexachloride, tungsten f~ ~ ~r hexafluorid~ and the like. other representativ~ salts include tho~e o acetylacetonate~, sulfates, pho~phates, nitrates, and thQ like. ~ixtures of salts can also be used. For polymerization results, the more preferred salts are the molybdenum halide~, esp~cially molybdenum pentahalides such as MsCl5.
Specific example~ of co-catalyst~ for ring-op~ning solution polymerization include alkyl-aluminum halides such as ethylaluminum sesquichloride, diethylaluminum chloride, diethylaluminum iodide, ethylaluminum diiodide, propylaluminum diiodid2 and ethylpropylaluminum iodide and a mixture of triethylaluminum and elemental iodine.
For solution polymeriza~ion, the molybdenum or tungsten salt is generally employed at a level ~rom about 0.01 to about 50 millimoles per mole of total monomer, preferably from about 0.5 to about 10 millimoles per mole of total monomer and the organoaluminum compounds described above are generally used in a molar ratio of organoaluminum compound to molybdenum an~/or tungsten salt(s) from about 10/1 to about 1/3, preferably from about 5/1 to about 3/1. Both catalyst and co-catalyst for solution polymerization are normally added at the time of polymerization.
Suitable solvents used for the solution polymerization and in forming the dipping solution include aliphatic and cycloaliphatic hydrocarbon solvents ~ontaining 4 to 10 carbon atoms such as cyclohexane, cyclooctane and the like; aromatic hydrocarbon solvents containing 6 to 14 carbon atoms which are liquid or ea~ily liquified such as benzene, toluene, xylene and the like; and substituted hydrocarbons wherein the substituents are inert such as dichloromethan2, chloroform, chlorobenzene, dichlorobenzene and the liXe.

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Optionally pre~ent within the dipping solution are curing agent~ which initlate radical cro~-linking such as the p¢roxide~, di-t-butyl peroxide, or 2,5-di~ethyl-2,5-ditt-butylperoxy)-h~xyna 3. Antioxidants such as hindered phenol antioxidants (~thyl 330) and polyun~aturated monomeric or oligomeric cross-linkers such as trim2thylol-propane triacrylate are also optionalL The dipping solution ha~ a solids content of preferably about 10% to about 40%. Dipping solution~
having concentrations both above and below thi~ range can be used in ~orming the laminates of the invention.
The dipping solution is impregnated into a non-cellulosic cloth, such as ~iberglass, ~o form a substrate layer, often referred to a a prepreg. The cloth may be woven or non-woven. ~ ny glass cloth materials having a variety of surface characteristics are available commercially. In the present invention E-type fiberglass cloth, style 2116~ having a surface finish type 642 or 627 (which refer~ to a silane treatment) made by Burlington Industries is preferred.
The non-cellulosic cloth is impregnated by i~mersing it in the dipping solution of the polynorhornene diluted in an organic solvent~ This can be accomplished at ambient tempera~ures or at the temperatures above or below ambient temp~rature~.
~n amount of copolym~r sufficient to provide a weight-to-wei~ht ratio o~ copolymer to glass in the finished prepreg of from about 30:70 to about 80:20 on a weight-to-weight basis is suitably employed.
Pxeferably amounts ~o provide from about 40:60 to about 70:30, and most preferably from about 50:50 to aboùt 65:35 are ~mployed.
The glass cloth may be pretreated with a silane solution. A pre~erred class of pretr~ating agents is th~ styryl-diamino-alkoxy silan~s.

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The prepreg so produced i8 typically dried at temperature~ between a~bient te~p~rature and about 150C. At final sta~es of drying the t~mperature is preferably maintained above the glass transition temperature (~g) of the polymer to per~it the solvent to diffu3e out. I~ curing agents are present, the temperature is kept sufficiently low to prevent activation of radical cro~s-linking~
The laminate~ produced by th9 prasent invention incorporate a conductive foil, pr ferably a copper ~ilm with a copper ~urface layer, such as copper foil. This copper foil can be the surPace layer of other metallic films. Th~ copp~r surface layer is pretreated with a silane solution which increases the bond strength between the substrate and the copper surface layer.
Prior to lamination the copper ~oil can be treated for ~xample, for 1 minute by dipping in a 0.4% solution of 3-~N-styrylmethyl-2-amino~ethyl)-aminopropyltri~ethoxy-silane hydrochloride in methanol as an adhesion promoter. The treated foil can be subjected to a short bake for 5 minut~s at 105 C. Preferably, copper foil o~
the type ~anufactured for printed wiring boards with a matte side for lamination to a prepreg is pretreated with such a solution of silane coupling agent before being lam~nated to the prepreg. Such copper foils are typically about 35 microns thick and have a dendritic bronz~ matte surface.
It is also feasible to employ a composite conductive sheet in which one face of the sh~et i^
copper and the other is an appropriate ~etal such as tin, silver, gold, solder, aluminum, platinum, ~itanium, zinc, chromQ, or an alloy o~ one or mor~ of these metals with each other or copper. Additionally, the conductive foil may be composed of entirely only one of the above metal~.. Particularly ~uitable metal foils or films are available Pro~ Gould, Inc..

