CA2516977A1 - Method for high-frequency tuning an electrical device, and a printed circuit board therefor - Google Patents

Method for high-frequency tuning an electrical device, and a printed circuit board therefor Download PDF

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Publication number
CA2516977A1
CA2516977A1 CA002516977A CA2516977A CA2516977A1 CA 2516977 A1 CA2516977 A1 CA 2516977A1 CA 002516977 A CA002516977 A CA 002516977A CA 2516977 A CA2516977 A CA 2516977A CA 2516977 A1 CA2516977 A1 CA 2516977A1
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CA
Canada
Prior art keywords
circuit board
printed circuit
conductor track
frequency
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002516977A
Other languages
French (fr)
Other versions
CA2516977C (en
Inventor
Peter Bresche
Ulrich Hetzer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ADC GmbH
Original Assignee
Krone Gmbh
Peter Bresche
Ulrich Hetzer
Adc Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Krone Gmbh, Peter Bresche, Ulrich Hetzer, Adc Gmbh filed Critical Krone Gmbh
Publication of CA2516977A1 publication Critical patent/CA2516977A1/en
Application granted granted Critical
Publication of CA2516977C publication Critical patent/CA2516977C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461Means for preventing cross-talk
    • H01R13/6464Means for preventing cross-talk by adding capacitive elements
    • H01R13/6466Means for preventing cross-talk by adding capacitive elements on substrates, e.g. printed circuit boards [PCB]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6473Impedance matching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0237High frequency adaptations
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09218Conductive traces
    • H05K2201/09236Parallel layout
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17Post-manufacturing processes
    • H05K2203/171Tuning, e.g. by trimming of printed components or high frequency circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17Post-manufacturing processes
    • H05K2203/175Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S439/00Electrical connectors
    • Y10S439/941Crosstalk suppression
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128Assembling formed circuit to base
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y10T29/49135Assembling to base an electrical component, e.g., capacitor, etc. with component orienting and shaping, e.g., cutting or bending, etc.
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147Assembling terminal to base
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • Y10T29/49156Manufacturing circuit on or in base with selective destruction of conductive paths
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49174Assembling terminal to elongated conductor

Abstract

The invention relates to a method for high-frequency tuning a high-frequency plug connector (1), comprising a printed circuit board (3) that has both contact points (21-28) for high-frequency contacts as well as contact points (31-38) for insulation displacement contacts. Each contact point (21-28) for the high-frequency contacts is connected to one respective contact point (31-38) for the insulation displacement contacts. Capacitive couplings, which cause a near-end crosstalk, occur between the high-frequency contacts. At least one first conductor path (46), which is connected on only one side to a contact point (26) of an electrical contact, is situated on the printed circuit board (3) that, together with at least one second conductor path (44), which is situated on and/or in the printed circuit board (3), forms a capacitor (C46). At least one frequency-dependent parameter of the device is measured, and this frequency-dependent parameter is compared to a set parameter and, according to on a difference between the two, the conductor path (46) that is contacted on one side is partially removed or completely separated.

Claims (16)

