CA2036877C - Apparatus for inspecting printed circuit boards - Google Patents
Apparatus for inspecting printed circuit boardsInfo
- Publication number
- CA2036877C CA2036877C CA002036877A CA2036877A CA2036877C CA 2036877 C CA2036877 C CA 2036877C CA 002036877 A CA002036877 A CA 002036877A CA 2036877 A CA2036877 A CA 2036877A CA 2036877 C CA2036877 C CA 2036877C
- Authority
- CA
- Canada
- Prior art keywords
- light
- printed circuit
- circuit board
- rings
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
Abstract
A printed circuit board inspection device includes a lighting system for use with the series of cameras associated with the printed circuit board inspection device which is essentially domed in configuration, and which incorporates a plurality of selectively controllable light emitting diodes for developing desired lighting patterns.
The light emitting diodes are arranged within the domed fixture to form an array of defined latitudes and longitudes, and are capable of selective activation to develop the particular lighting patterns which are desired.
This permits an acquisition of images useful in developing a "topographical display" of the acquired image, which is useful in enhancing the subsequent inspections which are to be performed.
The light emitting diodes are arranged within the domed fixture to form an array of defined latitudes and longitudes, and are capable of selective activation to develop the particular lighting patterns which are desired.
This permits an acquisition of images useful in developing a "topographical display" of the acquired image, which is useful in enhancing the subsequent inspections which are to be performed.
Description
203687~
This invention relates generally to systems for inspecting printed circuit boards, and more particularly, to improved illumination and processing techniques for use in conjunction with systems of this general type.
As is well known to those skilled in the art, a printed circuit board is used for mounting and electrically interconnecting electrical components in a predetermined manner. To the extent possible, such printed circuit boards are constructed mechanically, using automated assembly machines which operate to reduce the often prohibitive costs of manually assembling a printed circuit board. While reducing overall costs, such automated assembly techniques have been found to give rise to a certain limited degree of assembly defects such as mis-insertions of components, and their leads or pins, as well as defects in the soldering procedures which would then follow.
Originally, steps were taken to locate assembly errors of this general type through a visual inspection of each printed circuit board at a desired stage of the manufacturing process, by human operators using the naked eye, or possibly a stereo microscope or the like. However, since this procedure was found to be extremely tedious and inaccurate, as well as a relatively expensive process, steps were taken to develop automated systems for inspecting printed circuit boards, to replace such visual inspections.
Examples of devices of this general type are the Model 5511 and Model 5512 Printed Circuit Board Inspection Systems which are manufactured by Cimflex Teknowledge Corporation of Princeton, New Jersey. These inspection devices generally employ a series of cameras which are mounted within a fixture (an inspection head) adapted for controlled movement relative to a printed circuit board.
This invention relates generally to systems for inspecting printed circuit boards, and more particularly, to improved illumination and processing techniques for use in conjunction with systems of this general type.
As is well known to those skilled in the art, a printed circuit board is used for mounting and electrically interconnecting electrical components in a predetermined manner. To the extent possible, such printed circuit boards are constructed mechanically, using automated assembly machines which operate to reduce the often prohibitive costs of manually assembling a printed circuit board. While reducing overall costs, such automated assembly techniques have been found to give rise to a certain limited degree of assembly defects such as mis-insertions of components, and their leads or pins, as well as defects in the soldering procedures which would then follow.
Originally, steps were taken to locate assembly errors of this general type through a visual inspection of each printed circuit board at a desired stage of the manufacturing process, by human operators using the naked eye, or possibly a stereo microscope or the like. However, since this procedure was found to be extremely tedious and inaccurate, as well as a relatively expensive process, steps were taken to develop automated systems for inspecting printed circuit boards, to replace such visual inspections.
Examples of devices of this general type are the Model 5511 and Model 5512 Printed Circuit Board Inspection Systems which are manufactured by Cimflex Teknowledge Corporation of Princeton, New Jersey. These inspection devices generally employ a series of cameras which are mounted within a fixture (an inspection head) adapted for controlled movement relative to a printed circuit board.
The inspection head is either sequentially advanced to successive viewing fields (typically 1 inch by 1 inch) established along the surface of the printed circuit board then under inspection, or continuously advanced along the surface of the printed circuit board, to acquire images for microprocessor analysis. Any detected defects are in turn reported to the operator, for appropriate correction.
Further detail regarding the techniques which are used to perform these inspections are disclosed in U.S.
Patent No. 5,245,421, entitled "Apparatus for Inspecting -Printed Circuit Boards with Surface Mounted Components". As disclosed, the accuracy of the inspection process can be enhanced by providing an inspection head which incorporates a series of four angled, orthogonally placed cameras, operated in conjunction with a selectively controllable light source. Through selective control of the light source, in conjunction with desired operations of the series of cameras, a variety of testing procedures are enabled including a verification of the placement of components (and their leads or pins), both before and after the soldering procedure, as well as a verification of the solder connections which are made.
Previously, this was accomplished by selectively activating one of eight lighting groups provided in a generally cylindrical fixture surrounding the series of cameras used to acquire images for inspection purposes.
While adequate for its intended purpose, such illumination was found to be somewhat limiting in the patterns of light which could be developed. Essentially, this was limited to the availability of either a "high" lighting group or a 1 , , .
Further detail regarding the techniques which are used to perform these inspections are disclosed in U.S.
Patent No. 5,245,421, entitled "Apparatus for Inspecting -Printed Circuit Boards with Surface Mounted Components". As disclosed, the accuracy of the inspection process can be enhanced by providing an inspection head which incorporates a series of four angled, orthogonally placed cameras, operated in conjunction with a selectively controllable light source. Through selective control of the light source, in conjunction with desired operations of the series of cameras, a variety of testing procedures are enabled including a verification of the placement of components (and their leads or pins), both before and after the soldering procedure, as well as a verification of the solder connections which are made.
Previously, this was accomplished by selectively activating one of eight lighting groups provided in a generally cylindrical fixture surrounding the series of cameras used to acquire images for inspection purposes.
While adequate for its intended purpose, such illumination was found to be somewhat limiting in the patterns of light which could be developed. Essentially, this was limited to the availability of either a "high" lighting group or a 1 , , .
"low" lighting group for each of the four cameras associated with the system's inspection head.
This, while such lighting was found to be effective in illuminating the printed circuit board to obtain the information needed to make a proper inspection of its condition, it nevertheless became desirable to develop a more versatile lighting system for use in performing such inspections.
It is therefore an object of an aspect of the present invention to provide an improved lighting system for a printed circuit board inspection device.
It is also an object of an aspect of the present invention to provide a lighting system for a printed circuit board inspection device which provides increased versatility in selectively illuminating the regions which are to be inspected.
It is also an object of an aspect of the present invention to provide a lighting system for a printed circuit board inspection device which is addressable, and more versatile in control.
It is also an object of an aspect of the present invention to provide a lighting system having the above capabilities, and which is well adapted to existing printed circuit board inspection devices.
It is also an object of an aspect of the present invention to provide improvements in the processing of signals acquired by the video cameras of the printed circuit board inspection device making use of the improved lighting system of the present invention.
These and other objects are achieved in accordance with the present invention by providing a lighting system for use with the series of cameras associated with the printed circuit board inspection device which is essentially domed in configuration, and which incorporates a plurality of selectively controllable light emitting diodes for developing the lighting patterns which are desired.
