CN100398321C - 具有外装喷嘴控制器的喷墨喷嘴组件 - Google Patents
具有外装喷嘴控制器的喷墨喷嘴组件 Download PDFInfo
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Abstract
提供一种用于喷墨打印头的喷嘴组件(10),其包括形成于一基片(16)上的喷嘴腔(34),设置在基片(16)上以形成与喷嘴腔(34)流体连通的开口(24)的喷嘴(22),喷嘴(22)可以相对于基片(16)移动,从而在需要时通过开口(24)喷出墨水;及一个设置在基片(16)上并与喷嘴(22)连接的控制器单元(28),且该控制器单元(28)外装于喷嘴腔(34)而用于控制喷嘴(22)的移动。
Description
本申请是2000年5月24日申请的题为“具有外装控制器的移动喷嘴的喷墨打印头的制造方法”的00819574.9号中国专利申请的分案。
技术领域
本发明涉及一种喷墨打印头,特别是一种具有外装控制器的移动喷嘴的喷墨打印头的制造方法。
背景技术
在我们的同类申请——专利号为09/112,835的美国专利申请中概要介绍了一种移动喷嘴装置的制造方法。这种移动喷嘴装置通过一种磁控元件调节来控制移动喷嘴的位移,从而控制墨水的喷出。
这种设计的一个问题是,移动喷嘴装置的部件必须进行憎水处理,以便使墨水进入控制器区域中。
本发明提供了一种不需要进行憎水处理的移动喷嘴装置的制造方法。
发明内容
本发明提供了一种喷墨打印头的制造方法,包括以下步骤:
提供一个基片,以及
在基片上产生一个喷嘴组件的阵列,其中每个喷嘴组件带有一个喷嘴腔,该喷嘴腔与喷嘴组件的喷嘴开口的液路相通。每个喷嘴组件的喷嘴可以相对于基片位移,从而在需要时喷出墨水。每个喷嘴组件还包括一个外装于喷嘴腔并与喷嘴相连的控制器单元,用于控制喷嘴的位移。
在本说明书中,“喷嘴”一词应理解为带有一个开口的元件,而不是开口本身。
而且,本发明中描述的方法还包括通过使用平面集成电路沉积、平版印刷和刻蚀工艺产生上述喷嘴阵列。
而且,本发明中所述的方法可以包括在基片上同时形成多个打印头。
本发明中所述的方法可以包括在同一个基片上形成集成的驱动电路,该集成驱动电路可以使用CMOS制造工艺制造。
上述方法可以包括以喷嘴的一部分形成喷嘴腔周壁的第一部分以及使用一种抑制装置形成喷嘴腔的周壁的第二部分,该抑制装置从基片上延伸而来,可以抑制墨水从喷嘴腔中漏出。尤其,本发明中所述的方法可以包括通过沉积和刻蚀工艺过程形成从基片上延伸而来的抑制装置。
本发明中所述的方法可以包括使用一个臂把喷嘴与喷嘴的控制器单元互联,使喷嘴与控制器单元之间形成一种悬臂结构。
上述控制器单元可以是热弯曲型控制器;本发明中的方法还可以包括由至少两个梁形成的控制器单元,上述两个梁中一个作为主动梁,另一个作为被动梁。“主动梁”是指该梁上有电流通过,从而使该梁在电阻生热的作用下产生膨胀。相反,“被动梁”上没有电流通过,以利于上述主动梁在使用中产生弯曲。
附图说明
图1是本发明喷墨打印头的喷嘴组件的立体示意图。
图2到图4是图1中的喷嘴组件动作的立体示意图。
图5是构成喷墨打印头的喷嘴阵列的立体图。
图6是图5的喷嘴阵列的局部放大图。
图7是带有一个喷嘴保护帽的喷墨打印头的立体图。
图8a到图8r是本发明中喷墨打印头的喷嘴组件制造步骤的立体图。
图9a到图9r是制造步骤的侧面剖视图。
图10a到图10k是在制造过程的各步骤中使用的模板布局。
图11a到图11c是根据图8和图9的方法制造的喷嘴组件动作的立体图。
图12a到图12c是根据图8和图9制造的喷嘴组件的动作的侧面剖视图。
具体实施方式
下面结合附图对本发明的实施方式作进一步的说明
图1所示是本发明的一个喷嘴组件10。一个喷墨打印头带有多个上述喷嘴组件10,该喷嘴组件10在硅基片16上形成一个阵列14(见图5和图6)。该喷嘴阵列14将在下面详细说明。
喷嘴组件10包括一块沉积有一层电介质层18的硅基片16。在电介质层18上沉积有一层CMOS钝化层20。
每个喷嘴组件10包含一个带有喷嘴开口24的喷嘴22、一个杠杆臂26形式的连接部件以及一个控制器28。杠杆臂26把控制器单元28连接到喷嘴22上。
如图2到图4所示,喷嘴22带有一个花冠部分30,从花冠部分30上延伸出一个裙边部分32。裙边部分32构成喷嘴腔34的周壁(见图2到图4)的一部分。喷嘴开口24与喷嘴腔34的液路相通。需要注意的是,喷嘴开口24有一圈凸缘36,该凸缘36使喷嘴腔34中的墨水40在凸缘上形成一个弯液面38(见图2)。
