CA2677450C - Dome gas sensor - Google Patents
Dome gas sensor Download PDFInfo
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- CA2677450C CA2677450C CA2677450A CA2677450A CA2677450C CA 2677450 C CA2677450 C CA 2677450C CA 2677450 A CA2677450 A CA 2677450A CA 2677450 A CA2677450 A CA 2677450A CA 2677450 C CA2677450 C CA 2677450C
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- radiation detector
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
- G01N21/03—Cuvette constructions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/02—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/02—Details
- G01J3/0205—Optical elements not provided otherwise, e.g. optical manifolds, diffusers, windows
- G01J3/0216—Optical elements not provided otherwise, e.g. optical manifolds, diffusers, windows using light concentrators or collectors or condensers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/28—Investigating the spectrum
- G01J3/42—Absorption spectrometry; Double beam spectrometry; Flicker spectrometry; Reflection spectrometry
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
- G01N21/03—Cuvette constructions
- G01N21/031—Multipass arrangements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
- G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
- G01N21/35—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
- G01N21/3504—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light for analysing gases, e.g. multi-gas analysis
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/0004—Gaseous mixtures, e.g. polluted air
- G01N33/0009—General constructional details of gas analysers, e.g. portable test equipment
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/06—Illumination; Optics
- G01N2201/062—LED's
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/06—Illumination; Optics
- G01N2201/063—Illuminating optical parts
- G01N2201/0636—Reflectors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/0004—Gaseous mixtures, e.g. polluted air
- G01N33/0009—General constructional details of gas analysers, e.g. portable test equipment
- G01N33/0027—General constructional details of gas analysers, e.g. portable test equipment concerning the detector
- G01N33/0036—Specially adapted to detect a particular component
- G01N33/004—Specially adapted to detect a particular component for CO, CO2
Abstract
An NDIR (Non-Dispersive InfraRed) gas sensor has the LED radiation source (2) and photodiode detector (3) side by side in a dome shaped gas chamber (5). The mirror coated inner surface (6) of the dome (5) reflects light from the LED (2) to the photodiode (3). The reflecting surface in one embodiment has a plurality of semi-toroidal sub surfaces (51-59), such that radiation originating from a point on the LED is unfocussed as it converges on the photodiode. The LED and photodiode (3) may be mounted on a bridge printed circuit board (4) extending along the diameter of the dome housing. The bridge height is adjustable during assembly to optimise the radiation's incidence onto the photodiode.
Description
1 Dome gas sensor 3 The present invention relates to gas sensing, in 4 particular gas sensors such as non-dispersive infrared (NDIR) gas sensors having a radiation source, radiation 6 detector and a reflector-arranged to reflect radiation 7 from the radiation source to the radiation detector.
9 In the field of gas sensing, there is a requirement for small, low cost gas sensors that can operate over a wide 11 range of environmental'conditions. This is driven by 12 legislation directed to increasing safety and reducing 13 emissions in a variety of applications. For example, in 14 the automotive industry, sensing of the presence of automotive exhaust gases and CO2 in vehicle cabins and 16 engine management systems are applications where a small 17 form factor as well as low cost and efficiency are 18 desirable. The need for detection of CO2 in vehicle cabins 19 comes from the move towards C02 refrigerant based air conditioning systems away from the use of more 21 environmentally harmful Fluorocarbon based refrigerants 22 such as P134a. By providing COa based air conditioning 23 systems, automotive manufacturers will be able to avoid 1 emission penalties applied to the disposal and recycling 2 of hydrofluorocarbons. However, conventional gas sensors 3 suitable for CO2 and CO gas sensing are too large and too 4 expensive for use in such automotive applications.
Furthermore, in such applications, the gas sensor is 6 required to operate over a wide range of temperatures.
8 Like the automotive industry, industrial heating, 9 ventilation and air conditioning (HVAC) systems based on CO2 refrigerants require low cost CO2 gas sensors that 11 . operate in a variety of environments. The safety products 12 that detect combustion or solvent gas leaks in many 13 applications, from gas welding through automatic 14 production processes to solvent cleaners, also require low-cost, efficient gas sensors.
17 In the domestic heating field, gas sensors are used to 18 provide safety from carbbn monoxide poisoning.
19 Furthermore, combustion gas sensing provides safety from an explosion risk.
21 . .
22 In gas sensing; infrared gas sensors have advantages 23 compared with other technologies, including long lifetime 24 and resistance to poisoning. However many infrared detectors use thermal components such as,incandescent 26 sources (e.g. bulbs) and pyro-electric or thermopile 27 detectors, which themselves have several disadvantages.
28 For example they may have a slow response or a limited 29 wavelength range and may require explosion-proof housing to prevent the bulb acting as an ignition source.
31 Replacing the .incandescent sources and thermal detectors 32 with high performance LEDs (Light Emitting Diodes) and 33 photodiodes offers advantages including low power, fast 1 response and intrinsic safety, for a greater range of 2 gases.
4 Gas sensors may be made using a LED and a photodiode that are manufactured at matched frequencies such that they 6 have stable and very narrow coincident optical bandwidths 7 in operation.
9 In an NDIR gas sensor, light is emitted from a light source, passed through a gas and then measured by a light 11 detector. For efficient detection of a gas, it is 12 important to have a large interaction between the light 13 and the gas and this is influenced by the length and 14 volume of the interacting optical path, and the transport of the gas into and=out of the interacting optical path.
16 The problems with simply arranging a detector in front of 17 an emitter are that wheri the light diverges from the 18 source, only a small proportion of the light is incident 19 upon the detector and the optical path length is merely the distance around the emitter and the detector.
21 Therefore, there is a relatively small length and volume 22 for the gas to interact with the light. Known approaches 23 to improve this arrangement are to coat the internal 24 walls of the sensor housing with reflective material and to fold the optical path by the use of mirrors. However, 26 though the folded linear path the latter approach can 27 increase the optical path length, it retains the problem 28 that the path only sweeps out part of the available 29 volume between the light source and the light detector, even using curved mirrors. Thus with a folded optical 31 path, only a fraction of the available volume of the 32 sensor housing is used for the interacting optical path.
33 Also, a multiply folded optical path, for example in a 1 zig-zag shape, requires multiple reflectors that need to 2 be well aligned.
4 It is an object of the present invention to provide a compact, high-efficiency gas sensor.
7 According to the present invention, there is provided a 8 gas sensor comprising:
9 a radiation source;
a radiation detector; and 11 a reflecting means arranged to reflect radiation 12 from the radiation source to the radiation detector 13 along an optical path, 14 wherein the radiation source and the radiation detector are disposed side by side.
17 Preferably the gas sensor further comprises a screen 18 disposed in between the-radiation source and the 19 radiation detector.
21 Preferably the screen is disposed in line with the 22 radiation source and the radiation detector.
24 Preferably the screen is configured to reflect radiation.
26 Preferably the reflecting means is arranged to reflect 27 radiation divergent from the radiation source and to 28 concentrate the reflected radiation onto the radiation 29 detector.
31 Preferably, the reflecting means is arranged such that 32 the optical path is defined at least in part by a cavity 1 extending around the radiation source and radiation 2 detector.
4 Preferably the cavity is bounded by a plane parallel to 5 surfaces of the radiation source and the radiation 6 detector.
9 In the field of gas sensing, there is a requirement for small, low cost gas sensors that can operate over a wide 11 range of environmental'conditions. This is driven by 12 legislation directed to increasing safety and reducing 13 emissions in a variety of applications. For example, in 14 the automotive industry, sensing of the presence of automotive exhaust gases and CO2 in vehicle cabins and 16 engine management systems are applications where a small 17 form factor as well as low cost and efficiency are 18 desirable. The need for detection of CO2 in vehicle cabins 19 comes from the move towards C02 refrigerant based air conditioning systems away from the use of more 21 environmentally harmful Fluorocarbon based refrigerants 22 such as P134a. By providing COa based air conditioning 23 systems, automotive manufacturers will be able to avoid 1 emission penalties applied to the disposal and recycling 2 of hydrofluorocarbons. However, conventional gas sensors 3 suitable for CO2 and CO gas sensing are too large and too 4 expensive for use in such automotive applications.
Furthermore, in such applications, the gas sensor is 6 required to operate over a wide range of temperatures.
8 Like the automotive industry, industrial heating, 9 ventilation and air conditioning (HVAC) systems based on CO2 refrigerants require low cost CO2 gas sensors that 11 . operate in a variety of environments. The safety products 12 that detect combustion or solvent gas leaks in many 13 applications, from gas welding through automatic 14 production processes to solvent cleaners, also require low-cost, efficient gas sensors.
