CA2455739A1 - Heat dissipation device for and method of dissipating heat from a manifold - Google Patents
Heat dissipation device for and method of dissipating heat from a manifold Download PDFInfo
- Publication number
- CA2455739A1 CA2455739A1 CA002455739A CA2455739A CA2455739A1 CA 2455739 A1 CA2455739 A1 CA 2455739A1 CA 002455739 A CA002455739 A CA 002455739A CA 2455739 A CA2455739 A CA 2455739A CA 2455739 A1 CA2455739 A1 CA 2455739A1
- Authority
- CA
- Canada
- Prior art keywords
- manifold
- layer
- heat dissipation
- dissipation device
- injection molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract 28
- 238000000034 method Methods 0.000 title claims 7
- 238000001746 injection moulding Methods 0.000 claims abstract 23
- 238000010438 heat treatment Methods 0.000 claims abstract 2
- 239000010410 layer Substances 0.000 claims 37
- 239000000463 material Substances 0.000 claims 3
- 229910000838 Al alloy Inorganic materials 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 229910000881 Cu alloy Inorganic materials 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- 238000005452 bending Methods 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 230000008878 coupling Effects 0.000 claims 2
- 238000010168 coupling process Methods 0.000 claims 2
- 238000005859 coupling reaction Methods 0.000 claims 2
- 239000002356 single layer Substances 0.000 claims 2
- 229910000640 Fe alloy Inorganic materials 0.000 claims 1
- 229910001069 Ti alloy Inorganic materials 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical group [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 238000001816 cooling Methods 0.000 claims 1
- 239000011152 fibreglass Substances 0.000 claims 1
- 229910001220 stainless steel Inorganic materials 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2725—Manifolds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2737—Heating or cooling means therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2725—Manifolds
- B29C2045/273—Manifolds stacked manifolds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2725—Manifolds
- B29C2045/273—Manifolds stacked manifolds
- B29C2045/2732—Manifolds stacked manifolds sealing means between them
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C2045/277—Spacer means or pressure pads between manifold and mould plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C2045/2795—Insulated runners
Abstract
An injection molding apparatus comprising a hot runner manifold, a heater coupled to the manifold and a heat dissipation device coupled to said manifold, wherein said heat dissipation device reduces hot spots on said manifold caused by uneven heating.
Claims (29)
1. An injection molding apparatus comprising:
a hot runner manifold;
a heater coupled to said manifold; and a heat dissipation device, having a first end coupled to said manifold between said manifold and a cooler member, said cooler member having a lower temperature than said manifold;
wherein said heat dissipation device thermally expands and contacts said cooler member when a temperature of said manifold at said pre-determined location increases above a predetermined temperature.
a hot runner manifold;
a heater coupled to said manifold; and a heat dissipation device, having a first end coupled to said manifold between said manifold and a cooler member, said cooler member having a lower temperature than said manifold;
wherein said heat dissipation device thermally expands and contacts said cooler member when a temperature of said manifold at said pre-determined location increases above a predetermined temperature.
2. The injection molding apparatus as claimed in claim 1, wherein said heat dissipation device comprises a plurality of fins extending from a base.
3. The injection molding apparatus as claimed in claim 1, wherein said heat dissipation device has a second end, said second end being bent towards said cooler member prior to the introduction of heat into said manifold.
4. The injection molding apparatus as claimed in claim 3, wherein said heat dissipation device includes only a single layer of material.
5. The injection molding apparatus as claimed in claim 4, wherein said single layer is selected from the group consisting of copper, copper alloys, aluminum, and aluminum alloys.
6. The injection molding apparatus as claimed in claim 1, wherein said heat dissipation device includes a first layer that is directed toward a surface of said manifold and an opposed second layer.
7. The injection molding apparatus as claimed in claim 6, wherein said first layer is more thermally conductive than said opposed second layer.
8. The injection molding apparatus as claimed in claim 7, wherein said first layer is selected from the group consisting of copper, copper alloys, aluminum, and aluminum alloys.
9. The injection molding apparatus as claimed in claim 7, wherein said second layer is selected from the group consisting of titanium, titanium alloys, stainless steels, iron alloys, ceramic and fiberglass.
10. The injection molding apparatus as claimed in claim 6, wherein said first layer and said second layer are metallic.
11. The injection molding apparatus as claimed in claim 6, wherein said heat dissipation device includes a third layer adjacent to said second layer and opposite said second layer from said first layer.
