CA2405991A1 - Substrat transparent pourvu de pistes electroconductrices - Google Patents

Substrat transparent pourvu de pistes electroconductrices Download PDF

Info

Publication number
CA2405991A1
CA2405991A1 CA002405991A CA2405991A CA2405991A1 CA 2405991 A1 CA2405991 A1 CA 2405991A1 CA 002405991 A CA002405991 A CA 002405991A CA 2405991 A CA2405991 A CA 2405991A CA 2405991 A1 CA2405991 A1 CA 2405991A1
Authority
CA
Canada
Prior art keywords
transparent substrate
tracks
screen printing
substrate provided
shear stress
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002405991A
Other languages
English (en)
Other versions
CA2405991C (fr
Inventor
Dieter Hahn
Josef Switalla
Rainer Kummutat
Andre Beyrle
Yannick Lebail
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Saint Gobain Glass France SAS
Original Assignee
Saint-Gobain Glass France
Dieter Hahn
Josef Switalla
Rainer Kummutat
Andre Beyrle
Yannick Lebail
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10038768A external-priority patent/DE10038768A1/de
Priority claimed from FR0016199A external-priority patent/FR2818087B3/fr
Application filed by Saint-Gobain Glass France, Dieter Hahn, Josef Switalla, Rainer Kummutat, Andre Beyrle, Yannick Lebail filed Critical Saint-Gobain Glass France
Publication of CA2405991A1 publication Critical patent/CA2405991A1/fr
Application granted granted Critical
Publication of CA2405991C publication Critical patent/CA2405991C/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Surface Heating Bodies (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Surface Treatment Of Glass (AREA)
  • Conductive Materials (AREA)
  • Printing Methods (AREA)

Abstract

La présente invention se rapporte à un procédé de fabrication de pistes électroconductrices sur un substrat transparent, par sérigraphie d'une pâte électronconductrice, et au substrat transparent pourvu desdites pistes. Selon l'invention, on forme des pistes conductrices de largeur inférieure ou égale à 0,3 mm en appliquant par sérigraphie une pâte électroconductrice thixotrope possédant un rapport de la viscosité sans contrainte de cisaillement à la viscosité sous contrainte de cisaillement dans les conditions de la sérigraphie d'au moins 50 et ayant une teneur en argent supérieure à 35 % et dont au moins 98 % des particules qui la constituent ont une taille inférieure à 25 µm, au moyen d'un tamis ayant au moins 90 fils par cm, le revêtement dudit tamis étant pourvu de fentes dont la largeur la plus étroite est égale à 0,25 mm ~ 0,05 mm, et en soumettant lesdites pistes à une cuisson.
CA002405991A 2000-04-14 2001-04-17 Substrat transparent pourvu de pistes electroconductrices Expired - Lifetime CA2405991C (fr)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
DE10018902.4 2000-04-14
DE10018902 2000-04-14
DE10038768.3 2000-08-09
DE10038768A DE10038768A1 (de) 2000-04-14 2000-08-09 Verfahren zum Herstellen von elektrischen Leiterbahnen auf Glasscheiben und transparentes Substrat mit einem Muster aus elektrisch leitfähigen Leiterbahnen
DE10056777A DE10056777A1 (de) 2000-04-14 2000-11-16 Verfahren zum Herstellen von elektrischen Leiterbahnen auf Glasscheiben und transparentes Substrat mit einem Muster aus elektrisch leitfähigen Leiterbahnen
DE10056777.0 2000-11-16
FR00/16199 2000-12-13
FR0016199A FR2818087B3 (fr) 2000-12-13 2000-12-13 Procede de fabrication de pistes electroconductrices sur un substrat transparent et substrat obtenu
PCT/FR2001/001175 WO2001080608A1 (fr) 2000-04-14 2001-04-17 Substrat transparent pourvu de pistes electroconductrices

Publications (2)

Publication Number Publication Date
CA2405991A1 true CA2405991A1 (fr) 2001-10-25
CA2405991C CA2405991C (fr) 2009-07-14

