CA2610979C - Coated article with transparent conductive oxide film doped to adjust fermi level, and method of making same - Google Patents

Coated article with transparent conductive oxide film doped to adjust fermi level, and method of making same Download PDF

Info

Publication number
CA2610979C
CA2610979C CA2610979A CA2610979A CA2610979C CA 2610979 C CA2610979 C CA 2610979C CA 2610979 A CA2610979 A CA 2610979A CA 2610979 A CA2610979 A CA 2610979A CA 2610979 C CA2610979 C CA 2610979C
Authority
CA
Canada
Prior art keywords
dopant
transparent conductive
film
conductive film
coated article
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA2610979A
Other languages
French (fr)
Other versions
CA2610979A1 (en
Inventor
Alexey Krasnov
Yiwei Lu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guardian Industries Corp
Original Assignee
Guardian Industries Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guardian Industries Corp filed Critical Guardian Industries Corp
Publication of CA2610979A1 publication Critical patent/CA2610979A1/en
Application granted granted Critical
Publication of CA2610979C publication Critical patent/CA2610979C/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08Oxides
    • C23C14/086Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/22Surface treatment of glass, not in the form of fibres or filaments, by coating with other inorganic material
    • C03C17/23Oxides
    • C03C17/245Oxides by deposition from the vapour phase
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/453Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zinc, tin, or bismuth oxides or solid solutions thereof with other oxides, e.g. zincates, stannates or bismuthates
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2217/00Coatings on glass
    • C03C2217/20Materials for coating a single layer on glass
    • C03C2217/21Oxides
    • C03C2217/216ZnO
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2217/00Coatings on glass
    • C03C2217/20Materials for coating a single layer on glass
    • C03C2217/21Oxides
    • C03C2217/24Doped oxides
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2218/00Methods for coating glass
    • C03C2218/10Deposition methods
    • C03C2218/15Deposition methods from the vapour phase
    • C03C2218/154Deposition methods from the vapour phase by sputtering
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3217Aluminum oxide or oxide forming salts thereof, e.g. bauxite, alpha-alumina
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3284Zinc oxides, zincates, cadmium oxides, cadmiates, mercury oxides, mercurates or oxide forming salts thereof
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3289Noble metal oxides
    • C04B2235/3291Silver oxides
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/40Metallic constituents or additives not added as binding phase
    • C04B2235/402Aluminium
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/40Metallic constituents or additives not added as binding phase
    • C04B2235/408Noble metals
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/96Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
    • C04B2235/9646Optical properties
    • C04B2235/9653Translucent or transparent ceramics other than alumina

Abstract

A transparent conductive oxide (TCO) based film is formed on a substrate. The film may be formed by sputter-depositing, so as to include both a primary dopant (e.g., Al) and a co-dopant (e.g., Ag). The benefit of using the co-dopant in depositing the TCO inclusive film may be two-fold: (a) it may prevent or reduce self- compensation of the primary dopant by a more proper positioning of the Fermi level, and/or (b) it may promote declustering of the primary dopant, thereby freeing up space in the metal sublattice and permitting more primary dopant to create electrically active centers so as to improve conductivity of the film. Accordingly, the use of the co-dopant permits the primary dopant to be more effective in enhancing conductivity of the TCO inclusive film, without significantly sacrificing visible transmission characteristics. An example TCO in certain embodiments is ZnA10x:Ag.

Description

TITLE OF THE INVENTION

COATED ARTICLE WITH TRANSPARENT CONDUCTIVE OXIDE FILM
DOPED TO ADJUST FERMI LEVEL, AND METHOD OF MAKING SAME
[0001] This invention relates to a coated article including a transparent conductive oxide (TCO) film that is doped to adjust the Fermi level, and a method of making the same. In certain example embodiments, a TCO such as zinc aluminum oxide (ZnA1O,,) or the like is doped with an acceptor or co-dopant such as.
silver (Ag) or the like. The silver co-dopant prevents or reduces self-compensation of the primary dopant by native defects as well as promotes declustering of the primary dopant (e.g., Al) thereby freeing up space in the sublattice and permitting more AI to function as a donor. Thus, conductivity of the TCO film can be improved.
Moreover, in certain example embodiments, this technique also permits good quality TCO
inclusive films to be deposited at low temperatures (e.g., via sputtering).
Coated articles according to certain example non-limiting embodiments of this invention may be used in applications such as solar cells, oven doors, defrosting windows, or other types of windows in certain example instances.

