CA2564037A1 - Packaging for an interferometric modulator - Google Patents
Packaging for an interferometric modulator Download PDFInfo
- Publication number
- CA2564037A1 CA2564037A1 CA002564037A CA2564037A CA2564037A1 CA 2564037 A1 CA2564037 A1 CA 2564037A1 CA 002564037 A CA002564037 A CA 002564037A CA 2564037 A CA2564037 A CA 2564037A CA 2564037 A1 CA2564037 A1 CA 2564037A1
- Authority
- CA
- Canada
- Prior art keywords
- back plate
- transparent substrate
- sealing
- pressure
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/001—Optical devices or arrangements for the control of light using movable or deformable optical elements based on interference in an adjustable optical cavity
Abstract
A package is made of a transparent substrate (12) having an interferometric modulator (10) and a back plate (30). A non-hermetic seal (32) joins the back plate to the substrate to form a package, and a desiccant (34) resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate is provided and a desiccant is applied to the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package.
Claims (40)
1. A package, comprising:
a transparent substrate;
an interferometric modulator on the substrate;
a back plate;
a seal joining the back plate to the substrate to form a package; and a desiccant inside the package.
a transparent substrate;
an interferometric modulator on the substrate;
a back plate;
a seal joining the back plate to the substrate to form a package; and a desiccant inside the package.
2. The package of claim 1, wherein the transparent substrate comprises at least one of: glass, plastic, and transparent polymers.
3. The package of claim 1, wherein the seal comprises a non-hermetic seal.
4. The package of claim 1, wherein the seal comprises a hermetic seal.
5. The package of claim 1, wherein the interferometric modulator comprises at least one of a membrane modulator, and a separable modulator.
6. The package of claim 1, wherein the back plate comprises at least one of:
glass, metal, foil, polymer, plastic, ceramic and semiconductor materials.
glass, metal, foil, polymer, plastic, ceramic and semiconductor materials.
7. The device of claim 1, wherein the seal comprises at least one of: epoxy-based adhesives, o-rings, PIBs, poly-urethane, thin film metal welds, liquid spin-on glass, solder, polymers, and plastics.
8. The device of claim 1, wherein the desiccant comprises at least one of:
zeolites, molecular sieves, desiccants, surface adsorbents, bulk adsorbents, and chemical reactants.
zeolites, molecular sieves, desiccants, surface adsorbents, bulk adsorbents, and chemical reactants.
9. A method of packaging an interferometric modulator, comprising:
providing a transparent substrate;
manufacturing an interferometric modulator array on a side of the substrate;
providing a back plate;
applying a desiccant to the back plate;
sealing the back plate to the side of the substrate with a seal in ambient conditions.
providing a transparent substrate;
manufacturing an interferometric modulator array on a side of the substrate;
providing a back plate;
applying a desiccant to the back plate;
sealing the back plate to the side of the substrate with a seal in ambient conditions.
10. The method of claim 9, the method further comprising:
sealing in non-ambient conditions as a controlled environment of one of either inert gas or dry air, instead of sealing the back plate in ambient conditions.
sealing in non-ambient conditions as a controlled environment of one of either inert gas or dry air, instead of sealing the back plate in ambient conditions.
11. The method of claim 9, the method further comprising:
hardening the seal;
scribing the substrate between multiple packages;
breaking the substrate into individual devices; and applying an end seal to the individual devices.
hardening the seal;
scribing the substrate between multiple packages;
breaking the substrate into individual devices; and applying an end seal to the individual devices.
12. The method of claim 9, wherein providing a back plate comprises providing a back plate having recessed regions.
13. The method of claim 12, wherein providing a back plate with recessed regions comprises forming ribs on the back plate.
14. The method of claim 13, wherein forming ribs on the back plate comprises patterning ribs onto the back plate.
15. The method claim 13, wherein forming ribs on the back plate comprises printing a material onto the back plate.
16. The method of claim 13, wherein forming ribs on the back plate comprises stenciling a material onto the back plate.
17. The method of claim 12, wherein providing a back plate having recessed regions comprises eroding the back plate in those regions to form cavities.
18. The method of claim 12, wherein providing a back plate having recessed regions comprises providing a back plate having molded regions.
19. The method of claim 12, wherein providing a back plate having recessed regions comprises mounting a frame on a flat back plate, the frame defining cavities between struts of the frame and the transparent substrate.
20. The method of claim 9, wherein providing a back plate comprises providing a sheet of foil with integral spacer posts such that the spacer posts lie between multiple interferometric modulator arrays on the transparent substrate.
21. The method of claim 9, wherein providing a transparent substrate comprises providing a transparent substrate with recessed regions in which the interferometric modulators are formed.
22. The method of claim 9, wherein providing a back plate comprises providing a flexible, polymer sheet.
23. The method of claim 9, wherein providing a transparent substrate further comprising providing a transparent substrate having integrated spacers.
24. The method of claim 9, wherein applying the desiccant comprises:
aligning the transparent substrate to the back plate;
joining the transparent substrate to the back plate;
sealing the back plate to the transparent substrate.
aligning the transparent substrate to the back plate;
joining the transparent substrate to the back plate;
sealing the back plate to the transparent substrate.
25. The method of claim 9, wherein applying the desiccant comprises:
applying the desiccant through a hole; and sealing the hole.
applying the desiccant through a hole; and sealing the hole.
26. The method of claim 9, wherein sealing the back plate to the transparent substrate comprises sealing the back plate to the transparent substrate with a self-healing seal.
27. The method of claim 9, wherein sealing the back plate to the transparent substrate comprises sealing a hole in the back plate.