Family

ID=41394093

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002405991A Expired - Lifetime CA2405991C (fr) 2000-04-14 2001-04-17 Substrat transparent pourvu de pistes electroconductrices

Country Status (17)

Country Link
US (2) US7053313B2 (fr)
EP (1) EP2140742B1 (fr)
JP (2) JP5255742B2 (fr)
KR (1) KR100758255B1 (fr)
CN (1) CN1279797C (fr)
AT (1) ATE511743T1 (fr)
AU (1) AU5486201A (fr)
BE (1) BE1014124A5 (fr)
BR (1) BRPI0110089B1 (fr)
CA (1) CA2405991C (fr)
CZ (1) CZ307170B6 (fr)
IT (1) ITMI20010807A1 (fr)
MX (1) MXPA02010116A (fr)
PL (1) PL198898B1 (fr)
PT (1) PT2140742E (fr)
SK (1) SK287628B6 (fr)
WO (1) WO2001080608A1 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITMI20010807A1 (it) * 2000-04-14 2002-10-13 Saint Gobain Procedimento per la fabbricazione di piste elettroconduttorici sunun substrato trasparente e substrato ottenuto
WO2007000335A1 (fr) * 2005-06-28 2007-01-04 Nuplex Resins B.V. Produit de polyuree utilise en tant qu'agent modificateur en rheologie thixotropique
KR100953555B1 (ko) * 2006-05-03 2010-04-21 주식회사 엘지화학 투명한 전기 전도성 테이프 및 그 제조방법
JP4355010B2 (ja) * 2006-10-04 2009-10-28 昭栄化学工業株式会社 積層電子部品用導体ペースト
TW200849160A (en) * 2007-04-03 2008-12-16 Koninkl Philips Electronics Nv Light output device
US8895899B2 (en) 2007-10-26 2014-11-25 Philippe Marquet Glazing comprising a network of conducting wires
WO2012096373A1 (fr) 2011-01-14 2012-07-19 旭硝子株式会社 Vitre de véhicule et son procédé de production
JP6137191B2 (ja) 2012-10-25 2017-05-31 旭硝子株式会社 車両用窓ガラスおよびその取付構造
EP3762871A4 (fr) 2018-03-07 2021-11-10 X-Card Holdings, LLC Carte métallique
CN111261803B (zh) * 2020-01-19 2022-05-24 福建华佳彩有限公司 一种改善frit胶凹陷的方法
CN111901980A (zh) * 2020-07-13 2020-11-06 珠海杰赛科技有限公司 挠性线路板制作方法