BACKGROUND AND SUMMARY OF EXAMPLE EMBODIMENTS
[0002] Conventional methods of forming TCOs on glass substrates require high glass substrate temperatures. Such methods include chemical pyrolysis where precursors are sprayed onto the glass substrate at approximately 400 to 500 degrees C, and vacuum deposition where the glass substrate is kept at about 150 to 300 degrees C. It is often not desirable to require such high glass substrate temperatures for TCO
deposition processing.

[00031 Sputter deposition of a TCO at approximately room temperature would be desirable, given that most float glass manufacturing platforms are not equipped with in-situ heating systems. Thus, it would be an achievement in the art if a technique for sputter-depositing TCOs could be realized that would result in a sufficiently conductive film.

[0004] A limitation of low-temperature sputter deposition of TCOs is the low atom mobility on the glass substrate. This limits the ability of species to find their optimal positions, thereby reducing film quality due to less than desirable crystallinity. The low atom mobility is particularly problematic for dopant atoms which are often introduced to a stoichiometric TCO to produce free electrons.
At low deposition temperatures, the dopant atoms tend to cluster such that their efficiency becomes reduced.

[0005] In certain example embodiments of this invention, one or more of the above problems are addressed by sputter-depositing a TCO inclusive film at a low temperature (e.g., less than about 150 degrees C, more preferably less than about 100 degrees C, and possibly at approximately room temperature) by sputter-depositing both a primary dopant and a co-dopant. The use of both the primary dopant and the co-dopant in depositing (e.g., sputter-depositing) the TCO inclusive film prevents or reduces the formation of compensating native defects in a wide-bandgap semiconductor material during the impurity introduction by controlling the Fermi level at or proximate the edge of the growth.

[0006] Immediately after being captured by surface forces, atoms start to migrate and follow the charge neutrality principle. The Fermi level is lowered at the growth edge by the addition of a small amount of acceptor impurity (such as Ag) so it prevents or reduces the formation of the compensating (e.g., negative in this case) species, such as zinc vacancies. After the initial stage of the semiconductor layer formation, the mobility of atoms is reduced and the probability of the point defect formation is primarily determined by the respective energy gain. Silver atoms for example in this particular example case tend to occupy interstitial sites where they play a role of predominantly neutral centers, forcing Al atoms to the preferable zinc substitutional sites, where Al plays the desired role of shallow donors, thus eventually raising the Fermi level. In addition, the provision of the co-dopant promotes declustering of the primary dopant, thereby freeing up space in the metal sublattice and permitting more Al to function as a charge carrier so as to improve conductivity of the film. Accordingly, the use of the co-dopant permits the primary dopant to be more effective in enhancing conductivity of the TCO inclusive film, without significantly sacrificing visible transmission characteristics. Furthermore, the use of the co-dopant improves crystallinity of the TCO inclusive film and thus the conductivity thereof, and grain size may also increase which can lead to increased mobility.

[0007] In certain example embodiments of this invention, the TCO film may be sputter-deposited on a glass substrate (either directly or indirectly) at approximately room temperature. In alternative embodiments, it is possible to pre-heat the glass substrate prior to the sputter-deposition of the TCO film. In yet another embodiment, it is possible to heat the glass substrate with the TCO layer after the deposition thereof, e.g., during a glass tempering and/or heat strengthening step.
[0008] In an example embodiment, a zinc oxide based film includes Al as a primary dopant and Ag as a co-dopant. In this respect, the Al is the primary charge provider. It has surprisingly been found that the introduction of Ag to ZnAIOx promotes declustering of the Al and permits more Al to function as a donor thereby improving crystallinity and conductivity of the film. In the case of introducing Ag as the co-dopant (acceptor) into ZnO, Ag facilitates the introduction of the primary donor dopant (Al). Certain example embodiments of this invention may also use the ability of silver to promote the uniform or substantially uniform distribution of donor-like dopants in wide-bandgap II-VI compounds, thereby allowing one to increase the effective dopant concentration in a poly-crystalline film.

