CA2212639A1 - Substrate system for optoelectronic/microwave circuits - Google Patents
Substrate system for optoelectronic/microwave circuitsInfo
- Publication number
- CA2212639A1 CA2212639A1 CA002212639A CA2212639A CA2212639A1 CA 2212639 A1 CA2212639 A1 CA 2212639A1 CA 002212639 A CA002212639 A CA 002212639A CA 2212639 A CA2212639 A CA 2212639A CA 2212639 A1 CA2212639 A1 CA 2212639A1
- Authority
- CA
- Canada
- Prior art keywords
- substrate
- optoelectronic
- microwave
- substrate system
- circuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
Abstract
A low-loss substrate system is provided for carrying and interconnecting optoelectronic/microwave circuits. The system includes a high-resistivity substrate, e.g., silicon of resistivity >1x10 3 ohm-centimeter. A dielectric layer, e.g., silicon dioxide, is preferably deposited over at least a portion of the substrate. Low-loss microwave transmission members and passive microwave components, e.g:, capacitors and spiral inductors, can be fabricated directly on the dielectric layer with thin-film techniques. Optoelectronic and microwave integrated circuits are preferably mounted on the substrate system with solder bumps and bonding pads.
Other portions of the substrate can define grooves for receiving optical fibers. To enhance optical alignment, the grooves and bonding pads are preferably located with photolithographic techniques. The substrate system is especially suited for optoelectronic/microwave circuits that are realized with hybrid integration structures.
Other portions of the substrate can define grooves for receiving optical fibers. To enhance optical alignment, the grooves and bonding pads are preferably located with photolithographic techniques. The substrate system is especially suited for optoelectronic/microwave circuits that are realized with hybrid integration structures.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/591,854 US5611008A (en) | 1996-01-26 | 1996-01-26 | Substrate system for optoelectronic/microwave circuits |
US08/591,854 | 1996-01-26 | ||
PCT/US1997/001090 WO1997027508A1 (en) | 1996-01-26 | 1997-01-24 | Substrate system for optoelectronic/microwave circuits |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2212639A1 true CA2212639A1 (en) | 1997-07-31 |
CA2212639C CA2212639C (en) | 2003-04-08 |
Family
ID=24368227
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002212639A Expired - Lifetime CA2212639C (en) | 1996-01-26 | 1997-01-24 | Substrate system for optoelectronic/microwave circuits |
Country Status (7)
Country | Link |
---|---|
US (1) | US5611008A (en) |
EP (1) | EP0817983A1 (en) |
JP (1) | JPH10504663A (en) |
KR (1) | KR19980703337A (en) |
CA (1) | CA2212639C (en) |
IL (1) | IL121717A0 (en) |
WO (1) | WO1997027508A1 (en) |
Families Citing this family (68)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3028776B2 (en) * | 1996-09-27 | 2000-04-04 | 日本電気株式会社 | OEIC for parallel optical reception |
US6002375A (en) * | 1997-09-02 | 1999-12-14 | Motorola, Inc. | Multi-substrate radio-frequency circuit |
JPH11109184A (en) | 1997-09-30 | 1999-04-23 | Kyocera Corp | Optical device mounting base and optical module |
US5870517A (en) * | 1997-10-07 | 1999-02-09 | Integrated Device Technology, Inc. | Package including self-aligned laser diode and method of aligning a laser diode |
US5987196A (en) * | 1997-11-06 | 1999-11-16 | Micron Technology, Inc. | Semiconductor structure having an optical signal path in a substrate and method for forming the same |
JP4019538B2 (en) | 1998-03-16 | 2007-12-12 | 住友電気工業株式会社 | Optical module substrate and optical module |
US6159817A (en) * | 1998-05-07 | 2000-12-12 | Electro-Films Incorporated | Multi-tap thin film inductor |
US6466349B1 (en) * | 1998-05-14 | 2002-10-15 | Hughes Electronics Corporation | Integrated optical transmitter |
JP2000047055A (en) * | 1998-07-28 | 2000-02-18 | Japan Aviation Electronics Industry Ltd | Optical waveguide device and its production |
