CA2388520C - Solder ball terminal - Google Patents
Solder ball terminal Download PDFInfo
- Publication number
- CA2388520C CA2388520C CA002388520A CA2388520A CA2388520C CA 2388520 C CA2388520 C CA 2388520C CA 002388520 A CA002388520 A CA 002388520A CA 2388520 A CA2388520 A CA 2388520A CA 2388520 C CA2388520 C CA 2388520C
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- CA
- Canada
- Prior art keywords
- solder ball
- terminal
- socket
- body portion
- diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
A solder ball terminal includes a body portion, a spherical socket disposed at one end of the body portion, the spherical socket including an interior wall terminating in an annular lip, wherein the annular lip defines an opening of the spherical socket and a solder ball disposed within the socket such that a portion of the solder ball extends through the opening and beyond the annular lip.
Description
2
3 1. Technical Field
4 The present invention generally relates to electrical connectors and more particularly to a solder 6 ball terminal which facilitates the connection of 7 electrical leads to surface mount ball grid array 8 devices, land grid array devices and board to board 9 connections.
11 2. Discussion of the Related Art 12 In the electronics equipment industry, it is known 13 to provide leads for connection to contact pads of 14 printed circuit boards and other substrates by soldering the leads thereto. However, as the 16 electronics industry continues to move toward greater 17 miniaturization, the size and spacing between the 18 contact pads has accordingly been reduced. This 19 requires a corresponding reduction in the size and spacing of the leads which are connected to contact 21 pads. While the reduction of the spacing between the 22 leads is advantageous from a space-conservation 23 standpoint, it is important to provide sufficient 24 spacing to prevent inadvertent contact between adjacent leads. It is likewise important to ensure that a 26 connection is made between the leads and the contact 27 pads.
28 Various prior art connection devices have been 29 developed in order to facilitate the connection of high density pads. U.S. Patent No. 5,030,144 to Seidler 31 discloses a solder-bearing lead including a rectangular 32 bar having a pair of prongs for receiving a solder mass 33 therebetween. The bar is bent at a 90 angle so that 34 the portion holding the solder mass is parallel to the 1 mounting surface, and the opposite portion extends 2 perpendicularly from the mounting surface. While this 3 device may be effective in connecting terminals to the 4 mounting surface, it has several drawbacks. For instance, due to the offset design, the alignment of 6 the connector is complicated and, once the connections 7 are made, the offset connector can be difficult to 8 design around. Furthermore, the offset design, in 9 combination with the irregular shape of the solder mass, introduces the possibility that the mass could be 11 misaligned with the mounting pad, since the parallel 12 portion might not always be precisely parallel and 13 since the solder mass may not fit precisely on or in 14 the mounting pad.
A more precise method of connecting terminals to 16 mounting pads involves a technology in which the 17 mounting pads are arranged as a grid and a number of 18 solder balls are used to connect the terminals to the 19 mounting pads. The advantage of using this technology, which is called a ball grid array or BGA, is that the 21 solder balls are configured to enable a more precise 22 alignment of the terminal with the mounting pad because 23 the initial contact point on the mounting pad is a 24 round point on the surface of the solder ball, rather than a wider or irregularly-shaped portion of the 26 solder mass described above. This more precise 27 alignment capability enables the spacing between the 28 terminals to be greatly minimized as compared to the 29 device described above with respect to the '144 patent.
Conventional solder ball terminals are formed by 31 elevating the temperature of a solder ball to just 32 below the liquid state to cause the solder ball 524 to 33 adhere to the end 522 of a metal terminal 510 (Fig. 8, 34 prior art). Although generally effective, there are 1 several disadvantages to conventional solder ball 2 terminals. For example, the terminal can lack good 3 mechanical security (and hence electrical continuity) 4 since the solder ball can be prone to breaking off from the smooth, flat surface of the terminal. Also, the 6 shape (i.e. roundness) of the solder ball can be 7 affected during the attachment of the ball to the 8 terminal which, in turn, can adversely affect 9 attachment to the mounting pad.
Proper alignment of the solder ball to the 11 terminal can likewise be compromised during the 12 attachment procedure. Also, because the solder ball is 13 attached to the end of the terminal, the distance 14 between the terminal and the mounting pad prior to the application of heat to the solder ball is greater than 16 the diameter of the solder ball, thus increasing the 17 risk of the terminal becoming misaligned with the 18 mounting pad while the solder ball is being liquefied.
19 In addition, if the solder ball is not in contact with the mounting pad, then when heat is applied, the 21 liquefied solder will flow toward the heat source, in 22 this instance the terminal, instead of following the 23 force of gravity toward the mounting pad. In such a 24 case a proper connection to the pad is not made.
It is therefore an object of the present invention 26 to provide a device which allows for precise alignment 27 and placement of a solder ball in a predictable manner 28 for facilitating the connection of electrical leads to 29 a variety of devices, including surface mount ball grid array devices, land grid array devices, and board to 31 board connections.
1 Summary of the Invention 2 The present invention provides a solder ball 3 terminal in which the solder ball is physically 4 retained in a counterbored socket at a connection end of the terminal. The solder ball is configured such 6 that less than half of the diameter of the ball is 7 exposed from the terminal in order to minimize the 8 distance between the end of the terminal and the 9 mounting pad before heat is applied to the solder ball to effect the connection between the terminal and the 11 mounting pad.