12. The injection molding apparatus as claimed in claim 11, wherein said first and third layers are materials having a higher coefficient of thermal expansion than said second layer.
13. The injection molding apparatus as claimed in claim 1, wherein said cooler member is a manifold backing plate.
14. The injection molding apparatus as claimed in claim 1, further comprising a plurality of heat dissipation devices having a first end coupled to said manifold.
15. An injection molding apparatus, comprising:
a manifold;
a heater coupled to said manifold; and a heat dissipation device coupled to said manifold, said heat dissipation device having a first orientation when said manifold has a temperature below a predetermined temperature and a second orientation when said manifold has a temperature greater than a predetermined temperature, wherein said first and second orientations differ in that said second orientation contacts an adjacent cooler member.
a manifold;
a heater coupled to said manifold; and a heat dissipation device coupled to said manifold, said heat dissipation device having a first orientation when said manifold has a temperature below a predetermined temperature and a second orientation when said manifold has a temperature greater than a predetermined temperature, wherein said first and second orientations differ in that said second orientation contacts an adjacent cooler member.
16. The injection molding apparatus as claimed in claim 15, wherein said heat dissipation device is bent toward said cooler member prior to introducing heat to said manifold.
17. The injection molding apparatus as claimed in claim 15, wherein said cooler member is a manifold backing plate.
18. The injection molding apparatus as Claimed in claim 15, wherein said heat dissipation device comprises a, first layer and a second layer, wherein said first layer is closer to said manifold than said second layer and said first layer is a material having a greater coefficient of thermal expansion than said second layer.
19. An injection molding apparatus as claimed in claim 15, wherein said heat dissipation device includes a plurality of fin portions extending from a band portion.
20. A method of locally cooling a manifold of an injection molding apparatus comprising:
measuring the temperature of said manifold;
identifying high temperature locations on a surface of said manifold;
coupling a first end of a heat dissipation device to said surface of said manifold at said high temperature locations;
positioning a second end of said heat dissipation device such that thermal expansion causes said second end to come into contact with a cooler member when the temperature of said surface at said high temperature locations increases to a predetermined temperature; and heating said manifold surface to a temperature greater than said predetermined temperature.
measuring the temperature of said manifold;
identifying high temperature locations on a surface of said manifold;
coupling a first end of a heat dissipation device to said surface of said manifold at said high temperature locations;
positioning a second end of said heat dissipation device such that thermal expansion causes said second end to come into contact with a cooler member when the temperature of said surface at said high temperature locations increases to a predetermined temperature; and heating said manifold surface to a temperature greater than said predetermined temperature.
21. The method of claim 20, further comprising bending said second end away from said manifold surface and towards said cooler member.
22. The method of claim 20, wherein said cooler member is a manifold backing plate.
23. A heat dissipation device for use with a hot runner manifold apparatus, comprising:
a first end thermally coupled with a hot runner manifold, a second end and one or more thermally conductive layers, wherein said second end of said heat dissipation device thermally expands and contacts a cooler portion of said manifold apparatus only at temperatures above a predetermined temperature.
a first end thermally coupled with a hot runner manifold, a second end and one or more thermally conductive layers, wherein said second end of said heat dissipation device thermally expands and contacts a cooler portion of said manifold apparatus only at temperatures above a predetermined temperature.
24. A heat dissipation device as claimed in claim 23, wherein said second end of said heat dissipation device is bent away from said manifold.
25. A heat dissipation device as claimed in claim 23, further comprising a first layer directed towards an outer surface of said manifold and a second layer adjacent to said first layer, wherein said first layer has a greater coefficient of thermal expansion than said second layer.
26. A heat dissipation device as claimed in claim 25, further comprising a third layer adjacent said second layer and opposite said second layer from said first layer, wherein said third layer has a greater coefficient of thermal expansion than said second layer.
