CA2084499A1 - Emi shield apparatus and methods - Google Patents

Emi shield apparatus and methods

Info

Publication number
CA2084499A1
CA2084499A1 CA2084499A CA2084499A CA2084499A1 CA 2084499 A1 CA2084499 A1 CA 2084499A1 CA 2084499 A CA2084499 A CA 2084499A CA 2084499 A CA2084499 A CA 2084499A CA 2084499 A1 CA2084499 A1 CA 2084499A1
Authority
CA
Canada
Prior art keywords
emi
circuit board
printed circuit
circuitry
electronic circuitry
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2084499A
Other languages
French (fr)
Other versions
CA2084499C (en
Inventor
William F. Weber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia of America Corp
Original Assignee
Alcatel Network Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel Network Systems Inc filed Critical Alcatel Network Systems Inc
Publication of CA2084499A1 publication Critical patent/CA2084499A1/en
Application granted granted Critical
Publication of CA2084499C publication Critical patent/CA2084499C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0062—Structures of standardised dimensions, e.g. 19" rack, chassis for servers or telecommunications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1461—Slidable card holders; Card stiffeners; Control or display means therefor

Abstract

A top cover and bottom cover made of an electrically conductive material that absorbs and reflects electromagnetic interference (EMI) signals are formed to fit without solder or welding as an EMI shield apparatus over EMI susceptible electronic circuitry on a printed circuit board. The EMI shield apparatus shields the circuitry from EMI while at the same time permitting the communication of desired electromagnetic radio frequency and electrical signals to the circuitry. The EMI shield apparatus includes the use of an electrically conductive layer that is integral to the top and bottom sides of the printed circuit board and which includes conductive channels that penetrate the printed circuit board. The channels prevent EMI from passing through the printed circuit board to the electronic circuitry. Also, the channels receive tangs found both on the top cover and bottom cover. The tangs are positioned to prevent EMI
from passing through the top and bottom cover junctures with the conductive layer. As EMI signals reach the shield apparatus, they are absorbed and conducted through the shield EMI apparatus to an electrical ground or reflected from the EMI shield. Openings on the top cover permit desired electromagnetic radio frequency signals to reach the electronic circuitry. Passageways through the conductive layer permit electrical leads from the electronic circuitry to connect to external circuitry.
CA002084499A 1992-02-12 1992-12-03 Emi shield apparatus and methods Expired - Fee Related CA2084499C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US83490892A 1992-02-12 1992-02-12
US7-834,908 1992-02-12

Publications (2)

Publication Number Publication Date
CA2084499A1 true CA2084499A1 (en) 1993-08-13
CA2084499C CA2084499C (en) 1998-11-03

Family

ID=25268110

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002084499A Expired - Fee Related CA2084499C (en) 1992-02-12 1992-12-03 Emi shield apparatus and methods

Country Status (2)

Country Link
US (1) US5335147A (en)
CA (1) CA2084499C (en)

Families Citing this family (36)

