CN100386654C - Microstructure and method for producing microstructures - Google Patents
Microstructure and method for producing microstructures Download PDFInfo
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- CN100386654C CN100386654C CNB2004800135588A CN200480013558A CN100386654C CN 100386654 C CN100386654 C CN 100386654C CN B2004800135588 A CNB2004800135588 A CN B2004800135588A CN 200480013558 A CN200480013558 A CN 200480013558A CN 100386654 C CN100386654 C CN 100386654C
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/18—Diffraction gratings
- G02B5/1847—Manufacturing methods
- G02B5/1857—Manufacturing methods using exposure or etching means, e.g. holography, photolithography, exposure to electron or ion beams
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/30—Identification or security features, e.g. for preventing forgery
- B42D25/328—Diffraction gratings; Holograms
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/18—Diffraction gratings
- G02B5/1814—Diffraction gratings structurally combined with one or more further optical elements, e.g. lenses, mirrors, prisms or other diffraction gratings
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/18—Diffraction gratings
- G02B5/1847—Manufacturing methods
- G02B5/1852—Manufacturing methods using mechanical means, e.g. ruling with diamond tool, moulding
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/18—Diffraction gratings
- G02B5/1861—Reflection gratings characterised by their structure, e.g. step profile, contours of substrate or grooves, pitch variations, materials
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/08—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds or more than one marking of the same kind in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means
- G06K19/10—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds or more than one marking of the same kind in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means at least one kind of marking being used for authentication, e.g. of credit or identity cards
- G06K19/16—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds or more than one marking of the same kind in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means at least one kind of marking being used for authentication, e.g. of credit or identity cards the marking being a hologram or diffraction grating
Abstract
Microstructure is formed by overlapping a first relief structure with a second structure. The first relief structure is a structure mechanically formed in a layer (2) and the second relief structure is a diffraction structure (12) having recesses which are photochemically produced on the surface of the first relief structure. An independent claim is also included for a process for producing a light-diffracting microstructures (13).
Description
The present invention relates to microstructure and be applicable to the technology that microstructure produces, this microstructure is to adopt at least one second raised lines structure is overlapped a method on the raised lines structure to make.
The optical diffraction microstructure has a large amount of pits, and these pits generally all adopt the form of parallel groove, and for example, these pits form the grating with micro-meticulous raised lines structure.Be incident on mode diffraction or scattering that the light on the microstructure can microstructure be scheduled to.The mosaic pattern of formation microstructure can adopt such as plastic material or metal forming and have the actual performance of practical product.These actual performances show tangible optics behavior and are difficult to imitation.
Be applicable to that some technology that this class microstructure produces is known.So plant equipment can produce microstructure by the many parallel grooves of delineation on the surface of substrate.The shape of delineation instrument has been determined the profile of raised lines structure.Along with the increase of every millimeter line number, it is more and more expensive that the operation of delineation raised lines structure just progressively becomes more and more difficult and expense also correspondingly becomes.Holograph technology is cheap, and it can adopt two coherent light beams from LASER Light Source to form interference on the photosensitive layer of photoresist.According to the local luminance of light intensity, have bright and interference figure dark fringe and just can expose on photoresist, after development, the surface of photoresist just has the raised lines structure of symmetric profile.In other technology, electron beam is depicted the raised lines structure of a rule groove in photoresist layer, and in this case, groove also can form crooked lines.Shape according to the microstructure mother matrix that these technology produced all is to electroplate the metal pattern belling mould that duplicates and have the production of duplicating, use these punch can metal or plastic material produce the shape of microstructure.Yet, adopt these technology, the equipment cost that is used for the microstructure generation all is very expensive.
Can recognize also that from EP-A 0 105 099 new microstructure is applicable to that also mosaic mode synthesizes, in this case, just have the different raised lines structure of many groups, these raised lines structures can produce in a plurality of orientation in a predetermined manner, and machinery is formed on each surface element of mosaic component.
US No 5 138 604 has disclosed a kind of recording-member, its first micro-raised lines structure and the second diffraction structure overlaid.First raised lines structure can be by means of registering by the zero diopter of mask in unexposed photoresist layer.The photoresist layer that is exposed exposes subsequently once more, and in this case, the conoscope image of hologram just acts on the photoresist layer.After photoresist layer develops, remain on the substrate of photoresist layer corresponding to first raised lines structure of mask arrangement, the back side of first raised lines structure has the diffraction structure of hologram.