Further in accordance with the present invention, the light emitting diodes are arranged within the domed fixture in an array which operates to establish defined latitudes and longitudes, for selective activation as desired. This is accomplished by interconnecting the light emitting diodes in an array which constitutes what is essentially a diode control matrix, which permits the light emitting diodes to be selectively addressed to develop the particular lighting patterns which are desired.
In addition to providing the lighting patterns which are useful in performing inspections of printed circuit boards such as are described in U.S. Patent No.
5,245,421 (referenced above), the improved lighting system of the present invention has been found to permit an acquisition of images useful in developing a "topographical display'~ of the acquired image, which is useful in enhancing the subsequent inspections which are to be performed.
Other aspects of this invention are as follows:
An apparatus for inspecting a printed circuit board, and components affixed to said printed circuit board, said components having leads or pins for engaging features of said printed circuit board for soldered connection thereto, said apparatus comprising:
means for illuminating said printed circuit board and said components; and -4a-camera means for receiving light reflected from said printed circuit board and said components, and for producing an electrical signal which varies responsive to the reflected light received by said camera means;
wherein said illuminating means is comprised of a substantially dome-shaped fixture incorporating an array of individually addressable light producing elements defining a lo plurality of latitudes and longitudes of the dome-shaped fixture, and means for selectively controlling the light producing elements to activate subsets of the light producing elements within the array at intersections of latitudes and longitudes of the dome-shaped fixture.
lS
In an apparatus for inspecting a printed circuit board, and components affixed to said printed circuit board, said components having leads or pins for engaging features of said printed circuit board for soldered connection thereto, said apparatus comprising means for illuminating said printed circuit board and said components, and camera means for receiving light reflected from said printed circuit board and said components, and for producing an electrical signal which varies responsive to the reflected 2s light received by said camera means, an improved illuminating means comprising a substantially dome-shaped fixture incorporating an array of individually addressable light producing elements defining a plurality of latitudes and longitudes of the dome-shaped fixture, and means for selectively controlling the light producing elements to activate subsets of the light-producing elements within the array at intersections of latitudes and longitudes of the dome-shaped fixture.
3s A method for inspecting a printed circuit board, and components affixed to said printed circuit board, said components having leads or pins for engaging features of said printed circuit board for soldered connection thereto, said method comprising the steps of:
-4b-illuminating said printed circuit board and said components making use of illuminating means including a substantially dome-shaped fixture incorporating an array of individually addressable light producing elements defining plurality of latitudes and longitudes of the dome-shaped fixture;
selectively controlling the light-producing elements to activate subsets of the light-producing elements within the array at intersections of latitudes and longitudes of the dome-shaped fixture; and receiving light reflected from said printed circuit board and said components making use of camera means for producing an electrical signal which varies responsive to the reflected light received by said camera means.
For further detail regarding the improved lighting system of the present invention, and its use in inspecting printed circuit boards, reference is made to the detailed description which is provided below, taken in conjunction with the following illustrations.
Figure 1 is an isometric view of the inspection head of a printed circuit board inspection device, which incorporates the improved lighting system of the present invention:
Figure 2 is a plan view of the lighting system of the present invention, also showing the cameras which are used to acquire images for the inspection of a printed circuit board;
Figure 3 is a side elevational view of the lighting system shown in Figure 2;
Figure 4 is a partial schematic illustration of the electrical connections used in controlling the lighting system shown in Figure 2; and Figure 5 is a block diagram illustrating subsequent processing of the images which are acquired making use of the lighting system shown in Figure 2.
In the several views provided, like reference numbers denote similar structure.
Figure 1 generally illustrates an apparatus 10 for inspecting printed circuit boards in accordance with the present invention. The apparatus 10 generally includes an inspection head 11 which is supported for predetermined movement in a defined plane by an X-Y table (generally designated by the reference number 13), using any of a variety of known servo-motor controls. Further detail regarding the basic construction of the inspection head 11 and the manner in which the inspection head 11 is caused to proceed across a printed circuit board to inspect its condition and provide and indication of potential defects may be had with reference to U.S. Patent No. 5,245,421.
A
However, by way of general description, and referring also to Figure 2 of the drawings, it is seen that the inspection head 11 generally includes a plurality of TV
or video cameras 13, 14, 15, 16, and a lighting fixture 20 produced in accordance with the present invention. It should be understood that to this point, with the exception of the lighting fixture 20, the components previously described and illustrated in Figure 1 essentially correspond to known components used in previously available printed circuit board inspection systems of this general type. For this reason, further discussion of the improvements of the present invention will proceed with a discussion of the improved lighting fixture 20 of the present invention, and the manner in which the lighting fixture 20 may be used to provide an enhanced inspection of printed circuit boards in accordance with the present invention.
Referring now to Figures 2 and 3 of the drawings, it will be noted that the lighting fixture 20 generally takes the form of a domed-shaped frame 21 which surrounds and depends from the series of cameras 13, 14, 15, 16. To this end, the frame 21 is provided with a series of apertures 22 for appropriately receiving the objectives of the cameras 13, 14, 15, 16. The frame 21 further incorporates a series of apertures 23 for receiving an array of light emitting diodes 24 (LED's) for illuminating a printed circuit board to be inspected by the apparatus 10.
For purposes which will be explained more fully below, the series of LED's 24 are preferably disposed within the frame 21 of the lighting fixture 20 in a regular pattern which establishes a series of latitudes 25 and longitudes 26. The spacings developed between the several latitudes 25 and longitudes 26 may be varied, as desired, to achieve the lighting which is desired for a proper inspection of a 203~7 printed circuit board in accordance with the present invention.
An important aspect of the lighting fixture 20 of the present invention is its use of LED's 24 for purposes of illuminating the printed circuit board under inspection.
This arises from the "dual function" of a light emitting diode, that being its ability to be "strobed" to provide the lighting which is desired, as well as its "directional"
operation. This dual functionality operates to provide an easily controlled lighting system which can effectively illuminate a desired area (i.e., viewing field).
To this end, reference is now made to Figure 4 of the drawings, which schematically shows the manner in which the array of LED's 24 may be effectively controlled in accordance with the present invention. Illustrated is what essentially constitutes a diode control matrix 30 comprised of addressable electrical connections 31,32. To be noted is that the electrical connections 31 correspond to the defined latitudes 25 of the lighting fixture 20, while the electrical connections 32 correspond to the defined longitudes 26 of the lighting fixture 20.
Each light emitting diode of the array of LED's 24 is electrically connected between one of the connections 31 and one of the connections 32, in series with a resistor (not shown for clarity of illustration) for equalizing the lighting produced within the array. Each of the series of LED's 24 may then be selectively (individually or in groups) operated by applying appropriate control (biasing) voltages to the electrical connections 31,32. This has the advantage of permitting any of a variety of lighting patterns to be developed using straight- forward control techniques which do not require the individual activating switches (or frame 21 of the lighting fixture 20 in a regular pattern which establishes a series of latitudes 25 and longitudes 26. The spacings developed between the several latitudes 25 and longitudes 26 may be varied, as desired, to achieve the lighting 5 which is desired for a proper inspection of a printed circuit board in accordance with the present invention.
An important aspect of the lighting fixture 20 of the present invention is its use of LED's 24 for purposes of illuminating the printed circuit board under inspection. This arises from the "dual function" of a light emitting diode, that being its ability to be "strobed" to provide the lighting which is desired, as well as its "directional" operation. This dual functionality operates to provide an easily controlled lighting system which can effectively illuminate a desired area (i.e., viewing field).