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1796310C3 (de) 1964-11-09 1974-10-31 Compagnie De Saint-Gobain-Pont-Amousson, Neuilly-Sur-Seine (Frankreich) Verwendung einer metallisches Silber und eine niedrig schmelzende Fritte enthaltenden Paste zur Herstellung einer aus vorgespanntem Glas bestehenden heizbaren Autoscheibe und Vorrichtung zu ihrer Herstellung. Ausscheidung aus: 1480445
US3813519A (en) 1964-11-09 1974-05-28 Saint Gobain Electrically heated glass window
NL169018C (nl) * 1969-03-07 1982-05-17 Saint Gobain Werkwijze voor het vervaardigen van een elektrisch verwarmbare glasruit.
US3830651A (en) 1970-05-25 1974-08-20 Owens Illinois Inc Fine line electronic micro-circuitry printing pastes
US3832527A (en) 1970-12-18 1974-08-27 Asahi Glass Co Ltd Defogging glass plate
US4057671A (en) * 1975-06-27 1977-11-08 Ppg Industries, Inc. Heated laminated window and method of assembling same
GB2091528B (en) * 1981-01-14 1984-11-07 Boussois Sa Heatable panels
US4369063A (en) * 1981-11-12 1983-01-18 Ciba-Geigy Corporation Silver containing conductive coatings
DE3231386A1 (de) 1982-08-24 1984-03-01 Georg 2400 Lübeck Dose Motor
DE3506891A1 (de) 1985-02-27 1986-08-28 VEGLA Vereinigte Glaswerke GmbH, 5100 Aachen Verfahren zur herstellung einer beheizbaren glasscheibe und siebdruckschablone fuer die durchfuehrung des verfahrens
US4716081A (en) * 1985-07-19 1987-12-29 Ercon, Inc. Conductive compositions and conductive powders for use therein
DE3733192C1 (de) * 1987-10-01 1988-10-06 Bosch Gmbh Robert PTC-Temperaturfuehler sowie Verfahren zur Herstellung von PTC-Temperaturfuehlerelementen fuer den PTC-Temperaturfuehler
CA1316303C (fr) * 1988-12-23 1993-04-20 Thijs Eerkes Structure composite
JPH02213432A (ja) * 1989-02-10 1990-08-24 Dai Ichi Kogyo Seiyaku Co Ltd 導電性組成物
US5183593A (en) * 1989-11-14 1993-02-02 Poly-Flex Circuits, Inc. Electrically conductive cement
DE4040446A1 (de) * 1990-12-18 1992-06-25 Degussa Gold(i)mercaptocarbonsaeureester, verfahren zu ihrer herstellung und verwendung
EP0526992B1 (fr) * 1991-07-25 1996-05-01 Ncr International Inc. Dispositif multicouche pour le montage de circuits intégrés et son procédé de fabrication
US5242623A (en) * 1991-08-13 1993-09-07 E. I. Du Pont De Nemours And Company Screen-printable thick film paste composition
JPH06139815A (ja) * 1992-10-28 1994-05-20 Nippon Steel Corp メタライズ用ペースト
JPH0757805A (ja) * 1993-08-10 1995-03-03 Shin Etsu Polymer Co Ltd 熱圧着性接続部材
US5610618A (en) * 1994-12-20 1997-03-11 Ford Motor Company Motor vehicle antenna systems
US5824993A (en) * 1995-05-04 1998-10-20 Ford Motor Company Arrangement for heating an automobile glazing unit
US5650791A (en) * 1995-09-05 1997-07-22 Ford Motor Company Multiband antenna for automotive vehicle
US5906042A (en) * 1995-10-04 1999-05-25 Prolinx Labs Corporation Method and structure to interconnect traces of two conductive layers in a printed circuit board
DE19704334B4 (de) * 1996-02-15 2008-04-17 Gebr. Wunderlich Gmbh & Co Kg Textiles Dämpfungsmaterial und daraus hergestellte Golfabschlagmatte
US6365975B1 (en) * 1997-04-02 2002-04-02 Tessera, Inc. Chip with internal signal routing in external element
JP3705314B2 (ja) * 1997-05-22 2005-10-12 凸版印刷株式会社 スクリーン印刷用スクリーン版
JP3082712B2 (ja) * 1997-06-16 2000-08-28 日本電気株式会社 スクリーン印刷用スキージ
US6164984A (en) * 1999-04-01 2000-12-26 Schreiner Etiketten Und Selbstkelbetechnik Gmbh & Co. Electrical connecting element
ITMI20010807A1 (it) * 2000-04-14 2002-10-13 Saint Gobain Procedimento per la fabbricazione di piste elettroconduttorici sunun substrato trasparente e substrato ottenuto
DE10116653A1 (de) * 2001-04-04 2002-10-10 Dmc2 Degussa Metals Catalysts Cerdec Ag Leitfähigkeitspaste, damit erzeugte Artikel mit einer leitfähigen Beschichtung auf Glas, Keramik und emailliertem Stahl und Verfahren zu deren Herstellung
WO2005044141A2 (fr) * 2003-10-31 2005-05-19 Avery Dennison Corporation Pansement chauffable en contact avec la peau
US20060062898A1 (en) * 2004-09-17 2006-03-23 Eastman Kodak Company Method of making a display sheet comprising discontinuous stripe coating
US20060060135A1 (en) * 2004-09-17 2006-03-23 Eastman Kodak Company Apparatus for forming discontinuous stripe coatings