WO 00/61386 has discussed the generation of decorating film.Microstructure can be formed on the surface of film by means of the mold pressing punch.If, not level and smooth convex mould surface, just can use to have this class convex mould surface that micro-fine structure provides, so that shaping operation, the microstructure that is formed in the film can have micro-fine structure.
A kind of method, this diffraction structure and additional structure overlaid that uses diffraction structure to produce has been discussed in JP 2,000 264000.This method is used the variation of resin length, and this resin can adopt radiation to harden, as long as it can generate heat in the cure process process soon.Diffraction burr layer at first is formed in the semi-harden layer of resin, and the reflection horizon can be coated in the surface that burr is out of shape.Because the heating of resin, variation in the longitudinal direction cause other distortion on surface in the wrinkle mode.These wrinkles also can be superimposed upon on the burr.The further sclerosis of resin is fixed on overlapping wrinkled surface with burr.
US No 4 537 504 has disclosed a kind of diffraction structure, and this structure formation is on corrugated surface, and the cycle of the ripple period ratio diffraction structure on surface is much bigger.
US No 6 043 936 has disclosed and has been applicable to the PYR two kinds of casing processs of shaping order of diffraction type.First method is discussed above, the method that simple machinery is removed, and second method uses the anisotropic lithographic method in silicon to produce PYR shape.Subsequently, the coating of photoresist is accepted on level and smooth pyramid surface.And under the effect of electron beam, photoresist layer is exposed, like this, after photoresist layer developed, PYR surface will have a grade type.The PYR shaping of diffraction polar form is to adopt plating mode to produce, and can be used for the production of punch mould.
The body matter of WO 03/084764 is paid close attention to safety element, and this element is difficult to duplicate, and is enclosed in the compound of layer.The diffraction structure of safety element is have macroscopical overlapping function additional overlapping, compare with diffraction structure in this respect, overlapping changes of function slow.
The objective of the invention is to propose a kind of inexpensive process that is applicable to that microstructure produces, wherein the raised lines structure of microstructure produces by at least two raised lines structure overlaids, therefore just can produce easily such as the microstructure of duplicating mother matrix, and have high precision and complexity and be difficult to imitated.
According to the present invention, concrete purpose is that the performance that proposes by claim 1 obtains, and is based on and adopts the combination of mechanical molding's technology of photosensitive structure so that produce the thought of cheap but complicated microstructure mold pressing or other.In follow-up claim, will further set forth favourable structure of the present invention.
Go through and illustrate embodiments of the invention below with reference to accompanying drawing, accompanying drawing comprises:
Fig. 1 has shown the substrate with photoresist layer;
Fig. 2 has shown the convex mould surface of photoresist layer;
Fig. 3 has shown the wrinkle structure;
Fig. 4 has shown the operation of resist exposure;
Fig. 5 has shown the profile of dimpling line; And,
Fig. 6 has shown the mold pressing punch with burr punch die.
With reference to figure 1, Fig. 1 has shown the first step that is applicable to that optical diffraction structures produces in the mode of sectional view.Photoresist layer 2 is coated on the flat substrate 1 of metal, glass, pottery or plastic material.Layer 2 thickness is in the scope between 0.1 μ m and 100 μ m, and depends on the degree of depth of the diffraction structure that will produce.Photosensitivity photoresist material all is well-known, and for example, the product code numbering of being produced by Shipley is Microposit S 1813.The photoresist material can adopt the mode of liquid to be coated on the substrate 1, and is cured under the condition of heating.In preferable change example, be installed in burr punch die 4 on the mold pressing punch 3 and press downward to the smooth blank surface of layer 2 and compress, make the shape that in the blank surface of layer 2, produces burr punch die 4.
As shown in Figure 2, after mold pressing punch 3 (see figure 1)s were lifted, layer 2 just had raised lines structure 5 in the scope of mold pressing punch, and these structures are opposite with burr punch die 4 (see figure 1)s.In the process of mold pressing, substrate 1 can not be out of shape or be loosening, makes burr punch die 4 raised lines structure 5 can be transferred on the layer 2 with the maximum verisimilitude of shape.
