CN100403123C - Light source assembling structure of back light module - Google Patents
Light source assembling structure of back light module Download PDFInfo
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- CN100403123C CN100403123C CNB2004100586584A CN200410058658A CN100403123C CN 100403123 C CN100403123 C CN 100403123C CN B2004100586584 A CNB2004100586584 A CN B2004100586584A CN 200410058658 A CN200410058658 A CN 200410058658A CN 100403123 C CN100403123 C CN 100403123C
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- backboard
- substrate
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- light sources
- assembling structure
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Abstract
The present invention provides a light source assembling structure of a back light assembly. The structure comprises at least one light source group and a back plate, wherein the light source group is provided with at least one light emitting assembly and a baseplate; the back plate is provided with at least one salient. The baseplate is arranged on the back plate in a removable mode and is tightly held by the back plate and the salient.
Description
Technical field
The present invention relates to a kind of light sources assembling structure, relate in particular to a kind of LED source package assembly that is applied to a backlight assembly of liquid crystal display.
Background technology
In recent years, various display techniques are constantly flourish, after the research and development that continue, as new products such as LCD, plasma display, organic light emitting diode display, commercialization gradually also is applied to various sizes and the display device of various areas.Present whole display industry is invariably towards high brightness and high efficiency development, in the hope of producing the display product that has more commercial value.And in the middle of the various key parts and components of LCD, be used for supplying the backlight assembly of light source, luminescence efficiency to LCD integral body has very important influence power, when backlight assembly itself has good luminescence efficiency, not only can improve the brightness of LCD, the elasticity that other component design in the LCD also is provided and has made, but when the luminescence efficiency of backlight assembly itself is not good, the light source that can provide is limited, has often limited the brightness performance of lcd products.
In the luminescence efficiency that improves backlight assembly, the luminescence efficiency that improves luminescence component is an improvement scheme commonly used.Yet, when improving the luminescence efficiency of luminescence component, inevitably, must deal carefully with the problem of its heat radiation again, otherwise, still can not implement the scheme of improving luminescence efficiency.Therefore the dealer drops into manpower and other resource one after another, in the hope of designing and produce the product that share, not only satisfies the demand of lcd products, can both reach requirement again on luminescence efficiency and heat-sinking capability.Except that this, whether easyly must consider on the operation, and whether cost is reasonable.
With reference to figure 1, Fig. 1 is the diagrammatic cross-section of the LED source package assembly 10 in the backlight assembly of known technology.As shown in Figure 1, known LED source package assembly 10 comprises: a LED source 12, is used for carrying the metal substrate 14 of LED source 12, and a backboard 16.LED source 12 is soldered to the surface of metal substrate 14, and metal substrate 14 is fixed on the backboard 16 by a plurality of screws 18 and a plurality of nut 22.When light autoluminescence diode light-source 12 emits, follow and the heat that produces will conduct to backboard 16 via metal substrate 14, conduct to again in the air, to reach the purpose of heat radiation.
But, if want to reach the purpose of abundant heat radiation, above-mentioned heat radiation approach must contact well, to avoid other bad heat eliminating mediums such as air to have influence on whole rate of heat dispation, cause heat radiation bad even, and then make the circuit (not shown) on LED source 12 or metal substrate 14 and the backboard 16 impaired.Therefore, with screw 18 and nut 22 metal substrate 14 is fixed to backboard 16 in the known technology, power when locking to nut 22 by screw 18, closely seize metal substrate 14 and backboard 16 on both sides by the arms, make the surface of contact of metal substrate 14 in the above-mentioned heat radiation approach and backboard 16 complete good, so so long as when the welding of 14 of LED source 12 and metal substrates is good, the integral heat sink ability of LED source package assembly 10 just can reach requirement.
Yet, though such design is enough to closely seize on both sides by the arms metal substrate 14 and backboard 16, so that the heat-sinking capability of LED source package assembly 10 reaches expection, but but must use screw 18 and nut 22 to do assembling, too complicated when assembling, cause the increase of various manpowers and material resources cost.And the quantity of screw and nut, according to actual needs, though can be different, but can not have only sparse several, especially in some large-scale backlight assemblies, be equiped with under the situation of tens of or hundreds of LED source the quantity of employed screw and nut easily, must be very considerable, highlighted such problem more.
