CA2175166C - Liquid ejecting head, liquid ejecting device and liquid ejecting method - Google Patents

Abstract

A liquid ejecting method includes providing a substrate having a heat generating surface for generating heat for generating a bubble in liquid;
providing a movable member having a free end;
providing an ejection outlet for ejecting the liquid using the generation of the bubble, the ejection outlet being opposed to the substrate with the movable member interposed therebetween; disposing the free end of the movable member at a downstream side with respect to a direction of flow of the liquid to the ejection outlet; and wherein the bubble displaces the free end of the movable member, and grows toward the ejection outlet to eject the liquid.

Description

217~166 LIgUID EJECTING HEAD, LIQUID EJECTING DEVICE
AND LIQUID EJECTING METI~OD
FIELD 9F TlIE INVENTI9N AND 17~r A'rED MT
The present invention relates to a liquid eiecting head for ejecting desired liquia using generation of a bubble by applying thermal energy to the liquid, a head cartridge using the liquid ejecting head, a liquid ejecting device using the same, a manufacturing method for the liquid ejecting head, a liquid ejecting method, a recording method, and a print provided using the liquid ejecting method. It further relates to an ink ~et head kit containing the liquid e~ection head.
More particularly, it relates to a liquid ejecting head having a movable member movable by generation of a bubble, and a head cartridge using the liquid eiecting head, and liquid e~ecting device using the same. It further relates to a liquid ejecting method and recording method for e~ection the liquid by moving the movable member using the generation of the bubble .
The present invention is applicable to equipment such as a printer, a copying machine, a facsimile machine having a communication system, a word processor having a printer portion or the like, and an industrial recording device ~ n~cl with _ _ _ _ _ _ _ . .. . . .. _ ' 1-various processing device or p.oces~ing devices, in which the recording is effected on a recording material such as paper, thread, fiber, teYtile, leather, metal, plastic resin material, glass, wood, 5 ceramic and so on.
In this specification, "recording" means not only forming an image of letter, figure or the like having specific -nin~fi, but also includes forming an image of a pattern not having a specific meaning.
An ink jet recording method of so-called bubble jet type is known in which an instantaneous state change resulting in an instantaneous volume change (bubble generation) is caused by application of energy such as heat to the ink, 80 as to eject the ink 15 throu~h the e~ection outlet by the force resulted from the state change by which the ink is ejected to and deposited on the recording material to form an image formation. As disclosed in US patent No. 4,723,129, a recording device using the bubble jet recording method 20 comprises an ejection outlet for ejecting the ink, an ink flow path in fluid communication with the ejection outlet, and an electrothermal trAnR~ r as energy generating means disposed in the ink flow path.
With such a recording method is advantageous 25 in that, a high quality image, can be recorded at high speed and with low noise, and a plurality of such ejection outlets can be posited at high density, and therefore, small size recording apparatus capable of providing a high resolution can be provided, and color images can be easily formed. Therefore, the bubble jet recording method is now widely used in printers, 5 copying r^^~h1n~, facsimile r^-h~n~ or another office equipment, and for industrial systems such as textile printing device or the like, With the increase of the wide needs for the bubble jet technique, various demands are imposed 10 thereon, recently.
For example, an impL~v~ - L in energy use efficiency is ' 'e~. To meet the demand, the optimization of the heat generating element such as adjustment of the thickness of the protecting film is 15 investigated. This method is effective in that a propagation efficiency of the generated heat to the liquid is improved.
In order to provide high image ~uality images, driving conditions have been proposed by which 20 the ink ejection 8peed i8 increased, and/or the bubble generation is stabilized to accomplish better ink e~ection. As another e~ample, from the standpoint of increasing the recordins~ speed, flow passage configuration i 10~G Ls have been proposed by which 25 the speed of liquid filling (refilling) into the liquid ilow path is increased.
Japanese Laid Open Patent Application No.

~ 2175166 SHO-63-199972 propose flow passage structures as disclosed in Figure 1, (a) and (b), for example.
The liquid path or pas~3age structure of a manuf acturing method theref or are proposed f rom the 5 standpoint of the back wave toward the li~uid chamber.
This back wave is ~-(.nQi ~ered as energy 1088 since it does not contribute to the li~uid eiection. It proposeg a valve 10 disposed upstream of the heat generating element 2 with respect to the direction of 10 general flow of the liquid, and is mounted on the ceiling of the passage. It takes an initial position wherein it e~tends along the ceiling. Upon bubble generation, it takes the position wherein it extends downwardly, thus suppressing a part of the ~ack wave 15 by the valve 10. When th valve is generated in the path 3, the suppression of the back wave is not practically significant. The back wave is not directly contributable to the eiection of tne liquid.
Upon the back wave occurs in the path, the pressure 20 for directly eiecting the liquid already makes the liquid eiectable from the passage.
On the other hand, in the bubble jet recording method, the heating is repeated with the heat generating element contacted with the ink, and 25 thereiore, a burnt material is deposited on the surface of the heat generating element due to kogation of the ink. However, the amount of the deposition may ~ ~ 2175166 be large tl~r~nll~n~ on the materials of the ink. if thi~i occurs, the ink e~ection becomes unstable.
Additionally, even when the liquid to be ejected is the one easily deteriorated by heat or even when the 5 liquid is the one with which the bubble generation is not sufficient, the liquid is desired to be ejected in good order without property change.
Japanese Laid Open Patent Application No.
SHO-61-69467, Japanese Laid Open Patent Application No. SHO-55-81172 and US Patent No. 4,480,259 disclose that different liquids are used for the liquid generating the bubble by the heat (bubble generating liquid) and for the liquid to be e~ected (ejection liquid). In these publications, the ink as the 15 ejection liquid and the bubble generation liquid are completely separated by a flexible film of silicone rubber or the like 80 as to prevent direct contact of the eiection liquid to the heat generating element while pLu~ay~ting the pressure resulting from the 20 bubble generation of the bubble generation liquid to the eiection liquid by the deformation of the flexible film. The prevention of the deposition of the material on the surface of the heat generating element and the increase of the selection latitude of the Z5 ejection liquid are accomplished, by such a structure.
However, with this structure in which the ejection liguid an~ the bubble generation liquid are , _ _ _ _ _ _ _ _ ~ 21 75~ 66 completely separated, th~ pressurs ~y the bubble generation i8 propagated to the s~sct$on liquld through the expansion-contract.on deformation of the flexible film, and therefore, the presgure i8 ;?.hsorh 5 by the flexi~le film to a quite high degree. In addition, t~e deformation of the flexible film is not 80 large, and thersfore, the energy use efficiency and the s,ection force ars deteriorated although the some effect is provided by the provlsion bstwssn the 10 e,ection liquid and ths bubbls generation liquid.

Sll~ARY OF THE I2~V~NTIO~ _ Accordingly, it is a principal objsct of tns prsssnt invsntion to provids a liquid eJection 15 principls with which the gsnsrated bubble is controlls~ in a novsl mannsr.
It is another ob~sct of ths prsse..t invention to provide a liquid e~ecting method, liquid e~ecting head and ~o on ~herein heat ~r: 1 ~tion in ths liquid 20 on the hsat gensrating slemsnt is E;ignif icantly reduced, and the rssidual bubbls on ths heat generating slemsnt is rsduced, while improving the s3sction sfficisncy and the s~sction pLe~uL~.
~t is a furthsr o~isct of the present 25 invsntion to provide a liquia e~ecting head ard 80 on wherein insrtia forcs in a direction against li~uid supply dirsction due to back wavs is supprssssd, and . _ ,, , .. . .. .... , . , . ,,,, . , , _ _ _ _ _ _ _ ~ 2f75t66 simultaneously, a degree of retraction of a meniscus is reduction by a valve function of a movable member by which the refilling frequency 18 increased, thus permltting high speed printing.
It is a further ob~ect of the present invention to provide a liquid eiecting head and 80 on wherein deposition of residual material on the heat generating element is reduced, and the range of the usable liquid is widened, and in addition, the ejection efficiency and the ejectlon force are gignificantly increased.
It is a further object of the present invention to provide a liquid ejecting method, a liquid ejecting head and 80 on, wherein the choice of 1~ the liquid to be eiected is made greater.
It is a further obiect of the present invention to provide a manufacturing method for a liquid e~ecting head with which such a liquid ejecting head is easily manufactured.
It is a further ob~ect of the present invention to provide a liquid ejecting head, a printing apparatus and 80 on which can be easily manufactured because a liquid introduction path for supplying a plurality of liquids are constituted with a small number of parts. it is an additional object to provide a downsized liquid e~ecting head and device.
It is a further ob~ect of the present 2175~66 invention to provide a good print of an image using an above-described e~ection method.
It is a further object of the present invention to provide a head kit for permitting easy S refuse of the liquid e~ecting head.
A~rr~rfli n~ to an aspect of the present invention, there is provided a liquid ejecting method, comprising: providing a substrate having a heat generating surface for generating heat for generating a bubble in liguid; providing a movable member having a free end; providing an ejection outlet for ejecting the liquid using the generation of the bubble, the ejection outlet being opposed to the substrate with the movable member interposed therebetween; disposing the free end of the movable member at a downstream side with respect to a direction of flow of the liquid to the e~ection outlet; and wherein the bubble displaces the free end of the movable member, and grows toward the e~ection outlet to e~ect the liquid.
According to another aspect of the present invention, there is provided a liguid ejecting method, comprlsing: providing a heat generating surface for generating heat for generating a bubble in liquid;
providing a movable member having a free end;
providing an e~ection outlet for ejecting the liquid using the generation of the bubble, the ejection outlet being opposed to the heat generating surface , , . , . . . _ _ _ _ _ g with the movable member interposed therebetween;
~3roS1n~ the free end of the movable member at a downstream side with respect to a direction of flow of the liquid to the e~ection outlet; and wherein the S bubble displaces the free end of the movable member, and grows toward the ejection outlet to eiect the liquid.
According to a further aspect of the present invention, there is provided a liquid eiection head 10 comprising: a substrate having a heat generating surface for generating heat for generating a bubble in liquid; a movable member having a free end; an eiection outlet for ejecting the liquid using the generation of the bubble, the e~ection outlet being 15 opposed to the substrate with the movable member interposed therebetween; an opposing member cooperable with the movable member to direct the bubble toward the ejection outlet, wherein the opposing member oppose8 to such a side of the movable member as is 20 near to the heat generating surf ace when the f ree end of the movable member is displaced by the bubble.
According to a further aspect of the present invention, there is provided a liquid e~ection head comprising: a heat generating surface for generating 25 heat for generating a bubble in liquid; a movable member having a free end; an eiection outlet for ejecting the li~auid using the generation of the . ~ 2175166 bubble, the ejection outlet being opposed to the heat generating surface with the movable member interposed therebetween; an opposing member cooperable with the movable member to direct the bubble toward the 5 e~ection outlet, wherein the orro~n~ member opposes to such a side of the movable member as is near to the heat generating surface when the free end of the movable member is displaced by the bubble.
According to a further aspect of the present 10 invention, there is provided a head cartridge comprising: a liquid e~ection head including: a substrate having a heat generating surface for generating heat for generating a bubble in liquid; a movable member having a free end; an e~ection outlet 15 for e~ecting the liquid using the generation of the bubble, the e~ection outlet being opposed to the substrate with the movable member interposed therebetween; an opposing member cooperable with the movable member to direct the bubble toward the 20 ejection outlet, wherein the opposing member opposes to such a side of the movable member as is near to the heat generating surface when the free end of the movable member is displaced by the bubble, and the head cartridge further comprising: a liquid containlng 25 portion for containing the liquid to be supplied to the liquid e~ecting head.
According to a further aspect of the present . _ _ . _ _ _ _ _ _ _ _ _ _ _ _ ` ~ 2~75166 invention, there is provided a head cartridge comprising: a liquid e~ection head including; a heat ,eLc.~lng surface for generating heat for generating a bubble in liquid; a movable member having a free 5 end; an e~ection outlet for ejecting the liquid using the generation of the bubble, the e~ection outlet being opposed to the heat generating surface with the movable member interposed therebetween; an opposing member cooperable with the movable member to direct 10 the bubble toward the e~ection outlet, wherein the opposing member opposes to such a side of the movable member as is near to the heat generating surface when the free end of the movable member is displaced by the bubble; and the head cartridge further comprising: a 15 liquid containing portion for containin~ the liquid to be supplied to the liquid ejecting head.
According to a further aspect of the present invention, there is provided a liquid e~ection apparatus comprising: a liquid e~ection head 20 including; a substrate having a heat generating surface for generating heat for generating a bubble in liquid, a movable member having a free end; an ejection outlet for e~ecting the liquid using the generation of the bubble, the e~ection outlet being 25 opposed to the substrate with the movable member interposed therebetween; an opposing member cooperable with thc movable member to direct the bubble toward , _ ,, , , ,, , ,, _ _,,,, _, , _, , ,,, , , _ _ _ _ _ 2175~66 the eiectlon outlet, wherein the opposing member opposes to such a side of the movable member as is near to the heat generating surface when the free end of the movable member is ~ ~rl~c~d by the bubble: and S the c,~alc-Lus further comprising: driving signal supply means for supplying a driving signal for ejecting the liquld.
According to a further aspect of the present invention, there is provided a liquid ejection 10 apparatus comprising: a liquid eiection head including; a ~u~ LlaLe having a heat generating surface for generating heat for generating a bubble in li~uid; a movable member having a free end; an ejection outlet for e~ecting the liquid using the lS generation of the bubble, the ejection outlet being opposed to the su~strate with the movable member interposed therebetween; an opposing member cooperable with the mova~le member to direct the bubble toward the eiection outlet, wherein the opposing member 20 opposes to suCh a side of the movable member as is near to the heat generating surface when the free end of the movable member i8 displaced by the bubble; and transportlng means for transporting a recording material for receiving the liquid ejected from the 25 liquid e~ecting head.
According to a further aspect of the present invention, there is provided a liquid ejection apparatus comprising: a liquid e~ection head including; a heat generatlng surface for generating heat for generating a bubble in liquid; a movable member having a free end; an e~ection outlet for 5 ejecting the li~uid using the generation of the bubble, the e~ection outlet being opposed to the heat generating surface with the movable member interposed therebetween; an opposing member cooperable with the movable member to direct the bubble toward the 10 ejection outlet, wherein the opposing member opposes to such a side of the movable member as is near to the heat generating surface when the free end of the movable member is displaced by the bubble; and the apparatus further comprising: driving signal supply 15 means for supplying a driving signal for e~ecting the liquid .
A~ )r~l~n~ to a further aspect of the present invention, there is provided a liquid e~ection apparatus comprising: a liquid ejection head 20 including; a heat generating surface for generating heat for generating a bubble in liquid; a movable member having a free end; an ejection outlet for e~ecting the liquid using the generation of the bubble, the e~ection outlet being opposed to the heat 25 generating 8urface with the movable member interposed therebetween; an opposing member cooperable with the movable member to direct the bubble toward the eiection outlet, wherein the orpn~31n~ member opposes to such a side of the movable member as is near to the heat generating surface when the free end of tne movable member is ~; srl A~ by the bubble; and 5 transporting means for t~ olLing a rf~ r~lin~
material for receiving the liquid ejected from the liquid eiecting head.
According to a further aspect of the present invention, there is provided a head kit comprising: a 10 liquid e~ection head including; a substrate having a heat generating surface for generating heat for generating a bubble in liquid; a movable member having a free end; an eiection outlet for eiecting the liquid using the generation of the bubble, the e~ection 15 outlet being opposed to the substrate with the movable member interposed therebetween; an opposing member cooperable with the movable member to direct the bubble toward the e~ection outlet, wherein the opposing member opposes to such a side of the movable 20 member as is near to the heat generating surface when the free end of the movable member ls displaced by the bubble; and a liquid container contalning the liquid to be supplied to the liquid ejecting head.
According to a further aspect of the present 25 invention, there is provided a head kit comprising: a liquid eiection head including; a having a heat generating surface for generating heat for generating a bubble in liquid; a movable member having a free end; an ejection outiet for ejecting the liquid using the generation of the bubble, the eiection outlet being opposed to the heat generating surf ace with the 5 movable member interposed therebetween; an opposing member cooperable with the movable member to direct the bubble toward the ejection outlet, wherein the opposing member opposes to such a ~ide of the movable member as is near to the heat generating surface when 10 the f ree end of the movable member is displaced by the bubble; and a liquid container containing the liquid to be supplied to the liquid eiectlng head.
According to a further aspect of the present invention, there is provided a liquid e~ecting method, lS comprising: providing a substrate having a heat generating surface for generating heat for generating a bubble in liquid; providing a movable member having a free end; providing an ejection outlet member having an eiection outlet for e~ecting the liquid using the 20 generation of the bubble, the e~ection outlet being opposed to the substrate with the movable member interposed therebetween; wherein the e~ection outlet member and the substrate define a liquid path therebetween and do not cross each other in the path;
25 ~ ?os~ng the free end of the movable member at a ,L~ side with respect to a direction of flow of the liguid to the ejection outlet; and wherein the ,,, , . , _,,,, , . ,,, , ,,, _ _ _ _ _ _ _ _ . _ _ _ _ _ _ _ _ ~ 2175166 bubble displaces the free end of the movable member, and grows toward the eiection outlet to eject the liguid .
According to a further aspect of the present 5 invention, there is provided a liquid e~ection head comprising: a substrate having a heat generating surface for generating heat for generating a bubble in liquid a movable member having a free end; an ejection outlet member having an ejection outlet for 10 ejecting the liquid using the generation of the bubble, the e~ection outlet being opposed to the substrate with the movable member interposed therebetween: wherein the ejection outlet member and the substrate deiine a liquid path therebetween and do lS not cro8s each other in thç path; an opposing member cooperable with the movable member to direct the bubble toward the eiection outlet, wherein the opposing member opposes to such a side of the movable member as is near to the heat generating surf ace when 20 the free end of the movable member is displaced by the bubble; the heat generated by the heat generating surface causes film boiling of liquid to create the bubble .
According to a further aspect of the pre8ent 25 invention, there is provided a recording system u8ing the recording apparatus.
According to the present invention, a movable ~ 2175166 member having a f ree end interposed between a heat generation surf ace of a heat generatlng element and an e~ection outlet, displaces toward the e~ection outlet by the pressure produced by the bubble generated by S the heat generation surface. As a result, the movable member cooperates with a member oppo6ed thereto, and concentrates the pressure produced by the bubble toward the e~ect$on outlet as if it squeeze the fluid communication path between the heat generation surface 10 and the e~ection outlet. Therefore, the liquid can be e~ected with high ejection efficiency, high ejectlon power, and high shot accuracy onto the recording material. The movable member is also effective to reduce the influence of the back wave, and therefore, 15 the refilling property of the liquid can be improved.
Therefore, there is provided the high responsivity, stable growth of the bubble and tne stable e~ection property of the liquid droplet during continuous liquid ejections, thus accomplishing high spee~l 20 recording and high image quality recording.
By using the liquid which is easy to generate the bubble and which does not easily produce accumulated material such as cogation in the liquid e~ecting head in the two-flow-path structure, the 25 latitude of the selection of the e~ection liquid is increased. Additionally liquid which is relatively influenced by heat is usable without the influence.

