CN100388516C - Light source module - Google Patents
Light source module Download PDFInfo
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- CN100388516C CN100388516C CNB2005100759925A CN200510075992A CN100388516C CN 100388516 C CN100388516 C CN 100388516C CN B2005100759925 A CNB2005100759925 A CN B2005100759925A CN 200510075992 A CN200510075992 A CN 200510075992A CN 100388516 C CN100388516 C CN 100388516C
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- light
- emitting diode
- source module
- light source
- carrier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The present invention relates to a combining method and a structure of a light emitting diode assembly and a load bearing base plate in a light source module. The light emitting diode assembly is composed of a light emitting diode and a carrier, and a fixed part is extended from the bottom of the carrier to form an abutting surface. A through hole of which the external diameter is a little larger than the external diameter of the light emitting diode and smaller than that of the external edge of the fixed part is formed on the load bearing base plate. Thus, when the light emitting diode assembly is stuck on a heat radiator, the light emitting diode assembly and the heat radiator are combined more tightly by pressure applied by the load bearing base plate to improve heat radiating effect.
Description
Technical field
The present invention relates to a kind of light source module, particularly relate to compound mode and structure thereof between interior light-emitting diode component of a kind of light source module and bearing substrate.
Background technology
In known light source module, combined method between light-emitting diode component and the bearing substrate and the step that the structure that combination is finished is covered on the heat sink can be with reference to Figure 1A to Fig. 1 C.At first with reference to the generalized section shown in Figure 1A, light source module mainly by a plurality of light-emitting diode components 12 and the substrate 11 that is used for carrying light-emitting diode component 12 formed.Substrate 11 has opposite first 111 (bottom surface) and second surface 112 (end face), and is formed with a plurality of perforation 113 that run through substrate 11, then is formed with pattern conductive circuit 114 on the first surface 111 of substrate 11.
Continuation is with reference to Figure 1A, and each light-emitting diode component 12 is made up of a light-emitting diode 121 and a carrier 12 2, and a plurality of pins 124 that electrically connect with light-emitting diode 121 then expose from carrier 122 sidewalls.
With reference to Figure 1B, when mobile light-emitting diode component 12 and when first surface 111 inserts corresponding perforation 113, light-emitting diode 121 wears substrate 11 and protrudes in second surface 112, and the pin 124 that exposes then is resisted against on the perforation 113 pattern conductive circuit 114 on every side; At this moment, can utilize welding fluid 13 that pin 124 is welded on the pattern conductive circuit 114 and finish light-emitting diode 12 and the electric connection and the combining structure of 11 of substrates.
With reference to Fig. 1 C, the heat energy that is produced for light-emitting diode 12 running the time is effectively discharged, after the light-emitting diode 12 that the welding combination can be finished is done the upset of one 180 degree with substrate 11, the bottom surface of the carrier 12 2 of light-emitting diode 12 is resisted against on the heat conductive pad 14, and heat conductive pad 14 contacts with a heat sink 15 surfaces again; But, desire allows when bestow substrate 11 1 downward pressure along the direction of arrow has one to contact more closely and when increasing heat radiation function between light-emitting diode 12 and the heat sink 115, pin 124 on the light-emitting diode 12 is owing to directly bear the pressure that substrate 11 is bestowed, therefore cause the pin 124 crooked situation that deforms easily, even may take place to break away from and damage with pattern conductive circuit 114.
Summary of the invention
Because in the foregoing invention background, the problem that light-emitting diode component in the light source module and the combining structure of bearing substrate can't closely contact with heat sink, combined method in this provides a kind of light source module between light-emitting diode component and the bearing substrate and this combining structure, its purpose when allowing light-emitting diode component closely paste to heat sink, the situation that light-emitting diode component itself also can not deform or damage.
