CA2480144A1 - Rtm and ri processable polymide resins - Google Patents

Rtm and ri processable polymide resins Download PDF

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Publication number
CA2480144A1
CA2480144A1 CA002480144A CA2480144A CA2480144A1 CA 2480144 A1 CA2480144 A1 CA 2480144A1 CA 002480144 A CA002480144 A CA 002480144A CA 2480144 A CA2480144 A CA 2480144A CA 2480144 A1 CA2480144 A1 CA 2480144A1
Authority
CA
Canada
Prior art keywords
rtm
resin
inventive
processable
resins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002480144A
Other languages
French (fr)
Other versions
CA2480144C (en
Inventor
Gary L. Deets
Jianming Xiong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
I S T Corp
Original Assignee
I S T (MA) Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by I S T (MA) Corp filed Critical I S T (MA) Corp
Publication of CA2480144A1 publication Critical patent/CA2480144A1/en
Application granted granted Critical
Publication of CA2480144C publication Critical patent/CA2480144C/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003Preparatory processes
    • C08G73/1007Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003Preparatory processes
    • C08G73/1007Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • C08G73/1014Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents in the form of (mono)anhydrid
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/1064Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075Partially aromatic polyimides
    • C08G73/1082Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31721Of polyimide

Abstract

Polyimide resins that are suitable for processing by resin transfer molding (RTM) and resin infusion (RI) methods at reduced processing temperatures are provided. The inventive RTM and RI processable polyimide resins exhibit melting at temperatures of less than about 200 °C and melt viscosities at 200 °C of less than about 3000 centipoise. A process for synthesizing the inventive resins is also provided, as is a fiber-reinforced composite material. The fiber- reinforced composite material employs the inventive polyimide resin as its resin matrix and demonstrates good heat resistance and mechanical properties.
CA002480144A 2003-09-02 2004-09-02 Rtm and ri processable polymide resins Active CA2480144C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US49984903P 2003-09-02 2003-09-02
US60/499,849 2003-09-02

Publications (2)

Publication Number Publication Date
CA2480144A1 true CA2480144A1 (en) 2005-03-02
CA2480144C CA2480144C (en) 2009-04-21

Family

ID=34135363

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002480144A Active CA2480144C (en) 2003-09-02 2004-09-02 Rtm and ri processable polymide resins

Country Status (8)