,,, . , , , , ,,,,, ,,, , . , _ _ , _, . ..... . ...... . . .

According to the manufacturing method o the liquid ejecting head o~ the present invention, such liquid ejecting heads can be manufactured with hlgh precision, with smaller number of parts at low cost.
The present inventlon provides a recording system or liquid ejecting device with high e~ectlon ef f i ciency .
According to the present invention, the head can be reused.
These and other objects, features and advantages of the present invention will hecome more apparent upon a consideration of the following description of the preferred embodiments of the present invention taken in conjunction with the ~c~ ying drawings.
BRIEF DFS~RIPTIQ~ OF ~HE DRAWINGS
Figure l is a schematic sectional view of a maJor part of a liquid e~ecting head according to an embodiment.
Figure 2 is a partial ~ch- ~lc partly broken perspective view of a ma~or part of a liquid ejecting head according to an ~ of the present invention .
Figure 3A is a schematic sectional view illustrating liquid ejection state of a liquid ejecting head according to an c ' -'1r 1 of the . . ~

present invention.
Figure 3B i8 a schematic sectional view illustrating liquid ejection state of a liquid e jecting head according to the ' -,,~! L of the 5 present invention.
Figure 3C is a schematic sectional view illustrating liquid eiection state of a liquid e~ecting head according to the ~ r-- L of the present invention.
Figure 3D is a schematic sectional view illustrating liquid ejection state of a liquid ejecting head according to the embodiment of the present invention.
Figure 4 is a schematic sectional view of a major part of a liquid ejecting head according to an t of the present invention.
Figure 5 is a schematic sectional view of a maior part of a liquid ejecting head according to an -"i L of the present invention.
Figure 6 is a partly broken schematic perspective view of a ma~or part of a liquid e~ecting head according to an ~ L of the present invention .
Figure 7 is a schematic sectional view of a ma jor part of a liquid ejecting head according to an embodiment of the present invention.
Figure 8 is a partially broken schematic . ~

perspective view Of a liquid e~ection head accord$ng to an ' -'~ L Of the present invention.
Figure 9A i8 a sr~ Lic top plan view of a heat generating element and movable portion or the 5 like used in a liquid eiecting head according to an embodiment of the present inverltion.
Figure 9EI is a schematic top plan view of a heat generating element and movable portion or the like used in a liquid ejecting head according to the 10 ~ r L Of the present invention.
Figure 9C is a schematic top plan view Of a heat generating element and movable portion or the like used in a liquid ejecting head according to the embodiment of the present invention.
Figure lOA is a schematic sectional view illustrating liquid e~ection state of a liquid ejecting head according to an enbodiment Of the present invention.
Figure 10~ 3 a schematic sectional view 20 illustrating liquid ejection state Of a liquid ejecting head according to the embodiment of the present invention.
Figure lOC is a schematic sectional view illustrating liquid ejection state o a liquid 25 ejecting head according to the embodiment Of the present invention.
Figure lOD is a schematic sectional view _ _ _ _ _ _ _ _ _ .

` ~ 2~75166 illustrating liquid ejection state of a liquid ejecting head according to the embodiment of the present invention.
Figure llA is a schematic sectional view 5 illustrating pressure propagation from a bubble produced in a liquid ejecting head according to an r- L of the present invention.
Figure llB is a schematic sectional view illustrating pressure propagation from a bubble in a 10 conventlonal liquid e~ecting head.
Figure 12 i8 a 6chematic sectional view of a major part of a liquid eiecting head according to an embodiment of the pre~;ent invention.
Figure 13A i9 a schematic sectional view and 15 a partial &chematic top plan view of a liquid ejecting head according to an embodiment of the pre6ent invention .
Figure 13B is a schematic sectional view and a partial schematic top plan view of a liquid e~ecting 20 head according to the embodiment of the present inventi on .
Figure 14A is a 6chematic sectional view illustrating liquid ejection state in a liquid e~ecting head according to an embodiment of the 25 prese;nt invention.
Figure 14B is a schematic 6~ct~ /~n:~l view illustrating liquid e~ection state in a liquid -22- 2l75l66 ejecting head according to the ' ~ of the present invention.
Figure 15A is a schematic sectional view and a partial ~-~ Llc top plan view of a liquid ejecting 5 head according to an F ''`'i L of the present invention .
Figure 15B is a schematic sectional view and a partial schematic top plan view of a liquid e~ecting head according to the embodiment of the present 10 invention.
Figure 16A is a schematic sectional view illustrating a major part of a liquid ejecting head according to an c ' --~i L of the present invention.
Figure 16B is a schematic sectional view 15 il lustrating a major part of a liquid ejecting head according to the embodiment of the present invention.
Figure 17 i8 partial schematic perspective view of an ~ L of the present invention.
Figure 18 i8 an is a partial schematic 20 perspective view of a liquid ejecting head according to an embodiment of the present invention.
Figure l9A is a schematic top plan view illustrating an example of a configuration of the movable portion usable in the liquid eiecting head of 25 the present invention .
Figure l9B is a schematic top plan view illustrating another example of a configuration of the _ _ _ _ _ _ 2~ 751 66 movable portian usable in the liquid e~ecting head of the present lnvention.
Figure l9C is a schematic top plan view illustrating a further example of a configuration of 5 the rcovable portion usable in the liquid ejecting head of the present invention.
Figure 20 is a schematic top plan view illustrating example of a movable portion usable with a liquid ejecting head of the present invention.
Figure 21A is a schematic top plan view illustrating an example of a configuration of a movable portion of a liquid ejecting head o~ the present invention.
Figure 21B is a schematic top plan view illustratlng another example of a configuration of a movable portion of a liquid e~ecting head of the present invention.
Figure 21C is a schematic top plan view illustrating a further example of a configuration of a movable portion of a liquid ejecting head of the present invention.
Figure 22A is a schematic sectional view illustrating an example of a substrate of a liquid e~ecting head of the present invention.
Figure 2213 is a schematic ~ct1 ~nAl view illustrating an example of a substrate of a liquid ejecting head of the present invention.
_ _ _ _ _ Figure 23 i8 a graph showing an example of a driving pulse applied to a liquid ejecting head of the present invention.
Figure 24A 8hows a proces8 8tep of 5 manufacturing method of a liquid e~ecting head according to the present invention.
Figure 24B shows another process step of manufacturing method of a liquid e~ecting head according to the present invention.
Figure 24C 8hOws a further process step of manufacturing method of a liquid ejecting head according to the present invention.
Figure 24D shows a further process step of manufacturing method of a liquid e~ecting head accor~tling to the present invention.
Figure 24E shows a further process step of manufacturing method of a liquid ejecting head according to the present invention.
Figure 25A schematically shows a proce8s step for manufacturing a grooved member usable with a liquid e~ecting head of the present invention.
Figure 25B schematically shows a process step for manufacturing a grooved member usable with a liquid ejecting head of the present invention.
Figure 25C schematically shows a process step for manufacturing a grooved member usable with a liquid e~ecting head of the present invention.
,, _ , ~ 21 751 66 Figure 25D schematically shows a process step for manufacturing a grooved member usable with a liquid e~ecting head of the present invention.
Figure 25E schematically shows a process step 5 for manufacturing a grooved member usable with a liquid ejecting head of the present invention.
Figure 26A shows a process step of another embodiment of a manufacturing method of a liquid ejecting head of the present invention.
Figure 26B shows a process step of the embodiment of a manufacturing method of a liquid ejecting head of the present invention.
Figure 26C shows a process step of the ~ ' _A;! L of a manufacturing method of a liquid 15 e~ecting head of the present invention.
Figure 26D shows a process step of the _'i L of a manufacturing method of a liquid ejecting head of the present invention.

Figure 27A shows a process step of another 20 embodiment of a manufacturing method of a liquid ejecting head of the present invention.
Figure 27B shows a process step of the embodiment of a manuf acturing method of a 1~ quid e~ecting head of the present invention.

. ~ 2175166 Figure 27C shows a process step of the : o~li L of a manufactur$ng method of a liquid e~ecting head of the present invention.
Figure 27D shows a process step of the ' S ' -J~-' L of a manufacturing method of a liqui~
ejecting head of the present invention.

Figure 28 is an exploded perspective view of a liquid e~ection head cartridge according to anotner c -~i~- t of the present invention.

Figure 29 is a schematic perspective view of a liquid e~ecting device ~rrorflin~ to another embodlment of the present invention.
Figure 30 is a block diagram of an example l i qui d e; ecting devi ce .
Figure 31 is a perspective view of example of a liquid e~ection recording system.
Figure 32 is a schematic view of an example of a liqui~3 ejecting head kit.

20 DESCRIPTIQN OF T~IE 1~ ;~;~ F~MRtmIMENT
Referring to the ~cl _~nying drawings, the o~l1r Ls of the present invention will be described .
oA ~ L 1 ) , ~ , 2175166 Figure 1 is a schematic cross-sectional view of a liquid eiecting head according to an embodiment of the present invention. Figure 2 is a Figure 2 is a partly broken schematic partial view of the liquid S e lecting head of Figure 1.
The liquid ejecting head of this ~ L
is a so-called side shooter type head, wherein the e jection outlet 11 is faced substantially parallel to a heat generation surf ace of the heat generating 10 element 2. The heat generating element 2 has a size of 48 ,um x 46 llm and iæ in the form of a heat generating resistor. It is mounted on a substrate 1, and generates thermal energy used to generate a bubble by film boiling of liquid as disclosed in USP
4,723,129. The e~ection outlet 11 is formed in an orifice plate 14 which is an ejection outlet portion material. The orifice plate 14 is manufactured from nickel through electro-forming.
A liquid flow path 3b is provision between the orifice plate 14 and the substrate 1 80 that it is directly in fluid communication with the ejection outlet 11 to flow the liquid therethrough. In this embodiment, water base ink (mixture liquid of water and ethanol ) as liquid to be ejected.
The liquid flow path 3b is provided with a movable portion 6 in the form of a flat plate cantilever 80 as to cover the heat generating element 2~75166 2 and to face it. Here, the movable portlon is called ~movable member". The movable portion 6 is positioned ad~acent an upward pro~ection space of the heat generation surface in a direction perpendlcular to the 5 heat generation surface of the heat generatlng element 2. The movable portion 6 is of elastic material such as metal. In this ~ L, it is of nickel having a thickness of 5 ~um. An one end 5a of the movable portion 6 is supported and fixed on a supporting 10 member 5b. The supporting member 5b is formed by patterning photosensitive resin material on the substrate 1. ~etween the movable portion 6 and the heat generating surface, this i8 provided a clearance of approx. 15 llm.
Reference numeral 15a designates a wall member as an orp~ n~ member opposed to such a surface of the movable portion 6 as is nearer to the heat generation surface when the movable portion 6 is opened. The wall member 15a and a free end 6a of the 20 movable portion 6 are opposed to each other with a gap therebetween of approx. 2 um in the form of a slit 8.
The movable portion 6 has a fixed end (fulcrum) at an upstream side with respect to the f low of the liquid from a common liquid chamber to the ejection outlet 11 Z5 through the supply passage 4b and the movable portion 6, and has a f ree end 6a at the downstream side . The fixed end 6b functions as a base portion (fulcrum) _ _ _ _ _ _ _ _ , ... ... . . .. . . .....

.j ~ 21 751 66 upon opening of the movable portion 6.
In this ;~' - 'i L, the slit 8 i8 narrow enough to prevent the bubble from ~Yr~n~n~
therethrough before the movable portion 6 displaces.
5 Thus, it i8 formed around the movable portion 6 but provides substantial sealed structure. At least the free end 6a of the movable portion 6 i8 disposed within a region to which the pressure due to the bubble extends. In Figure 1, "A" designates an upper 10 8ide reglon (eiection outlet side) of the movable portion 6 in a stable state, and "B" designates a lower side (heat generating element side) region.
When heat is generated at the heat generation surf ace of the heat generating element 2, and a bubble 15 is generated in the region B, the f ree end 6a of the movable portion 6 is instant~n~ yl y moved in the direction of the arrow in Figure 1 namely toward the r-~gion A with the base portion 6b functioning as a fulcrum by the pressure resulting from the generation 20 and growth of the bubble and by the expanding bubbie per se. By this, the liquid is e~ected out through the e~ection outlet 11.
In Figure 2, reference numeral 18 designates wiring electrode for applying an electric signal to 25 the heat generating element 2 which is an electrothermal Lialls-lucer, and it is mounted on the substrate 1.

