CA2088605A1 - Formation of microstructures by multiple level deep x-ray lithography with sacrificial metal layers - Google Patents

Formation of microstructures by multiple level deep x-ray lithography with sacrificial metal layers

Info

Publication number
CA2088605A1
CA2088605A1 CA2088605A CA2088605A CA2088605A1 CA 2088605 A1 CA2088605 A1 CA 2088605A1 CA 2088605 A CA2088605 A CA 2088605A CA 2088605 A CA2088605 A CA 2088605A CA 2088605 A1 CA2088605 A1 CA 2088605A1
Authority
CA
Canada
Prior art keywords
metal
primary
layer
electroplated
metals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2088605A
Other languages
French (fr)
Other versions
CA2088605C (en
Inventor
Henry Guckel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wisconsin Alumni Research Foundation
Original Assignee
Wisconsin Alumni Research Foundation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wisconsin Alumni Research Foundation filed Critical Wisconsin Alumni Research Foundation
Publication of CA2088605A1 publication Critical patent/CA2088605A1/en
Application granted granted Critical
Publication of CA2088605C publication Critical patent/CA2088605C/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D71/00—Semi-permeable membranes for separation processes or apparatus characterised by the material; Manufacturing processes specially adapted therefor
    • B01D71/02—Inorganic material
    • B01D71/0215—Silicon carbide; Silicon nitride; Silicon oxycarbide
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D71/00—Semi-permeable membranes for separation processes or apparatus characterised by the material; Manufacturing processes specially adapted therefor
    • B01D71/02—Inorganic material
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/094—Multilayer resist systems, e.g. planarising layers

Abstract

Complex metal structures are formed in microminiature dimensions utilizing multiple mask exposures which are capable of producing substantially arbitrary three-dimensional shapes. A first layer of a primary metal is electroplated onto an exposed plating base to fill a void in a photoresist, the photoresist is removed, and a secondary metal, which can constitute a sacrificial metal, is electroplated over the first layer and the plating base.
The exposed surface of the deposited secondary metal is then machined down to a height which exposes the first metal to produce a substantially flat, uniform surface extending across both the primary and secondary metals.
The secondary metal facilitates machining of the primary and secondary metals because of these mechanical stability provided by the secondary metal to the primary metal.
After the first layers of the primary and secondary metals have been machined, another photoresist layer can be applied over the primary and secondary metals, and a second layer of primary metal is electroplated. A further layer of secondary metal can be also electroplated if desired.
The process of machining and electroplating can be repeated until the desired structure is formed. Secondary metal is removed by an etchant which does not etch the primary metal.
CA002088605A 1992-04-24 1993-02-02 Formation of microstructures by multiple level deep x-ray lithography with sacrificial metal layers Expired - Lifetime CA2088605C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US874,116 1992-04-24
US07/874,116 US5190637A (en) 1992-04-24 1992-04-24 Formation of microstructures by multiple level deep X-ray lithography with sacrificial metal layers

Publications (2)

Publication Number Publication Date
CA2088605A1 true CA2088605A1 (en) 1993-10-25
CA2088605C CA2088605C (en) 2001-01-02

Family

ID=25363007

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002088605A Expired - Lifetime CA2088605C (en) 1992-04-24 1993-02-02 Formation of microstructures by multiple level deep x-ray lithography with sacrificial metal layers

Country Status (9)

Country Link
US (1) US5190637A (en)
EP (1) EP0567332B1 (en)
JP (1) JP3249233B2 (en)
KR (1) KR100272829B1 (en)
AT (1) ATE139810T1 (en)
CA (1) CA2088605C (en)
DE (1) DE69303320T2 (en)
IL (1) IL104835A0 (en)
MX (1) MX9302149A (en)

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CA2088605C (en) 2001-01-02
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