CA2062264A1 - Static dissipative resin composition - Google Patents

Static dissipative resin composition

Info

Publication number
CA2062264A1
CA2062264A1 CA2062264A CA2062264A CA2062264A1 CA 2062264 A1 CA2062264 A1 CA 2062264A1 CA 2062264 A CA2062264 A CA 2062264A CA 2062264 A CA2062264 A CA 2062264A CA 2062264 A1 CA2062264 A1 CA 2062264A1
Authority
CA
Canada
Prior art keywords
resin composition
semiconductor
static dissipative
fillers
filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2062264A
Other languages
French (fr)
Other versions
CA2062264C (en
Inventor
Mitsumasa Oku
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP3037678A external-priority patent/JPH0525323A/en
Priority claimed from JP4054388A external-priority patent/JPH05214158A/en
Priority claimed from JP4056778A external-priority patent/JPH05226092A/en
Application filed by Individual filed Critical Individual
Publication of CA2062264A1 publication Critical patent/CA2062264A1/en
Application granted granted Critical
Publication of CA2062264C publication Critical patent/CA2062264C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/017—Antistatic agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/08—Oxygen-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S524/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S524/91—Antistatic compositions
    • Y10S524/912—Contains metal, boron, phosphorus, or silicon

Abstract

A static dissipative resin composition has semiconductor fillers dispersed in the resin with at least some of the fillers in electrical contact with each other to form a conductive path. The .alpha. value representing the degree of nonlinearity of the V-i characteristic at the contact between the semiconductor fillers should be 2-150, and the volume resistivity of the semiconductor filler is desirably 105-1010.OMEGA..cm, whereby, by employment of a conductive filler or a solid lubricant together with the semiconductor filler, various physical properties of the resin composition are improved.
CA002062264A 1991-03-05 1992-03-04 Static dissipative resin composition Expired - Fee Related CA2062264C (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP3037678A JPH0525323A (en) 1991-03-05 1991-03-05 Electrically conductive thermoplastic resin composition
JP3-37678 1991-03-05
JP4-54388 1992-02-04
JP4054388A JPH05214158A (en) 1992-02-04 1992-02-04 Static electricity dissipating resin composition
JP4-56778 1992-02-07
JP4056778A JPH05226092A (en) 1992-02-07 1992-02-07 Electrostatic diffusion resin complex

Publications (2)

Publication Number Publication Date
CA2062264A1 true CA2062264A1 (en) 1992-09-06
CA2062264C CA2062264C (en) 1997-01-14

Family

ID=27289546

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002062264A Expired - Fee Related CA2062264C (en) 1991-03-05 1992-03-04 Static dissipative resin composition

Country Status (4)

Country Link
US (1) US5276080A (en)
EP (1) EP0502483A3 (en)
KR (1) KR950015027B1 (en)
CA (1) CA2062264C (en)