US6690845B1 (en) | 1998-10-09 | 2004-02-10 | Fujitsu Limited | Three-dimensional opto-electronic modules with electrical and optical interconnections and methods for making |
US6611635B1 (en) | 1998-10-09 | 2003-08-26 | Fujitsu Limited | Opto-electronic substrates with electrical and optical interconnections and methods for making |
US6343171B1 (en) | 1998-10-09 | 2002-01-29 | Fujitsu Limited | Systems based on opto-electronic substrates with electrical and optical interconnections and methods for making |
US6785447B2 (en) | 1998-10-09 | 2004-08-31 | Fujitsu Limited | Single and multilayer waveguides and fabrication process |
US6845184B1 (en) | 1998-10-09 | 2005-01-18 | Fujitsu Limited | Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making |
US6684007B2 (en) | 1998-10-09 | 2004-01-27 | Fujitsu Limited | Optical coupling structures and the fabrication processes |
US6706546B2 (en) | 1998-10-09 | 2004-03-16 | Fujitsu Limited | Optical reflective structures and method for making |
US6342960B1 (en) * | 1998-12-18 | 2002-01-29 | The Boeing Company | Wavelength division multiplex transmitter |
WO2001033272A1 (en) * | 1999-11-01 | 2001-05-10 | Cielo Communications, Inc. | Optical device using chip-on-board technology |
US6285043B1 (en) * | 1999-11-01 | 2001-09-04 | The Boeing Company | Application-specific optoelectronic integrated circuit |
US6362525B1 (en) | 1999-11-09 | 2002-03-26 | Cypress Semiconductor Corp. | Circuit structure including a passive element formed within a grid array substrate and method for making the same |
JP2001274528A (en) | 2000-01-21 | 2001-10-05 | Fujitsu Ltd | Inter-substrate transfer method for thin film device |
JP4060023B2 (en) * | 2000-03-28 | 2008-03-12 | 沖電気工業株式会社 | Optical waveguide transceiver module |
US7046868B2 (en) | 2000-03-28 | 2006-05-16 | Oki Electric Industry Co., Ltd. | Optical waveguide transmitter-receiver module |
US6180445B1 (en) | 2000-04-24 | 2001-01-30 | Taiwan Semiconductor Manufacturing Company | Method to fabricate high Q inductor by redistribution layer when flip-chip package is employed |
JP2002050821A (en) * | 2000-07-31 | 2002-02-15 | Kyocera Corp | Optical board assembly and optical module using it |
US20020043551A1 (en) * | 2000-08-25 | 2002-04-18 | Axsun Technologies, Inc. | Solid-phase welded optical element attach process |
DE20114544U1 (en) | 2000-12-04 | 2002-02-21 | Cascade Microtech Inc | wafer probe |
US6645790B2 (en) | 2001-01-03 | 2003-11-11 | Anadigics, Inc. | System and method for prototyping and fabricating complex microwave circuits |
JP3722279B2 (en) * | 2001-01-26 | 2005-11-30 | 日本電気株式会社 | Optical transceiver module |
US6850144B1 (en) | 2001-03-30 | 2005-02-01 | Intel Corporation | Coil for use on a substrate |
US6490379B2 (en) | 2001-05-07 | 2002-12-03 | Corning Incorporated | Electrical transmission frequency of SiOB |
US6639461B1 (en) | 2001-08-30 | 2003-10-28 | Sierra Monolithics, Inc. | Ultra-wideband power amplifier module apparatus and method for optical and electronic communications |
US6549106B2 (en) | 2001-09-06 | 2003-04-15 | Cascade Microtech, Inc. | Waveguide with adjustable backshort |
US6704488B2 (en) * | 2001-10-01 | 2004-03-09 | Guy P. Lavallee | Optical, optoelectronic and electronic packaging platform, module using the platform, and methods for producing the platform and the module |
US6574399B2 (en) * | 2001-11-02 | 2003-06-03 | Corning Incorporated | Ceramic waferboard for integration of optical/optoelectronic/electronic components |
US6640021B2 (en) | 2001-12-11 | 2003-10-28 | International Business Machines Corporation | Fabrication of a hybrid integrated circuit device including an optoelectronic chip |
GB0201969D0 (en) * | 2002-01-29 | 2002-03-13 | Qinetiq Ltd | Integrated optics devices |
JP3950694B2 (en) * | 2002-01-29 | 2007-08-01 | 株式会社ルネサステクノロジ | Optical transmission module |
WO2003069389A1 (en) * | 2002-02-14 | 2003-08-21 | Silex Microsystems Ab | Three dimensional alignment method and system |
US7141450B2 (en) * | 2002-04-08 | 2006-11-28 | Lucent Technologies Inc. | Flip-chip alignment method |