Therefore, how to develop and a kind of new LED source package assembly, it not only can closely be seized metal substrate to backboard on both sides by the arms, make each the surface of contact contact in the heat radiation approach good, and then make the heat-sinking capability of LED source package assembly reach expection, and be easy to assembling again, be unlikely to the problem that has assembling too complicated, simultaneously have low cost again, just become crucial problem.
Summary of the invention
Therefore the purpose of this invention is to provide the LED source package assembly in a kind of backlight assembly, to address the above problem.
In preferred embodiment of the present invention, a kind of light sources assembling structure of backlight assembly is provided, this structure comprises an at least one light sources and a backboard, and this light sources has an at least one light emitting diode and a substrate, and this backboard has at least one punching press teat.Wherein this substrate is arranged on this backboard in the mode that can extract, and this substrate is closely seized on both sides by the arms by this backboard and this punching press teat.
Because the LED source package assembly in the backlight assembly of the present invention, at least one teat of backboard and the spacing of backboard are less than the thickness of substrate, and because the material of backboard itself has elasticity, therefore substrate can be set in the mode that can extract on the backboard, and at least one corner or at least one side of substrate are closely seized on both sides by the arms by backboard and at least one teat simultaneously.Utilize backboard and teat for the power of seizing on both sides by the arms that substrate applied, substrate not only can closely be fixed on the backboard, and the surface of contact between substrate and backboard also will be very complete good.So so long as when the welding between LED source and substrate is good, the heat of being supervened when light autoluminescence diode light-source emits will conduct to backboard via substrate rapidly, conducts in the air again, reaches the purpose of abundant heat radiation.Owing to LED source package assembly of the present invention, release or part are exempted the use of falling screw fully, therefore can not cause that assembling is too complicated, to such an extent as to the problem that raises the cost simultaneously.
Description of drawings
Fig. 1 is the diagrammatic cross-section of the LED source package assembly in the backlight assembly of known technology.
Fig. 2 is the diagrammatic cross-section of the LED source package assembly in the backlight assembly of first embodiment of the invention.
Fig. 3 is the last diagrammatic sketch of the LED source package assembly in the backlight assembly of Fig. 2.
Fig. 4 is the last synoptic diagram of the LED source package assembly in the backlight assembly of second embodiment of the invention.
Fig. 5 is the diagrammatic cross-section of the LED source package assembly in the backlight assembly of third embodiment of the invention.
Fig. 6 is the diagrammatic cross-section of the LED source package assembly in the backlight assembly of fourth embodiment of the invention.
Fig. 7 is the diagrammatic cross-section of the LED source package assembly in the backlight assembly of fifth embodiment of the invention.
Running synoptic diagram when Fig. 8 is applied to LCD for the LED source package assembly in the backlight assembly of the present invention.
The reference numeral explanation:
10,100,200,300,406, LED source package assembly
330、360
12,102,202,302 LED source
14 metal substrates
16,106,206,306,336, backboard
366
18,314 screws
22,316 nuts
104,204,304,334,364 substrates
108,208,308,338,368 punching press teats
112,212 teats
114 sides, 214 corners
116,216 conductive materials, 312 screws
348 screw copper posts, 378 rivets
400 LCD, 402 backlight assemblies
404 liquid crystal panels, 408 light guide plate
412 liquid crystal molecules
Embodiment
With reference to figure 2 and Fig. 3, Fig. 2 is the diagrammatic cross-section of the LED source package assembly 100 in the backlight assembly of first embodiment of the invention, and Fig. 3 is the last diagrammatic sketch of the LED source package assembly 100 in the backlight assembly of Fig. 2.As Fig. 2 and shown in Figure 3, LED source package assembly 100 of the present invention comprises that at least one LED source 102, is used for carrying the substrate 104 of LED source 102, and a backboard 106.LED source 102 is soldered to the surface of substrate 104, substrate 104 is one by the made substrate of metal material, so that can conduct the heat of dispersing out, and the material of substrate is to can be aluminium, copper, aluminium alloy or aldary by LED source 102.Backboard 106 is also made by metal material, and the material of backboard 106 is to can be stainless steel, aluminium, aluminium alloy or galvanized steel plain sheet.