17 In the domestic heating field, gas sensors are used to 18 provide safety from carbbn monoxide poisoning.
19 Furthermore, combustion gas sensing provides safety from an explosion risk.
21 . .
22 In gas sensing; infrared gas sensors have advantages 23 compared with other technologies, including long lifetime 24 and resistance to poisoning. However many infrared detectors use thermal components such as,incandescent 26 sources (e.g. bulbs) and pyro-electric or thermopile 27 detectors, which themselves have several disadvantages.
28 For example they may have a slow response or a limited 29 wavelength range and may require explosion-proof housing to prevent the bulb acting as an ignition source.
31 Replacing the .incandescent sources and thermal detectors 32 with high performance LEDs (Light Emitting Diodes) and 33 photodiodes offers advantages including low power, fast 1 response and intrinsic safety, for a greater range of 2 gases.
4 Gas sensors may be made using a LED and a photodiode that are manufactured at matched frequencies such that they 6 have stable and very narrow coincident optical bandwidths 7 in operation.
9 In an NDIR gas sensor, light is emitted from a light source, passed through a gas and then measured by a light 11 detector. For efficient detection of a gas, it is 12 important to have a large interaction between the light 13 and the gas and this is influenced by the length and 14 volume of the interacting optical path, and the transport of the gas into and=out of the interacting optical path.
16 The problems with simply arranging a detector in front of 17 an emitter are that wheri the light diverges from the 18 source, only a small proportion of the light is incident 19 upon the detector and the optical path length is merely the distance around the emitter and the detector.
21 Therefore, there is a relatively small length and volume 22 for the gas to interact with the light. Known approaches 23 to improve this arrangement are to coat the internal 24 walls of the sensor housing with reflective material and to fold the optical path by the use of mirrors. However, 26 though the folded linear path the latter approach can 27 increase the optical path length, it retains the problem 28 that the path only sweeps out part of the available 29 volume between the light source and the light detector, even using curved mirrors. Thus with a folded optical 31 path, only a fraction of the available volume of the 32 sensor housing is used for the interacting optical path.
33 Also, a multiply folded optical path, for example in a 1 zig-zag shape, requires multiple reflectors that need to 2 be well aligned.
4 It is an object of the present invention to provide a compact, high-efficiency gas sensor.
7 According to the present invention, there is provided a 8 gas sensor comprising:
9 a radiation source;
a radiation detector; and 11 a reflecting means arranged to reflect radiation 12 from the radiation source to the radiation detector 13 along an optical path, 14 wherein the radiation source and the radiation detector are disposed side by side.
17 Preferably the gas sensor further comprises a screen 18 disposed in between the-radiation source and the 19 radiation detector.
21 Preferably the screen is disposed in line with the 22 radiation source and the radiation detector.
24 Preferably the screen is configured to reflect radiation.
26 Preferably the reflecting means is arranged to reflect 27 radiation divergent from the radiation source and to 28 concentrate the reflected radiation onto the radiation 29 detector.
31 Preferably, the reflecting means is arranged such that 32 the optical path is defined at least in part by a cavity 1 extending around the radiation source and radiation 2 detector.
4 Preferably the cavity is bounded by a plane parallel to 5 surfaces of the radiation source and the radiation 6 detector.
8 Preferably, the reflecting means comprises a curved 9 surface.
11 Preferably, the reflecting means comprises a dome.
13 Preferably, the reflecting means has a radial symmetry.
Preferably, the reflecting means comprises a 16 hemispherical surface.
- 18 Alternatively, the'reflecting means comprises a semi-19 ellipsoidal surface.
21 Preferably the reflecting means comprises a mirror.
23 Preferably, the reflecting means comprises a reflective 24 surface of a housing.
26 Preferably, the housing has at least one aperture for 27 permitting the transport of gas in and out of the gas 28 sensor.
Preferably the radiation source is a light emitting diode 31 having an emission bandwidth..
1 Preferably the gas sensor further comprises a filter in 2 the optical path configured to filter at least a portion 3 of the emission bandwidth.
Preferably, the-radiation source and radiation detector 6 are mounted on a common substrate.
8 Preferably the screen is mounted on the substrate.
Alternatively, the substrate comprises the screen.
12 Optionally, the substrate is configured to provide 13 structural support for the radiation source and radiation'' 14 detector within the gas sensor.
16 Preferably the substrate is configured to locate the 17 radiation source and radiation detector in relation to 18 the housing.
By acting a mechanical location means it therefore avoids 21 the need for location adjustment during assembly.
23 Preferably the substrate is configured as an elongate 24 member extending along a diameter of the housing.
26 Optionally, the gas sensor further.comprises a 27 temperature adjusting means for adjusting thetemperature 28 of the radiation source and radiation detector 29 simultaneously.
31 Optionally, the gas sensor further comprises a 32 temperature sensing means for sensing the temperature of 1 the radiation source and radiation detector 2 simultaneously.
4 Preferably, the temperature sensing means comprises a thermistor.
7 Optionally, the temperature sensing means uses the 8 characteristics of the radiation source and/or detector 9 to measure temperature.
11 Optionally, the substrate further comprises a signal 12 processing means for processing signals relating to the 13 radiation source.
Optionally, the substrate further comprises a signal 16 processing meansfor processing signals relating to the 17 -radiation detector.
19 Optionally, the substrate further comprises a signal amplifying means for amplifying signals relating to the 21 radiation detector.
23 Preferably, the radiation source and radiation detector 24 are in thermal communication.
26 Preferably, the radiation source is operable to heat the 27 radiation detector.
29 Preferably, the radiation detector is heated above the dew point of ambient gas.
1 Preferably, the gas sensor further comprises a radiation 2 source reflector arranged to reflect radiation from the 3 radiation source back into the radiation source.
Optionally, the radiation source reflector is applied to 6 a surface of the radiation source.
8 Optionally the radiation source reflector is provided by 9 the mounting of the radiation source.
11 Preferably, the gas sensor further comprises a radiation 12 detector reflector arranged to reflect radiation from the 13 radiation detector back into the radiation detector.
Optionally, the radiation detector reflector is applied_ 16 to a surface of the radiation detector.
18 Optionally the radiation detector reflector is provided-.
19 by the mounting of the radiation detector.
21 Preferably, the radiation source and radiation detector 22 are fabricated from the same substrate.
24 Preferably, the reflecting means comprises a surface comprising a plurality of sub surfaces, each defined by 26 an arc with a radius and a centre point, the arcs being.
27 swept out around an axis, and each sub surface being 28- tangent to an adjacent sub surface and having a different 29 radius and different centre point from the adjacent sub--30 surface.
32 Preferably, the axis is in line with the radiation source 33 and the radiation detector.
2 Optionally, the arc length tends to zero.
4 Preferably, the sub surface are semi-toroidal.
6 Preferably, the surface is configured such that radiation 7 originating from a point on the radiation source is 8 unfocussed as it converges on the radiation detector.
Preferably, the surface is configured to-reflect 11 radiation from the radiation source to a corresponding 12 location on,the radiation detector, irrespective of the 13 radiation exit angle from the radiation source.
Preferably, the surface is configured to reflect 16 radiation leaving the centre of the radiation source to 17 the centre of the radiation detector, radiation leaving 18 the outer side of'the radiation source to the outer side 19 of the radiation detector, and radiation leaving the inner side of the radiation source to the inner side of 21 the radiation detector.
23 Preferably, the surface is configured to reflect 24 radiation such that the length of the optical path is on average equal for each sub surface.
27 Preferably, the elongate member is adjustable so as to 28 optimise the location of a reflected radiation pool on 29 the radiation detector.
31 Preferably, the elongate member is adjustable by sliding 32 of pins.
1 Preferably, the pins are electrical leads.
3 Preferably, the adjustable elongate member is lockable 4 with respect to the reflecting means.
6 Preferably, the adjustable elongate member is lockable by 7 gluing the pins to the reflecting means.
9 Preferably, the adjustable elongate member is lockable by 10 soldering the pins. -11 The present invention.will now be described by way of 12 example only with reference to the figures in which:
11 Preferably, the reflecting means comprises a dome.
13 Preferably, the reflecting means has a radial symmetry.
Preferably, the reflecting means comprises a 16 hemispherical surface.
- 18 Alternatively, the'reflecting means comprises a semi-19 ellipsoidal surface.
21 Preferably the reflecting means comprises a mirror.
23 Preferably, the reflecting means comprises a reflective 24 surface of a housing.
26 Preferably, the housing has at least one aperture for 27 permitting the transport of gas in and out of the gas 28 sensor.
Preferably the radiation source is a light emitting diode 31 having an emission bandwidth..
