CA2516977A1 - Method for high-frequency tuning an electrical device, and a printed circuit board therefor - Google Patents
Method for high-frequency tuning an electrical device, and a printed circuit board therefor Download PDFInfo
- Publication number
- CA2516977A1 CA2516977A1 CA002516977A CA2516977A CA2516977A1 CA 2516977 A1 CA2516977 A1 CA 2516977A1 CA 002516977 A CA002516977 A CA 002516977A CA 2516977 A CA2516977 A CA 2516977A CA 2516977 A1 CA2516977 A1 CA 2516977A1
- Authority
- CA
- Canada
- Prior art keywords
- circuit board
- printed circuit
- conductor track
- frequency
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
- H01R13/6464—Means for preventing cross-talk by adding capacitive elements
- H01R13/6466—Means for preventing cross-talk by adding capacitive elements on substrates, e.g. printed circuit boards [PCB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6473—Impedance matching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/171—Tuning, e.g. by trimming of printed components or high frequency circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S439/00—Electrical connectors
- Y10S439/941—Crosstalk suppression
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
- Y10T29/49135—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting and shaping, e.g., cutting or bending, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49174—Assembling terminal to elongated conductor
Abstract
The invention relates to a method for high-frequency tuning a high-frequency plug connector (1), comprising a printed circuit board (3) that has both contact points (21-28) for high-frequency contacts as well as contact points (31-38) for insulation displacement contacts. Each contact point (21-28) for the high-frequency contacts is connected to one respective contact point (31-38) for the insulation displacement contacts. Capacitive couplings, which cause a near-end crosstalk, occur between the high-frequency contacts. At least one first conductor path (46), which is connected on only one side to a contact point (26) of an electrical contact, is situated on the printed circuit board (3) that, together with at least one second conductor path (44), which is situated on and/or in the printed circuit board (3), forms a capacitor (C46). At least one frequency-dependent parameter of the device is measured, and this frequency-dependent parameter is compared to a set parameter and, according to on a difference between the two, the conductor path (46) that is contacted on one side is partially removed or completely separated.
Claims (16)
1. A method for RF matching of an electrical arrangement, with the electrical arrangement having at least one printed circuit board on which electrical components are arranged which have capacitive couplings, wherein at least one first conductor track (46), which is connected on only one side to a contact point (26) of an electrical component, is arranged on the printed circuit board (3) and, together with at least one second conductor track (44) which is arranged on and/or in the printed circuit board (3), forms a capacitor (C46), with at least one frequency-dependent parameter of the arrangement being measured, the frequency-dependent parameter being compared with a nominal parameter, and the conductor track (46) with which contact is made on one side being partially removed or cut through as a function of the difference.
2. The method as claimed in claim 1, wherein the second conductor track (44) is in the form of a conductor track (44) with which contact is made on one side.
3. The method as claimed in claim 1 or 2, wherein at least one further second conductor track is arranged in an internal layer in the printed circuit board (3) and is connected to the second conductor track (44) that is arranged on the printed circuit board (3).
4. The method as claimed in one of the preceding claims, wherein at least two matchable capacitors (C46, C35) are arranged on the printed circuit board (3).
5. The method as claimed in one of the preceding claims, wherein the frequency-dependent parameters are determined on the unpopulated printed circuit board (3).
6. The method as claimed in one of the preceding claims, wherein in a first step, only a portion of the estimated conductor track shortening (L) that is necessary is carried out, the frequency-dependent parameter is measured once again, and the remaining conductor track length which is still to be removed or to be cut is determined from this.
7. The method as claimed in claim 6, wherein, in the final step, the conductor track (46, 45) is cut in a broader manner than in the first step.
8. The method as claimed in one of the preceding claims, wherein near crosstalk (NEXT) is determined as the frequency-dependent parameter.
9. The method as claimed in one of the preceding claims, wherein the conductor track (46, 45) is cut by means of a laser.
10. The method as claimed in one of the preceding claims, wherein the process of controlling the laser is assisted by means of an optical system.
11. A printed circuit board for holding components for radio-frequency applications, comprising contact points for the components and conductor tracks, with capacitive couplings being produced between the components, wherein at least one first conductor track (46), which is connected on only one side to a contact point (26) of an electrical component, is arranged on the printed circuit board (3) and, together with at least one second conductor track (44) which is arranged on the printed circuit board (3), forms a capacitor (C46).