_ . _ . . _ _ . ... . . .

The description will be made as to e~ecting operation of the liquid eiecting head according to this ~ ~ '. Figures 3A - 3D are schematic sectional views illustrating ejecting operation of the S li~Iuid ejecting head according to this . -'1 i,. In Figure 3A - 3D, supporting member 5b i8 omitted ~or simpl i city .
Figure 3A shows a state in which the heat generating element 2 has not yet been supplied with 10 energy such as electric energy, namely, in which the heat generating element has not yet generated the heat (initial state). As shown Figure 3A, the free end 6a is opposed to the glit 8 of a predetPrm~n~
size .
Figure 38 shows a state in which the heat generating element Z is supplied with the electric energy or the like to generate the heat, which produces a bubble 7 by film boiling, and the bubble is growing. The pressure resulting f rom the generation of the bubble and the growth thereof is mainly propagated to the movable portion 6. The mechanical displacement of the movable portion 6 is contributable to the e~ection of the ejection li~uid. from the ejection outlet.
Figure 3C shows a state in which the bubble 7 has further grown. As will be understood, the movable portion 6 is further displaced toward the ejection - ~ 2175166 outlet with the growth of the bubble 7. By the displacement of the movable portion 6, the eiection outlet side region A and the heat generating element side region B are in much freer communication with each other than the initial st2te. In this state, the fluid communication path between the heat generation surface and the ejection outlet is choked to a proper extent by the movable portion 6 so as to concentrate the force of the bubble expansion toward the ejection outlet. In this manner, the pressure wave resulting from the growth of the bubble is transmitted concentratedly in the upward direction. By such direct propagation of the pressure wave and the mechanical displacement of the movable portion 6 described in conjunction with Figure 4B, the eiection li~uid is e~ected at high speed and with high e~ection power and further with high ejection efficiency through the eiection outlet 11 in the form of a droplet 1 la ( Fi gure 3D ) .
In Figure 3C, a part of the bubble generated at the heat generating element side region B extends to the eiection outlet side region A. The eiection power can be further increased lf the clearance from the surface of the substrate 1 or the heat generation surf ace of the heat generating element 2 to the movable portion 6 is 80 fU~l P~ted as to permit the bubble to extend into the ejection outlet side region A. In order to permit the bubble to extend toward the eiject$on outlet beyond the initial position of the movable portion 6, it is desirable that the height of the heat generating element side region B is 8maller S than tne height of the maximum bubble state, more particularly severaI pm - 30 pm.
Figure 3D shows a state in which the bubble 7 is collapsing by the decrease of the inside pressure.
The movable portion 6 restore~i its initial position by the negative pressure resulting from the contraction of the bubble and the restoring force due to the spring property of the movable portion per se. With this, the liquid flow path 3b is quickly supplied with the amount of the liquid ejected out. In the liquid flow path 3b, there is har~ly any influence of the back wave due to the bubble, and liquid supply is carried out cc,-~ullelll ly with the closing of the movable portion 6, and therefore, the liquid supply is not obstructed by the movable portion.
The description will be made as to refilling of the liquid in the liquid ejecting head of this embodiment .
When the bubble 7 is in the collapsing process after the maximum volume thereof is reached, the volume of the liquid _ ~ating for the disappeared bubble volume flows both from the ejection outle~ 11 side and the liquid flow path 3b side. The _ ~ ~ _ _ _ , , _ _ _ . . .. . _ volume of the bubble at the upper side (ejection outlet side) beyond the initial position of the movable portion 6 is Wl, and that of the lower side (heat generating element side) is movable portion 5 (Wl+W2=W). When the movable portion 6 restores its initial position, the retraction of the meniscus at the ejection outlet for compensating a part of Wl stops, thereafter, the ~ ation for the 1~ lnin~
W2 is mainly effected by the liquid supply between the 10 movable portion 6 and the heat generation surface. By this, the retraction of the meniscus at the e~ection outlet can be reduced.
In this embodiment, the compensation of the volume W2 can be forcedly effected malnly through the 15 liguid flow path 3b along the heat generation surface of the heat generating element, using the pressure change upon the collapse of bubble, and therefore, the quicker refilling is possible. In the case that the refilling is effected using the pressure upon the 20 collapse of bubble in a conventional head, the vibration of the meniscus is large with the result of the deterioration of the image quality, but in this r 1,, the vibration of the meniscus can be minimized since the communication between the eiection 25 outlet side region A and the heat generating element side region B is suppressed. By this, the implov~
of the image quality and the high speed recording are _ _ _ _ _ _ _ _ _ . . _ _ _ _ _ .

2175~66 expected .
The surface of the substrate l is substantially flush with the heat generation surface of the heat generating element 2, that is, the heat generating element surface is not stepped down. In such a case, the supply of the liquid to the region B
occurs along the surface of the substrate l.
Therefore, the stagnation of the liquid on the heat generation surface of the heat generating element 2 is suppressed, and the precipitated bubble resulting from the dissolved gasses or the residual bubble having not collapsed, are removed, and the heat accumulation in the liquid is not too much. Therefore, more stabilized generation of the bubble can be repeated at high speed. In this embodiment, the surface of the substrate l is of flat inner wall, but this is not limiting if the inner wall has such a smooth surface that the liquid does not stagnate and that an eddy flow does not occur in the liquid.
(Embodiment 2 ) Figure 4 is a schematic sectional view of a ma~or part of another ~ L of the liquid ejecting head of the present invention, In Figure 4, supporting member 5b is omitted for slmplicity.
This embodiment is different from Enbodiment 1 in that the movable portion 6 is thin to provide higher flexibility. By this, as shown in Figure 4 by .. .. . . _ . . _ . _ . . .. _ . ... .

the broken line, the movable portion 6 displaced by the bubble is slightly bent toward the eiection outlet 11. If the moYable portlon 18 flexible, the movable portlon can be def lected to a great extent even with 5 relatively low bubble generatlon pressure, 80 that the bubble generatlon pressure can be further efflclently directed to the ejectlon outlet. In this ~ ~~~ L, too, a high e~ection power and high e~ection efficiency liquid ejectlng head 18 provided.
10 (Embodiment 3) Figure 5 is a schematic sectional view of a ma~or part of another ~ L. Figure 6 is a partial schematic partly broken perspective view of a liquid ejecting head shown in Figure 5. The movable 15 portion 6 of the head of this ~ t is not of a single structure but has a couple structure. The pressure of the ~ubble displaces a pair of movable portions 6 to permit the pressure to transmit towar~l the e~ection outlet 11 disposed above the movable 20 portion 6. One of the movable portlons 6 functlon as the movable member and the on the other hand functions as an opposing member, so that the bubble generation pressure 18 efficiently directed toward the ejection outlet. In this .- ~1 L, too, a high e~ectlon 25 power and high e~ection efflciency liquid e~ecting heaCI 18 provided.
(F ' _ '1 L 4) ` 2175166 Figure 7 i8 an is a schematic cross-sectional view of a liquia e~ecting head of a further ~
of the present invention. Figure 8 is schematic portion partly broken perspective view of a liquid ejecting head of Figure 7.
The liquid ejecting head of this ~ t is a side shooter type head wherein the heat generating element 2 is faced to the ejection outlet 11. The heat generating element 2 has a size of 10 48 llm x 46 ,~m and is in the form of a heat generating resistor_ It is mounted on a substrate 1, and generates thermal energy used to generate a bubble by film boiling of liquid as disclosed in USP 4,723,129.
The e~ection outlet 11 is provided in an orifice plate 15 14 which is an ejection outlet portion material. The orifice plate 14 is of nickel and manufactured through electro-f orming .
A first liquid flow path 3 is provided below the orifice plate 14 80 that it is directly in fluid 20 communication with the ejection outlet 11. On the other hand, on the substrate 1, a second liquid f low path 4 is provision for the flow of the bubble generation liquid. Between the first liquid flow path 3 and the second liquid flow path 4, a partition 25 or 8eparation wall 5 for separating the liquid flow paths is provided. The separation wall 5 is of elastic material such as metal. In this e ~ t, _ _ _ ` 21?5166 the ~eparation wall 5 is of nickel having a thickness of 5 pm. The separation wall 5 separates the eiection liquid in first liquid flow path 3 and the bubble g~neration liquid in the second liquid flow path 4.
The e~ection liquid i8 supplied to the first liquid flow path 3 through the first supply passage 12a from the first common liquid chamber 12 containing the e~ection liquid. The bubble generation liquid is supplied to the second liquid flow path 4 through the second supply passage 13a f rom the second common liquid chamber 13 containing the bubble generation liquid . The f irst common liquid chamber 12 and the second common liquid chamber 13 are separated by a partition la. In this embodiment, the ejection liquid 8upplied to the first liquid flow path 3 and the bubble generation liquid supplied to the second liquid flow path 4 are both water base ink (mixed liquid of etha~ol and water ) .
The separation wall 5 i~ disposed ad~acent the portion of the pro~ected space of the heat generation surf ace of the heat generating element 2 perpendicular to the heat generation surface, and has a pair of movable portions 6 of flat plate cantilever configuration, one of which is a movable member and the other is an opposing member opposed to the movable member. The movable portion 6 and the heat generating surface a disposed with a clearance of 15 ,um approx.

`~ ~ 2175166 The free ends 6a of the movable portlons 6 are opposed to each other with a gap of approx. 2 ,um (slit 8).
Designated by 6b is a base portion functioning as a base portion upon opening of the movable portions 6.
5 Slit 8 is formed in a plane including a line connecting a center portion of the heat generating element 2 and the center portion of the e~ection outlet 11. In this ~ , the slit 8 is so narrow that the bubble does not extend through the 10 slit 8 around the movable portions 6 before the movable portion 6 is displaced, when the bubble growths. At lea8t the free end 6a of the movable portion 6 is disposed within a region to which the pressure due to the bubble extends. In Figure 7, "A"
15 designates an upper side region(ejection outlet side) of the movable portion 6 in a stable state, and "~
designates a lower side(heat generating element side) region .
When heat is generated at the heat generation 20 surface of the heat generating element 2, and a bubble is ~onerAt~ in the region B, the free end 6a of the movable portion 6 is instantaneously moved in the direction of the arrow in Figure 1 namely toward the region A with the base portlon 6b functioning as a 25 fulcrum by the pressure resulting from the generation and growth of the bubble and by the expanding bubble per se. By this, the liquid is e~ected out through _ _ _ _ _ . , . . . _ _ . . _ _ _ . . . . . .. . _ _ _ _ _ _ _ . ~ 2175t66 t11e ejection outlet 11.
~ esignated by reference numeral 18 in Figure 8 is a wiring electrode for applying the electric signal to the heat generating element Z which is an 5 electrothermal tr.qn~ cf~r mounted on the substrate 1.
The description will be made as to the positional relation between the vable portion 6 and the second liquid f low path 4 in this ' ~l f L .
Figure 9A i8 a schematic top plan view of the movable I0 portion 6 as seen from the orifice plate 14 side.
Figure 9B is a schematic top plan view of the bottom portion of the second liquid Elow path 4, as seen from the separation wall 5 side. Figure 9C is a schematic top plan view of the movable portion 6 through the lS second liquid flow path 4, as seen from the orifice plate 14 side. In these Figures, the front side of the sheet of the drawing is an ejection outlet 11 side .
In thiE; ~ - t, throat portions 9 are 20 formed on both sides of the heat generating element 2 in the second liquid flow path 4. By the throat portions 9, the adiacent region of the heat generating element 2 of the second liquid flow path 4 has a chamber (bubble generation chamber) structure such 25 that escape of the pressure upon the bubble generation along the second liquid flow path 4 is suppressed.
When a throat portion is provided in the ~ ~ 2175166 liquid flow path to suppress escape of the pie~ul~
upon the bubble generation in a conventional head, the f low path cross-sectional area at the throat portion should not be too small in view of the refilling 5 property of the liquid to be ejected. However, in this embodiment, most of the e~ected liquid is the e lection liquid in the first liquid flow path, and the bubble generation liquid in the second liquid flow path having the heat generating element is not ejected lO 80 much, and therefore, the filling of the bubble generation liquid into the region B of the second liquid flow path may relatively small. Therefore, the clearance of the flow passage wall in the throat portion 9 may be very narrow, such as several pm. By 15 this, the pressure upon the bubble generation generated in the second liquid flow path 4 can be di rected concentratedly toward the movable portion 6 without escape to the circumference. Such pressure c~n be used as the ejection power through th~ movable 20 portion 6, and therefore, further high e~ection ef~iciency anCi e~ection power can be accomplished.
The description will be made as to the e~ecting operation of the liquid ejecting head in this embodiment. Figure lOA - Figure lOD are 8r~ ' c 25 sectional views of the liqui~l eiecting head illustrating the eiecting operation in this embodiment. In this embodiment, the ejection liquid _ _ _ _ _ _ _ _ ~ . _ _ . _ _ " ~ 2175166 to be supplied to the first liquid flow path 3 and the bubble generation liquid to be supplied to the second liquid flow path 4, are the 8ame water ba8e ink.
Figure lOA shows a statc before the energy 5 such as the electric energy is applied to the heat generating element 2, namely, the initial state before the heat generating element generates heat. As shown in Figure lOA, the free ends 6a of the separation walls 5 above the heat generating element 2, are faced 10 to each other through a slit 8 to separate the ejection liquid in the first liquid flow path 3 and the bubble generation liquid in the second liquid flow path 4.
Figure lOB shows a state in which the heat 15 generating element 2 is supplied with the electric energy or the like, and the heat generating element 2 generate the heat which pl~,du~es film boiling in the liquid 50 that the bubble 7 is generated and is expande~l . The pressure resulting f rom the generation 20 and the growth of the bubble is mainly propagated to the movable portion 6. The mechanical displacement of the movable portion 6 is contributabl~ to the e~ection of the e~ection liquid from the ejection outlet.
Figure lOC 8hows a state wherein the bubble 7 25 ha~ further grown. With the growth of the bubble 7, the movable portion 6 is further displaced toward the first liquid flow path 3 side with its base portion 6b ~ 2175166 functioning as fulcrum. By the displacement of the movable portion 6, the first liquid flow path 3 and the ~;econd liquid flow path 4 are in substantial fluid communication with each other. In this state, the 5 fluid communication path between the heat generation surface and the ejectlon outlet is choked to a proper extent by the movable portion 6 80 as to con~enLLaL~
the force of the bubble expansion toward the eiection outlet. In this manner, the pressure wave produced by 10 the growth of the bubble is concentratedly transmitted right upwarA toward the eiection outlet 11 in fluid communication with the first liquid flow path 3. By the direct propagation of the pressure wave and the mechanical displacement of the movable portion 6 15 described in conjunction with Figure lOB, the ejection liquid is ejected through the eiection outlet ll at high speed and with high eiection power and with high eiection efficiency as a droplet lla (Figure lOD).
In Figure lOC, with the displacement of the 20 movable portion 6 to the first liquid flow path 3 side, a part of the bubble generated at the region B
in the second liquid flow path 4 e~tend~ into the first liquid flow path 3 side. Thus, the height of the second liquid flow path 4 (a clearance from the 25 surf ace of the 8ubstrate l or the heat generating surface of the heat generating element 2 to the movable portion 6) is such that the bubble extending ~ 2~75166 into the first liquid flow path 3 side, by which the e~ection power is further improved. In order to extend the bubble into the first liquid flow path 3, it is desirable the height of the second liquid f low S path 4 i8 made smaller than the height of the maximum bubble, for example, several ,u~ - 30 ,um.
Figure lOD shows a state in which the bubble 7 is coll~r~1n~ by the decrease of the inside pressure. The movable portion 6 restores its initial 10 position by the negative pressure resulting from the contraction of the bubble and the restoring force due to the spring property of the movable portion per se.
With this, the first liquid flow path 3 is quickly supplied with the amount of the liquid e~ected out.
15 In the first liquid flow path 3, there is hardly any inf luence of the back wave due to the bubble, and liquid supply is carried out concurrently with the closing of the movable portion 6, and therefore, the liquid supply is not obstructed by the movable 20 portion. Accordingly, the inside in the Figure lOD
is not pressure 80 much, and therefore, a small amount of decrease is enough.
The description will be made as to the refilling of the liquid in the liquid e~ecting head 25 according to this embodiment.
When the bubble 7 is in the bubble collapse process after the maximum volume thereof, the volume -~ 21 751 66 of the liquid, ^nR;~ting for tne disappeared bubble volume flows both from the ejection outlet 11 side side, the flrst liquid flow path 3b side and the second liquid flow path 4. The volume of the bubble 5 at the upper side (eiection outlet side) beyond the initial position of the movable portion 6 i8 Wl, and that of the lower side (heat generating element side ) is movable portion (Wl+W2=W). When the movable portion 6 restores its initial position, the retraction of the 10 meniscus at the e~ection outlet for ~ _~ sting a part of W1 stops, thereafter, the compensation for the ,~ ~n;n~ W2 i8 mainly effected by the liquid supply in the second liquid flow path 4. ~y this, the degree of retraction of the meniscus in the ejection outlet, 15 can be suppressed.
In this embodiment, the compensation of the volume W2 can be forcedly effected mainly through the second liquid f low path along the heat generation surface of the heat generating element, using the 20 pressure change upon the collapse of bubble, and therefore, the ~uicker refilling is possible. In the case that the refilling is effected using the pressure upon the collapse of bubble in a conve~tional head, the vibration of the i srll~ is large with the result 25 of the deterioration of the image quality, but in this embod~mert, the vibration of the ~ 8r~l~ can be minimized since the communication between the region _ _ _ _ _ _ , , . , , ,, _ , .,, _, . _ ,,,, _, , , ,, _ _ _ _ _ . ~ 2175~66 of the first liquid flow path 3 of the election outlet side and the second liquid flow path 4, is suppressed by the movable portlon. By this, the implo~. L of the image quality and the high speed recording are 5 expected.
The surface of the substrate 1 is substantially flush with the heat generatlon surface of the heat generatlng element 2, that is, the heat generating element surface is rlot stepped down. In 10 such a ca6e, the supply of the liquid to the reglon B
occurs along the surface of the substrate 1.
Therefore, the stagnatlon of the liquld on the heat generation surface of the heat generating element 2 i8 suppressed, and the precipitated bubble resulting from 15 the dissolved gasses or the residual bubble having not collapsed, are removed, and the heat accumulation in the liquid is not too much. Therefore, more stabilized generation of the ~ubble can be repeated at high speed. In this embodiment, the surface of the 20 8Ubstrate 1 is of flat inner wall~ but thls is not limiting if the inner wall has such a smooth surface that the liquld does not stagnate and that an eddy flow does not occur ln the liquid.
The description will be made as to the 25 pressure ~l~>ay~Lion from the bubble in the liquld e~ectlng head of thls embodlment, as compared with a conventlonal e~ample. Figure llA is a schematic _ _ _ _ _ _ _426_ sectional view illustrating pl~:s~ul~ p.u~age.Lion from the bubble in the liquid ejecting head of this L. Figure llB i8 a schematic sectional view illustrating ~Les-ult propagation from the bubble in 5 the liquid eiecting head of the conventional.
In a representative conventional head showed in Figure llB, there is not obstructing material against the propagation of the pressure produced by the bubble 7, in the propagation direction.
10 Therefore, the direction of the pressure propagation of the bubble is widely scattered along tne substantially normal line direction of the surface of the bubble, as in~icated by V1-V8. Among these directions, the pressure component directed to the 15 e:~ection outlet which is most influential to the liquid e~ection, is V~-V6, namely, the pressure propagation component close to the ejection outlet.
Particularly, V4 and V5 are closest to the e~ection outlet, 80 that they work efficiently for the liquid 20 ejection, but V3 and V6 have relatively small component directed to the eiection outlet. Here, VA
and VB are the pressure propagation ~ Jllellt in the opposite direction along the liquid flow path.
In the case of this embodiment showed in 25 Figure llA, the movable member 6 directs the pressure propagation ~ V3-V6 of the bubble toward the e~ection outlet, and therefore, the pressure of the _ _ _ . . .. _ . . .. _ _ .