1 Preferably the gas sensor further comprises a filter in 2 the optical path configured to filter at least a portion 3 of the emission bandwidth.
Preferably, the-radiation source and radiation detector 6 are mounted on a common substrate.
8 Preferably the screen is mounted on the substrate.
Alternatively, the substrate comprises the screen.
12 Optionally, the substrate is configured to provide 13 structural support for the radiation source and radiation'' 14 detector within the gas sensor.
16 Preferably the substrate is configured to locate the 17 radiation source and radiation detector in relation to 18 the housing.
By acting a mechanical location means it therefore avoids 21 the need for location adjustment during assembly.
23 Preferably the substrate is configured as an elongate 24 member extending along a diameter of the housing.
26 Optionally, the gas sensor further.comprises a 27 temperature adjusting means for adjusting thetemperature 28 of the radiation source and radiation detector 29 simultaneously.
31 Optionally, the gas sensor further comprises a 32 temperature sensing means for sensing the temperature of 1 the radiation source and radiation detector 2 simultaneously.
4 Preferably, the temperature sensing means comprises a thermistor.
7 Optionally, the temperature sensing means uses the 8 characteristics of the radiation source and/or detector 9 to measure temperature.
11 Optionally, the substrate further comprises a signal 12 processing means for processing signals relating to the 13 radiation source.
Optionally, the substrate further comprises a signal 16 processing meansfor processing signals relating to the 17 -radiation detector.
19 Optionally, the substrate further comprises a signal amplifying means for amplifying signals relating to the 21 radiation detector.
23 Preferably, the radiation source and radiation detector 24 are in thermal communication.
26 Preferably, the radiation source is operable to heat the 27 radiation detector.
29 Preferably, the radiation detector is heated above the dew point of ambient gas.
1 Preferably, the gas sensor further comprises a radiation 2 source reflector arranged to reflect radiation from the 3 radiation source back into the radiation source.
Optionally, the radiation source reflector is applied to 6 a surface of the radiation source.
8 Optionally the radiation source reflector is provided by 9 the mounting of the radiation source.
11 Preferably, the gas sensor further comprises a radiation 12 detector reflector arranged to reflect radiation from the 13 radiation detector back into the radiation detector.
Optionally, the radiation detector reflector is applied_ 16 to a surface of the radiation detector.
18 Optionally the radiation detector reflector is provided-.
19 by the mounting of the radiation detector.
21 Preferably, the radiation source and radiation detector 22 are fabricated from the same substrate.
24 Preferably, the reflecting means comprises a surface comprising a plurality of sub surfaces, each defined by 26 an arc with a radius and a centre point, the arcs being.
27 swept out around an axis, and each sub surface being 28- tangent to an adjacent sub surface and having a different 29 radius and different centre point from the adjacent sub--30 surface.
32 Preferably, the axis is in line with the radiation source 33 and the radiation detector.
2 Optionally, the arc length tends to zero.
4 Preferably, the sub surface are semi-toroidal.
6 Preferably, the surface is configured such that radiation 7 originating from a point on the radiation source is 8 unfocussed as it converges on the radiation detector.
Preferably, the surface is configured to-reflect 11 radiation from the radiation source to a corresponding 12 location on,the radiation detector, irrespective of the 13 radiation exit angle from the radiation source.
Preferably, the surface is configured to reflect 16 radiation leaving the centre of the radiation source to 17 the centre of the radiation detector, radiation leaving 18 the outer side of'the radiation source to the outer side 19 of the radiation detector, and radiation leaving the inner side of the radiation source to the inner side of 21 the radiation detector.
23 Preferably, the surface is configured to reflect 24 radiation such that the length of the optical path is on average equal for each sub surface.
27 Preferably, the elongate member is adjustable so as to 28 optimise the location of a reflected radiation pool on 29 the radiation detector.
31 Preferably, the elongate member is adjustable by sliding 32 of pins.
1 Preferably, the pins are electrical leads.
3 Preferably, the adjustable elongate member is lockable 4 with respect to the reflecting means.
6 Preferably, the adjustable elongate member is lockable by 7 gluing the pins to the reflecting means.
9 Preferably, the adjustable elongate member is lockable by 10 soldering the pins. -11 The present invention.will now be described by way of 12 example only with reference to the figures in which:
14 Figure 1 illustrates in schematic form a cross section of a first embodiment of a gas sensor;
17 Figure 2 illustrates in schematic form a cross 18 section of the radiation source and radiation 19 detector assembly;
21 Figure 3 illustrates in schematic form a cross 22 section of a second embodiment of a gas sensor;
24 Figure 4 illustrates in schematic form a perspective view of the second embodiment of a gas sensor;
27 Figure 5 illustrates in schematic form a half cross..
28 section of the dome reflector;
Figure 6 illustrates in schematic form rays of light 31 being reflected between the centres and outer sides 32 of the radiation source and radiation detector;
1 Figure 7 illustrates in schematic form rays of light 2 being reflected between the centres and inner sides 3 of the radiation source and radiation detector; and Figure 8 illustrates in schematic form a cross 6 section of an embodiment of the gas sensor having an 7 adjustable bridge.
9 With reference to figure 1, a partial cross section of a gas-sensor in accordance with a first embodiment of the 11 present invention is shown. The gas sensor has a screen 1 12 in between a LED radiation source 2 and a photodiode 13 radiation detector 3 on a substrate 4 mounted within the 14 gas sensor. The LED and photodiode are therefore side-by-side, with the screen in line and in between them. Only 16 half of a housing 5 and the radiation path is shown in 17 figure 1. The housing has radial symmetry centred on the 18 LED/screen/photodiode assembly. The inner surface 6 of 19 the housing is reflective. This may be achieved by applying a reflective coating to a moulded plastic 21 housing.' Light rays 8 that diverge from the LED are 22 reflected from the inner surface of the housing. The 23 housing is shaped such that the light emitted by the LED
24 is reflected through the cavity extending around the LED
and photodiode and the reflected light rays 9 are 26 concentrated onto the photodiode. The cavity is bounded 27 by the plane parallel to the main emitting and absorbing 28 surfaces of the LED and photodiode respectively. The rays 29 reflected from surface 6 may or may not be focused. The curved shape of the housing is arranged to provide an 31 even, broad spread of the light throughout the cavity.
32 The surface may be hemispherical or semi-ellipsoidal. The 33 even spread of light through the cavity is generally 1 characterised by avoidance of focus where light rays 2 originating from a point on the source do not converge on 3 a particular focal point, but none the less converge on 4 the photodiode. The side-by-side geometry has the advantage of allowing a small housing with a maximum 6 spread of the.interacting light path throughout the 7 available volume of the, housing. This provides good 8 opticalabsorption efficiency and minimises the risk of 9 saturation of the gas's interaction with the light, all in a compact housing. The compact optical design enables 11 the gas sensor to fit within a 20mm diameter and 17mm 12 long form factor. These features improve the gas sensor's 13 sensitivity for gas sensing and response and the compact 14 size makes it suitable for use in a wide range of space sensitive applications, where large housings are not 16 acceptable.
18 The LED has a narrow emission bandwidth, therefore using 19 a LED and photodiode the narrow optical bandwidth required for gas sensing may be achieved without optical 21 filters as are required for incandescent and other 22* sources. However, the radiation source may be a LED that 23 uses an optical bandpass filter to trim the optical 24 emission profile but remove all other light frequencies that may cause error in the gas sensing process. Such an 26 optical bandpass filter may remove no more than 25% of 27 the emitted light-form the LED, whereas in the prior art 28 case of an incandescent source the vast majority of .29 radiated light would be'removed by the filter. Therefore, the LED radiates a precise and narrow bandwidth which is 31 not post or pre optically filtered other than by simple 32 bandwidth trimming.
1 Figure 2 shows a cross section of the radiation source, 2 screen and radiation detector is shown. With reference to 3 figure 2, the LED radiation source 2 and the photodiode 4 radiation detector 3 are side-by-side mounted on an interconnecting substrate 4, with the screen 1 in 6 between. The screen may be formed as part of the 7 substrate and the LED and/or photodiode may abut the 8 screen. The screen may be reflecting. The surfaces of the 9 LED and/or photodiode facing the screen may be reflecting. Alternatively the screen may be a reflective 11 coating on one or more of the surfaces of the LED or 12 photodiode facing each other.