[0009] While silver is used as a co-dopant in certain example embodiments of this invention, it is possible to use another Group IB, IA or V element such as Cu or Au instead of or in addition to silver as the co-dopant.

[0010] In certain example embodiments of this invention, there is provided a method of making a coated article including a transparent conductive film, the method comprising: providing a glass substrate; sputtering at least one target comprising each of zinc, aluminum and silver in an atmosphere comprising oxygen so as to form a transparent conductive film on the glass substrate.

[0011] In other example embodiments of this invention, there is provided a method of making a coated article including a transparent conductive film, the method comprising: providing a substrate; sputtering at least one target comprising each of zinc, a-primary metal dopant, and a co-dopant of at least one Group IB, IA or V
element, wherein the sputtering is performed in an atmosphere comprising oxygen so as to form a transparent conductive film comprising zinc, oxygen, the primary metal dopant and the co-dopant on the substrate.

[0012] In still further example embodiments of this invention, there is provided a coated article comprising: a transparent conductive film provided on a glass substrate; and wherein the transparent conductive film comprises zinc.aluminum oxide that is doped with silver in order to enhance electrical properties of the film.
[0013] In other example embodiments of this invention, there is provided a coated article comprising: a transparent conductive film provided on a substrate; and wherein the transparent conductive film comprises MAl oxide that is doped with silver in order to enhance electrical properties of the film. The metal M may be Zn or the like in certain example embodiments.

BRIEF DESCRIPTION OF THE DRAWINGS

[0014] FIGURE 1 is a cross-sectional view of a coated article according to an example embodiment of this invention.

[0015] FIGURE 2 is a schematic diagram of a method of making a coated article according to an example embodiment of this invention.

DETAILED DESCRIPTION OF THE INVENTION

[0016] Coated articles including conductive layer(s) according to certain example non-limiting embodiments of this invention may be used in applications such as solar cells, oven doors, defrosting windows, or other types of windows in certain example instances. For example and without limitation, the conductive layers discussed herein may be used as electrodes in solar cells, as heating layers in defrosting windows, as solar control layers in windows, or the like.

[0017] Fig. 1 is a cross-sectional view of a coated article according to an example embodiment of this invention. The coated article includes glass substrate 1 and transparent electrically conductive layer 3 that is provided on the substrate. Glass 1 may be soda-lime-silica glass in certain example. embodiments of this invention, although other types of glass may instead be used. In certain example embodiments of this invention, conductive film 3 may be of or include a transparent conducive oxide (TCO). Optionally, other layers may be provided between the glass substrate 1 and the transparent conductive layer 3. Layer 3 is said to be on the substrate 1, regardless of whether other layer(s) are provided therebetween. In certain example embodiments of this invention, the coated article has a visible transmission of at least about 30%, more preferably of at least about 50%, and even more preferably of at least about 70%.

[0018] In certain example embodiments of this invention, TCO inclusive film 3 is sputter-deposited onto substrate 1 at a low temperature (e.g., less than about 150 degrees C, more preferably less than about 100 degrees C, and possibly at approximately room temperature) so as to include both a primary dopant and a co-dopant. For purposes of example, the film 3 may be zinc oxide based, the primary dopant may be Al, and the co-dopant may be Ag. In such an example situation, the TCO film 3 may be of or include ZnAIOx:Ag, where Ag is the co-dopant. Al is the primary charge carrier dopant. However, if too much Al is added (without Ag), its effectiveness as a charge carrier is compromised because the system compensates Al by generating native acceptor defects (such as zinc vacancies). Also, at low substrate temperatures, more clustered electrically inactive (yet optically absorbing) defects tend to occur. However, when Ag is added as a co-dopant, this promotes declustering of the Al and permits more Al to function as a charge generating dopant (Al is more effective when in the Zn substituting sites). Thus, the use of the Ag permits the Al to be a more effective charge generating dopant in the TCO inclusive film 3.
Accordingly, the use of Ag in ZnAlO is used to enhance the electrical properties of the film.