According to above-mentioned purpose, a technical scheme provided by the invention is as follows:
A kind of light source module comprises:
One substrate has one first perforation on it; And
One light-emitting diode component, include a light-emitting diode and a carrier, it is characterized in that, this carrier base forms the fixed part of an outer rim greater than this first perforation external diameter, this fixed part is protruded the sidewall of this carrier by the bottom extension of this carrier, wherein this light-emitting diode runs through this first perforation, and this fixed part then is connected to the bottom surface of this substrate.
The present invention also provides another technical scheme:
A kind of light source module is characterized in that, comprising:
One substrate has the groove of wearing, and this substrate has a relative first surface and a second surface; And
A plurality of light-emitting diode components, to wearing the groove configuration, wherein, each this light-emitting diode component is made up of a light-emitting diode and a carrier, and be formed with outer rim in this carrier base and wear a fixed part of well width greater than this, this fixed part is protruded the sidewall of this carrier by the bottom extension of this carrier, make a plurality of light-emitting diode components when this first surface of this substrate inserts this and wears groove, these a plurality of light-emitting diodes can be worn groove by this simultaneously and protrude in this second surface, this fixed part then be resisted against on this first surface contiguous this wear groove around.
Technique effect of the present invention is: the combined method of light-emitting diode component and bearing substrate and structure thereof in the light source module, the carrier base that is used for carrying light-emitting diode in light-emitting diode component is extended a fixed part and is formed abutment face, and be engaged on the bearing substrate and form that external diameter is slightly larger than the diode external diameter and less than the perforation of fixed part outer rim, thus, when light-emitting diode component was covered on the heat sink, substrate just can be bestowed a pressure by having one to combine more closely and increase the effect of heat radiation between light-emitting diode component and the heat sink.
Description of drawings
Figure 1A to Fig. 1 C is a known technology, is assembled to light-emitting diode component on the bearing substrate and is resisted against steps flow chart on the heat sink;
Fig. 2 A to Fig. 2 C is assembled to light-emitting diode component on the bearing substrate according to a preferred embodiment provide of the present invention and is resisted against steps flow chart on the heat sink;
The light source module schematic perspective view that Fig. 2 D provides combination to finish according to a preferred embodiment of the present invention;
Fig. 2 E provides according to other preferred embodiment of the present invention has the substrate of wearing groove and the light-emitting diode component schematic perspective view when combining;
Fig. 2 F and Fig. 2 G provide according to a preferred embodiment of the present invention and form the generalized section of a reflector plate on light source module;
Generalized section when Fig. 2 H is provided at the heat sink that forms a radiating fin external form in the light source module according to other preferred embodiment of the present invention;
Fig. 2 I to Fig. 2 J is the profile variation of its fixed part of light-emitting diode component of the present invention.
Symbol description among the figure:
11 substrates
111 first surfaces
112 second surfaces
113 perforation
114 pattern conductive circuits
12 light-emitting diode components
121 light-emitting diodes
122 carriers
124 pins
13 welding fluid
14 heat conductive pads
15 heat sinks
21 substrates
211 first surfaces
212 second surfaces
213 first perforation
214 pattern conductive circuits
215 wear groove
22 light-emitting diode components
221 light-emitting diodes
222 carriers
223 fixed parts
2231 abutment faces
224 pins
23 welding fluid
24 heat conductive pads
25 heat sinks
26 reflector plates
261 second perforation
27 radiating fins
Embodiment
Next be detailed description of the present invention, description to light source module and light-emitting diode component itself in the following explanation does not comprise detailed contexture and operation principles, the existing skill that the present invention continued to use is only done quoting of emphasis formula at this, to help elaboration of the present invention.And the accompanying drawing of relevant light source module is also according to the actual ratio drafting in the literary composition in following, and its effect is only giving expression to feature of the present invention.Secondly, each assembly in embodiments of the invention are graphic or structure are when describing explanation, should be with this as the cognition that qualification is arranged, promptly following explanation is during the restriction on the lay special stress on number, spirit of the present invention and range of application can spread to most assemblies or structure and the structure of depositing on.