US6907178B2 (en) * | 2002-06-13 | 2005-06-14 | Steve Lerner | Optoelectronic assembly with embedded optical and electrical components |
US7057404B2 (en) | 2003-05-23 | 2006-06-06 | Sharp Laboratories Of America, Inc. | Shielded probe for testing a device under test |
JP2007517231A (en) | 2003-12-24 | 2007-06-28 | カスケード マイクロテック インコーポレイテッド | Active wafer probe |
US7306378B2 (en) * | 2004-05-06 | 2007-12-11 | Intel Corporation | Method and apparatus providing an electrical-optical coupler |
DE202005021435U1 (en) | 2004-09-13 | 2008-02-28 | Cascade Microtech, Inc., Beaverton | Double-sided test setups |
US7656172B2 (en) | 2005-01-31 | 2010-02-02 | Cascade Microtech, Inc. | System for testing semiconductors |
US7535247B2 (en) | 2005-01-31 | 2009-05-19 | Cascade Microtech, Inc. | Interface for testing semiconductors |
US7782921B2 (en) * | 2005-03-28 | 2010-08-24 | Intel Corporation | Integrated optical detector in semiconductor reflector |
US20060231919A1 (en) * | 2005-04-15 | 2006-10-19 | Blacka Robert J | Passive microwave device and method for producing the same |
US7764072B2 (en) | 2006-06-12 | 2010-07-27 | Cascade Microtech, Inc. | Differential signal probing system |
US7403028B2 (en) | 2006-06-12 | 2008-07-22 | Cascade Microtech, Inc. | Test structure and probe for differential signals |
US7723999B2 (en) | 2006-06-12 | 2010-05-25 | Cascade Microtech, Inc. | Calibration structures for differential signal probing |
KR100777967B1 (en) * | 2006-09-29 | 2007-11-21 | 한국전자통신연구원 | Coplanar waveguide cancelling reflection-loss at discontinuous section and optical telecommunication module using the coplanar waveguide |
US7602027B2 (en) * | 2006-12-29 | 2009-10-13 | Semiconductor Components Industries, L.L.C. | Semiconductor component and method of manufacture |
WO2008112077A1 (en) * | 2007-03-14 | 2008-09-18 | Lucent Technologies Inc. | High speed optoelectronic receiver |
US7917042B2 (en) * | 2007-06-29 | 2011-03-29 | Alcatel-Lucent Usa Inc. | High speed optoelectronic receiver |
US7876114B2 (en) | 2007-08-08 | 2011-01-25 | Cascade Microtech, Inc. | Differential waveguide probe |
US8410806B2 (en) | 2008-11-21 | 2013-04-02 | Cascade Microtech, Inc. | Replaceable coupon for a probing apparatus |
US8530821B2 (en) | 2010-06-08 | 2013-09-10 | International Business Machines Corporation | Low distortion high bandwidth adaptive transmission line for integrated photonics applications |
MX338930B (en) * | 2012-03-05 | 2016-05-06 | Nanoprec Products Inc | Coupling device having a structured reflective surface for coupling input/output of an optical fiber. |
US20160274318A1 (en) | 2012-03-05 | 2016-09-22 | Nanoprecision Products, Inc. | Optical bench subassembly having integrated photonic device |
US9520547B2 (en) * | 2013-03-15 | 2016-12-13 | International Business Machines Corporation | Chip mode isolation and cross-talk reduction through buried metal layers and through-vias |
US9219298B2 (en) | 2013-03-15 | 2015-12-22 | International Business Machines Corporation | Removal of spurious microwave modes via flip-chip crossover |
FR3007589B1 (en) | 2013-06-24 | 2015-07-24 | St Microelectronics Crolles 2 | PHOTONIC INTEGRATED CIRCUIT AND METHOD OF MANUFACTURE |
US10068181B1 (en) | 2015-04-27 | 2018-09-04 | Rigetti & Co, Inc. | Microwave integrated quantum circuits with cap wafer and methods for making the same |
US11121301B1 (en) | 2017-06-19 | 2021-09-14 | Rigetti & Co, Inc. | Microwave integrated quantum circuits with cap wafers and their methods of manufacture |
RU181218U1 (en) * | 2017-12-28 | 2018-07-06 | федеральное государственное автономное образовательное учреждение высшего образования "Санкт-Петербургский национальный исследовательский университет информационных технологий, механики и оптики" (Университет ИТМО) | High-frequency photodetector module |
US11714142B2 (en) | 2020-12-11 | 2023-08-01 | International Business Machines Corporation | Flux line filter |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4904036A (en) * | 1988-03-03 | 1990-02-27 | American Telephone And Telegraph Company, At&T Bell Laboratories | Subassemblies for optoelectronic hybrid integrated circuits |