28. The method of claim 9, wherein sealing the back plate to the transparent substrate comprises forming a seal line of a width that is sufficient to allow scribing and breaking of the substrate without breaking the seal.
29. The method of claim 9, wherein sealing the back plate to the transparent substrate comprises sealing the back plate to the transparent substrate in a vacuum environment.
30. The method of claim 29, further comprising maintaining the vacuum pressure in the package.
31. The method of claim 9, wherein sealing the back plate to the transparent substrate comprises sealing the back plate to the transparent substrate in an environment having an initial vacuum, and wherein environmental pressure increases from vacuum to a higher pressure as sealing occurs such that, as pressure in the package increases due to reduction in volume, increased environmental pressure aids in improving the seal.
32. The method of claim 9, wherein sealing the back plate to the transparent substrate comprises sealing the back plate to the transparent substrate in an environment having a pressure at higher than vacuum up to and including ambient pressure to form the seal.
33. The method of claim 31, further comprising maintaining the higher pressure at ambient pressure in the package.
34. The method of claim 9, wherein sealing the back plate to the transparent substrate comprises sealing the back plate to the transparent substrate in an environment having an initial pressure higher than vacuum up to an including ambient pressure, and wherein environmental pressure increases to a pressure higher than the initial pressure as sealing occurs such that, as pressure in the package increases due to reduction in volume, increased environmental pressure aids in improving the seal.
35. The method of claim 9, wherein sealing the back plate to the transparent substrate comprises sealing the back plate to the transparent substrate in an environment having a pressure higher than ambient pressure to form the seal.
36. The method of claim 35, further comprising maintaining the pressure in the package at a level that is higher than ambient pressure.
37. The method of claim 9, wherein sealing the back plate to the transparent substrate comprises sealing the back plate to the transparent substrate in an environment having an initial environmental pressure higher than ambient pressure, and wherein the environmental pressure increases to a pressure higher than the initial pressure as sealing occurs such that, as pressure in the package increases due to reduction in volume, increased environmental pressure aids in improving the seal.
38. The method of claim 31, wherein the increased pressure inside the package during sealing creates a convex backplane shape by partial adhesive curing during a period of time in which the package is at a level that is higher than the initial pressure.
39. The method of claim 34, wherein the increased pressure inside the cavity during sealing creates a convex backplane shape by partial adhesive curing during a period of time in which the cavity is at said higher pressure level.
40. The method of claim 37, wherein the increased pressure inside the package during sealing creates a convex backplane shape by partial adhesive curing during a period of time in which the package is at said higher pressure level.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/844,819 US7164520B2 (en) | 2004-05-12 | 2004-05-12 | Packaging for an interferometric modulator |
US10/844,819 | 2004-05-12 | ||
PCT/US2005/013464 WO2005114294A1 (en) | 2004-05-12 | 2005-04-20 | Packaging for an interferometric modulator |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2564037A1 true CA2564037A1 (en) | 2005-12-01 |
CA2564037C CA2564037C (en) | 2012-08-07 |
Family
ID=34966531
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA2564037A Expired - Fee Related CA2564037C (en) | 2004-05-12 | 2005-04-20 | Packaging for an interferometric modulator |
Country Status (8)
Country | Link |
---|---|
US (4) | US7164520B2 (en) |
EP (2) | EP2028521A1 (en) |
KR (1) | KR101118067B1 (en) |
CA (1) | CA2564037C (en) |
MY (1) | MY139178A (en) |
SG (1) | SG136124A1 (en) |
TW (1) | TWI291219B (en) |
WO (1) | WO2005114294A1 (en) |
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-
2004
- 2004-05-12 US US10/844,819 patent/US7164520B2/en not_active Expired - Fee Related
-
2005
- 2005-04-20 SG SG200706523-8A patent/SG136124A1/en unknown
- 2005-04-20 CA CA2564037A patent/CA2564037C/en not_active Expired - Fee Related
- 2005-04-20 KR KR1020067025535A patent/KR101118067B1/en not_active IP Right Cessation
- 2005-04-20 EP EP08168731A patent/EP2028521A1/en not_active Withdrawn
- 2005-04-20 WO PCT/US2005/013464 patent/WO2005114294A1/en active Application Filing
- 2005-04-20 EP EP05738076A patent/EP1751603A1/en not_active Withdrawn
- 2005-04-27 MY MYPI20051837A patent/MY139178A/en unknown
- 2005-05-04 TW TW094114334A patent/TWI291219B/en not_active IP Right Cessation
-
2007
- 2007-01-12 US US11/653,088 patent/US7443563B2/en active Active
-
2008
- 2008-01-24 US US12/019,590 patent/US7816710B2/en not_active Expired - Fee Related
-
2010
- 2010-10-14 US US12/904,825 patent/US8853747B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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US20070170568A1 (en) | 2007-07-26 |
US20080164544A1 (en) | 2008-07-10 |
US20110053304A1 (en) | 2011-03-03 |
EP1751603A1 (en) | 2007-02-14 |
TW200608531A (en) | 2006-03-01 |
US8853747B2 (en) | 2014-10-07 |
WO2005114294A1 (en) | 2005-12-01 |
EP2028521A1 (en) | 2009-02-25 |
SG136124A1 (en) | 2007-10-29 |
US20050254115A1 (en) | 2005-11-17 |
KR101118067B1 (en) | 2012-02-24 |
MY139178A (en) | 2009-08-28 |
KR20070016162A (en) | 2007-02-07 |
US7164520B2 (en) | 2007-01-16 |
US7816710B2 (en) | 2010-10-19 |
CA2564037C (en) | 2012-08-07 |
US7443563B2 (en) | 2008-10-28 |
TWI291219B (en) | 2007-12-11 |
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