~ 2~75~66 bubble 7 acts directly and efficiently. The bubble per se growths toward the e~ect$on outlet. In this manner, the movable portion controls not only the pressure propagation directlon but also the growth of 5 the bubble per se, 80 that the ejection efficiency, e~ection power, ejectlon speed and so on are significantly e~ection powered.
Here, VAl and VBl are pressure ,~ n~nts along the first liquid flow path in the opposite 10 directions from each other, and VA and VB are pressure ~ Ls along the second liquid flow path in the opposite directions from each other. In this embodiment, the movable portion 6 suppresses the back wave, and therefore, VAl and VBl are smaller than in 15 the conventional device. The bubble is directed toward the eiection outlet, and therefore, VA and VB
are smaller than in the conventional device. As a result, VAl+VA and VBl+VB are smaller than VA and VB
in the conventional device.

20 (Embodiment 5) Figure 12 is a schematic sectional view of a major part of a liquid e~ecting head according to another embodiment of the present invention. This -air L is different from ~ L 4 in that the 25 movable portion 6 is thin to give higher fle~ibility.
By this, as shown in Figure 12 by the broken line, the movable portion 6 displaced by the bubble is slightly bent toward the ejection outlet 11. If the movable portion 18 flexible, the movable portion can be deflected to a great extent even with relatively low bubble generation pressure, 80 that the bubble 5 generation pressure can be further efflciently directed to the eiection outlet. In this ~ L, too, a high e~ection power and high ejection efficiency liquid e~ecting head is providea.
( F ' ~ 1, 6 ) Figure 13A is a schematic sectional view of a ma~or part of a liquid ejecting head of the present invention according to a further ,A1 t. Figure 13B is a ~ c top plan view of the movable portion used in this ' -~ t, as seen from the e~ection outlet side. This c ' ~A~- t is different from Embodiment 4 in that a trench or pit type liquid passage 4a enclosed by walls in four sides is in place of the second liquid flow path 4. In this f ' -~r-- t, after liquid ejection, the liquid is supplied into the pit type liquid passage 4a mainly from the first liquid flow path 3 through the opening 6C in the movable member 6. The size of the opening 6C will suffice if it permits flow of the ink without escaping the bubble.
In thls embodiment, the escape of the bubble generation pressure toward upstream side along the lower part of the movable portion 6. Furth~ -Ire~

2~75166 upon the collapse of bubble, the amount of the lnk to ~e refilled is only the one corrP~r~7ndin!J to the volume of the pit type liquld passage, 80 that the refilling amount may be small, ana the high speed S responsivlty can be accomplished. In this ~ t-- L, the high eiection power and high ejection efficiency liquid e~ecting head can be prevented.
(Embod$ment 7) Figure 14A is a schematic sectional view of a 10 ma Jor part of a Iiquid ejecting head according to a further embodiment of the present invention. The movable portion 6 of the head of this F ' ~ is not a dual type, but a single type. The iirst liquid flow path 3 at the free end 6a side of the movable 15 portion 6 is closed by a wall 15a (opposing member opposed to the movable member), 80 that the pressure produced by the bubb~e expands toward the e jection outlet 11 thereabove by deflection of the movable portion 6. The movable portion 6 in this embodiment 20 is a single member, manufacturing is easy and latitude in the designing is large.
Figure 14B is a schematic sectional view illustrating the generation, and so on, of the bubble 7 in the liquid ejecting head according to this 25 : ' - '~r lt. As shown in this Figure, a part of the bubble generated in the region B of the second liquid flow path 4 expands into the first liquid flow path 3 . . , _ . . . _ _ . _ .

side with the disp~ of the movable portion 6 into the first liquid flow path 3 side. Thus, the height o$ the second liquid flow path 4 (a clearance f rom the surf ace of the substrate 1 or the heat S generating surface of the heat generating element 2 to the movable portion 6) is such that the bubble e~tending into the first liqui~ flow path 3 side, by which the ejection power is further ~ roved. In order to extend the bubble into the first liquid flow 10 path 3, it is desirable the height of the second liquid flow path 4 is made smaller than the height of the maximum bubble, for example, several ~m - 30 pm.
In this ~ , the high e~ection power and high e~iection efficiency liquid ejecting head can be 15 prevented.
ofl j-- t 8 ) Figure 15A is a schematic sectional view illustrating ma~or part of a liquid eiecting head according to a further ~mho~ of the present 20 invention. Figure 15B is a schematic top plan view of the movable portion of this ~ t, as seen from the ejection outlet side. This ~ is different from r _a1 ~ 4 in that a pit type liquid passage 4a enclosed by walls in four sides i~ in place 25 of the second liquid flow path 4. In this '~o~3~ 1,, after liquid e~ection, the liquid is supplied into the pit type liquid passage 4a mainly from the first . . .

~ 2175166 liquid flow path 3 through the opening 6c in the movable member 6. The slze of the opening 6c will suffice if it permlt8 flow of the ink wlthout escaping the bubble .
In this embodiment the pressure for deflecting up the valve and the pL~##Ul~ of the bubble are both directed toward the ejection outlet. The movable portion 6 returns to the initial position substantially simultAneo~ y with the collapse of bubble, and therefore, the degree of the retraction of the ink i 8rll~ can be minimized, so that the the ink is smoothly supplied to the heat generating surface from the upstream side by the forced refilling function of the ink by the collapse of bubble. By lS this, a liquid ejecting head with high ejection power and high ejection efficiency, can be prevented.
( Embodiment 9 ) Figure 16A is a Figure 16A is a schematic sectional view of a major part of a liquid e~ecting head according to a further embodiment of the present invention. Figure 16i3 is an is a schematic top plan view of a movable portion used in movable portion, as seen irom the e~ection outlet slde. This embodiment is dlfferent from Embodlment 7 in that a pit type liquid passage 4a enclosed by walls in four sides is in place of the second liquid flow path 4. Tn this embodiment, after liquid e~ection, the liquid is supplied into the pit type liquid passage 4a mainly from the first liquid flow path 3 through the opening 6c in the movable member 6. The size of the opening 6c will suffice if it permits flow of the ink without escaping the bubble.
In this ~ _'i L, the escape of the bubble generation pressure toward the upstream side along the lower part of the movable portion 6, can be suppressed, and therefore, 80 that the bubble generation pressure can be efficiently directed toward the ejection outlet. Further ~ore, upon the collapse of bubble, the amount of the ink to be refilled is only the one corr~spnn~iin~ to the volume of the pit type liquid passage, 80 that the refilling amount may be small, and the high speed responsivity can be accomplished. According to this embodiment, too, a liquid ejecting head of high ejection power and high e~ection efficiency can be prevented.
(Head Example l ) Figure 17 is a schematic perspective view of an example of a liquid ejecting head according to an embodiment of the present invention, which has a plurality of ejection outlets and a plurality of liquid flow paths in fluid communication therewith, respectively. The liquid ejecting head is formed by a substrate 1, a separation wall 5 and an orifice plate 14 which are laminated with gaps. Substrate 1 has a 2175t66 ~IUp~JOl ~lng member of metal such as aluminum and a plurality of heat generating element6 2. I~eat generating element 2 is in the form of an electrothermal tr~n~d~lcl~r element generating heat for S generating a bubble by film boiling in the bubble generation liquid supplied to the second liquid flow path 4. The substrate 1 is provided with a wiring electrode for supplying the electric signal to the heat generating element 2, and function elements such 10 as transistor, diode, latch, shift register for driving the heat generating elements 2 selectively.
On the heat generating element 2, a protection layer (omitted in the Figure) for protecting the heat generating element 2 is provided.
The separation wall 5 is provided with a pair of movable portions 6 80 as to oppose to the heat generating element 2. Above the separation wall 5/ an orifice plate 14 having eiection outlets ll is provided with flow passage walls 15 for constituting 20 the first liquid flow paths 3 sandwiched thelebe~ _cn.
In Figure 17, reference numeral 12 designates a first common liquid chamber ior supplying the ejection liquid through the first supply passage 12a to the first liquid flow paths 3. Designated by 13 is 25 second common liquid chamber for supplying the bubble generation liquid through the second supply passage 13a to the second liquid flow paths 4. Thus, the _ _, _ _ _ _ first common liquid chamber 12 is in fluid communication w$th the plurality of first liquid flow paths 3 separated by the flow passage walls 15 on the separation wall 5. The second common liquid chamber 5 13 is in fluid communication with the plurality of second liquid flow paths 4 separated by the plurality of flow passage walls (omitted in the Figure for explanation purpose) on the substrate 1.
In the manufacturing of the liquid ejecting 10 head shown in Figure 17, a dry film having a thickne8s of 15 pm (solid photosensitivity resin material ) is placed on the substrate 1, and is patterned to form the flow passage walls for constituting the second liquid flow paths 4. The material of the flow passage 15 wall may be any if it exhibits anti-solvent property against the bubble generation liquid, and the flow passage wall can be formed. Examples of such materials include liquid photosensitive resin material in addition to the dry film. Other examples are resin 20 material such as polysulfone or polyethylene or metal such as gold, silicon, nickel, and glass. Thereafter, the substrate 1 and the separation wall 5 are connected to form an integral substrate and separation wall combination while the heat generating element 2 25 and the movable portion 6 are correctly positioned with each other.
The orifice plate 14 having the ejection 2?75?66 outlets 11 are formed from nickel through electro-forming. Tne orifice plate 14 may be a grooved member having e~ection outlets formed by projecting eximer laser to a mold of resin integrally having the first liquid flow path 3. The first liquid flow path 3 is formed by placing a ary film having a thickness of 25 l~m on the back side of the orifice plate 14 and patterning it. Thereafter, the orifice plate 14 is connected with the integral substrate and separation wall combination, while the eiection outlet 11 and the movable portion 6 are correctly positioned relative to each other.
(Head Example 2 ) Figure 18 is a ~q~`.h~ Llc perspective view of a liquid eiecting head according to an ~ L of the present invention. The 1 of this ~ - L is different from the foregoing head is in that the movable portion 6 is an i n~ r~n~1~nt member rather than a pair. The defect 15d having the flow passage wall 15 functions as an opposing member. In this embodiment, a liquid ejecting head with the high eiection power and high ejection efficiency, is proviZled .
(Movable portion and separation wall ) Figure l9A - Figure l9C are schematic top plan views of liquid e~ecting heads having a movable portions according to further embodiments. Figure l9A
_ _ _ _ _ _ .. . . _ _ _ _ . _ .. _ . . .

showæ an example, wherein the movable portion 6 of the separation wall 5 is rectangular. Figure l9B shows an example, wherein the movable member is rectangular with narrowed base portlon 6b functioning a8 the 5 fulcrum upon the displacement or deflection. Figure lgC shows an example, wherein the movable member is rectangular with wider base portion 6b functioning aa the fulcrum of the displacement than the free end 6a side .
With the use o~ the movable portion 6 as 8hown in Figure l9B, the operation of the displacement is easier. With the movable portion 6 as shown in Figure l9C, the durability of the movable portion is high. From the standpoint of both of easiness of the 15 operation of the movable portion and the durability of the movable portion, the width of the base portion 6b side functioning as the fulcrum, as shown in Figure 9A, is desirably narrowed arcuately.
Figure 20 is a schematic top plan view of the 20 rectangular movable portion 6 and the heat generating element 2 shown in Figure l9A, as seen from the ejection outlet side, to show the positional relation therebetween. In order to effectively use the bubble generation pressure, the two movable portions 6 are 25 extended in the different directions 80 that the portion right above the effective bubble generating region of the heat generating element 2 is covered by _ _ _ _ _ _ _ _ _ _ , . . .