在喷嘴腔34的底板上带有一个用于墨水入口的孔42(图6所示最为清晰)。该孔42与通过基片16的墨水进入通道48相通。
孔42的外圈有一圈围壁50,围壁50从底部46向上延伸。上述的喷嘴22的裙边部分32构成喷嘴腔34周壁的第一部分,上述围壁50构成喷嘴腔34周壁的第二部分。
围壁50的自由端具有一个向内翻转的唇边52,该唇边起密封墨水的作用,当喷嘴22移动时,唇边52可以阻止墨水漏出。由于墨水40的粘度较高,而且唇边52与裙边部分32之间的间隙非常小,在墨水40的表面张力作用下,唇边52起到密封墨水的作用,防止墨水40从喷嘴腔34中漏出。
控制器单元28是一种热弯曲型调节装置,它与从基片16向上延伸的(更确切地说是从CMOS钝化层20向上延伸)的锚片54连接。锚片54安装在导电垫片56上,导电垫片56与控制器单元28电连接。
控制器单元28包括一个第一个主动梁58,和一个第二个梁被动梁60,主动梁58在被动梁60的上面。在本发明的一个优选实例中,主动梁58和被动梁60都由导电陶瓷材料构成或含有导电陶瓷材料(例如氮化钛TiN)。
主动梁58和被动梁60的第一端都固定到锚片54上,另一端与杠杆臂26连接。当电流通过主动梁58时,主动梁58会发生热膨胀。而被动梁60上没有电流通过,所以不会与主动梁58一起同时膨胀,因此,主动梁58和被动梁60会产生弯曲运动,导致杠杆臂26和喷嘴22朝基片16向下位移,如图3所示。这样会导致墨水从喷嘴开口24喷射出来,如图3中的62。当主动梁58上的热源消除后,即停止电流后,喷嘴22将返回到其静态位置,如图4所示。当喷嘴22返回到其静态位置时,由于墨滴颈部被断开,会产生一滴墨滴64,如图4中的66。然后,墨滴64落到打印媒质上,例如一张纸。由于墨滴64的形成,会产生一个反向弯液面,如图4中的68。反向弯液面68导致墨水40流入喷嘴腔34,从而立即形成一个新的弯液面38(见图2),为从喷嘴组件10喷出下一滴墨水做好准备。
现在请看图5和图6,其中更详细地描绘了喷嘴阵列14。喷嘴阵列14用于彩色打印头。所以,该喷嘴阵列14由4个喷嘴阵列组70构成,每个喷嘴组件组提供一种颜色。每个喷嘴组件组70中的喷嘴组件10设置为两个喷嘴组件排72和74。图6中更详细地画出了喷嘴组件组70中的一个喷嘴组件10。
为了紧密安排喷嘴组件排72和74中的喷嘴组件10,喷嘴组件排74中的喷嘴组件10相对于喷嘴组件排72中的喷嘴组件10偏移一定距离或交错排列。而且,喷嘴组件排72中的喷嘴组件10彼此之间的距离很大,足以使喷嘴组件排74中的喷嘴组件的杠杆臂26通过喷嘴组件排72中相邻的喷嘴组件10的喷嘴22。需要说明的是,每个喷嘴组件10都是哑铃形的,因此,喷嘴组件排72中的喷嘴组件10的喷嘴22可以位于喷嘴组件排74中的相邻喷嘴组件10的喷嘴22和控制器单元28之间。
而且,为了便于更紧凑地安排喷嘴组件排72和74中的喷嘴22,每个喷嘴22都是六边形的。
行业人员很容易知道,在实际使用中,当喷嘴22向基片16移动时,由于喷嘴开口24与喷嘴腔34有一个小角度,所以墨水在喷出时会稍稍偏离垂直方向。而图5和图6中的设计具有一个优点:喷嘴组件排72和74中的喷嘴组件10的控制器单元28沿同一方向延伸到喷嘴组件排72和排74的一侧。因此,从喷嘴组件排72中的喷嘴22喷出的墨滴与从喷嘴组件排74中的喷嘴22喷出的墨滴相互平行,从而提高了打印质量。
而且,如图5所示,基片16带有一些粘结垫76,这些粘结垫提供了从垫片56向喷嘴组件10的控制器单元28的电连接。这些电连接通过CMOS层(图中没有示出)形成。
如图7所示是本发明的一个实施例。参考前图,两张图纸中的相同部件的标号是相互对应的,除非另有规定。
在该实施例中,喷嘴阵列14的基片16上安装了一个喷嘴保护帽80。喷嘴保护帽80包括一个主体部分82,该主体部分82具有多个贯穿的通道84。通道84与阵列14中的喷嘴组件10的喷嘴开口24相对应,这样当墨水从任何一个喷嘴开口24喷出时,墨滴在打到打印媒质之前会通过相应的通道84。
主体部分82与喷嘴组件10有一定间隙,由支杆或者说支柱86支撑。支柱86有一个位于其中的进气开口88。
工作时,当阵列14动作时,空气被从进气开口88吸入,并与墨水一起通过通道84。
