CA2062415A1 - Molded optical package utilizing leadframe technology - Google Patents

Molded optical package utilizing leadframe technology

Info

Publication number
CA2062415A1
CA2062415A1 CA2062415A CA2062415A CA2062415A1 CA 2062415 A1 CA2062415 A1 CA 2062415A1 CA 2062415 A CA2062415 A CA 2062415A CA 2062415 A CA2062415 A CA 2062415A CA 2062415 A1 CA2062415 A1 CA 2062415A1
Authority
CA
Canada
Prior art keywords
leadframe
connector receptacle
outer package
optical package
molded outer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2062415A
Other languages
French (fr)
Other versions
CA2062415C (en
Inventor
Muvaffak Sabri Acarlar
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
American Telephone and Telegraph Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Telephone and Telegraph Co Inc filed Critical American Telephone and Telegraph Co Inc
Publication of CA2062415A1 publication Critical patent/CA2062415A1/en
Application granted granted Critical
Publication of CA2062415C publication Critical patent/CA2062415C/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4245—Mounting of the opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4255—Moulded or casted packages
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means

Abstract

An optical communication arrangement and method is disclosed which utilizes a combination of leadframe and package molding technology to reduce thecomplexity of the arrangement. In general, a leadframe is utilized for the placement and connection of the required electronic circuitry. An optical device is also coupled to the leadframe, where a subassembly may be used to house the optical device.
The electronics and optics are then simultaneously encapsulated in a molded outer package to form the final arrangement. In one embodiment, an optical subassemblyincorporating a fiber optic connector receptacle may be utilized, wherein the molded outer package is configured such that the connector receptacle remains exposed.
Alternatively, the molded outer package may be configured to include the connector receptacle.
CA002062415A 1991-04-25 1992-03-06 Molded optical package utilizing leadframe technology Expired - Lifetime CA2062415C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US691,623 1991-04-25
US07/691,623 US5123066A (en) 1991-04-25 1991-04-25 Molded optical package utilizing leadframe technology

Publications (2)

Publication Number Publication Date
CA2062415A1 true CA2062415A1 (en) 1992-10-26
CA2062415C CA2062415C (en) 1997-08-12

Family

ID=24777289

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002062415A Expired - Lifetime CA2062415C (en) 1991-04-25 1992-03-06 Molded optical package utilizing leadframe technology

Country Status (6)

Country Link
US (1) US5123066A (en)
EP (1) EP0510859B1 (en)
JP (1) JPH06252424A (en)
KR (1) KR920020699A (en)
CA (1) CA2062415C (en)
DE (1) DE69228445T2 (en)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2079964C (en) * 1992-01-22 1997-12-16 Mitsutoshi Kamakura Apparatus and method for manufacturing optical module
US5282071A (en) * 1992-07-13 1994-01-25 Motorola, Inc. Contact areas on an optical waveguide and method of making
US5271083A (en) * 1992-07-27 1993-12-14 Motorola, Inc. Molded optical waveguide with contacts utilizing leadframes and method of making same
EP0582992B1 (en) * 1992-08-11 1998-06-03 Sumitomo Electric Industries, Ltd Optical module with improved grounding of an optical element
US5249245A (en) * 1992-08-31 1993-09-28 Motorola, Inc. Optoelectroinc mount including flexible substrate and method for making same
US5337398A (en) * 1992-11-30 1994-08-09 At&T Bell Laboratories Single in-line optical package
DE4300652C1 (en) * 1993-01-13 1994-03-31 Bosch Gmbh Robert Hybrid integrated optical circuit manufacturing method - uses shaping tool into which electro-optical semiconductor component is inserted before enclosing in polymer material
JPH06232504A (en) * 1993-01-29 1994-08-19 Canon Inc Laser scanning device
US5359686A (en) * 1993-03-29 1994-10-25 Motorola, Inc. Interface for coupling optical fibers to electronic circuitry
US5416871A (en) * 1993-04-09 1995-05-16 Sumitomo Electric Industries, Ltd. Molded optical connector module
US5546489A (en) * 1993-08-02 1996-08-13 Sumitomo Electric Industries, Ltd. Optical link apparatus
US5482658A (en) * 1993-08-13 1996-01-09 Motorola, Inc. Method of making an optoelectronic interface module
US5367593A (en) * 1993-09-03 1994-11-22 Motorola, Inc. Optical/electrical connector and method of fabrication
US5493437A (en) * 1993-09-13 1996-02-20 Motorola External communication link for a credit card pager
US5475778A (en) * 1993-10-21 1995-12-12 Motorola, Inc. Smart optical coupler and smart optical coupler system
EP0654866A3 (en) * 1993-11-23 1997-08-20 Motorola Inc Package for mating with a semiconductor die and method of manufacture.
US5432878A (en) * 1994-03-03 1995-07-11 Cts Corporation Silicon carrier for testing and alignment of optoelectronic devices and method of assembling same
SE9402082L (en) * 1994-06-14 1995-12-15 Ericsson Telefon Ab L M Miniature optical capsule
US5521992A (en) * 1994-08-01 1996-05-28 Motorola, Inc. Molded optical interconnect
US5515467A (en) * 1994-12-30 1996-05-07 Motorola, Inc. Optical fiber assembly for connecting photonic devices to a fiber optic cable
DE19718950A1 (en) * 1997-05-05 1998-11-12 Bosch Gmbh Robert Electro-optical module
DE19755806A1 (en) * 1997-12-16 1999-06-17 Bosch Gmbh Robert Electro-optical module
DE19920638C2 (en) * 1999-04-29 2001-09-13 Infineon Technologies Ag Module for parallel optical data transmission
SE514393C2 (en) * 1999-06-30 2001-02-19 Ericsson Telefon Ab L M Enclosed opto module
DE19947889C2 (en) * 1999-10-05 2003-03-06 Infineon Technologies Ag Optoelectronic, bidirectional transmit and receive module in leadframe technology
US6704515B1 (en) * 1999-12-30 2004-03-09 The Boeing Company Fiber optic interface module and associated fabrication method
DE10001873B4 (en) * 2000-01-18 2010-06-02 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Optical transmitting and receiving device
JP2001284608A (en) * 2000-03-29 2001-10-12 Fujitsu Ltd Optical module
GB2365989B (en) * 2000-05-08 2003-05-14 Mitel Semiconductor Ab Optic fiber interface device on folded circuit board
US6607308B2 (en) 2001-02-12 2003-08-19 E20 Communications, Inc. Fiber-optic modules with shielded housing/covers having mixed finger types
US6659655B2 (en) 2001-02-12 2003-12-09 E20 Communications, Inc. Fiber-optic modules with housing/shielding
JP4543561B2 (en) * 2001-02-19 2010-09-15 住友電気工業株式会社 Optical module manufacturing method and optical module
FR2836236B1 (en) * 2002-02-21 2004-09-17 Framatome Connectors Int IMPROVED OPTOELECTRONIC COUPLING DEVICE
TW579071U (en) * 2002-02-26 2004-03-01 Ind Tech Res Inst Optoelectronic module package
DE10319900A1 (en) * 2003-04-29 2004-11-25 Infineon Technologies Ag Optoelectronic transmission and / or reception arrangement
DE10322071A1 (en) * 2003-05-15 2004-09-02 Infineon Technologies Ag Micro-optical module, has housing formed as molded interconnect device, with three-dimensional conductor structure for connecting optoelectronic circuitry with components
US7268368B1 (en) 2003-08-29 2007-09-11 Standard Microsystems Corporation Semiconductor package having optical receptacles and light transmissive/opaque portions and method of making same
US7458808B2 (en) * 2005-02-22 2008-12-02 Woodlane Environmental Technology, Inc. Gel fuel log set
EP2265102B1 (en) * 2009-06-19 2014-06-25 Baumer Innotec AG Sensor device without housing
JP6631138B2 (en) 2015-10-01 2020-01-15 住友電気工業株式会社 Optical devices, printed circuit boards
JP6558192B2 (en) * 2015-10-01 2019-08-14 住友電気工業株式会社 Optical device