12 According to one embodiment of the invention, a 13 solder ball terminal is disclosed which includes a body 14 portion, a connection socket disposed at one end of the body portion, the socket including an interior wall 16 terminating in an annular lip, wherein the annular lip 17 defines an opening into the socket. The solder ball is 18 disposed within the socket such that a portion of the 19 solder ball which is less than half of the diameter of the solder ball, extends beyond the annular lip. In a 21 preferred embodiment, the socket has a spherical shape, 22 and a longitudinal axis of the terminal's body portion 23 extends through a center point of the solder ball.
24 According to another embodiment of the present invention, a solder ball terminal for particular 26 application in surface mount circuit board connections 27 is disclosed. The terminal includes a body portion at 28 a first end thereof and a head at a second end thereof, 29 the head including a socket having an opening for receiving a solder ball such that a portion of the 31 solder ball extends outwardly from the socket, beyond 32 the opening. The body portion may also preferably 33 include a male adaptor for connection to a second 34 solder ball terminal.
1 Brief Description of the Drawings 2 It should be understood that the drawings are 3 provided for the purpose of illustration only and are 4 not intended to define the limits of the invention.
11 2. Discussion of the Related Art 12 In the electronics equipment industry, it is known 13 to provide leads for connection to contact pads of 14 printed circuit boards and other substrates by soldering the leads thereto. However, as the 16 electronics industry continues to move toward greater 17 miniaturization, the size and spacing between the 18 contact pads has accordingly been reduced. This 19 requires a corresponding reduction in the size and spacing of the leads which are connected to contact 21 pads. While the reduction of the spacing between the 22 leads is advantageous from a space-conservation 23 standpoint, it is important to provide sufficient 24 spacing to prevent inadvertent contact between adjacent leads. It is likewise important to ensure that a 26 connection is made between the leads and the contact 27 pads.
28 Various prior art connection devices have been 29 developed in order to facilitate the connection of high density pads. U.S. Patent No. 5,030,144 to Seidler 31 discloses a solder-bearing lead including a rectangular 32 bar having a pair of prongs for receiving a solder mass 33 therebetween. The bar is bent at a 90 angle so that 34 the portion holding the solder mass is parallel to the 1 mounting surface, and the opposite portion extends 2 perpendicularly from the mounting surface. While this 3 device may be effective in connecting terminals to the 4 mounting surface, it has several drawbacks. For instance, due to the offset design, the alignment of 6 the connector is complicated and, once the connections 7 are made, the offset connector can be difficult to 8 design around. Furthermore, the offset design, in 9 combination with the irregular shape of the solder mass, introduces the possibility that the mass could be 11 misaligned with the mounting pad, since the parallel 12 portion might not always be precisely parallel and 13 since the solder mass may not fit precisely on or in 14 the mounting pad.
A more precise method of connecting terminals to 16 mounting pads involves a technology in which the 17 mounting pads are arranged as a grid and a number of 18 solder balls are used to connect the terminals to the 19 mounting pads. The advantage of using this technology, which is called a ball grid array or BGA, is that the 21 solder balls are configured to enable a more precise 22 alignment of the terminal with the mounting pad because 23 the initial contact point on the mounting pad is a 24 round point on the surface of the solder ball, rather than a wider or irregularly-shaped portion of the 26 solder mass described above. This more precise 27 alignment capability enables the spacing between the 28 terminals to be greatly minimized as compared to the 29 device described above with respect to the '144 patent.
Conventional solder ball terminals are formed by 31 elevating the temperature of a solder ball to just 32 below the liquid state to cause the solder ball 524 to 33 adhere to the end 522 of a metal terminal 510 (Fig. 8, 34 prior art). Although generally effective, there are 1 several disadvantages to conventional solder ball 2 terminals. For example, the terminal can lack good 3 mechanical security (and hence electrical continuity) 4 since the solder ball can be prone to breaking off from the smooth, flat surface of the terminal. Also, the 6 shape (i.e. roundness) of the solder ball can be 7 affected during the attachment of the ball to the 8 terminal which, in turn, can adversely affect 9 attachment to the mounting pad.
Proper alignment of the solder ball to the 11 terminal can likewise be compromised during the 12 attachment procedure. Also, because the solder ball is 13 attached to the end of the terminal, the distance 14 between the terminal and the mounting pad prior to the application of heat to the solder ball is greater than 16 the diameter of the solder ball, thus increasing the 17 risk of the terminal becoming misaligned with the 18 mounting pad while the solder ball is being liquefied.
19 In addition, if the solder ball is not in contact with the mounting pad, then when heat is applied, the 21 liquefied solder will flow toward the heat source, in 22 this instance the terminal, instead of following the 23 force of gravity toward the mounting pad. In such a 24 case a proper connection to the pad is not made.
It is therefore an object of the present invention 26 to provide a device which allows for precise alignment 27 and placement of a solder ball in a predictable manner 28 for facilitating the connection of electrical leads to 29 a variety of devices, including surface mount ball grid array devices, land grid array devices, and board to 31 board connections.
1 Summary of the Invention 2 The present invention provides a solder ball 3 terminal in which the solder ball is physically 4 retained in a counterbored socket at a connection end of the terminal. The solder ball is configured such 6 that less than half of the diameter of the ball is 7 exposed from the terminal in order to minimize the 8 distance between the end of the terminal and the 9 mounting pad before heat is applied to the solder ball to effect the connection between the terminal and the 11 mounting pad.
