CA2087794C - Circuit elements dependent on core inductance and fabrication thereof - Google Patents
Circuit elements dependent on core inductance and fabrication thereofInfo
- Publication number
- CA2087794C CA2087794C CA002087794A CA2087794A CA2087794C CA 2087794 C CA2087794 C CA 2087794C CA 002087794 A CA002087794 A CA 002087794A CA 2087794 A CA2087794 A CA 2087794A CA 2087794 C CA2087794 C CA 2087794C
- Authority
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- Canada
- Prior art keywords
- fabrication
- board
- turn
- segments
- boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000004519 manufacturing process Methods 0.000 title claims description 32
- 230000001419 dependent effect Effects 0.000 title 1
- 230000013011 mating Effects 0.000 claims abstract description 18
- 238000004804 winding Methods 0.000 claims abstract description 18
- 239000000853 adhesive Substances 0.000 claims abstract description 11
- 230000001070 adhesive effect Effects 0.000 claims abstract description 11
- 239000002245 particle Substances 0.000 claims abstract description 10
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 3
- 239000004020 conductor Substances 0.000 claims description 7
- 238000010276 construction Methods 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- 238000009736 wetting Methods 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000000696 magnetic material Substances 0.000 claims 1
- 239000012790 adhesive layer Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 abstract 1
- 238000013459 approach Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 238000000429 assembly Methods 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 238000011065 in-situ storage Methods 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229910000859 α-Fe Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000011152 fibreglass Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- VVNCNSJFMMFHPL-VKHMYHEASA-N D-penicillamine Chemical compound CC(C)(S)[C@@H](N)C(O)=O VVNCNSJFMMFHPL-VKHMYHEASA-N 0.000 description 1
- 241000282320 Panthera leo Species 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229940106691 bisphenol a Drugs 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 229940075911 depen Drugs 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000010952 in-situ formation Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49073—Electromagnet, transformer or inductor by assembling coil and core
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49789—Obtaining plural product pieces from unitary workpiece
Abstract
Magnetic circuit elements, e.g. for inclusion on circuit boards including one or more windings about a toroidal core are produced by joinder of mating sheets, one or both recessed to hold the core, and each containing partial windings. Joinder is by use of an anisotropically conducting adhesive layer. The layer is applied as an uncured thermosetting adhesive containing spherical conducting particles of suchsize and distribution as to statistically result in electrical completion of windings while avoiding turn-to-turn shorting.
Description
2 0 8 779~
Circuit Elements Depen~en~ on Core Inductance and Fabrication Thereof Back~round of the Invention Technical Field S The invention is con~çrnPd with the fabrication of small circuit eleme~tc which, as generally now fabricated, entail wire winding of a soft magnetic core. An important class of elements includes transformers and inductQr~ based on toroidal or other m~gnPtically ungapped cores. Contçmpl~ted structures may be discrete elPment.~ or sub-assemblies, e.g. for incorporation on circuit boards. They may be 10 constructed in situ to constitute an integral part of a circui~
Description of the Prior Art Wire wound core structures such as toroidal inductors and transformers are expensive to fabricate - generally entail turn-by-turn hand or machine winding.
Relative to other circuit elçm~nt.~, e.g. resictors, capacitors, etc., they contribute 15 disproportionately to the cost of completed cilcuill~. The problem is most pronounced for ungapped core elements in which cost is due to complex apparatus/proce~ing associated with the tum-by-turn insertion-extraction operation of winding. Cost is aggravated by the trend toward decreasing device size.
The prevailing commercial approach continues to depend on m~hinP or 20 hand winding of coil turns about toroidal cores. Recognition of the problem is evidenced by proposed ~lt~ tives revealed in patentlliterature study. These include:
winding with multiple turns of flex cil~;uil~, largely as con.~titl~tPd of parallel conductive paths (see, U.S. Patents 4,342,976, dated 08/03/82 and 4,755,783, dated OS/07/88); provision of parallel paths by drilling and through-plating followed by 25 met~lli7.ing and dçlinP~ting on an insulating m~nPtic sheet (U. S. Patent 5,055,816 dated 10/8/91); as well as a variety of approaches çnt~iling mating of boards supporting half-circuits with windings completed mechanically by use of conductive clips (~e U.S. Patent 4,536,733, dated 08/20/85).
Terminolo~
30 Winding or Wire Wound This terminology, as used by the artisan, refers to coils or turns however produced. In context, it is used to refer to functionally equivalent ~ltç.rn~tives to the literal encircling wire of the prior art.
