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Número de publicaciónCN100417523 C
Tipo de publicaciónConcesión
Número de solicitudCN 200510053799
Fecha de publicación10 Sep 2008
Fecha de presentación24 May 2000
Fecha de prioridad24 May 2000
También publicado comoCN1657290A
Número de publicación200510053799.1, CN 100417523 C, CN 100417523C, CN 200510053799, CN-C-100417523, CN100417523 C, CN100417523C, CN200510053799, CN200510053799.1
Inventores卡·西尔弗布鲁克
Solicitante西尔弗布鲁克研究有限公司
Exportar citaBiBTeX, EndNote, RefMan
Enlaces externos:  SIPO, Espacenet
Ink-jet printing head with isolated nozzle controller
CN 100417523 C
Resumen  traducido del chino
本发明提供一种喷墨打印头,其包括至少一个喷嘴组件,每个所述喷嘴组件包括:一个能够移动的喷嘴,所述喷嘴具有一个限定喷嘴开口的花冠部分以及从花冠部分上延伸出的一个裙边部分,所述喷嘴开口与一个用于容置墨水的喷嘴腔流体连通,所述裙边部分限定所述喷嘴腔的外壁的一部分,而且在喷嘴腔的一底板上限定有一个墨水入口孔,环绕所述墨水入口孔设置的围墙限定所述喷嘴腔外壁的第二部分;一个能够控制所述喷嘴移动的热弯曲型控制器;以及一个将所述热弯曲型控制器连接到所述喷嘴的连接部件;其中,在使用中,当所述热弯曲型控制器受热弯曲时,所述连接部件将运动传递给所述喷嘴使得所述喷嘴产生位移,从而通过所述开口由所述喷嘴腔喷射墨水。 The present invention provides an ink jet print head, comprising at least one nozzle assembly, each of said nozzle assembly comprising: a movable nozzle, the nozzle having a crown portion defining a nozzle opening and extending from the upper portion of the corolla a skirt portion, said nozzle receiving opening and an ink nozzle for fluid communication with the chamber, said skirt portion defining a portion of the outer wall of the nozzle chamber, and on a bottom plate defining a nozzle chamber ink inlet holes around the ink inlet aperture settings chamber walls defining a second portion of the outer wall of the nozzle; one capable of controlling the movement of heat curved nozzle controller; and a thermal bend the controller is connected to the the nozzle connecting member; wherein, in use, when the heated heat bendable bending controller, said motion transmitting member is connected to said nozzle such that the nozzle is displaced, so that by the opening of the nozzle by the chamber to eject ink.
Reclamaciones(5)  traducido del chino
1. 一种喷墨打印头,其包括至少一个喷嘴组件,每个所述喷嘴组件包括: 一个能够移动的喷嘴,所述喷嘴具有一个限定喷嘴开口的花冠部分以及从花冠部分上延伸出的一个裙边部分,所述喷嘴开口与一个用于容置墨水的喷嘴腔流体连通,所述裙边部分限定所述喷嘴腔的外壁的一部分,而且在喷嘴腔的一底板上限定有一个墨水入口孔,环绕所述墨水入口孔设置的围墙限定所述喷嘴腔外壁的第二部分; 一个能够控制所述喷嘴移动的热弯曲型控制器;以及一个将所述热弯曲型控制器连接到所述喷嘴的连接部件; 其中,在使用中,当所述热弯曲型控制器受热弯曲时,所述连接部件将运动传递给所述喷嘴使得所述喷嘴产生位移,从而通过所述开口由所述喷嘴腔喷射墨水。 An ink jet print head, comprising at least one nozzle assembly, each of said nozzle assembly comprising: a movable nozzle, the nozzle having a crown portion defining a nozzle opening and extending from the crown portion skirt portion, said nozzle receiving opening and an ink nozzle for fluid communication with the chamber, said skirt portion defining a portion of the outer wall of the nozzle chamber, and the chamber defining a bottom nozzle has an ink inlet hole around the walls of the ink inlet hole set defines a second portion of the outer wall of the nozzle chamber; a nozzle capable of controlling the movement of heat bending controller; and a thermal bend the controller is connected to the nozzle The connecting member; wherein, in use, when the heated heat bendable bending controller, said motion transmitting member is connected to said nozzle such that the nozzle is displaced, thereby opening from said chamber through said nozzle ejecting ink.
2. 如权利要求1所述的打印头,其特征在于,当所述裙边部分通过所述热弯曲型控制器的致动而相对于所述喷嘴腔的底板移位时,所述围墙用于作为抑制墨水从所述喷嘴腔中漏出的抑制装置。 2. The print head according to claim 1, characterized in that when the skirt portion bent by the heat controller with respect to actuation of the nozzle chamber floor shift, the fences As the ink to suppress leakage from the nozzle chamber suppression device.
3. 如权利要求1所述的打印头,其特征在于,所述热弯曲型控制器由两条梁构成, 一条作为主动梁,另一条作为被动梁。 Print head according to claim, wherein said heat controller consists of two curved beam constituted, as an active beam, the other as a passive beam.
4. 如权利要求1所述的打印头,其特征在于,所述热弯曲型控制器和所述喷嘴设置在一个基片上,且所述喷嘴腔设置在所述基片内;且每个梁的一端锚定到一个安装在所述基片上的锚片上,另一端与所述连接部件相连。 And each beam; printhead according to claim 4., characterized in that the heat controller and the curved nozzle disposed on a substrate, and the nozzle chamber is disposed within said substrate one end anchored to the anchor sheet mounted on the substrate, and the other end connected to said connecting member.
5.如权利要求1所述的打印头,其特征在于,所述连接部件包括一个臂,所述臂具有以悬臂方式与所述热弯曲型控制器连接的第一端和与所述喷嘴连接的第二端。 5. The print head according to claim 1, characterized in that said connecting member comprises an arm, said arm having a cantilever manner connected with the thermal bowing controller and a first end connected to the nozzle The second end.