12 According to one embodiment of the invention, a 13 solder ball terminal is disclosed which includes a body 14 portion, a connection socket disposed at one end of the body portion, the socket including an interior wall 16 terminating in an annular lip, wherein the annular lip 17 defines an opening into the socket. The solder ball is 18 disposed within the socket such that a portion of the 19 solder ball which is less than half of the diameter of the solder ball, extends beyond the annular lip. In a 21 preferred embodiment, the socket has a spherical shape, 22 and a longitudinal axis of the terminal's body portion 23 extends through a center point of the solder ball.
24 According to another embodiment of the present invention, a solder ball terminal for particular 26 application in surface mount circuit board connections 27 is disclosed. The terminal includes a body portion at 28 a first end thereof and a head at a second end thereof, 29 the head including a socket having an opening for receiving a solder ball such that a portion of the 31 solder ball extends outwardly from the socket, beyond 32 the opening. The body portion may also preferably 33 include a male adaptor for connection to a second 34 solder ball terminal.
1 Brief Description of the Drawings 2 It should be understood that the drawings are 3 provided for the purpose of illustration only and are 4 not intended to define the limits of the invention.
5 The foregoing and other objects and advantages of the
6 embodiments described herein will become apparent with
7 reference to the following detailed description when
8 taken in conjunction with the drawings in which:
9 Fig. 1 is a partial cut-away view of the solder ball terminal of the present invention, the cut-away 11 portion showing the configuration of the solder ball 12 within the connection socket of the terminal;
13 Fig. 2 is an end view of the solder ball terminal, 14 as seen from line 2-2 in Fig. 1;
Fig. 3 is a partial view of the solder ball 16 terminal of the Fig. 1, showing the placement of the 17 solder ball on a mounting pad before and after the 18 application of heat to the solder ball;
19 Fig. 4 is a partial view of the solder ball terminal of Fig. 1, showing the placement of the solder 21 ball on a mounting pad before and after the application 22 of heat to the solder ball, wherein the solder ball 23 includes a solid core portion;
24 Fig. 5 is a partial cut-away view of an alternate embodiment of the solder ball terminal of Fig. 1, 26 including a male adaptor at one end for connection to a 27 socket;
28 Fig. 6 is a partial cut-away view of an alternate 29 embodiment of the solder ball terminal of Fig. 1, including a closed end and a knurl;
31 Fig. 7 is a partial cut-away view of an alternate 32 embodiment of the solder ball terminal of Fig. 1, 33 including a pair of solder balls disposed within 1 corresponding sockets at either end of the terminal;
2 and 3 Fig. 8 is a schematic view of a solder ball 4 terminal of the prior art.
6 DPra;led Descristion of the Illustrative Embodiments 7 Referring now to the drawings, and more 8 particularly Figs. 1 and 2, there is generally 9 indicated at 10 a solder ball terminal in accordance with the present invention. Solder ball terminal 10 11 includes a body portion 12 having a female socket 14 12 disposed at one end thereof and a head portion 16 13 disposed at an opposite end thereof. Preferably, the 14 body 12, socket 14, and head 16 are formed from a unitary piece of metal.
16 Head 16 further includes a connection socket 18 17 which is defined internally by a wall 20, and which 18 includes an annular lip 22 located at the distal end of 19 the head 16. The socket 18 may preferably be spherical so that a solder ball 24 can be easily fitted or 21 swaged into the socket 18. The solder ball 24 is 22 formed from typical solder materials, such as tin and 23 lead, and the diameter of the solder ball 24 is 24 approximately 0.020"-0.030" in the present embodiment.
It should be understood that any size solder ball may 26 be used in conjunction with the present invention, 27 provided that the spherical socket 18 is appropriately 28 sized, as described below.
29 As seen in Fig. 2, the reduced-diameter opening defined by the outermost tip 22a of the annular lip 22, 31 shown by dotted dashed line 28, is smaller than a first 32 diameter "D" of the solder ball 24. This configuration 33 allows the solder ball to be securely retained within 34 the socket 18 by the annular lip so that the solder 1 ball does not disengage from the socket. In addition, 2 a center line which bisects the solder ball 24, shown 3 by dashed line 26, is disposed within socket 18, above 4 the outermost tip 22a of the annular lip 22. This enables more precise alignment of the solder ball 24 on 6 a mounting pad by reducing the distance between the 7 terminal and the mounting pad, as described in greater 8 detail below.
9 Body 12 may also include a barb portion 17 for anchoring the terminal in an insulating mount, as is 11 known in the art. In addition, connection socket 14 is 12 preferably sized to receive an adapter or interposer 13 from a second terminal for connection to both a circuit 14 board and a microprocessor chip or for connection to electrical leads to the microprocessor. Such an 16 adapter 129 is shown in Fig. 5 which represents an 17 alternate embodiment of body portion 12, as described 18 in greater detail below. Use of solder ball terminal 19 10 with connection socket 14 in combination with terminal 110 and adapter 129 allows a simultaneous 21 connection to be made between a microprocessor chip and 22 a printed circuit board which reduces cost and the risk 23 of damage to the system.