Provide the combined method and the structure thereof of interior light-emitting diode component of a kind of light source module and bearing substrate according to a preferred embodiment of the present invention, and this combining structure closely can be covered on the heat sink.At first with reference to the generalized section shown in Fig. 2 A, light source module mainly by a plurality of light-emitting diode components 22 and the substrate 21 that is used for carrying light-emitting diode component formed.In the present embodiment, substrate 21 can be a printed circuit board (PCB) or other multi-layer sheet, it has opposite first 211 (bottom surface) and second surface 212 (end face), and forms a plurality of first perforation 213 that run through substrate 21 and respective leds assembly 22 positions and quantity; In addition, on the first surface 211 of substrate 21, expose by Copper Foil or the formed pattern conductive circuit 214 of other conductive layer.
Continuation is with reference to Fig. 2 A, the light-emitting diode component 22 that present embodiment provided is made up of a light-emitting diode 221 and a carrier 222, wherein, the external diameter of light-emitting diode 221 is slightly less than the external diameter of first perforation 213, but carrier 222 bottoms then extend to form the fixed part 223 of an outer rim greater than first perforation, 213 external diameters, and pin 224 a plurality of and that light-emitting diode 221 electrically connects also exposes out on fixed part 223 sidewalls.
With reference to Fig. 2 B, when mobile light-emitting diode component 22 and when first surface 211 inserts corresponding first perforation 213, light-emitting diode 221 just can and protrude in the second surface 212 of substrate 21 by first perforation 213, and fixed part 223 then is resisted against the part around contiguous first perforation 213 on the first surface 211 and can't wears; So, just can utilize welding fluid 23 that pin 224 is welded on the pattern conductive circuit 214 and finish light-emitting diode component 22 and the electric connection and the combining structure of 21 of substrates.
With reference to Fig. 2 C, the heat energy that is produced for light-emitting diode 221 running the time is effectively discharged, and present embodiment is done light-emitting diode component 22 and the combining structure of substrate 21 the direct a plurality of heat conductive pads 24 of mat after the upsets of one 180 degree and carrier 222 bottom surfaces are contacted with the surface of a heat sink 25; And because the carrier 222 that present embodiment provided has the fixed part 223 of outer rim greater than first perforation, 213 external diameters, therefore can bestow substrate 21 1 downward pressure and allow and have one combine more closely and increase the effect of dispelling the heat between light-emitting diode component 22 and the heat sink 25 along the direction of arrow, and its pin of the carrier of known light-emitting diode component produces because substrate presses down and is out of shape even just can avoids with the problem of pattern conductive circuit disengaging.
And its schematic perspective view of light source module of finishing of combination can be with reference to Fig. 2 D, and this figure shows first perforation 213 by correspondence and protrude in the second surface 212 of substrate 21 of each light-emitting diode 221.And in foundation other specific embodiment of the present invention, substrate also can be formed directly in the groove of wearing of corresponding a plurality of light-emitting diode components, for example with reference to Fig. 2 E, on substrate 21, be formed with and wear groove 215, and this wears groove 215 width between light-emitting diode 221 external diameters and fixed part 213 outer rims, thus, a plurality of light-emitting diodes 221 just can be simultaneously by this second surface 212 of wearing groove 215 and protruding in substrate 21, and the fixed part 223 formed abutment faces 2231 of each light-emitting diode component all can be resisted against on the first surface (not shown) of substrate 21 contiguous this wear groove 215 around.