[0019] In certain example embodiments of this invention, the amount of primary dopant (e.g., Al) in the film 3 may be from about 0.5 to 7%, more preferably from about 0.5 to 5%, and most preferably from about 1 to 4% (atomic %).
Moreover, in certain example embodiments of this invention, the amount of co-dopant (e.g., Ag) in the film 3 may be from about 0.001 to 3%, more preferably from about 0.01 to 1%, and most preferably from about 0.02 to 0.25% (atomic %). In certain example instances, there is more primary dopant in the film than co-dopant, and preferably there is at least twice as much primary dopant in the film than co-dopant (more preferably at least three times as much, and most preferably at least 10 times as much). Moreover, there is significantly more Zn and 0 in the film 3 than both Al and Ag, as the film 3 may be zinc oxide based - various different stoichiometries may be used for film 3.

[0020] The use of both the primary dopant (e.g., Al) and the co-dopant (e.g., Ag) in depositing (e.g., sputter-depositing) the TCO inclusive film (e.g., ZnAlOx:Ag) 3 prevents or reduces the formation of compensating native defects in a wide-bandgap semiconductor material during the impurity introduction by controlling the Fermi level at or proximate the edge of the growth. Immediately after being captured by surface forces, atoms start to migrate and follow the charge neutrality principle. The Fermi level is lowered at the growth edge by the addition of a small amount of acceptor impurity (such as Ag) so it prevents the formation of the compensating (negative in this case) species, such as zinc vacancies. After the initial stage of the semiconductor layer formation, the mobility of atoms is reduced and the probability of the point defect formation is primarily determined by the respective energy gain.
Silver atoms in this particular case tend to occupy interstitial sites where they play role of predominantly neutral centers, forcing Al atoms to the preferable zinc substitutional sites, where Al plays the desired role of shallow donors, thus eventually raising the Fermi level. In addition, the provision of the co-dopant (Ag) promotes declustering of the primary dopant (Al), thereby freeing up space in the metal sublattice of the film 3 and permitting more primary dopant (Al) to function as a charge provider so as to improve conductivity of the film. Accordingly, the use of the co-dopant (Ag) permits the primary dopant (Al) to be more effective in enhancing conductivity of the TCO inclusive film 3, without significantly sacrificing visible transmission characteristics. Furthermore, the use of the co-dopant surprisingly improves crystallinity of the TCO inclusive film 3 and thus the conductivity thereof, and grain size of the crystalline film 3 may also increase which can lead to increased mobility.
[0021] Fig. 2 is a schematic diagram illustrating an example of how the TCO
inclusive film 3 may be sputter-deposited on substrate 1 according to an example embodiment of this invention. In certain example embodiments, the TCO film 3 may be sputter-deposited on glass substrate 1(either directly or indirectly) at approximately room temperature. However, in alternative embodiments, it is possible to pre-heat the glass substrate prior to the sputter-deposition of the TCO
film 3. In the Fig. 2 embodiment, the glass substrate may move in direction 8 under the sputtering target 5 so as to permit the film 3 to be formed thereon.

[0022] Referring to Fig. 2, a sputtering target(s) 5 is provided. In certain example embodiments, the sputtering target may be a rotatable magnetron type sputtering target, or alternatively may be a planar sputtering target, or any other suitable type of sputtering target. In certain example embodiments, the target 5 is made of or includes ZnAlAg, where Zn is the primary metal of the target, Al is the primary dopant, and Ag is the co-dopant. Thus, with respect to atomic %
content of the target, the target 5 is characterized by Zn>Al>Ag, where at least 50% of the target is made up of Zn (more preferably at least 70%, and most preferably at least 80%).
Moreover, the amount of primary dopant (e.g., Al) in the target 5may be from about 0.5 to 7%, more preferably from about 0.5 to 5%, and most preferably from about 1 to 4% (atomic %); and the amount of co-dopant (e.g., Ag) in the target 5 may be from about 0.00 1 to 3%, more preferably from about 0.01 to 1%, and most preferably from about 0.02 to 0.25% (atomic %). When the target 5 is an entirely metallic or substantially metallic target, the target is typically sputtered in an atmosphere include oxygen gas (e.g., 02). In certain example embodiments, the atmosphere in which the target is sputtered may include a mixture of oxygen and argon gas. The oxygen from the atmosphere contributes to forming the "oxide" nature of the film 3 on the substrate. It is also possible for other gases (e.g., nitrogen) to be present in the atmosphere in which the target 5 is sputtered, and thus some of this may end up in the film 3 on the substrate.