24 Referring now to Fig. 3, the method of attaching the solder ball terminal 10 to a substrate, or a 26 mounting pad of a circuit board will be described. For 27 simplicity, only the connection end or distal end 40 of 28 the solder ball terminal 10 is shown in Fig. 3, 29 including the head 16, socket 18, and the solder ball 24. As shown on the left side of the figure, 31 prior to connection, the solder ball 24 is preferably 32 brought into contact with a mounting pad 30 of the 33 substrate, or circuit board 32. Due to the 34 configuration of the terminal 10, as described above, 1 the distance d between the tip 22a of the annular lip 2 22 and the mounting pad is approximately 0.008"-0.013", 3 depending on the terminal and solder ball size, which 4 may vary, as would be known to one of skill in the art.
In addition, solder paste having a thickness of 6 approximately 0.006" may also be utilized on the 7 substrate. In such a case, the terminal comes even 8 closer to the solder paste than the substrate alone.
9 In the prior art terminals described above, the head of the terminal is typically soldered to the top 11 of the solder ball to adhere the solder ball to the 12 terminal (see Fig. 8). This results in a distance (d2) 13 between the end of the terminal head 522 and the 14 mounting pad 530 to be equal to approximately the diameter of the solder ball, or 0.030", in the case of 16 the solder ball as described herein. The reduction of 17 this distance by more than 50 s by mounting the solder 18 ball within socket 18 enables the terminal 10 to be 19 connected with more precision and less chance of misalignment, since the solder ball terminal can be 21 brought more than 50o closer to the mounting pad (with 22 or without solder paste), for a more direct contact.
23 In addition, because the terminal is twice as close to 24 the mounting pad as prior art terminals, if the solder ball is not in direct contact with the pad, upon 26 melting the solder will follow the flow of gravity 27 toward the mounting pad, instead of toward the heat 28 source (i.e. the terminal), and a connection will be 29 made between the terminal and the circuit board.
Shown on the right side of Fig. 3 is the distal 31 end 40 of the solder ball terminal 10 upon the 32 application of heat to the solder ball 24. Once heat 33 is applied, the solder ball melts, causing the terminal 1 to move closer to the mounting pad 30. Since the 2 original distance d is greatly reduced from the prior 3 art, as discussed above, the terminal does not travel 4 as far as prior art terminals before coming to rest on the solder mass 34, which is formed from the melted 6 solder ball 24. As is known in the art, the amount of 7 time that the solder is allowed to flow is precisely 8 controlled so that the solder mass 34 does not run off 9 of the mounting pad 30 into contact with adjacent mounting pads. Once the solder mass 34 cools, the 11 terminal 10 is electrically connected to the circuit 12 board 32 and mechanically secured due to the locking 13 feature of the solder inside and outside the socket.
14 The locking feature provides the terminal with improved mechanical security and electrical continuity as 16 compared to prior art devices.
17 The solder ball terminal 10 may also be utilized 18 with a solder ball 124 having an inner core 126 and an 19 outer coating 128 (Fig. 4), such solder balls being known in the art. The outer core 128 is preferably 21 formed from a typical solder material having a low 22 melting temperature, and the inner core 126 is 23 preferably formed from a solder material having a much 24 higher melting point than the outer coating 128. In the embodiment of Fig. 4, the formation of the head 16 26 of the terminal, including the annular lip 22 and the 27 tip 22a, is identical to the terminal 10 shown in Fig.
28 1. Shown on the right side of Fig. 4 is distal end 40 29 of the terminal 10 which has been attached to mounting pad 30 of the substrate or circuit board 32. As can be 31 seen in the figure, upon heating of the solder ball 32 124, the outer coating 128 melts to form a solder mass
13 Fig. 2 is an end view of the solder ball terminal, 14 as seen from line 2-2 in Fig. 1;
Fig. 3 is a partial view of the solder ball 16 terminal of the Fig. 1, showing the placement of the 17 solder ball on a mounting pad before and after the 18 application of heat to the solder ball;
19 Fig. 4 is a partial view of the solder ball terminal of Fig. 1, showing the placement of the solder 21 ball on a mounting pad before and after the application 22 of heat to the solder ball, wherein the solder ball 23 includes a solid core portion;
24 Fig. 5 is a partial cut-away view of an alternate embodiment of the solder ball terminal of Fig. 1, 26 including a male adaptor at one end for connection to a 27 socket;
28 Fig. 6 is a partial cut-away view of an alternate 29 embodiment of the solder ball terminal of Fig. 1, including a closed end and a knurl;
31 Fig. 7 is a partial cut-away view of an alternate 32 embodiment of the solder ball terminal of Fig. 1, 33 including a pair of solder balls disposed within 1 corresponding sockets at either end of the terminal;
2 and 3 Fig. 8 is a schematic view of a solder ball 4 terminal of the prior art.
6 DPra;led Descristion of the Illustrative Embodiments 7 Referring now to the drawings, and more 8 particularly Figs. 1 and 2, there is generally 9 indicated at 10 a solder ball terminal in accordance with the present invention. Solder ball terminal 10 11 includes a body portion 12 having a female socket 14 12 disposed at one end thereof and a head portion 16 13 disposed at an opposite end thereof. Preferably, the 14 body 12, socket 14, and head 16 are formed from a unitary piece of metal.
16 Head 16 further includes a connection socket 18 17 which is defined internally by a wall 20, and which 18 includes an annular lip 22 located at the distal end of 19 the head 16. The socket 18 may preferably be spherical so that a solder ball 24 can be easily fitted or 21 swaged into the socket 18. The solder ball 24 is 22 formed from typical solder materials, such as tin and 23 lead, and the diameter of the solder ball 24 is 24 approximately 0.020"-0.030" in the present embodiment.