14 Both the radiation source and'detector in this embodiment are based on the narrow band gap III-V material indium 16 aluminium antimonide (In(1_X)Al.Sb), grown on a gallium 17 arsenide (GaAs) substrate, the band gap of which can be 18 tuned to a very narrow width to provide light emission 19 and detection that is specific to carbon dioxide (C02) and carbon monoxide (CO gases) or other selected gases 21 without the use of expensive optical filters and 22 complicated differentiating circuitry. The LED and 23 photodiode may be fabricated from the same semiconducting 24 substrate. The LED and photodiode may also be fabricated from very similar substrates varying only by their 26 epilayer thicknesses, which maybe tuned to enhance the 27 performance of light emission in the case of the LED or 28 collection in the case of the photodiode. In other.
29 embodiments, the radiation source and radiation detector may comprise one or more discrete LED or photodiode 31 elements respectively.
1 The invention is not limited to this type of radiation 2 source and radiation detector. For example, cadmium 3 mercury telluride compounds are useful with ultraviolet 4 frequencies. Although solid state radiation sources and detectors are convenient for miniaturised application, .6 the present invention may also be implemented using 7 incandescent sources and pyro-electric or thermopile 8 detectors.
The interconnecting substrate 4 and/or screen is 11 thermally conductive and provides thermal communication 12 between the LED and the photodiode. The thermal 13 communication allows the transfer of heat from the LED to 14 the photodiode. This provides the advantage of reducing the temperature-difference between the LED and 16 photodiode, thereby simplifying the compensation of any 17 temperature dependent effects on the operation of the LED
18 and/or photodiode: This approach is in contrast to most 19 common electrical applications.of conductive layers where the heat is trans-ferred away from the semiconductors. The 21 heating effect may be used to keep the photodiode at an 22 elevated temperature when compared to its surroundings, 23 thus keeping it on the positive side of the dew point of 24 the ambient gas, therefore reducing the risk of condensation forming on the photodiode.
27 The substrate may have integrated in it or mounted on it 28 a temperature control means 12 such as a-heater or cooler 29 '(Peltier device or similar) that~can be controlled and powered to affect the temperature of the LED and 31 photodiode simultaneously.
1 Temperature detection maybe achieved by use of an 2 additional device (not shown), which may be in or on the 3 substrate, such as a thermistor, or may be detected by 4 measuring the characteristics of either the emitter or 5 detector. For example the forward voltage of the LED will 6 vary with temperature.
8 The substrate provides a structural mounting for the LED
9 and photodiode within the gas sensor. The substrate may 10 be shaped to aid in locat-ing the radiation source or 11 detector for mounting on the substrate. The substrate may -12 also provide mechanical features that serve to precisely 13 locate the optical pair within the optical housing 14 avoiding the need for adjustment or setting during the 15 assembly process..;
17 Figure 2 illustrates in schematic form a cross 18 section of the radiation source and radiation 19 detector assembly;
21 Figure 3 illustrates in schematic form a cross 22 section of a second embodiment of a gas sensor;
24 Figure 4 illustrates in schematic form a perspective view of the second embodiment of a gas sensor;
27 Figure 5 illustrates in schematic form a half cross..
28 section of the dome reflector;
Figure 6 illustrates in schematic form rays of light 31 being reflected between the centres and outer sides 32 of the radiation source and radiation detector;
1 Figure 7 illustrates in schematic form rays of light 2 being reflected between the centres and inner sides 3 of the radiation source and radiation detector; and Figure 8 illustrates in schematic form a cross 6 section of an embodiment of the gas sensor having an 7 adjustable bridge.
9 With reference to figure 1, a partial cross section of a gas-sensor in accordance with a first embodiment of the 11 present invention is shown. The gas sensor has a screen 1 12 in between a LED radiation source 2 and a photodiode 13 radiation detector 3 on a substrate 4 mounted within the 14 gas sensor. The LED and photodiode are therefore side-by-side, with the screen in line and in between them. Only 16 half of a housing 5 and the radiation path is shown in 17 figure 1. The housing has radial symmetry centred on the 18 LED/screen/photodiode assembly. The inner surface 6 of 19 the housing is reflective. This may be achieved by applying a reflective coating to a moulded plastic 21 housing.' Light rays 8 that diverge from the LED are 22 reflected from the inner surface of the housing. The 23 housing is shaped such that the light emitted by the LED
24 is reflected through the cavity extending around the LED
and photodiode and the reflected light rays 9 are 26 concentrated onto the photodiode. The cavity is bounded 27 by the plane parallel to the main emitting and absorbing 28 surfaces of the LED and photodiode respectively. The rays 29 reflected from surface 6 may or may not be focused. The curved shape of the housing is arranged to provide an 31 even, broad spread of the light throughout the cavity.
32 The surface may be hemispherical or semi-ellipsoidal. The 33 even spread of light through the cavity is generally 1 characterised by avoidance of focus where light rays 2 originating from a point on the source do not converge on 3 a particular focal point, but none the less converge on 4 the photodiode. The side-by-side geometry has the advantage of allowing a small housing with a maximum 6 spread of the.interacting light path throughout the 7 available volume of the, housing. This provides good 8 opticalabsorption efficiency and minimises the risk of 9 saturation of the gas's interaction with the light, all in a compact housing. The compact optical design enables 11 the gas sensor to fit within a 20mm diameter and 17mm 12 long form factor. These features improve the gas sensor's 13 sensitivity for gas sensing and response and the compact 14 size makes it suitable for use in a wide range of space sensitive applications, where large housings are not 16 acceptable.
18 The LED has a narrow emission bandwidth, therefore using 19 a LED and photodiode the narrow optical bandwidth required for gas sensing may be achieved without optical 21 filters as are required for incandescent and other 22* sources. However, the radiation source may be a LED that 23 uses an optical bandpass filter to trim the optical 24 emission profile but remove all other light frequencies that may cause error in the gas sensing process. Such an 26 optical bandpass filter may remove no more than 25% of 27 the emitted light-form the LED, whereas in the prior art 28 case of an incandescent source the vast majority of .29 radiated light would be'removed by the filter. Therefore, the LED radiates a precise and narrow bandwidth which is 31 not post or pre optically filtered other than by simple 32 bandwidth trimming.
1 Figure 2 shows a cross section of the radiation source, 2 screen and radiation detector is shown. With reference to 3 figure 2, the LED radiation source 2 and the photodiode 4 radiation detector 3 are side-by-side mounted on an interconnecting substrate 4, with the screen 1 in 6 between. The screen may be formed as part of the 7 substrate and the LED and/or photodiode may abut the 8 screen. The screen may be reflecting. The surfaces of the 9 LED and/or photodiode facing the screen may be reflecting. Alternatively the screen may be a reflective 11 coating on one or more of the surfaces of the LED or 12 photodiode facing each other.
14 Both the radiation source and'detector in this embodiment are based on the narrow band gap III-V material indium 16 aluminium antimonide (In(1_X)Al.Sb), grown on a gallium 17 arsenide (GaAs) substrate, the band gap of which can be 18 tuned to a very narrow width to provide light emission 19 and detection that is specific to carbon dioxide (C02) and carbon monoxide (CO gases) or other selected gases 21 without the use of expensive optical filters and 22 complicated differentiating circuitry. The LED and 23 photodiode may be fabricated from the same semiconducting 24 substrate. The LED and photodiode may also be fabricated from very similar substrates varying only by their 26 epilayer thicknesses, which maybe tuned to enhance the 27 performance of light emission in the case of the LED or 28 collection in the case of the photodiode. In other.
29 embodiments, the radiation source and radiation detector may comprise one or more discrete LED or photodiode 31 elements respectively.
1 The invention is not limited to this type of radiation 2 source and radiation detector. For example, cadmium 3 mercury telluride compounds are useful with ultraviolet 4 frequencies. Although solid state radiation sources and detectors are convenient for miniaturised application, .6 the present invention may also be implemented using 7 incandescent sources and pyro-electric or thermopile 8 detectors.
The interconnecting substrate 4 and/or screen is 11 thermally conductive and provides thermal communication 12 between the LED and the photodiode. The thermal 13 communication allows the transfer of heat from the LED to 14 the photodiode. This provides the advantage of reducing the temperature-difference between the LED and 16 photodiode, thereby simplifying the compensation of any 17 temperature dependent effects on the operation of the LED
18 and/or photodiode: This approach is in contrast to most 19 common electrical applications.of conductive layers where the heat is trans-ferred away from the semiconductors. The 21 heating effect may be used to keep the photodiode at an 22 elevated temperature when compared to its surroundings, 23 thus keeping it on the positive side of the dew point of 24 the ambient gas, therefore reducing the risk of condensation forming on the photodiode.
27 The substrate may have integrated in it or mounted on it 28 a temperature control means 12 such as a-heater or cooler 29 '(Peltier device or similar) that~can be controlled and powered to affect the temperature of the LED and 31 photodiode simultaneously.