To this end, reference is now made to Figure 4 of the drawings, which schematically shows the manner in which the array of LED's 24 may be effectively controlled in accordance with the present invention. Illustrated is what essentially constitutes a diode control matrix 30 comprised of addressable electrical connections 31, 32. To be noted is that the electrical connections 31 correspond to the defined latitudes 25 of the lighting fixture 20, while the electrical connections 32 correspond to the defined longitudes 26 of the lighting fixture 20.
Each light emitting diode of the array of LED's 24 is 20~6~7~
g lighting fixture 20 of the present invention to develop what is essentially a "topographical map" of the viewing field under inspection. In general, this is accomplished by selectively and preferably sequentially developing rings of light corresponding to the various longitudes 26 defined by the lighting fixture 20. The cameras 13, 14, 15, 16 are then each used to acquire a "series" of images developed by these various rings of light, which can then be suitably stored in memory for subsequent display and analysis as is schematically illustrated in Figure 5 of the drawings.
These images are preferably developed at regular intervals (e.g., every 33 ms) making use of sequential rings of light, preferably of the same intensity, which progress inwardly toward the center of the lighting fixture 20.
Referring now to Figure 5 of the drawings, the element 50 represents what is generally known as the "frame grabber" (storage buffer) of the inspection apparatus 10.
Thus, as previously described and further in accordance with the present invention, a series of "bit planes" 51 corresponding to the sequential strobings of rings of light along the longitudes 26 of the lighting fixture 20 are developed within the frame grabber 50, for each of the cameras 13, 14, 15, 16. Each of the bit planes 50 are then "assigned" a colour and a level (or weight), for further processing as follows.
For purposes of display, a conventionally available color processing circuit 52 is placed in communication with the frame grabber 50, to assign various colours to the several bit planes 51 developed as previously described. The "colourized" data stored within the frame grabber 50 is then capable of being displayed on a monitor 53, which operates to display a series of coloured layers developed responsive to the sequentially strobed rings of ~ 0 3 ~ 8 7 ~
light previously described. This, in essence, constitutes a reliefed illustration or three dimensional image corresponding to the viewing field then under inspection since the various colours displayed on the monitor 53 will correspond to images produced (responsive to the strobed rings of light) at different elevations relative to the printed circuit board under inspection. This effect has been found to produce a mapping which constitutes a three dimensional representation of a two dimensional image (on the screen 53), providing a significantly enhanced image for visual inspection purposes.
For purposes of analysis, a processor 54 is also placed in communication with the frame grabber 50. The processor 54 operates to, in essence, assign a level (or weight) to each of the several bit planes 51 defined within the frame grabber 50 as previously described. These weighted values can then be numerically analyzed to determine volumes corresponding to features then under inspection.
Of primary importance here is that this enables the shape of a solder connection (or fillet) to be analyzed even more effectively than was previously possible. For example, by isolating certain layers (defining a "topographical zone") and summing the number of pixels detected within each defined topographical zone, a measure of solder volume can be made. By analyzing the smoothness of the transitions from one topographical zone to the next, a measure of solder wetting can be made (determined primarily by the solder's adhesion to the surface, and generally described by the smoothness of the resulting joint). By detecting aberrations or secondary shapes (measured in similar fashion), voids, blow holes and pinholes may be detected. Thus, significant information may be developed by 2036~7 performing these weighted calculations, making use of the sequential images acquired within the frame grabber 50 in accordance with the present invention.
Further versatility is achieved in accordance with the present invention as a result of the series of four cameras 13, 14, 15, 16 which are available for inspection purposes. This results from the separate generation of acquired images as previously described, by each of the four cameras which are provided. This in turn generates a series of four topographical mappings, from each of four sides of a component under inspection or a completed solder fillet. By correlating (combining or connecting) data stored within the several bit planes 51 developed responsive to operations of the series of cameras 13, 14, 15, 16, an overall "image" can be created in memory which is significantly more complete than the image generated by a single vertical camera. The resulting image can reveal internal surfaces which would be hidden when viewed vertically, which is especially useful in inspecting solder fillets for straight-through hole leads, or when analyzing "J lead" devices (which typically form solder joints which are not visible from above).
It will further be understood that various changes in the details, materials and arrangement of parts which have been herein described and illustrated in order to explain the nature of this invention may be made by those skilled in the art within the principle and scope of the invention as expressed in the following claims.
This, while such lighting was found to be effective in illuminating the printed circuit board to obtain the information needed to make a proper inspection of its condition, it nevertheless became desirable to develop a more versatile lighting system for use in performing such inspections.
It is therefore an object of an aspect of the present invention to provide an improved lighting system for a printed circuit board inspection device.
It is also an object of an aspect of the present invention to provide a lighting system for a printed circuit board inspection device which provides increased versatility in selectively illuminating the regions which are to be inspected.
It is also an object of an aspect of the present invention to provide a lighting system for a printed circuit board inspection device which is addressable, and more versatile in control.
It is also an object of an aspect of the present invention to provide a lighting system having the above capabilities, and which is well adapted to existing printed circuit board inspection devices.
It is also an object of an aspect of the present invention to provide improvements in the processing of signals acquired by the video cameras of the printed circuit board inspection device making use of the improved lighting system of the present invention.
These and other objects are achieved in accordance with the present invention by providing a lighting system for use with the series of cameras associated with the printed circuit board inspection device which is essentially domed in configuration, and which incorporates a plurality of selectively controllable light emitting diodes for developing the lighting patterns which are desired.
Further in accordance with the present invention, the light emitting diodes are arranged within the domed fixture in an array which operates to establish defined latitudes and longitudes, for selective activation as desired. This is accomplished by interconnecting the light emitting diodes in an array which constitutes what is essentially a diode control matrix, which permits the light emitting diodes to be selectively addressed to develop the particular lighting patterns which are desired.
In addition to providing the lighting patterns which are useful in performing inspections of printed circuit boards such as are described in U.S. Patent No.
5,245,421 (referenced above), the improved lighting system of the present invention has been found to permit an acquisition of images useful in developing a "topographical display'~ of the acquired image, which is useful in enhancing the subsequent inspections which are to be performed.
Other aspects of this invention are as follows:
An apparatus for inspecting a printed circuit board, and components affixed to said printed circuit board, said components having leads or pins for engaging features of said printed circuit board for soldered connection thereto, said apparatus comprising:
means for illuminating said printed circuit board and said components; and -4a-camera means for receiving light reflected from said printed circuit board and said components, and for producing an electrical signal which varies responsive to the reflected light received by said camera means;
wherein said illuminating means is comprised of a substantially dome-shaped fixture incorporating an array of individually addressable light producing elements defining a lo plurality of latitudes and longitudes of the dome-shaped fixture, and means for selectively controlling the light producing elements to activate subsets of the light producing elements within the array at intersections of latitudes and longitudes of the dome-shaped fixture.
lS
In an apparatus for inspecting a printed circuit board, and components affixed to said printed circuit board, said components having leads or pins for engaging features of said printed circuit board for soldered connection thereto, said apparatus comprising means for illuminating said printed circuit board and said components, and camera means for receiving light reflected from said printed circuit board and said components, and for producing an electrical signal which varies responsive to the reflected 2s light received by said camera means, an improved illuminating means comprising a substantially dome-shaped fixture incorporating an array of individually addressable light producing elements defining a plurality of latitudes and longitudes of the dome-shaped fixture, and means for selectively controlling the light producing elements to activate subsets of the light-producing elements within the array at intersections of latitudes and longitudes of the dome-shaped fixture.
