CA2067784A1 - Procede et dispositif d'encapsulation hermetique de composants electroniques - Google Patents

Procede et dispositif d'encapsulation hermetique de composants electroniques

Info

Publication number
CA2067784A1
CA2067784A1 CA002067784A CA2067784A CA2067784A1 CA 2067784 A1 CA2067784 A1 CA 2067784A1 CA 002067784 A CA002067784 A CA 002067784A CA 2067784 A CA2067784 A CA 2067784A CA 2067784 A1 CA2067784 A1 CA 2067784A1
Authority
CA
Canada
Prior art keywords
electronic components
hermetic encapsulation
layer
ensuring
function
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002067784A
Other languages
English (en)
Other versions
CA2067784C (fr
Inventor
Michel Leroy
Christian Val
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Michel Leroy
Christian Val
Thomson-Csf
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Michel Leroy, Christian Val, Thomson-Csf filed Critical Michel Leroy
Publication of CA2067784A1 publication Critical patent/CA2067784A1/fr
Application granted granted Critical
Publication of CA2067784C publication Critical patent/CA2067784C/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0179—Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09872—Insulating conformal coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1322—Encapsulation comprising more than one layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Credit Cards Or The Like (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

2067784 9203902 PCTABS00110 Selon un mode de réalisation de l'invention, les composants électroniques discrets ou intégrés, sont encapsulés chacun dans un boîtier, par exemple plastique; les boîtiers sont ensuite montés sur une carte de circuit imprimé, par exemple époxy. L'ensemble composants et carte est recouvert d'une première couche relativement épaisse, constituée par un composé organique et assurant une fonction de nivellement, puis d'une couche telle qu'un composé métallique minéral, ayant pour fonction d'assurer l'herméticité de l'ensemble.
CA002067784A 1990-08-24 1991-08-23 Procede et dispositif d'encapsulation hermetique de composants electroniques Expired - Lifetime CA2067784C (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR9010631A FR2666190B1 (fr) 1990-08-24 1990-08-24 Procede et dispositif d'encapsulation hermetique de composants electroniques.
FR90/10631 1990-08-24
PCT/FR1991/000688 WO1992003902A1 (fr) 1990-08-24 1991-08-23 Procede et dispositif d'encapsulation hermetique de composants electroniques

Publications (2)

Publication Number Publication Date
CA2067784A1 true CA2067784A1 (fr) 1992-02-25
CA2067784C CA2067784C (fr) 2001-10-23

Family

ID=9399835

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002067784A Expired - Lifetime CA2067784C (fr) 1990-08-24 1991-08-23 Procede et dispositif d'encapsulation hermetique de composants electroniques

Country Status (7)

Country Link
US (1) US5461545A (fr)
EP (1) EP0497948B1 (fr)
JP (1) JPH05502142A (fr)
CA (1) CA2067784C (fr)
DE (1) DE69109464T2 (fr)
FR (1) FR2666190B1 (fr)
WO (1) WO1992003902A1 (fr)

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Also Published As

Publication number Publication date
FR2666190A1 (fr) 1992-02-28
US5461545A (en) 1995-10-24
EP0497948A1 (fr) 1992-08-12
FR2666190B1 (fr) 1996-07-12
JPH05502142A (ja) 1993-04-15
DE69109464T2 (de) 1995-09-14
EP0497948B1 (fr) 1995-05-03
CA2067784C (fr) 2001-10-23
DE69109464D1 (de) 1995-06-08
WO1992003902A1 (fr) 1992-03-05

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