2~75166 the movable portion, that i8, the movable ends thereof are oppoæed to each other. In this ~ ` A; t, the movable portions 6 have the same conf igurations and are arranged symmetrically, but a plurality of movable 5 members having different configurations may be used.
The movable portions may be asymmetrical if the durability of the movable portion is high, and the e~ection efficiency is high. By making the total area of the movable portion larger than the total area of 10 the heat generating surf ace of the heat generating element and by positioning the fulcrum of the movable portion outside the region of effective bubble generating region of the heat generating element, the ejection efficiency and the durability of the liquid 15 ejecting head are improved.
In the head having the opposed movable portions as shown in Figure 7 and the like, it is preferable that the slit is relatively narrow, rom the standpoint of the implU~ in the e ~ection 20 efficiency. rt is preferable that a line passing through the center of the heat generating surface of the heat generating element and perpendicular to the heat generating surface is close with a line passing through the center of the region of the gap between 25 the free ends and perpendicular to the gap region, and it is further preferable that these lines are substantially overlapped. Further, it is preferable -58- 2175~66 that a line passing through the center of the heat generating surface ~f the heat generating element and perpenaicular to the heat generating surface, passes through the ejection outlet, and it i8 further 5 preferable that the line and a line perpendicular to the e~ection outlet through the center of the ejection outlet are overlapped.
In the head having the one side movable portion as shown in Figure 14B or the like and the 10 opposing defect thereto, it is preferable that a line passing through the heat generating surf ace of the heat generating element and perpendicular to the heat generating surface, penetrate the one side movable portion. Additionally, it is preferable that a line lS pa88ing through the center of the heat generating surface and vertical to the heat generating surface, penetrates the e~ection outlet, and it is further preferable that the line and a line passing through the center of the ejection outlet and vertical to the 20 ejection outlet are substantially overlapped.
Figure 21A - Figure 21C is a schematic top plan view illustrating a configuration in which not less than three movable portions 6 are used for one bubble generation region, and Figure 21A shows an 25 example of three positions, Figure 21B shows an example of four positions, and show shows an example of six positions. The number of the movable portions " 21751 66 6 is not limited unless a problem arises in manufacturing. In any cases, the movable portions 6 are arranged in a radial fa8hion 80 that the pressure produced by the bubble is applied uniformly to the movable portions 6, and the fulcrum side is made arcuate to accomplish better operation and the durability. By the adjacent radial aLL~ly~ t of the valve-like movable portion 6, large size droplets can be eiected with high efficiency. The plurality of 1~ movable portions 6 can be detPrminpd by one skilled in the art in accordance with the diameter of the droplet (dot size) to be eiected.
As for the material of the separation wall including the movable portion, any material is usable if it has anti-solvent property against the bubble generation liquid and the eiection liquid, it has an elasticity suitable for operation as the movable portion, and it is suitable for formation of the fine slit .
Preferable examples of the materials for the movable member include ~lurable materials such as metal such as silver, nickel, gold, iron, titanium, aluminum, platinum, tantalum, stainless steel, phosphor bronze or the like, alloy thereof, or resin material having nitrile group 8uch as acrylonitrile, butadiene, 8tylene or the like, resin material having amide group such as polyamide or the like, resin _ _ _ _ _ _ _ _ _ _ .

,~

material having carboxyl such as polycarbonate or the like, resln material having alclehyde group such as polyacetal or the like, resin material having sulfone group such as polysulfone, resin material such as 5 liquid crystal polymer or the like, or chemical .; _ ' thereof; or materials having durability against the ink, such as metal such as gold, ~u-ly~Lell, tantalum, nickel, stalnless steel, titanium, alloy thereof, materials coated with such metal, resin 10 material having amide group such as polyamide, resin material having aldehyde group such as polyacetal, resin material having ketone group such as polyetheretherketone, resin material having imide group such as polyimide, resin material having 15 hydroxyl group such as phenolic resin, resin material having ethyl group such as polyethylene, resin material having alkyl group such as polypropylene, resin material having epoxy group such as epoxy resin material, resin material having amino group such as 20 mela~ine resin material, resin material having methylol group such as xylene resin material, chemical compound thereof, ceramic material such as silicon dioxide or chemical ~ _ .ulld thereof .
Preferable examples of partition or division 25 wall include resin material having high heat-resistive, high anti-solvent p v~eL l y and high molding property, more particularly recent engineering plastic , ~ 2175166 resin materials such as polyethylene, polypropylene, polyamide, polyethylene terephthalate, 1 i ' nfl resin material, phenolic resin, epoxy resin material, polybutadiene, polyurethane, polyetheretherketone, 5 polyether sulfone, polyallylate, polyimide, polysulfone, liquid crystal polymer (LCP), or chemical ol~nfl thereof, or metal guch a8 silicon dioxide, silicon nitride, nickel, gold, stainless steel, alloy thereof, chemical compound thereof, or materials 10 coated with titanium or gold.
The thickness of the separation wall is det~rminp~l flF~r-~n-lin~ on the used material and configuration from the standpoint of sufficlent E~trength as the wall and sufficient operativity as the 15 movable member, and generally, 0.5 llm - 10 pm approx.
is desirable.
As for width of the slit 35 for providing the movable member 31, when the bubble generation liquid and eiection liquid are different materials, and 20 mixture of the liquids i8 to be avoided, the gap is det~rm; nl~(l 80 as to form a meniscus between the liquids, thus avoiding mixture therebetween. For example, when the bubble generation liquid has a viscosity about 2 cP, and the ejection liquid has a 25 viscosity not less tha~ 100 cP, 5 pm approx. slit is enough to avoid the liquid mixture, but not more than 3 pm is desirable.

_ _ _ _ _ _ _ _ _ . . . , , _ . . _ In this invention, the movable member has a thickness of ,um order as preferable thickness. When a slit is formed in the movable member having a thickness of ,um orderr and the slit has the width (W
S pm) of the order of the thickness of the movable member, it i8 desirable to consider the variations ln the manuf acturing .
When the thickness of the member opposed to the f ree end and/or lateral edge of the movable member 10 formed by a slitr 18 equivalent to the thickness of the movable member, the relation between the slit width and the thickness 18 preferably as follows in cons$deration of the variation in the manufacturing to stably suppress the liquid mixture between the bubble 15 generation liquid and the ejection li~uid. When the bubble generation liquid has a viscosity not more than 3cpr and a high viscous ink (5 cp, 10 cp or the like) is used as the eiection liquid, the mixture of the 2 liqui~s can be suppressed for a long term if W/t < 1 20 is satisf ied.
The slit providing the "substantial sealing", preferably has several microns width, since the liquid mixture prevention is assured.
When the ejection liquid and the bubble 25 generation liquid are separated, the movable member functions as a partition theLebeL.J_~.~. However, a small amount of the bubble generation liquid is mixed " ~ 2175166 into the ejection liquid. In the case of liquid ejection for printing, the percentage of the mixing i8 practically of no problem, if the percentage is less than 20 %.
Therefore, the present invention covers the case where the mixture ratio of the bubble generation liqui~ of not more than 20 %.
In the foregoing ~ - af ~ Ls, the maximum mixture ratio of the bubble generation liquid was 15 %

lC even when various viscosities are used. With the bubble generation liquid having the viscosity not more than 5 cps, the mixture ratio was 10 % approx. at the maximum, although it is different if the driving freguency is different. The mixed liquid can be IS reduced by reducing the viscosity of the ejection liquid in the range below 20 cps (for e~ample not more than 5 % ) .
(Ejection liquid and bubble generation liquid) When the e~ection liquid and the bubble 20 generation liquid are the same liquid, various liquid materials are usable, if it is not deteriorated by the heat imparted by the heat generating element;
accumulated material i8 not easily deposited on the heat generating element; the state change of 25 gassification and the condensation are reversible; and the liquid flow path, movable member or separation wall or the like are not deteriorated. For recording, 2~75166 the liquid used in a conventional bubble jet device as recording liquid, is also usable in this invention.
On the other hand, eve if the e~ection liquid and the bubble generation liquid are different liquid 5 materials, the ejection liquid can be ejected by the displacement of the movable portion caused by the pressure p~ luced by the bubble generation of the bubble generation liquid. Therefore, high viscosity liquid such as polyethylene glycol with which the 10 bubble generation is not sufficient upon heat application, and therefore, the e~ection power is not sufficient, can be ejected at high eiection efficiency and with high e~ection pressure by supplying this liquid in the first liquid flow path and supplying, to 15 the second liquid flow path as the bubble generation liquid, the good bubble generation liquid (a mixed liquid of ethanol and water at 4:6, having a viscosity of 1 - 2 cps approx., for example).
The liquid easily influenced by heat can be 20 ejected at high ejection efficiency and with high eiection pressure without thermal damage to such liquid, if such liquid is supplied to the first liquid flow path, and the liquid not easily influenced by the heat but having good bubble generation property, is 25 supplied to the second liquld flow path.
Various liquid materials are usable, if it is not deteriorated by the heat imparted by the heat _ _ _ _ _ _ _ _ _ , " ~ 2~75166 generating element; accumulate~ material i8 not easily deposited on the heat generatirg element, the state change of gassification and the l ~mA-~n~ation are reversible and the liquid flow path, movable member 5 or separation wall or the like are not deteriorated.
More particularly, examples of such liquids include methanol, ethanol, n-propanol, isopropanol, n-hexane, n-heptane, n-octane, toluene, xylene, methylene dichloride, trichlene, Freon TF, Freon BF, ethyl 10 ether, dioxane, cyclohexane, methyl acetate, ethyl acetate, acetone, methyl ethyl ketone, water or the like or a mixture of them.
As for the ejection liquid, various liquid is usable irrespective of thermal property or of the 15 bubble generation property. The liquid having low bubble generation property, the liquid which is easily deteriorated or inf luenced by heat or the high viscous liquid, which are not easily eiected heretofore, can be e~ected. However, it is desirable that the 20 ejection, bubble generation or the operation of the movable portion is not obstructed by the ejection liquid per se or by the reaction with the bubble generation liquid. As for the reaction for the _owever, bubble generation movable portion of is 25 usable. Other examples of eiection liquid include rh~r~ uticals, perfume such as which is easily inf luenced by heat .

` 2175~66 The head shown in Figure 1 was driven with voltage of 25 V and at 2 . 5 kHz using:
The bubble generation liquid which was the above-descrlbed mixed liquid of ethanol and water;
Ejection liquid which was dye ink (2 cps), pigment ink ( 15 cps), polyethylene glycol 200 or polyethylene glycol 600.
As a result, satisfactory ejection was conf i rmed .
Recording operations were also carried out using the following combination of the liquids for the bubble generation liquid and the ejection liquid. As a result, the liquid having a ten and several cps viscosity, which was unable to be e~ected heretofore, was properly e~ected, and even 150 cps liquid was properly e~ected to provide high quality image.
Bubble generation liquid 1:
Ethanol 40 wt. %
Water 60 wt. 96 Bubble generatlon liquld 2:
Water 100 wt.
Bubble generatlon liquid 3:
Isopropyl alcoholic 10 wt. %
Water 90 wt. %
Eiection liquid 1:
( Pigment ink approx . 15 cp ) Carbon black 5 wt. g6 " ~ 2175166 Stylene-acrylate-acrylate ethyl copolymer resin mater$al l wt. %
Dispers$on materlal (oxide 140, weight average molecular welght) 5 rqono-ethanol amine 0 . 25 wt . %
Glyceline 69 wt. 96 Thiodiglycol 5 wt. g6 Ethanol 3 wt. %
Water 16. 75 wt. %
Ejection liquid 2 (55cp):
Polyethylene glycol 200 lO0 wt. %
Ejection liguid 3 ( 150cp):
Polyethylene glycol 600 lO0 wt. %
Further, the use was made with the following 15 liquid which is usable both for the e~ection liquid and the hubble generation liquid, and the results were that high quality images were recorded because of high i nk e j ect i on speed .
Dye ink (viscosity of 2 cps) C . I . hoodblack 2 dye 3 wt . %
Diethylene glycol lO wt. %
Thiodiglycol 5 wt. %
Ethanol 3 wt. %
Water 77 wt. %
In the case of the liquid which is not easily eiected heretofore, the eiection speed is low, and therefore, the variation of the ejecting directions is _ _ _ _ _ , . ,, .. ... . . _ .. .