The restriction that the implication of term " raised lines structure " 5 is not strict, the Fig. 1 in the accompanying drawing shows the profile of burr punch die 4, this shape is the shape that will form in substrate, has shown the periodically symmetrical sawtooth profile of grating by this example.Particularly, also can adopt a kind of in other well-known profile, for example, asymmetrical sawtooth profile, the sinusoidal profile, PYR regularly arranged of rectangular profile, sine or class, and forming the striated pattern in cycle or other shape of crossed grating, these shapes all are applicable to raised lines structure 5.The spatial frequency of raised lines structure 5 may be selected in from 1 row/mm in the wide region about 1000 row/mm.Periodically the constructional depth T of the raised lines structure of grating is normally in the scope between 0.1 μ m and 100 μ m, at this on the one hand, for technical reason, generally all has low numerical value with respect to spatial frequency than the raised lines structure 5 of macrostructure degree of depth T (see figure 1).
In another change example of technology, form the isotropy of raised lines structure and the surface that anisotropic wrinkle structure can be formed on layer 2.The wrinkle structure comprises micro-meticulous raised lines structure element, and this element determined the ability of scattering and can only adopt statistical parameter to discuss, for example, and mean roughness numerical value R
a, persistence length I
cAnd other or the like, relevant mean roughness numerical value R
aNumerical value normally in the scope between 20nm and 2500nm, preferable numerical value is in the scope between 50nm and 500nm.At least be in one direction, persistence length I
cBe the numerical value in the scope between 200nm and 50000nm, preferably in 1000nm and 10, between the 000nm.The micro-meticulous raised lines structure element of isotropy wrinkle structure does not have the preferred direction on the orientation, for this reason, on all azimuth directions, greater than can evenly distributing by the space angle that the ability of wrinkle structural scattering body is scheduled to such as scattered light by the brightness of visual experience ability institute preset limit numerical value.Wrinkle structure compared with the wrinkle structure strong scattering of weak scattering can be distributed in scattered light bigger space angle.
If opposite, the element of micro-meticulous raised lines structure has preferable direction on the orientation, and then wrinkle structural scattering body is with the anisotropy incident light.The space angle of being scheduled to by the scatterer ability of wrinkle structure is a plurality of stepped serrations shape, and this long axis of ellipse is perpendicular to the preferred direction of raised lines structure element.The light of institute's incident of opposite wrinkle structural scattering body with diffraction structure in fact with its Wavelength-independent, that is to say that the color of the light of institute's scattering corresponds essentially to the color of the light that is incident on the wrinkle structure.
Fig. 3 has shown its cross section as an example by a kind of wrinkle structure, and the shape of this wrinkle structure is created in the layer 2, as raised lines structure 5.Replace the constructional depth T (see figure 1) of grating, the profile of wrinkle structure has mean roughness numerical value R
aThe meticulous raised lines structure element of wrinkle structure presents maximum difference at this short transverse H, can be up to mean roughness numerical value R
aAbout ten times.Therefore, the maximum difference of wrinkle structure on the height H direction is corresponding to the constructional depth that is applicable to periodic optical grating.The wrinkle structure is in the values of disparity on the short transverse H all is above-mentioned scope at constructional depth T.Below will set forth the details of constructional depth T, it can be used to have the raised lines structure 5 that the raised lines structure 5 of grating periodically also can be used to have the wrinkle structure.
With reference now to Fig. 4, holograph technology is discussed, holograph technology nationality helps the additional overlapping diffraction grating of photosensitive structure (not showing) of raised lines structure 5 in Fig. 4.LASER Light Source 7 produces for example coherent light beam 6 of 400nm wavelength.Light beam 6 impinges upon on the beam splitter 8.Beam splitter 8 is with the direction deflector light beam 6 of raised lines structure 5, as divided beams 9.Deflection does not form reference beam 10 by the remainder light beam of beam splitter 8.Deflection mirror 11 also points to raised lines structure 5 with reference beam 10.Divided beams 9 and reference beam 10 all the fan-out mode that adopts parallel beam illuminate whole raised lines structure 5 with light beam 9 and 10 separately.The direction of divided beams 9 is different from the direction of reference beam 10, makes divided beams 9 and reference beam 10 to intersect with predetermined intersecting angle in the zone of body structure surface.Because the coherence of light wave of two light beams 9 and 10 and difference of wavelength, divided beams 9 and reference beam 10 form mutually interferes, and so just produces interference figure on raised lines structure 5.This interference figure comprises the parallel striped of the high brightness light intensity of being separated by the striped of low-light level light intensity, and wherein the striped of conoscope image intersects vertically on raised lines structure 5 by divided beams 9 and reference beam 10 defined planar obit simulations.Every millimeter fringe number is to be determined by the crossing angles that light beam 6,9 and 10 optical wavelength that produced and divided beams 9 and reference beam 10 intersect.