Country Link
US (1) US7129318B2 (en)
EP (1) EP1514888B1 (en)
JP (1) JP4537158B2 (en)
CA (1) CA2480144C (en)
ES (1) ES2421646T3 (en)
MX (1) MXPA04008505A (en)
PL (1) PL1514888T3 (en)
PT (1) PT1514888E (en)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7994274B2 (en) * 2003-09-02 2011-08-09 I.S.T. (Ma) Corporation Two-stage cure polyimide oligomers
US20070265422A1 (en) * 2006-05-12 2007-11-15 General Electric Company Method for making copolymeric polyimide resins
US20070265417A1 (en) * 2006-05-12 2007-11-15 General Electric Company Crosslinked polyimide copolymer material
US20070265420A1 (en) * 2006-05-12 2007-11-15 General Electric Company fiber reinforced gas turbine engine component
US8030433B2 (en) 2006-05-12 2011-10-04 General Electric Company RTM and RI processible tailorable polyimide resin systems and composite articles formed therefrom
US8633284B2 (en) * 2006-05-12 2014-01-21 General Electric Company Tailorable polyimide prepolymer blends, crosslinked polymides and articles formed therefrom
US20070265416A1 (en) * 2006-05-12 2007-11-15 General Electric Company Polyimide blend with tailorable properties
US20070265421A1 (en) * 2006-05-12 2007-11-15 General Electric Company Method for making a prepolymer polyimide resin blend
US8030437B2 (en) 2006-05-12 2011-10-04 General Electric Company Methods for forming composite articles from tailorable polyimide resin systems using RTM and RI techniques
JPWO2008004615A1 (en) * 2006-07-07 2009-12-03 三菱瓦斯化学株式会社 Polyimide resin
EP2045295B1 (en) * 2006-07-20 2012-12-12 Mitsubishi Gas Chemical Company, Inc. Thermocurable polyimide resin composition
US8309663B2 (en) * 2007-05-31 2012-11-13 The Boeing Company Water-entrained-polyimide chemical compositions for use in high-performance composite fabrication
US20080300374A1 (en) * 2007-05-31 2008-12-04 The Boeing Company Dinadic phenyl amine reactive endcaps
US7825211B2 (en) * 2007-06-22 2010-11-02 The Boeing Company Single-step-processable polyimides
US20090112650A1 (en) * 2007-10-31 2009-04-30 Iwane Donna S Online method of procuring mortgage loans
JP2009114415A (en) * 2007-11-09 2009-05-28 Nitto Denko Corp Resin for optical-semiconductor-element encapsulation containing polyimide and optical semiconductor device obtained with the same
US20110003955A1 (en) * 2008-02-07 2011-01-06 Daiwa Can Company Imide Oligomer And Polyimide Resin Obtained By Thermal Curing Thereof
JP2010006983A (en) * 2008-06-27 2010-01-14 Hitachi Chem Co Ltd Sealing filler and semiconductor device
DE102008038295B4 (en) * 2008-08-18 2013-11-28 Eads Deutschland Gmbh Granulation and stabilization of resin systems for use in the manufacture of fiber composite components
KR101397703B1 (en) 2011-12-26 2014-05-22 제일모직주식회사 Polyamide resin, a method for preparing the same, and an article comprising the same
US8962890B1 (en) 2012-04-20 2015-02-24 The United States Of America As Represented By The Secretary Of The Air Force Multifunctional crosslinkers for shape-memory polyimides, polyamides and poly(amide-imides) and methods of making the same
US8791227B1 (en) * 2012-04-20 2014-07-29 The United States Of America As Represented By The Secretary Of The Air Force Crosslinked aromatic polyimides and methods of making the same
WO2013181333A1 (en) 2012-06-01 2013-12-05 E. I. Du Pont De Nemours And Company An electrochemical cell comprising a nanoweb comprising nanofibers of a cross-linked polyimide
US9085661B1 (en) 2012-10-26 2015-07-21 The United States Of America As Represented By The Secretary Of The Air Force Photomechanically active copolyimides derived from an azobenzenediamine, a rigid dianhydride, and a flexible dianhydride
US9139696B1 (en) 2014-03-28 2015-09-22 The United States Of America, As Represented By The Secretary Of The Air Force Aromatic diamines containing three ether-linked-benzonitrile moieties, polymers thereof, and methods of making the same
US9644071B1 (en) 2014-09-05 2017-05-09 The United States Of America As Represented By The Secretary Of The Air Force Bis(azobenzene) diamines and photomechanical polymers made therefrom
KR101841977B1 (en) 2015-03-19 2018-03-26 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 Polyimide resin
US10239254B1 (en) 2015-08-07 2019-03-26 The United States Of America As Represented By The Secretary Of The Air Force Method of fabricating shape memory films
US10294255B1 (en) 2015-08-07 2019-05-21 The United States Of America As Represented By The Secretary Of The Air Force Multifunctional crosslinking agent, crosslinked polymer, and method of making same
KR101786509B1 (en) 2016-02-04 2017-10-18 국방과학연구소 Resin composition for producing high temperature heat resistingprepreg and method for producing the same
WO2018180930A1 (en) 2017-03-30 2018-10-04 株式会社カネカ Semipreg, prepreg, resin composite material, and production methods thereof
KR102627227B1 (en) * 2017-08-23 2024-01-22 유비이 가부시키가이샤 Binder resin for electrodes, electrode mixture paste, electrode, and method for producing electrode
KR102521984B1 (en) * 2022-05-17 2023-04-27 주식회사 씨지피머트리얼즈 Method for manufacturing colorless and transparent polyimide film, and colorless and transparent polyimide film prepared by manufacturing method thereof