It should be understood that any size solder ball may 26 be used in conjunction with the present invention, 27 provided that the spherical socket 18 is appropriately 28 sized, as described below.
29 As seen in Fig. 2, the reduced-diameter opening defined by the outermost tip 22a of the annular lip 22, 31 shown by dotted dashed line 28, is smaller than a first 32 diameter "D" of the solder ball 24. This configuration 33 allows the solder ball to be securely retained within 34 the socket 18 by the annular lip so that the solder 1 ball does not disengage from the socket. In addition, 2 a center line which bisects the solder ball 24, shown 3 by dashed line 26, is disposed within socket 18, above 4 the outermost tip 22a of the annular lip 22. This enables more precise alignment of the solder ball 24 on 6 a mounting pad by reducing the distance between the 7 terminal and the mounting pad, as described in greater 8 detail below.
9 Body 12 may also include a barb portion 17 for anchoring the terminal in an insulating mount, as is 11 known in the art. In addition, connection socket 14 is 12 preferably sized to receive an adapter or interposer 13 from a second terminal for connection to both a circuit 14 board and a microprocessor chip or for connection to electrical leads to the microprocessor. Such an 16 adapter 129 is shown in Fig. 5 which represents an 17 alternate embodiment of body portion 12, as described 18 in greater detail below. Use of solder ball terminal 19 10 with connection socket 14 in combination with terminal 110 and adapter 129 allows a simultaneous 21 connection to be made between a microprocessor chip and 22 a printed circuit board which reduces cost and the risk 23 of damage to the system.
24 Referring now to Fig. 3, the method of attaching the solder ball terminal 10 to a substrate, or a 26 mounting pad of a circuit board will be described. For 27 simplicity, only the connection end or distal end 40 of 28 the solder ball terminal 10 is shown in Fig. 3, 29 including the head 16, socket 18, and the solder ball 24. As shown on the left side of the figure, 31 prior to connection, the solder ball 24 is preferably 32 brought into contact with a mounting pad 30 of the 33 substrate, or circuit board 32. Due to the 34 configuration of the terminal 10, as described above, 1 the distance d between the tip 22a of the annular lip 2 22 and the mounting pad is approximately 0.008"-0.013", 3 depending on the terminal and solder ball size, which 4 may vary, as would be known to one of skill in the art.
In addition, solder paste having a thickness of 6 approximately 0.006" may also be utilized on the 7 substrate. In such a case, the terminal comes even 8 closer to the solder paste than the substrate alone.
9 In the prior art terminals described above, the head of the terminal is typically soldered to the top 11 of the solder ball to adhere the solder ball to the 12 terminal (see Fig. 8). This results in a distance (d2) 13 between the end of the terminal head 522 and the 14 mounting pad 530 to be equal to approximately the diameter of the solder ball, or 0.030", in the case of 16 the solder ball as described herein. The reduction of 17 this distance by more than 50 s by mounting the solder 18 ball within socket 18 enables the terminal 10 to be 19 connected with more precision and less chance of misalignment, since the solder ball terminal can be 21 brought more than 50o closer to the mounting pad (with 22 or without solder paste), for a more direct contact.
23 In addition, because the terminal is twice as close to 24 the mounting pad as prior art terminals, if the solder ball is not in direct contact with the pad, upon 26 melting the solder will follow the flow of gravity 27 toward the mounting pad, instead of toward the heat 28 source (i.e. the terminal), and a connection will be 29 made between the terminal and the circuit board.
Shown on the right side of Fig. 3 is the distal 31 end 40 of the solder ball terminal 10 upon the 32 application of heat to the solder ball 24. Once heat 33 is applied, the solder ball melts, causing the terminal 1 to move closer to the mounting pad 30. Since the 2 original distance d is greatly reduced from the prior 3 art, as discussed above, the terminal does not travel 4 as far as prior art terminals before coming to rest on the solder mass 34, which is formed from the melted 6 solder ball 24. As is known in the art, the amount of 7 time that the solder is allowed to flow is precisely 8 controlled so that the solder mass 34 does not run off 9 of the mounting pad 30 into contact with adjacent mounting pads. Once the solder mass 34 cools, the 11 terminal 10 is electrically connected to the circuit 12 board 32 and mechanically secured due to the locking 13 feature of the solder inside and outside the socket.
14 The locking feature provides the terminal with improved mechanical security and electrical continuity as 16 compared to prior art devices.
17 The solder ball terminal 10 may also be utilized 18 with a solder ball 124 having an inner core 126 and an 19 outer coating 128 (Fig. 4), such solder balls being known in the art. The outer core 128 is preferably 21 formed from a typical solder material having a low 22 melting temperature, and the inner core 126 is 23 preferably formed from a solder material having a much 24 higher melting point than the outer coating 128. In the embodiment of Fig. 4, the formation of the head 16 26 of the terminal, including the annular lip 22 and the 27 tip 22a, is identical to the terminal 10 shown in Fig.
28 1. Shown on the right side of Fig. 4 is distal end 40 29 of the terminal 10 which has been attached to mounting pad 30 of the substrate or circuit board 32. As can be 31 seen in the figure, upon heating of the solder ball 32 124, the outer coating 128 melts to form a solder mass
10 1 134, while the inner core 126 remains intact. Once the 2 solder mass 134 is cooled, the terminal and the inner 3 core 126 are electrically connected to the circuit 4 board through the mounting pad 30.
