CA2485230A1 - Thermally or electrically conductive gap filler - Google Patents

Thermally or electrically conductive gap filler Download PDF

Info

Publication number
CA2485230A1
CA2485230A1 CA 2485230 CA2485230A CA2485230A1 CA 2485230 A1 CA2485230 A1 CA 2485230A1 CA 2485230 CA2485230 CA 2485230 CA 2485230 A CA2485230 A CA 2485230A CA 2485230 A1 CA2485230 A1 CA 2485230A1
Authority
CA
Canada
Prior art keywords
compound
gap
dispensed
filler component
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA 2485230
Other languages
French (fr)
Other versions
CA2485230C (en
Inventor
Michael H. Bunyan
Miksa De Sorgo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Parker Hannifin Corp
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=29712136&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CA2485230(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Individual filed Critical Individual
Publication of CA2485230A1 publication Critical patent/CA2485230A1/en
Application granted granted Critical
Publication of CA2485230C publication Critical patent/CA2485230C/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Abstract

Application of a thermally and/or electrically conductive compound to fill a thermal and/or EMI shielding gap between a first and a second surface. A supply of a fluent, form-stable compound is provided as an admixture of a cured polymer gel component, and a particulate filler component. An of the compound is dispensed from a nozzle or other orifice under an applied pressu re onto one of the surfaces which, when opposed, form the gap, or into the gap formed between the surfaces. The gap is at least partially filled by at leas t a portion of the dispensed compound.

Claims (17)

1. A method of filling a gap between a first and a second surface, the method comprising the steps of:
(a) providing a supply of a fluent, form-stable compound;
(b) providing an orifice connected in fluid communication with the supply of the compound;
(c) dispensing from the orifice under an applied pressure an amount of the compound; and (d) prior to or following step (c), forming the gap between the first and the second surface, the gap being at least partially filled by at least a portion of the compound dispensed in step (c), the method being characterized in that:
the compound provided in step (a) comprises an admixture of: (I) a cured polymer gel component; and (II) a particulate filler component.
2. The method of claim 1 wherein:
the compound dispensed in step (c) is dispensed onto one of the first and the second surface; and the gap of step (d) is formed following step (d) by disposing the one of the first and the second surfaces as adjoining the other of the first and the second surface, with the compound dispensed in step (c) being deflected therebetween to at least partially fill the gap.
3. The method of claim 1 wherein:
the gap of step (d) is formed prior to step (d); and the compound dispensed in step (c) is dispensed into the gap.
4, The method of claim 1 wherein the compound comprises, by total weight of the components (I) and (II), between about 20-80% of the filler component.
5. The method of claim 1 wherein the filler component has a mean average particle size of between about 0.01-10 mil (0.25-250 µm).
6. The method of claim 1 wherein the gap formed in step (d) has a thickness of between about 2-100 mils (0.05-2.5 mm).
7. The method of claim 1 wherein:
the gap is a thermal gap; and the filler component is thermally-conductive.
8. The method of claim 7 wherein the filler component has a thermal conductivity of at least about 20 W/m-K.
9. The method of claim 7 wherein the filler component is selected from the group consisting of oxide, nitride, carbide, diboride, graphite, and metal particles, and mixtures thereof.
10. The method of claim 7 wherein the compound has a thermal conductivity of at least about 0.5 W/m-K.
11. The method of claim 1 wherein the compound has a viscosity of about 15 million cps at about 25-30°C.
12. The method of claim 1 wherein the compound is provided in step (a) as charged into a container.
13. The method of claim 2 wherein the compound is substantially self adherent to at least the one of the first and the second surface onto which the compound is dispensed in step (c).
14. The method of claim 1 wherein:
the gap is an EMI shielding gap; and the filler component is electrically-conductive.
15. The method of claim 14 wherein the compound has an electrical volume resistivity of not greater than about 1 .OMEGA.-cm.
16. The method of claim 1 wherein the compound exhibits an EMI shielding effectiveness of at least about 60 dB substantially over a frequency range of between about 10 MHz and about 10 GHz.
17. The method of claim 1 wherein the polymer gel component comprises a silicone polymer.
CA 2485230 2002-05-31 2003-02-03 Thermally or electrically conductive gap filler Expired - Lifetime CA2485230C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US38514502P 2002-05-31 2002-05-31
US60/385,145 2002-05-31
PCT/US2003/003406 WO2003103044A1 (en) 2002-05-31 2003-02-03 Thermally or electrically conductive gap filler

Publications (2)

Publication Number Publication Date
CA2485230A1 true CA2485230A1 (en) 2003-12-11
CA2485230C CA2485230C (en) 2012-01-24

Family

ID=29712136

Family Applications (1)

Application Number Title Priority Date Filing Date
CA 2485230 Expired - Lifetime CA2485230C (en) 2002-05-31 2003-02-03 Thermally or electrically conductive gap filler

Country Status (5)

Country Link
US (1) US7208192B2 (en)
EP (1) EP1509951A1 (en)
AU (1) AU2003225546A1 (en)
CA (1) CA2485230C (en)
WO (1) WO2003103044A1 (en)

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Also Published As

Publication number Publication date
US7208192B2 (en) 2007-04-24
CA2485230C (en) 2012-01-24
AU2003225546A1 (en) 2003-12-19
WO2003103044A1 (en) 2003-12-11
EP1509951A1 (en) 2005-03-02
US20030222249A1 (en) 2003-12-04

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Effective date: 20230203