3s A method for inspecting a printed circuit board, and components affixed to said printed circuit board, said components having leads or pins for engaging features of said printed circuit board for soldered connection thereto, said method comprising the steps of:
-4b-illuminating said printed circuit board and said components making use of illuminating means including a substantially dome-shaped fixture incorporating an array of individually addressable light producing elements defining plurality of latitudes and longitudes of the dome-shaped fixture;
selectively controlling the light-producing elements to activate subsets of the light-producing elements within the array at intersections of latitudes and longitudes of the dome-shaped fixture; and receiving light reflected from said printed circuit board and said components making use of camera means for producing an electrical signal which varies responsive to the reflected light received by said camera means.
For further detail regarding the improved lighting system of the present invention, and its use in inspecting printed circuit boards, reference is made to the detailed description which is provided below, taken in conjunction with the following illustrations.
Figure 1 is an isometric view of the inspection head of a printed circuit board inspection device, which incorporates the improved lighting system of the present invention:
Figure 2 is a plan view of the lighting system of the present invention, also showing the cameras which are used to acquire images for the inspection of a printed circuit board;
Figure 3 is a side elevational view of the lighting system shown in Figure 2;
Figure 4 is a partial schematic illustration of the electrical connections used in controlling the lighting system shown in Figure 2; and Figure 5 is a block diagram illustrating subsequent processing of the images which are acquired making use of the lighting system shown in Figure 2.
In the several views provided, like reference numbers denote similar structure.
Figure 1 generally illustrates an apparatus 10 for inspecting printed circuit boards in accordance with the present invention. The apparatus 10 generally includes an inspection head 11 which is supported for predetermined movement in a defined plane by an X-Y table (generally designated by the reference number 13), using any of a variety of known servo-motor controls. Further detail regarding the basic construction of the inspection head 11 and the manner in which the inspection head 11 is caused to proceed across a printed circuit board to inspect its condition and provide and indication of potential defects may be had with reference to U.S. Patent No. 5,245,421.
A
However, by way of general description, and referring also to Figure 2 of the drawings, it is seen that the inspection head 11 generally includes a plurality of TV
or video cameras 13, 14, 15, 16, and a lighting fixture 20 produced in accordance with the present invention. It should be understood that to this point, with the exception of the lighting fixture 20, the components previously described and illustrated in Figure 1 essentially correspond to known components used in previously available printed circuit board inspection systems of this general type. For this reason, further discussion of the improvements of the present invention will proceed with a discussion of the improved lighting fixture 20 of the present invention, and the manner in which the lighting fixture 20 may be used to provide an enhanced inspection of printed circuit boards in accordance with the present invention.
Referring now to Figures 2 and 3 of the drawings, it will be noted that the lighting fixture 20 generally takes the form of a domed-shaped frame 21 which surrounds and depends from the series of cameras 13, 14, 15, 16. To this end, the frame 21 is provided with a series of apertures 22 for appropriately receiving the objectives of the cameras 13, 14, 15, 16. The frame 21 further incorporates a series of apertures 23 for receiving an array of light emitting diodes 24 (LED's) for illuminating a printed circuit board to be inspected by the apparatus 10.
For purposes which will be explained more fully below, the series of LED's 24 are preferably disposed within the frame 21 of the lighting fixture 20 in a regular pattern which establishes a series of latitudes 25 and longitudes 26. The spacings developed between the several latitudes 25 and longitudes 26 may be varied, as desired, to achieve the lighting which is desired for a proper inspection of a 203~7 printed circuit board in accordance with the present invention.
An important aspect of the lighting fixture 20 of the present invention is its use of LED's 24 for purposes of illuminating the printed circuit board under inspection.
This arises from the "dual function" of a light emitting diode, that being its ability to be "strobed" to provide the lighting which is desired, as well as its "directional"
operation. This dual functionality operates to provide an easily controlled lighting system which can effectively illuminate a desired area (i.e., viewing field).
To this end, reference is now made to Figure 4 of the drawings, which schematically shows the manner in which the array of LED's 24 may be effectively controlled in accordance with the present invention. Illustrated is what essentially constitutes a diode control matrix 30 comprised of addressable electrical connections 31,32. To be noted is that the electrical connections 31 correspond to the defined latitudes 25 of the lighting fixture 20, while the electrical connections 32 correspond to the defined longitudes 26 of the lighting fixture 20.
Each light emitting diode of the array of LED's 24 is electrically connected between one of the connections 31 and one of the connections 32, in series with a resistor (not shown for clarity of illustration) for equalizing the lighting produced within the array. Each of the series of LED's 24 may then be selectively (individually or in groups) operated by applying appropriate control (biasing) voltages to the electrical connections 31,32. This has the advantage of permitting any of a variety of lighting patterns to be developed using straight- forward control techniques which do not require the individual activating switches (or frame 21 of the lighting fixture 20 in a regular pattern which establishes a series of latitudes 25 and longitudes 26. The spacings developed between the several latitudes 25 and longitudes 26 may be varied, as desired, to achieve the lighting 5 which is desired for a proper inspection of a printed circuit board in accordance with the present invention.
An important aspect of the lighting fixture 20 of the present invention is its use of LED's 24 for purposes of illuminating the printed circuit board under inspection. This arises from the "dual function" of a light emitting diode, that being its ability to be "strobed" to provide the lighting which is desired, as well as its "directional" operation. This dual functionality operates to provide an easily controlled lighting system which can effectively illuminate a desired area (i.e., viewing field).
To this end, reference is now made to Figure 4 of the drawings, which schematically shows the manner in which the array of LED's 24 may be effectively controlled in accordance with the present invention. Illustrated is what essentially constitutes a diode control matrix 30 comprised of addressable electrical connections 31, 32. To be noted is that the electrical connections 31 correspond to the defined latitudes 25 of the lighting fixture 20, while the electrical connections 32 correspond to the defined longitudes 26 of the lighting fixture 20.
Each light emitting diode of the array of LED's 24 is 20~6~7~
g lighting fixture 20 of the present invention to develop what is essentially a "topographical map" of the viewing field under inspection. In general, this is accomplished by selectively and preferably sequentially developing rings of light corresponding to the various longitudes 26 defined by the lighting fixture 20. The cameras 13, 14, 15, 16 are then each used to acquire a "series" of images developed by these various rings of light, which can then be suitably stored in memory for subsequent display and analysis as is schematically illustrated in Figure 5 of the drawings.
These images are preferably developed at regular intervals (e.g., every 33 ms) making use of sequential rings of light, preferably of the same intensity, which progress inwardly toward the center of the lighting fixture 20.
Referring now to Figure 5 of the drawings, the element 50 represents what is generally known as the "frame grabber" (storage buffer) of the inspection apparatus 10.
Thus, as previously described and further in accordance with the present invention, a series of "bit planes" 51 corresponding to the sequential strobings of rings of light along the longitudes 26 of the lighting fixture 20 are developed within the frame grabber 50, for each of the cameras 13, 14, 15, 16. Each of the bit planes 50 are then "assigned" a colour and a level (or weight), for further processing as follows.
