CN100424124C - Manufacturing method of high dielectric constant low dielectric dissipation insulating resin - Google Patents
Manufacturing method of high dielectric constant low dielectric dissipation insulating resin Download PDFInfo
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- CN100424124C CN100424124C CNB2006100214947A CN200610021494A CN100424124C CN 100424124 C CN100424124 C CN 100424124C CN B2006100214947 A CNB2006100214947 A CN B2006100214947A CN 200610021494 A CN200610021494 A CN 200610021494A CN 100424124 C CN100424124 C CN 100424124C
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Abstract
The present invention relates to a preparation method of insulating resin with high dielectric constant and low dielectric loss. It is characterized by that it includes preparation of nano core-shell structure composite granules: using 0.1-10 weight portions of organics, adding said organics into 100-300 weight portions of acetone, heating to 20-60 deg.C, stirring and dissolving, adding 100 weight portions of nano-grade ferroelectric material, stirring and dispersing, heat-insulating for 10-15 h, vacuum suction-filtering, drying filter cake at 80-120 deg.C so as to obtain the nano composite granules with core-shell structure, and preparation of insulating resin: using high-speed dispersing machine to disperse the above-mentioned composite granules in phenolic resin or epoxy resin under the condition of 6000-8000 rpm so as to obtain the invented insulating resin.
Description
Technical field
The invention belongs to the composition of macromolecular compound, relating to a kind of is the manufacture method of the high dielectric constant low dielectric dissipation insulating resin of additive with nanometer core/shell structure matrix material.
Technical background
Along with the development trend of miniaturization of electronic products and multifunction, a large amount of capacitor assemblies that originally are installed in print circuit board surface more and more trend towards filming and are embedded in the wiring board.Require insulating material when having the low temperature workability in this embedded electrical condenser, have high dielectric constant and than low-dielectric loss, generally speaking, the dielectric loss of capacitor insulation material (tg δ) should be below 2%.
United States Patent (USP) 5,796,587,5,162,977,5,800,575 propose to lure electrical ceramic powder to prepare embedded electrical condenser high dielectric constant insulating material by force with the epoxy resin solution mixing; European patent EP 0902048A1 propose with ceramic powders such as barium titanate directly be mixed in polyimide or earlier with polyimide coating ceramic powder after hot pressing, and be prepared into the single or multiple lift high dielectric constant film; Chinese patent 03136112.9 proposes to add properties-correcting agent and makes high polar group upgrading resin in Resins, epoxy, be mixed with ceramic powder and form high dielectric constant insulating material; Chinese patent 02131239.7 proposes to make high dielectric constant material with metallic nickel, barium titanate and polyvinylidene difluoride (PVDF) mixing hot pressing; Chinese patent 03119260.2 proposes to fill the barium titanate more than 300 parts in 100 parts of body material M10, make high dielectric rubber combination; Chinese patent 90102967.X proposition is mixing with paracril and polypropylene, compacting forms film with high dielectric constant and low dielectric loss.
Only there is minority to use paracril in the above patent,, thereby can't reaches higher dielectric constant because the above-mentioned relatively ceramic powder of specific inductivity of paracril is low separately as weighting material; Great majority use high-dielectric-constant ceramics as additive in the above patent, but the ceramic powder particle diameter mostly is micron or submicron greatly, powder density is bigger, sedimentation in organic resin and solution thereof, layering easily, cause the tamped density and the homogeneity of matrix material not enough, can't reach higher dielectric constant; Although a few patents is used the nanometer particle size pottery, increase particles filled density, improved the specific inductivity of material, but owing to nanometer powder is not carried out surface modification, the specific surface energy that nano particle is huge causes viscosity increase, the filler loading level of the material of preparation to reduce the preparation process difficulty significantly.What is more important, high-dielectric-constant ceramics directly joins in the low-k organic insulation matrix resin in the above-mentioned patent, owing to the ceramic powder surface can form interfacial layer by the absorption organic resin, the existence of this interfacial layer badly influences ceramic powder body polarization performance, thereby the apparent dielectric constant that is shown during ceramic powder filled and its body specific inductivity exist than big-difference, with the kind of material, the deployment conditions of powder etc. much relations are arranged, and apparent dielectric constant often is lower than the body specific inductivity.