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* Cited by examiner, † Cited by third party
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TW401454B (en) * 1992-06-02 2000-08-11 Sumitomo Chemical Co Liquid crystal polyester resin composition and molded article
JP3229020B2 (en) * 1992-06-05 2001-11-12 大豊工業株式会社 Slide bearing material
US6221200B1 (en) * 1994-01-18 2001-04-24 Nisshinbo Industries Inc. Instrument for production of semiconductor device and process for production thereof
GB9411101D0 (en) * 1994-06-03 1994-07-27 Rennie Stephen A Polyamide compositions
JP3333324B2 (en) * 1994-08-23 2002-10-15 セイコーエプソン株式会社 Tape cartridge and tape printer
US5989460A (en) * 1994-11-21 1999-11-23 Garland Floor Co. Electrically conductive coating
US5853254A (en) * 1994-12-15 1998-12-29 Seiko Epson Corporation Tape cartridge for use in a tape printer
DE19525692A1 (en) * 1995-07-14 1997-01-16 Abb Research Ltd Electrically and thermally conductive plastic and the use of this plastic
US5846621A (en) * 1995-09-15 1998-12-08 Minnesota Mining And Manufacturing Company Component carrier tape having static dissipative properties
GB9600819D0 (en) * 1996-01-16 1996-03-20 Raychem Gmbh Electrical stress control
JPH10199196A (en) * 1997-01-09 1998-07-31 Tdk Corp Tape guide for tape cassette
US6274524B1 (en) * 1997-04-25 2001-08-14 Kyocera Corporation Semiconductive zirconia sintering body and electrostatic removing member constructed by semiconductive zirconia sintering body
US6605660B2 (en) 1997-09-29 2003-08-12 Polyplastics Co., Ltd. Polyarylene sulfide resin composition
JP3479448B2 (en) 1998-01-23 2003-12-15 Ｔｄｋ株式会社 Tape cassette
DE19824104B4 (en) * 1998-04-27 2009-12-24 Abb Research Ltd. Non-linear resistor with varistor behavior
US6071612A (en) * 1999-10-22 2000-06-06 Arteva North America S.A.R.L. Fiber and filament with zinc sulfide delusterant
US6261680B1 (en) * 1999-12-07 2001-07-17 Hughes Electronics Corporation Electronic assembly with charge-dissipating transparent conformal coating
US20050191788A1 (en) * 2001-02-15 2005-09-01 Integral Technologies, Inc. Low cost magnetic brakes and motion control devices manufactured from conductive loaded resin-based materials
US20020145233A1 (en) * 2001-04-09 2002-10-10 Ching-Cheng Lai Method for manufacturing fire-proof material
US7304105B2 (en) * 2001-09-28 2007-12-04 Nippon Tungsten Co., Ltd. High-density composite material
FR2846976B1 (en) * 2002-11-08 2005-12-09 Rhodianyl YARNS, FIBERS, FILAMENTS AND TEXTILE ARTICLES WITH ANTIBACTERIAL AND ANTIFUNGAL ACTIVITY
JP4386633B2 (en) * 2002-12-27 2009-12-16 三井・デュポンフロロケミカル株式会社 Fluoro resin composition
US20050186438A1 (en) * 2003-09-24 2005-08-25 Alms Gregory R. Electrically conductive thermoplastic compositions
US20070152195A1 (en) * 2005-12-30 2007-07-05 Saint-Gobain Performance Plastics Corporation Electrostatic dissipative composite material
US20070154716A1 (en) * 2005-12-30 2007-07-05 Saint-Gobain Performance Plastics Corporation Composite material
US20070155949A1 (en) * 2005-12-30 2007-07-05 Saint-Gobain Performance Plastics Corporation Thermally stable composite material
US20070154717A1 (en) * 2005-12-30 2007-07-05 Saint-Gobain Performance Plastics Corporation Thermally stable composite material
JP4865403B2 (en) * 2006-05-15 2012-02-01 株式会社クラレ Polyvinyl acetal powder coating
US7476339B2 (en) * 2006-08-18 2009-01-13 Saint-Gobain Ceramics & Plastics, Inc. Highly filled thermoplastic composites
US20140142228A1 (en) * 2012-11-21 2014-05-22 Ticona Llc Plasticized, Conductive Polyoxymethylene for Fuel Applications
CN104693801A (en) * 2013-12-10 2015-06-10 合肥杰事杰新材料股份有限公司 Wear-resisting anti-electrostatic polyphenylene sulfide/semi-aromatic high-temperature-resistant nylon composite material and preparation method thereof
CN105330963A (en) * 2015-11-23 2016-02-17 常州大学 Preparation method of wear-resistant and anti-static PP (polypropylene) sheet
DE102020118742B4 (en) * 2020-07-15 2022-11-03 Murat Gündüz Use of silicone as a sealant in particularly exposed areas
CN112922266B (en) * 2021-02-04 2022-09-16 安徽森泰木塑科技地板有限公司 Indoor LVT floor

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0025583B1 (en) * 1979-09-14 1982-11-24 Mitsubishi Materials Corporation Electroconductive powder and process for production thereof
JPS6113421A (en) * 1984-06-29 1986-01-21 Fuji Photo Film Co Ltd Magnetic tape having leader tape
US4933109A (en) * 1985-10-14 1990-06-12 Sumitomo Chemical Company, Limited Fibrous white electrically conductive material and a white electrically conductive coating composition containing the same
DE3764238D1 (en) * 1986-11-11 1990-09-13 Ishihara Sangyo Kaisha NEEDLE CRYSTAL-SHAPED ELECTRICALLY CONDUCTIVE TITANIUM OXIDE AND METHOD FOR PRODUCING THE SAME.
JPH0618911B2 (en) * 1987-09-25 1994-03-16 ポリプラスチックス株式会社 Method for manufacturing electrostatically-coated plastic molded products
US5231269A (en) * 1989-02-17 1993-07-27 Matsushita Electric Industrial Co., Ltd. Electromagnetic wave energy conversion heat-generating material, heating container for microwave oven, and microwave oven
JP2767051B2 (en) * 1989-02-21 1998-06-18 住友化学工業株式会社 Polypropylene resin composition
JPH0353253A (en) * 1989-07-21 1991-03-07 Fuji Photo Film Co Ltd Electrostatic recording film
JPH03162445A (en) * 1989-11-21 1991-07-12 Mitsubishi Gas Chem Co Inc Sliding resin composition
JPH03289004A (en) * 1990-04-04 1991-12-19 Matsushita Electric Ind Co Ltd Conductive resin composite

Also Published As

Publication number Publication date
US5276080A (en) 1994-01-04
KR950015027B1 (en) 1995-12-21
KR920019220A (en) 1992-10-22
CA2062264C (en) 1997-01-14
EP0502483A2 (en) 1992-09-09
EP0502483A3 (en) 1993-01-20

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