20~7794 Sllm~n~ry of the Invention The inventive teaching importantly relies on joining of mating boards supporting partial or "half" coils by means of anisotropically conducting adhesive -to simultaneously complete coil windings. Completed windings are constituted of 5 surface-supported ~gments on the boards together with penetrating surface-to-surface board segments. Properly designed adhesive consists of a dispersion, generally of uniformly dimensioned conductive particles - illustratively and, in fact, likely spherical or near-spherical, of app~opliate size and number to permit simultaneous completion of partial turns to result in coil completion. As described 10 in detail, such "anisotropic adhesives" as constituted in accordance with the pre~nt state of the art, provide sufficient redundancy of conductive paths to statistically provide for adequate assurance of completion of individual windings while avoiding turn-to-turn shorting. Most satisfactory anisotropic adhesives at this time, e.g.
"AdCon" as referenced below, likely depend on an epoxy-ba~d or other 15 thermosetting adhesive vehicle. A number of mechanisms may provide for otherwise yield-reducing imperfections. Perhaps prime, surface roughness of regions containing half-coil termin~tions may be accommodated by flexible or plastic deformation in bearing surfaces, by u~ of prolate or oblate spheres, and/or by distortion or fracture of spheres during joinder. Available adhesive vehicles are 20 sufficient to m~int~in joinder, likely as assisted by clamping during setting.
Coil completion as described is assured by mating conductive pads of enlarged mating surface through which coil segments are conductively connected.
Such pads may be formed lithographically, perhaps from foil, perhaps from deposited material. Board-penetrating segments are expediently produced by 25 through-plating of holes which are drilled or otherwi~ formed in the circuit board sheet to be mated - likely of glass reinforced plastic or of other suitable electrically insulating material. Surface-supported segments may be formed lithographically.
Continuous, magnetically ungapped looped cores - e.g. toroids, "squareoids" - are contained within reces~s. As shown in the drawing, the core may 30 be contained within a single recess in one of the boards, or, ~ltern~tively, mating reces~s of reduced depth may be provided in both boards. Embodiments based on the latter approach entail mated through-plated holes solely in both boards.
Embodiments ba~d on the first approach may be ba~d on mated through-plated holes as well. An altern~tive structure is ba~d on penetrating ~gments in the 35 recessed board, with coil completion accomplished by contacting surface-supported ~gments on the underside of the unrecessed board.
- 20~779~
Circuit Elements Depen~en~ on Core Inductance and Fabrication Thereof Back~round of the Invention Technical Field S The invention is con~çrnPd with the fabrication of small circuit eleme~tc which, as generally now fabricated, entail wire winding of a soft magnetic core. An important class of elements includes transformers and inductQr~ based on toroidal or other m~gnPtically ungapped cores. Contçmpl~ted structures may be discrete elPment.~ or sub-assemblies, e.g. for incorporation on circuit boards. They may be 10 constructed in situ to constitute an integral part of a circui~
Description of the Prior Art Wire wound core structures such as toroidal inductors and transformers are expensive to fabricate - generally entail turn-by-turn hand or machine winding.
Relative to other circuit elçm~nt.~, e.g. resictors, capacitors, etc., they contribute 15 disproportionately to the cost of completed cilcuill~. The problem is most pronounced for ungapped core elements in which cost is due to complex apparatus/proce~ing associated with the tum-by-turn insertion-extraction operation of winding. Cost is aggravated by the trend toward decreasing device size.
The prevailing commercial approach continues to depend on m~hinP or 20 hand winding of coil turns about toroidal cores. Recognition of the problem is evidenced by proposed ~lt~ tives revealed in patentlliterature study. These include:
winding with multiple turns of flex cil~;uil~, largely as con.~titl~tPd of parallel conductive paths (see, U.S. Patents 4,342,976, dated 08/03/82 and 4,755,783, dated OS/07/88); provision of parallel paths by drilling and through-plating followed by 25 met~lli7.ing and dçlinP~ting on an insulating m~nPtic sheet (U. S. Patent 5,055,816 dated 10/8/91); as well as a variety of approaches çnt~iling mating of boards supporting half-circuits with windings completed mechanically by use of conductive clips (~e U.S. Patent 4,536,733, dated 08/20/85).
Terminolo~
30 Winding or Wire Wound This terminology, as used by the artisan, refers to coils or turns however produced. In context, it is used to refer to functionally equivalent ~ltç.rn~tives to the literal encircling wire of the prior art.