12. The printed circuit board as claimed in claim 11, wherein the second conductor track (44) is likewise a conductor track (44) which is connected to a contact point (24) on one side.
13. The printed circuit board as claimed in claim 11 or 12, wherein at least one further second conductor track is arranged in an internal layer in the printed circuit board (3) and is connected to the further conductor track (44) that is arranged on the printed circuit board (3).
14. The printed circuit board as claimed in one of claims 11 to 13, wherein at least two matchable capacitors (C46, C35) are arranged on the printed circuit board (3).
15. The printed circuit board as claimed in one of claims 11 to 14, wherein the printed circuit board (3) is fitted with RF contacts and insulation-displacement contacts for an RJ-45 female connection.
16. The printed circuit board as claimed in claim 15, wherein the first capacitor (C46) is arranged between the contact points (24 and 26), and the second capacitor (C35) is arranged between the contact points (23 and 25).
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10310434A DE10310434A1 (en) | 2003-03-11 | 2003-03-11 | Method for RF tuning of an electrical arrangement and a circuit board suitable for this |
DE10310434.8 | 2003-03-11 | ||
PCT/EP2004/001952 WO2004082343A1 (en) | 2003-03-11 | 2004-02-27 | Method for high-frequency tuning an electrical device, and a printed circuit board suitable therefor |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2516977A1 true CA2516977A1 (en) | 2004-09-23 |
CA2516977C CA2516977C (en) | 2012-02-21 |
Family
ID=32920703
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA2516977A Expired - Fee Related CA2516977C (en) | 2003-03-11 | 2004-02-27 | Method for high-frequency tuning an electrical device, and a printed circuit board therefor |
Country Status (26)
Country | Link |
---|---|
US (3) | US7401402B2 (en) |
EP (1) | EP1602263B1 (en) |
JP (1) | JP4685759B2 (en) |
KR (1) | KR100806090B1 (en) |
CN (1) | CN100534258C (en) |
AR (1) | AR043526A1 (en) |
AU (1) | AU2004219120B9 (en) |
BR (1) | BRPI0408208A (en) |
CA (1) | CA2516977C (en) |
CL (1) | CL2004000485A1 (en) |
DE (1) | DE10310434A1 (en) |
HK (1) | HK1090245A1 (en) |
HR (1) | HRP20050785B1 (en) |
IL (1) | IL170756A (en) |
ME (1) | MEP29608A (en) |
MX (1) | MXPA05009326A (en) |
MY (1) | MY138688A (en) |
NO (1) | NO20054626L (en) |
NZ (1) | NZ542327A (en) |
PL (1) | PL205021B1 (en) |
RS (1) | RS50882B (en) |
RU (1) | RU2309546C2 (en) |
TW (1) | TWI244246B (en) |
UA (1) | UA89612C2 (en) |
WO (1) | WO2004082343A1 (en) |
ZA (1) | ZA200507268B (en) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1723702B1 (en) * | 2004-03-12 | 2015-10-28 | Panduit Corporation | Methods and apparatus for reducing crosstalk in electrical connectors |
DE102006056001B4 (en) | 2006-11-24 | 2008-12-04 | Phoenix Contact Gmbh & Co. Kg | Field attachable circular connector for Ethernet |
JP5411124B2 (en) * | 2007-03-29 | 2014-02-12 | ザ・シーモン・カンパニー | Telecommunication connector |
US7874865B2 (en) * | 2008-06-20 | 2011-01-25 | Tyco Electronics Corporation | Electrical connector with a compliant cable strain relief element |
US7621772B1 (en) * | 2008-06-20 | 2009-11-24 | Tyco Electronics Corporation | Electrical connector with a compliant cable strain relief element |
US8202128B2 (en) * | 2008-11-25 | 2012-06-19 | Adc Gmbh | Telecommunications jack with adjustable crosstalk compensation |
AU2009202284B2 (en) * | 2008-12-19 | 2015-02-12 | Tyco Electronics Services Gmbh | Plug |
US7896692B2 (en) * | 2009-05-15 | 2011-03-01 | Leviton Manufacturing Co., Inc. | Method of improving isolation between circuits on a printed circuit board |