Descripción  traducido del chino

带有隔离的喷嘴控制器的喷墨打印头本申请是2000年5月24日提出的题为"带有外装控制器的移动喷嘴的喷墨打印头"的中国专利申请00819573.0的分案申请。 The ink jet print head with a nozzle controller application isolation is entitled May 24, 2000's "move with the exterior controller nozzle ink jet print head," the Chinese patent application is a divisional application 00819573.0. 技术领域本发明涉及喷墨打印头,尤其涉及一种具有一个喷嘴阵列的喷墨打印头,其该喷嘴阵列中的每个喷嘴都为一个带有外装控制器的移动喷嘴。 TECHNICAL FIELD The present invention relates to an ink jet printhead, and more particularly to a nozzle having an array of ink jet print head, the nozzle array in which each nozzle has a moving nozzle with an exterior controller. 背景技术共同待批的专利申请与本发明有关的各种方法、系统和装置在下列共同待批的专利申请中揭示。 BACKGROUND Various methods of co-pending patent application with the present invention, a system and apparatus are disclosed in the following co-pending patent application in. 这些专利申请是本发明的专利申请人或受让人与本发明同时申请的:PCT/AU00/O0518,PCT/AU00/00519,PCT/AU00/00520,PCT/AU00/00521 ,PCT/AU00/00522,PCT/AU00/00523,PCT/AU00/00524,PCT/AU00/00525,PCT/AU00/00526,PCT/AU00/00527,PCT/AU00/00528,PCT/AU00/00529,PCT/AU00/00530,PCT/AU00/00531,PCT/AU00/00532,PCT/AU00/00533,PCT/AU00/00534,PCT/AU00/00535,PCT/AUO0/00536,PCT/AU00/00537,PCT/AU00/00538,PCT/AU00/00539,PCT/AU00/00540,PCT/AU00/00541,PCT/AD00/00542,PCT/AU00/00543,PCT/AU00/00544,PCT/AU00/00545,PCT/AU00/00547,PCT/AU00/00546,PCT/AU00/00554,PCT/AU00/00556,PCT/AU0O/0O557,PCT/AUOO/OO558,PCT/AU0O/00559,PCT/AUO0/00560,PCT/AU00/00561,PCT/AU00/00562,PCT/AU00/00563,PCT/AU00/00564,PCT/AUOO/OO565,PCT/AUOO/00566,PCT/AUOO/00567,PCT/AU00/00568,PCT/AU00/00573,PCT/AU00/00574,PCT/AU00/00575,PCT/AU00/00576, PCT/AU00/00577,PCT/AU00/00578,PCT/AU00/00579,PCT/AU00/00581, PCT/AU00/00580,PCT/AU00/00582,PCT/AU00/00587,PCT/AU00/00588, PCT/AU00/00589,PCT/AU00/00583,PCT/AU00/00593,PCT/AU00/00590, PCT/AU00/00591,PCT/AU00/00592,PCT/AU00/00584,PCT/AU00/00585, PCT/AU00/00586,PCT/AU00/00594,PCT/AU00/00595,PCT/AU00/00596, PCT/AU00/00597,PCT/AU00/00598,PCT/AU00/00516,PCT/AU00/00517, PCT/AUOO/00511 ,PCT/AU00/00501 ,PCT/AU00/00502,PCT/AU00/00503, PCT/AU00/00504,PCT/AU00/00505,PCT/AU00/00506,PCT/AU00/00507, PCT/AU00/00508,PCT/AU00/00509,PCT/AU00/00510,PCT/AU00/00512, PCT/AUOO/00513,PCT/AU00/00514,PCT/AU00/00515在此结合上述共同待批的专利申请作为交叉参考。 These patent applications are patent applicant or assignee of the present invention, the present invention also apply: PCT / AU00 / O0518, PCT / AU00 / 00519, PCT / AU00 / 00520, PCT / AU00 / 00521, PCT / AU00 / 00522 , PCT / AU00 / 00523, PCT / AU00 / 00524, PCT / AU00 / 00525, PCT / AU00 / 00526, PCT / AU00 / 00527, PCT / AU00 / 00528, PCT / AU00 / 00529, PCT / AU00 / 00530, PCT / AU00 / 00531, PCT / AU00 / 00532, PCT / AU00 / 00533, PCT / AU00 / 00534, PCT / AU00 / 00535, PCT / AUO0 / 00536, PCT / AU00 / 00537, PCT / AU00 / 00538, PCT / AU00 / 00539, PCT / AU00 / 00540, PCT / AU00 / 00541, PCT / AD00 / 00542, PCT / AU00 / 00543, PCT / AU00 / 00544, PCT / AU00 / 00545, PCT / AU00 / 00547, PCT / AU00 / 00546 , PCT / AU00 / 00554, PCT / AU00 / 00556, PCT / AU0O / 0O557, PCT / AUOO / OO558, PCT / AU0O / 00559, PCT / AUO0 / 00560, PCT / AU00 / 00561, PCT / AU00 / 00562, PCT / AU00 / 00563, PCT / AU00 / 00564, PCT / AUOO / OO565, PCT / AUOO / 00566, PCT / AUOO / 00567, PCT / AU00 / 00568, PCT / AU00 / 00573, PCT / AU00 / 00574, PCT / AU00 / 00575, PCT / AU00 / 00576, PCT / AU00 / 00577, PCT / AU00 / 00578, PCT / AU00 / 00579, PCT / AU00 / 00581, PCT / AU00 / 00580, PCT / AU00 / 00582, PCT / AU00 / 00587 , PCT / AU00 / 00588, PCT / AU00 / 00589, PCT / AU00 / 00583, PCT / AU00 / 00593, PCT / AU00 / 00590, PCT / AU00 / 00591, PCT / AU00 / 00592, PCT / AU00 / 00584, PCT / AU00 / 00585, PCT / AU00 / 00586, PCT / AU00 / 00594, PCT / AU00 / 00595, PCT / AU00 / 00596, PCT / AU00 / 00597, PCT / AU00 / 00598, PCT / AU00 / 00516, PCT / AU00 / 00517, PCT / AUOO / 00511, PCT / AU00 / 00501, PCT / AU00 / 00502, PCT / AU00 / 00503, PCT / AU00 / 00504, PCT / AU00 / 00505, PCT / AU00 / 00506, PCT / AU00 / 00507 , PCT / AU00 / 00508, PCT / AU00 / 00509, PCT / AU00 / 00510, PCT / AU00 / 00512, PCT / AUOO / 00513, PCT / AU00 / 00514, PCT / AU00 / 00515 in this co-pending combination of the above patent application by cross-reference. 在我们的共同待批的美国专利申请(申请号:09/112,821)中概要介绍了一种移动喷嘴装置。 In U.S. patent application (application number: 09 / 112,821) in our co-pending overview of a mobile nozzle device. 这种移动喷嘴装置通过一种磁控元件调节来控制移动喷嘴的位移,从而控制墨水的喷出。 This movement of the nozzle by means of a magnetic element adjustment device to control the movement of the nozzle of displacement, to control the discharge of the ink. 这种设计的一个问题是,移动喷嘴装置的部件必须进行憎水处理, 以防止墨水进入控制器区域中。 