由于空气通过通道84的速度与墨滴64的速度不同,所以墨滴64不会被空气夹带。例如,墨滴64以大约为3米/秒的速度从喷嘴22喷出,而空气通过通道84的速度大约为1米/秒。
空气的作用是使通道84不会夹杂异物颗粒。如果某些异物(例如灰尘颗粒)落入到喷嘴组件10上,会对喷嘴产生不良影响。在喷嘴保护帽80中采用进气开口88制送气的方式,能够在很大程度上避免上述问题。
请参考图8到图10,其中示出了制造喷嘴组件10的工艺过程。
从硅基片16开始,在基片16的表面沉积一层电介质层18。该电介质层18是一层1.5微米厚的CVD氧化物。在电介质层18上加一层抗蚀剂,然后使用模具100进行印刷处理。
经过印刷处理后,使用等离子刻蚀方法把电介质层18刻蚀到硅基片16的层上,然后去掉抗蚀剂,清理电介质层18,经过上述步骤,孔42就形成了。
在图8b中,在电介质层18上沉积0.8微米厚度的的铝膜102,然后加一层抗蚀剂,使用模具104进行印刷处理。然后,采用等离子刻蚀方式把铝膜102刻蚀到该氧化的电介质层18,去掉抗蚀剂,对该层进行清理。此工艺步骤形成了粘结垫以及与喷墨控制器单元28的互连通道。该互联通道连接到一个NMOS驱动晶体管和一个电源层,连接线路在CMOS层(图中没有示出)形成。
然后,在所得到的装置上再沉积0.5微米厚的PECVD氮化物,作为CMOS钝化层20。在钝化层20上加一层抗蚀剂,然后使用模具106进行印刷处理。经过印刷处理后,使用等离子刻蚀方法把氮化物刻蚀到铝膜102,在孔42区域,应刻蚀到硅基片16的层上。去掉抗蚀剂,然后对设备进行清理。
在钝化层20上旋压一层牺牲层108。该牺牲层108是6微米厚的感光聚酰亚胺或4微米厚的高温抗蚀剂。把牺牲层108烘干,然后使用模具110进行印刷处理。印刷处理后,如果牺牲层108由聚酰亚胺材料制成,那么应在400℃温度下对其烘烤1小时;如果牺牲层108由高温抗蚀剂构成,那么应在300℃以上的温度对其烘烤1小时。需要注意的是,在设计模具110时,应考虑到由缩水所导致的聚酰亚胺构成的牺牲层108的图案的扭曲。
下一步,如图8e所示,在产品上加第二层牺牲层112。牺牲层112可以是旋压的2微米厚的感光聚酰亚胺,也可以是1.3微米厚的高温抗蚀剂。牺牲层112烘干后,使用模具114进行印刷处理。经过印刷处理后,对于由聚酰亚胺构成的牺牲层112,应在400℃下烘烤约1小时;对于由高温抗蚀剂构成的牺牲层112,应在300℃以上的温度下烘烤1小时左右。
然后,在产品上沉积一层0.2微米厚的多层金属层116。金属层116的一部分将构成控制器单元28的被动梁60。
也可以使用TiB2、MoSi2或(Ti,Al)N代替TiN。
然后,对金属层116使用模具118进行印刷处理,然后使用等离子刻蚀方法刻蚀到牺牲层112,下一步,小心地去掉加在金属层116上的防蚀剂,注意不要伤及牺牲层108或牺牲层112。
下一步,在金属层116上旋压一层4微米厚的感光聚酰亚胺或2.6微米厚的高温抗蚀剂,形成第三层牺牲层120。牺牲层120经过烘干后,使用模具122进行印刷处理。然后进行热烘。对于聚酰亚胺构成的牺牲层120,应在400℃下烘烤1小时左右;对于高温抗蚀剂构成的牺牲层120,应在300℃以上烘烤1小时左右。
下一步,在牺牲层120上再沉积第二层多层金属层124。金属层124的成分与金属层116相同,工艺方式也相同。需要说明的是,金属层116和金属层124都是导电层。
然后,使用模具126对金属层124进行印刷处理。下一步使用等离子刻蚀方法把金属层124刻蚀到牺牲层120(聚酰亚胺或高温抗蚀剂),然后,把加在金属层124上的抗蚀剂层小心地揭下来,注意不要伤及牺牲层108、112或120。需要说明的是,金属层124的剩余部分将构成控制器单元28的主动梁58。
下一步,通过旋压一层4微米厚的感光聚酰亚胺或2.6微米厚的高温抗蚀剂,形成第四层牺牲层128。牺牲层128经过烘干后,使用模具130进行印刷处理,剩下图9k所示的孤立部分。然后,对于聚酰亚胺材料,应在400℃下对牺牲层128的剩余部分烘烤1小时左右;对于高温抗蚀剂材料,应在300℃以上的温度下对牺牲层128的剩余部分烘烤1小时左石。
请参考图81,在上述产品上再沉积一层高杨氏模量的电介质层132。电介质层132由1微米左右厚度的氮化硅或氧化铝构成。电介质层132的沉积温度应低于牺牲层108、112、120、128的热烘温度。电介质层132应具有高弹性模数、化学惰性以及对TiN的良好粘接性。