Because substrate 1 is around normal 15 rotation of base plan, so before exposing operation, substrate 1 and raised lines structure 5 thereof are according to the orientation of conoscope image and predetermined location reference is set.
The material of above-mentioned photoresist is to change by a striped according to the involved high brightness light intensity of conoscope image in the exposure process, so just can after exposure, under the effect of developer solution, dissolve the material of photoresist, for example, Shipley Mikroposit 351.In this case, will the form with the parallel groove of diffraction grating produce pit on the surface of photoresist, wherein, the cycle of grating equals the fringe spacing in conoscope image.When the crossing angles that intersect at divided beams 9 and reference beam 10 changed, the cycle of grating also can be adjusted in the scope that intersects angle.Light beam 6 be predetermined by LASER Light Source institute, and must be applicable to the exposure of the photoresist of layer 2.
Therefore, time shutter, development time and light intensity have been determined the profile of groove and the degree of depth of geometric shape.The degree of depth of groove can reach the predetermined value of maximum 500nm, preferably is maximum 250nm.Profile be the symmetry and can extend to rectangular profile from simple sinusoidal profile.The position of groove can be determined by the striped of conoscope image.Therefore, the groove of the grid stroke of striated structure 5 and diffraction structure is being different aspect set orientation, numerical value ground, preset bearing.
Fig. 5 is presented at the surface of the photosensitive structure formation layer 2 afterwards of raised lines structure 5 (see figure 4)s.Surface at layer 2 has produced microstructure 12, and these microstructures are that wherein, in this example, the grid stroke of raised lines structure 5 all is in identical orientation with the groove of diffraction structure 13 by additional overlapping generation of the diffraction structure that adopts holograph to produce.In Fig. 5, adopt dotted line 14 to represent original raised lines structure 5.In the operation of developing, removed between dotted line 14 and microstructure 12 the photoresist of original existence.
After the photoresist oven dry, can adopt the shape of nickel electro-chemistry formation microstructure 12 in a well-known manner, so just produced the mother matrix of microstructure 12.The mother matrix of reflection confirms that through check and correction whether the optical property of template is corresponding to desired performance.Subsequently, this mother matrix can be used for producing duplicate, adopts the part duplicate that comes from mother matrix combined with plastics and metal with other diffraction structure, mirror surface or the like, so that the similar inserted figure that is applicable to the optical security element is provided.
The advantage that this generation technology is had is to guarantee that substantially (and it is better to work as other technology of use) microstructure 12 can obtain real stack and will make up the structure of raised lines structure 5 and diffraction structure, and keeps the physical dimension of raised lines structure 5 and diffraction structure substantially.
At this on the one hand, also might make up the structure that a great difference is arranged on the size.For example, the constructional depth T of raised lines structure 5 can and can be a kind of wrinkle structure or or even a kind of grating or a kind of microprism of penetrating device that returns greater than 2 μ m.Raised lines structure 5 and diffraction structure overlaid with low numerical value of grating cycle.
In being applicable to first kind of technology that microstructure 12 produces, a kind of above-mentioned periodic grating can adopt the mode of the raised lines structure 5 of diffraction structure photosensitive structure to be formed in the layer 2.In specific embodiment, the spatial frequency of diffraction structure is higher five times than the spatial frequency of raised lines structure 5 at least.
In being applicable to second kind of technology that microstructure 12 produces, a kind of above-mentioned periodic grating can be formed in the layer 2 of diffraction structure institute photosensitive structure.The grating cycle of diffraction structure is at most 500nm, so light can only reflex in the zero diffraction magnitude.The advantage that this microstructure 12 is had is the scattering power that it has made up the wrinkle structure with diffraction grating performance, for example, and wavelength selective reflectivity, polarization capacity or the like.