One problem with this design is that the member moving the nozzle means must be hydrophobic treatment, in order to prevent the ink into the control area. 本发明提供了一种不需要进行憎水处理的移动喷嘴装置。 The present invention provides a water repellent treatment does not require moving the nozzle means. 发明内容本发明提供了一种喷墨打印头,其包括至少一个喷嘴组件,每个所述喷嘴组件包括: 一个能够移动的喷嘴,所述喷嘴具有一个限定喷嘴开口的花冠部分以及从花冠部分上延伸出的一个裙边部分,所述喷嘴开口与一个用于容置墨水的喷嘴腔流体连通,所述裙边部分限定所述喷嘴腔的外壁的一部分,而且在喷嘴腔的一底板上限定有一个墨水入口孔,环绕所述墨水入口孔设置的围墙限定所述喷嘴腔外壁的第二部分; 一个能够控制所述喷嘴移动的热弯曲型控制器;以及一个将所述热弯曲型控制器连接到所述喷嘴的连接部件;其中,在使用中,当所述热弯曲型控制器受热弯曲时,所述连接部件将运动传递给所述喷嘴使得所述喷嘴产生位移,从而通过所述开口由所述喷嘴腔喷射墨水。 Summary of the Invention The present invention provides an inkjet printhead, comprising at least one nozzle assembly, each of said nozzle assembly comprising: a movable nozzle, the nozzle having a crown portion defining a nozzle opening and a portion from the corolla extending a skirt portion, said nozzle receiving opening and an ink nozzle for fluid communication with the chamber, said skirt portion defining a portion of the outer wall of the nozzle chamber, and a bottom plate defining the nozzle cavity has an ink inlet hole, surrounded by the walls of the ink inlet hole provided in the nozzle chamber outer wall defining a second portion; one capable of controlling the movement of heat curved nozzle controller; and a thermal bend the controller connection connected to the nozzle member; wherein, in use, when the heated heat bendable bending controller, said motion transmitting member is connected to said nozzle such that the nozzle is displaced, so that by the opening of the The nozzle chamber to eject ink. 在本发明中,"喷嘴" 一词应理解为带有一个开口的元件,而不是开口本身。 In the present invention, the term "nozzle" is to be understood as a component having an opening, rather than opening itself. 上述裙边部分可以相对于基片移动,更具体地说,该裙边部分可以相对基片往复位移,向前位移时,墨水得以喷出,向后位移时,可以向喷嘴腔中补充墨水。 Said skirt portion can be moved relative to the substrate, more specifically, the skirt portion may be displaced reciprocally relative to the substrate, the forward displacement of the ink to be ejected, when the rearward displacement of the nozzle can be added to the ink chamber. 在裙边部分位移时,上述围墙可以作为抑制装置, 防止墨水从喷嘴腔中漏出。 When the displacement of the skirt portion, said wall can be used as suppressing means to prevent leakage of ink from the nozzle chamber. 而且,该围墙最好具有内巻的唇边部分或刮拭部分,以作为一种密封手段。 Moreover, the wall preferably has a lip portion of the inner portion or wiper Volume to as a sealing means. 虽然上述唇边部分与裙边部分之间有一定间隙,但由于墨水粘度较高而且该间隙非常窄,当喷嘴向基片移动时, 唇边或刮拭部分可以防止墨水漏出。 Although there is a certain gap between the lip portion and the skirt portion, but due to the high viscosity of the ink and the gap is very narrow, when the nozzle is moved to the substrate, or wiper lip portion can prevent ink leakage. 上述控制器可以由两根横梁构成,其中的一根横梁作为主动梁,另外一根作为被动梁。 And the controller may be constituted by two beams, one of a beam as an active beam, the other as a passive beam. "主动梁"是指在控制器起动时,电流会流过该梁, 而"被动梁"上此时没有电流通过。 "Active beam" refers to when the controller is started, the current will flow through the beam, while "passive beam" on this point there is no current. 由于控制器的特殊构造,当电流流过主动梁时,主动梁由于电阻生热作用而发生膨胀,由于被动梁是受限的,所以弯曲运动被传给连接部件,从而使喷嘴产生位移。 Because of the special structure of the controller, when the current flows through the active beam, active beam due to the resistance of the heat effect and swell, as passive beam is limited, so the bending motion is transmitted to the connecting member so that the nozzle displacement. 上述梁可以在一端使用锚片固定,另一端从基片向上延伸并与连接部件相连。 You can use the beam anchor piece fixed at one end and the other end extending upwardly from the substrate and connected to the connecting member. 连接部件包括一条臂,臂的一端与控制器相连,另一端连接喷嘴,形成一种悬臂结构。 The connecting member comprises a leg, arm connected at one end to the controller, and the other end connected to the nozzle, forming a cantilever structure. 因此,与控制器相连的一端的弯曲运动在另一端被放大,使喷嘴产生所需的位移。 Thus, one end of the bending movement connected to the controller at the other end is enlarged, to produce the desired displacement of the nozzle. 打印头可以有多个喷嘴,每个喷嘴都有排列在基片上的对应的控制器和连接部件。 The print head may have a plurality of nozzles, each nozzle are arranged on a substrate corresponding to the controller and the connecting member. 每个喷嘴和其控制器和连接部件构成一个完整的喷嘴组件。 Each nozzle and its controllers and connecting parts to form a complete nozzle assembly. 打印头可由平面集成电路沉积、平版印刷和刻蚀工艺制造,而且喷嘴组件也可以使用这些工艺制作在打印头上。 Printhead by plane IC deposition, lithography and etching process, and nozzle assembly can also use these processes make the print head. 基片可以带有一集成的驱动电路层。 The substrate may be provided with an integrated drive circuit layer. 该集成驱动电路层可以使用CMOS加工工艺制造。 The integrated drive circuit layer can be manufactured using a CMOS process. 