Have at least one punching press teat 108 on the backboard 106, punching press teat 108 may have different shapes after through special design, and for example its teat 112 may be V-shape, plane, camber, sawtooth pattern etc.No matter but its shape why, at least one teat 112 of punching press teat 108 and the spacing of backboard 106 are less than the thickness of substrate 104.And because backboard 106 metal materials own have elasticity, the mode that therefore substrate 104 can extract is set on the backboard 106, and at least one side 114 of substrate 104 is closely seized on both sides by the arms by backboard 106 and 108 of at least one punching press teats simultaneously.Except that this, because in fact substrate 104 might non-ly contact fully with backboard 106, making has air layer to exist therebetween, and the thermal conduction effect of air is very poor, therefore, and in order to reduce the chance that air layer exists between substrate 104 and the backboard 106, often add Heat Conduction Material 116, as heat-conducting glue or heat-conducting cream etc.,, and then increase thermal conduction effect with the minimizing air layer.And whether add conductive material 116, or deny whole coating, fully according to the actual needs, be among Fig. 2 to add that conductive material 116 and whole coating are example.Under such situation, not only substrate 104 can be fixed on the backboard 106, and also because the power of seizing on both sides by the arms that backboard 106 and punching press teat 108 are applied for substrate 104, the surface of contact of substrate 104 and backboard 106 will be very complete good.So so long as when the welding of 104 of LED source 102 and substrates is good, the heat of following when light autoluminescence diode light-source 102 emits and producing, to conduct to backboard 106 via substrate 104 and conductive material 116 rapidly, conduct to again in the air, reach the purpose of abundant heat radiation.And during owing to making punching press teat 108, utilize the mode of punching press to come to backboard 106 processing, so backboard 106 is one-body molded with punching press teat 108, therefore under the prerequisite that can reach tight fixing base 104, can select punching press teat 108 is made in the outer rim of backboard 106 as far as possible, be unlikely to have influence on the heat-sinking capability of backboard 106 fully.
In addition, the function of substrate 104 except be used for carrying LED source 102 and heat conduction, by also being provided with various circuit (not shown)s thereon, also have the function that LED source of providing 102 is electrically connected to other assembly.Exactly because it is also like this, the heat dissipation problem of LED source package assembly 100 must be dealt carefully with, because when radiating treatment is bad, not only can cause the damage of the circuit (not shown) on substrate 104 and the backboard 106, also make LED source 102 impaired easily.Because the structure that is provided in the present embodiment does not use screw fully, therefore can not cause problems such as assembling is too complicated, cost is enhanced.
With reference to figure 4, Fig. 4 is the last synoptic diagram of the LED source package assembly 200 in the backlight assembly of second embodiment of the invention.As shown in Figure 4, LED source package assembly 200 of the present invention comprises that at least one LED source 202, is used for carrying the substrate 204 of LED source 202, and a backboard 206.LED source 202 is soldered to the surface of substrate 204, and substrate 204 and backboard 206 are made by metal material, so that can conduct the heat of being dispersed out by LED source 202.Have at least one punching press teat 208 on the backboard 206, punching press teat 208 may have different shapes after through special design.No matter but its shape why, at least one teat 212 of punching press teat 208 and the spacing of backboard 206 are less than the thickness of substrate 204.And because backboard 206 metal materials own have elasticity, the mode that therefore substrate 204 can extract is set on the backboard 206, and at least one corner 214 of substrate 204 is closely seized on both sides by the arms by backboard 206 and 208 of at least one punching press teats simultaneously.
Except that this, because in fact substrate 204 might non-ly contact fully with backboard 206, making has air layer to exist therebetween, the thermal conduction effect of air is very poor, therefore, and in order to reduce the chance that air layer exists between substrate 204 and the backboard 206, often add Heat Conduction Material 216, as heat-conducting glue or heat-conducting cream etc.,, and then increase thermal conduction effect with the minimizing air layer.And whether add conductive material 216, or deny whole coating, fully according to the actual needs, be among Fig. 4 to add that conductive material 216 and whole coating are example.Under such situation, not only substrate 204 can be fixed on the backboard 206, and also because the power of seizing on both sides by the arms that backboard 206 and punching press teat 208 are applied for substrate 204, the surface of contact of substrate 204 and backboard 206 will be very complete good.So so long as when the welding of 204 of LED source 202 and substrates is good, the heat of following when light autoluminescence diode light-source 202 emits and producing, to conduct to backboard 206 via substrate 204 and conductive material 216 rapidly, conduct to again in the air, reach the purpose of abundant heat radiation.In addition, the other parts in the present embodiment are identical with first embodiment.