In addition, with reference to Fig. 2 F, the characteristic of the also visual light-emitting diode component 22 of the present invention or the needs of light source module and increase by a reflecting element, for example when the light-emitting diode 221 that present embodiment adopted is penetrated the light-emitting diode 22 of type (side emitting) for one side, just can on the second surface 212 of substrate 21, paste a reflector plate 26 (or forming a reflecting surface), bore a hole 261 and on reflector plate 26, form second of a plurality of corresponding first perforation 213 positions, and the external diameter of this second perforation 261 can be selected as shown in the 2nd F figure, greater than the light-emitting diodes external diameter of pipe, and allow light-emitting diode 221 directly by this second perforation 261 and protrude in outside the reflector plate 26; Perhaps in foundation other specific embodiment of the present invention, on reflector plate, form second perforation that an external diameter is equal to or less than light-emitting diode, shown in Fig. 2 G, have one to fit effect more closely and avoid taking place the phenomenon of light leak between reflector plate and the light-emitting diode and can allow, so can reach the more light output of available energy.
In addition, in foundation other embodiments of the invention, heat sink also can be selected from a radiating fin 27 (heat sink) and the effect of increase heat radiation as shown in Fig. 2 H except can being selected from a fin; And the heat conductive pad 24 that is arranged between each carrier 222 bottom surface and the radiating fin 27 also can be the structure of whole piece as shown in Fig. 2 H.
With reference to Fig. 2 I and the 2nd J Fig. 2 J, the light-emitting diode component 22 that its present embodiment provided has the schematic perspective view that different external forms change, wherein, each fixed part 223 is the extension of carrier 222 bottoms, its purpose forms an abutment face 2231 producing offset, make when light-emitting diode 221 allows light-emitting diode 221 and part carrier 222 pass through from substrate top insertion first perforation, outer rim is greater than the fixed part 223 of piercing aperture abutment face 2231 and being resisted against outside first perforation by this just, thereby can carry out the welding step of follow-up pin 224 and pattern conductive circuit smoothly; In addition, when light-emitting diode component 22 with the combining structure mat heat conductive pad of substrate against to the heat sink surface time, the pressure of light-emitting diode component that substrate is bestowed 22 just can directly not oppressed the pin 224 that welds together with the pattern conductive circuit.And the external form of light-emitting diode component 22 its fixed parts 223 provided by the present invention can be as shown in Fig. 2 I and Fig. 2 J, be a cubic type or column type, it all can form greater than the abutment face 2231 of perforation (or wearing groove) scope and reach identical against effect.
Above-described embodiment only is explanation technological thought of the present invention and characteristics, its purpose makes the personage who has the knack of this skill can understand content of the present invention and is implementing according to this, when can not with qualification claim of the present invention, promptly the equalization of doing according to disclosed spirit generally changes or modifies, and must be encompassed in the claim of the present invention.
Claims (13)
1. light source module comprises:
One substrate has one first perforation on it; And
One light-emitting diode component, include a light-emitting diode and a carrier, it is characterized in that, this carrier base forms the fixed part of an outer rim greater than this first perforation external diameter, this fixed part is protruded the sidewall of this carrier by the bottom extension of this carrier, wherein this light-emitting diode runs through this first perforation, and this fixed part then is connected to the bottom surface of this substrate.
2. light source module as claimed in claim 1 is characterized in that, comprises that also a heat sink connects the bottom surface of this carrier.
3. light source module as claimed in claim 2 is characterized in that this heat sink comprises a fin.
4. light source module as claimed in claim 2 is characterized in that, comprises that also a heat conductive pad is arranged between this carrier and this heat sink.
5. light source module as claimed in claim 1 is characterized in that, also comprises a reflector plate, and this reflector plate is disposed on the end face of this substrate.
6. light source module as claimed in claim 5 is characterized in that, has one second perforation corresponding to this first punch position on this reflector plate, uses to make this light-emitting diode and protrude in this reflector plate by this second perforation.
7. light source module as claimed in claim 6 is characterized in that, aperture of this second perforation is equivalent to or less than the external diameter of this light-emitting diode.