~3~2~

ol6--Laminate~, ~uGh a~ printed circuit wiring boards, can be pr~pared by lamina~ing t~ pre-treated conductive layer to the substrate layer ~prepreg). The lamination step~ can involve fully conventional conditions well-known to thos2 of ordinary skill ln the art. For example, one of ordinary ~kill in the art can easily determine optimum presRure and temperature condition6 at which the lamination ~hould be carried out, perhap~ with a few routin~ optimization experiment L~mination can suitably be accomplished in a heated press using pressures above about 700 psi; prePerably i,000-1,100 psi, and at te~peratures between a~bient temperature and 250 C, but preferably b~tween 170 C and 190 C.
Preferably, the lamination te~pera~ure is above the glass transition temperature of the polymer and is su~iciently high to activate any curing agents which are employed, e.g., p~roxide curing agents~ At such tempera~ures, the curing agents, particularly peroxide curing agents will rel~ase an oxygen free-radical which 2Q causes cross-linking. Cross-linking provides strength and chemical resistance ~o the boards. Generally, a stack of prepreg~ can be pressed between a pair of pre-treated copper foils. The pre-treated bronze side of the copper foil is placed in contact with the prepreg.
Many o~ the silane-substituted monomers of this invention are readily commercially available. Moreover, the silane-~ubstituted monomers of this invention may be easily prepared by introducing silicon atoms into the polynorbornene~. This is accomplished by reacting a diene monomer (cycloolefin monomer) with a diensophile containing silicon. For example, a silane~sub~itu~ed monomer can be prepared from cyclop~ntadiene and a dieneophile containing ilicon. Si~ilarly, a t~tracyclododecene could be obtain~d. This pro~edure is easily accomplished, and involves ~ully conventional conditionc and material~ (e.g., conv~ntion~l catalysts, ~3~?~3~
-etc.). The silane co~pounds o~ fo~mula V are prepared in the ame way. Tho~e of ordinary skill in the art will readily be able to s~lect ~he op~i~um starting materials and reaction conditions.
Suitable silicon-containing dieneophiles are fully conventional, readily available and can be easily selected by thoæe of ordinary skill in the art.
Examples of suitable dieneophile~ include vinyltriethoxysilane, vlnyltrichlorosilane and vinyldichlorom~thylsilane. However, many others exist and are readily availableO
The silane-substituted monomers are then copolymerized with non silane-substituted monomers to produce a silane-substituted copolymer comprising polycycloolefins. Examples of suitable and preferred silane-substituted monomers include norbornenylsilane, norbornenyl methyldichlorosilane, norbornenyltriethoxysilane (or 5-(bicycloheptene)-2 triethoxysilane), etc. In an exemplary embodiment, 5-(bicycloheptene)-2-triethoxysilane is copolymerized with 2-methyl-5-norbornene to produce a polycycloolefin containing functional silan2 groups. The copolymerization advantageously takes place under the conditions di~cussed abov~.
A ratio of silane-substituted monomer to non silane-sub tituted monomer of from about 95:5 to about 1:99 is suitably employed on a weight-to-weight basis.
Preferably, a ratio of from about 80:50 to about 3:97 is employed and most preferably a ratio of from about 20:80 to about 5:95.
Prepregs produced from such copolymers exhibit improved polymer-glas3 adhesion, improved plasma etch resistance, lower dielectric constants and lower dis~ipation factors.
The silane-substituted copolymer o~ this invention are employed to produce prepregs in the sa~e way that .

- `~ 2 ~ 3 ~ æ~ ~) non silan~-~ubs~ituted polycyloole~in~ have been e~ploy~d to produce printed circuit wiring board~. The procedure for producing ~uch wiring boards and related laminates i9 set forth below:

Preparation o~ 70/30 (wt/wt) Methyltetracyclod~decene ~mtd~
5-~ri~thoxy$ilyl-~-n~or~ene ~N~ ~o~lxmer An unsaturated polynorbornene polymer was obtained in the following manner. Into a ~eptum capped vessel containing 150 g. o~ molecular sieves were added 400 g.
of dry toluene, 80.3 g. of methyl tetracyclododecene, 35 g. triethoxysilyl norbornene and 26.5 g. hexene~
The contents were mixed and this mixture was allowed to stand 30 minu~es, then transferred to a second vessel by pas~ing it through a 1 micron filter under nitrogen pressure. The vessel was slightly pressurized with nltrogen. To the mixture 2.77 cc of a 25% ~olution of ethyl-sesquichloride (EASC cocatalyst) in dry toluene were introduGed by syringe. To this mixture, 9.77 cc of a solution o~ 2 g. o~ ~olybdenum pentachloride catalyst in 39 g. of dry ethylacetate and 84 g. of dry toluene, were also introduced by syringe. Within one minute, an exothermic reaction of the mixture resulted and the mixture became a viscous liquid. After 15 minutes, 60 cc of a 88/12 ~wt/wt) mixture o~ 2-propanol and water was added to the vessel and the contents shaken to inactivate the catalyst. The top layer, containing mostly solven~s, residual ~onomers and low molecuIar weight polymers, was poured off. The semisolid bottom layer wa~ redi3~01ved in 100 cc of toluene, wa~hed with water and dried by azeotroplc distillation of part of the solvent.
Polymeriæation was found to ba 93% conversion o~
monom~r a~ calculated by mea~uring ths percent weight ,: , . , . . . .
- .

~ . .
. , '' ' ,, .

f r ) ~19 -colid~ o~ the re~ulting polymer so~lution. The glass transi~ion temperature (Tg) was found ~o be 138C in the second heat, as calculated fro~ a Differential Scanning Calorimetry ~urve of a sampl~ of the polymer that was diluted in toluene/ precipitated into methanol with stirring, ~iltered and dried.

Ste P~e~3~t onQ i Prep~e~
The prepreg formulation used consisted of a 25%
solution o a 70/30 twt/wt) copoly~er o~
methyltetracyclodocene (MTD~ and 5 tri~thoxysilyl-2-norbornene (SiN8) also containing 3.5 p.h.r. (parts per hundred resin) of Lupersol 130, peroxide from Penwalt Co. Lucidol Division, and l p.h.r. o~ Irqanox lOlO
antioxidant from Ciba Geigy Co. The polymer had a dilute solution visco~ity (DSV) in toluene o~ 0.5 and it wa~ obtained by ring opening polymerization of above monomers in toluene, in the presence of hexene-1 as a molecular weight modifier, using molybdenum pentachloride and ethyl-aluminum sesquichloride as the catalyst system.
The above formulation was impregnated, by dipping, onto a glass cloth style 2~16, having a fini~h 642 from Burlington Industries. After air drying to a tack-free condition, the residual solvent was eliminated in a mechanical convection oven for 15 minutes at 50C, 15 at 75 C, ~0 at 100 C and 10 at 130 C~ The residual amount o~ volatiles was measured to be below 2.5% at 200 C by Thermogravimetric Analysis.

~ J`~J

Two layers of above prepreg~ were laminated in-b~tween electrodepo~itQd copper oil, containing a proprietary bronze ~reatmen~ on the mat~e ~ide (TC treat~ent from Gould Ina., Po$1 Division). The lamination and cure wa~ perfon~d in a pres at ~rom 40 to 190 C for 25 minute~ and, i~othermally at ~39 C for 3 hrs., using a pressure of 700 psi.
The copper on both sides of the laminate was imaged and etched using a 1 molar solution of ammonium persulfat2. The etched board was at this point a cured substituted polynorbornene c-stage board.
The following examples illustrate how various copolymers of this invention perfor~ when employed in printed circuit wiring boards oP this invention. In these examples and throughout the specification, all parts and percentages are by weight and all temperatures are in de~rees Celsiuæ, unles~ expressly stated otherwise.

~xam~

Printed circuit wiring boards were prepared from prepregs of glass mat impregnated with various copolymers. The polymers were prepared from monomers according to the following table using molybdenum pentachloride in toluene with added ethyl acetate as cataly~t and ethyl aluminu~ sesquichloride in toluene as cocatalyst. Hexene-l was used as a chain tran~fer agent to control molecular weight. The polymer was formulated in a formulation containin~ 1% Lupersol 130 and impregnated on a glas~ cloth having a typical amino silane traatmen~ used ~or epoxy resin formulations.
After cure o~ the prepregs in a pres3 at 270 C khe . .

. .

~3~; '3 -2~-adhasion of the poly~er to glass wa~ determined by scanning elec~ron micro~copy o~ an interface obtained ~y fra¢ture at liquid nitrogen temperature. The polymers containing the silicon compound ~howed good adhesion to yla~s fiber bundles, while a control prepreg made of a polymer of MTD/MNB 90-10 showed poor adhesion at the glass poly~er interface. The dielectric constant of the copolymers was then measur2d at ambient conditions using a GenRad 1687B l-Megahertz LC Digibridge at ~ frequency of l-MHz. The results ar~ set forth below.
Dielectric # Pol~mer C~mposition (PartsL CQnstant 1 70/30 MTD/SiNB-glas8 3.2 2 70/10/20 MTD/MNB/SiNB-glass 3.3 3 70/20/10 ~TD/MNB/SiNB-glass 3.1 4 70/25/5 M~D/MNB/SiNB-glass 3.2 70/29/1 MTD/MNB/SiNB-glass 3.0 Control Epoxy-&lass 4.1-3.5 (FR-4) MTD = methyl tetracyclododecene MNB = methylnorbornene SiNB = 5-(bicycloheptene-2-yl)-triethoxy-silane While the invention has been di~closed in this specification by reference to the details of preferred embodiments of the invention, it is to be understood that the disclosure is intended in an illustrative, rather than in a limiting sense, as it is contemplat~d that modifications will readily occur to those skilled in the art, within the spirit of the invention and the scope of the appended claims.