1 Temperature detection maybe achieved by use of an 2 additional device (not shown), which may be in or on the 3 substrate, such as a thermistor, or may be detected by 4 measuring the characteristics of either the emitter or 5 detector. For example the forward voltage of the LED will 6 vary with temperature.
8 The substrate provides a structural mounting for the LED
9 and photodiode within the gas sensor. The substrate may 10 be shaped to aid in locat-ing the radiation source or 11 detector for mounting on the substrate. The substrate may -12 also provide mechanical features that serve to precisely 13 locate the optical pair within the optical housing 14 avoiding the need for adjustment or setting during the 15 assembly process..;
17 The LED and photodiode are each provided with optically 18 reflective layers 10,.11 on. their-surfaces. These 19 -reflective layers may be included on one or other of the LED and photodiode, or not at all. The reflective layers 21 may be part of the substrate or applied as a coating to 22 the back and/or sides of the LED and/or photodiode. The 23 optical reflection improves the efficiency of both the 24 LED and the photodiode._ A proportion of the light generated or detected can pass straight through either 26 device without being absorbed, however the incorporation 27 of the reflective layers functions to return the light 28 back through the LED improving emission efficiency, or 29 similarly in the case of the photodiode, it can significantly increase the absorption by reducing loss of 31 light out of the back or sides of the photodiode.
1 With reference to figure 3, a cross section of a second 2 embodiment of a gas sensor is shown. The elements are 3 numbered as in figure 1. In comparison with the first 4 embodiment illustrated in figure 1, the domed reflector has been inverted. In this embodiment the substrate is an 6 elongate printed circuit board extending along a diameter 7 of the domed reflecting housing, which has radial 8 symmetry. This substrate allows the mounting of further 9 components (not shown). These components can include a temperature sensor (12 in figure 2) that because of the 11 side-by-side mounting of the LED and photodiode allows 12 the measurement simultaneously by one sensor of the 13 temperature of both the LED and the photodiode. This has 14 the advantage of reducing the component count. Another component or set of"components that can be incorporated 16 adjacent to the LED and photodiode are signal processing 17 elements, including a preamplifier. For example, the 18 preamplifier may be.mounted on the substrate next to the 19 LED/photodiode pair with the"remaining electronics and processing components-"being located at the next available 21 -position on the substrate away from the LED/photodiode 22 pair.'In that case there is an advantage that the 23 preamplifier and processor are located adjacent to both 24 the LED and the photodiode. Any electrical modulation signals can be transmitted to the LED with minimised 26 noise pickup. Furthermore, the same components can detect 27 the signal from the photodiode, which may be in the nA
28 range. These low level signals are similarly sensitive to 29 noise pickup effects and the location of the processing elements adjacent'to the detector reduces the effect-of 31 such noise pickup. There is a further advantage to 32 having the signal amplification and processing components 33 within a gas sensor housing, which is the shielding 1 afforded by the metalised housing. The apertures in the 2 housing may reduce such shielding, but the circuits 3 containing the components may be designed to balance with 4 any antenna affect of the housing in order to achieve a zero biased system.
7 With reference to figure 4, a perspective view of the 8 second embodiment of a gas sensor is shown. Two gas 9 filters 13, 14 are shown with the very narrow printed circuit board (PCB) 4 being located in the middle of 11 them. As an alternative to the signal processing and-12 temperature control components 15 being located on the 13 emitter/collector PCB as discussed above, they are'placed 14 on a second PCB 16. Having the preamplifier thus separated from the'LED/photodiode pair has been enabled 16 by the use of a centre:tap connection in the centre of an 17 array of discrete photodiode elements that make up the 18 radiation detect"or'connected along with the other two-LED
19 terminations by pins 17 to either:
a) two independent- t-ransimpedance amplifiers and the 21 outputs differentially amplified to combine the signals 22 and cancel out any common noise; or.
23 b) a differential transimpedance ainplifier.
A tubular external housing (not shown) may be placed 26 around the assembly, which forms a Faraday cage between 27 the metalised reflector, the external tube and a 28 shielding layer built into the second PCB, so improving 29 the electrical isolation of the components, as well as being a structural support.
31 _ 32 Figure 5 shows a cross section of half of"the internal 33 surface 6 of the dome in another embodiment of the 1 present invention. The dome has an internal surface 2 comprising a plurality of sub surfaces 51 to 59, shown in 3 section as arcs, each defined by a radius R9.3711 to 4 R9.0104 respectively and a centre point 60, each sub surface being tangent to an adjacent sub surface and 6 having a different radius and different centre location 7 from the adjacent subsurface. The offsets of the centre 8 points 61, 62 from the perpendicular datum lines 63"and 9 64 respectively a.re also shown. The emitter and detector lie on the datum line 64. The surface is defined by the 11 arcs labelled 51 to 59 (and their reflection about datum 12 line 63) being swept out by rotation by 180 degrees 13 around datum line 64. Another embodiment may have the arc 14 length tending to zero, thus giving a continuously varying curve from datum line 63 to datum line 64. -17 The internal sub.surfaces-czf this embodiment are semi-18 toroidal. The internal surface therefore does not form a 19 focused-reflector.
21 The dome functions to reflect, as near as possible, the 22 radiation-from the"emitter 2 through a single reflection 23 to the identical mirrored location on the detector 3, 24 irrespective of the.radiation exit angle from the emitter. This is illustrated by-Figures 6 and 7.
27 With reference to-Figure 6, light rays 65, 66 leaving the 28 centre 67 of-the emitter 2 are reflected by the inner 29 surface 6 as rays 68, 69 to the centre of the detector 70. Light rays 71, 72 leaving the outer side 73 of the 31 emitter 2 are reflected as rays 74, 75 to the outer side 32 of the detector 76.
1 With reference to Figure 7, as for Figure 6, light rays 2 65, 66 leaving the centre 67 of the emitter 2 are 3 reflected by the inner surface 6 as rays 68, 69 to the 4 centre of the detector 70. Light rays 77, 78 leaving the 5. inner side 79 of the emitter 2 are reflected as rays 80, 6 81 to the inner'side of the detector 82.
8 The emitter and detector are positioned on a common 9 mounting a small distance apart, typically 3mm centre to centre. The mutually tangent radii forming the swept 11 profile of the toroid are constructed such that the path 12 length,from emitter and detector is on average equal. The 13 number.of tangent radii used to construct the swept 14 profile of'the toroid determines the variation in path length for each ray angle between emitter and detector, 16 therefore the statement that the path length for each 17 specific radii is on'average equal refers to the average 18 path length of each radius, which generally occurs at the 19 radius mid point.. Therefore, apart from.one specific point in each radius, the path length varies continuously 21 across the face of each radius and therefore the face of 22 the toroidal swept curve, within the limits imposed by 23 the number of radii selected in the construction of the 24 swept curve. 25 26 This dome has the effect of transferring the image, of the 27 emitter to the detector, without a focus. The image may 28 be.concentrated towards the centre of the detector when 29. the components become out of alignment. This increases = 30 the manufacturing tolerance'of the assembly.
31 .
1 The surface is formed by silver coating an injection 2 moulded feature that forms.part of the sensor housing and 3 does not provide a mounting for the emitter and detector.
5 With reference to Figure 8, the emitter 2 and detector 3 6 are bonded to a bridge PCB (printed circuit board) 4 that 7 serves to provide electrical connectivity, thermal path, 8 and a mounting means that is adjustable on assembly to 9 optimise the location of the reflected radiation pool on 10 the detector. Other components are labelled as in 11 previous figures. A typical surface emitting LED may have 12 an emission surface that is 1 mm2 in area, and the 13 location of the bridge mounting the emitter and detector 14 is adjusted to provide as near as possible a pool of 15 radiation (nearly identical to that radiated) striking 16 the detector photodiode (as the non-focussed lighting 17 provides greater efficiency) that is the same size. If 18 the bridge PCB is wrongly adjusted in either direction, 19 at no time will the total"emitted radiation focus to a 20 single point. The adjustment is performed when the bridge.