附图说明下面结合附图详细介绍本发明:图1是根据本发明实现的喷墨打印头的喷嘴组件的立体示意图;图2到图4是图1中的喷嘴组件的动作的立体示意图;图5是构成喷墨打印头的喷嘴阵列的立体图;图6是图5的喷嘴阵列的局部放大图;图7是带有一个喷嘴保护帽的喷墨打印头的立体图;图8a到8r是在喷墨打印头上制造喷嘴组件的步骤立体图; 图9a到9r是制造步骤的侧面剖视图;图10a到10k所示为在制造过程的各步骤中使用的模板布局;图lla到llc是根据图8和图9的方法制造的喷嘴组件的动作的立体图;图12a到12c是根据图8和图9制造的喷嘴组件的动作,侧面剖视图。 BRIEF DESCRIPTION OF THE DRAWINGS The following detailed description of the present invention: FIG. 1 is a perspective schematic view of a nozzle assembly in accordance with the present invention is implemented in an ink jet print head; FIG. 2 to FIG. 4 is a perspective schematic view of the operation of the nozzle assembly of FIG. 1; and FIG. 5 is a perspective view of an ink jet printhead nozzle array; FIG. 6 is a partially enlarged view of the nozzle array of FIG. 5; FIG. 7 is a perspective view of a protective cap having a nozzle ink jet printing head; FIG. 8a to 8r is sprayed manufacture of ink on the printhead nozzle assembly step perspective; Figure 9a to 9r is a side sectional view of manufacturing steps; shown in Fig. 10a to 10k template layout used in each step of the manufacturing process; Fig. lla to llc according to FIG. 8 and perspective view of the operation of the method of Figure 9 for manufacturing a nozzle assembly; Figures 12a to 12c based on the operation in FIG. 8 and FIG. 9 of manufacturing a nozzle assembly, a side cross-sectional view. 具体实施方式图1所示为根据本发明实现的一个喷嘴组件10。 DETAILED DESCRIPTION Figure 1 shows a nozzle assembly in accordance with the present invention is to achieve 10. 一个喷墨打印头带有多个上述喷嘴组件10,该喷嘴组件在硅基片16上形成一个阵列14(见图5和图6)。 An ink jet print head having a plurality of said nozzle assembly 10, the nozzle assembly 14 is formed in an array on a silicon substrate 16 (see FIG. 5 and FIG. 6). 喷嘴阵列14将在下面详细说明。 Nozzle array 14 will be described in detail below. 组件10包括一块沉积有一层电介质层18的硅基片(或者说硅晶片) 16。 Assembly 10 comprises a dielectric layer is deposited a layer 18 of a silicon substrate (or silicon wafer) 16. 在电介质层18上沉积有一层CMOS钝化层20。 Deposited on the dielectric layer 18 with a layer of CMOS passivation layer 20. 每个喷嘴组件10包含一个带有喷嘴开口24的喷嘴22、 一个杠杆臂26形式的连接部件,以及一个控制器28。 Each nozzle assembly 10 includes a nozzle 24 with a nozzle opening 22, a lever arm 26 forms the connecting member, and a controller 28. 杠杆臂26把控制器连接到喷嘴22上。 The lever arm 26 is connected to the controller 22 nozzles. 如图2到图4所示,喷嘴带有一个花冠部分30,从花冠部分30上延伸出一个裙边部分32。 FIG 2 to FIG. 4, the nozzle having a crown portion 30, extending from the crown portion 30 a skirt portion 32. 裙边部分32构成喷嘴腔34的外壁(见图2到图4)的一部分。 A portion of the skirt portion 32 constituting the outer wall of the nozzle chamber 34 (see FIG. 2 to FIG. 4). 喷嘴开口24与喷嘴腔34的液路相通。 The nozzle opening 24 and the nozzle chamber 34 of the fluid path communicating. 需要注意的是,喷嘴开口24有一圈凸缘36,该凸缘36使喷嘴腔34中的墨水40在凸沿上形成一个弯月面38 (见图2)。 It should be noted that the nozzle opening 24 with a ring flange 36, the flange 36 of the nozzle 40 of the ink chamber 34 to form a meniscus 38 (Fig. 2) on the ledge. 在喷嘴腔34的底部46上带有一个墨水入口孔42 (如图6中所示)。 Having an ink inlet hole 42 on the bottom of the chamber 34 of the nozzle 46 (shown in Figure 6). 墨水入口孔42与通过硅基片16的墨水进入通道48相通。 The ink through the ink inlet hole 42 and the silicon substrate 16 into the channel 48 communicates. 墨水入口孔42的外圈有一圈围墙50,围墙从底部46向上延伸。 The outer ring of the ink inlet hole 42 is a circular wall 50 extending upwardly from the bottom wall 46. 上述喷嘴22的裙边部分32构成喷嘴腔34外壁的第一部分,上述围墙50 构成喷嘴腔34的外壁的第二部分。 The skirt portion 22 of the nozzle 32 constitutes a first part of the outer wall of the nozzle chamber 34, said wall 50 constitutes the second portion 34 of the outer wall of the nozzle chamber. 围墙50的自由端具有向内翻转的唇边52,该唇边起密封墨水的作用, 当喷嘴22移动时,唇边52可以阻止墨水漏出。 The wall 50 has a free end turn inward lip 52, the lip seal ink from the role, when the nozzle 22 is moved, the lip 52 can prevent ink leakage. 由于墨水40的粘度较高, 而且唇边52与裙边部分32之间的间隙非常小,在墨水40的表面张力作用下,唇边52起到密封墨水的作用,防止墨水40从喷嘴腔34中漏出。 Due to the high viscosity of the ink 40, and the gap between the lip 52 and the skirt portion 32 is very small, the surface tension of the ink 40, the sealing lip 52 acts as the ink, prevents the ink from the nozzle chamber 34 40 leaking. 控制器28是一种热弯曲型调节装置,它与从硅基片16向上延伸的(更确切地说是从CMOS钝化层20向上延伸)锚片54连接。 The controller 28 is a thermal bend type adjustment means extending upwardly from the silicon substrate 16 (more precisely, 20 extend upwardly from the CMOS passivation layer) 54 connected to the anchor sheet. 锚片54 安装在导电垫片56上,导电垫片56作为与控制器28连接的电力连接通路。 Anchor piece 54 is mounted on the conductive pads 56, conductive pad 56 and the controller 28 is connected as a power connection path. 控制器28包括第一个梁(58,主动梁)和第二个粱(60,被动梁), 主动梁在被动梁的上面。 The controller 28 includes a first beam (58, active beam) and a second beam (60, passive beam), active beam above the passive beam. 在一个较佳实例中,梁58和梁60都由导电陶瓷材料构成或含有导电陶瓷材料(例如氮化钛TiN)。 