20~7794 Sllm~n~ry of the Invention The inventive teaching importantly relies on joining of mating boards supporting partial or "half" coils by means of anisotropically conducting adhesive -to simultaneously complete coil windings. Completed windings are constituted of 5 surface-supported ~gments on the boards together with penetrating surface-to-surface board segments. Properly designed adhesive consists of a dispersion, generally of uniformly dimensioned conductive particles - illustratively and, in fact, likely spherical or near-spherical, of app~opliate size and number to permit simultaneous completion of partial turns to result in coil completion. As described 10 in detail, such "anisotropic adhesives" as constituted in accordance with the pre~nt state of the art, provide sufficient redundancy of conductive paths to statistically provide for adequate assurance of completion of individual windings while avoiding turn-to-turn shorting. Most satisfactory anisotropic adhesives at this time, e.g.
"AdCon" as referenced below, likely depend on an epoxy-ba~d or other 15 thermosetting adhesive vehicle. A number of mechanisms may provide for otherwise yield-reducing imperfections. Perhaps prime, surface roughness of regions containing half-coil termin~tions may be accommodated by flexible or plastic deformation in bearing surfaces, by u~ of prolate or oblate spheres, and/or by distortion or fracture of spheres during joinder. Available adhesive vehicles are 20 sufficient to m~int~in joinder, likely as assisted by clamping during setting.
Coil completion as described is assured by mating conductive pads of enlarged mating surface through which coil segments are conductively connected.
Such pads may be formed lithographically, perhaps from foil, perhaps from deposited material. Board-penetrating segments are expediently produced by 25 through-plating of holes which are drilled or otherwi~ formed in the circuit board sheet to be mated - likely of glass reinforced plastic or of other suitable electrically insulating material. Surface-supported segments may be formed lithographically.
Continuous, magnetically ungapped looped cores - e.g. toroids, "squareoids" - are contained within reces~s. As shown in the drawing, the core may 30 be contained within a single recess in one of the boards, or, ~ltern~tively, mating reces~s of reduced depth may be provided in both boards. Embodiments based on the latter approach entail mated through-plated holes solely in both boards.
Embodiments ba~d on the first approach may be ba~d on mated through-plated holes as well. An altern~tive structure is ba~d on penetrating ~gments in the 35 recessed board, with coil completion accomplished by contacting surface-supported ~gments on the underside of the unrecessed board.
- 20~779~
It is expected that prevalent use of the ~eaching will entail simultaneous construction of many such "wire wound" structures. A single circuit or circuit module may include a plurality of inductors or transformers. The inventive approach is likely to be used in fabrication of large boards which may later be subdivided into 5 individual circuits or modules.
Importantly, the invel-~ive teaching permits design flexibility to lessen compromise as to numbers as well as size of elernent.~. Simultaneous provision of turn segments of a given class - surface-supported or through-plated - as well as of turn completion during joinder, substantially reduces cost implications of increasing 10 numbers of coil turns.
It is expected that initial use will take the form of manufacture of discrete devices or modules to be included in subsequently assembled circuits. The inventive procedures lend themselves to such fabrication as well as to final circuit assemblies. It is contemplated, too, that the approach will be used for direct 15 fabrication of elPment~ in situ, to result in circuits Cont~ininE other ehPment~ - e.g.
re~i~tors, capacitors, air core or gapped wound structures, etc.
Brief D~e.il~lion of ~e D~a~
FIG. 1 is a perspective view depicting a portion of a device in fabrication - showing one of the two mating sheets as recessed for core acceptance 20 and as provided with coil turn mating pads.
FIG. 2 is an exploded view, in pel~pe-;live, showing a single device region as in FIG. lA together with a core - in this in~t~nce, a "squareoid", and with the mating portion of the second sheet, the latter as provided with printed conductors for completing coil turns. The depicted embodiment provides for mating recesses in 25 both sheets for housing the core.
FIG. 3 is a cutaway perspective view depicting a completed circuit elemPnt as yielded by the successive stages shown in FIGS. 1 and 2 - to be regarded as a discrete device, as included within a module, or as an in situ constructed device within a circuit - e.g. within a hybrid circuit.
FIG. 4 is an exploded view, in perspective, showing an embodiment in which the core is to be entirely housed in one of the two boards. For the particular embodiment shown, circuit completion is by means of surface-supported segments on the underside of the unrecessed mating board.
- _ 20$7794 Detailed Descr~p~on The Drawing FIG. 1 depicts a board 10 which may be of glass fiber-strengthened epoxy - e.g. "FR-4". Recesses for housing the cores, in this in.~t~nce, square cores, 5 are provided by intersecting recessed grooves 11 and 12. For an expçriment~l structure using a squareoid of 0.25 in. overall si~, housing grooves were of 0.033 in.
depth and 0.058 in. width in the 0.047 in. thi(~ntq~ board. Core legs, not shown, were of 0.060 in. height x 0.050 in. width cross-section. The enlarged view lA
shows pads 13 and 14 as formed in contact with through-plated con~luctQrs, not 10 shown. In conformity with an expected early use, pads 13 and 14 may be considered as corresponding with primary and secondary transformer turn segm~Pnt~, respectively.