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Publication number Priority date Publication date Assignee Title
US5491613A (en) * 1994-01-31 1996-02-13 Hubbell Incorporated Electrical circuit card with reduced EMI emission
US5463532A (en) * 1994-04-15 1995-10-31 Hubbell Incorporated Electrical circuit card with EMI shielding strip adapted to make contact with non-outwardly facing surface of card-receiving housing
SE506941C2 (en) * 1995-03-31 1998-03-02 Ericsson Telefon Ab L M PCB with interference shielding layer
CA2151331A1 (en) * 1995-06-08 1996-12-09 Henry W. C. Mok Emi shield
US5633786A (en) * 1995-08-21 1997-05-27 Motorola Shield assembly and method of shielding suitable for use in a communication device
US5726864A (en) * 1995-08-24 1998-03-10 Digital Equipment Corporation Cage system
US5781078A (en) * 1996-12-05 1998-07-14 Glenayre Electronics, Inc. Filter enhancement using input-to-output ground isolation and shielding
DE19710514C2 (en) * 1997-03-13 2001-06-28 Itt Mfg Enterprises Inc Plug-in card for electronic devices
SE511926C2 (en) * 1997-04-16 1999-12-20 Ericsson Telefon Ab L M Screen enclosure as well as process for making and using a screen enclosure and mobile phone with screen enclosure
US6053771A (en) * 1997-08-20 2000-04-25 Dell Usa L.P. Electromagnetic shield connector
US6172880B1 (en) 1998-07-31 2001-01-09 Hubbell Incorporated Faceplate for an electronic circuit card for reducing EMI emissions between circuit cards inserted in a circuit card housing
SE513630C2 (en) * 1998-12-21 2000-10-09 Ericsson Telefon Ab L M Method and apparatus for shielding electronic components
TW379824U (en) * 1998-12-28 2000-01-11 Foxconn Prec Components Co Ltd Heat radiating apparatus
US6178097B1 (en) 1999-01-22 2001-01-23 Dial Tool Industries, Inc. RF shield having removable cover
US6366380B1 (en) 1999-02-12 2002-04-02 Cisco Technology, Inc Optical transceiver EMI detuning device
US6088231A (en) * 1999-03-03 2000-07-11 Methode Electronics, Inc. RF and EMI shield
US6269537B1 (en) 1999-07-28 2001-08-07 Methode Electronics, Inc. Method of assembling a peripheral device printed circuit board package
US6327155B1 (en) * 1999-12-16 2001-12-04 Nortel Networks Limited Method and apparatus for preventing flamespread in an equipment assembly
US6377475B1 (en) 2001-02-26 2002-04-23 Gore Enterprise Holdings, Inc. Removable electromagnetic interference shield
US6744640B2 (en) 2002-04-10 2004-06-01 Gore Enterprise Holdings, Inc. Board-level EMI shield with enhanced thermal dissipation
WO2003096500A1 (en) * 2002-05-14 2003-11-20 Sumitomo Electric Industries, Ltd. Optical module
US6852924B2 (en) * 2002-07-30 2005-02-08 Lsi Logic Corporation EMI sealed removable latching cover
US6999323B1 (en) * 2002-10-17 2006-02-14 Finisar Corporation Electromagnetic interference containment transceiver module
US6816372B2 (en) * 2003-01-08 2004-11-09 International Business Machines Corporation System, method and apparatus for noise and heat suppression, and for managing cables in a computer system
JP4112484B2 (en) * 2003-12-17 2008-07-02 株式会社東芝 Wireless device and semiconductor device
US20060018098A1 (en) * 2004-07-22 2006-01-26 Adrian Hill PCB board incorporating thermo-encapsulant for providing controlled heat dissipation and electromagnetic functions and associated method of manufacturing a PCB board
US7511970B2 (en) * 2004-12-27 2009-03-31 Cisco Technology, Inc. Method and apparatus for shielding a circuit board of a circuit board chassis
US7481656B2 (en) * 2006-02-13 2009-01-27 Finisar Corporation Optical transceiver PCB mounting system having EMI containment features
US7508684B2 (en) * 2006-08-18 2009-03-24 Research In Motion Limited Handheld electronic device including multi-compartment shielding container and associated methods
EP2367411A3 (en) * 2010-03-17 2015-03-18 Kabushiki Kaisha Toshiba Display apparatus and electronic apparatus
JP5149320B2 (en) * 2010-03-17 2013-02-20 株式会社ソニー・コンピュータエンタテインメント Electronics
CN102548290B (en) * 2010-12-09 2016-06-01 中山市云创知识产权服务有限公司 Electronic equipment chassis
KR101760746B1 (en) * 2010-12-10 2017-08-04 엘지전자 주식회사 Mobile terminal
TW201225752A (en) * 2010-12-10 2012-06-16 Askey Computer Corp Printed circuit board grounding structure for use with communication apparatus
US9504175B2 (en) * 2012-12-12 2016-11-22 Fourte Internatinal, Ltd. Solid-state drive housing, a solid-state disk using the same and an assembling process thereof
CN105792626B (en) * 2014-12-26 2019-03-26 菲尼萨公司 Electromagnetic interference shield

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4370515A (en) * 1979-12-26 1983-01-25 Rockwell International Corporation Electromagnetic interference
DE3211758A1 (en) * 1982-03-30 1983-10-06 Siemens Ag Housing for electrical information technology
US4661888A (en) * 1984-07-03 1987-04-28 Hewlett-Packard Company Removable modular housing for RF circuits
DE3537653A1 (en) * 1985-10-23 1987-04-23 Licentia Gmbh Arrangement for radio-frequency-proof screening of a printed circuit board
DE3629913A1 (en) * 1986-09-03 1988-03-17 Standard Elektrik Lorenz Ag Screening housing
DE3736833A1 (en) * 1987-10-30 1989-05-11 Philips Patentverwaltung Electrical assembly having a screening device
JPH01145897A (en) * 1987-12-01 1989-06-07 Toshiba Corp Shielding structure
GB2214000B (en) * 1987-12-19 1991-06-26 Stc Plc Circuit screening arrangement
US4800464A (en) * 1988-02-05 1989-01-24 Eip Microwave, Inc. Modular shielding assembly for electronic devices
DE3809607A1 (en) * 1988-03-22 1989-10-05 Siemens Ag HF-proof (RF-proof) plug-in module
JPH0638559B2 (en) * 1988-08-10 1994-05-18 日本電気株式会社 High-frequency circuit board connection structure
JPH02239699A (en) * 1989-03-13 1990-09-21 Fujitsu Ltd Shielding structure of printed board
US5107404A (en) * 1989-09-14 1992-04-21 Astec International Ltd. Circuit board assembly for a cellular telephone system or the like
FR2652227B1 (en) * 1989-09-19 1996-08-02 Legrand Sa PRINTED CIRCUIT BOARD WITH SHIELDING COVER.
US5053924A (en) * 1990-03-30 1991-10-01 Motorola, Inc. Electromagnetic shield for electrical circuit
ATE97293T1 (en) * 1990-05-16 1993-11-15 Siemens Ag METHOD OF CONTACTING SHIELDS.
DE4037763C2 (en) * 1990-11-28 1995-06-22 Rohde & Schwarz High-frequency-tight assembly for electrical communications engineering devices

Also Published As

Publication number Publication date
CA2084499C (en) 1998-11-03
US5335147A (en) 1994-08-02

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Legal Events

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EEER Examination request
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