CA2230065A1 - Anti-tamper bond wire shield for an integrated circuit - Google Patents
Anti-tamper bond wire shield for an integrated circuitInfo
- Publication number
- CA2230065A1 CA2230065A1 CA002230065A CA2230065A CA2230065A1 CA 2230065 A1 CA2230065 A1 CA 2230065A1 CA 002230065 A CA002230065 A CA 002230065A CA 2230065 A CA2230065 A CA 2230065A CA 2230065 A1 CA2230065 A1 CA 2230065A1
- Authority
- CA
- Canada
- Prior art keywords
- bond wire
- active component
- integrated circuit
- tamper
- processor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/70—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
- G06F21/86—Secure or tamper-resistant housings
- G06F21/87—Secure or tamper-resistant housings by means of encapsulation, e.g. for integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
- G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
- G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
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- G—PHYSICS
- G07—CHECKING-DEVICES
- G07F—COIN-FREED OR LIKE APPARATUS
- G07F7/00—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus
- G07F7/08—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus by coded identity card or credit card or other personal identification means
- G07F7/0806—Details of the card
- G07F7/0813—Specific details related to card security
- G07F7/082—Features insuring the integrity of the data on or in the card
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/24—Memory cell safety or protection circuits, e.g. arrangements for preventing inadvertent reading or writing; Status cells; Test cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/57—Protection from inspection, reverse engineering or tampering
- H01L23/576—Protection from inspection, reverse engineering or tampering using active circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
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- H—ELECTRICITY
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/4813—Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/01005—Boron [B]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01013—Aluminum [Al]
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- H01L2924/01014—Silicon [Si]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01015—Phosphorus [P]
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- H01L2924/01047—Silver [Ag]
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- H01L2924/01074—Tungsten [W]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01079—Gold [Au]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
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- H01L2924/14—Integrated circuits
- H01L2924/143—Digital devices
- H01L2924/1433—Application-specific integrated circuit [ASIC]
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Abstract
An anti-tamper shield for an integrated circuit (IC) includes a bond wire which passes through a protective layer such as an epoxy encapsulating layer of the IC. The bond wire carries a signal, such as a steady state current, which allows an active component of the IC, such as a secure processor, to function. The bond wire is carried within and/or proximate to the encapsulating layer such that a decapsulation of the IC will cause a rupture of the electrically conductive member, thereby rendering the processor non-functional. The bond wire may be coupled to the processor in a variety of configurations, including the use of internal or external bond pads, lead frame contacts, and/or directly to a computer board on which the IC
is carried. A metallic shield layer may be located between the active component and a top portion, of the encapsulating layer to prevent a pirate from using an electron, microscope, for example, to survey the active component region.
is carried. A metallic shield layer may be located between the active component and a top portion, of the encapsulating layer to prevent a pirate from using an electron, microscope, for example, to survey the active component region.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/804,792 US5861662A (en) | 1997-02-24 | 1997-02-24 | Anti-tamper bond wire shield for an integrated circuit |
US08/804,792 | 1997-02-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2230065A1 true CA2230065A1 (en) | 1998-08-24 |
CA2230065C CA2230065C (en) | 2005-06-28 |
Family
ID=25189846
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002230065A Expired - Fee Related CA2230065C (en) | 1997-02-24 | 1998-02-20 | Anti-tamper bond wire shield for an integrated circuit |
Country Status (7)
Country | Link |
---|---|
US (1) | US5861662A (en) |
EP (1) | EP0860882A3 (en) |
JP (1) | JPH10294325A (en) |
KR (1) | KR19980071653A (en) |
CN (1) | CN1200570A (en) |
CA (1) | CA2230065C (en) |
TW (1) | TW388942B (en) |