In a preferred embodiment, the beam 58 and the beam 60 by the electrically conductive ceramic material consisting of or containing electrically conductive ceramic material (such as titanium nitride TiN). 梁58和梁60的第一端都固定到锚片54上,另一端与杠杆臂26连接。 A first end of the beam 58 and the beam 60 are secured to the anchor sheet 54, the other end of the lever arm 26 is connected. 当电流通过主动梁58时,梁58会由于电阻生热效应发生热膨胀。 When the current through the active beam 58, the beam 58 will occur due to the resistance of the heat effect of thermal expansion. 而被动梁60上没有电流通过,所以不会与主动梁58 -'起同时膨胀,因此,梁58和梁60会产生弯曲运动,导致杠杆臂26和喷嘴22向硅基片16位移,如图3所示。 But not passive beam 60 current through, it will not and active beam 58 - 'play at the same time expanded, so that the beam 58 and the beam 60 will have a bending motion, leading to the lever arm 26 and the nozzle 22 to the displacement of the silicon substrate 16, as shown in Figure 3. 此时,墨水会通过喷嘴开口24喷射出来,如图3 中的62。 In this case, ink may be ejected through the nozzle openings 24, 62 in FIG. 3. 当主动梁58上的热源消除后,即停止电流,喷嘴22将返回到其静态位置,如图4所示。 After the heat active beam 58 on the elimination of the current stops, the nozzle 22 returns to its static position, as shown in FIG. 当喷嘴22返回到其静态位置时,由于墨滴颈部被断开,会产生一滴墨64,如图4中标号66所示。 When the nozzle 22 returns to its static position, since the ink droplet neck is broken, will produce a drop of ink 64, as shown in Figure 4, reference numeral 66. 然后,墨滴64落到打印媒质上,例如一张纸。 Then, the droplet 64 falls on a print medium, such as a piece of paper. 由于墨滴64的形成,会产生一个如图4所示的反向弯月面68,。 Since the formation of drops 64, it will produce a reverse meniscus shown in FIG. 68 ,. 反向弯月面68导致墨水40流入喷嘴腔34,从而立即形成一个新的弯月面38 (见图2),为从喷嘴组件10喷出下一滴墨水做好准备。 Reverse meniscus 68 causes the ink 40 into the nozzle chamber 34, thus immediately forms a new meniscus 38 (see Figure 2), is ejected from the nozzle assembly 10 at a drop of ink ready. 现参考图5和图6,其中更详细地描绘了喷嘴阵列14。 Referring now to Figures 5 and 6, which depicts in greater detail a nozzle array 14. 喷嘴阵列14 用于四色打印头。 An array of nozzles 14 for four-color print head. 所以,该喷嘴阵列14由4个喷嘴组件组70构成,每一个喷嘴组件组提供一种颜色。 Therefore, the nozzle array 14 by the four groups 70 constituting the nozzle assembly, each nozzle assembly to provide a color group. 每个喷嘴组件组70中的喷嘴组件10设置为两个喷嘴组件排72和74。 Each nozzle assembly group 70 of the nozzle assembly 10 is provided as two rows 72 and 74 of the nozzle assembly. 图6中更详细地画出了喷嘴组件组70中的一个喷嘴组件10。 Figure 6 depicts in more detail the nozzle assembly 70 of a group of nozzle assembly 10. 为了更紧密地包装喷嘴组件排72和74中的喷嘴组件10,喷嘴组件排74中的喷嘴组件10相对于喷嘴组件排72中的喷嘴组件10错开一定距离或交错排列。 In order to more tightly packed rows 72 and 74 of the nozzle assembly of the nozzle assembly 10, ranked 74 in the nozzle assembly nozzle assembly 10 relative to the nozzle assembly 72. The nozzle assembly of row 10 is shifted a certain distance or staggered. 而且,喷嘴组件排72中的喷嘴组件10之间的距离足够大,以使喷嘴组件排74中的喷嘴组件的杠杆臂26通过喷嘴组件排72中相邻的喷嘴组件IO。 Moreover, discharge from the nozzle assembly 72 between the nozzle assembly 10 is large enough to enable the discharge nozzle assembly 74 of the lever arm 26 of the exhaust nozzle assembly 72 adjacent the nozzle assembly IO through the nozzle assembly. 需要说明的是,每个喷嘴组件io都i哑铃形的,因此,喷嘴组件排72中的喷嘴22嵌套于喷嘴组件排74中的相邻喷嘴组件10的喷嘴22和控制器28之间。 It should be noted that each nozzle assembly are i io dumbbell-shaped, and therefore, the discharge nozzle 72 of the nozzle assembly 22 nested within the nozzle assembly 74 in the row adjacent nozzles 22 and nozzle assembly 10 between the controller 28. 而且,为了便于更紧凑地包装喷嘴组件排72和74中的喷嘴22,每个喷嘴22都是六边形的。 Moreover, in order to facilitate more tightly packed rows 72 and 74 of the nozzle assembly of the nozzles 22, each nozzle 22 is hexagonal. 业界人士很容易知道,在实际使用中,当喷嘴22向硅基片16移动时,由于喷嘴开口24与喷嘴腔34有一个小角度,所以墨水在喷出时会稍稍偏离垂直方向。 It is easy to know the industry, in actual use, when the nozzle 22 is moved to the silicon substrate 16, since the nozzle opening 24 and the nozzle chamber 34 has a small angle, so that when the ink is ejected will slightly deviate from the vertical direction. 而图5和图6中的设计克服了这个问题。 And Figures 5 and 6 designed to overcome this problem. 在上述两个图中,喷嘴组件排72和74中的喷嘴组件10的控制器28沿同一方向延伸到喷嘴组件排72和74的一侧。 In both drawings, the nozzle assembly 72 and the row controller 74 of the nozzle assembly 28 of the extension 10 in the same direction to the discharge side of the nozzle assembly 72 and 74. 因此,从喷嘴组件排72中的喷嘴22 喷出的墨滴与从喷嘴组件排74中的喷嘴22喷出的墨滴相互平行,从而提高了打印质量。 Thus, from the nozzle rows 72 of the nozzle assembly 22 parallel to each other with the ink droplets jetted from the nozzles 74 of the nozzle assembly 22 discharge ink droplets ejected, thereby improving the print quality. 而且,如图5所示,硅基片16带有一些粘结垫76,这些粘结垫提供了经垫片56向喷嘴组件10的控制器28的电连接。 