1. A method for RF matching of an electrical arrangement, with the electrical arrangement having at least one printed circuit board on which electrical components are arranged which have capacitive couplings, wherein at least one first conductor track (46), which is connected on only one side to a contact point (26) of an electrical component, is arranged on the printed circuit board (3) and, together with at least one second conductor track (44) which is arranged on and/or in the printed circuit board (3), forms a capacitor (C46), with at least one frequency-dependent parameter of the arrangement being measured, the frequency-dependent parameter being compared with a nominal parameter, and the conductor track (46) with which contact is made on one side being partially removed or cut through as a function of the difference.
2. The method as claimed in claim 1, wherein the second conductor track (44) is in the form of a conductor track (44) with which contact is made on one side.
3. The method as claimed in claim 1 or 2, wherein at least one further second conductor track is arranged in an internal layer in the printed circuit board (3) and is connected to the second conductor track (44) that is arranged on the printed circuit board (3).
4. The method as claimed in one of the preceding claims, wherein at least two matchable capacitors (C46, C35) are arranged on the printed circuit board (3).
5. The method as claimed in one of the preceding claims, wherein the frequency-dependent parameters are determined on the unpopulated printed circuit board (3).
6. The method as claimed in one of the preceding claims, wherein in a first step, only a portion of the estimated conductor track shortening (L) that is necessary is carried out, the frequency-dependent parameter is measured once again, and the remaining conductor track length which is still to be removed or to be cut is determined from this.
7. The method as claimed in claim 6, wherein, in the final step, the conductor track (46, 45) is cut in a broader manner than in the first step.
8. The method as claimed in one of the preceding claims, wherein near crosstalk (NEXT) is determined as the frequency-dependent parameter.
9. The method as claimed in one of the preceding claims, wherein the conductor track (46, 45) is cut by means of a laser.
10. The method as claimed in one of the preceding claims, wherein the process of controlling the laser is assisted by means of an optical system.
11. A printed circuit board for holding components for radio-frequency applications, comprising contact points for the components and conductor tracks, with capacitive couplings being produced between the components, wherein at least one first conductor track (46), which is connected on only one side to a contact point (26) of an electrical component, is arranged on the printed circuit board (3) and, together with at least one second conductor track (44) which is arranged on the printed circuit board (3), forms a capacitor (C46).
12. The printed circuit board as claimed in claim 11, wherein the second conductor track (44) is likewise a conductor track (44) which is connected to a contact point (24) on one side.
13. The printed circuit board as claimed in claim 11 or 12, wherein at least one further second conductor track is arranged in an internal layer in the printed circuit board (3) and is connected to the further conductor track (44) that is arranged on the printed circuit board (3).
14. The printed circuit board as claimed in one of claims 11 to 13, wherein at least two matchable capacitors (C46, C35) are arranged on the printed circuit board (3).
15. The printed circuit board as claimed in one of claims 11 to 14, wherein the printed circuit board (3) is fitted with RF contacts and insulation-displacement contacts for an RJ-45 female connection.
16. The printed circuit board as claimed in claim 15, wherein the first capacitor (C46) is arranged between the contact points (24 and 26), and the second capacitor (C35) is arranged between the contact points (23 and 25).
CA2516977A 2003-03-11 2004-02-27 Method for high-frequency tuning an electrical device, and a printed circuit board therefor Expired - Fee Related CA2516977C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10310434A DE10310434A1 (en) 2003-03-11 2003-03-11 Method for RF tuning of an electrical arrangement and a circuit board suitable for this
DE10310434.8 2003-03-11
PCT/EP2004/001952 WO2004082343A1 (en) 2003-03-11 2004-02-27 Method for high-frequency tuning an electrical device, and a printed circuit board suitable therefor

Publications (2)

Publication Number Publication Date
CA2516977A1 true CA2516977A1 (en) 2004-09-23
CA2516977C CA2516977C (en) 2012-02-21

Family

ID=32920703

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2516977A Expired - Fee Related CA2516977C (en) 2003-03-11 2004-02-27 Method for high-frequency tuning an electrical device, and a printed circuit board therefor

Country Status (26)

Country Link
US (3) US7401402B2 (en)
EP (1) EP1602263B1 (en)
JP (1) JP4685759B2 (en)
KR (1) KR100806090B1 (en)
CN (1) CN100534258C (en)
AR (1) AR043526A1 (en)
AU (1) AU2004219120B9 (en)
BR (1) BRPI0408208A (en)
CA (1) CA2516977C (en)
CL (1) CL2004000485A1 (en)
DE (1) DE10310434A1 (en)
HK (1) HK1090245A1 (en)
HR (1) HRP20050785B1 (en)
IL (1) IL170756A (en)
ME (1) MEP29608A (en)
MX (1) MXPA05009326A (en)
MY (1) MY138688A (en)
NO (1) NO20054626L (en)
NZ (1) NZ542327A (en)
PL (1) PL205021B1 (en)
RS (1) RS50882B (en)
RU (1) RU2309546C2 (en)
TW (1) TWI244246B (en)
UA (1) UA89612C2 (en)
WO (1) WO2004082343A1 (en)
ZA (1) ZA200507268B (en)

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Also Published As

Publication number Publication date
CA2516977C (en) 2012-02-21
HRP20050785A2 (en) 2006-11-30
AR043526A1 (en) 2005-08-03
RU2005131432A (en) 2006-03-27
EP1602263A1 (en) 2005-12-07
MXPA05009326A (en) 2006-01-17
MEP29608A (en) 2011-02-10
US7856709B2 (en) 2010-12-28
MY138688A (en) 2009-07-31
US20110287670A1 (en) 2011-11-24
UA89612C2 (en) 2010-02-25
RS20050693A (en) 2006-12-15
RU2309546C2 (en) 2007-10-27
AU2004219120B2 (en) 2009-02-12
NZ542327A (en) 2007-12-21
RS50882B (en) 2010-08-31
PL377996A1 (en) 2006-02-20
JP2006520070A (en) 2006-08-31
CN100534258C (en) 2009-08-26
EP1602263B1 (en) 2015-12-09
IL170756A (en) 2012-05-31
AU2004219120B9 (en) 2009-03-19
JP4685759B2 (en) 2011-05-18
ZA200507268B (en) 2006-06-28
AU2004219120A1 (en) 2004-09-23
US7401402B2 (en) 2008-07-22
TW200501520A (en) 2005-01-01
NO20054626L (en) 2005-11-29
BRPI0408208A (en) 2006-02-14
CL2004000485A1 (en) 2005-05-27
US20060264106A1 (en) 2006-11-23
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