Families Citing this family (126)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5880523A (en) * | 1997-02-24 | 1999-03-09 | General Instrument Corporation | Anti-tamper integrated circuit |
TW399319B (en) * | 1997-03-19 | 2000-07-21 | Hitachi Ltd | Semiconductor device |
US6104280A (en) | 1997-10-20 | 2000-08-15 | Micron Technology, Inc. | Method of manufacturing and testing an electronic device, and an electronic device |
US6043745A (en) * | 1997-11-13 | 2000-03-28 | Micron Technology, Inc. | Electronic devices and methods of forming electronic devices |
US5920112A (en) * | 1998-04-07 | 1999-07-06 | Micro Networks Corporation | Circuit including a corral for containing a protective coating, and method of making same |
US6127194A (en) * | 1998-12-09 | 2000-10-03 | Advanced Micro Devices, Inc. | Package removal for FBGA devices |
US6241907B1 (en) * | 1998-12-09 | 2001-06-05 | Advanced Micro Devices, Inc. | Method and system for providing a package for decapsulating a chip-scale package |
CA2371791A1 (en) | 1999-02-12 | 2000-08-17 | Mack Hicks | System and method for providing certification-related and other services |
DE19913326A1 (en) * | 1999-03-24 | 2000-10-05 | Giesecke & Devrient Gmbh | Device for checking the authenticity of a portable data carrier |
EP1041482A1 (en) | 1999-03-26 | 2000-10-04 | Siemens Aktiengesellschaft | Tamperproof integrated circuit |
JP3515012B2 (en) * | 1999-04-23 | 2004-04-05 | シャープ株式会社 | Semiconductor device and manufacturing method thereof |
JP4470242B2 (en) * | 1999-04-23 | 2010-06-02 | ソニー株式会社 | Semiconductor memory card |
US7030466B1 (en) | 1999-05-03 | 2006-04-18 | United Microelectronics Corporation | Intermediate structure for making integrated circuit device and wafer |
US7179740B1 (en) | 1999-05-03 | 2007-02-20 | United Microelectronics Corporation | Integrated circuit with improved interconnect structure and process for making same |
US6429509B1 (en) | 1999-05-03 | 2002-08-06 | United Microelectronics Corporation | Integrated circuit with improved interconnect structure and process for making same |
US6387206B1 (en) | 1999-08-17 | 2002-05-14 | Advanced Micro Devices, Inc. | Method and system for plastic package decapsulation of electronic devices |
US20020029200A1 (en) | 1999-09-10 | 2002-03-07 | Charles Dulin | System and method for providing certificate validation and other services |
CA2384242A1 (en) * | 1999-09-24 | 2001-04-05 | Mary Mckenney | System and method for providing payment services in electronic commerce |
FR2801999A1 (en) * | 1999-12-01 | 2001-06-08 | Gemplus Card Int | Smart card with integrated circuit chips includes additional conductive mesh providing protection against fraudulent access to chips |
JP2001185578A (en) * | 1999-12-24 | 2001-07-06 | Toshiba Corp | Semiconductor device |
JP3557990B2 (en) * | 2000-03-09 | 2004-08-25 | ソニーケミカル株式会社 | Information recording tag |
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GB0012478D0 (en) * | 2000-05-24 | 2000-07-12 | Ibm | Intrusion detection mechanism for cryptographic cards |
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US7000105B2 (en) * | 2000-09-08 | 2006-02-14 | Identrus, Llc | System and method for transparently providing certificate validation and other services within an electronic transaction |
EP1325599A1 (en) * | 2000-09-08 | 2003-07-09 | Guy S. Tallent | System and method for providing authorization and other services |
AU2001290377A1 (en) * | 2000-09-08 | 2002-03-22 | Aurium Systems Limited | Apparatus and method for securing electronic information |
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US6982642B1 (en) | 2000-11-20 | 2006-01-03 | International Business Machines Corporation | Security cloth design and assembly |
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US7296299B2 (en) | 2001-07-03 | 2007-11-13 | Hewlett-Packard Development Company, L.P. | Tamper-evident and/or tamper-resistant electronic components |
US7065656B2 (en) * | 2001-07-03 | 2006-06-20 | Hewlett-Packard Development Company, L.P. | Tamper-evident/tamper-resistant electronic components |
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US7640658B1 (en) | 2005-10-18 | 2010-01-05 | Teledyne Technologies Incorporated | Methods for forming an anti-tamper pattern |
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- 1998-02-21 EP EP98103099A patent/EP0860882A3/en not_active Withdrawn
- 1998-02-24 CN CN98107718A patent/CN1200570A/en active Pending
- 1998-02-24 KR KR1019980005771A patent/KR19980071653A/en not_active IP Right Cessation
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CN1200570A (en) | 1998-12-02 |
EP0860882A3 (en) | 1999-08-18 |
TW388942B (en) | 2000-05-01 |
JPH10294325A (en) | 1998-11-04 |
EP0860882A2 (en) | 1998-08-26 |
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