Be applicable to that the technology photosensitive structure realization formerly that microstructure 12 produces can first kind of mode enlarge afterwards, and the crossing angle that divided beams 9 (see figure 4)s and reference beam 10 (see figure 4)s intersect changes, and other photosensitive structure can adopt conoscope image to implement, compare with previous photosensitive structure, every millimeter fringe number of the striated pattern of conoscope image is all variable.The expansion of technology can be adopted the difference of relevant striated pattern spatial frequency that single enforcement is set or adopt different spatial frequencys to repeat repeatedly until reaching predetermined microstructure 12.
Can the second way enlarge after being applicable to technology that microstructure 12 produces formerly photosensitive structure being realized, and the operation of other photosensitive structure can be with respect to by divided beams 9 (see figure 4)s and the formed conoscope image of reference beam 10 (see figure 4)s and with the different azimuth orientation of substrate effectively.The operation of above-mentioned photosensitive structure can be adopted the difference of relevant orientation that single enforcement is set or adopt different orientation to repeat repeatedly until reaching predetermined microstructure 12.
Be applicable to technology that microstructure 12 produces formerly photosensitive structure can the third mode change after implementing, and the spatial frequency of striated pattern and orientation the two all change, and then carry out the operation of other photosensitive structure.The extension of above-mentioned photosensitive structure operation can adopt the different of striated pattern spatial frequency and orientation single enforcement to be set or to adopt different being provided with to repeat repeatedly until reaching predetermined microstructure 12.
During as preferable recommendation technology, step a) comprises the use mould pressing process in the technology of being discussed, and this technology is applicable to the shaping of raised lines structure 5.Yet, also might be to change technology in the step a), in this case, when cast layer 2, raised lines structure 5 has been shaped.In this case, liquid photoresist casts in the model of casting, and this model comprises substrate 1 and burr mould 4 (see figure 1)s that are provided with substrate 1 inverse relationship.Photoresist be under the heating condition solidify after, can remove burr mould 4.Layer 2 empty forms mask has the raised lines structure 5 opposite with burr mould 4.
In other change example of technology, in step a), replace mold pressing or casting, raised lines structure 5 can adopt mechanical mode directly with engraving needle its to be carved in layer 2.
Technology shown in Figure 6 becomes example and can be used for burr mould 4, and this structure comprises at least one parabolic surface 16 and/or cone point 17.Parabolic surface 16 and/or cone point 17 also can be combined with above-mentioned periodicity grating.The shape of burr mould 4 can produce in the layer 2 on substrate 1.Can carry out the operation of photosensitive structure subsequently.
Be applicable to other change example of the technology of microstructure 12, can not use grating or wrinkle structure as burr mould 4, and be to use the unitized construction that has existed with overlay structure, these structures at first are formed in the surface of the layer 2 of photoresist in above-mentioned technology, so that produce raised lines structure 5, and further carry out photosensitive structureization subsequently.
As everyone knows, except above-mentioned positive photoresist, (for example, FuturrexNR7-1000PY), this photoresist also is very suitable for above-mentioned technology also may to use the photoresist of negativity.
Claims (16)
1. one kind is applicable to the technology that produces the optical diffraction microstructure in the photoresist layer (2) of substrate (1), and this microstructure is by making one first raised lines structure (5) and at least one second raised lines structure overlaid as diffraction structure (12);
It is characterized in that may further comprise the steps:
A) go up to produce the photoresist layer (2) with first raised lines structure at smooth substrate (1), this is to form in the blank surface of described photoresist layer (2) by the shape that will become the burr mould (4) that inverse relationship is provided with substrate (1) to produce;
B) remove described burr mould (4);
C) go up the generation conoscope image at described first raised lines structure (5), wherein, coherent light can be divided into divided beams (9) and reference beam (10), and described divided beams (9) and described reference beam (10) can be gone up at described first raised lines structure (5) and produce the interference that comprise the predetermined angle of the crossing;
D) by making normal (15) rotation of described substrate (1) around described substrate (1) plane, the described conoscope image of azimutal orientation that foundation is relevant with described first raised lines structure (5), wherein said conoscope image comprises the high brightness light intensity striped by low-light level light intensity stripe segmentation;
E) in the given time by means of expose described first raised lines structure (5) in the described photoresist layer (2) of described conoscope image;
F) the described photoresist that develops in the given time, the described photoresist material that wherein changes in the exposing operation process is partly removed, and produces the groove (13) of diffraction structure (12) in described first raised lines structure (5); And
G) dry described photoresist.
2. technology as claimed in claim 1 is characterized in that, in step f), the development time of described photoresist makes the groove (13) of described diffraction structure (12) reach the degree of depth that is at most 500nm.
