CA2155257A1 - Low Inductance Surface-Mount Connectors for Interconnecting Circuit Devices and Method for Using Same - Google Patents
Low Inductance Surface-Mount Connectors for Interconnecting Circuit Devices and Method for Using SameInfo
- Publication number
- CA2155257A1 CA2155257A1 CA2155257A CA2155257A CA2155257A1 CA 2155257 A1 CA2155257 A1 CA 2155257A1 CA 2155257 A CA2155257 A CA 2155257A CA 2155257 A CA2155257 A CA 2155257A CA 2155257 A1 CA2155257 A1 CA 2155257A1
- Authority
- CA
- Canada
- Prior art keywords
- low inductance
- circuit device
- same
- circuit devices
- connectors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1031—Surface mounted metallic connector elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/1084—Notched leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
In accordance with the invention, a low inductance surface-mount connector comprises a slotted, hollow rectangular parallelepiped. The device permits interconnection by pick-and-place techniques, and the interconnection has advantageous qualities of compactness, low inductance, and mechanical compliance.
A first circuit device having one or more circuit components is interconnected with a second circuit device by surface mounting such connectors on the first circuit device, providing corresponding solder pads on the second circuit device, and mounting the connectors of the first circuit device onto the pads of the second.
A first circuit device having one or more circuit components is interconnected with a second circuit device by surface mounting such connectors on the first circuit device, providing corresponding solder pads on the second circuit device, and mounting the connectors of the first circuit device onto the pads of the second.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/302,559 US5588848A (en) | 1994-09-08 | 1994-09-08 | Low inductance surface-mount connectors for interconnecting circuit devices and method for using same |
US302,559 | 1994-09-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2155257A1 true CA2155257A1 (en) | 1996-03-09 |
CA2155257C CA2155257C (en) | 1999-12-21 |
Family
ID=23168264
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002155257A Expired - Fee Related CA2155257C (en) | 1994-09-08 | 1995-08-03 | Low inductance surface-mount connectors for interconnecting circuit devices and method for using same |
Country Status (8)
Country | Link |
---|---|
US (1) | US5588848A (en) |
EP (1) | EP0701298B1 (en) |
JP (1) | JP3168242B2 (en) |
KR (1) | KR960013144A (en) |
AU (1) | AU682622B2 (en) |
CA (1) | CA2155257C (en) |
DE (1) | DE69515764T2 (en) |
TW (1) | TW271014B (en) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6146155A (en) * | 1997-09-16 | 2000-11-14 | 3M Innovative Properties Company | Recyclable locater device for board mounted connectors |
JPH11186688A (en) * | 1997-10-14 | 1999-07-09 | Murata Mfg Co Ltd | Hybrid ic and electronic device using the same |
US6175500B1 (en) * | 1998-09-22 | 2001-01-16 | Lucent Technologies Inc. | Surface mount thermal connections |
US6189203B1 (en) | 1999-04-08 | 2001-02-20 | Lucent Technologies Inc. | Method of manufacturing a surface mountable power supply module |
US6310301B1 (en) | 1999-04-08 | 2001-10-30 | Randy T. Heinrich | Inter-substrate conductive mount for a circuit board, circuit board and power magnetic device employing the same |
DE10003696A1 (en) * | 2000-01-28 | 2001-08-09 | Eupec Gmbh & Co Kg | Tapping device for electric current |
US6750396B2 (en) * | 2000-12-15 | 2004-06-15 | Di/Dt, Inc. | I-channel surface-mount connector |
US6503088B2 (en) * | 2000-12-15 | 2003-01-07 | Di/Dt, Inc. | I-channel surface-mount connector with extended flanges |
DE10215985A1 (en) * | 2002-04-11 | 2003-11-06 | Siemens Ag | High-current contact element for attachment to a circuit board arrangement and use of a high-current contact element |