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4307934A (en) * 1978-05-08 1981-12-29 General Dynamics, Pomona Division Packaged fiber optic modules
DE3175956D1 (en) * 1980-11-28 1987-04-09 Toshiba Kk Module for a fiber optic link
EP0053483B1 (en) * 1980-11-28 1985-10-02 Kabushiki Kaisha Toshiba Method for manufacturing a module for a fiber optic link
US4798440A (en) * 1983-01-24 1989-01-17 Amp Incorporated Fiber optic connector assembly
JPS6142975A (en) * 1984-08-06 1986-03-01 S M K Kk Photo transmission element
US4633582A (en) * 1985-08-14 1987-01-06 General Instrument Corporation Method for assembling an optoisolator and leadframe therefor
JPH06105798B2 (en) * 1985-12-13 1994-12-21 株式会社日立製作所 Optical communication semiconductor device
US4803361A (en) * 1986-05-26 1989-02-07 Hitachi, Ltd. Photoelectric device with optical fiber and laser emitting chip
US4752109A (en) * 1986-09-02 1988-06-21 Amp Incorporated Optoelectronics package for a semiconductor laser
US4911519A (en) * 1989-02-01 1990-03-27 At&T Bell Laboratories Packaging techniques for optical transmitters/receivers
CA1330576C (en) * 1989-03-29 1994-07-05 Camilo M. Tabalba Transient voltage suppression for electro-optic modules
US4913511A (en) * 1989-03-30 1990-04-03 Northern Telecom Limited Transient voltage suppression for electro-optic modules
GB2229857B (en) * 1989-03-31 1992-12-23 Stc Plc Semiconductor device package
JP2881806B2 (en) * 1989-04-12 1999-04-12 住友電気工業株式会社 Optical module and manufacturing method thereof
EP0472587A4 (en) * 1989-05-19 1993-01-20 E.I. Du Pont De Nemours And Company (A Delaware Corporation) Housing for an opto-electronic device

Also Published As

Publication number Publication date
DE69228445T2 (en) 1999-07-22
DE69228445D1 (en) 1999-04-01
EP0510859A2 (en) 1992-10-28
EP0510859B1 (en) 1999-02-24
JPH06252424A (en) 1994-09-09
US5123066A (en) 1992-06-16
CA2062415C (en) 1997-08-12
EP0510859A3 (en) 1993-03-10
KR920020699A (en) 1992-11-21

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