Claims

1. A printed circuit wiring board comprising a conductive film laminated to a prepreg layer comprising glass cloth impregnated with a polycycloolefin copolymer comprising silane-substituted repeating unites derived by ring-opening polymerization from monomers of the formula or wherein R1 and R6 are each independently selected from H, halogen, CH3, C2-C10 alkyl;

R3 and R5 are each independently selected from H, halogen CH3, C2-C10 alkyl, C2-C10 alkene, C6-C12 cycloalkyl, C6-C12 cycloalkene, C6-C12 aryl, or C6-C12 aryl substituted by C1-C10 alkyl or a silane group, or R3 and R5 together form a saturated or unsaturated cyclic alkylene group of from 2-10 carbon atoms, with the proviso that when R3 and R5 together form a saturated or unsaturated alkylene group, said saturated or unsaturated alkylene group is further substituted by a silane group;

R2 and R4 are each independently selected from H or a silane group, with the proviso that when R3 and R4 do not together form an alkylene group, at least one of R2 and R4 is a silane group.

2. A printed circuit wiring board of claim 1 wherein said silane group is a substuent of the formula -SiR9R10R11 wherein each of R9, R10, R11 is selected independently from the group which includes H;
halogen; C1-C12 alkyl; C6-C12 aryl; and C6-C12 aryl substituted by C1-C12 alkyl; C1-C12 alkoxy; and hydroxyl.

3. A printed circuit wiring board of claim 2 wherein said silane group is a trialkoxysilane.

4. A printed circuit wiring board of claim 3 wherein said trialkoxysilane is triethoxysilane.

5. A printed circuit wiring board of claim 2 wherein said silane group is an alkylalkoxy silane.

6. A printed circuit wiring board of claim 1 wherein the ratio of silane-substituted monomer to non silane-substituted monomer is from about 95:5 to about 1:99.

7. A printed circuit wiring board of claim 1 wherein the ratio of polycycloolefin copolymer to glass cloth is from about 75:25 to about 30:70.

8. A printed circuit wiring board of claim 1 wherein the conductive film is copper and the surface of the copper film which is laminated to the prepreg layer has a bronze coating.

9. A printed circuit wiring board of claim 1 wherein at least one monomer of the polycycloolefin is derived from a cycloolefin monomer selected from methylnorbornene, methyltetracyclododecene, tetracyclododecene, vinyl-norbornene or dicyclopentadiene.

10. A printed circuit wiring board of claim 1 wherein said polycyclic copolymer is derived form silane-substituted and non silane-substituted monomers selected from dicyclopentadiene, 2-norbornene, and other norbornene monomers such as 5-methyl-2-norbornene, 5,6-dimethyl-2-norbornene, 5-ethyl-2-norbornene, 5-ethylidenyl-2-norbornene (or 5-ethylidene-norbornene), 5-butyl-2-norbornene, 5-hexy1-2-norbornene, 5 octyl-2-norbornene, 5-phenyl-2-norbornene, 5-dodecyl-2-norbornene, 5-isobutyl-2-norbornene, 5-octadecyl-2-norbornene, 5-isopropyl-2-norbornene, 5-phenyl-2-norbornene, 5-p-toluyl-2-norbornene, 5-.alpha.-naphthyl-2-norbornene, 5-cyclohexyl- 2-norbornene, 5-isopropenyl-norbornene, 5-vinyl-norbornene, 5,5-dimethyl-2-norbornene, tricyclopentadiene (or cyclopentadiene trimer), tetracyclopentadiene (or cyclopentadiene tetramer), dihydrodicyclopentadiene (or cyclopentene-cyclopentadlene co-dimer), methyl-cyclopentadiene dimer, ethyl-cyclopentadiene dimer, tetracyclododecene 9-methyl-tetracyclo[6, 2,1, 13, 6, O2,7]dodecene-4, (or methyl-tetracyclododecene) 9-ethyl-tetracyclo[6,2,1,13,6,O2,7] dodecene-4 (or ethyl-tetracyclododecene) 9-propyl-tetracyclo[6,2,1, 13,6, O2, 7]dodecene-4, 9-hexyl-tetracyclo[6,2,1, 13,6, O2, 7]dodecene-4, 9-decyl-tetracyclo[6,2,1,13,6,O2,7]dodecene-4, 9,10-dimethyl-tetracyclo[6,2,1,13,6,O2,7]dodecene-4, 9-methyl,10-ethyl-tetracyclo[6,2,1,13,6,O2,7]
dodecene-4, 9-cyclohexyl-tetracyclo[6,2,1, 13,6, O2,7]dodecene-4, 9-chloro-tetracyclo[6,2,1, 13 , 6 , O2, 7]dodecene-4, 9-bromo-tetracyclo[6,2,1, 13, 6 , O2, 7]dodecene-4, 9-fluoro-tetracyclo[6,2,1,13,6,O2,7]dodecene-4, 9-isobutyl-tetracyclo[6,2,1,13,6,O2,7]dodecene-4, or 9,10-dichloro-tetracyclo[6,2,1,13,6,O2,7]dodecene-4.