An exp~Prime~t~l model depended on m~c~ining - on sawing or grinding for grooves, and on drilling for through connection. It used 28-turn coils together 15 with cores of overall si~ 0.25 in. Quantity production may make use of other forms of machining or may make use of molding.
FIG. 2 depicts a formed sheet 20 which may be regarded as corresponding with that of sheet 10 of FIG. 1. Primary and secondary pads are here numbered 21 and 22, respectively. Soft m~gnPtic core, e.g. ferrite core, 23 - an20 ungapped toroidal core or "squareoid" - is shown pAor to sandwiching between sheets 20 and 24. For the embodiment shown, sheets 20 and 24 are rece~sed by slots 25 and 26 to define a mating, half thic~nPcc recesses for accepting core 23. Printed cir~;uiLl~ shown on the upper surface of sheet 24 includes primary segmPnt~, termin~ting in pads 27 for completing turns incl~ ng through-plated conductors 25 associated with pads 21 and secondary segmP.nt.~, termin~ting in pads 28 for complPting turns including pads 22. Pads are shown as enlarged to ease registration requirPmen~c with through-plated holes and to accommodate a particular AdCon compo6ition. Pads 29 and 30 serve for t~rmin~l connection.
FIG. 3, in depicting the now-assembled element 40, includes mating 30 sheets 41 and 42 corresponding with sheets 20 and 24 of FIG. 2. A m~netic core, not shown, e.g. a ferrite core such as core 23 of FIG. 2 is now housed in mated half recesses 44 and 45. Coil turns or "windings", primary turns 46 and secondary turns 47, are now completed via pads 48, in turn, joined by anisotropic bonding layer 49. Segments 50 and 51 on the upper surface of sheet 42 together with 35 segments 52 and 53, in conjunction with through-plated conductors 54 and 55, as connected through anisotropically bonded pads 48 complete the "windings". Contact ~ - ~Q8i77!1~
- s -pads 57 and associated printed wires 58 provide access to the primary coil. For the structure depicted, the secondary coil is ~cce~sed by wires 43 together with pads 59 (only one shown).
Such segments may be constructed of foil or by a variety of printing S techniques such as used in integrated cil~;uill~, or by stenciling.
FIG. 4 represents the embodiment in which the core member, not - shown, is housed in recesses 60 provided within a single board 61. Windings may be completed as in FIG. 3, by use of pads 62 and 63 together with through-platedholes 64. The same arrangement may be used in u~lece~ced board 65, or, 10 alternatively, as in one e~pelilnental structure, may depend on pad-termin~ted segments 66 and 67 provided on the underside, cont~cfing surface of board 65.
Process Outline Contemplated process steps are set forth in general terms with indication of likely proces.cing par~mPters. Description is largely for structures in which15 housing of cores is shared between mating rece~ces. The ~lt~rn~tive approach depends on a single housing recess together with a mating unrecessed board as shown in FIG. 4. For such approach, the recessed board may be designed and fabricated in the same manner.
Description is with the objective of aiding the practitioner, and as such, 20 include steps ancillary to the inventive teaching itself. Specific order as well as parameters are to be considered illu~lla~ive only, and not to constitute furtherlimitation on appended claims. Support sheets are suitably circuit boards in state-of-the-art use. An illustrative product known as FR-4 is based on glass fiber reinforced plastic. (See, Microelectronics Packagin~ Handbook, pp. 885-909, R. R.
25 Tumm~l~ and E. J. Rymaszewski, eds., Van Nostrand Reinhold, New York (1989)).To first appfoAill-ation, overall thickness of mated boards results in mechanical integrity similar to that of prior art devices using single boards of that overall thi~lfn~ss. The final product includes coil structures con~icting of coil turns, each composed of face segments on one face on each of the two boards to be 30 interconnected by through-plated holes and mating pads as ~iscussed Such coils, as so defined, encompass magnetic cores sandwiched between the boards.
Boards are provided with holes to be through-plated as well as recesses for accommodating cores. Experimentally, such shaping has been accomplished by machining - by drilling and sawing. Appropriate choice of materials may expedite35 quantity production by shaping, as by molding, during initial preparation of the boards or subsequently. While alternatives are feasible, surface-supported ~ ~ ~ 7 7 ~ 4 conductive regions on the boards - face-supported turn segments and associated contact pads as well as interconnect pads associated with through-plated holes - may be formed lithographically. Experimental structures have made use of copper foil bonded to both surfaces, and it is likely this approach will be used initially. Alternatively, and perhaps 5 better suited to smaller design rules, metallization may take other forms as presently used in IC manufacture.