[0023] In other example embodiments, the sputtering target 5 may be a ceramic target. For example, target 5 may be of or include ZnAlAgO,,. A
ceramic target may be advantageous in this respect because less oxygen gas would be required in the atmosphere in which the target is sputtered (e.g., and more Ar gas for example could be used).

[0024] While silver is discussed as a co-dopant in certain example embodiments of this invention, it is possible to use another Group IB, IA or V
element such as Cu or Au instead of or in addition to silver as the co-dopant.
Moreover, while Al is discussed as a primary dopant in certain example embodiments of this invention, it is possible to use another material such as Mn (instead of or in addition to Ag) as the primary dopant for the TCO film 3.

[0025] While the invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not to be limited to the disclosed embodiment, but on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

Claims (20)

1. A method of making a coated article including a transparent conductive film, the method comprising:
providing a glass substrate;
sputtering at least one target comprising each of zinc, aluminum and silver in an atmosphere comprising oxygen so as to form a transparent conductive film on the glass substrate.
2. The method of claim 1, wherein with respect to atomic%, material content in the target of zinc, aluminum and silver is characterized by Zn > Al > Ag, so that the target includes more zinc than aluminum, and more aluminum than silver.
3. The method of claim 1, wherein aluminum is a primary charge carrier dopant in the transparent conductive film, and silver is a co-dopant in the film.
4. The method of claim 1, wherein said sputtering is performed at approximately room temperature.
5. The method of claim 1, wherein said sputtering is performed at a temperature of less than 150 degrees C.
6. The method of claim 1, wherein another layer is provided on the glass substrate so as to be located between the glass substrate and the transparent conductive film.
7. The method of claim 1, wherein the transparent conductive film comprises ZnAlO x:Ag.
8. The method of claim 1, wherein the transparent conductive film consists essentially of ZnAlO x:Ag.
9 9. The method of claim 1, wherein the coated article has a visible transmission of at least about 50%.
10. The method of claim 1, wherein the target comprises at least about 50 atomic % zinc, from about 0.5 to 7 atomic % aluminum, and from about 0.001 to atomic % silver.
11. The method of claim 1, wherein the target is a ceramic target, and includes from about 0.5 to 7 atomic % aluminum, and from about 0.001 to 3 atomic %
silver.
12. A method of making a coated article including a transparent conductive film, the method comprising:
providing a substrate;
sputtering at least one target comprising each of zinc, a primary metal dopant, and a co-dopant of a Group IB, IA or V element, wherein the sputtering is performed in an atmosphere comprising oxygen so as to form a transparent conductive film comprising zinc, oxygen, the primary metal dopant and the co-dopant on the substrate;
wherein the co-dopant comprises Ag.
13. The method of claim 12, wherein the primary dopant comprises one or more of Al and Mn.
14. A coated article comprising:
a transparent conductive film provided on a glass substrate;
wherein the transparent conductive film comprises zinc aluminum oxide that is doped with silver in order to enhance electrical properties of the film.
15. The coated article of claim 14, wherein the film includes more zinc than aluminium, and more aluminium than silver.
16. The coated article of claim 14, wherein at least one dielectric layer is provided between the glass substrate and the transparent conductive film.
17. The coated article of claim 14, wherein the coated article has a visible transmission of at least about 50%.
18. The coated article of claim 14, wherein the conductive film comprises at least about 25 atomic % zinc, from about 0.5 to 7 atomic % aluminum, and from about 0.001 to 3 atomic % silver.
19. A coated article comprising:
a transparent conductive film provided on a substrate;
wherein the transparent conductive film comprises MA1 oxide that is doped with silver in order to enhance electrical properties of the film wherein M is zinc, and wherein there is more Al than Ag present in the film.
20. The method of claim 1, wherein the coated article is thermally tempered after the transparent conductive film is provided on the glass substrate.
CA2610979A 2005-07-05 2006-06-29 Coated article with transparent conductive oxide film doped to adjust fermi level, and method of making same Expired - Fee Related CA2610979C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/173,157 US7628896B2 (en) 2005-07-05 2005-07-05 Coated article with transparent conductive oxide film doped to adjust Fermi level, and method of making same
US11/173,157 2005-07-05
PCT/US2006/025379 WO2007005525A1 (en) 2005-07-05 2006-06-29 Coated article with transparent conductive oxide film doped to adjust fermi level, and method of making same