For purposes of display, a conventionally available color processing circuit 52 is placed in communication with the frame grabber 50, to assign various colours to the several bit planes 51 developed as previously described. The "colourized" data stored within the frame grabber 50 is then capable of being displayed on a monitor 53, which operates to display a series of coloured layers developed responsive to the sequentially strobed rings of ~ 0 3 ~ 8 7 ~
light previously described. This, in essence, constitutes a reliefed illustration or three dimensional image corresponding to the viewing field then under inspection since the various colours displayed on the monitor 53 will correspond to images produced (responsive to the strobed rings of light) at different elevations relative to the printed circuit board under inspection. This effect has been found to produce a mapping which constitutes a three dimensional representation of a two dimensional image (on the screen 53), providing a significantly enhanced image for visual inspection purposes.
For purposes of analysis, a processor 54 is also placed in communication with the frame grabber 50. The processor 54 operates to, in essence, assign a level (or weight) to each of the several bit planes 51 defined within the frame grabber 50 as previously described. These weighted values can then be numerically analyzed to determine volumes corresponding to features then under inspection.
Of primary importance here is that this enables the shape of a solder connection (or fillet) to be analyzed even more effectively than was previously possible. For example, by isolating certain layers (defining a "topographical zone") and summing the number of pixels detected within each defined topographical zone, a measure of solder volume can be made. By analyzing the smoothness of the transitions from one topographical zone to the next, a measure of solder wetting can be made (determined primarily by the solder's adhesion to the surface, and generally described by the smoothness of the resulting joint). By detecting aberrations or secondary shapes (measured in similar fashion), voids, blow holes and pinholes may be detected. Thus, significant information may be developed by 2036~7 performing these weighted calculations, making use of the sequential images acquired within the frame grabber 50 in accordance with the present invention.
Further versatility is achieved in accordance with the present invention as a result of the series of four cameras 13, 14, 15, 16 which are available for inspection purposes. This results from the separate generation of acquired images as previously described, by each of the four cameras which are provided. This in turn generates a series of four topographical mappings, from each of four sides of a component under inspection or a completed solder fillet. By correlating (combining or connecting) data stored within the several bit planes 51 developed responsive to operations of the series of cameras 13, 14, 15, 16, an overall "image" can be created in memory which is significantly more complete than the image generated by a single vertical camera. The resulting image can reveal internal surfaces which would be hidden when viewed vertically, which is especially useful in inspecting solder fillets for straight-through hole leads, or when analyzing "J lead" devices (which typically form solder joints which are not visible from above).
It will further be understood that various changes in the details, materials and arrangement of parts which have been herein described and illustrated in order to explain the nature of this invention may be made by those skilled in the art within the principle and scope of the invention as expressed in the following claims.
Claims (36)
1. An apparatus for inspecting a printed circuit board, and components affixed to said printed circuit board, said components having leads or pins for engaging features of said printed circuit board for soldered connection thereto, said apparatus comprising:
means for illuminating said printed circuit board and said components; and camera means for receiving light reflected from said printed circuit board and said components, and for producing an electrical signal which varies responsive to the reflected light received by said camera means;
wherein said illuminating means is comprised of a substantially dome-shaped fixture incorporating an array of individually addressable light producing elements defining a plurality of latitudes and longitudes of the dome-shaped fixture, and means for selectively controlling the light producing elements to activate subsets of the light producing elements within the array at intersections of latitudes and longitudes of the dome-shaped fixture.
means for illuminating said printed circuit board and said components; and camera means for receiving light reflected from said printed circuit board and said components, and for producing an electrical signal which varies responsive to the reflected light received by said camera means;
wherein said illuminating means is comprised of a substantially dome-shaped fixture incorporating an array of individually addressable light producing elements defining a plurality of latitudes and longitudes of the dome-shaped fixture, and means for selectively controlling the light producing elements to activate subsets of the light producing elements within the array at intersections of latitudes and longitudes of the dome-shaped fixture.
2. The apparatus of claim 1 wherein said camera means is comprised of for orthogonally disposed cameras associated with said illuminating means.
3. The apparatus of claim 1 wherein said light producing elements are light emitting diodes.
4. The apparatus of claim 1 wherein light emitting diodes grouped along a selected latitude are simultaneously operable to develop a ring of light.
5. The apparatus of claim 4 which further comprises means for sequentially operating light emitting diodes grouped along selected latitudes to develop a series of rings of light.
6. The apparatus of claim 1 wherein light emitting diodes grouped in a selected quadrant are simultaneously operable to develop a directed source of light.
7. The apparatus of claim 1 which further comprises means for acquiring images from said camera means, for storage in a buffer.
8. The apparatus of claim 7 wherein said light producing elements are controllable to develop a plurality of rings of light, and wherein said acquiring means acquires a plurality of images corresponding to said plurality of rings of light.
9. The apparatus of claim 8 wherein said rings of light illuminate different topographical zones associated with said components and said leads or pins.
10. The apparatus of claim 9 wherein said rings of light are sequentially and serially operated.
11. The apparatus of claim 9 wherein said rings of light are operated to produce substantially constant levels of light.
12. The apparatus of claim 9 which further comprises means for assigning colors to said different topographical zones, for display on a color monitor.
13. The apparatus of claim 9 which further comprises means for assigning light levels to said different topographical zones, and for performing weighted and volumetric calculations responsive to said assigned light levels.
14 14. The apparatus of claim 13 wherein said camera means is comprised of four orthogonally disposed cameras, and wherein said calculation performing means includes means for correlating data stored in said buffer for different ones of said cameras.
15. In an apparatus for inspecting a printed circuit board, and components affixed to said printed circuit board, said components having leads or pins for engaging features of said printed circuit board for soldered connection thereto, said apparatus comprising means for illuminating said printed circuit board and said components, and camera means for receiving light reflected from said printed circuit board and said components, and for producing an electrical signal which varies responsive to the reflected light received by said camera means, an improved illuminating means comprising a substantially dome-shaped fixture incorporating an array of individually addressable light producing elements defining a plurality of latitudes and longitudes of the dome-shaped fixture, and means for selectively controlling the light producing elements to activate subsets of the light-producing elements within the array at intersections of latitudes and longitudes of the dome-shaped fixture.
16. The apparatus of claim 15 wherein said camera means is comprised of four orthogonally disposed cameras associated with said illuminating means.
17. The apparatus of claim 15 wherein said light producing elements are light emitting diodes.
18. The apparatus of claim 15 wherein light emitting diodes grouped along a selected latitude are simultaneously operable to develop a ring of light.
19. The apparatus of claim 18 which further comprises means for sequentially operating light emitting diodes grouped along selected latitudes to develop a series of rings of light.
20. The apparatus of claim 19 wherein said rings of light illuminate different topographical zones associated with said components and said leads or pins.
21. The apparatus of claim 20 wherein said rings of light are sequentially and serially operated.
22. The apparatus of claim 20 wherein said rings of light are operated to develop substantially constant levels of light.
23. The apparatus of claim 15 wherein light emitting diodes grouped in a selected quadrant are simultaneously operable to develop a directed source of light.