27. A method of dissipating heat from a manifold of an injection molding apparatus, comprising:
providing an injection molding apparatus including a manifold;
providing a manifold backing plate adjacent but not contacting said manifold;
providing at least one heat dissipation device having a first end and a second end;
coupling said first end to said manifold;
directing heat away from said manifold by allowing said heat dissipation device to thermally expand and contact said. manifold backing plate when said manifold temperature increases beyond a predetermined temperature.
providing an injection molding apparatus including a manifold;
providing a manifold backing plate adjacent but not contacting said manifold;
providing at least one heat dissipation device having a first end and a second end;
coupling said first end to said manifold;
directing heat away from said manifold by allowing said heat dissipation device to thermally expand and contact said. manifold backing plate when said manifold temperature increases beyond a predetermined temperature.
28. A method of dissipating heat from a manifold as claimed in claim 27, further comprising bending said heat dissipation device away from said manifold and towards said manifold backing plate.
29. A method of dissipating heat from a manifold as claimed in claim 27, wherein said heat dissipation device comprises a first layer directed towards an outer surface of said manifold and a second layer adjacent to said first layer, said first layer having a greater coefficient of thermal expansion than said second layer.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US44814603P | 2003-02-20 | 2003-02-20 | |
| US60/448,146 | 2003-02-20 | ||
| US45249703P | 2003-03-07 | 2003-03-07 | |
| US60/452,497 | 2003-03-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2455739A1 true CA2455739A1 (en) | 2004-08-20 |
| CA2455739C CA2455739C (en) | 2011-04-26 |
Family
ID=32872058
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2455537A Expired - Fee Related CA2455537C (en) | 2003-02-20 | 2004-01-21 | Heat dissipation device for and method of dissipating heat from a nozzle |
| CA2455739A Expired - Fee Related CA2455739C (en) | 2003-02-20 | 2004-01-21 | Heat dissipation device for and method of dissipating heat from a manifold |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2455537A Expired - Fee Related CA2455537C (en) | 2003-02-20 | 2004-01-21 | Heat dissipation device for and method of dissipating heat from a nozzle |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US7105123B2 (en) |
| CA (2) | CA2455537C (en) |
| DE (2) | DE102004002882B4 (en) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7342206B2 (en) * | 2004-01-06 | 2008-03-11 | Watlow Electric Manufacturing Company | Tailored heat transfer layered heater system |
| US7160100B2 (en) | 2004-01-06 | 2007-01-09 | Mold-Masters Limited | Injection molding apparatus having an elongated nozzle incorporating multiple nozzle bodies in tandem |
| CA2482254A1 (en) * | 2004-04-07 | 2005-10-07 | Mold-Masters Limited | Modular injection nozzle having a thermal barrier |
| US7232305B2 (en) * | 2005-05-20 | 2007-06-19 | Husky Injection Molding Systems, Ltd. | Load management device for a feed body of a molding machine |
| US20060289683A1 (en) * | 2005-06-23 | 2006-12-28 | Akzo Nobel Coatings International B.V. | Dispenser |
| US7421310B2 (en) * | 2006-06-12 | 2008-09-02 | Husky Injection Molding Systems Ltd. | Method and apparatus for controlling cooling rates during post-mold cooling of a molded article |
| DE102006049667A1 (en) * | 2006-10-18 | 2008-04-24 | Günther Heisskanaltechnik Gmbh | Electric heating device for hot runner systems |
| CN101518933A (en) * | 2008-02-29 | 2009-09-02 | 深圳富泰宏精密工业有限公司 | Hot runner and mould provided with hot runner |
| CN101544030B (en) * | 2008-03-25 | 2012-03-28 | 鸿富锦精密工业（深圳）有限公司 | Mould with thermal compensation function |
| US7972132B2 (en) * | 2008-10-10 | 2011-07-05 | Mold-Masters (2007) Ltd | Injection molding valve gated hot runner nozzle |
