CA976664A - Square cylindrical packaged semiconductor device - Google Patents
Square cylindrical packaged semiconductor deviceInfo
- Publication number
- CA976664A CA976664A CA155,194A CA155194A CA976664A CA 976664 A CA976664 A CA 976664A CA 155194 A CA155194 A CA 155194A CA 976664 A CA976664 A CA 976664A
- Authority
- CA
- Canada
- Prior art keywords
- semiconductor device
- packaged semiconductor
- square cylindrical
- cylindrical packaged
- square
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
- H01L23/49844—Geometry or layout for devices being provided for in H01L29/00
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
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- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/01005—Boron [B]
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- H01L2924/01006—Carbon [C]
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- H01L2924/01014—Silicon [Si]
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- H01L2924/01033—Arsenic [As]
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- H01L2924/01074—Tungsten [W]
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- H01L2924/01079—Gold [Au]
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- H01L2924/01082—Lead [Pb]
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- H01L2924/014—Solder alloys
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- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
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- H01L2924/30—Technical effects
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- H01L2924/351—Thermal stress
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8596771A JPS559825B2 (en) | 1971-10-30 | 1971-10-30 | |
US29985572A | 1972-10-24 | 1972-10-24 | |
US00404730A US3857168A (en) | 1971-10-30 | 1973-10-09 | Square cylindrical packaged semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
CA976664A true CA976664A (en) | 1975-10-21 |
Family
ID=27305009
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA155,194A Expired CA976664A (en) | 1971-10-30 | 1972-10-30 | Square cylindrical packaged semiconductor device |
Country Status (4)
Country | Link |
---|---|
US (2) | US3801881A (en) |
CA (1) | CA976664A (en) |
DE (1) | DE2252833A1 (en) |
FR (1) | FR2158332B1 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3864810A (en) * | 1972-09-27 | 1975-02-11 | Minnesota Mining & Mfg | Process and composite leadless chip carriers with external connections |
US3916434A (en) * | 1972-11-30 | 1975-10-28 | Power Hybrids Inc | Hermetically sealed encapsulation of semiconductor devices |
US3898594A (en) * | 1973-11-02 | 1975-08-05 | Trw Inc | Microwave semiconductor device package |
JPS55120152A (en) * | 1979-03-09 | 1980-09-16 | Fujitsu Ltd | Semiconductor device |
JPS5615059U (en) * | 1979-07-11 | 1981-02-09 | ||
JPS5875859A (en) * | 1981-10-30 | 1983-05-07 | Fujitsu Ltd | Semiconductor device |
JPS6376444A (en) * | 1986-09-19 | 1988-04-06 | Nec Corp | Chip carrier |
US5122621A (en) * | 1990-05-07 | 1992-06-16 | Synergy Microwave Corporation | Universal surface mount package |
US5160810A (en) * | 1990-05-07 | 1992-11-03 | Synergy Microwave Corporation | Universal surface mount package |
JP3166251B2 (en) * | 1991-12-18 | 2001-05-14 | 株式会社村田製作所 | Manufacturing method of ceramic multilayer electronic component |
US6200407B1 (en) * | 1994-08-18 | 2001-03-13 | Rockwell Technologies, Llc | Method of making a multilayer circuit board having a window exposing an enhanced conductive layer for use as an insulated mounting area |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB939966A (en) * | 1960-12-21 | 1963-10-16 | Gen Electric Co Ltd | Improvements in or relating to glass-to-metal seals |
GB1015909A (en) * | 1963-12-30 | 1966-01-05 | Gen Micro Electronics Inc | Method of and product for packaging electronic devices |
US3340602A (en) * | 1965-02-01 | 1967-09-12 | Philco Ford Corp | Process for sealing |
US3404215A (en) * | 1966-04-14 | 1968-10-01 | Sprague Electric Co | Hermetically sealed electronic module |
US3405224A (en) * | 1966-04-20 | 1968-10-08 | Nippon Electric Co | Sealed enclosure for electronic device |
US3560180A (en) * | 1968-05-15 | 1971-02-02 | Philco Ford Corp | Glass metal sealing technique |
BE755950A (en) * | 1969-09-11 | 1971-03-09 | Philips Nv | PROCESS FOR ESTABLISHING ELECTRICAL LINKS BETWEEN CONTACT LOCATIONS OF A SEMICONDUCTOR BODY AND SUPPLY CONDUCTORS |
US3715635A (en) * | 1971-06-25 | 1973-02-06 | Bendix Corp | High frequency matched impedance microcircuit holder |
US3706841A (en) * | 1971-09-17 | 1972-12-19 | Joseph F Novak | Method and apparatus for converting monochrome pictures to multi-color pictures electronically |
-
1972
- 1972-10-24 US US00299855A patent/US3801881A/en not_active Expired - Lifetime
- 1972-10-27 DE DE2252833A patent/DE2252833A1/en active Pending
- 1972-10-27 FR FR7238317A patent/FR2158332B1/fr not_active Expired
- 1972-10-30 CA CA155,194A patent/CA976664A/en not_active Expired
-
1973
- 1973-10-09 US US00404730A patent/US3857168A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
FR2158332B1 (en) | 1978-09-29 |
FR2158332A1 (en) | 1973-06-15 |
US3801881A (en) | 1974-04-02 |
US3857168A (en) | 1974-12-31 |
DE2252833A1 (en) | 1973-05-24 |
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