24. A method for inspecting a printed circuit board, and components affixed to said printed circuit board, said components having leads or pins for engaging features of said printed circuit board for soldered connection thereto, said method comprising the steps of:
illuminating said printed circuit board and said components making use of illuminating means including a substantially dome-shaped fixture incorporating an array of individually addressable light producing elements defining plurality of latitudes and longitudes of the dome-shaped fixture;
selectively controlling the light-producing elements to activate subsets of the light-producing elements within the array at intersections of latitudes and longitudes of the dome-shaped fixture; and receiving light reflected from said printed circuit board and said components making use of camera means for producing an electrical signal which varies responsive to the reflected light received by said camera means.
illuminating said printed circuit board and said components making use of illuminating means including a substantially dome-shaped fixture incorporating an array of individually addressable light producing elements defining plurality of latitudes and longitudes of the dome-shaped fixture;
selectively controlling the light-producing elements to activate subsets of the light-producing elements within the array at intersections of latitudes and longitudes of the dome-shaped fixture; and receiving light reflected from said printed circuit board and said components making use of camera means for producing an electrical signal which varies responsive to the reflected light received by said camera means.
25. The method of claim 24 which further includes developing a ring of light by simultaneously operating light producing elements grouped along a selected latitude.
26. The method of claim 25 which further includes sequentially operating light producing elements grouped along selected latitudes to develop a series of rings of light.
27. The method of claim 24 which further includes developing a directed source of light by simultaneously operating light producing elements grouped in a selected quadrant.
28. The method of claim 24 which further includes developing a topographical mapping of said printed circuit board and said components responsive to said electrical signal provided by said camera means.
29. The method of claim 28 which further includes acquiring images from said camera means, and storing said images as data in a buffer.
30. The method of claim 29 which further includes controlling said light producing elements to develop a plurality of rings of light, and acquiring a plurality of images corresponding to said plurality of rings of light.
31. The method of claim 30 wherein said rings of light illuminate different topographical zones associated with said components and said leads or pins.
32. The method of claim 31 wherein said rings of light are sequentially and serially operated.
33. The method of claim 31 wherein said rings of light are operated to develop substantially constant levels of light.
34. The method of claim 31 which further includes assigning colors to said different topographical zones, for display on a color monitor.
35. The method of claim 31 which further includes assigning light levels to said different topographical zones, and performing weighted and volumetric calculations responsive to said assigned light levels.
36. The method of claim 35 wherein said camera means is comprised of four orthogonally disposed cameras, and which further includes correlating data stored in said buffer for different ones of said cameras.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/483,882 US5060065A (en) | 1990-02-23 | 1990-02-23 | Apparatus and method for illuminating a printed circuit board for inspection |
| US07/483,882 | 1990-02-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2036877A1 CA2036877A1 (en) | 1991-08-24 |
| CA2036877C true CA2036877C (en) | 1999-04-13 |
Family
ID=23921882
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002036877A Expired - Fee Related CA2036877C (en) | 1990-02-23 | 1991-02-22 | Apparatus for inspecting printed circuit boards |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US5060065A (en) |
| EP (1) | EP0443289B1 (en) |
| JP (1) | JP3056269B2 (en) |
| KR (1) | KR100294872B1 (en) |
| AT (1) | ATE172795T1 (en) |
| CA (1) | CA2036877C (en) |
| DE (1) | DE69032724T2 (en) |
Families Citing this family (95)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03269681A (en) * | 1990-03-19 | 1991-12-02 | Sharp Corp | Picture recognizing device |
| IL99823A0 (en) * | 1990-11-16 | 1992-08-18 | Orbot Instr Ltd | Optical inspection method and apparatus |
| US5172005A (en) * | 1991-02-20 | 1992-12-15 | Pressco Technology, Inc. | Engineered lighting system for tdi inspection comprising means for controlling lighting elements in accordance with specimen displacement |
| US5365084A (en) * | 1991-02-20 | 1994-11-15 | Pressco Technology, Inc. | Video inspection system employing multiple spectrum LED illumination |
| JPH05223532A (en) * | 1991-07-10 | 1993-08-31 | Raytheon Co | Automatic sight-check system |
| US5260779A (en) * | 1992-02-21 | 1993-11-09 | Control Automation, Inc. | Method and apparatus for inspecting a printed circuit board |
| US5461417A (en) * | 1993-02-16 | 1995-10-24 | Northeast Robotics, Inc. | Continuous diffuse illumination method and apparatus |
| US5517235A (en) * | 1993-11-03 | 1996-05-14 | Control Automation, Inc. | Method and apparatus for inspecting printed circuit boards at different magnifications |
| US5418879A (en) * | 1994-04-04 | 1995-05-23 | Chrysler Corporation | Distributed light delivery system |
| US5761540A (en) * | 1994-10-31 | 1998-06-02 | Northeast Robotics, Inc. | Illumination device with microlouver for illuminating an object with continuous diffuse light |
| US5604550A (en) * | 1994-10-31 | 1997-02-18 | Northeast Robotics, Inc. | Illumination device for indirectly illuminating an object with continuous diffuse light |
| US5842060A (en) * | 1994-10-31 | 1998-11-24 | Northeast Robotics Llc | Illumination device with curved beam splitter for illumination an object with continuous diffuse light |
| US5764874A (en) * | 1994-10-31 | 1998-06-09 | Northeast Robotics, Inc. | Imaging system utilizing both diffuse and specular reflection characteristics |
| US5539485A (en) * | 1994-10-31 | 1996-07-23 | White; Timothy P. | Illumination device for providing continuous diffuse light on and off an observing axis |
| EP0800756B1 (en) * | 1994-12-30 | 1998-09-02 | Siemens Aktiengesellschaft | Device for determining the position of connections of components |
| JP2775411B2 (en) * | 1995-07-25 | 1998-07-16 | 名古屋電機工業株式会社 | Lighting equipment for printed wiring board inspection equipment |
| US5713661A (en) * | 1995-10-23 | 1998-02-03 | Northeast Robotics, Inc. | Hockey puck shaped continuous diffuse illumination apparatus and method |
| US5859924A (en) * | 1996-07-12 | 1999-01-12 | Robotic Vision Systems, Inc. | Method and system for measuring object features |