Further, as shown in FIG. 5, the silicon substrate 16 with a number of bonding pads 76, bonding pads which provide electrical connection via the pads 56 of the controller 28 to the nozzle assembly 10. 这些电连接通过CMOS 层(图中没有示出)形成。 These are electrically connected through CMOS layer (not shown) is formed. 请参考图7所示的本发明的一个实例。 Please one example 7 of the present invention with reference to FIG. 同时参考前图,两张图纸屮的符号是相互对应的。 While referring to the previous figure, two sheets Che symbols correspond to each other. 在本实例中,在喷嘴阵列14的硅基片16上安装了一个喷嘴保护帽80。 In this example, the nozzle array 14 of the silicon substrate 16 is mounted on a nozzle protection cap 80. 喷嘴保护帽80带有一个主体部分82,该主体部分82具有多个通道84。 The protective cap 80 having a nozzle body portion 82, 82 of the body portion 84 having a plurality of channels. 通道84与阵列14中的喷嘴组件10的喷嘴开口24相对应,当墨水从任何一个喷嘴开口24喷出时,墨滴在打到打印媒质之前会通过相应的通道84。 Nozzle channel 84 and nozzle assembly 14 in the array 10 corresponding to the opening 24, when any of the ink from the nozzle opening 24 is ejected before the ink droplets hit the print media 84 through the corresponding channel. 主体部分82与喷嘴组件10有一定间隙,由支杆或者说支柱86支撑。 Section 82 of the nozzle assembly body 10 has a certain gap, supported by struts or pillars 86. 其中一个支柱86带有一个进气开口88。 One of the pillars 86 with an inlet opening 88. 在使用时,当阵列14工作时,空气从进气开口88被吸入,并与墨水一起通过通道84。 In use, when the array 14 work, the air from the intake opening 88 is drawn, and together with the ink through the channel 84. 由于空气通过通道84的速度与墨滴64的速度不同,所以墨滴64不会受空气的影响。 As the air velocity through the passage 84 and the ink droplet 64 at different speeds, so the ink droplet 64 is not affected by the air. 例如,墨滴64从喷嘴22喷出的速度大约为3米/秒, 而空气通过通道84的速度大约为1米/秒。 For example, the ink droplet 64 discharged from the nozzle 22 the speed of about 3 m / s, while the air velocity through the channel 84 is about 1 m / sec. 空气的作用是使通道84不会夹杂异物颗粒。 Air role is to channel 84 will not be mixed with foreign particles. 如果某些异物(例如灰尘颗粒)落入到喷嘴组件10中,会对喷嘴产生不良影响。 If some foreign matter (e.g. dust particles) fall into the nozzle assembly 10, the nozzle will have a negative impact. 采用由喷嘴保护帽80的进气开口88强制送气的方式,能够在很大程度上避免上述问题。 By way of the nozzle protection cap 80 of the air intake opening 88 forcibly aspirated, the above problems can be avoided to a large extent. 请参考图8到图10,其中示出了制造喷嘴组件10的工艺过程。 Please refer to FIG. 8 to FIG. 10, which shows a manufacturing process of the nozzle assembly 10. 从硅基片(或者说硅晶片)16开始,在硅基片16的表面沉积一层电介质层(或者说氧化物层)18。 Starting from the silicon substrate (or silicon wafer) 16, the surface of the silicon substrate 16 is deposited a layer of a dielectric layer (or oxide layer) 18. 该电介质层18是一层1,5微米厚的CVD氧化物。 The dielectric layer 18 is a layer of 1,5 m thick CVD oxide. 在电介质层18上加一层抗蚀剂,然后使用模具100进行印刷处理。 Add a layer of resist on the dielectric layer 18, and then processed using a mold 100 for printing. 经过印刷处理后,使用等离子刻蚀方法把电介质层18刻蚀到硅基片16的层上,然后去掉抗蚀剂,清理电介质层18,经过上述步骤,墨水入口孔42就形成了。 After the printing process, using a plasma etching method to etch the dielectric layer 18 to the layer 16 of the silicon substrate, and then the resist is removed, cleaning the dielectric layer 18, after the above steps, the ink inlet hole 42 is formed. 在图8b中,在电介质层18上沉积0.8微米厚度的铝102,然后加一层抗蚀剂,使用模具104进行印刷处理。 In Figure 8b, the dielectric layer 18 is deposited in a thickness of 0.8 microns of aluminum 102, then add a layer of resist printing process using a mold 104. 然后,釆用等离子刻蚀方式把铝102刻蚀到电介质层18,去掉抗蚀剂,对该层进行清理。 Then, preclude the use of plasma etching the aluminum 102 mode dielectric layer 18 is etched to remove the resist, the layer is cleaned. 此工艺步骤形成了粘结垫以及与喷墨控制器28的互连通道。 This process step of forming the bonding pads and the controller 28 are interconnected with the ink jet channel. 互联通道连接到一个NMOS驱动晶体管和一个电源层,连接线路在CMOS层(图中没有示出) 形成。 Interconnection is connected to an NMOS drive transistor and a power supply layer, a connection line (not shown in FIG) layer is formed in CMOS. 然后,在所得到的装置上再沉积0.5微米厚的PECVD氮化物,作为CMOS钝化层20。 Then, on the resultant device redeposition 0.5 micron thick PECVD nitride as the CMOS passivation layer 20. 在钝化层20上加一层抗蚀剂,然后使用模具106进行印刷处理。 20 on the passivation layer add a layer of resist, then printing process using a mold 106. 经过印刷处理后,使用等离子刻蚀方法把氮化物刻蚀到铝102 的层上,在墨水入口孔42区域,应刻蚀到硅基片16的层上。 After the printing process, using plasma etching the nitride layer is etched onto the aluminum 102, in 42 regions of the ink inlet hole should be etched onto the silicon substrate layer 16. 去掉抗蚀剂,然后对设备进行清理。 The resist is removed, then the equipment clean. 在钝化层20上旋压一层牺牲层108。 20 on the passivation layer of spinning sacrificial layer 108. 该层108是6微米厚的感光聚酰亚胺或4微米厚的高温抗蚀剂。 The layer 108 is a 6 micron thick photosensitive polyimide or resist high temperatures 4 microns thick. 把层108烘干,然后使用模具110进行印刷处理。 