relatively larger with the result of varlations of the shot positions of the droplets and variation of the ejection amounts due to the eiection instability, and therefore, the image quality i6 not very high.
Elowever, :~crnr-lin~ to the 4~ ' -'i L, the generation of the bubble is stable and sufficient. Therefore, the shot accuracy of the liquid droplet is i l~v~:d, and the ink ejection amount is stabilized, thus remarkably improving the recorded image quality.
(Element substrate) ~ereinafter, the structure of the element substrate provided with heatin~ members for applying heat to the liquid will be described.
Figures 22A and 22B are sectional views of the element substrate of the liquid eiection head in accordance with the present invention. Figure 22A
depicts a portion of a head element substrate 1 provided with a protective film, which is on an electrothermal tr~ns:Alln~r comprising the heating member. Figure 22B depicts a head element substrate 1 provided with no protective film.
A layer of silicon oxide or silicon nitride is formed as a bottom layer 66 on a substrate 67 of silicon or the like, for the p~rpose of insulation and heat ~ lation. On the bottom layer 66, a 0.01 -O . 02 ,um thick heat generating resistor layer 65 (heat generating member 2 ) composed of hafnium boride 2~75166 (E~fB2), tantalum nitride (TaN), tantalum aluminum (TaAl ), or the like, and a 0 . 2 - 1. 0 pm thick patterned wiring electrode 64 of aluminum or the like, are laminated. As voltage is applied to the heat 5 generating resistor layer 65 through these two wiring electrodes 64, a current flows through the heat generating resistor layer 65 located between two electrodes 64, whereby heat is generated.
In the case of the structure depicted in Figure 22A, the 0 .1 - 2 . O ,~m thick protective layer 63 of the silicon oxide, sllicon nitride, or the like is formed on the heat generating resistor layer, at least between the wiring electrodes 64. Further, a 0.1 -O . 6 ,um thick anti-cavitation layer of tantalum or the s like is deposited on the protective layer 63, protecting at least the heat generating resistor layer 65 from various liquids such as ink. The reason why metallic material such as tantalum is used as the anti-cavitation layer 62 is that the pressure wave or 20 the shock wave generated during the generation and collapse of the bubble is extremely powerful, being liable to drastically deteriorate the durability of the oxide film which is hard and britt~e.
Figure 2233 depicts a heat element substrate 1 25 without the protective layer 62; the protective layer or the like is not mandatory. As for the heat generating resistor layer material which does not require the protective layer described above, metallic alloy material such as iridium-tantalum-aluminum alloy can be named.
In other words, the structure of the heat 5 generating member ln accordance with the present invention may comprise the protectlve layer which i8 placed over the heat generating portion of the heat generating resistor layer, between the wiring electrodes, but this not mandatory.
In this F ' ~ L, the heat generating member is constituted of a heat generating resistor layer which generates heat in response to an electric signal. But, the present invention is not limited by this embodiment. The present invention is compatible 15 with any heat generating member as long as it can generate bubbles in the bubble generation liquid sufficiently to eject the ejection liquid. For example, a photothermal tr~nc~ r which generates heat as it receives light such as a laser beam, or a 20 heating member comprising a heating portion which generates heat as it receives high f requency waves, may be employed.
The element substrate 1 may integrally comprise functional elements such as transistors, 25 diodes, latches, and shift registers, in addition to the aforementioned electrothermal tr~n~duc~rs which contain the heat generating resistor layer 65 217~166 constituting the heat generating portion, and the wiring electrodes 64 for supplying thP electrlc signals to the heat generatlng reslstor layer 65.
These functlonal elements are also formed through a 5 semiconductor manufacturlng process.
Figure 23 18 a graph depictlng the pattern of a driving signal applied to the heat generating member. The axis of abscissa presents the duration of the driving signal applied to the heat generating 10 portion, and the axis of ordinates represents the voltage value of the driving signal. In order to eject the llquid by drivlng the heat generatlng portion of the electrothermal tr~ncfll~rpr arranged on the element substrate 1, a rectangular pul6e as 15 illustrated in Figure 23 is applied to the heat generating resistor layer 65 through the wiring electrodes 64, causing the heat generating resistor layer 65 located between the wlring electrodes 64, to rapidly generate heat. In each of the preceding 20 embodiments, the driving signal applied to drive the heat generating member 80 that the liquid, that is, the ink, could be e~ected from the ejection orifice through the aforementioned operation, had a voltage of 24 V, a pulse width of 7 llsec, a current of 150 mA, 25 and a frequency of 6 kH. ~Iowever, the speciiications of the driving signal are not limited to those described above; any drlving signal is acceptable as _ _ _ _ _ . . _ _ _ _ _ . _ . . . _ .

~ 2175166 long as it can properly generate bubbles in the bubble generation liquid.
(Head Production Method) NeYt, a manufacturing method for the liquid ejection head in accordance with the present invention will be described.
The manufacturing process for the liquid ejection head having the twin liquid flow paths is generally as follows. First, the walls of the second liquid flow path 4 are formed on the element substrate 1, and a separation wall 5 is placed on top of the walls. Then, a grooved member provided with the grooves or the like which will become the first liquid flow path 3 is placed on top of the separation walls 5. The separation wall 5 may be provided on the groove member, and in such a case, after the walls of the second liquid flow path 4 are formed, the grooved member with the separation walls 5 is bonded to the top surfaces of these walls.
Next, the manufacturing method for the second liquid flow path 4 will be described.
Figures 24A - 24E are schematic sectlonal drawings depicting the steps of the liSluid ejection head manufacturing method in the first ~ of the present invention.
Referring to Figure 24A, the electrothermal tr~n~d~ r comprising a heating member 2 composed of 2~75166 .

hafnium boride, tantalum nitride, and the like is formed on the element substrate 1, that is, an individually plotted section of a silicon wafer, using manufacturing apparatuses similar to those employed 5 for the semiconductor manufacturing process. Then, the surface of the element substrate 1 is lP~n~Pcl to improve its adhesiveness to the photosensitive resin which is involved in the following step. In order to further improve the adhesiveness, the propertles of 10 the element substrate surface are modified with a combination of ultraviolet rays and ozone, or the like combination, and then is spin coated with, for example, a 1 wt. % ethyl alcohol solution of silane coupler A189 (product of NIPPON UNICA).
Next, referring to Figure 24B, a dry film Odyl SY-318 (product of Tokyo Ohka Kogyo Co., Ltd. ), that is, an ultraviolet ray sensitive resin film DF, is laminated on the element substrate 1, the surface of which has ~een cleansed to improve the 20 adhesiveness.
Next, referrlng to Figure 24C, a photomask PM
is placed on the dry film DF. Ultraviolet rays are irradiated on the dry film DF covered with the photomask PM in a prerleterm1 nP~l pattern, whereby the 25 regions of the dry film DF, which are not shielde~l by the phot nlr PM, are expoged to the ultraviolet rays;
these exposed regions are to become the walls of the _ _ _ _ _ _ _ _ _ . ,,,, ., . , . , , , . ,,, _ ... _,, . _ .. ...

" .

second liquid flow path. This exposure process i8 carrled out using an MPA-600 (product of Canon Inc, ), whereby the rate of exposure is approximately 600 mJ/cm2 .
Next, referring to Figure 24D, the dry film DF is developed using a developer BMRC-3 (product of Tokyo Ohka Kogyo Co., Ltd. ), which is a mixture of xylene and butyl c-~l 1 oc~l ve acetate: the unexposed reglons are dissolved, leaving the exposed and hardened regions as the walls of the second liquid flow path 4. Then, the residue 1~ ~n1n~ on the surface of the element substrate 1 is removed by treating the surface of the element substrate 1 for approximately 90 seconds with an oxygen plasma ashing s apparatus MAS-800 (product of Alcan-Tech Co., Ltd. ) .
Next, the exposed regions are further irradiated with ultraviolet rays with a strength of 100 mJ/cm2 for two hours at a temperature of 150 C, being completely hardened .
According to the above method, the second liquid flow path is uniformly and precisely formed on each of the heater boards on the silicon substrate.
Next, a gold stud bump is formed on the electrical joint of the heater board using a bump bonder (product of Kushu Matsushita Electric Co., Ltd. ) . Thereafter, the silicon wafer is cut using a dicing machine AWD-4000 (product of Tokyo Seimitsu ) , _ _ _ _ _ , . .. . .. ... . .. . ..

, ~ 2175~66 equipped with a 0.05 mm thick diamond blade, separating each heater board 1. Next, a TAB tape and the heater board 1 are joined. Next, a, ~ d member formed by bonding the grooved member 14a and 5 the separation wall 5 is precisely positioned on the heater board 1 and bonded thereto.
When the above method is used, not only can the liquid flow path be precisely formed, but it also can be positioned without becoming misaligned relative 10 to the heater of the heater board. Since the grooved member 14a and the separation wall 5 are bonded together in a preceding step, the accuracy in the positional relationship between the first liquid flow path 3 and the flexible member 6 can be improved. The lS employment of these high precision manufacturing technologies makes it possible to produce a liquid ejection head capable of stable ejection, essential to the 1 ~ ,. 1 of print quality. Further, these technologies allow a large number of heads to be 20 formed on the wafer at the same time, making it possible to manuiacture a large number of heads at low cost .
In this embodiment, a dry film which can be hardened with ultraviolet rays was used to form the 25 second liquid flow path 2, but a resin material, the absorption band of which is in the ultraviolet ray spectrum, in particular, near 248 nm, may be employed.

_ . _ _ _ _ _ _ _ 2t75166 In the latter case, the resin is hardened after being laminated, and then, the second liquid flow path is formed by directly removing the portions, which are to become the second liquid flow path, from the hardened 5 resin u8ing an excimer laser.
Figures 25A - 25E are schematic sectional drawings depicting the steps of the manufacturing method for the grooved member of the liquid ejection head in accordance with the present invention.
Referring to Figure 25A, in thi8 ~mho~
a O . 5 ,um thick resist 22 is placed on a stainless steel (SUS) substrate 21, in a predet~rm1ne-l pattern having the same pitch as the ejection orifice. In this embodiment~ a resist having a diameter of 59 um 15 is formed to yield an ejection orifice having a diameter of 30 um.
Next, referring to Figure 25B, a nickel layer 23 is grown on the SUS substrate 21 to a thickness of 15 ,um by electroplating. As for the plating solution, 20 a mixture of sulfamic acid nickel, stress reducing agent Zero Ohru (product of World Metal Inc. ), boric acid, anti-pitting agent NP-APS (product of World Metal Inc. ), and nickel chloride, is u~ed. As for the means for applying an electric field, an electrode is 25 attached to the anode side, an~ the SUS sub8trate 21 on which pattering has been completed is attached to the cathode side. The temperature of the plating _ _ _ _ _ _ ,, ,,, . , , ,,, . , . , . , _ .

~ 2175~6 solution and the current density are kept at 50 C and 5 A/cm2, respectively. Thus, not only is the nickel layer allowed to grow in the thickness direction of the resist, but also in the diameter direction of the 5 resist pattern, at the same speed. As a result, a preferable diameter is realized for the e~ectlon ori f ice .
Next, referring to Figure 25C, a Dry Film Ordyl SY-318 (product of Tokyo Ohka Kogyo Co., Ltd. ), 10 that is, an ultraviolet sensitlve resin film 24, is laminated on the nickel plated substrate 21.
Then, referring to Figure 25D, a photomask 25 is placed on the dry film 24, and the dry film 24 shielded with the photomask 25 in the predet~rm1 nPd 15 pattern is irradiated with ultraviolet rays; the regions which will be left as the liquid path walls are irradiated with ultraviolet rays. This exposure process iB carried out using an exposing apparatus MPA-600 (product of Canon Inc. ), whereln the rate of ZO the ~ lO~>Ul~ is approximately 600 mJ/cm2.
Next, referring to Figure 25E, the dry film 24 is developed using a developer BMRC-3 (product of Tokyo Ohka Kogyo Co., Ltd. ), which is a mixture of xylene and butyl cellosolve acetate; the llneYr~ cl 25 regions are dissolvea, leaving the regions hardened by the ~.,~o~ule as the walls of the liquid flow paths.
The residue 1~ lnln~ on the surface of the substrate , _ _ _ _ _ _ _ ~ _ . .. . _ _ _ _ . .

,~ 21751 66 $s removed by treating the surface of the ,,uI",Ll~lLe f or approximately 90 seconds with an oYygen plasma ashing apparatus MAS-800 (product of Alcan-Tech Co., Ltd. ) . Next, the exposed regions are further 5 irradiated with ultraviolet rays with a strength of 100 mJ/cm2 for two hours at a temperature of 150 C, being completely hardened. Thus, 15 llm high walls are formed Next, the nickel layer 24 is separated from the SUS substrate 21 by applying ultrasonic vibrations 10 to the SUS substrate 21, yielding a grooved member in the predet~rm;n~fl form.
In this, A; t, the liquid flow path was formed of resin material, but the grooved member may be formed of nickel alone. In the latter case, the is regions of the dry film 24, which are not to become the liquid path walls, are removed in the step illustrated in Figure 25D, and a nickel layer is accumulated by plating on the surface created by the removal of the "non wall" regions. Then, the resist 20 is removed. When the surface of the nickel layer portion of the grooved me~er is placed with gold, the grooved member will be provided with much better solvent resistance.
Figures 26A - 26D are schematic sectional 25 drawings depicting the steps of the liquid e~ection head manuf acturing method in the second embodiment of the present invention.

_ _ _ _ _ _ _ _ _ _ _ .

Referring to Figure 26A, in this embodiment, a 15 ,um thick reslst 101 is placed on a stainless steel ~SUS) 8ubstrate 100, in the pattern of the second liquid f low path .
Next, referring to Figure 26B, a nickel layer is grown on the exposed surface of the SUS substrate 100 by plating, to a thicknes8 of 15 llm, the same thickness as the thickness of the resist 101. As for the plating solution, a mixture of sulfamic acid nickel, stress reducing agent Zero Ohru (product of World Metal Inc. ), boric acid, anti-pitting agent NP
APS (product of World Metal Inc. ), and nickel chloride, i8 used. As for the means for applying an electric field, an electrode is attached to the anode side, and the 8US substrate 21 on which pattering has been completed is attached to the cathode side. The temperature of the plating solution and the current density are kept at 50 C and 5 A/cm2, respectively.
Next, referring to Figure 26C, after the above described plating process is completed, the nickel layer 102 portion is separated from the SUS
substrate by applying ultrasonic vibrations to the SUS
substrate, completing the second liquid flow path with predet-~rm~ned specifications. When the surface of the nickel layer portion is plated with gold after the nickel layer portion 102 is separated, the second lisluid flow path will be provided with higher solvent resistance .
In the meantime, the heater boards comprising electrothermal trPn~ c~s are formed on a silicon wa$er using a manufacturing apparatus similar to a 5 semiconauctor manufacturing apparatus. The wafer on which the heater boards have been formed is cut with a dicing machine, separating individual heater boards as A~rr~h~rl above. The 8eparated heater board 1 is bonded to a TAB tape to provide electrical wiring.
10 Next, referring to Figure 26D, the above described memher comprising the second liquid flow path is precisely positioned on the heater board 1 which has been prepared as described above, and fixed thereto.
During this positioning and fi~ing step, the strength lS with which the member comprising the second liquid flow path is fixed to the heater board 1 only has to be enough to prevent them from displacing from each other when the top plate is bonded thereon. This is because during the later steps, the top plate on which 20 the separation walls have been fixed is placed on the thus assembled heater board, and all ~ ts are f irmly f ixed together using a pressing spring .
In this embodiment, an ultraviolet ray hardening type adhesive (product of GRACE JAPAN
25 Amicon W-300) is coated to the ~oint and is hardened with an ultraviolet radiation apparatus. The rate of exposure is 100 mJJcm2, and the auration of exposure _ _ _ _ _ _ _ _ _ , .. ..