US7892018B1 (en) | 2009-09-29 | 2011-02-22 | Tyco Electronics Corporation | Electrical connector assembly with two cable loading stop elements |
JP5201153B2 (en) * | 2010-01-13 | 2013-06-05 | 第一精工株式会社 | Electrical connector and electrical connector assembly |
CH704988A1 (en) * | 2011-06-21 | 2012-12-31 | Reichle & De Massari Fa | Connector and method for its production. |
US8900015B2 (en) * | 2011-10-03 | 2014-12-02 | Panduit Corp. | Communication connector with reduced crosstalk |
US20140027155A1 (en) * | 2012-07-25 | 2014-01-30 | Ametek, Inc. | Differential mode signal connector and cable assembly |
US9246274B2 (en) * | 2013-03-15 | 2016-01-26 | Panduit Corp. | Communication connectors having crosstalk compensation networks |
DE102016122222A1 (en) | 2016-11-18 | 2018-05-24 | Telegärtner Karl Gärtner GmbH | Electrical socket |
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US4604513A (en) * | 1985-05-07 | 1986-08-05 | Lim Basilio Y | Combination of a laser and a controller for trimming a metallized dielectric film capacitor |
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JPH01184942A (en) * | 1988-01-20 | 1989-07-24 | Toshiba Corp | Trimming element and electrical short-circuit thereof |
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-
2003
- 2003-03-11 DE DE10310434A patent/DE10310434A1/en not_active Ceased
-
2004
- 2004-02-27 EP EP04715300.2A patent/EP1602263B1/en not_active Expired - Lifetime
- 2004-02-27 ME MEP-296/08A patent/MEP29608A/en unknown
- 2004-02-27 CA CA2516977A patent/CA2516977C/en not_active Expired - Fee Related
- 2004-02-27 BR BRPI0408208-7A patent/BRPI0408208A/en not_active IP Right Cessation
- 2004-02-27 KR KR1020057016915A patent/KR100806090B1/en not_active IP Right Cessation
- 2004-02-27 RU RU2005131432/09A patent/RU2309546C2/en not_active IP Right Cessation
- 2004-02-27 PL PL377996A patent/PL205021B1/en unknown
- 2004-02-27 US US10/547,498 patent/US7401402B2/en not_active Expired - Fee Related
- 2004-02-27 WO PCT/EP2004/001952 patent/WO2004082343A1/en active Application Filing
- 2004-02-27 MX MXPA05009326A patent/MXPA05009326A/en active IP Right Grant
- 2004-02-27 JP JP2006504479A patent/JP4685759B2/en not_active Expired - Fee Related
- 2004-02-27 AU AU2004219120A patent/AU2004219120B9/en not_active Ceased
- 2004-02-27 UA UAA200508603A patent/UA89612C2/en unknown
- 2004-02-27 CN CNB2004800067237A patent/CN100534258C/en not_active Expired - Fee Related
- 2004-02-27 RS YUP-2005/0693A patent/RS50882B/en unknown
- 2004-02-27 NZ NZ542327A patent/NZ542327A/en not_active IP Right Cessation
- 2004-03-03 MY MYPI20040730A patent/MY138688A/en unknown
- 2004-03-10 CL CL200400485A patent/CL2004000485A1/en unknown
- 2004-03-10 TW TW093106332A patent/TWI244246B/en not_active IP Right Cessation
- 2004-03-10 AR ARP040100757A patent/AR043526A1/en active IP Right Grant
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2005
- 2005-09-08 HR HR20050785A patent/HRP20050785B1/en not_active IP Right Cessation
- 2005-09-08 IL IL170756A patent/IL170756A/en not_active IP Right Cessation
- 2005-09-09 ZA ZA200507268A patent/ZA200507268B/en unknown
- 2005-10-07 NO NO20054626A patent/NO20054626L/en not_active Application Discontinuation
-
2006
- 2006-09-19 HK HK06110400.7A patent/HK1090245A1/en not_active IP Right Cessation
-
2008
- 2008-03-21 US US12/053,154 patent/US7856709B2/en not_active Expired - Lifetime
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2010
- 2010-12-23 US US12/978,091 patent/US8413323B2/en not_active Expired - Fee Related
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