CA2358233A1 - Differential thermal analysis sensor - Google Patents

Differential thermal analysis sensor Download PDF

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Publication number
CA2358233A1
CA2358233A1 CA002358233A CA2358233A CA2358233A1 CA 2358233 A1 CA2358233 A1 CA 2358233A1 CA 002358233 A CA002358233 A CA 002358233A CA 2358233 A CA2358233 A CA 2358233A CA 2358233 A1 CA2358233 A1 CA 2358233A1
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CA
Canada
Prior art keywords
sensor
microstructure
temperature sensor
temperature
heater
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002358233A
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French (fr)
Other versions
CA2358233C (en
Inventor
Robert E. Higashi
Barrett E. Cole
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Honeywell International Inc
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Individual
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Publication of CA2358233A1 publication Critical patent/CA2358233A1/en
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Publication of CA2358233C publication Critical patent/CA2358233C/en
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Expired - Fee Related legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
    • G01N25/48—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity on solution, sorption, or a chemical reaction not involving combustion or catalytic oxidation
    • G01N25/4846—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity on solution, sorption, or a chemical reaction not involving combustion or catalytic oxidation for a motionless, e.g. solid sample
    • G01N25/4866—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity on solution, sorption, or a chemical reaction not involving combustion or catalytic oxidation for a motionless, e.g. solid sample by using a differential method
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/18—Investigating or analyzing materials by the use of thermal means by investigating thermal conductivity

Abstract

A sensor having an active sensing material exposed to the substance to be detected and an active reference material that is shielded from the substance to be detected. Thermocouples having a set of junctions proximate to the active sensing material and another set of junctions to the active reference material for measuring the temperatures at the respective materials. The junctions are connected differentially in that a difference of the two temperatures is measured. A heater is proximate and common to the two materials. Heat pulses may be applied to the materials via the heater and the temperatures are measured. If ambient factors or substances affect the active sensing material, its thermal response will be different than that of the active reference material, and a differential pulse-like indication of temperature will be detected. This indication will have certain characteristics of amplitude, shape and time, which indicate an identification of the type and concentration of substance detected by the sensor.

Claims (31)