~ 2175166 is approxlmately three seconds.
According to the manufacturing method described in thl6: ' _'i L, not only can the second liquid flow path be highly precisely produced, but 5 also can be positioned without be 'ng misaligned relative to the heat generating member. In addition, the liquid flow path wall is formed of nickel.
Therefore, it is possible to provide a highly reliable and highly alkali resistant head.
Figures 27A - 27D are schematic sectional drawings depicting the steps of the liquid ejection head manufacturing method in the third ~ t of the present invention.
Referring to Figure 27A, a resist 103 is 15 coated on both surfaces of a 15 ym thick stainless steel (SUS) substrate 100 provided with alignment holes or marks 104. As for the resist, PMERP-AR900, a product of Tokyo Ohka Kogyo Co., Ltd., is used.
Next, referring to Figure 27B, the resist 20 coated substrate 100 is exposed using an exposure apparatus MPA-600 (product of Canon Inc. ), and then, the resist 103 is removed from the regions UULL~ fl~ ~L to the second liquid flow paths and the alignment holes 104. The rate of exposure is 800 25 mJ~cm2.
Next, referring to Figure 27C, the SUS
substrate 100 having a patterned resist 103 on both 2~75~66 surfaces is immersed in an etching liquid (water solution of ferric chloride or cupric chloride), etching away the portions not covered by the resist 103, and then, the resist is removed.
NeYt, referring to Figure 27D, the etched SUS
substrate 100 is positioned on the heater board 1, and is fi~ed thereto, completing a liquid eiection head comprising the second liquid flow path 4, in the same manner as the manuf acturing method described in the preceding ~ t.
According to this ~ ., not only can the second liquid flow path be formed with high precision but also can be positioned without becoming misaligned relative to the heater. In addition, the liquid flow path is formed of stainless steel.
Therefore, it is possible to provide a highly reliable as well as highly alkali resistant liquid ejection head .
According to the head manuf acturing method described above, the walls of the second liquid flow path are formed on the element substrate in advance, making it possible to accurately position the electrothermal transducer and the second liquid flow path relative to each other. Further, the second liquid flow path can be formed on a large number of the element substrates collectively plotted on the substrate wafer before the substrate wafer is diced 2~75166 into separate pieces of element substrates.
Therefore, a large number of liquid e~ection heads can be provide at low cost.
Further, in the liquid e~ection head 5 manufactured by the manufacturing method described in this embodiment, the heat generating member and the second liquid flow path are positioned relative to each other with high precision: therefore, the pressure from the bubble generation caused by the heat 10 generation of the electrothermal tr~nq~lrl~r is effectively transmitted, making the head superior in ejection efficiency.
(Liquid Ejection Head Cartridge~
Next, a liquid ejection head cartridge in 15 which the liquid eiection head in accordance with the preciding ~ Ls is mounted, will be rrrri s:F~l y described .
Figure 28 is an exploded schematic view of the liquid e lection head cartridge comprising the 20 aforementioned liquid eiection head. Essentially, the liquid e~ection head cartridge comprises a liquid ejection head portion 200 and a liquid container 80.
The liquid e~ection head portion 200 comprises an element substrate 1, a separation wall 30, a grooved member 50, a liquid container 90, a circuit board (TAB tape~ 70 for supplying an electric signal, and the like. On the element substrate 1, a 2~75766 number of heat generating resistors for applying heat to the bubble generation liquid are aligned. Also on the element substrate 1, a number of functional elements for selectively drlving these heat generating 5 resistors are provide~l. A liquld f low path is formed between the element substrate 1 and the separation wall 30 comprising the flexible member, and the bubble generation liquid flows through this liquid flow path.
The e~ection liquid path (unillustrated), that is, the 10 liqu$d path through which the liquid to be ejected flows, is formed as the separation wall 30, the grooved member 50, and the liquid delivery member 80 are joined. Both liquids are supplied through the liquid delivery member 80, being routed behind the lS 8ubstrate 1.
The liquid container 90 separately contains the liquid such as ink, and the bubble generation liquid for generating bubbles, both of which are delivered to the liquid eJection head. On the 20 exterior surface of the liquid container 90, a positioning member 94 is provided for locating a connecting member which connects the liquid ejection head and the liquid container. The TAB tape 70, which i8 attached after the head portion is positioned on 25 the liquid container 90, is fixed to the surface of the liquid container 90 using a double face adhesive tape. The e~ection liquid is delivered to the first common liquid chamber by way of the e~ection liquid delivery path 92 of the liquid container, the delivery path 84 of the connecting member, and the ejection liquid delivery path of the liquid delivery member 80, 5 in this order. The bubble generation liquid is delivered to the second common liquid chamber by way of the delivery path 93 of the liquid container, the supply path of the connecting member, and the bubble generation liquid path 82 of the liquid delivery 10 member 80, in this order.
In the foregoing, the description was given with reference to a combination of the liquid e~ection head cartridge and the liquid container, which is capable of separately delivering or containing the 15 bubble generation liquid and the ejection liquid when the bubble generation liquid and the e~ection liquid are different. EIowever, when the ejection liquid and the bubble generation liquid are the same, it is llnnf~ RI2i,ry to provide geparate delivery paths and 20 containers for the bubble generation liquid and the ejection liquid.
Incidentally, the liquid container descrlbed above may be refilled after each liquid ig ~ IIIY '.
In order to do 80, it i8 preferable that the liquid 25 container is provided with a liquid filling port.
Further, the liquid e~ection head and the liquid container may be inseparable or separable.

Figure 29 i8 a schematic illustration of a liquid eiecting device used with the above-described liquid e~ecting head. In this ~ , the ejection liquid is ink, and the apparatus is an ink S e~ection recording apparatus. The liquid ejecting device comprises a carriage HC to which the head cartridge comprising a liquid container portion 90 and liquid eiecting head portion 200 which are detachably connectable with each other, is mountable. The 10 carriage HC is reciprocable in a direction of width of the recording material 150 such as a recording sheet or the like fed by a recording material t~ ,,~oL Ling means .
When a driving signal is supplied to the 15 li~uid ejecting means on the carriage from unshown driving signal supply means, the rf~ rrl~n~ liguid is eiected to the r~t~or~ n~ material from the liquid eiecting head in response to the signal.
The liquid e~ecting apparatus of this 20 embodiment comprises a motor 111 as a driving source for driving the recording material transporting means and the carriage, gears 112, 113 for transmitting the power from the driYing source to the carriage, and carriage shaft 115 and 80 on. By the recording device 25 and the liquid eiecting method using this recording device, good prints can be provided by e~ecting the liguid to the various recording material.

Figure 30 is a block diagram for describing the general operation of an ink eiection recording ,~alal u~i which employs the liquid eiection method, and the liquid eiection head, in accordance with the 5 present inventlon.
The recording apparatus receives printing data in the form of a control signal from a host computer 300. The printing data is temporarily stored in an input interface 301 of the printing apparatus, 10 and at the same time, is converted into processable data to be inputted to a CPU 302, which doubles as means for supplying a head driving signal. The CPU
302 processes the aforementioned data inputted to the CPU 302, into printable data (image data), by 15 processing them with the use of peripheral units such as RAMs 304 or the like, following control programs stored in an ROM 303.
Further, in order to record the image data onto an appropriate spot on a recording sheet, the CPU
20 302 ~enerates driving data for driving a driving motor which moves the recording sheet and the recording head in synchronism with the image data. The image data and the motor driving data are transmitted to a head 200 and a driving motor 306 through a head driver 307 25 and a motor driver 305, respectively, which are controlled with the proper timings for forming an image .

~ 2175166 As for recording medium, to which liquid $uch as ink is adhered, and which is usable with a recordlng apparatus such as the one described above, the following can be listed; various sheets of paper;
S OE~P sheets; plastic material used for forming compact disks, Qrni l al plates, or the like; fabric;
metallic material such as aluminum, copper, or the like; leather material such as cow hide, pig hide, gynthetic leather, or the like; lumber material such as solid wood, plywood, and the like; bamboo material;
ceramic material such as tile; and material such as sponge which has a three dimensional structure.
The aforementioned recording apparatus includes a printing apparatus for various sheets of paper or OHP sheet, a recording apparatus for plastic material such as plastic material used for forming a compact disk or the like, a rerr~rnin~ apparatus for metallic plate or the like, a recording apparatus for leather material, a recording apparatus $or lumber, a recording apparatus for ceramic material, a recording apparatus for three dimensional recording medium such as sponge or the like, a teYtile printing apparatus for recording images on fabric, and the like recording apparatuses .
As for the liquid to be used with these liquid e~ection apparatuses, any liquid is usable as long as it i8 compatible with the employed recording 2}75166 medium, and the recording conditions.
( Reco rding System ) Next, an exemplary ink jet recording system will be described, which records images on recording S medium, using, as the recording head, the liquid ejection head in accordance with the present invention .
Figure 31 is a schematic perspective view of an ink jet recording system employing the aforementioned liquid ejection head 201 in accordance with the present invention, and depicts its general structure. The liquid eJection head in this embodiment is a full-line type head, which comprises plural e~ection orifices aligned with a density of 360 dpi 80 as to cover the entire recordable range of the recording medium 150. It comprises iour heads, which are corr~pnn~l~nt to four colors; yellow (Y), magenta (M), cyan (C) and black (Bk). These four heads are fixedly 2~u~,o L~d by a holder 1202, in parallel to each other and with predetermined intervals.
These heads are driven in response to the signals supplied from a head driver 307, which constitutes means for supplying a driving signal to each head.
Each of the four color inks (Y, M, C and Bk) is supplied to a corre~}n,ll~enl head from an ink container 204a, 204b, 205c or 204d. A reference 217~166 --so--numeral 204e designates a bubble generation liquid container from which the bubble generation liquid is delivered to each head.
~elow each head, a head cap 203a, 203b, 203c 5 or 203d i5 disposed, which contains an ink absorbing member composed of sponge or the like. They cover the e~ection orifices of the co~ Ain~ heads, protecting the head8, and also maintaining the head performance, during a non-recording period.
A reference numeral 206 designates a conveyer belt, which con~titutes means for conveying the various recording medium such as those described in the preceding embodiments. The conveyer belt 206 is routed through a predet~rml n-~d path by various 15 rollers, and is driven by a driver roller connected to a motor driver 305.
The ink jet recording system in this F ' oA~- L comprises a pre-printing processing apparatus 251 and a postprinting prorp<2&:t n~ apparatus 20 252, which are disposed on the upstream and downstream sides, respectively, of the ink jet recording apparatus, along the recording medium cull\,ey~lce path.
These processing ~alcll,uses 251 and 252 process the recording medium in various manners before or after 25 recording is ma~e, respectively.
The pre-printillg proce8s and the postprinting process vary Aer~nflin~ on the type of recording _ _ _ _ medium, or the type of lnk. For example, when recording medium composed of metallic material, plastic materlal, ceramic material or the like i8 employed, the recording medium is expo8ed to ultra-S violet rays and ozone before printing, activatlng lts~urf ace .
In a recording material tending to acquire electric charge, such as plastic resin material, the dust tends to deposit on the surface by static 10 electricity, the dust may impede the desired recording. In such a case, the use is made with ioni~er to remove the static charge of the recording material, thus removing the dust from the recording material. When a textile is a recording material, 15 from the standpoint of feathering prevention and lUV~ L of fixing or the like, a pre-processing may ~e effected wherein alkali property substance, water soluble property substance, compoæition polymeric, water soluble property metal salt, urea, or 20 thiourea is applied to the textile. The pre-processing is not limited to this, ano it may be the one to provide the recording materlal with the proper temperature .
On the other hand, the po8t-processing is a 25 process for imparting, to the recording material having received the ink, a heat treatment, ultraviolet radiation pro~ection to promote the fixing of the ink, 2 ~ 75 1 66 or a cleaning for removlng the process material used for the pre-treatment and 1. ~1nln~ because of no reaction .
In this G ' ~ ,, the head is a full line head, but the present invention is of course applicable to a serial type whereln the head is movea along a width of the recording material.
(Head Kit) Hereinafter, a head kit will be described, which comprises the liquid e lection head in accordance with the present invention. Figure 32 is a schematic view of such a head kit. This head kit iæ in the form of a head kit package 501, and contains: a head 510 in accordance with the present invention, which comprises an ink e~ection section 511 for ejecting ink; an ink container 510, that i8, a liquid container which is separable, or nonseparable, from the head; and ink filling means 530, which holds the ink to be filled into the ink container 520.
After the ink in the ink container 520 is completely depleted, the tip 530 (in the form of a hypodermic needle or the like) of the ink filling means is inserted into an air vent 521 of the ink container, the ~unction between the ink container and the head, or a hole drilled through the ink container wall, and the ink within the ink filling means is filled into the ink container through this tip 531.
.. , _ _ . _ . . _ . . .. .. . . _ _ _ _ _ _ When the liquid ejection head, the ink container, the ink filling means, and the like are available in the form of a kit contained in the kit package, the ink can be easily filled into the ink 5 depleted ink container as described above; therefore, recording can be quickly restarted.
In this ~ ' o~li t, the head kit contains the ink filling means. However, it iæ not mandatory for the head kit to contain the ink filling means; the kit 10 may contain an exchangeable type ink container filled with the ink, and a head.
Even though Figure 32 illustrates only the ink filling means for filling the printing ink into the ink container, the head kit may contain means for 15 filling the bubble generation liquid into the bubbie generation liquid container, In a~ldition to the printing ink refllling means.
While the invention has been described with reference to the structures disclosed hereln, it ls 20 not confined to the details set forth and this application is intended to cover such modifications or changes as may come within the purposes of the imp~ Ls or the scope of the following claims.

Claims (97)

1. A liquid ejecting method, comprising:
providing a substrate having a heat generating surface for generating heat for generating a bubble in liquid, the heat generating surface being substantially flush with or smoothly continuous with a surface of the substrate upstream of the heat generating surface;
providing a movable member having a free end and a fulcrum, the movable member and the heat generating surface having a space therebetween;
providing an ejection outlet for ejecting the liquid using the generation of the bubble, the ejection outlet being opposed to the substrate with said movable member interposed therebetween;
disposing the free end of the movable member at a downstream side with respect to a direction of flow of the liquid to the ejection outlet; and wherein the bubble displaces the free end of the movable member, and grows toward the ejection outlet to eject the liquid.

2. A method according to claim 1, wherein the substrate and the plane of the ejection outlet are substantially parallel with each other.

3. A method according to claim 1, wherein the heat generated by the heat generating surface causes film boiling of liquid to create the bubble.

4. A method according to claim 1, wherein the bubble expands toward the ejection outlet beyond an initial position of the movable member.

5. A method according to claim 1, wherein when the movable member is being displaced, the bubble is contacted to the movable member.

6. A method according to claim 1, wherein different liquids are supplied into a space at one side of said movable member and into a space at the other side of said movable member, respectively.

7. A method according to claim 1, wherein the same liquids are supplied into a space at one side of said movable member and into a space at the other side of said movable member, respectively.

8. A liquid ejecting method, comprising:
providing a heat generating surface for generating heat for generating a bubble in liquid, the heat generating surface being substantially flush with or smoothly continuous with a surface of the substrate upstream of the heat generating surface;
providing a movable member having a free end and a fulcrum, the movable member and the heat generating surface having a space therebetween;
providing an ejection outlet for ejecting the liquid using the generation of the bubble, the ejection outlet being opposed to the heat generating surface with said movable member interposed therebetween;
disposing the free end of the movable member at a downstream side with respect to a direction of flow of the liquid to the ejection outlet; and wherein the bubble displaces the free end of the movable member, and grows toward the ejection outlet to eject the liquid.

9. A method according to claim 8, wherein the heat generating surface is in a substrate, and the substrate and the plane of the ejection outlet are substantially parallel with each other.

10. A method according to claim 8, wherein the heat generated by the heat generating surface causes film boiling of liquid to create the bubble.

11. A method according to claim 8, wherein the bubble expands toward the ejection outlet beyond an initial position of the movable member.

12. A method according to claim 8, wherein when the movable member is being displaced, the bubble is contacted to the movable member.

13. A method according to claim 8, wherein different liquids are supplied into a space at one side of said movable member and into a space at the other side of said movable member, respectively.

14. A method according to claim 8, wherein the same liquids are supplied into a space at one side of said movable member and into a space at the other side of said movable member, respectively.

15. A liquid ejection head comprising:
a substrate having a heat generating surface for generating heat for generating a bubble in liquid, the heat generating surface being substantially flush with or smoothly continuous with a surface upstream of the heat generating surface;
a movable member having a free end and a fulcrum, the movable member and the heat generating surface having a space therebetween;
an ejection outlet for ejecting the liquid using the generation of the bubble, the ejection outlet being opposed to the substrate with said movable member interposed therebetween;
an opposing member cooperable with the movable member to direct the bubble toward the ejection outlet, wherein the movable member directs the growing bubble toward the ejection outlet in a direction substantially perpendicular to the heat generating surface.

16. An ejection head according to claim 15, wherein a member defining the ejection outlet and the heat generation surface are substantially parallel with each other.

17. An ejection head according to claim 15, wherein the opposing member is a second movable member having a free end, and the free ends of the movable members are opposed to each other with an elongated gap therebetween.

18. An ejection head according to claim 17, wherein a line perpendicular to the heat generating surface and passing through a center of the heat generating surface passes through substantially a center of the gap.