The drying layer 108, and then printing process using a mold 110. 印刷处理后,如果层108由聚酰亚胺材料制成,那么应在400'C温度下对其烘烤1小时;如果层108由高温抗蚀剂构成,那么应在300'C以上的温度对其烘烤1小时。 After the printing process, if the layer 108 is made of a polyimide material, then it should at 400'C temperature baking one hour; if the resist layer 108 is constituted by a high temperature, then the temperature is at least 300'C its bake 1 hour. 需要注意的是,在设计模具110时, 应考虑到由缩水所导致的牺牲层108的图案扭曲。 It should be noted that, in the design of the mold 110, taking into account the sacrificial layer 108 caused by the shrinking of the pattern distortions. 下一步,如图8e所示,在产品上加第二层牺牲层112。 Next, as shown in Figure 8e, the second layer of the product plus the sacrificial layer 112. 牺牲层112 可以是旋压的2微米厚的感光聚酰亚胺,也可以是1.3微米厚的高温抗蚀剂。 The sacrificial layer 112 may be a 2 micron thick spinning photosensitive polyimide, it may be 1.3 micron thick resist high temperatures. 牺牲层112烘干后,使用模具114进行印刷处理。 After drying the sacrificial layer 112, using a mold 114 for printing processing. 经过印刷处理后, 对于由聚酰亚胺构成的牺牲层112,应在40(TC下烘烤1小时;对于由高温抗蚀剂构成的牺牲层112,应在30(TC以上的温度下烘烤1小时左右。然后,在产品上沉积一层0.2微米厚的多层金属层116。该金属层116 的一部分将构成控制器28的被动梁60。金属层116的加工方法是:在30(TC左右溅射1000A厚的氮化钛TiN, 然后溅射50A厚的氮化钽TaN,然后溅射50A厚的氮化钽TaN和IOOOA 厚的氮化钛TiN,最后再溅射1000A厚的厚的氮化钛TiN。也可以使用TiB2、 MoSi2或(Ti, Al) N代替TiN。然后,对金属层116使用模具118进行印刷处理,然后使用等离子刻蚀方法刻蚀到牺牲层112,下一步,小心地去掉加在金属层116上的防蚀剂,注意不要伤及牺牲层108或112。下一步,在金属层116上旋压一层4微米厚的感光聚酰亚胺或2.6微米厚的高温抗蚀剂,形成第三层牺牲层120。牺牲层120经过烘千后,使用模具122进行印刷处理。然后进行热烘。对于聚酰亚胺,应在40(TC下对牺牲层120烘烤1小时左右;对于高温抗蚀剂,应在30CTC以上对牺杵层120烘烤1小时左右。下一步,在牺牲层120上再沉积第二层多层金属层124。金属层124 的成分与金属层116相同,工艺方式也相同。需要说明的是,金属层li6 和金属层124都是导电层。然后,使用模具对金属层124进行印刷处理。下一步使用等离子刻蚀方法把金属层124刻蚀到牺牲层120 (聚酰亚胺或高温抗蚀剂),然后, 把加在金属层124上的抗蚀剂层小心地揭下来,注意不要伤及牺牲层108、 112或120。需要说明的是,金属层124的剩余部分将构成控制器28的主动梁58。下一步,在金属层124上旋压一层4微米厚的感光聚酰亚胺或2.6微米厚的高温抗蚀剂,形成第四层牺牲层128。牺牲层128经过烘干后,使用模具BO进行印刷处理,剩下图9k所示的孤立部分。然后,对于聚酰亚胺材料,应在40(TC下对牺牲层128的剩余部分烘烤1小时;对于高温抗蚀剂材料,应在30(TC以上的温度下对牺牲层128的剩余部分烘烤1小时。请参考图81,在上述产品上再沉积一层高杨氏模量的电介质层132。 电介质层132由1微米左右厚度的氮化硅或氧化铝构成。电介质层132 的沉积温度应低于牺牲层108、 112、 120、 128的热烘温度。 After the printing process, the sacrificial layer 112 made of polyimide, should be baked 1 hour at 40 (under TC; a high temperature for a sacrificial layer 112 composed of a resist should be baked at 30 (TC temperature above Roast for about 1 hour and then, in a part of the product deposited metal layers 0.2 micron thick layer 116. The metal layer 116 constituting the passive beam controller 60. The metal layer 28 116 processing methods are: 30 ( TC about 1000A thick sputtered titanium nitride TiN, then sputtered 50A thick tantalum nitride TaN, tantalum nitride and titanium nitride TiN and IOOOA thick TaN sputtering 50A thick, and finally sputtered 1000A thick thick titanium nitride TiN. may also be used TiB2, MoSi2 or (Ti, Al) N instead of TiN. Then, the metal layer 116 is processed using a mold 118 for printing, and then using a plasma etching method to etch the sacrificial layer 112, the next step Carefully remove the metal layer 116 is applied to the anti-corrosion agent, careful not to hurt the sacrificial layer 108 or 112. Next, spinning a layer of 4 microns thick metal layer 116 on a photosensitive polyimide or 2.6 microns thick The high temperature resist to form the third layer 120. The sacrificial layer 120 after the sacrificial layer after drying thousand, 122 perform the printing process using a mold and then thermally baked for polyimide should be 40 (for the sacrificial layer 120 under TC bake for about 1 hour; temperature for the resist, the above should 30CTC pestle sacrifice layer 120 is baked for about one hour Next, on the sacrificial layer 120 and then depositing a second layer of the multilayer metal layer 124. The metal layer 124. the same composition and the metal layer 116, the same process ways. Note that, the metal layer and the metal layer 124 are li6 conductive layer. Then, the metal layer 124 using a mold printing processing using a plasma etching method next metal layer 124 is etched into the sacrificial layer 120 (high-temperature polyimide or resist), then, to add a resist layer on the metal layer 124 is carefully peeled off, be careful not to hurt the sacrificial layer 108, 112 or 120 It should be noted that the remaining portion of the metal layer 124 constituting the active beam 28 of the controller 58. Next, the metal layer 124 on high-temperature spinning 4 m thick layer of photosensitive polyimide or 2.6 micrometer thick anti- etchant, forming the fourth layer 128. The sacrificial layer 128 after sacrificial layer drying, BO printing processing using a mold, the remaining parts shown in Fig. 9k isolated. Then, the polyimide material, should be 40 (TC on said product temperature for the resist material should be on the remaining portion of the sacrificial layer 128 is baked for one hour at 30 (TC temperature above refer to FIG. 81,; in the remaining portion of the sacrificial layer 128 is baked for one hour. and then depositing a layer of high Young's modulus dielectric layer 132. The dielectric layer 132 made of silicon nitride or aluminum oxide is about 1 micron thickness constituted. The deposition temperature of the dielectric layer 132 should be less than 108, 112, 120, 128 of the sacrificial layer heat drying temperature. 