GB9014639D0 (en) * | 1990-07-02 | 1990-08-22 | British Telecomm | Optical component packaging |
US5138436A (en) * | 1990-11-16 | 1992-08-11 | Ball Corporation | Interconnect package having means for waveguide transmission of rf signals |
DE4112471A1 (en) * | 1991-03-02 | 1992-10-22 | Ant Nachrichtentech | Guide for optical and electric conductors into housing - has buffer layer service as base of electric conductors and surface mount components under hermetic seal |
GB2255672B (en) * | 1991-05-10 | 1994-11-30 | Northern Telecom Ltd | Opto-electronic components |
JPH05251629A (en) * | 1992-03-05 | 1993-09-28 | Hitachi Ltd | Hybrid semiconductor integrated circuit |
JP2790033B2 (en) * | 1993-04-07 | 1998-08-27 | 松下電器産業株式会社 | Semiconductor device |
EP1083450B1 (en) * | 1993-08-09 | 2004-10-27 | Nippon Telegraph And Telephone Corporation | Opto-electronic hybrid integration platform, optical sub-module |
US5500910A (en) * | 1994-06-30 | 1996-03-19 | The Whitaker Corporation | Passively aligned holographic WDM |
-
1996
- 1996-01-26 US US08/591,854 patent/US5611008A/en not_active Expired - Lifetime
-
1997
- 1997-01-24 IL IL12171797A patent/IL121717A0/en unknown
- 1997-01-24 JP JP9526998A patent/JPH10504663A/en active Pending
- 1997-01-24 WO PCT/US1997/001090 patent/WO1997027508A1/en not_active Application Discontinuation
- 1997-01-24 CA CA002212639A patent/CA2212639C/en not_active Expired - Lifetime
- 1997-01-24 KR KR1019970706742A patent/KR19980703337A/en not_active Application Discontinuation
- 1997-01-24 EP EP97905605A patent/EP0817983A1/en not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
JPH10504663A (en) | 1998-05-06 |
WO1997027508A1 (en) | 1997-07-31 |
IL121717A0 (en) | 1998-02-22 |
CA2212639C (en) | 2003-04-08 |
EP0817983A1 (en) | 1998-01-14 |
KR19980703337A (en) | 1998-10-15 |
US5611008A (en) | 1997-03-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CA2212639A1 (en) | Substrate system for optoelectronic/microwave circuits | |
Schares et al. | Terabus: Terabit/second-class card-level optical interconnect technologies | |
CA2129762A1 (en) | Opto-Electronic Hybrid Integration Platform, Optical Sub-Module, Opto-Electronic Hybrid Integration Circuit, and Process for Fabricating Platform | |
US5898806A (en) | Optical interconnection circuit structure | |
US20060177173A1 (en) | Vertical stacking of multiple integrated circuits including SOI-based optical components | |
EP0613182B1 (en) | High power capacity optical receiver apparatus and method employing distributed photodetectors | |
WO2003026060A1 (en) | High-frequency module substrate device | |
GB2208943A (en) | Aligning optical components on blocks having solder pad arrays | |
GB2288074B (en) | Ball grid array arrangement | |
CN207650434U (en) | Photonic integrated circuits | |
US6495382B2 (en) | Application-specific optoelectronic integrated circuit | |
CA2246610A1 (en) | Non-linear optical waveguide with differing crystallographic orientations achieved by wafer bonding | |
CN102906632B (en) | The transmission line with inductive load of integrated photon application | |
EP0683519A3 (en) | A hybrid IC | |
ES2139841T3 (en) | PLATE DEVICE WITH INDUCTOR. | |
EP0154431B1 (en) | Integrated circuit chip assembly | |
CN108267820A (en) | A kind of silicon-based photonics integration structure and preparation method | |
KR20080048429A (en) | A multi-chip electronic circuit module and a method of manufacturing | |
DANIEL | Substrate system for optoelectronic/microwave circuits | |
EP0614221A1 (en) | Integrated transmission line structure | |
KR100317397B1 (en) | Architecture of a free-space optical interconnection module | |
JP4640733B2 (en) | Semiconductor device | |
CA2121772A1 (en) | Power Supply Structure for Multichip Package | |
CN109669243A (en) | Photonic integrated circuits | |
JP3716951B2 (en) | Method for manufacturing hybrid optical integrated circuit |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
MKEX | Expiry |
Effective date: 20170124 |