Also Published As

Publication number Publication date
BRPI0110089B1 (pt) 2015-08-18
EP2140742B1 (fr) 2011-06-01
SK287628B6 (sk) 2011-04-05
MXPA02010116A (es) 2003-06-04
BE1014124A5 (fr) 2003-05-06
CZ307170B6 (cs) 2018-02-21
US20040031146A1 (en) 2004-02-19
PL365984A1 (en) 2005-01-24
CN1436439A (zh) 2003-08-13
SK14752002A3 (sk) 2003-04-01
US7582833B2 (en) 2009-09-01
WO2001080608A1 (fr) 2001-10-25
US20060065435A1 (en) 2006-03-30
EP2140742A1 (fr) 2010-01-06
KR100758255B1 (ko) 2007-09-13
CA2405991C (fr) 2009-07-14
JP2013062249A (ja) 2013-04-04
ATE511743T1 (de) 2011-06-15
ITMI20010807A0 (it) 2001-04-13
KR20040029941A (ko) 2004-04-08
ITMI20010807A1 (it) 2002-10-13
PT2140742E (pt) 2011-09-08
CZ20023414A3 (cs) 2003-08-13
JP5255742B2 (ja) 2013-08-07
PL198898B1 (pl) 2008-07-31
BR0110089A (pt) 2004-12-28
US7053313B2 (en) 2006-05-30
AU5486201A (en) 2001-10-30
JP2003531461A (ja) 2003-10-21
CN1279797C (zh) 2006-10-11

Similar Documents

Publication Publication Date Title
CA2405991A1 (fr) Substrat transparent pourvu de pistes electroconductrices
DE2744167C2 (de) Optoelektronisches Koppelelement
EP1427025A3 (fr) Dispositif photovoltaique et son procédé de fabrication
WO2012031908A1 (fr) Vitre transparente munie d'un revêtement chauffant
EP1022768A3 (fr) Condensateur à couche mince résistant à la tension avec structure interdigitale
FR2653588A1 (fr) Resistance electrique sous forme de puce a montage de surface et son procede de fabrication.
DE102004061949B4 (de) LED mit organischer Kleberschicht
EP2912725A1 (fr) Contact électrique et circuit électronique
EP0717442B1 (fr) Support de connexion d'un circuit intégré à un autre support par l'intermédiare de boules
EP0193464A2 (fr) Procédé de fabrication d'une vitre chauffable et pochoir de sérigraphie pour l'exécution du procédé
EP0817540A3 (fr) Structure électroluminescente utilisant des électrodes lamellaires
DE3137096A1 (de) Anzeigevorrichtung
DE4318463C2 (de) Verfahren zum Herstellen eines Metall-Keramik-Substrates
DE19960450C1 (de) Scheibenelement und Verfahren zu seiner Herstellung
DE2330161A1 (de) Verbesserte schaltkreise und verfahren zu deren herstellung
DE19614501A1 (de) Verfahren zum Herstellen eines Keramik-Metall-Substrates sowie Keramik-Metall-Substrat
DE19545296C2 (de) Infrarotstrahler
WO2000016366A3 (fr) Procede d'application de pistes conductrices metalliques servant d'electrode sur une plaque a canaux pour ecrans plats a grande surface
DE4206365C1 (fr)
EP0937315B1 (fr) Fluide contenant plusieurs particules ayant une surface electriquement conductrice
EP0856868A3 (fr) Procédé de réalisation de sources d'électrons à micropointes et source d'électrons à micropointes obtenue par ce procédé
EP0994778A1 (fr) Racle d'application de produits presentant un degre de viscosite important et des caracteristiques de thixotropie sur un substrat pouvant presenter des variations de hauteur, a travers un pochoir, applique au dit substrat
FR2502231A1 (fr) Glace pour vehicule automobile munie de moyens de fixation
EP0886172A3 (fr) Dispositif d'affichage à cristal liquide et son procédé de fabrication
DE3436001A1 (de) Elektrostatisches glasloeten von halbleiterbauteilen

Legal Events

Date Code Title Description
EEER Examination request
MKEX Expiry

Effective date: 20210419