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4389504A (en) 1981-10-02 1983-06-21 The United States Of America As Represented By The United States National Aeronautics And Space Administration Office Of General Counsel-Code Gp Elastomer toughened polyimide adhesives
US4837300A (en) * 1985-06-20 1989-06-06 The United States Of America As Represented By The Administration Of The National Aeronautics And Space Administration Copolyimide with a combination of flexibilizing groups
JPS6454030A (en) 1987-08-25 1989-03-01 Ube Industries Terminal-modified imide oligomer and its solution composition
US5817744A (en) 1988-03-14 1998-10-06 The Boeing Company Phenylethynyl capped imides
US4861882A (en) 1988-07-14 1989-08-29 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Ethynyl terminated imidothioethers and resins therefrom
US5338827A (en) 1990-01-30 1994-08-16 Trw Inc. Polyimide resins useful at high temperatures
DE69115076T2 (en) * 1990-02-20 1996-05-09 Nat Starch Chem Invest Diarylacetylene end-capped polyimides.
US5145943A (en) 1990-12-17 1992-09-08 Ethyl Corporation Production of particulate amide/imide prepolymers
DE4232523A1 (en) 1992-09-29 1994-03-31 Basf Ag Thermoplastic polyimide-sulphone(s) - from mixts. of oxy-di:phthalic anhydride, di:amino:di:aryl-sulphone(s), other di:anhydride(s) and di:amine(s), and mono:anhydride(s) or -amine(s)
US5344982A (en) 1993-04-02 1994-09-06 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Diamines and polyimides containing pendent ethynyl groups
GB9310400D0 (en) 1993-05-20 1993-07-14 Ici Composites Inc Curable compositions
US5412066A (en) 1994-03-03 1995-05-02 Ther United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Phenylethynyl terminated imide oligomers
US5567800A (en) 1994-10-28 1996-10-22 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Imide oligomers endcapped with phenylethynyl phthalic anhydrides and polymers therefrom
US5606014A (en) 1995-08-04 1997-02-25 The United States Of America As Represented By The United States National Aeronautics And Space Administration Imide oligomers and co-oligomers containing pendent phenylethynyl groups and polymers therefrom
ATE210693T1 (en) * 1995-11-13 2001-12-15 Cytec Tech Corp HEAT CURING POLYMERS FOR COMPOSITE AND ADHESIVE APPLICATIONS
US5965687A (en) 1996-03-05 1999-10-12 The United States Of America Represented By The Adminstrator Of The National Aeronautics And Space Administration Method of preparing polymers with low melt viscosity
JPH10279799A (en) 1997-04-04 1998-10-20 Nitto Denko Corp Thermosetting resin composition
DE69919487T2 (en) 1998-05-29 2005-09-08 The Government Of The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration (Nasa) FIXED RESIDUES FROM POLYIMID CARRIER
US6133330A (en) 1998-05-29 2000-10-17 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Aromatic polyimide foam
DE19828248A1 (en) 1998-06-25 1999-12-30 Abb Corporate Research Ltd Bad Low temperature curing epoxy resin system, useful as an adhesive, matrix resin or casting resin
US6114494A (en) * 1998-12-03 2000-09-05 Ranbar Electrical Materials, Inc. Polyimide material and method of manufacture
JP4719976B2 (en) 1999-03-11 2011-07-06 東レ株式会社 Epoxy resin composition, epoxy resin composition for fiber reinforced composite material, and fiber reinforced composite material having the same
US6124035A (en) 1999-04-13 2000-09-26 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration High temperature transfer molding resins
US6359107B1 (en) * 2000-05-18 2002-03-19 The United States Of America As Represented By The Administrator, National Aeronautics And Space Administration Composition of and method for making high performance resins for infusion and transfer molding processes
US5994418A (en) 1999-05-21 1999-11-30 The United States Of America As Represented By The Administrator Of The National Aeronautica And Space Administration Hollow polyimide microspheres
US6514370B1 (en) 2000-06-08 2003-02-04 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Dry process for manufacturing hybridized boron fiber/carbon fiber thermoplastic composite materials from a solution coated precursor
US6511789B2 (en) 2000-06-26 2003-01-28 Arch Specialty Chemicals, Inc. Photosensitive polyimide precursor compositions
US6528145B1 (en) 2000-06-29 2003-03-04 International Business Machines Corporation Polymer and ceramic composite electronic substrates
JP4461606B2 (en) 2000-10-31 2010-05-12 宇部興産株式会社 Polyimide powder manufacturing method, polyimide powder, polyimide powder molded body and manufacturing method thereof
US6444783B1 (en) 2000-12-21 2002-09-03 E. I. Du Pont De Nemours And Company Melt-processible semicrystalline block copolyimides
US6476182B1 (en) 2000-12-21 2002-11-05 E. I. Du Pont De Nemours And Company Melt-processible, thermoplastic random copolyimides having recoverable crystallinity and associated processes
JP4133561B2 (en) 2003-05-07 2008-08-13 Jsr株式会社 Polyamic acid oligomers, polyimide oligomers, solution compositions, and fiber reinforced composite materials

Also Published As

Publication number Publication date
US20050080229A1 (en) 2005-04-14
EP1514888B1 (en) 2013-04-17
EP1514888A1 (en) 2005-03-16
JP4537158B2 (en) 2010-09-01
JP2005076032A (en) 2005-03-24
US7129318B2 (en) 2006-10-31
PT1514888E (en) 2013-06-28
PL1514888T3 (en) 2013-09-30
CA2480144C (en) 2009-04-21
ES2421646T3 (en) 2013-09-04
MXPA04008505A (en) 2005-11-17

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