11. A printed circuit wirinq board of claim 1 wherein the polycycloolefin copolymer further comprises an amount of from about 1 wt.% to about 10 wt.%, based on the total weight of monomeric units present in the polymeric composition, of units derived from monomers of the formula Wherein X is selected from -C-, -C5H4-CH2- or alkylene of from 1-4 carbon atoms;
Z is selected from -0-, -NH-, -0-CH2-CH2-0-, or -NH-CH2-CH2-NH-;
Y is selected from alkylene of from 1-4 carbon atoms; and R9, R10 and R11 are ach independently selected from hydrogen, hydroxyl, C1-C12 alkyl; C5-C12 aryl; C6-C12 substituted by alkyl; halogen; or C1-C12 alkoxy.

12. A printed circuit wiring board comprisintg a conductive film laminated to a prepreg layer comprising a glass cloth impregnated with a polycyclic copolymer comprising silane-substituted repeating units drived from monomers of the formulas wherein n=1-4 and R7 and R8 are independently selected from hydrogen, halogen, C1-C12 alkyl groups, C2-C12 alkylene groups, C6-C12 cycloalkyl groups, C6-C12 cycloalkylene groups and C6-C12 aryl groups, silane or R7 and R8 together from a saturated or unsaturated silane substituted cyclic group of from 4 to 12 carbon atoms with the two ring carbon atoms connected thereto, said ring carbon atoms forming part of and contributing to the 4 to 12 carbon atoms in the cyclic group with the proviso that, when R7 and R8 do not together form said cyclic group, at least one of R7 and R8 is

13. A printed circuit wiring board of claim 12 wherein said silane group is a substituent of the formula -SiR9R10R11 wherein each of R9, R10, R11 is selected independently from the group which includes H;
halogen; C1-C12 alkyl; C6-C12 aryl; and C6-C12 aryl substituted by C1-C12 alkyl; C1-C12 alkoxy; and hydroxyl.

14. A printed circuit wiring board of claim 13 wherein said silane group is a trialkoxy silane.

15. A printed circuit wiring board of claim 14 wherein said silane group is triethoxysilane.

16. A printed circuit wiring board of claim 13 wherein said silane group is an alkylalkoxy silane.

17. A printed circuit wiring board of claim 12 wherein the ratio of silane-substituted monomers to non silane-substituted monomers is from about 95:5 to about 1:99.

18. A printed circuit wiring board of claim 12 wherein the ratio of polycyloolefin copolymer to glass cloth is from about 75:25 to about 30:70.

19. A printed circuit wiring board of claim 12 wherein the conductive film is copper and the surface of the copper film which is laminated to the prepreg layer has been pretreated with a bronze coating.

20. A printed circuit wiring board of claim 11 wherein X is alkylene of from 1-2 carbon atoms.

21. A printed circuit wiring board of claim 20 wherein X is CH2 or -C6H4-CH2-.

22. A printed circuit wiring board of claim 11 wherein X is -C-.

23. A printed circuit wiring board of claim 11 wherein Z is -O-.

24. A printed circuit wiring board of claim 11 wherein Z is -NH-.

25. A printed circuit wiring board of claim 11 wherein Z is -O-CH2CH2-O-.

26. A printed circuit wiring board of claim 11 wherein Z is -NH-CH2-CH2-NH-.

27. A printed circuit wiring board of claim 11 wherein Y is alkylene of from 1-3 carbon atoms.

28. A printed circuit wiring board of claim 27 wherein Y is alkylene of 3 carbon atoms.

29. A printed circuit wiring board of claim 11 wherein at least one of R9, R10 and R11 is C1-C4 alkyl.

30. A printed circuit wiring board of claim 29 wherein at least one of R9, R10 and R11 is C1-C2 alkyl.

31. A printed circuit wiring board of claim 11 wherein at least one of R9, R10 and R11 is aryl substituted by C1-C? alkoxy.