1 With reference to figure 3, a cross section of a second 2 embodiment of a gas sensor is shown. The elements are 3 numbered as in figure 1. In comparison with the first 4 embodiment illustrated in figure 1, the domed reflector has been inverted. In this embodiment the substrate is an 6 elongate printed circuit board extending along a diameter 7 of the domed reflecting housing, which has radial 8 symmetry. This substrate allows the mounting of further 9 components (not shown). These components can include a temperature sensor (12 in figure 2) that because of the 11 side-by-side mounting of the LED and photodiode allows 12 the measurement simultaneously by one sensor of the 13 temperature of both the LED and the photodiode. This has 14 the advantage of reducing the component count. Another component or set of"components that can be incorporated 16 adjacent to the LED and photodiode are signal processing 17 elements, including a preamplifier. For example, the 18 preamplifier may be.mounted on the substrate next to the 19 LED/photodiode pair with the"remaining electronics and processing components-"being located at the next available 21 -position on the substrate away from the LED/photodiode 22 pair.'In that case there is an advantage that the 23 preamplifier and processor are located adjacent to both 24 the LED and the photodiode. Any electrical modulation signals can be transmitted to the LED with minimised 26 noise pickup. Furthermore, the same components can detect 27 the signal from the photodiode, which may be in the nA
28 range. These low level signals are similarly sensitive to 29 noise pickup effects and the location of the processing elements adjacent'to the detector reduces the effect-of 31 such noise pickup. There is a further advantage to 32 having the signal amplification and processing components 33 within a gas sensor housing, which is the shielding 1 afforded by the metalised housing. The apertures in the 2 housing may reduce such shielding, but the circuits 3 containing the components may be designed to balance with 4 any antenna affect of the housing in order to achieve a zero biased system.
7 With reference to figure 4, a perspective view of the 8 second embodiment of a gas sensor is shown. Two gas 9 filters 13, 14 are shown with the very narrow printed circuit board (PCB) 4 being located in the middle of 11 them. As an alternative to the signal processing and-12 temperature control components 15 being located on the 13 emitter/collector PCB as discussed above, they are'placed 14 on a second PCB 16. Having the preamplifier thus separated from the'LED/photodiode pair has been enabled 16 by the use of a centre:tap connection in the centre of an 17 array of discrete photodiode elements that make up the 18 radiation detect"or'connected along with the other two-LED
19 terminations by pins 17 to either:
a) two independent- t-ransimpedance amplifiers and the 21 outputs differentially amplified to combine the signals 22 and cancel out any common noise; or.
23 b) a differential transimpedance ainplifier.
A tubular external housing (not shown) may be placed 26 around the assembly, which forms a Faraday cage between 27 the metalised reflector, the external tube and a 28 shielding layer built into the second PCB, so improving 29 the electrical isolation of the components, as well as being a structural support.
31 _ 32 Figure 5 shows a cross section of half of"the internal 33 surface 6 of the dome in another embodiment of the 1 present invention. The dome has an internal surface 2 comprising a plurality of sub surfaces 51 to 59, shown in 3 section as arcs, each defined by a radius R9.3711 to 4 R9.0104 respectively and a centre point 60, each sub surface being tangent to an adjacent sub surface and 6 having a different radius and different centre location 7 from the adjacent subsurface. The offsets of the centre 8 points 61, 62 from the perpendicular datum lines 63"and 9 64 respectively a.re also shown. The emitter and detector lie on the datum line 64. The surface is defined by the 11 arcs labelled 51 to 59 (and their reflection about datum 12 line 63) being swept out by rotation by 180 degrees 13 around datum line 64. Another embodiment may have the arc 14 length tending to zero, thus giving a continuously varying curve from datum line 63 to datum line 64. -17 The internal sub.surfaces-czf this embodiment are semi-18 toroidal. The internal surface therefore does not form a 19 focused-reflector.
21 The dome functions to reflect, as near as possible, the 22 radiation-from the"emitter 2 through a single reflection 23 to the identical mirrored location on the detector 3, 24 irrespective of the.radiation exit angle from the emitter. This is illustrated by-Figures 6 and 7.
27 With reference to-Figure 6, light rays 65, 66 leaving the 28 centre 67 of-the emitter 2 are reflected by the inner 29 surface 6 as rays 68, 69 to the centre of the detector 70. Light rays 71, 72 leaving the outer side 73 of the 31 emitter 2 are reflected as rays 74, 75 to the outer side 32 of the detector 76.
1 With reference to Figure 7, as for Figure 6, light rays 2 65, 66 leaving the centre 67 of the emitter 2 are 3 reflected by the inner surface 6 as rays 68, 69 to the 4 centre of the detector 70. Light rays 77, 78 leaving the 5. inner side 79 of the emitter 2 are reflected as rays 80, 6 81 to the inner'side of the detector 82.
8 The emitter and detector are positioned on a common 9 mounting a small distance apart, typically 3mm centre to centre. The mutually tangent radii forming the swept 11 profile of the toroid are constructed such that the path 12 length,from emitter and detector is on average equal. The 13 number.of tangent radii used to construct the swept 14 profile of'the toroid determines the variation in path length for each ray angle between emitter and detector, 16 therefore the statement that the path length for each 17 specific radii is on'average equal refers to the average 18 path length of each radius, which generally occurs at the 19 radius mid point.. Therefore, apart from.one specific point in each radius, the path length varies continuously 21 across the face of each radius and therefore the face of 22 the toroidal swept curve, within the limits imposed by 23 the number of radii selected in the construction of the 24 swept curve. 25 26 This dome has the effect of transferring the image, of the 27 emitter to the detector, without a focus. The image may 28 be.concentrated towards the centre of the detector when 29. the components become out of alignment. This increases = 30 the manufacturing tolerance'of the assembly.
31 .
1 The surface is formed by silver coating an injection 2 moulded feature that forms.part of the sensor housing and 3 does not provide a mounting for the emitter and detector.
5 With reference to Figure 8, the emitter 2 and detector 3 6 are bonded to a bridge PCB (printed circuit board) 4 that 7 serves to provide electrical connectivity, thermal path, 8 and a mounting means that is adjustable on assembly to 9 optimise the location of the reflected radiation pool on 10 the detector. Other components are labelled as in 11 previous figures. A typical surface emitting LED may have 12 an emission surface that is 1 mm2 in area, and the 13 location of the bridge mounting the emitter and detector 14 is adjusted to provide as near as possible a pool of 15 radiation (nearly identical to that radiated) striking 16 the detector photodiode (as the non-focussed lighting 17 provides greater efficiency) that is the same size. If 18 the bridge PCB is wrongly adjusted in either direction, 19 at no time will the total"emitted radiation focus to a 20 single point. The adjustment is performed when the bridge.
21 PCB is raised or lowered in the direction shown 83 in 22 response to feedback, such as the detector received 23 signal strength. When the adjustment is optimum, the 24 location of the bridge 4 with respect to the dome 5 is locked, for example by gluing the PCB interconnect pins 26 into.the dome 5. Soldering may also be used, for example*
27 by soldering the pins to lock the pins in position in the 28 bridge PCB 4 or the base PCB 16. Other forms of providing 29, the adjustment to an optimum position may be used, for example the adjustment may move the bridge 4 with respect 31 to the pins 17 and the position may be locked by affixing 32 the bridge to the pins after adjustment. Soldering may 33 also be used for locking, for example by soldering the 1 pins in position in the bridge PCB 4 or the base PCB 16.
2 The bridge PCB stop 84 acts as a limit to the adjustment 3 during assembly and prevents the assembly falling apart 4 in case the locking means fails.during use.
6 There is no limitation to the range of angles that light 7 emitted from the LED can reflect within the housing with 8 the exception of the natural optical reflectivity of the 9 emitter and detector surfaces. Therefore typically radiation up to around 80 degree half angle may find its 11 way from the emitter to a similar location on the 12 detector.
14 In the case where multiple gases are to be detected with the single housing or multiple emitter or detector 16 elements are required, these are grouped as previously 17 described for the "sirigle-LED and photodiode except that 18 in the case where multiple frequency LEDs are required 19 these will be clustered in an area that is equal to or less than the area of the detector. In this configuration 21 radiation from the multiple emitters will strike the 22 detector in a similar corresponding location to that of 23 emission from the LED. In the case where multiple 24 detectors are required the same principle will apply.
Also for any combination of emitter and or detector 26 numbers the same principle will apply.
28 Further modifications and improvements may be made 29 without departing from the scope of the invention herein.
-described by the claims.
27 by soldering the pins to lock the pins in position in the 28 bridge PCB 4 or the base PCB 16. Other forms of providing 29, the adjustment to an optimum position may be used, for example the adjustment may move the bridge 4 with respect 31 to the pins 17 and the position may be locked by affixing 32 the bridge to the pins after adjustment. Soldering may 33 also be used for locking, for example by soldering the 1 pins in position in the bridge PCB 4 or the base PCB 16.
2 The bridge PCB stop 84 acts as a limit to the adjustment 3 during assembly and prevents the assembly falling apart 4 in case the locking means fails.during use.
6 There is no limitation to the range of angles that light 7 emitted from the LED can reflect within the housing with 8 the exception of the natural optical reflectivity of the 9 emitter and detector surfaces. Therefore typically radiation up to around 80 degree half angle may find its 11 way from the emitter to a similar location on the 12 detector.