US6786736B2 (en) | 2002-08-23 | 2004-09-07 | Artesyn Technologies, Inc. | Surface mount interconnect and device including same |
US20040048498A1 (en) * | 2002-09-06 | 2004-03-11 | Hong Huang | Metallic surface mount technology power connector |
US7065351B2 (en) | 2003-01-30 | 2006-06-20 | Qualcomm Incorporated | Event-triggered data collection |
US7123928B2 (en) * | 2003-07-21 | 2006-10-17 | Qualcomm Incorporated | Method and apparatus for creating and using a base station almanac for position determination |
DE10333566A1 (en) * | 2003-07-23 | 2005-02-10 | eupec Europäische Gesellschaft für Leistungshalbleiter mbH | Electrical connection between parallel electronic circuit boards is provided by hollow studs that also provide mechanical support |
BRPI0418696A (en) | 2004-04-02 | 2007-06-12 | Qualcomm Inc | methods and equipment for signaling assisted position determination systems |
US20050277313A1 (en) * | 2004-06-09 | 2005-12-15 | Aldrin Pangilinan | Surface mountable pin assembly for a printed circuit board |
US20060046525A1 (en) * | 2004-08-27 | 2006-03-02 | Allan Mark | Printed circuit board type connector using surface mount and through hole technologies |
JP4676855B2 (en) * | 2005-10-03 | 2011-04-27 | ローム株式会社 | Hybrid integrated circuit device and manufacturing method thereof |
US7740066B2 (en) * | 2008-01-25 | 2010-06-22 | Halliburton Energy Services, Inc. | Additives for high alumina cements and associated methods |
US8478228B2 (en) | 2008-10-20 | 2013-07-02 | Qualcomm Incorporated | Mobile receiver with location services capability |
US8600297B2 (en) | 2009-07-28 | 2013-12-03 | Qualcomm Incorporated | Method and system for femto cell self-timing and self-locating |
USD749292S1 (en) * | 2014-10-14 | 2016-02-16 | Time And Oak, Inc. | Beverage flavoring element |
USD747582S1 (en) * | 2015-05-01 | 2016-01-12 | Ronald Kenneth Weller | Seat belt cleaner |
JP6542573B2 (en) * | 2015-05-11 | 2019-07-10 | フジコン株式会社 | Board terminal |
JP6572820B2 (en) * | 2016-04-25 | 2019-09-11 | 富士通株式会社 | Power supply structure |
JP7144245B2 (en) * | 2018-08-31 | 2022-09-29 | 日本航空電子工業株式会社 | soldering parts |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2192437B1 (en) * | 1972-07-10 | 1974-10-25 | Radiotechnique Compelec | |
US4605278A (en) * | 1985-05-24 | 1986-08-12 | North American Specialties Corporation | Solder-bearing leads |
US4629267A (en) * | 1984-10-12 | 1986-12-16 | Gte Communication Systems Corporation | Circuit terminating device |
JPS6427293A (en) * | 1987-07-22 | 1989-01-30 | Fujitsu Ltd | Method of mount chip component |
US4915652A (en) * | 1989-06-12 | 1990-04-10 | Thomas & Betts Corporation | Shielded electrical connector |
US5256086A (en) * | 1992-12-04 | 1993-10-26 | Molex Incorporated | Electrical connector shield and method of fabricating same |
-
1994
- 1994-09-08 US US08/302,559 patent/US5588848A/en not_active Expired - Lifetime
-
1995
- 1995-01-24 TW TW084100617A patent/TW271014B/en active
- 1995-08-03 CA CA002155257A patent/CA2155257C/en not_active Expired - Fee Related
- 1995-08-30 EP EP95306063A patent/EP0701298B1/en not_active Expired - Lifetime
- 1995-08-30 DE DE69515764T patent/DE69515764T2/en not_active Expired - Fee Related
- 1995-09-01 AU AU30404/95A patent/AU682622B2/en not_active Ceased
- 1995-09-05 KR KR1019950028929A patent/KR960013144A/en active IP Right Grant
- 1995-09-07 JP JP25453895A patent/JP3168242B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TW271014B (en) | 1996-02-21 |
KR960013144A (en) | 1996-04-20 |
JP3168242B2 (en) | 2001-05-21 |
EP0701298A2 (en) | 1996-03-13 |
DE69515764D1 (en) | 2000-04-27 |
AU682622B2 (en) | 1997-10-09 |
EP0701298B1 (en) | 2000-03-22 |
US5588848A (en) | 1996-12-31 |
AU3040495A (en) | 1996-03-21 |
DE69515764T2 (en) | 2000-08-31 |
JPH08195234A (en) | 1996-07-30 |
CA2155257C (en) | 1999-12-21 |
EP0701298A3 (en) | 1997-05-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
MKLA | Lapsed |