32. A printed circuit wiring board of claim 31 wherein at least one of R9, R10 and R11 C1-C2 alkoxy.

33. A printed circuit wiring board of claim 31 wherein at least one of R9, R10 and R11 hydroxyl.

34. A composition suitable for impregnating a glass cloth to form a prepreg, the composition comprising a polycyclic copolymer comprising silane-substituted and non silane-substituted repeating units derived from monomers of the formulas wherein n=1-4 and R7 and R8 are independently selected from hydrogen, halogen, C1-C12 alkyl groups, C2-C12 alkylene groups, C6-C12 cycloalkyl groups, C6-C12 cycloalkylene groups and C6-C12 aryl groups, silane or R7 and R8 together form saturated or unsaturated silane substituted cyclic group of from 4 to 12 carbon atoms with the two ring carbon atoms connected thereto, said ring carbon atom.
forming part of and contributing to the 4 to 12 carbon atoms in the cyclic group with the proviso that, when R' and R9 do not together form said cyclic group, at least one of R7 and R8 is a silane group.

35. A composition of claim 34 wherein said silane group is a substituent of the formula -SiR9R10R11 wherein each of R9, R10, R11 is selected independently from the group which includes H; halogen; C1-C12 alkyl;
C6-C12 aryl; and C6-C12 aryl substituted by C1-C12 alkyl; C1-C12 alkoxy and hydroxyl.

36. A composition of claim 35 wherein said silane group is a trialkoxysilane.

37. A composition of claim 36 wherein said trialkoxysilane is triethoxysilane.

38. A composition of claim 35 wherein said silane group is an alkylalkoxy silane.

39. A composition of claim 34 wherein the ratio of silane-substituted monomer to non silane-substituted monomers is from about 95: 5 to about 1:99.

40. A composition of claim 34 wherein the ratio of silane-substituted monomer to non silane-substituted monomer is from about 75:25 to about 30:70.

41. A composition of claim 34 wherein at least one monomer of the polycycloolefin is unsaturated and derived from a cycloolefin monomer selected from methylnorbornene, methyltetracyclododecene, tetracyclododecene, vinyl-norbornene, dicyclopentadiene.

42. A composition of claim 34 wherein said polycyclic copolymer is derived from silane-substituted and non silane-substituted monomers selected from dicyclopentadiene, 2-norbornene, 5-methyl-2-norbornene, 5,6-dimethyl-2-norbornene, 5-ethyl-2-norbornene, 5-ethylidenyl-2-norbornene (or 5-ethylidene-norbornene), 5 butyl-2-norbornene, 5-hexyl-2-norbornene, 5-octyl-2-norbornene, 5-phenyl-2-norbornene, 5-dodecyl-2-norbornene, 5-isobutyl-2-norbornene, 5-octadecyl-2-norbornene, 5-isopropyl-2-norbornene, 5-phenyl-2-norbornene, 5-p-toluyl-2-norbornene, 5-.alpha.-naphthyl-2-norbornene, 5-cyclohexyl-2-norbornene, 5-isopropenyl-norbornene, 5-vinyl-norbornene, 5,5-dimethyl-2-norbornene, tricyclopentadiene (or cyclopentadiene trimer), tetracyclopentadiene (or cyclopentadiene tetramer), dihydrodicyclopentadiene (or cyclopentene-cyclopentadiene co-dimer), methyl-cyclopentadiene dimer, ethyl-cyclopentadiene dimer, tetracyclododecene 9-methyl-tetracyclo[6,2,1, 13.6,02.7] dodecene-4, (or methyl-tetracyclododecene) 9-ethyl-tetracyclo[6,2,1,13,6,02,7]dodecene-4, (or ethyl-tetracyclododecene) 9-propyl-tetracyclo[6,2,1,13,6,02,7]dodecene-4, 9-hexyl-tetracyclo[6,2,1,13,6,02,7]dodecene-4, 9-decyl-tetracyclo[6,2,1,13,6,02,7]dodecene-4, 9,10-dimethyl-tetracyclo[6,2,1,13,6,02,7]dodecene-4, 9-methyl,10-ethyl-tetracyclo[6,2,1,13,6,02,7]
dodecene-4, 9-cyclohexyl-tetracyclo[6,2,1,13,6,02,7]dodecene-4, 9-chloro tetracyclo[6,2,1,13,6,02,7]dodecene-4, 9-bromo-tetracyclo[6,2,1,13,6,02,7]dodecene-4, 9 fluoro-tetracyclo[6,2,1,13,6,02,7]dodecene-4, 9-isobutyl-tetracyclo[6,2,1,13,6,02,7]dodecene-4, or 9,10-dichloro-tetracyclo[6,2,1,13,6,02,7]dodecene-4.