14 In the case where multiple gases are to be detected with the single housing or multiple emitter or detector 16 elements are required, these are grouped as previously 17 described for the "sirigle-LED and photodiode except that 18 in the case where multiple frequency LEDs are required 19 these will be clustered in an area that is equal to or less than the area of the detector. In this configuration 21 radiation from the multiple emitters will strike the 22 detector in a similar corresponding location to that of 23 emission from the LED. In the case where multiple 24 detectors are required the same principle will apply.
Also for any combination of emitter and or detector 26 numbers the same principle will apply.
28 Further modifications and improvements may be made 29 without departing from the scope of the invention herein.
-described by the claims.
Claims (20)
1. A gas sensor comprising:
a radiation source;
a radiation detector; and a reflecting means arranged to reflect radiation from the radiation source to the radiation detector along an optical path, wherein the radiation source and the radiation detector are disposed side by side and the reflecting means is arranged to reflect radiation divergent from the radiation source and to concentrate the reflected radiation onto the radiation detector, and wherein the reflecting means comprises a surface comprising a plurality of sub surfaces, each defined by an arc with a radius and a centre point, the arcs being swept out around an axis, and each sub surface having a different radius and different centre point from an adjacent sub surface, and wherein each sub surface is tangent to the adjacent sub surface.
a radiation source;
a radiation detector; and a reflecting means arranged to reflect radiation from the radiation source to the radiation detector along an optical path, wherein the radiation source and the radiation detector are disposed side by side and the reflecting means is arranged to reflect radiation divergent from the radiation source and to concentrate the reflected radiation onto the radiation detector, and wherein the reflecting means comprises a surface comprising a plurality of sub surfaces, each defined by an arc with a radius and a centre point, the arcs being swept out around an axis, and each sub surface having a different radius and different centre point from an adjacent sub surface, and wherein each sub surface is tangent to the adjacent sub surface.
2. The gas sensor of claim 1 wherein the axis is in line with the radiation source and the radiation detector.
3. The gas sensor of claim 1 or claim 2 wherein the arc length tends to zero.
4. The gas sensor of any one of claims 1 to 3 wherein the sub surfaces are semi-toroidal.
5. The gas sensor of any one of claims 1 to 4 wherein the surface is configured to reflect radiation from the radiation source to a corresponding location on the radiation detector, irrespective of the radiation exit angle from the radiation source.
6. The gas sensor of any one of claims 1 to 5 wherein the surface is configured to reflect radiation leaving the centre of the radiation source to the centre of the radiation detector, radiation leaving the outer side of the radiation source to the outer side of the radiation detector, and radiation leaving the inner side of the radiation source to the inner side of the radiation detector.
7. The gas sensor of any one of claims 1 to 6 wherein the surface is configured to reflect radiation such that the length of the optical path is on average equal for each sub surface.
8. The gas sensor of any one of claims 1 to 7 wherein the reflecting means comprises a reflective surface of a housing.
9. The gas sensor of claim 8 wherein the housing has at least one aperture for permitting the transport of gas in and out of the gas sensor.
10. The gas sensor of any one of claims 1 to 9 wherein the radiation source and radiation detector are mounted on a common substrate configured to locate the radiation source and radiation detector in relation to the housing.
11. The gas sensor of claim 10 wherein the substrate is configured as an elongate member extending along a diameter of the housing.
12. The gas sensor of any one of claims 1 to 11 wherein the elongate member is adjustable so as to optimise the location of a reflected radiation pool on the radiation detector.
13. The gas sensor of claim 12 wherein the elongate member is adjustable by sliding of pins.
14. The gas sensor of claim 13 wherein the pins are electrical leads.
15. The gas sensor of any one of claims 13 to 14 wherein the adjustable elongate member is lockable with respect to the reflecting means.
16. The gas sensor of claim 15 wherein the adjustable elongate member is lockable by gluing the pins to the reflecting means.
17. The gas sensor of claim 15 wherein the adjustable elongate member is lockable by soldering the pins.
18. The gas sensor of any one of claims 1 to 17 wherein the reflecting means is arranged such that the optical path is defined at least in part by a cavity extending around the radiation source and radiation detector.
19. The gas sensor of claim 18 wherein the cavity is bounded by a plane parallel to surfaces of the radiation source and the radiation detector.
20. The gas sensor of any one of claims 1 to 19 wherein the surface is configured such that radiation originating from a point on the radiation source is unfocussed as it is incident on the radiation detector.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0602320.4 | 2006-02-06 | ||
| GBGB0602320.4A GB0602320D0 (en) | 2006-02-06 | 2006-02-06 | Domed gas sensor |
| PCT/GB2007/000401 WO2007091043A1 (en) | 2006-02-06 | 2007-02-06 | Dome gas sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2677450A1 CA2677450A1 (en) | 2007-08-16 |
| CA2677450C true CA2677450C (en) | 2014-10-07 |
Family
ID=36101101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2677450A Active CA2677450C (en) | 2006-02-06 | 2007-02-06 | Dome gas sensor |
Country Status (15)
| Country | Link |
|---|---|
| US (1) | US20090235720A1 (en) |
| EP (1) | EP1987346B1 (en) |
| JP (1) | JP5543113B2 (en) |
| KR (1) | KR101339076B1 (en) |
| CN (1) | CN101449143B (en) |
| AT (1) | ATE477482T1 (en) |
| AU (1) | AU2007213575B2 (en) |
| CA (1) | CA2677450C (en) |
| DE (1) | DE602007008368D1 (en) |
| DK (1) | DK1987346T3 (en) |
| GB (1) | GB0602320D0 (en) |
| HK (1) | HK1126552A1 (en) |
| NZ (1) | NZ571080A (en) |
| PT (1) | PT1987346E (en) |
| WO (1) | WO2007091043A1 (en) |
Families Citing this family (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102009036114B3 (en) * | 2009-08-05 | 2010-09-02 | Dräger Safety AG & Co. KGaA | Infrared-optical gas measurement device for use in warning- and alarm system for monitoring concentration of e.g. explosive gas in industry, has split washers or perforated disks arranged in region of gas inlet opening |
| GB2475277B (en) * | 2009-11-12 | 2014-05-21 | Bah Holdings Llc | Optical absorption gas analyser |
| GB201000756D0 (en) | 2010-01-18 | 2010-03-03 | Gas Sensing Solutions Ltd | Gas sensor with radiation guide |
| DE102010015899B4 (en) * | 2010-02-04 | 2022-07-28 | Erbe Elektromedizin Gmbh | Electrosurgical assembly and electrosurgical instrument |
| US8692997B2 (en) | 2010-08-25 | 2014-04-08 | Bah Holdings Llc | Optical gas and/or particulate sensors |
| US8003945B1 (en) * | 2010-08-25 | 2011-08-23 | Jacob Y Wong | Intrinsically safe NDIR gas sensor in a can |
| GB201018417D0 (en) | 2010-11-01 | 2010-12-15 | Gas Sensing Solutions Ltd | Apparatus and method for generating light pulses from LEDs in optical absorption gas sensors |
| GB201018418D0 (en) | 2010-11-01 | 2010-12-15 | Gas Sensing Solutions Ltd | Temperature calibration methods and apparatus for optical absorption gas sensors, and optical absorption gas sensors thereby calibrated |
| CN102279167A (en) * | 2011-07-15 | 2011-12-14 | 中北大学 | Miniature infrared gas sensor |