Publications (2)

Publication Number Publication Date
CA2610979A1 CA2610979A1 (en) 2007-01-11
CA2610979C true CA2610979C (en) 2011-05-03

Family

ID=37433755

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2610979A Expired - Fee Related CA2610979C (en) 2005-07-05 2006-06-29 Coated article with transparent conductive oxide film doped to adjust fermi level, and method of making same

Country Status (5)

Country Link
US (2) US7628896B2 (en)
EP (1) EP1919837A1 (en)
BR (1) BRPI0612688A2 (en)
CA (1) CA2610979C (en)
WO (1) WO2007005525A1 (en)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7628896B2 (en) * 2005-07-05 2009-12-08 Guardian Industries Corp. Coated article with transparent conductive oxide film doped to adjust Fermi level, and method of making same
US8679302B2 (en) 2005-11-14 2014-03-25 Guardian Industries Corp. Silicon titanium oxide coating, coated article including silicon titanium oxide coating, and method of making the same
WO2007118204A2 (en) * 2006-04-06 2007-10-18 Applied Materials, Inc. Reactive sputtering zinc oxide transparent conductive oxides onto large area substrates
US8298380B2 (en) 2006-05-23 2012-10-30 Guardian Industries Corp. Method of making thermally tempered coated article with transparent conductive oxide (TCO) coating in color compression configuration, and product made using same
US7674662B2 (en) * 2006-07-19 2010-03-09 Applied Materials, Inc. Process for making thin film field effect transistors using zinc oxide
US8734621B2 (en) 2007-01-16 2014-05-27 Alliance For Sustainable Energy, Llc Transparent conducting oxides and production thereof
US8747630B2 (en) * 2007-01-16 2014-06-10 Alliance For Sustainable Energy, Llc Transparent conducting oxides and production thereof
US20080254613A1 (en) * 2007-04-10 2008-10-16 Applied Materials, Inc. Methods for forming metal interconnect structure for thin film transistor applications
US7927713B2 (en) * 2007-04-27 2011-04-19 Applied Materials, Inc. Thin film semiconductor material produced through reactive sputtering of zinc target using nitrogen gases
JP5718052B2 (en) 2007-08-02 2015-05-13 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated Thin film transistor using thin film semiconductor material
US8980066B2 (en) * 2008-03-14 2015-03-17 Applied Materials, Inc. Thin film metal oxynitride semiconductors
US8253012B2 (en) * 2008-03-17 2012-08-28 Alliance For Sustainable Energy, Llc High quality transparent conducting oxide thin films
US8143093B2 (en) * 2008-03-20 2012-03-27 Applied Materials, Inc. Process to make metal oxide thin film transistor array with etch stopping layer
US7879698B2 (en) * 2008-03-24 2011-02-01 Applied Materials, Inc. Integrated process system and process sequence for production of thin film transistor arrays using doped or compounded metal oxide semiconductor
US8258511B2 (en) 2008-07-02 2012-09-04 Applied Materials, Inc. Thin film transistors using multiple active channel layers
US20100133094A1 (en) * 2008-12-02 2010-06-03 Applied Materials, Inc. Transparent conductive film with high transmittance formed by a reactive sputter deposition
US20100163406A1 (en) * 2008-12-30 2010-07-01 Applied Materials, Inc. Substrate support in a reactive sputter chamber
US9139465B2 (en) 2009-08-04 2015-09-22 Lehigh University Conductive doped metal-glass compositions and methods
WO2011037829A2 (en) 2009-09-24 2011-03-31 Applied Materials, Inc. Methods of fabricating metal oxide or metal oxynitride tfts using wet process for source-drain metal etch
US8840763B2 (en) * 2009-09-28 2014-09-23 Applied Materials, Inc. Methods for stable process in a reactive sputtering process using zinc or doped zinc target
WO2013119550A1 (en) 2012-02-10 2013-08-15 Alliance For Sustainable Energy, Llc Thin film photovoltaic devices with a minimally conductive buffer layer
WO2014077895A1 (en) 2012-11-19 2014-05-22 Alliance For Sustainable Energy, Llc Devices and methods featuring the addition of refractory metals to contact interface layers
CN107253826B (en) * 2017-05-22 2020-08-04 美的集团股份有限公司 Heat insulation glass, preparation method thereof and electric appliance
CN108385072B (en) * 2018-01-18 2020-04-21 中国科学院宁波材料技术与工程研究所 Transparent conductive film with single-layer structure and preparation method and application thereof