43. A process for producing a printed circuit wiring board comprising the steps of (a) providing a dipping solution comprising polynorbornene polymers dissolved within a solvent wherein the polynorbornene polymers comprise a polycyclic copolymer comprising silane-substituted repeating units derived from monomers of the formulas wherein n=1-4 and R7 and R8 are independently selected from hydrogen, halogen, C1-C12 alkyl groups, C2-C12 alkylene groups, C6-C12 cycloalkyl groups, C6-C12 cycloalkylene groups and C6-C12 aryl groups, silane or R7 and R8 together from a saturated or unsaturated silane substituted cyclic group of from 4 to 12 carbon atoms with the two ring carbon atoms connected thereto, said ring carbon atoms forming part of and contributing to the 4 to 12 carbon atoms in the cyclic group with the proviso that, when R7 and R9 do not together form said cyclic group, at least one of R7 and R8 is a silane group;

(b) impregnating a glass cloth with the dipping solution and drying the impregnated cloth to remove a substantial portion of the solvent to form a prepreg to function as a substrate layer;

(c) laminating and curing the prepreg layer to the treated surface of the conductive film.

44. A process of claim 43 wherein said silane group is a substituent of the formula -SiR9R10R11 wherein each of R9, R10, R11 is selected independently from the group which includes H; halogen; C1-C12 alkyl; C6-C12 aryl; and C6-C12 aryl substituted by C1-C12 alkyl, C1-C12 alkoxy and hydroxyl.

45. A process of claim 43 wherein said silane group is a trialkoxysilane.

46. A process of claim 45 wherein said trialkoxysilane is triethoxysilane.

47. A process of claim 44 wherein said silane group is an alkylalkoxy silane

48. A process of claim 43 wherein the ratio of silane-substitued monomers to non silane substituted monomers is from about 95:5 to about 1:99.

49. A process of claim 43 wherein the ratio of copolymer to glass is from about 75:25 to about 30:70.

50. A process of claim 43 wherein the conductive film is copper and the surface of the copper film which is laminated to the prepreg layer has been pretreated with a bronze coating.

51. A process of claim 43 wherein at least one monomer of the polycycloolefin is unsaturated and derived from a cycloolefin monomer selected from methylnorbornene, methyltetracyclododecene, tetracyclododecene, vinyl-norbornene, dicyclopentadiene.

52. A process of claim 28 wherein said polycyclic copolymer is derived from silane-substituted and non silane-substituted monomers selected from dicyclopentadiene, 2-norbornene, 5-methyl-2-norbornene, 5,6-dimethyl-2-norbornene, 5-ethyl-2-norbornene, 5-ethylidenyl-2-norbornene (or 5-ethylidene-norbornene), 5-butyl-2-norbornene, 5-hexyl-2-norbornene, 5-octyl-2-norbornene, 5-phenyl-2-norbornene, 5-dodecyl-2-norbornene, 5-isobutyl-2-norbornene, 5-octadecyl-2-norbornene, 5-isopropyl-2-norbornene, 5-phenyl-2-norbornene, 5-p-toluyl-2-norbornene, 5-.alpha.-naphthyl-2-norbornene, 5-cyclohexyl-2-norbornene, 5-isopropenyl-norbornene, 5-vinyl-norbornene, 5,5-dimethyl-2-norbornene, tricyclopentadiene (or cyclopentadiene trimer), tetracyclopentadiene (or cyclopentadiene tetramer), dihydrodicyclopentadiene (or cyclopentene-cyclopentadiene co-dimer), methyl-cyclopentadiene dimer, ethyl-cyclopentadiene dimer, tetracyclododecene 9-methyl-tetracyclo[6,2,1,13,6,02,7]dodecene-4, (or methyl-tetracyclododecene) 9-ethyl-tetracyclo[6,2,1,13,6,02,7]dodecene-4, (or ethyl-tetracyclododecene) 9-propyl-tetracyclo[6,2,1,13,6,02,7]dodecene-4, 9-hexyl-tetracyclo[6,2,1,13,6,02,7]dodecene-4, 9-decyl-tetracyclo[6,2,1,13,6,02,7]dodecene-4, 9,10-dimethyl-tetracyclo[6,2,1,13,6,02,7]dodecene-4, 9-methyl,10-ethyl-tetracyclo[6,2,1,13,6,02,7]
dodecene-4, 9-cyclohexyl-tetracyclo[6,2,1,13,6,02,7]dodecene-4, 9-chloro-tetracyclo[6,2,1,13,6,02,7]dodecene-4, 9-bromo-tetracyclo[6,2,1,13,6,02,7]dodecene-4, 9-fluoro-tetracyclo[6,2,1,13,6,02,7]dodecene-4, 9-isobutyl-tetracyclo[6,2,1,13,6,02,7]dodecene-4, or