In experimental models, holes were drilled and through-plated. Through-plating entailed two steps - (a) electroless plating, (b) followed by electroplating. This, as well as suitable alternative procedures are well-known. Relevant materials, 10 temperatures, times, etc. are set forth in a number of publications, see, for example, Printed Circuits Handbook, chapters 12 and 13, C.F. Coombs, Jr., ed., 3rd. ed., McGraw-Hill, New York (1988).
Face-supported conductor layers are patterned, for example, by photolithography. Alternative approaches, perhaps carried out at this stage, entail 15 selective deposition as by screen printing or stenciling through an apertured mask. (A
representative literature reference is Handbook of Flexible Circuits, pp. 198-209, Ken Gilleo, ed., Van Nostrand Reinhold, New York (1992)). On the assumption of usualphotolithographic delineation, as initiated by provision of a continuous unpatterned conductive layer, the surface is now exposed and developed to allow removal of 20 unwanted conductive material. Boards, if not already shaped by machining or molding, may be shaped at this stage to accommodate cores.
A variety of considerations may yield to preference for but a single rather than mated recess. Containment of the core structure in a single board may permit thinning of the unrecessed board, with operational or economic advantage. Mating25 interconnect pads are now coated with anisotropically conducted adhesive. Theexemplary material, AdCon, as applied, consists of uncured therrnosetting resin loaded with the particles responsible for pad-to-pad conduction. A typical AdCon composition consists of mixed diglycidyl ether of bisphenol-A epoxy and an amine curing agent, serving as suspension medium for the particles. Compositions, used in one set of30 experiments, contained from 5 to 15 vol.% of uniformly dimensioned 10-20 ,um diameter spheres of silver plated glass. Likely initial manufacture will be directed toward discrete elements or sub-assemblies. Subdivision follows curing of the adhesive.
In-situ formation directed toward final circuit fabrication has likely been attended by simultaneous process steps e.g. directed toward construction of other devices as well as 35 associated ~' -7- ~087794 Cin;uill~. In some instances, prior as well as subsequent processing, directed toward incorporadon of other circuit elements, may be indicated.
Dimensions DimPn.cions listed are those used in experim~nt~l structures. For the S most part, while relevant to likely initial fabrication, it is expected that they will undergo .cignific~nt reduction in size, in part as permitte~ by the inventive approach.
Interconnection pads - lOxlS mil pads st~ti~tic~lly result in - 25 particle-interconnection paths as based on the AdCon example above.
Lines - turn segments or other Cil~;uill ~ - of dimP.n.~ion S mil wide by 0.7 10 mil high, were based on "half ounce copper foil".
Termin~l pads providing for electrical connection to coils were SOxS0 mil.
- Cores - toroids or "squareoids" - were of 250 mil overall ~imPn~ion - 60 mil high by 50 mil wide on a side. Experimental ~llu~ s made use of 15 m~gnPtic~lly soft "MnZn" ferrite cores. In general, core m~teri~l is soft andconstitut~Pd of domain magnetic m~tPri~l ferrim~gnPtic or ferrom~gnPti~.
Permeability is likely within the range of from 10 to 20,000.
Importantly, the invel-~ive teaching permits design flexibility to lessen compromise as to numbers as well as size of elernent.~. Simultaneous provision of turn segments of a given class - surface-supported or through-plated - as well as of turn completion during joinder, substantially reduces cost implications of increasing 10 numbers of coil turns.
It is expected that initial use will take the form of manufacture of discrete devices or modules to be included in subsequently assembled circuits. The inventive procedures lend themselves to such fabrication as well as to final circuit assemblies. It is contemplated, too, that the approach will be used for direct 15 fabrication of elPment~ in situ, to result in circuits Cont~ininE other ehPment~ - e.g.
re~i~tors, capacitors, air core or gapped wound structures, etc.
Brief D~e.il~lion of ~e D~a~
FIG. 1 is a perspective view depicting a portion of a device in fabrication - showing one of the two mating sheets as recessed for core acceptance 20 and as provided with coil turn mating pads.
FIG. 2 is an exploded view, in pel~pe-;live, showing a single device region as in FIG. lA together with a core - in this in~t~nce, a "squareoid", and with the mating portion of the second sheet, the latter as provided with printed conductors for completing coil turns. The depicted embodiment provides for mating recesses in 25 both sheets for housing the core.
FIG. 3 is a cutaway perspective view depicting a completed circuit elemPnt as yielded by the successive stages shown in FIGS. 1 and 2 - to be regarded as a discrete device, as included within a module, or as an in situ constructed device within a circuit - e.g. within a hybrid circuit.