3. technology as claimed in claim 1, it is characterized in that, in step a), at first go up and produce described photoresist layer (2) at smooth substrate (1), and by being heating and curing, the burr mould (4) that will be installed in subsequently on the mold pressing punch (3) drops to the surface that is lower than described photoresist layer (2), thereby the shape of first raised lines structure (5) is made as the egative forme of described burr mould (4).
4. technology as claimed in claim 1, it is characterized in that, in step a), described photoresist layer (2) can adopt the mode of casting to produce, wherein liquid photoresist casts between described substrate (1) and the described burr mould (4), and after described photoresist solidified by thermal effect and removes from mould, the empty forms mask of described photoresist layer (2) had described first raised lines structure (5) as the egative forme of described burr mould (4).
5. as arbitrary described technology in the claim 1 to 4, it is characterized in that in step a), periodically grating is shaped with as described first raised lines structure (5) in described photoresist layer (2).
6. as arbitrary described technology in the claim 1 to 4, it is characterized in that in step a), a kind of crossed grating is formed in the described photoresist layer (2), as described first raised lines structure (5).
7. as arbitrary described technology in the claim 1 to 4, it is characterized in that, in step a), periodically grating is shaped in described photoresist layer (2) with as described first raised lines structure (5), in the scope of its spatial frequency that has between 1 line/mm and 1000 lines/mm.
8. technology as claimed in claim 1, it is characterized in that the crossing angle between divided beams described in the step b) (9) and described reference beam (10) is provided so that the described diffraction structure (12) that is produced is the grating that has at least corresponding to five times spatial frequency of the spatial frequency of described first raised lines structure (5).
9. as arbitrary described technology in the claim 1 to 4, it is characterized in that in step a), a kind of light scattering wrinkle structure formation is in described photoresist layer (2), with as described first raised lines structure (5).
10. as arbitrary described technology in the claim 1 to 4, it is characterized in that, in step a), the burr mould (4) with structure of at least one parabolic surface (16) and a cone point (17) is used to produce the shape of described first raised lines structure (5).
11., it is characterized in that described first raised lines structure (5) is shaped as the constructional depth T in the scope that has between 0.1 μ m and 100 μ m as arbitrary described technology in the claim 1 to 4.
12. as arbitrary described technology in the claim 1 to 4, it is characterized in that, at execution in step g) before, adopt step c) to f) the repetition photosensitive structure, make it to have at least one other diffraction structure (12), wherein, in step d), orientation has described first raised lines structure (5) of the groove (13) of described diffraction structure (12), makes it relevant with new conoscope image by described substrate (1) around its normal (15) rotation.
13. technology as claimed in claim 12 is characterized in that, in case repeat the photosensitive structure operation in step b), then changes the crossing angle between described divided beams (9) and described reference beam (10).
14. as arbitrary described technology in the claim 1 to 4, it is characterized in that, in step b), be arranged on the crossing angle between described divided beams (9) and the described reference beam (10), make the described diffraction structure (12) that is produced have the grating cycle that mostly is 500nm most.
15. technology as claimed in claim 1 is characterized in that, the development time of described photoresist makes the groove (13) of described diffraction structure (12) reach and is at most 250nm.
16. as arbitrary described technology in the claim 1 to 4, it is characterized in that, in step a), the burr mould (4) with structure of at least one parabolic surface (16) or a cone point (17) is used to produce the shape of described first raised lines structure (5).