It should be noted that, also can use side and the corner that punching press teat and backboard are closely seized substrate on both sides by the arms simultaneously among the present invention, reach same purpose, and be arranged at the number of substrates on the backboard, and be arranged at LED source quantity on the substrate, all can adjust not special restriction according to actual conditions.Except that this, the present invention also can use screw, nut and punching press teat simultaneously substrate is fixed to backboard, and reaches the purpose that reduces screw, nut usage quantity simultaneously.With reference to figure 5, Fig. 5 is the diagrammatic cross-section of the LED source package assembly 300 in the backlight assembly of third embodiment of the invention.As shown in Figure 5, LED source package assembly 300 of the present invention comprises: a LED source 302, is used for carrying the substrate 304 of LED source 302, and a backboard 306.LED source 302 is soldered to the surface of substrate 304, and substrate 304 and backboard 306 are made by metal material, so that can conduct the heat of being dispersed out by LED source 302.In order to reduce the chance that air layer exists between substrate 304 and the backboard 306, optionally Heat Conduction Material is added between substrate 304 and the backboard 306, and then increases thermal conduction effect, and be among Fig. 5 not add that conductive material is an example.
On the backboard 306 except have at least one punching press teat 308, also has at least one screw 312 simultaneously, therefore, substrate 304 is not only by backboard 306 and 308 of punching press teats and is closely seized on both sides by the arms, also simultaneously is fixed to backboard 306 by screw 314 and nut 316.Under this situation, the power of seizing on both sides by the arms that is applied for substrate 304 by backboard 306 and punching press teat 308, and the power of screw 314 when locking to nut 316, the surface of contact of substrate 304 and backboard 306 will be very complete good.So so long as when the welding of 304 of LED source 302 and substrates is good, the heat of following when light autoluminescence diode light-source 302 emits and producing, to conduct to backboard 306 via substrate 304 rapidly, conduct to again in the air, reach the purpose of abundant heat radiation.Though still used screw and nut partly in the present embodiment, but teat replaces because screw partly and nut have been stamped, so problem such as will effectively improve coping screw in the known technology, nut quantity is too many, and caused assembling is too complicated, cost is enhanced.In addition, the other parts of present embodiment are identical with first embodiment.
With reference to figure 6, Fig. 6 is the diagrammatic cross-section of the LED source package assembly 330 in the backlight assembly of fourth embodiment of the invention.As shown in Figure 6, in the LED source package assembly 330 in the backlight assembly of fourth embodiment of the invention, nut also can be replaced by the screw copper post 348 of imbedding backboard 336, add the power of seizing on both sides by the arms that punching press teat 338 is applied for substrate 334, substrate 334 is fixed to backboard 336.With reference to figure 7, Fig. 7 is the diagrammatic cross-section of the LED source package assembly 360 in the backlight assembly of fifth embodiment of the invention.As shown in Figure 7, also can use rivet 378 in the LED source package assembly 360 of the present invention, add the power of seizing on both sides by the arms that punching press teat 368 is applied for substrate 364, substrate 364 is fixed to backboard 366.
With reference to figure 8, the running synoptic diagram when Fig. 8 is applied to LCD 400 for the LED source package assembly in the backlight assembly of the present invention.As shown in Figure 8, comprise in the LCD 400 that a backlight assembly 402 and is arranged at the liquid crystal panel 404 of its top, in the backlight assembly 402 except comprise LED source package assembly 406, also comprise at least one light guide plate 408, and LED source package assembly 406 can be disclosed any LED source package assembly among the present invention.The light that is emitted from LED source package assembly 406, will inject light guide plate 408 in, optics mechanism (not shown) via light guide plate 408 inside becomes uniform surface light source then, be directed to liquid crystal panel 404 again, after the continuous refraction through liquid crystal molecule 412 in the liquid crystal panel 404, produce image at last.
Because the LED source package assembly of backlight assembly of the present invention utilizes backboard and teat for the power of seizing on both sides by the arms that substrate applied, and substrate closely is fixed on the backboard, make the surface of contact of substrate and backboard very complete good.So so long as when the welding between LED source and substrate is good, follow when light autoluminescence diode light-source emits and the heat that produces, will conduct to backboard via substrate rapidly, conduct to again in the air, reach the purpose of abundant heat radiation.When the LED source package assembly of using backlight assembly of the present invention during, can produce and conform with the heat radiation specification, be convenient to assembling and product cheaply in an actual production line.