| US6219442B1 (en) | 1996-10-08 | 2001-04-17 | International Business Machines Corporation | Apparatus and method for measuring distortion of a visible pattern on a substrate by viewing predetermined portions thereof |
| DE19643017C1 (en) * | 1996-10-18 | 1998-04-23 | Innomess Ges Fuer Messtechnik | Procedure for the determination of optical defects in large panes |
| US6075883A (en) * | 1996-11-12 | 2000-06-13 | Robotic Vision Systems, Inc. | Method and system for imaging an object or pattern |
| US5760893A (en) * | 1996-12-24 | 1998-06-02 | Teradyne, Inc. | Method and apparatus for inspecting component placement and solder connection in printed circuit board manufacture |
| US5862973A (en) * | 1997-01-30 | 1999-01-26 | Teradyne, Inc. | Method for inspecting solder paste in printed circuit board manufacture |
| US20030133292A1 (en) | 1999-11-18 | 2003-07-17 | Mueller George G. | Methods and apparatus for generating and modulating white light illumination conditions |
| US6624597B2 (en) | 1997-08-26 | 2003-09-23 | Color Kinetics, Inc. | Systems and methods for providing illumination in machine vision systems |
| US7740371B1 (en) | 1998-03-19 | 2010-06-22 | Charles A. Lemaire | Method and apparatus for pulsed L.E.D. illumination for a camera |
| US6095661A (en) | 1998-03-19 | 2000-08-01 | Ppt Vision, Inc. | Method and apparatus for an L.E.D. flashlight |
| US20040114035A1 (en) * | 1998-03-24 | 2004-06-17 | Timothy White | Focusing panel illumination method and apparatus |
| EP1093562A1 (en) | 1998-07-08 | 2001-04-25 | PPT Vision, Inc. | Machine vision and semiconductor handling |
| US6956963B2 (en) | 1998-07-08 | 2005-10-18 | Ismeca Europe Semiconductor Sa | Imaging for a machine-vision system |
| US7353954B1 (en) * | 1998-07-08 | 2008-04-08 | Charles A. Lemaire | Tray flipper and method for parts inspection |
| JP3299193B2 (en) * | 1998-08-21 | 2002-07-08 | 日本電気株式会社 | Bump inspection method / apparatus, information storage medium |
| US6207946B1 (en) * | 1998-09-03 | 2001-03-27 | Semiconductor Technologies & Instruments, Inc. | Adaptive lighting system and method for machine vision apparatus |
| US6273338B1 (en) | 1998-09-22 | 2001-08-14 | Timothy White | Low cost color-programmable focusing ring light |
| US6788411B1 (en) | 1999-07-08 | 2004-09-07 | Ppt Vision, Inc. | Method and apparatus for adjusting illumination angle |
| IE20000838A1 (en) | 1999-10-18 | 2001-05-16 | Mv Res Ltd | Machine vision |
| US7075565B1 (en) * | 2000-06-14 | 2006-07-11 | Landrex Technologies Co., Ltd. | Optical inspection system |
| US6509559B1 (en) | 2000-06-20 | 2003-01-21 | Ppt Vision, Inc. | Binary optical grating and method for generating a moire pattern for 3D imaging |
| US6501554B1 (en) | 2000-06-20 | 2002-12-31 | Ppt Vision, Inc. | 3D scanner and method for measuring heights and angles of manufactured parts |
| US6486963B1 (en) | 2000-06-20 | 2002-11-26 | Ppt Vision, Inc. | Precision 3D scanner base and method for measuring manufactured parts |
| US6760471B1 (en) * | 2000-06-23 | 2004-07-06 | Teradyne, Inc. | Compensation system and related techniques for use in a printed circuit board inspection system |
| US6850637B1 (en) * | 2000-06-28 | 2005-02-01 | Teradyne, Inc. | Lighting arrangement for automated optical inspection system |
| WO2002018913A2 (en) * | 2000-09-01 | 2002-03-07 | Color Kinetics Incorporated | Systems and methods for providing illumination in machine vision systems |
| US7042172B2 (en) | 2000-09-01 | 2006-05-09 | Color Kinetics Incorporated | Systems and methods for providing illumination in machine vision systems |
| JP3496644B2 (en) * | 2001-01-12 | 2004-02-16 | シーシーエス株式会社 | Lighting equipment for inspection |
| JP3433739B2 (en) * | 2001-05-18 | 2003-08-04 | オムロン株式会社 | Irradiation device and substrate inspection device using the same |
| US7113313B2 (en) * | 2001-06-04 | 2006-09-26 | Agilent Technologies, Inc. | Dome-shaped apparatus for inspecting a component or a printed circuit board device |
| FR2829344B1 (en) * | 2001-08-29 | 2004-10-01 | Oreal | DEVICE FOR ACQUIRING AT LEAST ONE IMAGE OF AT LEAST PART OF A PERSON'S FACE OR HAIR |
| JP4155496B2 (en) * | 2002-04-25 | 2008-09-24 | 大日本スクリーン製造株式会社 | Classification support device, classification device, and program |
| US8171567B1 (en) | 2002-09-04 | 2012-05-01 | Tracer Detection Technology Corp. | Authentication method and system |
| TWI258583B (en) * | 2003-01-30 | 2006-07-21 | Test Research Inc | Device and method for optical detection of printed circuit board |
| EP1455179A1 (en) * | 2003-03-07 | 2004-09-08 | MV Research Limited | A machine vision inspection system and method |
| US7171037B2 (en) | 2003-03-20 | 2007-01-30 | Agilent Technologies, Inc. | Optical inspection system and method for displaying imaged objects in greater than two dimensions |
| US20040184653A1 (en) * | 2003-03-20 | 2004-09-23 | Baer Richard L. | Optical inspection system, illumination apparatus and method for use in imaging specular objects based on illumination gradients |
| JP2004093571A (en) * | 2003-09-26 | 2004-03-25 | Ccs Inc | Lighting system for inspection |
| ATE433164T1 (en) | 2004-03-12 | 2009-06-15 | Ingenia Technology Ltd | METHOD AND DEVICES FOR GENERATING AUTHENTICABLE ITEMS AND THEIR SUBSEQUENT VERIFICATION |
| EP2128790A3 (en) * | 2004-03-12 | 2011-01-26 | Ingenia Technology Limited | Authenticity verification with linearised data |
| EP1612569A3 (en) | 2004-06-30 | 2006-02-08 | Omron Corporation | Method and apparatus for substrate surface inspection using multi-color light emission system |
| JP2006047290A (en) * | 2004-06-30 | 2006-02-16 | Omron Corp | Image generation method for board inspection, board inspecting device and illumination device for board inspection |
| GB2444139B (en) * | 2004-08-13 | 2008-11-12 | Ingenia Technology Ltd | Authenticity verification methods products and apparatuses |
| DE102004056698B3 (en) * | 2004-11-24 | 2006-08-17 | Stratus Vision Gmbh | Inspection device for a substrate having at least one printed layer |
| TWM276556U (en) * | 2005-03-04 | 2005-10-01 | Biotek Technology Corp | Improvement of optical system structure for treatment and cosmetology |
| US7344273B2 (en) | 2005-03-22 | 2008-03-18 | Binary Works, Inc. | Ring light with user manipulable control |
| EP1969525A1 (en) | 2005-12-23 | 2008-09-17 | Ingenia Holdings (UK)Limited | Optical authentication |
| KR100833717B1 (en) * | 2005-12-26 | 2008-05-29 | (주) 인텍플러스 | Vision inspection system |
| SG138491A1 (en) * | 2006-06-21 | 2008-01-28 | Generic Power Pte Ltd | Method and apparatus for 3-dimensional vision and inspection of ball and like protrusions of electronic components |
| FR2919396B1 (en) * | 2007-07-27 | 2010-08-20 | Clara Vision | HOUSING AND SHOOTING SYSTEM, IN PARTICULAR FOR THE QUALITY CONTROL OF WELD CORD. |
| US20110175997A1 (en) * | 2008-01-23 | 2011-07-21 | Cyberoptics Corporation | High speed optical inspection system with multiple illumination imagery |
| KR100956932B1 (en) * | 2008-02-16 | 2010-05-10 | 주식회사 에스디티 | Lighting unit for automatic visual inspection machine |
| CN103134446B (en) | 2008-02-26 | 2017-03-01 | 株式会社高永科技 | 3 d shape measuring apparatus and measuring method |