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2264342B1 (en) * 1974-03-12 1978-12-01 Commissariat Energie Atomique
DE3128900A1 (en) 1981-07-22 1983-02-10 Varta Batterie Ag, 3000 Hannover METHOD FOR REDUCING CORROSION OF NON-AMALGAMED ZINC
ES2095271T3 (en) * 1990-07-05 1997-02-16 Asahi Glass Co Ltd LOW EMISSIVITY FILM.
FR2672884B1 (en) 1991-02-20 1993-09-10 Saint Gobain Vitrage Int PROTECTIVE LAYER ON A CONDUCTIVE SUBSTRATE.
DE4132882C2 (en) 1991-10-03 1996-05-09 Antec Angewandte Neue Technolo Process for the production of pn CdTe / CdS thin-film solar cells
US5773086A (en) 1996-08-13 1998-06-30 Libbey-Owens-Ford Co. Method of coating flat glass with indium oxide
GB2332094A (en) * 1996-09-04 1999-06-09 Cambridge Display Tech Ltd Electrode deposition for organic light-emitting devices
US5922142A (en) 1996-11-07 1999-07-13 Midwest Research Institute Photovoltaic devices comprising cadmium stannate transparent conducting films and method for making
US6169246B1 (en) 1998-09-08 2001-01-02 Midwest Research Institute Photovoltaic devices comprising zinc stannate buffer layer and method for making
US6221495B1 (en) 1996-11-07 2001-04-24 Midwest Research Institute Thin transparent conducting films of cadmium stannate
US6190511B1 (en) * 1997-03-13 2001-02-20 David T. Wei Method and apparatus for ion beam sputter deposition of thin films
JPH10321373A (en) 1997-05-19 1998-12-04 Canon Inc Electroluminescent element
DE19732978C1 (en) 1997-07-31 1998-11-19 Ver Glaswerke Gmbh Low emissivity layer system especially for glass
US6881505B2 (en) 1998-03-20 2005-04-19 Glaverbel Coated substrate with high reflectance
US6436541B1 (en) 1998-04-07 2002-08-20 Ppg Industries Ohio, Inc. Conductive antireflective coatings and methods of producing same
DE19848751C1 (en) 1998-10-22 1999-12-16 Ver Glaswerke Gmbh Transparent substrate coating especially a low emissivity layer system with a silver functional layer for glass panes
US6398925B1 (en) * 1998-12-18 2002-06-04 Ppg Industries Ohio, Inc. Methods and apparatus for producing silver based low emissivity coatings without the use of metal primer layers and articles produced thereby
US20020084455A1 (en) 1999-03-30 2002-07-04 Jeffery T. Cheung Transparent and conductive zinc oxide film with low growth temperature
JP2000294980A (en) 1999-04-06 2000-10-20 Nippon Sheet Glass Co Ltd Translucent electromagnetic wave filter and fabrication thereof
US6602606B1 (en) 1999-05-18 2003-08-05 Nippon Sheet Glass Co., Ltd. Glass sheet with conductive film, method of manufacturing the same, and photoelectric conversion device using the same
US6762553B1 (en) * 1999-11-10 2004-07-13 Matsushita Electric Works, Ltd. Substrate for light emitting device, light emitting device and process for production of light emitting device
US6251701B1 (en) 2000-03-01 2001-06-26 The United States Of America As Represented By The United States Department Of Energy All-vapor processing of p-type tellurium-containing II-VI semiconductor and ohmic contacts thereof
US6887575B2 (en) 2001-10-17 2005-05-03 Guardian Industries Corp. Heat treatable coated article with zinc oxide inclusive contact layer(s)
US6576349B2 (en) 2000-07-10 2003-06-10 Guardian Industries Corp. Heat treatable low-E coated articles and methods of making same
WO2002056282A1 (en) * 2001-01-12 2002-07-18 Nippon Sheet Glass Co., Ltd. Electrode plate for color display unit and production method therefor
US6936347B2 (en) 2001-10-17 2005-08-30 Guardian Industries Corp. Coated article with high visible transmission and low emissivity
JP2003347572A (en) * 2002-01-28 2003-12-05 Kanegafuchi Chem Ind Co Ltd Tandem type thin film photoelectric converter and method of manufacturing the same
US6917158B2 (en) * 2002-03-08 2005-07-12 City University Of Hong Kong High-qualty aluminum-doped zinc oxide layer as transparent conductive electrode for organic light-emitting devices
WO2003095695A2 (en) * 2002-05-06 2003-11-20 Guardian Industries Corp. Sputter coating apparatus including ion beam source(s), and corresponding method
AU2003267186A1 (en) * 2002-05-08 2003-11-11 Target Technology Company, Llc. Silver alloy thin film reflector and transparent electrical conductor
US6787005B2 (en) 2002-09-04 2004-09-07 Guardian Industries Corp. Methods of making coated articles by sputtering silver in oxygen inclusive atmosphere
US7184190B2 (en) * 2002-09-20 2007-02-27 Donnelly Corporation Electro-optic reflective element assembly
US7005190B2 (en) 2002-12-20 2006-02-28 Guardian Industries Corp. Heat treatable coated article with reduced color shift at high viewing angles
CN100446102C (en) * 2003-05-16 2008-12-24 三菱麻铁里亚尔株式会社 Silver alloy sputtering target for forming reflection layer of optical recording medium
US7537677B2 (en) * 2005-01-19 2009-05-26 Guardian Industries Corp. Method of making low-E coating using ceramic zinc inclusive target, and target used in same
US7628896B2 (en) 2005-07-05 2009-12-08 Guardian Industries Corp. Coated article with transparent conductive oxide film doped to adjust Fermi level, and method of making same