FIG. 4 is an exploded view, in perspective, showing an embodiment in which the core is to be entirely housed in one of the two boards. For the particular embodiment shown, circuit completion is by means of surface-supported segments on the underside of the unrecessed mating board.
- _ 20$7794 Detailed Descr~p~on The Drawing FIG. 1 depicts a board 10 which may be of glass fiber-strengthened epoxy - e.g. "FR-4". Recesses for housing the cores, in this in.~t~nce, square cores, 5 are provided by intersecting recessed grooves 11 and 12. For an expçriment~l structure using a squareoid of 0.25 in. overall si~, housing grooves were of 0.033 in.
depth and 0.058 in. width in the 0.047 in. thi(~ntq~ board. Core legs, not shown, were of 0.060 in. height x 0.050 in. width cross-section. The enlarged view lA
shows pads 13 and 14 as formed in contact with through-plated con~luctQrs, not 10 shown. In conformity with an expected early use, pads 13 and 14 may be considered as corresponding with primary and secondary transformer turn segm~Pnt~, respectively.
An exp~Prime~t~l model depended on m~c~ining - on sawing or grinding for grooves, and on drilling for through connection. It used 28-turn coils together 15 with cores of overall si~ 0.25 in. Quantity production may make use of other forms of machining or may make use of molding.
FIG. 2 depicts a formed sheet 20 which may be regarded as corresponding with that of sheet 10 of FIG. 1. Primary and secondary pads are here numbered 21 and 22, respectively. Soft m~gnPtic core, e.g. ferrite core, 23 - an20 ungapped toroidal core or "squareoid" - is shown pAor to sandwiching between sheets 20 and 24. For the embodiment shown, sheets 20 and 24 are rece~sed by slots 25 and 26 to define a mating, half thic~nPcc recesses for accepting core 23. Printed cir~;uiLl~ shown on the upper surface of sheet 24 includes primary segmPnt~, termin~ting in pads 27 for completing turns incl~ ng through-plated conductors 25 associated with pads 21 and secondary segmP.nt.~, termin~ting in pads 28 for complPting turns including pads 22. Pads are shown as enlarged to ease registration requirPmen~c with through-plated holes and to accommodate a particular AdCon compo6ition. Pads 29 and 30 serve for t~rmin~l connection.
FIG. 3, in depicting the now-assembled element 40, includes mating 30 sheets 41 and 42 corresponding with sheets 20 and 24 of FIG. 2. A m~netic core, not shown, e.g. a ferrite core such as core 23 of FIG. 2 is now housed in mated half recesses 44 and 45. Coil turns or "windings", primary turns 46 and secondary turns 47, are now completed via pads 48, in turn, joined by anisotropic bonding layer 49. Segments 50 and 51 on the upper surface of sheet 42 together with 35 segments 52 and 53, in conjunction with through-plated conductors 54 and 55, as connected through anisotropically bonded pads 48 complete the "windings". Contact ~ - ~Q8i77!1~
- s -pads 57 and associated printed wires 58 provide access to the primary coil. For the structure depicted, the secondary coil is ~cce~sed by wires 43 together with pads 59 (only one shown).
Such segments may be constructed of foil or by a variety of printing S techniques such as used in integrated cil~;uill~, or by stenciling.
FIG. 4 represents the embodiment in which the core member, not - shown, is housed in recesses 60 provided within a single board 61. Windings may be completed as in FIG. 3, by use of pads 62 and 63 together with through-platedholes 64. The same arrangement may be used in u~lece~ced board 65, or, 10 alternatively, as in one e~pelilnental structure, may depend on pad-termin~ted segments 66 and 67 provided on the underside, cont~cfing surface of board 65.
Process Outline Contemplated process steps are set forth in general terms with indication of likely proces.cing par~mPters. Description is largely for structures in which15 housing of cores is shared between mating rece~ces. The ~lt~rn~tive approach depends on a single housing recess together with a mating unrecessed board as shown in FIG. 4. For such approach, the recessed board may be designed and fabricated in the same manner.
Description is with the objective of aiding the practitioner, and as such, 20 include steps ancillary to the inventive teaching itself. Specific order as well as parameters are to be considered illu~lla~ive only, and not to constitute furtherlimitation on appended claims. Support sheets are suitably circuit boards in state-of-the-art use. An illustrative product known as FR-4 is based on glass fiber reinforced plastic. (See, Microelectronics Packagin~ Handbook, pp. 885-909, R. R.
25 Tumm~l~ and E. J. Rymaszewski, eds., Van Nostrand Reinhold, New York (1989)).To first appfoAill-ation, overall thickness of mated boards results in mechanical integrity similar to that of prior art devices using single boards of that overall thi~lfn~ss. The final product includes coil structures con~icting of coil turns, each composed of face segments on one face on each of the two boards to be 30 interconnected by through-plated holes and mating pads as ~iscussed Such coils, as so defined, encompass magnetic cores sandwiched between the boards.