| DE102012007016B3 (en) | 2012-04-05 | 2013-10-10 | Dräger Safety AG & Co. KGaA | Optical gas sensor |
| JP6347051B2 (en) * | 2013-03-04 | 2018-06-27 | パナソニックＩｐマネジメント株式会社 | device |
| ITMI20130478A1 (en) * | 2013-03-29 | 2014-09-30 | N E T Srl | OPTICAL GAS DETECTOR WITH VARIABLE GEOMETRY |
| WO2015104133A1 (en) * | 2014-01-07 | 2015-07-16 | Koninklijke Philips N.V. | A gas sensor by light absorption |
| EP2960642A1 (en) | 2014-06-26 | 2015-12-30 | Schneider Electric Industries SAS | Optical chamber for a gas detection device |
| DE102014016515B4 (en) * | 2014-11-10 | 2021-04-29 | Dräger Safety AG & Co. KGaA | Optical gas sensor |
| KR20160105062A (en) | 2015-02-27 | 2016-09-06 | 김영웅 | Gas sense module |
| DE102015212870A1 (en) * | 2015-07-09 | 2017-01-12 | Robert Bosch Gmbh | Sensor device for measuring a fluid concentration and use of the sensor device |
| DE102015011810B4 (en) | 2015-09-17 | 2018-03-15 | Dräger Safety AG & Co. KGaA | Sample gas cuvette for an optical gas sensor and optical gas sensor |
| US20170184492A1 (en) * | 2015-12-27 | 2017-06-29 | Comdek Industrial Corporation | Gas analyzer system |
| DE102016010088A1 (en) | 2016-08-23 | 2018-03-01 | Dräger Safety AG & Co. KGaA | Measuring device for absorption measurement of gases |
| DE102016012970A1 (en) * | 2016-10-28 | 2018-05-03 | Drägerwerk AG & Co. KGaA | Device for determining the concentration of at least one gas component in a breathing gas mixture |
| DE102016012971B4 (en) * | 2016-10-28 | 2023-02-09 | Drägerwerk AG & Co. KGaA | Device for determining the concentration of at least one gas component in a breathing gas mixture |
| KR102556009B1 (en) * | 2016-11-15 | 2023-07-18 | 삼성전자주식회사 | Filler structure and the electric device including the same |
| CN106841112A (en) * | 2016-12-19 | 2017-06-13 | 天津同阳科技发展有限公司 | Telemetering motor vehicle tail equipment based on NDIR and diffusing reflection technology |
| EP3372988B1 (en) | 2017-03-10 | 2022-10-12 | Sensatronic GmbH | Method and device for measuring the concentration of a substance in a gaseous medium by means of absorption spectroscopy |
| WO2018222764A1 (en) | 2017-05-30 | 2018-12-06 | Analog Devices, Inc. | Compact optical gas detection system and apparatus |
| EP3454044A1 (en) * | 2017-09-07 | 2019-03-13 | Honeywell International Inc. | Planar reflective ring |
| US11073467B2 (en) * | 2018-09-28 | 2021-07-27 | Stmicroelectronics S.R.L. | Miniaturized optical particle detector |
| US11079321B2 (en) * | 2018-09-28 | 2021-08-03 | Stmicroelectronics S.R.L. | NDIR detector device for detecting gases having an infrared absorption spectrum |
| EP3693725B1 (en) * | 2019-02-11 | 2021-04-07 | Infineon Technologies AG | Photoacoustic sensor |
| US11796445B2 (en) | 2019-05-15 | 2023-10-24 | Analog Devices, Inc. | Optical improvements to compact smoke detectors, systems and apparatus |
| US11747272B2 (en) | 2019-06-10 | 2023-09-05 | Analog Devices, Inc. | Gas detection using differential path length measurement |
| US11152664B2 (en) * | 2019-12-24 | 2021-10-19 | Anexa Labs Llc | Compact electronics with optical sensors |
| SE543968C2 (en) * | 2020-02-27 | 2021-10-12 | Senseair Ab | Gas sensor with long absorption path length |
| US11474031B2 (en) * | 2020-03-16 | 2022-10-18 | Asahi Kasei Microdevices Corporation | Gas detection apparatus |
| US11821836B2 (en) | 2020-07-13 | 2023-11-21 | Analog Devices, Inc. | Fully compensated optical gas sensing system and apparatus |
| SE544494C2 (en) | 2020-10-21 | 2022-06-21 | Senseair Ab | Temperature controller for a temperature control mechanism |
| US11156965B1 (en) | 2020-10-23 | 2021-10-26 | Anexa Labs Llc | Latching mechanism for securing two objects |
| CN113340838B (en) * | 2021-06-10 | 2023-01-10 | 上海迈鸿传感器有限公司 | NDIR gas detection sensor optical path device |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07218427A (en) * | 1994-02-04 | 1995-08-18 | Chino Corp | Gas concentration measuring instrument |
| US5459566A (en) * | 1994-04-22 | 1995-10-17 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Multiple pass gas absorption cell utilizing a spherical mirror opposite one or more pair of obliquely disposed flat mirrors |
| DE4434814A1 (en) * | 1994-09-29 | 1996-04-04 | Microparts Gmbh | Infrared spectrometric sensor for gases |
| JPH08148407A (en) * | 1994-11-21 | 1996-06-07 | Nikon Corp | Illuminating optical apparatus |
| WO2000007411A1 (en) * | 1998-07-30 | 2000-02-10 | Ion Optics, Inc. | Infrared radiation sources, sensors and source combinations, and methods of manufacture |
| JPH09184803A (en) * | 1995-12-29 | 1997-07-15 | Horiba Ltd | Infrared gas analyzer |
| JPH10332585A (en) * | 1997-05-29 | 1998-12-18 | Horiba Ltd | Gas sensor |
| CN2303293Y (en) * | 1997-06-04 | 1999-01-06 | 侯蓝田 | Apparatus for analysing gas concentration |
| JP2000019108A (en) * | 1998-07-06 | 2000-01-21 | Horiba Ltd | Infrared gas analyzer |
| EP1196306B1 (en) * | 1998-10-12 | 2004-06-16 | Control Devices, Inc. | Ambient light sensor |
| DE10200797A1 (en) * | 2002-01-11 | 2003-07-24 | Gerhard Wiegleb | Infrared absorption gas sensor for determining concentration of infrared active gases in mixtures, comprises radiation source, detector and mirror |
| DE10200908A1 (en) * | 2002-01-12 | 2003-07-31 | Gerhard Wiegleb | Infrared gas sensor, used in environmental and process measuring technology, has an infrared detector onto which infrared radiation is deviated via an imaging lens as a parallel light bundle in the direction of its optical axis |
| GB0213326D0 (en) * | 2002-06-11 | 2002-07-24 | Edinburgh Instr | Gas sensors |
| US7034304B2 (en) * | 2003-07-25 | 2006-04-25 | Honeywell International, Inc. | Chamber for gas detector |
| DE10360215A1 (en) * | 2003-12-20 | 2005-07-28 | Robert Bosch Gmbh | gas sensor |
| JP2006275980A (en) * | 2005-03-30 | 2006-10-12 | Denso Corp | Infrared-type gas detector |
| US10194805B2 (en) * | 2011-02-05 | 2019-02-05 | Triple Ring Technologies, Inc. | Intrinsic and swept-source raman spectroscopy |
-
2006
- 2006-02-06 GB GBGB0602320.4A patent/GB0602320D0/en not_active Ceased
-
2007
- 2007-02-06 PT PT07705132T patent/PT1987346E/en unknown
- 2007-02-06 NZ NZ571080A patent/NZ571080A/en not_active IP Right Cessation
- 2007-02-06 AU AU2007213575A patent/AU2007213575B2/en not_active Ceased
- 2007-02-06 JP JP2008553822A patent/JP5543113B2/en not_active Expired - Fee Related
- 2007-02-06 AT AT07705132T patent/ATE477482T1/en active
- 2007-02-06 US US12/223,572 patent/US20090235720A1/en not_active Abandoned
- 2007-02-06 CN CN200780004661XA patent/CN101449143B/en not_active Expired - Fee Related
- 2007-02-06 DK DK07705132.4T patent/DK1987346T3/en active
- 2007-02-06 CA CA2677450A patent/CA2677450C/en active Active
- 2007-02-06 KR KR1020087021848A patent/KR101339076B1/en active IP Right Grant
- 2007-02-06 WO PCT/GB2007/000401 patent/WO2007091043A1/en active Application Filing
- 2007-02-06 DE DE602007008368T patent/DE602007008368D1/en active Active
- 2007-02-06 EP EP07705132A patent/EP1987346B1/en not_active Not-in-force
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2009
- 2009-05-05 HK HK09104152.7A patent/HK1126552A1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| EP1987346A1 (en) | 2008-11-05 |
| JP2009526217A (en) | 2009-07-16 |
| ATE477482T1 (en) | 2010-08-15 |
| JP5543113B2 (en) | 2014-07-09 |
| DK1987346T3 (en) | 2010-12-06 |
| KR101339076B1 (en) | 2014-01-10 |
| GB0602320D0 (en) | 2006-03-15 |
| CN101449143B (en) | 2011-07-13 |
| HK1126552A1 (en) | 2009-09-04 |
| NZ571080A (en) | 2011-07-29 |
| CA2677450A1 (en) | 2007-08-16 |
| AU2007213575B2 (en) | 2012-06-07 |
| DE602007008368D1 (en) | 2010-09-23 |
| AU2007213575A1 (en) | 2007-08-16 |
| CN101449143A (en) | 2009-06-03 |
| US20090235720A1 (en) | 2009-09-24 |
| KR20090004869A (en) | 2009-01-12 |
| WO2007091043A1 (en) | 2007-08-16 |
| EP1987346B1 (en) | 2010-08-11 |
| PT1987346E (en) | 2010-11-17 |
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