Compare with the LED source package assembly of known backlight assembly, the LED source package assembly of backlight assembly of the present invention, at least one teat of backboard and the spacing of backboard are less than the thickness of substrate.Because the material of backboard itself has elasticity, thus, the mode that substrate can extract is set on the backboard again, and at least one corner or at least one side of substrate are closely seized on both sides by the arms by backboard and at least one teat simultaneously.Utilize backboard and teat for the power of seizing on both sides by the arms that substrate applied, substrate not only can closely be fixed on the backboard, and the surface of contact between substrate and backboard also will be very complete good.So so long as when the welding between LED source and substrate is good, the heat of being supervened when light autoluminescence diode light-source emits will conduct to backboard via substrate rapidly, conducts in the air again, reaches the purpose of abundant heat radiation.Owing to LED source package assembly of the present invention, release or part are exempted the use of falling screw fully, therefore can not cause that assembling is too complicated, to such an extent as to the problem that raises the cost simultaneously.
The above only is preferred embodiment of the present invention, and all equalizations of being done according to claims scope of the present invention change and modify, and all should belong to covering scope of the present invention.
Claims (8)
1. the light sources assembling structure of a backlight assembly comprises:
At least one light sources, this light sources have an at least one light emitting diode and a substrate; And
One backboard, this backboard have at least one first punching press teat;
Wherein this substrate is arranged on this backboard in the mode that can extract, and this substrate is closely seized on both sides by the arms by this backboard and this first punching press teat.
2. light sources assembling structure as claimed in claim 1 is characterized in that: the material of this substrate comprises aluminium, copper, aluminium alloy or aldary.
3. light sources assembling structure as claimed in claim 1 is characterized in that: at least one teat of this first punching press teat and the spacing of this substrate are less than the thickness of this backboard.
4. light sources assembling structure as claimed in claim 1 is characterized in that: this light sources assembling structure also comprises at least one fixed mechanism, this fixed mechanism in order to this substrate of tight locking to this backboard.
5. light sources assembling structure as claimed in claim 4 is characterized in that: this fixed mechanism comprises a screw, a rivet, a nut or a screw copper post.
6. light sources assembling structure as claimed in claim 1 is characterized in that: the material of this backboard comprises stainless steel, aluminium, aluminium alloy or galvanized steel plain sheet.
7. light sources assembling structure as claimed in claim 1 is characterized in that: this light emitting diode is welded on this substrate.
8. light sources assembling structure as claimed in claim 1 is characterized in that: between this substrate and this backboard heat-conducting piece is arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100586584A CN100403123C (en) | 2004-07-27 | 2004-07-27 | Light source assembling structure of back light module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100586584A CN100403123C (en) | 2004-07-27 | 2004-07-27 | Light source assembling structure of back light module |
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| Publication Number | Publication Date |
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| CN1588204A CN1588204A (en) | 2005-03-02 |
| CN100403123C true CN100403123C (en) | 2008-07-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2004100586584A Active CN100403123C (en) | 2004-07-27 | 2004-07-27 | Light source assembling structure of back light module |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI361316B (en) | 2007-07-11 | 2012-04-01 | Au Optronics Corp | Backlight module structure and backlight module comprising said structure |
| CN102661582A (en) * | 2012-05-31 | 2012-09-12 | 南京中电熊猫液晶显示科技有限公司 | LED (light-emitting diode) luminous bar fixing device, backlight source module and liquid crystal display device |
| CN104423093A (en) * | 2013-08-30 | 2015-03-18 | 鸿富锦精密工业（深圳）有限公司 | Display device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5166815A (en) * | 1991-02-28 | 1992-11-24 | Novatel Communications, Ltd. | Liquid crystal display and reflective diffuser therefor including a reflection cavity section and an illumination cavity section |
| JP2002162626A (en) * | 2000-11-22 | 2002-06-07 | Sony Corp | Heat radiating device of light source for liquid crystal display and its manufacturing method |
-
2004
- 2004-07-27 CN CNB2004100586584A patent/CN100403123C/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5166815A (en) * | 1991-02-28 | 1992-11-24 | Novatel Communications, Ltd. | Liquid crystal display and reflective diffuser therefor including a reflection cavity section and an illumination cavity section |
| JP2002162626A (en) * | 2000-11-22 | 2002-06-07 | Sony Corp | Heat radiating device of light source for liquid crystal display and its manufacturing method |
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| CN1588204A (en) | 2005-03-02 |
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