Also Published As

Publication number Publication date
US20070007125A1 (en) 2007-01-11
WO2007005525A1 (en) 2007-01-11
US7989072B2 (en) 2011-08-02
US20100040892A1 (en) 2010-02-18
EP1919837A1 (en) 2008-05-14
BRPI0612688A2 (en) 2010-11-30
US7628896B2 (en) 2009-12-08
CA2610979A1 (en) 2007-01-11

Similar Documents

Publication Publication Date Title
CA2610979C (en) Coated article with transparent conductive oxide film doped to adjust fermi level, and method of making same
US20070184573A1 (en) Method of making a thermally treated coated article with transparent conductive oxide (TCO) coating for use in a semiconductor device
US20070029186A1 (en) Method of thermally tempering coated article with transparent conductive oxide (TCO) coating using inorganic protective layer during tempering and product made using same
US7597964B2 (en) Thermally tempered coated article with transparent conductive oxide (TCO) coating
EP1912912B1 (en) Method of thermally tempering coated article with transparent conductive oxide (tco) coating using flame(s) in tempering furnace adjacent tco to burn off oxygen and product made using same
EP1851354B2 (en) Method of making low-e coating using ceramic zinc inclusive target, and target used in same
AU2010258455B2 (en) Thin film deposition method and resulting product
EP1430332B1 (en) Optical coatings and associated methods
WO2013158451A1 (en) Method of making heat treated coated article using tco and removable protective film
JP4285019B2 (en) Transparent conductive thin film and method for producing the same, transparent conductive substrate for display panel using the same, and electroluminescence device
Kim et al. Effects of H2 ambient annealing in fully 0 0 2-textured ZnO: Ga thin films grown on glass substrates using RF magnetron co-sputter deposition
Chen et al. Optimization of the process for preparing Al-doped ZnO thin films by sol-gel method
Maruyama et al. Fluorine‐Doped Tin Dioxide Thin Films Prepared by Radio‐Frequency Magnetron Sputtering
JP2000156517A (en) Manufacture of compound semiconductor thin film and solar battery using the same
KR100806681B1 (en) Fabrication of highly conductive zno using low temperature rapid thermal annealing

Legal Events

Date Code Title Description
EEER Examination request
MKLA Lapsed

Effective date: 20140702