下一步,在上述产品上在旋压一层2微米厚的感光聚酰亚胺或1.3微米厚的高温抗蚀剂,形成第五个牺牲层134。牺牲层134经过烘干后,使用模具136进行印刷处理。然后,如果是聚酰亚胺材料,应在400℃下对牺牲层134的剩余部分烘烤1小时;如果是高温抗蚀剂,应在300℃以上的温度下对牺牲层134的剩余部分烘烤1小时。
然后,采用等离子刻蚀方法把电介质层132刻蚀到牺牲层128,注意不要伤及牺牲层134。
上述步骤形成喷嘴开口24、杠杆臂26、以及喷嘴组件10的锚片54。
下一步,在上述产品上沉积一层高杨氏模量的电介质层138。电介质层138的沉积方法是:在低于牺牲层108、112、120和128的热烘温度下,沉积一层0.2微米厚的氮化硅或氮化铝。
下一步,如图8p所示,使用具有方向性的等离子刻蚀方法对电介质层138刻蚀0.35微米的深度。刻蚀的目的是从所有表面上清除电介质,仅留下电介质层132和牺牲层134的侧壁上的电介质。此步骤形成喷嘴开口24周围的喷嘴凸缘36,该喷嘴凸缘36使墨水产生上述的弯液面。
然后,在产品上加一层防紫外线(UV)胶带140,在硅基片16背面旋压一层4微米厚的抗蚀剂。然后使用模具142对硅基片16进行背面刻蚀处理,形成墨水进入通道48。然后从基片16上去掉防蚀剂。
在基片16的背面贴一层防紫外线胶带(图中没有示出)。然后去掉胶带140。下一步,把牺牲层108、112、120、128和134在氧等离子中进行处理,形成图8r和图9r中的最终的喷嘴组件10。为了便于参考,上两张图纸中的部件编号与图1中的编号相同,以反映喷嘴组件10的相关部件。图11和12示出了按照上述图8和图9所述的工艺过程制造的喷嘴组件10的动作。这些图纸与图2到图4对应。
行业人员很容易了解,可以根据上述实例中描述的本发明进行各种等价的变化或修改。本发明的实例只用来阐明发明内容,不应限制发明的范围。任何根据本发明进行等价变化或修改的装置都应属于本发明的概念范围。
Claims (4)
1.一种用于喷墨打印头的喷嘴组件,所述组件包括:
一个形成于一基片上的喷嘴腔;
一个设置在所述基片上而形成一个与所述喷嘴腔流体连通的开口的喷嘴,所述喷嘴可以相对于所述基片移动,从而在需要时通过所述开口喷出墨水;
一个设置在所述基片上并与所述喷嘴连接的控制器单元,且所述控制器单元外装于所述喷嘴腔而用于控制喷嘴的移动;以及
一个将所述喷嘴和所述控制器单元互联的臂,使所述喷嘴相对所述控制器单元形成一种悬臂结构。
2.如权利要求1所述的组件,其特征在于,部分喷嘴形成喷嘴腔壁的第一部分,且一个用于抑制墨水从所述喷嘴腔中泄漏的围壁形成喷嘴腔壁的第二部分,所述围壁由所述基片伸出。
3.如权利要求1所述的组件,其特征在于,所述控制器单元是热弯曲型控制器。
4.如权利要求3所述的组件,其特征在于,所述热弯曲型控制器包括至少两个梁,一个为主动梁,另一个为被动梁。
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- 2000-05-24 AU AU4731400A patent/AU4731400A/xx active Pending
- 2000-05-24 DE DE60035618T patent/DE60035618T2/de not_active Expired - Lifetime
- 2000-05-24 AU AU2000247314A patent/AU2000247314C1/en not_active Ceased
- 2000-05-24 CN CNB2005100510876A patent/CN100398321C/zh not_active Expired - Fee Related
- 2000-05-24 WO PCT/AU2000/000579 patent/WO2001089840A1/en active IP Right Grant
- 2000-05-24 AT AT00929091T patent/ATE367266T1/de not_active IP Right Cessation
- 2000-05-24 US US10/296,435 patent/US7169316B1/en not_active Expired - Fee Related