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| Application Number | Priority Date | Filing Date | Title |
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| DE10312564.7 | 2003-03-21 | ||
| DE10312564 | 2003-03-21 | ||
| DE10318105.9 | 2003-04-22 |
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| CN100386654C true CN100386654C (en) | 2008-05-07 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| FR2947210B1 (en) * | 2009-06-24 | 2017-09-08 | Oberthur Technologies | SECURITY DOCUMENT WHOSE DATA ARE PROTECTED BY A ROUGH COATING. |
| CN101727010B (en) * | 2009-12-03 | 2011-11-09 | 吉林大学 | Method for preparing biomimetic colour super-hydrophobic coating by multi-beam interference photoetching technology |
| CN106657970A (en) * | 2016-10-25 | 2017-05-10 | 乐视控股（北京）有限公司 | Depth map imaging device |
| CN109740184B (en) * | 2018-12-07 | 2022-04-12 | 吉林大学 | Method for realizing surface planarization of pit-shaped microarray structure unit by secondary pressing |
| CN114690297A (en) * | 2020-12-29 | 2022-07-01 | 华为技术有限公司 | Composite grating, method for manufacturing the same, diffraction optical waveguide, and electronic device |
| CN112874202B (en) * | 2021-01-11 | 2021-12-21 | 中钞印制技术研究院有限公司 | Method for producing a security element and security element |
| CN114261947A (en) * | 2021-12-22 | 2022-04-01 | 东北林业大学 | Method for processing nano periodic structure by using vibration-assisted needle point track motion |
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| US5138604A (en) * | 1988-04-12 | 1992-08-11 | Dai Nippon Insatsu Kabushiki Kaisha | Optical recording method having two degrees of reflectivity and a diffraction grating or hologram formed integrally thereon and process for making it |
| US6043936A (en) * | 1995-12-06 | 2000-03-28 | De La Rue International Limited | Diffractive structure on inclined facets |
| JP2000264000A (en) * | 1999-03-15 | 2000-09-26 | Dainippon Printing Co Ltd | Color-changing vapor deposition medium and its manufacture |
| US6359735B1 (en) * | 1997-03-04 | 2002-03-19 | Fraunhofer Gesellschaft Zur Forderung Der Angewandten Forschung E.V. | Antireflective coating and method of manufacturing same |
| CN1345274A (en) * | 1999-04-09 | 2002-04-17 | Ovd基尼格拉姆股份公司 | Decorative foil |
| WO2003084764A2 (en) * | 2002-04-05 | 2003-10-16 | Ovd Kinegram Ag | Security element comprising micro- and macrostructures |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH659433A5 (en) * | 1982-10-04 | 1987-01-30 | Landis & Gyr Ag | DOCUMENT WITH A REFLECTIVE OPTICAL SECURITY ELEMENT. |
| US5575878A (en) * | 1994-11-30 | 1996-11-19 | Honeywell Inc. | Method for making surface relief profilers |
| US5995638A (en) * | 1995-08-28 | 1999-11-30 | Ecole Polytechnique Federale De Lausanne | Methods and apparatus for authentication of documents by using the intensity profile of moire patterns |
| US6027595A (en) * | 1998-07-02 | 2000-02-22 | Samsung Electronics Co., Ltd. | Method of making optical replicas by stamping in photoresist and replicas formed thereby |
| GB0030675D0 (en) * | 2000-12-15 | 2001-01-31 | Rue De Int Ltd | Methods of creating high efficiency diffuse back-reflectors based on embossed surface relief |
-
2003
- 2003-04-22 DE DE10318105A patent/DE10318105B4/en not_active Expired - Fee Related
-
2004
- 2004-03-18 CN CNB2004800135588A patent/CN100386654C/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4537504A (en) * | 1981-02-03 | 1985-08-27 | Lgz Landis & Gyr Zug Ag | Security blank with enhanced authenticating features, and a method and an apparatus for determining the genuineness of the security blank |
| US5138604A (en) * | 1988-04-12 | 1992-08-11 | Dai Nippon Insatsu Kabushiki Kaisha | Optical recording method having two degrees of reflectivity and a diffraction grating or hologram formed integrally thereon and process for making it |
| US6043936A (en) * | 1995-12-06 | 2000-03-28 | De La Rue International Limited | Diffractive structure on inclined facets |
| US6359735B1 (en) * | 1997-03-04 | 2002-03-19 | Fraunhofer Gesellschaft Zur Forderung Der Angewandten Forschung E.V. | Antireflective coating and method of manufacturing same |
| JP2000264000A (en) * | 1999-03-15 | 2000-09-26 | Dainippon Printing Co Ltd | Color-changing vapor deposition medium and its manufacture |
| CN1345274A (en) * | 1999-04-09 | 2002-04-17 | Ovd基尼格拉姆股份公司 | Decorative foil |
| WO2003084764A2 (en) * | 2002-04-05 | 2003-10-16 | Ovd Kinegram Ag | Security element comprising micro- and macrostructures |
Also Published As
| Publication number | Publication date |
|---|---|
| DE10318105A1 (en) | 2004-10-07 |
| DE10318105B4 (en) | 2007-09-20 |
| CN1791813A (en) | 2006-06-21 |
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