19. An ejection head according to claim 18, wherein said line penetrates the ejection outlet.

20. An ejection head according to claim 19, wherein said line and a line perpendicular to the ejection outlet and passing through a center of the ejection outlet are substantially overlapped with each other.

21. An ejection head according to claim 15, wherein the opposing member is a wall.

22. An ejection head according to claim 18, wherein said line penetrates the movable member.

23. An ejection head according to claim 18, wherein said first line penetrates the ejection outlet.

24. An ejection head according to claim 23, wherein said first line and a line perpendicular to the ejection outlet and passing through a center of the ejection outlet, are substantially overlapped.

25. An ejection head according to claim 15, wherein liquid flow paths are formed at one side of said movable member and at the other side of said movable member, respectively.

26. An ejection head according to claim 25, wherein the movable member is a part of a separation wall between the liquid flow paths.

27. An ejection head according to claim 25, wherein the liquid flow paths are substantially hermetically separated from each other.

28. An ejection head according to claim 25, wherein different liquids are supplied to the liquid flow paths, respectively.

29. An ejection head according to claim 25, wherein the same liquids are supplied to the liquid flow paths, respectively.

30. An ejection head according to claim 15, wherein the liquid is supplied to the heat generating surface along an inner wall substantially flush with the heat generating surface.

31. An ejection head according to claim 15, wherein an area of the movable member is larger than an area of the heat generating surface.

32. An ejection head according to claim 15, wherein said movable member has a fulcrum portion at a position away from a region of said heat generating surface.

33. An ejection head according to claim 15, wherein the movable member is in the form of a plate.

34. An ejection head according to claim 15, wherein the movable member is of metal.

35. An ejection head according to claim 34, wherein the metal is nickel or gold.

36. An ejection head according to claim 15, wherein the movable member is resin material.

37. An ejection head according to claim 15, wherein the movable member is of ceramic material.

38. An ejection head according to claim 25, further comprising a common liquid chamber for containing the liquid to be supplied to the liquid flow paths.

39. An ejection head according to claim 15, wherein the heat generating surface is of an electrothermal transducer for converting electric energy to heat.

40. An ejection head according to claim 15, wherein the heat generated by the heat generating surface causes film boiling of liquid to create the bubble.

41. A liquid ejection head comprising:
a heat generating surface for generating heat for generating a bubble in liquid, the heat generating surface being substantially flush with or smoothly continuous with a surface upstream of the heat generating surface;
a movable member having a free end and a fulcrum, the movable member and the heat generating surface having a space therebetween;
an ejection outlet for ejecting the liquid using the generation of the bubble, the ejection outlet being opposed to the heat generating surface with the movable member interposed therebetween; and an opposing member cooperable with the movable member to direct the bubble toward the ejection outlet;
wherein the movable member directs the growing bubble toward the ejection outlet in a direction substantially perpendicular to the heat generating surface.

42. An ejection head according to claim 41, wherein the substrate and the plane of the ejection outlet are substantially parallel with each other.

43. An ejection head according to claim 41, wherein the opposing member is a second movable member having a free end, and the free ends of the movable members are opposed to each other with a gap therebetween.

44. An ejection head according to claim 43, wherein a line perpendicular to the heat generating surface and passing through a center of the heat generating surface passes through substantially a center of the gap.

45. An ejection head according to claim 44, wherein said line penetrates the ejection outlet.

46. An ejection head according to claim 45, wherein said line and a line perpendicular to the ejection outlet and passing through a center of the ejection outlet are substantially overlapped with each other.

47. An ejection head according to claim 41, wherein the opposing member is a wall.

48. An ejection head according to claim 44, wherein said line penetrates the movable member.

49. An ejection head according to claim 44, wherein said line penetrates the ejection outlet.

50. An ejection head according to claim 49, wherein said first line and a line perpendicular to the ejection outlet and passing through a center of the ejection outlet, are substantially overlapped.

51. An ejection head according to claim 41, wherein liquid flow paths are formed at one side of said movable member and at the other side of said movable member, respectively.

52. An ejection head according to claim 51, wherein the movable member is a part of a separation wall between the liquid flow paths.

53. An ejection head according to claim 51, wherein the liquid flow paths are substantially hermetically separated from each other.

54. An ejection head according to claim 51, wherein different liquids are supplied to the liquid flow paths, respectively.

55. An ejection head according to claim 51, wherein the same liquids are supplied to the liquid flow paths, respectively.

56. An ejection head according to claim 51, wherein the liquid is supplied to the heat generating surface along an inner wall substantially flush with the heat generating surface.

57. An ejection head according to claim 51, wherein an area of the movable member is larger than an area of the heat generating surface.

58. An ejection head according to claim 51, wherein said movable member has a fulcrum portion at a position away from a region of said heat generating surface.

59. An ejection head according to claim 51, wherein the movable member is in the form of a plate.

60. An ejection head according to claim 51, wherein the movable member is of metal.

61. An ejection head according to claim 60, wherein the metal is nickel or gold.

62. An ejection head according to claim 51, wherein the removable member is resin material.

63. An ejection head according to claim 51, wherein the movable member is of ceramic material.

64. An ejection head according to claim 51, further comprising a common liquid chamber for containing the liquid to be supplied to the liquid flow paths.

65. An ejection head according to claim 41, wherein the heat generating surface is of an electrothermal transducer for converting electric energy to heat.

66. An ejection head according to claim 51, wherein the heat generated by the heat generating surface causes film boiling of liquid to create the bubble.

67. A head cartridge comprising:
a liquid ejection head including;
a substrate having a heat generating surface for generating heat for generating a bubble in liquid, the heat generating surface being substantially flush with or smoothly continuous with a surface of the substrate upstream of the heat generating surface;
a movable member having a free end and a fulcrum, the movable member and the heat generating surface having a space therebetween;

an ejection outlet for ejecting the liquid using the generation of the bubble, the ejection outlet being opposed to the substrate with said movable member interposed therebetween;
an opposing member cooperable with the movable member to direct the bubble toward the ejection outlet, wherein the movable member directs the growing bubble toward the ejection outlet in a direction substantially perpendicular to the heat generating surface; and said head cartridge further comprising:
a liquid containing portion for containing the liquid to be supplied to the liquid ejecting head.

68. A head cartridge according to claim 67, wherein the liquid ejecting head and the liquid containing portion are separable.

69. A head cartridge according to claim 67, wherein the liquid containing portion contains refilled liquid.

70. A head cartridge according to claim 67, wherein the liquid containing portion is provided with a liquid injection port for refilling the liquid.

71. A head cartridge comprising:
a liquid ejection head including;
a heat generating surface for generating heat for generating a bubble in liquid, the heat generating surface being substantially flush with or smoothly continuous with a surface upstream of the heat generating surface;
a movable member having a free end and a fulcrum, the movable member and the heat generating surface having a space therebetween;
an ejection outlet for ejecting the liquid using the generation of the bubble, the ejection outlet being opposed to the heat generating surface with said movable member interposed therebetween;

an opposing member cooperable with the movable member to direct the bubble toward the ejection outlet, wherein the movable member directs the growing bubble toward the ejection outlet in a direction substantially perpendicular to the heat generating surface; and said head cartridge further comprising:
a liquid containing portion for containing the liquid to be supplied to the liquid ejecting head.

72. A head cartridge according to claim 71, wherein the liquid ejecting head and the liquid containing portion are separable.

73. A head cartridge according to claim 71, wherein the liquid containing portion contains refilled liquid.

74. A head cartridge according to claim 71, wherein the liquid containing portion is provided with a liquid injection port for refilling the liquid.

75. A liquid ejection apparatus comprising:
a liquid ejection head including;
a substrate having a heat generating surface for generating heat for generating a bubble in liquid, the heat generating surface being substantially flush with or smoothly continuous with a surface of the substrate upstream of the heat generating surface;
a movable member having a free end and a fulcrum, the movable member and the heat generating surface having a space therebetween;
an ejection outlet for ejecting the liquid using the generation of the bubble, the ejection outlet being opposed to the substrate with said movable member interposed therebetween;
an opposing member cooperable with the movable member to direct the bubble toward the ejection outlet, wherein the movable member directs the growing bubble toward the ejection outlet in a direction substantially perpendicular to the heat generating surface; and said apparatus further comprising:
driving signal supply means for supplying a driving signal for ejecting the liquid.

76. A liquid ejection apparatus comprising:
a liquid ejection head including;
a substrate having a heat generating surface for generating heat for generating a bubble in liquid, the heat generating surface being substantially flush with or smoothly continuous with a surface of the substrate upstream of the heat generating surface;
a movable member having a free end and a fulcrum, the movable member and the heat generating surface having a space therebetween;
an ejection outlet for ejecting the liquid using the generation of the bubble, the ejection outlet being opposed to the substrate with said movable member interposed therebetween;
an opposing member cooperable with the movable member to direct the bubble toward the ejection outlet, wherein the movable member directs the growing bubble toward the ejection outlet in a direction substantially perpendicular to the heat generating surface; and transporting means for transporting a recording material for receiving the liquid ejected from the liquid ejecting head.

77. A liquid ejection apparatus according to claim 76, wherein a plurality of colors of recording liquids are ejected from the liquid ejecting head to effect color recording on a recording material.

78. A liquid ejection apparatus according to claim 76, wherein a plurality of such ejection outlets are arranged covering an entire width of the recording material.

79. A liquid ejection apparatus comprising:
a liquid ejection head including;
a heat generating surface for generating heat for generating a bubble in liquid, the heat generating surface being substantially flush with or smoothly continuous with a surface upstream of the heat generating surface;
a movable member having a free end and a fulcrum, the movable member and the heat generating surface having a space therebetween;
an ejection outlet for ejecting the liquid using the generation of the bubble, the ejection outlet being opposed to the heat generating surface with said movable member interposed therebetween;
an opposing member cooperable with the movable member to direct the bubble toward the ejection outlet, wherein the movable member directs the growing bubble toward the ejection outlet in a direction substantially perpendicular to the heat generating surface; and said apparatus further comprising:
driving signal supply means for supplying a driving signal for ejecting the liquid.

80. A liquid ejection apparatus comprising:
a liquid ejection head including;
a heat generating surface for generating heat for generating a bubble in liquid, the heat generating surface being substantially flush with or smoothly continuous with a surface upstream of the heat generating surface;
a movable member having a free end and a fulcrum, the movable member and the heat generating surface having a space therebetween;
an ejection outlet for ejecting the liquid using the generation of the bubble, the ejection outlet being opposed to the heat generating surface with said movable member interposed therebetween;

an opposing member cooperable with the movable member to direct the bubble toward the ejection outlet, wherein the movable member directs the growing bubble toward the ejection outlet in a direction substantially perpendicular to the heat generating surface; and transporting means for transporting a recording material for receiving the liquid ejected from the liquid ejecting head.

81. A liquid ejection apparatus according to claim 80, wherein a plurality of colors of recording liquids are ejected from the liquid ejecting head to effect color recording on a recording material.

82. A liquid ejection apparatus according to claim 80, wherein a plurality of such ejection outlets are arranged covering an entire width of the recording material.

83. A recording system comprising:
a liquid ejection apparatus as defined in any one of claims 75, 76, 79 and 80; and a post-processing device for promoting fixing of the liquid on the recording material.

84. A recording system comprising:
a liquid ejection apparatus as defined in any one of claims 75, 76, 79 and 80; and a pre-processing device for promoting fixing of the liquid on the recording material.

85. A head kit comprising:
a liquid ejection head including;
a substrate having a heat generating surface for generating heat for generating a bubble in liquid, the heat generating surface being substantially flush with or smoothly continuous with a surface of the substrate upstream of the heat generating surface;

a movable member having a free end and a fulcrum, the movable member and the heat generating surface having a space therebetween;

an ejection outlet for ejecting the liquid using the generation of the bubble, the ejection outlet being opposed to the substrate with said movable member interposed therebetween;

an opposing member cooperable with the movable member to direct the bubble toward the ejection outlet, wherein the movable member directs the growing bubble toward the ejection outlet in a direction substantially perpendicular to the heat generating surface; and a liquid container containing the liquid to be supplied to the liquid ejecting head.

86. A head kit according to claim 85, further comprising liquid filling means for filling the liquid to supply.

87. A head kit comprising:
a liquid ejection head including;
a substrate having a heat generating surface for generating heat for generating a bubble in liquid, the heat generating surface being substantially flush with or smoothly continuous with a surface of the substrate upstream of the heat generating surface;
a movable member having a free end and a fulcrum, the movable member and the heat generating surface having a space therebetween;
an ejection outlet for ejecting the liquid using the generation of the bubble, the ejection outlet being opposed to the heat generating surface with said movable member interposed therebetween;
an opposing member cooperable with the movable member to direct the bubble toward the ejection outlet, wherein the movable member directs the growing bubble toward the ejection outlet in a direction substantially perpendicular to the heat generating surface; and a liquid container containing the liquid to be supplied to the liquid ejecting head.

88. A liquid ejecting method, comprising:
providing a substrate having a heat generating surface for generating heat for generating a bubble in liquid, the heat generating surface being substantially flush with or smoothly continuous with a surface of the substrate upstream of the heat generating surface;
providing a movable member having a free end and a fulcrum, the movable member and the heat generating surface having a space therebetween;
providing an ejection outlet member having an ejection outlet for ejecting the liquid using the generation of the bubble, the ejection outlet being opposed to the substrate with said movable member interposed therebetween;
wherein the ejection outlet member and the substrate define a liquid path therebetween and do not cross each other in the path;
disposing the free end of the movable member at a downstream side with respect to a direction of flow of the liquid to the ejection outlet; and wherein the bubble displaces the free end of the movable member, and grows toward the ejection outlet to eject the liquid.

89. A method according to claim 88, wherein the movable member has a fixed end which is disposed upstream with respect to a direction of flow of the liquid.

90. A method according to claim 88, wherein when the movable member is displaced by the bubble, the bubble expands under the free end of the movable member.

91. A liquid ejection head comprising:
a substrate having a heat generating surface for generating heat for generating a bubble in liquid, the heat generating surface being substantially flush with or smoothly continuous with a surface of the substrate upstream of the heat generating surface;
a movable member having a free end and a fulcrum, the movable member and the heat generating surface having a space therebetween;
an ejection outlet member having an ejection outlet for ejecting the liquid using the generation of the bubble, the ejection outlet being opposed to the substrate with said movable member interposed therebetween;
wherein the ejection outlet member and the substrate define a liquid path therebetween and do not cross each other in the path;
an opposing member cooperable with the movable member to direct the bubble toward the ejection outlet, wherein the movable member directs the growing bubble toward the ejection outlet in a direction substantially perpendicular to the heat generating surface;
the heat generated by the heat generating surface causes film boiling of liquid to create the bubble.

92. A liquid ejection head according to claim 91, wherein the movable member has a fixed end which is disposed upstream with respect to a direction of flow of the liquid.

93. A liquid ejection head according to claim 91, wherein when the movable member is displaced by the bubble, the bubble expands under the free end of the movable member.

94. An ejection head according to claim 91, wherein the opposing member is a second movable member having a free end, and the free ends of the movable members are opposed to each other with a gap therebetween.

95. An ejection head according to claim 91, wherein the opposing member is a wall.

96. A liquid ejection head according to claim 41, wherein said heat generating element includes a resistance layer and a pair of electrodes connected to the resistance layer, and said heat generating surface is disposed between the electrodes.

97. A liquid ejection head according to claim 96, wherein said heat generating element further includes a protection layer for protecting the resistance layer and the pair of electrodes.