- 2000-05-24 JP JP2001586058A patent/JP4380962B2/ja not_active Expired - Fee Related
- 2000-05-24 EP EP00929091A patent/EP1301345B1/en not_active Expired - Lifetime
- 2000-05-24 CN CN00819574.9A patent/CN1198726C/zh not_active Expired - Fee Related
-
2002
- 2002-12-03 ZA ZA200209795A patent/ZA200209795B/en unknown
-
2005
- 2005-02-15 IL IL166921A patent/IL166921A/en not_active IP Right Cessation
-
2006
- 2006-12-08 US US11/635,523 patent/US7547095B2/en not_active Expired - Fee Related
-
2009
- 2009-05-31 US US12/475,557 patent/US7887161B2/en not_active Expired - Fee Related
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2010
- 2010-12-28 US US12/980,181 patent/US8070260B2/en not_active Expired - Fee Related
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2011
- 2011-11-14 US US13/295,904 patent/US8382251B2/en not_active Expired - Fee Related
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Also Published As
Publication number | Publication date |
---|---|
ATE367266T1 (de) | 2007-08-15 |
US20110090285A1 (en) | 2011-04-21 |
EP1301345A4 (en) | 2004-11-17 |
CN1452554A (zh) | 2003-10-29 |
CN1651244A (zh) | 2005-08-10 |
WO2001089840A1 (en) | 2001-11-29 |
AU2000247314B2 (en) | 2004-10-21 |
US20120069096A1 (en) | 2012-03-22 |
JP4380962B2 (ja) | 2009-12-09 |
US8070260B2 (en) | 2011-12-06 |
DE60035618T2 (de) | 2008-07-03 |
US7547095B2 (en) | 2009-06-16 |
EP1301345B1 (en) | 2007-07-18 |
AU2000247314C1 (en) | 2005-10-06 |
ZA200209795B (en) | 2003-07-30 |
CN1198726C (zh) | 2005-04-27 |
IL166921A (en) | 2010-05-31 |
EP1301345A1 (en) | 2003-04-16 |
US20090237449A1 (en) | 2009-09-24 |
US8382251B2 (en) | 2013-02-26 |
US7169316B1 (en) | 2007-01-30 |
US20070080980A1 (en) | 2007-04-12 |
AU4731400A (en) | 2001-12-03 |
US7887161B2 (en) | 2011-02-15 |
DE60035618D1 (de) | 2007-08-30 |
JP2003534168A (ja) | 2003-11-18 |
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