Boards are provided with holes to be through-plated as well as recesses for accommodating cores. Experimentally, such shaping has been accomplished by machining - by drilling and sawing. Appropriate choice of materials may expedite35 quantity production by shaping, as by molding, during initial preparation of the boards or subsequently. While alternatives are feasible, surface-supported ~ ~ ~ 7 7 ~ 4 conductive regions on the boards - face-supported turn segments and associated contact pads as well as interconnect pads associated with through-plated holes - may be formed lithographically. Experimental structures have made use of copper foil bonded to both surfaces, and it is likely this approach will be used initially. Alternatively, and perhaps 5 better suited to smaller design rules, metallization may take other forms as presently used in IC manufacture.
In experimental models, holes were drilled and through-plated. Through-plating entailed two steps - (a) electroless plating, (b) followed by electroplating. This, as well as suitable alternative procedures are well-known. Relevant materials, 10 temperatures, times, etc. are set forth in a number of publications, see, for example, Printed Circuits Handbook, chapters 12 and 13, C.F. Coombs, Jr., ed., 3rd. ed., McGraw-Hill, New York (1988).
Face-supported conductor layers are patterned, for example, by photolithography. Alternative approaches, perhaps carried out at this stage, entail 15 selective deposition as by screen printing or stenciling through an apertured mask. (A
representative literature reference is Handbook of Flexible Circuits, pp. 198-209, Ken Gilleo, ed., Van Nostrand Reinhold, New York (1992)). On the assumption of usualphotolithographic delineation, as initiated by provision of a continuous unpatterned conductive layer, the surface is now exposed and developed to allow removal of 20 unwanted conductive material. Boards, if not already shaped by machining or molding, may be shaped at this stage to accommodate cores.
A variety of considerations may yield to preference for but a single rather than mated recess. Containment of the core structure in a single board may permit thinning of the unrecessed board, with operational or economic advantage. Mating25 interconnect pads are now coated with anisotropically conducted adhesive. Theexemplary material, AdCon, as applied, consists of uncured therrnosetting resin loaded with the particles responsible for pad-to-pad conduction. A typical AdCon composition consists of mixed diglycidyl ether of bisphenol-A epoxy and an amine curing agent, serving as suspension medium for the particles. Compositions, used in one set of30 experiments, contained from 5 to 15 vol.% of uniformly dimensioned 10-20 ,um diameter spheres of silver plated glass. Likely initial manufacture will be directed toward discrete elements or sub-assemblies. Subdivision follows curing of the adhesive.
In-situ formation directed toward final circuit fabrication has likely been attended by simultaneous process steps e.g. directed toward construction of other devices as well as 35 associated ~' -7- ~087794 Cin;uill~. In some instances, prior as well as subsequent processing, directed toward incorporadon of other circuit elements, may be indicated.
Dimensions DimPn.cions listed are those used in experim~nt~l structures. For the S most part, while relevant to likely initial fabrication, it is expected that they will undergo .cignific~nt reduction in size, in part as permitte~ by the inventive approach.
Interconnection pads - lOxlS mil pads st~ti~tic~lly result in - 25 particle-interconnection paths as based on the AdCon example above.
Lines - turn segments or other Cil~;uill ~ - of dimP.n.~ion S mil wide by 0.7 10 mil high, were based on "half ounce copper foil".
Termin~l pads providing for electrical connection to coils were SOxS0 mil.
- Cores - toroids or "squareoids" - were of 250 mil overall ~imPn~ion - 60 mil high by 50 mil wide on a side. Experimental ~llu~ s made use of 15 m~gnPtic~lly soft "MnZn" ferrite cores. In general, core m~teri~l is soft andconstitut~Pd of domain magnetic m~tPri~l ferrim~gnPtic or ferrom~gnPti~.
Permeability is likely within the range of from 10 to 20,000.
Claims (18)
1. Fabrication entailing construction of at least one magnetic circuit element comprising at least one winding consisting essentially of at least one turn of electrically conductive material about an ungapped core of soft magnetic material, said at least one turn being produced by joinder of turn members, characterized in that said element is supported by sandwiching boards at least one of which is recessed to enclose such core, in that each such turn consists essentially of electrically conductive segments including a first surface-supported segment on one such board and a second surface-supported segment on the second such board, together with two board-penetrating segments so positioned that sandwiching accomplishes electrical joinder of segment portions to result in electrical completion of such turn, and in that joinder entails wetting of at least regions of mating surfaces of said boards by use of a wetting vehicle, said vehicle consisting essentially of adhesive containing electrically conductive particles of such size and distribution as to statistically join such segment portions, while adhesively bonding such sandwiching boards, so as to complete such turn, while avoiding unwanted electrical interconnection entailing any such segment said regions bothincluding and extending beyond segment portions to be electrically joined.