53. A printed circuit wiring board produced by a process of claim 43.

54. A laminate comprising at least one layer of a non-cellulic cloth impregnated with a copolymer having repeating units derived from silane-substituted and non-silane-substituted monomers of the formulas wherein n=1-4 and R7 and R8 are independently selected from hydrogen, halogen, C1-C12 alkyl groups, C2-C12 alkylene groups, C6-C12 cycloalkyl groups, C6-C12 cycloalkylene groups and C6-C12 aryl groups, silane or R7 and R8 together form a saturated or unsaturated silane substituted cyclic group of from 4 to 12 carbon atoms with the two ring carbon atoms connected thereto, said ring carbon atoms forming part of and contributing to the 4 to 12 carbon atoms in the cyclic group with the proviso that, when R7 and R8 do not together form said cyclic group, at least one of R7 and R8 is a silane group.

55. A laminate of claim 54 wherein said silane group is a substuent of the formula -SiR9R10R11 wherein each of R9, R10, R11 is selected independently from the group which includes H; halogen; C1-C12 alkyl; C6-C12 aryl; and C6-C12 aryl substituted by C1-C12 alkyl;
C1-C12 alkoxy; and hydroxyl.

56. A laminate of claim 55 wherein said silane group is a trialkoxysilane.

57. A laminate of claim 56 wherein said trialkoxysilane is triethoxysilane.

58. A laminate of claim 55 wherein said silane group is an alkylalkoxy silane.

59. A laminate of claim 54 wherein the ratio of silane-substituted monomer to non silane-substituted monomer is from about 95:5 to about 1:99.

60. A laminate of claim 54 wherein the ratio of polycycloolefin copolymer to glass cloth is from about 75:25 to about 30:70.

61. A laminate of claim 54 wherein the conductive film is copper and the surface of the copper film which is laminated to the prepreg layer has a bronze coating.

62. A laminate of claim 54 wherein at least one monomer of the polycycloolefin is unsaturated and derived from a cycloolefin monomer selected from methylnorbornene, methyltetracyclododecene, tetracyclododecene, vinyl-norbornene or dicyclopentadiene.

63. A laminate of claim 54 wherein said polycyclic copolymer is derived form silane- substituted and non silane-substituted monomers selected from dicyclopentadiene, 2-norbornene, and other norbornene monomers such as 5-methyl-2-norbornene, 5,6-dimethyl-2-norbornene, 5-ethyl-2-norbornene, 5-ethylidenyl-2-norbornene (or 5-ethylidene-norbornene), 5-butyl-2-norbornene, 5-hexyl-2-norbornene, 5-octyl-2-norbornene, 5-phenyl-2-norbornene, 5-dodecyl-2-norbornene, 5-isobutyl-2-norbornene, 5-octadecyl-2-norbornene, 5-isopropyl-2-norbornene, 5-phenyl-2-norbornene, 5-p-toluyl-2-norbornene, 5-.alpha.-naphthyl-2-norbornene, 5-cyclohexyl-2-norbornene, 5-isopropenyl-norbornene, 5-vinyl-norbornene, 5,5-dimethyl-2-norbornene, tricyclopentadiene (or cyclopentadiene trimer), tetracyclopentadiene (or cyclopentadiene tetramer), dihydrodicyclopentadiene (or cyclopentene-cyclopentadiene co-dimer), methyl-cyclopentadiene dimer, ethyl-cyclopentadiene dimer, tetracyclododecene 9-methyl-tetracyclo[6,2,1,13,6,02.7]dodecene-4, (or methyl-tetracyclododecene) 9-ethyl-tetracyclo[6,2,1,13,6,02,7]dodecene-4, (or ethyl-tetracyclododecene) 9-propyl-tetracyclo[6,2,1,13,6,02,7]dodecene-4, 9-hexyl-tetracyclo[6,2,1,13,6,02,7]dodecene-4, 9-decyl-tetracyclo[6,2,1,13,6,02,7]dodecene-4, 9,10-dimethyl-tetracyclo[6,2,1,13,6,02,7]dodecene-4, 9-methyl,10-ethyl-tetracyclo[6,2,1,13.6,02.7]
dodecene-4, 9-cyclohexyl-tetracyclo[6,2,1,13,6,02,7]dodecene-4, 9-chloro-tetracyclo[6,2,1,13,6,02,7]dodecene-4, 9-bromo-tetracyclo[6,2,1,13,6,02,7]dodecene-4, 9-fluoro-tetracyclo[6,2,1,13,6,02,7]dodecene-4, 9-isobutyl-tetracyclo[6,2,1,13,6,02,7]dodecene-4, or 9,10-dichloro-tetracyclo[6,2,1,13,6,02,7]dodecene-4.