Referring now to Figs. 5-7, alternate embodiments 6 of the solder ball terminal 10 are shown. In the 7 embodiments of Figs. 5, 6 and 7, all parts which are 8 the same, or similar to, corresponding parts of the 9 embodiment 10 (Fig. 1) are noted with the same two last numbers, but preceded by the numeral "1", "2" or "3",
Referring now to Figs. 5-7, alternate embodiments 6 of the solder ball terminal 10 are shown. In the 7 embodiments of Figs. 5, 6 and 7, all parts which are 8 the same, or similar to, corresponding parts of the 9 embodiment 10 (Fig. 1) are noted with the same two last numbers, but preceded by the numeral "1", "2" or "3",
11 respectively.
12 The embodiment of the terminal 110 shown in Fig. 5
13 includes a head 116 having a socket 118 defined by a
14 wall 120, and including an annular lip 122 having a tip 122a, as described above with respect to terminal 16 10 shown in Fig. 1. The body 112 of terminal 110, 17 however, includes a male adapter 129 for connection to 18 a socket, such as the socket 14 of terminal 10, or for 19 connection to a through-hole on a printed circuit board (not shown). Thus, use of solder ball terminal 10 with 21 connection socket 14 in combination with solder ball 22 terminal 110 and adapter 129 allows a simultaneous 23 connection to be made between a microprocessor chip and 24 a printed circuit board, which reduces cost and the risk of damage to the system. Such terminals have 26 particular application in surface mount circuit board 27 connections. The body 112 may also include a barb 28 portion 117 for anchoring the terminal in an insulating 29 mount, as described above.
The embodiment of terminal 210 as shown in Fig. 6, 31 likewise includes a head 216 having a socket 218 32 defined by a wall 220, and including an annular lip 222 1 having a tip 222a, as described above with respect to 2 terminal 10 shown in Fig. 1. This embodiment does not, 3 however, include a female socket at an end opposite the 4 head 216. Instead, terminal 210 has a closed end 219 and preferably includes a knurl 221 circumscribing a 6 portion of the body 212.
7 The embodiment of terminal 310, as shown in Fig.
8 7, includes a first or distal end 340 having a head 316 9 with a socket 318 defined by a wall 320, and including an annular lip 322 having a tip 322a, as described 11 above with respect to terminal 10 shown in Fig. 1. The 12 second or proximal end 350, is preferably identical to 13 the distal end 340 and likewise includes a head 316b 14 with a socket 318b defined by a wall 320b, and including an annular lip 322b having a tip 322c. The 16 proximal end may be connected to the distal end by a 17 stepped body portion 312. In this embodiment, the 18 terminal may be attached for electrical connection at 19 both ends, in the manner described above with reference to Figs. 3 and 4.
21 While there is shown and described herein certain 22 illustrative embodiments, it will be understood to 23 those skilled in the art that various modifications and 24 rearrangements of the parts may be made without departing from the spirit and scope of the underlying 26 inventive concept. For example, it will be appreciated 27 by those of skill in the art that while one end, i.e.
28 the head, of the terminal according to the present 29 invention includes a socket defined by a wall and including an annular lip having a outermost tip, the 31 opposite end, i.e. body, may take any number of forms.
32 Likewise, the body portion in all embodiments may 1 include a barb, a knurl or other geometries, either 2 alone or in combination, as would be known to those of 3 skill in the art. In addition, the dimensions provided 4 herein are not to be construed as limiting, but only as examples, and may be readily modified by one of skill 6 in the art. Therefore, the above description should 7 not be construed as limiting, but merely as 8 exemplifications of an illustrative embodiment.
The embodiment of terminal 210 as shown in Fig. 6, 31 likewise includes a head 216 having a socket 218 32 defined by a wall 220, and including an annular lip 222 1 having a tip 222a, as described above with respect to 2 terminal 10 shown in Fig. 1. This embodiment does not, 3 however, include a female socket at an end opposite the 4 head 216. Instead, terminal 210 has a closed end 219 and preferably includes a knurl 221 circumscribing a 6 portion of the body 212.
7 The embodiment of terminal 310, as shown in Fig.
8 7, includes a first or distal end 340 having a head 316 9 with a socket 318 defined by a wall 320, and including an annular lip 322 having a tip 322a, as described 11 above with respect to terminal 10 shown in Fig. 1. The 12 second or proximal end 350, is preferably identical to 13 the distal end 340 and likewise includes a head 316b 14 with a socket 318b defined by a wall 320b, and including an annular lip 322b having a tip 322c. The 16 proximal end may be connected to the distal end by a 17 stepped body portion 312. In this embodiment, the 18 terminal may be attached for electrical connection at 19 both ends, in the manner described above with reference to Figs. 3 and 4.
21 While there is shown and described herein certain 22 illustrative embodiments, it will be understood to 23 those skilled in the art that various modifications and 24 rearrangements of the parts may be made without departing from the spirit and scope of the underlying 26 inventive concept. For example, it will be appreciated 27 by those of skill in the art that while one end, i.e.
28 the head, of the terminal according to the present 29 invention includes a socket defined by a wall and including an annular lip having a outermost tip, the 31 opposite end, i.e. body, may take any number of forms.