| WO2011008583A1 (en) * | 2009-07-17 | 2011-01-20 | Husky Injection Molding Systems Ltd | Modular manifold system |
| JP5587615B2 (en) | 2010-01-18 | 2014-09-10 | 本田技研工業株式会社 | Casting method |
| DE102010033153B4 (en) | 2010-08-03 | 2020-06-18 | Otto Männer Innovation GmbH | Injection molding nozzle |
| TW201233521A (en) * | 2011-02-01 | 2012-08-16 | Quanta Comp Inc | Plastic material injection molding system |
| US9446543B2 (en) * | 2012-12-03 | 2016-09-20 | Fostag Formenbau Ag | Injection mould with hot runner manifold |
| WO2014133702A1 (en) * | 2013-02-27 | 2014-09-04 | Husky Injection Molding Systems Ltd. | Hot runner and components thereof with a melt conditioning zone |
| US9144930B2 (en) | 2013-04-09 | 2015-09-29 | Otto Männer Innovation GmbH | Heater and thermocouple assembly |
| CN104265737A (en) * | 2014-09-12 | 2015-01-07 | 苏州好特斯模具有限公司 | Rapid cooling waterway supporting plate |
| US10672695B2 (en) | 2015-12-23 | 2020-06-02 | Intel Corporation | Multi-layer molded substrate with graded CTE |
| KR101945982B1 (en) * | 2017-04-14 | 2019-02-08 | 주식회사 유도 | Hot runner system to apply heat spreader |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1174020A (en) | 1982-01-06 | 1984-09-11 | Jobst U. Gellert | Injection molding manifold member and method of manufacture |
| CA1177215A (en) * | 1982-03-31 | 1984-11-06 | Jobst U. Gellert | Heater installation in molding members |
| CA1230458A (en) * | 1984-07-13 | 1987-12-22 | Gellert, Jobst Ulrich | Injection molding heated nozzle with brazed in heating element and method of manufacture |
| CA1238163A (en) | 1985-04-09 | 1988-06-21 | Jobst U. Gellert | Composite plate method of manufacturing injection molding manifold |
| CA2022123C (en) | 1990-07-27 | 1998-02-03 | Jobst Ulrich Gellert | Injection molding insulative and resilient spacer member |
| US5360333A (en) | 1992-09-30 | 1994-11-01 | Husky Injection Molding Systems Ltd. | Band heater clamp arrangement for an injection molding machine |
| US5352109A (en) * | 1993-03-08 | 1994-10-04 | Salvatore Benenati | Injection molding apparatus |
| DE4320584A1 (en) | 1993-06-22 | 1995-01-05 | Wolff Hans Martin | Hot runner manifold |
| US5411392A (en) | 1993-11-15 | 1995-05-02 | Husky Injection Molding Systems Ltd. | Heated nozzle assembly including a heater clamp arrangement |
| CA2221425C (en) * | 1997-11-13 | 2005-07-12 | Jobst Ulrich Gellert | Side gated injection molding apparatus with actuated manifold |
| CA2273517C (en) * | 1999-06-01 | 2008-04-01 | Jobst Ulrich Gellert | Injection molding heater with melt bore therethrough |
| JP2002331552A (en) | 2001-05-09 | 2002-11-19 | Mitsubishi Materials Corp | Valve gate type die device |
| AU2003202931A1 (en) * | 2002-01-09 | 2003-07-30 | Mold-Masters Limited | Method and apparatus for measuring the temperature of molten material in a mold cavity |
| ATE552960T1 (en) * | 2002-02-05 | 2012-04-15 | Mold Masters 2007 Ltd | INJECTION MOLDING DEVICE HAVING AN INJECTION NOZZLE WITH HEATED HEAD PART |
| JP3813527B2 (en) | 2002-03-26 | 2006-08-23 | 本田技研工業株式会社 | In-mold nozzle structure of hot runner mold |
-
2004
- 2004-01-13 US US10/755,367 patent/US7105123B2/en active Active
- 2004-01-13 US US10/755,366 patent/US7118703B2/en active Active
- 2004-01-20 DE DE102004002882.6A patent/DE102004002882B4/en not_active Expired - Fee Related
- 2004-01-20 DE DE102004002883.4A patent/DE102004002883B4/en not_active Expired - Fee Related
- 2004-01-21 CA CA2455537A patent/CA2455537C/en not_active Expired - Fee Related
- 2004-01-21 CA CA2455739A patent/CA2455739C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CA2455739C (en) | 2011-04-26 |
| CA2455537C (en) | 2011-11-29 |
| US7118703B2 (en) | 2006-10-10 |
| DE102004002883A1 (en) | 2004-09-23 |
| DE102004002883B4 (en) | 2019-03-14 |
| DE102004002882B4 (en) | 2019-02-28 |
| US20040166194A1 (en) | 2004-08-26 |
| US7105123B2 (en) | 2006-09-12 |
| CA2455537A1 (en) | 2004-08-20 |
| DE102004002882A1 (en) | 2004-09-16 |
| US20040166195A1 (en) | 2004-08-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| MKLA | Lapsed |
Effective date: 20200121 |