1. A differential thermal analysis sensor comprising:
a substrate having a pit;
a first dielectric layer proximate to the pit;
a heating element formed on said first dielectric layer;
a second dielectric layer formed on said heating element and said first dielectric layer;
a first set of thermocouple junctions formed on said second dielectric layer;
a second set of thermocouple junctions formed on said second dielectric layer;
a third dielectric layer formed on said first and second sets of thermocouple junctions;
a first active layer is formed proximate to said first set of thermocouple junctions;
a second active layer is formed proximate to said second set of thermocouple junctions; and a fourth dielectric layer is formed on said first active layer.
2. The sensor of claim 1, wherein the first and second sets of thermocouple junctions are interconnected so that an output of the junctions indicates a temperature difference between the first and second active layers.
3. The sensor of claim 2, wherein the thermocouple junctions are interconnected such that each junction of one set has at least one lead that is a lead for a junction of the other set of thermocouple junctions.
4. A differential thermal analysis sensor comprising:
a thermally isolated microstructure;
a heater within said microstructure; and a temperature sensor within said microstructure; and wherein:
said heater and temperature sensor within said microstructure are substantially co-planar;
a coating is formed on said microstructure to thermally interact with an airborne chemical; and said microstructure is formed on a substrate.
5. The sensor of claim 4, wherein thermal isolation is achieved by forming a pit in the substrate.
6. The sensor of claim 4, wherein thermal isolation is achieved by removing a sacrificial layer from beneath said microstructure.
7. The sensor of claim 5, wherein said temperature sensor is a plurality of thermocouples connected in series.
8. The sensor of claim 6, wherein said temperature sensor is a plurality of thermocouples connected in series.
9. The sensor of claim 5, wherein said temperature sensor is a resistive temperature sensor.
10. The sensor of claim 6, wherein said temperature sensor is a resistive temperature sensor.
11. A differential thermal analysis sensor comprising:
a thermally isolated microstructure;
a heater within said microstructure; and two temperature sensors within said microstructure; and wherein:
said heater and two temperature sensors within said microstructure are substantially co-planar;
coatings are formed on said two temperature sensors, one passivated and one allowed to thermally interact with an airborne chemical; and said microstructure is formed on a substrate.
12. The sensor of claim 9, wherein thermal isolation is achieved by forming a pit in the substrate.
13. The sensor of claim 9, wherein thermal isolation is achieved by removing a sacrificial layer from beneath said microstructure.
14. The sensor of claim 10, wherein said temperature sensors are a plurality of thermocouples connected in series.
15. The sensor of claim 11, wherein said temperature sensors are a plurality of thermocouples connected in series.
16. The sensor of claim 10, wherein said temperature sensor is a resistive temperature sensor.
17. The sensor of claim 11, wherein said temperature sensor is a resistive temperature sensor.
18. A differential thermal analysis sensor comprising:
a thermally isolated microstructure;
a heater within said microstructure;
a temperature sensor within said microstructure; and wherein:
said temperature sensor is laminated over said heater within said microstructure;
a coating is formed on said microstructure to thermally interact with an airborne chemical; and said microstructure is formed on a substrate.
19. The sensor of claim 13, wherein thermal isolation is achieved by forming a pit in the substrate.
20. The sensor of claim 13, wherein thermal isolation is achieved by removing a sacrificial layer from beneath said microstructure.
21. The sensor of claim 14, wherein said temperature sensor is a plurality of thermocouples connected in series.
22. The sensor of claim 15, wherein said temperature sensor is a plurality of thermocouples connected in series.
23. The sensor of claim 14, wherein said temperature sensor is a resistive temperature sensor.
24. The sensor of claim 15, wherein said temperature sensor is a resistive temperature sensor.
25. A differential thermal analysis sensor comprising:
a thermally isolated microstructure;
a heater within said microstructure;
two temperature sensors within said microstructure; and wherein:
said temperature sensors are laminated over said heater within said microstructure;
coatings are formed on said two temperature sensors, one passivated and one allowed to thermally interact with an airborne chemical; and said microstructure is formed on a substrate.
26. The sensor of claim 17, wherein thermal isolation is achieved by forming a pit in the substrate.
27. The sensor of claim 17, wherein thermal isolation is achieved by removing a sacrificial layer from beneath said microstructure.
28. The sensor of claim 18, wherein said temperature sensors are a plurality of thermocouples connected in series.
29. The sensor of claim 19, wherein said temperature sensors are a plurality of thermocouples connected in series.
30. The sensor of claim 18, wherein said temperature sensor is a resistive temperature sensor.
31. The sensor of claim 19, wherein said temperature sensor is a resistive temperature sensor.
CA2358233A 1998-12-31 1999-11-12 Differential thermal analysis sensor Expired - Fee Related CA2358233C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/224,580 US6238085B1 (en) 1998-12-31 1998-12-31 Differential thermal analysis sensor
US09/224,580 1998-12-31
PCT/US1999/026934 WO2000040953A1 (en) 1998-12-31 1999-11-12 Differential thermal analysis sensor

Publications (2)

Publication Number Publication Date
CA2358233A1 true CA2358233A1 (en) 2000-07-13
CA2358233C CA2358233C (en) 2010-05-11

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Family Applications (1)

Application Number Title Priority Date Filing Date
CA2358233A Expired - Fee Related CA2358233C (en) 1998-12-31 1999-11-12 Differential thermal analysis sensor

Country Status (7)

Country Link
US (1) US6238085B1 (en)
EP (1) EP1141684B1 (en)
JP (1) JP2002534676A (en)
AT (1) ATE289063T1 (en)
CA (1) CA2358233C (en)
DE (1) DE69923704T2 (en)
WO (1) WO2000040953A1 (en)

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Also Published As

Publication number Publication date
JP2002534676A (en) 2002-10-15
CA2358233C (en) 2010-05-11
DE69923704D1 (en) 2005-03-17
EP1141684B1 (en) 2005-02-09
DE69923704T2 (en) 2006-04-06
WO2000040953A1 (en) 2000-07-13
US6238085B1 (en) 2001-05-29
ATE289063T1 (en) 2005-02-15
EP1141684A1 (en) 2001-10-10

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