32 Likewise, the body portion in all embodiments may 1 include a barb, a knurl or other geometries, either 2 alone or in combination, as would be known to those of 3 skill in the art. In addition, the dimensions provided 4 herein are not to be construed as limiting, but only as examples, and may be readily modified by one of skill 6 in the art. Therefore, the above description should 7 not be construed as limiting, but merely as 8 exemplifications of an illustrative embodiment.
Claims (18)
1. A solder ball terminal comprising:
a body portion;
a connection socket disposed at a first end of said body portion and including an opening; and a solder ball having a first diameter disposed in said connection socket, such that more than half of the diameter of the solder ball rests within said connection socket and less than half of a diameter of the solder ball extends beyond said opening.
a body portion;
a connection socket disposed at a first end of said body portion and including an opening; and a solder ball having a first diameter disposed in said connection socket, such that more than half of the diameter of the solder ball rests within said connection socket and less than half of a diameter of the solder ball extends beyond said opening.
2. The solder ball terminal of claim 1, wherein said opening is defined by an annular lip of said socket.
3. The solder ball terminal of claim 1, wherein said connection socket has a spherical shape.
4. The solder ball terminal of claim 1, wherein said solder ball comprises an inner core formed from a material having a first melting point and an outer coating which covers said inner core, said outer coating having a second melting point, wherein the first melting point is greater than the second melting point.
5. The solder ball terminal of claim 1, further comprising a second socket disposed at a second end of said body portion, said second socket being configured and arranged to receive one of an adaptor or an electrical lead therein.
6. The solder ball terminal of claim 1, further comprising an adaptor supported by a second end of said body portion.
7. The solder ball terminal of claim 1, further comprising a barb portion configured and arranged to anchor the terminal in an insulating mount.
8. The solder ball terminal of claim 1, further comprising a knurl circumscribing a section of said body portion.
9. A solder ball terminal for making an electrical connection comprising:
a solder ball having a first diameter; and a body portion including a head at a first end thereof, said head including a connection socket having a reduced-diameter opening which is smaller than the first diameter of said solder ball;
wherein said solder ball is retained within said connection socket by said reduced-diameter opening, such that said solder ball extends beyond said opening a distance which is less than half of the first diameter of the solder ball.
a solder ball having a first diameter; and a body portion including a head at a first end thereof, said head including a connection socket having a reduced-diameter opening which is smaller than the first diameter of said solder ball;
wherein said solder ball is retained within said connection socket by said reduced-diameter opening, such that said solder ball extends beyond said opening a distance which is less than half of the first diameter of the solder ball.
10. The solder ball terminal of claim 9, wherein said reduced-diameter opening is defined by an annular lip of said connection socket.
11. The solder ball terminal of claim 9, wherein a longitudinal axis of said body portion extends through a center point of said solder ball.
12. The solder ball terminal of claim 9, wherein said solder ball comprises an inner core formed from a material having a first melting point and an outer coating which covers said inner core, said outer coating having a second melting point, wherein said first melting point is greater than said second melting point.
13. A solder ball terminal for making an electrical connection comprising:
a body portion;
a connection socket disposed at a first end of said body portion, said connection socket including an interior wall terminating in an annular lip, wherein said annular lip defines an opening of said connection socket;
and a solder ball having a first diameter and disposed within said body portion such that said solder ball extends outwardly from said socket a distance which is less than half of the diameter of said solder ball.
a body portion;
a connection socket disposed at a first end of said body portion, said connection socket including an interior wall terminating in an annular lip, wherein said annular lip defines an opening of said connection socket;
and a solder ball having a first diameter and disposed within said body portion such that said solder ball extends outwardly from said socket a distance which is less than half of the diameter of said solder ball.
14. The solder ball terminal of claim 13, wherein said connection socket has a spherical shape.
15. The solder ball terminal of claim 13, further comprising a second socket disposed at a second end of said body portion, said second socket being configured and arranged to receive an adaptor therein.
16. The solder ball terminal of claim 13, further comprising an adaptor supported by a second end of said body portion.
17. A solder ball terminal for making a solder-interconnection with a contact pad located adjacent to and in alignment with said terminal, said terminal comprising:
an elongated body portion having one end thereof adjacent the contact pad;
a substantially spherical connection socket at said one end of said body portion;
a solder ball;
said socket having means for mechanically gripping said solder ball to hold the latter in said socket without any fusion taking place between the ball and the socket and without any fusion existing between the ball and the contact pad;
said ball extending outwardly from said socket by a distance less than one half the diameter of said ball, whereby melting of said solder ball results in effective and expeditious fusion between said one end of said body portion and the contact pad.
an elongated body portion having one end thereof adjacent the contact pad;
a substantially spherical connection socket at said one end of said body portion;
a solder ball;
said socket having means for mechanically gripping said solder ball to hold the latter in said socket without any fusion taking place between the ball and the socket and without any fusion existing between the ball and the contact pad;
said ball extending outwardly from said socket by a distance less than one half the diameter of said ball, whereby melting of said solder ball results in effective and expeditious fusion between said one end of said body portion and the contact pad.