2. Fabrication of claim 1 in which board-penetrating segments consist essentially of holes rendered electrically conductive by end-to-end inner plating, and in which segment portions to be joined are provided with conductive pads of enlarged area relative to cross-sectional area of board-penetrating segments to accommodate imprecision in placement of portions to be joined.
3. Fabrication of claim 2 in which such winding includes a plurality of turns.
4. Fabrication of claim 3 entailing construction of a plurality of such circuit elements.
5. Fabrication of claim 4 entailing severance of sandwiching boards subsequent to joinder so yielding discrete devices or modules or circuits.
6. Fabrication of claim 1 in which surface-supported segments on at least one such board are fabricated from a continuous layer by photolithographic delineation.
7. Fabrication of claim 6 in which such photographic delineation entails formation of ancillary circuitry.
8. Fabrication of claim 7 in which such ancillary circuitry includes non-magnetic circuit elements.
9. Fabrication of claim 1 in which said adhesive is thermosetting and in which the said particles are smooth surfaced.
10. Fabrication of claim 9 in which included particles are spherical, oblate, or prolate.
11. Fabrication of claim 10 in which included particles are substantially spherical and of approximately equal size.
12. Fabrication of claim 11 in which included particles are coated with electrically conductive material.
13. Fabrication of claim 12 in which included particles consist of coated dielectric spheres.
14. Fabrication of claim 1 in which both sandwiching boards are recessed so that the said core is enclosed within mating recesses and in which each of the said boards contains board-penetrating segments so that each turn includes four board-penetrating segments.
15. Fabrication of claim 1 in which but one of the said boards is recessed thereby yielding one recessed board and one unrecessed board.
16. Fabrication of claim 15 in which both the recessed board and the unrecessed board contain board-penetrating segments so that each turn includes four board-penetrating segments.
17. Fabrication of claim 15 in which only the said recessed board contains board-penetrating segments so that each turn includes only two board-penetrating segments.
18. Fabrication of claim 17 in which surface-supported segments on the unrecessed board are on the surface facing the recessed board.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/835,793 US5257000A (en) | 1992-02-14 | 1992-02-14 | Circuit elements dependent on core inductance and fabrication thereof |
US835,793 | 1992-02-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2087794A1 CA2087794A1 (en) | 1993-08-15 |
CA2087794C true CA2087794C (en) | 1998-09-29 |
Family
ID=25270475
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002087794A Expired - Fee Related CA2087794C (en) | 1992-02-14 | 1993-01-21 | Circuit elements dependent on core inductance and fabrication thereof |
Country Status (8)
Country | Link |
---|---|
US (1) | US5257000A (en) |
EP (1) | EP0555994B1 (en) |
JP (1) | JPH0613255A (en) |
KR (1) | KR930018769A (en) |
CA (1) | CA2087794C (en) |
DE (1) | DE69310781T2 (en) |
ES (1) | ES2101941T3 (en) |
HK (1) | HK1002719A1 (en) |
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-
1992
- 1992-02-14 US US07/835,793 patent/US5257000A/en not_active Expired - Lifetime
-
1993
- 1993-01-21 CA CA002087794A patent/CA2087794C/en not_active Expired - Fee Related
- 1993-02-04 EP EP93300835A patent/EP0555994B1/en not_active Expired - Lifetime
- 1993-02-04 ES ES93300835T patent/ES2101941T3/en not_active Expired - Lifetime
- 1993-02-04 DE DE69310781T patent/DE69310781T2/en not_active Expired - Fee Related
- 1993-02-11 KR KR1019930001834A patent/KR930018769A/en not_active Application Discontinuation
- 1993-02-12 JP JP5023110A patent/JPH0613255A/en active Pending
-
1998
- 1998-02-27 HK HK98101550A patent/HK1002719A1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0555994B1 (en) | 1997-05-21 |
HK1002719A1 (en) | 1998-09-11 |
US5257000A (en) | 1993-10-26 |
DE69310781D1 (en) | 1997-06-26 |
JPH0613255A (en) | 1994-01-21 |
KR930018769A (en) | 1993-09-22 |
CA2087794A1 (en) | 1993-08-15 |
EP0555994A1 (en) | 1993-08-18 |
DE69310781T2 (en) | 1997-09-04 |
ES2101941T3 (en) | 1997-07-16 |
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