| WO2009120951A2 (en) * | 2008-03-28 | 2009-10-01 | Nordson Corporation | Automated conformal coating inspection system and methods of use |
| AT507018B1 (en) * | 2008-07-09 | 2012-11-15 | Profactor Res And Solutions Gmbh | DEVICE FOR TESTING OBJECTS |
| US7869645B2 (en) * | 2008-07-22 | 2011-01-11 | Seiko Epson Corporation | Image capture and calibratiion |
| US8269836B2 (en) * | 2008-07-24 | 2012-09-18 | Seiko Epson Corporation | Image capture, alignment, and registration |
| US8673679B2 (en) | 2008-12-10 | 2014-03-18 | Applied Materials Italia S.R.L. | Enhanced vision system for screen printing pattern alignment |
| GB2466465B (en) * | 2008-12-19 | 2011-02-16 | Ingenia Holdings | Authentication |
| GB2466311B (en) | 2008-12-19 | 2010-11-03 | Ingenia Holdings | Self-calibration of a matching algorithm for determining authenticity |
| DE102008064562A1 (en) * | 2008-12-29 | 2010-07-08 | Carl Zeiss Oim Gmbh | Device for optically inspecting an at least partially shiny surface on an object |
| US8670031B2 (en) * | 2009-09-22 | 2014-03-11 | Cyberoptics Corporation | High speed optical inspection system with camera array and compact, integrated illuminator |
| US8872912B2 (en) * | 2009-09-22 | 2014-10-28 | Cyberoptics Corporation | High speed distributed optical sensor inspection system |
| US8388204B2 (en) * | 2009-09-22 | 2013-03-05 | Cyberoptics Corporation | High speed, high resolution, three dimensional solar cell inspection system |
| US8894259B2 (en) * | 2009-09-22 | 2014-11-25 | Cyberoptics Corporation | Dark field illuminator with large working area |
| US8681211B2 (en) * | 2009-09-22 | 2014-03-25 | Cyberoptics Corporation | High speed optical inspection system with adaptive focusing |
| GB2476226B (en) | 2009-11-10 | 2012-03-28 | Ingenia Holdings Ltd | Optimisation |
| EP2684026A4 (en) * | 2011-03-08 | 2014-09-10 | Spectral Instr Imaging Llc | Imaging system having primary and auxiliary camera systems |
| FI125320B (en) | 2012-01-05 | 2015-08-31 | Helmee Imaging Oy | EVENTS AND SIMILAR OPTICAL MEASUREMENT PROCEDURES |
| US9467609B2 (en) | 2013-05-10 | 2016-10-11 | Mettler-Toledo, LLC | Machine vision inspection systems and methods and aperture covers for use therewith |
| EP2887055B1 (en) | 2013-12-17 | 2016-05-11 | CSEM Centre Suisse d'Electronique et de Microtechnique SA - Recherche et Développement | Method and apparatus for detection of visible defects |
| KR101886947B1 (en) * | 2014-05-05 | 2018-08-08 | 아르코닉 인코포레이티드 | Apparatus and methods for weld measurement |
| US10091891B2 (en) * | 2014-07-11 | 2018-10-02 | Voltera Inc. | Apparatus and method for printing circuitry |
| JP2017067633A (en) * | 2015-09-30 | 2017-04-06 | キヤノン株式会社 | Checkup apparatus, and manufacturing method |
| FR3054914B1 (en) * | 2016-08-03 | 2021-05-21 | Vit | OPTICAL INSPECTION METHOD OF AN OBJECT |
| DE102017207071A1 (en) * | 2017-04-27 | 2018-10-31 | Robert Bosch Gmbh | Test device for optical inspection of an object and object inspection arrangement |
| JP7010057B2 (en) * | 2018-02-26 | 2022-01-26 | オムロン株式会社 | Image processing system and setting method |
| JP7187782B2 (en) | 2018-03-08 | 2022-12-13 | オムロン株式会社 | Image inspection equipment |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3916439A (en) * | 1974-03-08 | 1975-10-28 | Westinghouse Electric Corp | Inspection system employing differential imaging |
| US4500202A (en) * | 1982-05-24 | 1985-02-19 | Itek Corporation | Printed circuit board defect detection of detecting maximum line width violations |
| US4604648A (en) * | 1984-10-12 | 1986-08-05 | Kley Victor B | Electronic viewing system for integrated circuit packages |
| JPS61293657A (en) * | 1985-06-21 | 1986-12-24 | Matsushita Electric Works Ltd | Method for inspecting soldering appearance |
| EP0341806B1 (en) * | 1988-02-24 | 1996-12-11 | CONTROL AUTOMATION, Inc. | Apparatus for inspecting circuit boards with surface mounted components |
| DE68929481T2 (en) * | 1988-05-09 | 2004-06-09 | Omron Corp. | Device and method for displaying the results of a printed circuit board test |
-
1990
- 1990-02-23 US US07/483,882 patent/US5060065A/en not_active Expired - Lifetime
- 1990-12-27 EP EP90470073A patent/EP0443289B1/en not_active Expired - Lifetime
- 1990-12-27 DE DE69032724T patent/DE69032724T2/en not_active Expired - Fee Related
- 1990-12-27 AT AT90470073T patent/ATE172795T1/en active
-
1991
- 1991-02-22 CA CA002036877A patent/CA2036877C/en not_active Expired - Fee Related
- 1991-02-23 KR KR1019910002943A patent/KR100294872B1/en not_active IP Right Cessation
- 1991-02-25 JP JP3053354A patent/JP3056269B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP0443289A3 (en) | 1992-05-06 |
| DE69032724T2 (en) | 1999-07-08 |
| CA2036877A1 (en) | 1991-08-24 |
| KR920000207A (en) | 1992-01-10 |
| EP0443289B1 (en) | 1998-10-28 |
| US5060065A (en) | 1991-10-22 |
| EP0443289A2 (en) | 1991-08-28 |
| JP3056269B2 (en) | 2000-06-26 |
| DE69032724D1 (en) | 1998-12-03 |
| JPH06300702A (en) | 1994-10-28 |
| ATE172795T1 (en) | 1998-11-15 |
| KR100294872B1 (en) | 2001-09-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA2036877C (en) | Apparatus for inspecting printed circuit boards | |
| US5032735A (en) | Method of and apparatus for inspecting printed circuit boards | |
| US5245421A (en) | Apparatus for inspecting printed circuit boards with surface mounted components | |
| US5760893A (en) | Method and apparatus for inspecting component placement and solder connection in printed circuit board manufacture | |
| KR900702353A (en) | Inspection apparatus such as boards and the operation method | |
| US6084663A (en) | Method and an apparatus for inspection of a printed circuit board assembly | |
| KR101129349B1 (en) | Parts mount board inspection apparatus | |
| EP0341806B1 (en) | Apparatus for inspecting circuit boards with surface mounted components | |
| US7113313B2 (en) | Dome-shaped apparatus for inspecting a component or a printed circuit board device | |
| EP0871027A2 (en) | Inspection of print circuit board assembly | |
| JP3243385B2 (en) | Object shape inspection device | |
| AU608175B2 (en) | Optical inspection system for solder joints and inspection methods | |
| KR100323513B1 (en) | Appearance test apparatus &the test method for printed board | |
| JPH07306023A (en) | Shape measuring instrument, inspection device, and product manufacturing method | |
| EP0370527B1 (en) | Method of and apparatus for inspecting substrate | |
| JP2929701B2 (en) | Surface texture observation device | |
| JPH05296745A (en) | Form measuring device | |
| JPH0678856U (en) | Lighting equipment | |
| GB2364119A (en) | Circuit board testing | |
| JPS62174889A (en) | Illuminating conditions analyzing method and its device | |
| KR100229480B1 (en) | Lead inspection apparatus and calibration method for lead inspection apparatus | |
| JPH04337404A (en) | Position measurement device | |
| JPS6332669A (en) | Object recognizing device | |
| JPH05296744A (en) | Form measuring device | |
| JPH04212047A (en) | Soldering inspection device of printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| MKLA | Lapsed |