18. The solder ball terminal of claim 17, wherein the terminal edge of said connection socket comprises an annular lip, said lip comprising said gripping means.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/420,711 | 1999-10-20 | ||
| US09/420,711 US6352437B1 (en) | 1999-10-20 | 1999-10-20 | Solder ball terminal |
| PCT/US2000/040937 WO2001029929A1 (en) | 1999-10-20 | 2000-09-19 | Solder ball terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2388520A1 CA2388520A1 (en) | 2001-04-26 |
| CA2388520C true CA2388520C (en) | 2007-11-20 |
Family
ID=23667546
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002388520A Expired - Lifetime CA2388520C (en) | 1999-10-20 | 2000-09-19 | Solder ball terminal |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6352437B1 (en) |
| EP (1) | EP1226627A1 (en) |
| AU (1) | AU1254001A (en) |
| CA (1) | CA2388520C (en) |
| WO (1) | WO2001029929A1 (en) |
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| TW406454B (en) * | 1996-10-10 | 2000-09-21 | Berg Tech Inc | High density connector and method of manufacture |
| US6758702B2 (en) * | 2000-02-24 | 2004-07-06 | Fci Americas Technology, Inc. | Electrical connector with compression contacts |
| US6331836B1 (en) * | 2000-08-24 | 2001-12-18 | Fast Location.Net, Llc | Method and apparatus for rapidly estimating the doppler-error and other receiver frequency errors of global positioning system satellite signals weakened by obstructions in the signal path |
| US6644985B2 (en) * | 2001-02-16 | 2003-11-11 | Fci Americas Technology, Inc. | Ball attached zero insertion force socket |
| US6501665B1 (en) * | 2001-08-10 | 2002-12-31 | Lotes Co., Ltd. | Structure of a ball grid array IC mounting seat |
| US6530788B1 (en) * | 2001-10-09 | 2003-03-11 | Lotes Co., Ltd. | Structure of a ball grid array IC socket connection with solder ball |
| US6702594B2 (en) * | 2001-12-14 | 2004-03-09 | Hon Hai Precision Ind. Co., Ltd. | Electrical contact for retaining solder preform |
| FI20012473A (en) * | 2001-12-14 | 2003-06-15 | Nokia Corp | Procedure for controlling a broadcast in a radio system |
| US6533590B1 (en) * | 2001-12-17 | 2003-03-18 | Hon Hai Precision Ind. Co., Ltd. | Ball grid array connector having improved contact configuration |
| WO2003076957A1 (en) * | 2002-03-05 | 2003-09-18 | Rika Denshi America, Inc. | Apparatus for interfacing electronic packages and test equipment |
| US6861862B1 (en) | 2003-03-17 | 2005-03-01 | John O. Tate | Test socket |
| US7042702B2 (en) * | 2003-12-15 | 2006-05-09 | Intel Corporation | Wound capacitor |
| US7029292B2 (en) * | 2003-12-16 | 2006-04-18 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector and contact |
| US20050196979A1 (en) * | 2004-03-02 | 2005-09-08 | Ironwood Electronics, Inc. | Adapter apparatus with conductive elements mounted using curable material and methods regarding same |
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| US7690925B2 (en) * | 2005-02-24 | 2010-04-06 | Advanced Interconnections Corp. | Terminal assembly with pin-retaining socket |
| US7435102B2 (en) * | 2005-02-24 | 2008-10-14 | Advanced Interconnections Corporation | Interconnecting electrical devices |
| US20070117268A1 (en) * | 2005-11-23 | 2007-05-24 | Baker Hughes, Inc. | Ball grid attachment |
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| US8969734B2 (en) * | 2009-04-01 | 2015-03-03 | Advanced Interconnections Corp. | Terminal assembly with regions of differing solderability |
| JPWO2012137714A1 (en) | 2011-04-04 | 2014-07-28 | ローム株式会社 | Semiconductor device and manufacturing method of semiconductor device |
| US8371871B1 (en) | 2011-08-11 | 2013-02-12 | Advanced Interconnections Corp. | Terminal with compliant barb |
| US10333238B2 (en) | 2015-08-06 | 2019-06-25 | Telefonaktiebolaget Lm Ericsson (Publ) | Surface mount contact, electronic device assembly, and test probe pin tool |
| CN107565234B (en) * | 2017-07-24 | 2019-08-30 | 番禺得意精密电子工业有限公司 | Electric connector |
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| US10431920B1 (en) | 2018-04-17 | 2019-10-01 | John O. Tate | One-piece parallel multi-finger contact |
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| KR0157284B1 (en) | 1995-05-31 | 1999-02-18 | 김광호 | Printed circuit board of solder ball take-on groove furnished and this use of package ball grid array |
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| US5989049A (en) * | 1998-12-21 | 1999-11-23 | Hon Hai Precision Ind. Co., Ltd. | Contact of a ZIF PGA socket and the socket using the same |
| US6054978A (en) * | 1999-04-12 | 2000-04-25 | Perry; Robert C. | Computer mouse with improved ball lock |
-
1999
- 1999-10-20 US US09/420,711 patent/US6352437B1/en not_active Expired - Lifetime
-
2000
- 2000-09-19 CA CA002388520A patent/CA2388520C/en not_active Expired - Lifetime
- 2000-09-19 WO PCT/US2000/040937 patent/WO2001029929A1/en not_active Application Discontinuation
- 2000-09-19 EP EP00974127A patent/EP1226627A1/en not_active Withdrawn
- 2000-09-19 AU AU12540/01A patent/AU1254001A/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| CA2388520A1 (en) | 2001-04-26 |
| US6352437B1 (en) | 2002-03-05 |
| EP1226627A1 (en) | 2002-07-31 |
| WO2001029929A1 (en) | 2001-04-26 |
| AU1254001A (en) | 2001-04-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| MKEX | Expiry |
Effective date: 20200921 |