电介质层132 应具有高弹性模数、化学惰性以及对TiN的良好粘接性。 The dielectric layer 132 should have a high elastic modulus, chemical inertness and good adhesion of TiN. 下一步,在上述产品上在旋压一层2微米厚的感光聚酰亚胺或1.3微米厚的髙温抗蚀剂,形成第五个牺牲层134。 Next, the above-mentioned products in spinning a 2 micron thick layer of photosensitive polyimide or 1.3 micron thick Gao Wen resist to form the fifth sacrificial layer 134. 牺牲层134经过烘干后,使用模具136进行印刷处理。 After drying the sacrificial layer 134, the printing process using a mold 136. 然后,如果是聚酰亚胺材料,应在400'C下对牺牲层134的剩余部分烘烤1小时;如果是高温抗蚀剂,应在30(TC以上的温度下对牺牲层134的剩余部分烘烤1小时左右。然后,采用等离子刻蚀方法把电介质层132刻蚀到牺牲层128,注意不要伤及牺牲层134。上述步骤形成喷嘴开口24、杠杆臂26、以及喷嘴组件10的锚片54。下一步,在上述产品上沉积一层高杨氏模量的电介质层138。电介质层138的沉积方法是:在低于牺牲层108、 112、 120和128的热烘温度下,沉积一层0.2微米厚的氮化硅或氮化铝。下一步,如图8p所示,使用具有方向性的等离子刻蚀方法对电介质层138刻蚀0.35微米的深度。刻蚀的目的是从所有表面上清除电介质, 仅留下电介质层132和牺牲层134的侧壁上的电介质。此步骤形成喷嘴开口24周围的喷嘴凸缘36,该喷嘴凸缘36使墨水产生上述的弯月面。然后,在产品上加一层防紫外线(UV)胶带140,在硅基片16背面旋压一层4毫米后的抗蚀剂。然后使用模具142进行背面刻蚀处理,形成墨水进入通道48。然后从硅基片16上去掉防蚀剂。在硅基片16的背面贴一层防紫外线UV胶带(图中没有示出)。然后去掉胶带140。下一步,把牺牲层108、 112、 120、 128和134在氧等离子中进行处理,形成图8r和图9r中所示的最终的喷嘴组件10。为了便于参考,上述两图中的零件编号与图1中的编号相同,以反映喷嘴组件10的相关部件。图11和12所示为按照上述工艺过程制造的喷嘴组件10的工作示意图。这些附图与图2到图4对应。业内人士很容易了解,可以根据上述实例中描述的本发明进行各种等价的变化或修改。本发明的实例只用来阐明发明内容,不应限制发明的范围。任何根据本发明进行等价变化或修改的装置都应属于本发明的范围。 Then, if it is a polyimide material, should the remaining portion of the sacrificial layer 134 is baked for one hour at 400'C; if it is a high temperature resist, should be under 30 (TC temperature above sacrificial layer 134 remaining partially baked for about one hour. Then, a plasma etching method to etch the dielectric layer 132 to the sacrificial layer 128, careful not to hurt the sacrificial layer 134. The above step of forming the nozzle opening 24, lever arm 26, and the nozzle assembly 10 of the anchor sheet 54. Next, depositing a layer of high Young's modulus of the above product in the dielectric layer 138. The dielectric layer 138 deposition method is: lower than the sacrificial layer 108, 112, 120 and 128 of the heat drying temperature, deposition silicon nitride or aluminum nitride layer 0.2 micron thick. plasma etching method Next, as shown in Figure 8p, use directional dielectric layer 138 to etch depth 0.35 m. etching is intended from all Clear dielectric surface, leaving only the dielectric sidewall dielectric layer 132 and the sacrificial layer 134 on. This step of forming the nozzle opening 24 around the nozzle flange 36, the nozzle flange 36 to produce the above-mentioned ink meniscus. Then , add a layer of ultraviolet (UV) tape 140 on the product, the silicon substrate 16 in the back surface layer 4 mm after spinning resist is then performed using a die 142 backside etching treatment, and then forming the ink inlet passage 48. removed from the silicon substrate 16 corrosion inhibitor in the back of the silicon substrate 16 by sticking a UV UV tape (not shown) and then remove the tape 140. Next, the sacrificial layer 108, 112, 120, 128 and 134 were treated in an oxygen plasma to form Figure 8r and final nozzle assembly 10. For ease of reference, these two plans in the part number and the same number in Figure 1 shown in Figure 9r, to reflect the nozzle assembly 10 The associated components. The present invention and Figure 11 shows a schematic view of a nozzle assembly in accordance with the work of producing the above-described process 10. 2 to 4 correspond to these drawings FIG. insiders easily understood, can be described according to the above example 12 Various equivalent changes or modifications. Examples of the present invention is only intended to illustrate the content of the invention and should not limit the scope of the invention any means equivalent variations or modifications in accordance with the present invention should fall within the scope of the present invention.

Citas de patentes
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Clasificaciones
Clasificación internacionalB41J2/045, B41J2/14, B81B7/00, B41J2/135, B81B5/00
Eventos legales
FechaCódigoEventoDescripción
24 Ago 2005C06Publication
19 Oct 2005C10Request of examination as to substance
10 Sep 2008C14Granted
8 Jul 2015C17Cessation of patent right