8. a light source module is characterized in that, comprising:
One substrate has the groove of wearing, and this substrate has a relative first surface and a second surface; And
A plurality of light-emitting diode components, to wearing the groove configuration, wherein, each this light-emitting diode component is made up of a light-emitting diode and a carrier, and be formed with outer rim in this carrier base and wear a fixed part of well width greater than this, this fixed part is protruded the sidewall of this carrier by the bottom extension of this carrier, make these a plurality of light-emitting diode components when this first surface of this substrate inserts this and wears groove, these a plurality of light-emitting diodes can be worn groove by this simultaneously and protrude in this second surface, this fixed part then be resisted against on this first surface contiguous this wear groove around.
9. light source module as claimed in claim 8 is characterized in that, comprises that also a heat sink connects the bottom surface of this carrier.
10. light source module as claimed in claim 9 is characterized in that this heat sink comprises a fin.
11. light source module as claimed in claim 9 is characterized in that, comprises that also a heat conductive pad is arranged between this carrier and this heat sink.
12. light source module as claimed in claim 8 is characterized in that, comprises that also a reflector plate is disposed on the second surface of this substrate.
13. light source module as claimed in claim 12 is characterized in that, has on this reflector plate a perforation that should light-emitting diode component, uses making this light-emitting diode and protrude in this reflector plate by this perforation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100759925A CN100388516C (en) | 2005-06-07 | 2005-06-07 | Light source module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100759925A CN100388516C (en) | 2005-06-07 | 2005-06-07 | Light source module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1697207A CN1697207A (en) | 2005-11-16 |
| CN100388516C true CN100388516C (en) | 2008-05-14 |
Family
ID=35349807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100759925A Active CN100388516C (en) | 2005-06-07 | 2005-06-07 | Light source module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100388516C (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100552990C (en) * | 2006-12-29 | 2009-10-21 | 富准精密工业(深圳)有限公司 | Light emitting diode module |
| EP2147244B1 (en) * | 2007-05-07 | 2015-12-02 | Koninklijke Philips N.V. | Led-based lighting fixtures for surface illumination with improved heat dissipation and manufacturability |
| US8115369B2 (en) * | 2009-11-09 | 2012-02-14 | Lg Innotek Co., Ltd. | Lighting device |
| CN101975376B (en) * | 2010-10-08 | 2012-07-11 | 深圳市华星光电技术有限公司 | Luminous source heat-dissipation structure of backlight module |
| CN102679210B (en) * | 2012-04-01 | 2014-08-13 | 深圳市超频三科技有限公司 | LED (light-emitting diode) lamp and LED light source component |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5857767A (en) * | 1996-09-23 | 1999-01-12 | Relume Corporation | Thermal management system for L.E.D. arrays |
| US6428189B1 (en) * | 2000-03-31 | 2002-08-06 | Relume Corporation | L.E.D. thermal management |
| US20050024834A1 (en) * | 2003-07-28 | 2005-02-03 | Newby Theodore A. | Heatsinking electronic devices |
| CN1588658A (en) * | 2004-07-01 | 2005-03-02 | 友达光电股份有限公司 | Light-emitting diode light source module with support piece |
| CN1591924A (en) * | 2003-07-29 | 2005-03-09 | 西铁城电子股份有限公司 | Surface-mounted LED and light emitting device with same |
-
2005
- 2005-06-07 CN CNB2005100759925A patent/CN100388516C/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5857767A (en) * | 1996-09-23 | 1999-01-12 | Relume Corporation | Thermal management system for L.E.D. arrays |
| US6428189B1 (en) * | 2000-03-31 | 2002-08-06 | Relume Corporation | L.E.D. thermal management |
| US20050024834A1 (en) * | 2003-07-28 | 2005-02-03 | Newby Theodore A. | Heatsinking electronic devices |
| CN1591924A (en) * | 2003-07-29 | 2005-03-09 | 西铁城电子股份有限公司 | Surface-mounted LED and light emitting device with same |
| CN1588658A (en) * | 2004-07-01 | 2005-03-02 | 友达光电股份有限公司 | Light-emitting diode light source module with support piece |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1697207A (en) | 2005-11-16 |
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