Summary of the invention
Purpose of the present invention is intended to overcome the defective that exists in the above-mentioned prior art, and a kind of high dielectric constant low dielectric dissipation insulating resin and manufacture method thereof are provided.
The inventive method is to be additive with a kind of Nano composite granules with core/shell structure, this Nano composite granules is to coat a kind of organism with high-k for " nuclear " material, on its surface with the nano grade inorganic ferroelectric particles to be " shell " material, a kind of nanometer core/shell structure composite particles of formation, this Nano composite granules with core/shell structure is dispersed in resol or the Resins, epoxy and makes the insulating resin with high dielectric constant and low dielectric loss performance.
Content of the present invention is: plant the manufacture method of high dielectric constant low dielectric dissipation insulating resin, it is characterized in that comprising the following steps:
(1) preparation nanometer core/shell structure composite particles: get 0.1～10 weight part organism, add in 100～300 weight part acetone, be heated to 20～60 ℃, after the stirring and dissolving, add the ferroelectric body material of 100 weight part nano levels, dispersed with stirring, be incubated 10～15 hours, vacuum filtration, filter cake promptly makes the Nano composite granules with core/shell structure 80～120 ℃ of dryings;
Described organism is paracril, chloroprene rubber or urethanes;
(2) preparation insulating resin: the Nano composite granules with core/shell structure that will make is scattered in resol or the Resins, epoxy under the rotating speed of 6000～8000rpm and makes the volumn concentration of Nano composite granules in resin with high speed dispersor is 10%～40%, promptly is prepared into the insulating resin with high dielectric constant and low dielectric loss performance.
In the content of the present invention: the ferroelectric body material of described nano level is nano level metatitanic acid barium (BaTiO
3), nano level metatitanic acid strontium (SrTiO
3) or nano grade titanium lead plumbate (PbTiO
3).
In the content of the present invention: described resol is phenol formaldehyde resin or benzoxazine colophony.
In the content of the present invention: described Resins, epoxy is bisphenol A type epoxy resin.
In the content of the present invention: the average grain size of the ferroelectric body material of described nano level is 30～100nm preferably.
In the content of the present invention: described organism is solid-state paracril, chloroprene rubber or urethanes preferably.
The organic parcel amount of the organic integument of the ferroelectric body material surface of described nano level is 0.1～10wt% of described Nano composite granules additive preferably.
Compared with prior art, the present invention has following characteristics and beneficial effect:
(1) coats one deck on nanometer ferroelectric powder surface and have the resin of high-k and form core/shell structure, can reduce the surface energy of nano-powder on the one hand, reduce particle agglomeration; And the existence of the organic transition shell of inorganic powder surface improved the reactive force in inorganic powder and the organic polymer resin, improved the dispersiveness of inorganic powder; On the other hand, inorganic powder particle surface adsorption high-k resin formation high-k interfacial layer, the apparent dielectric constant that is shown in the low-k organic resin of raising inorganic powder is brought into play the ferroelectric filling effect of high dielectric better;
(2) the surface coated organism with high-k of nanometer ferroelectrics can effectively improve the apparent dielectric constant of inorganic particle in organic resin, gives full play to the effect that it improves the organic resin specific inductivity;
(3) nanometer core/shell structure composite particles can be dispersed in the organic insulation resin solution, and resistance to settling improves.The Nano composite granules volume content is 10%～40% o'clock, and the resistance to settling of Nano composite granules in resin solution is 410%～475% of single micron particle, is 103%～119% of single nano particle;
(4) nanometer core/shell structure composite particles can be dispersed in the organic insulation resin, can effectively improve matrix material homogeneity and specific inductivity.Nano composite granules volume content 10%～40% o'clock is 105%～216% of a single micron particle with the specific inductivity of the compound resin of this Nano composite granules preparation, is 100%～205% of single nano particle, and dielectric loss≤2%;
(5) nanometer core/shell structure composite particles prepares by liquid phase method, is easy to expand to the suitability for industrialized production scale.
(6) Nano composite granules with core/shell structure provided by the invention is dispersed in the insulating resin lacquer, can prepare the insulating material with high dielectric constant and low dielectric loss; This Nano composite granules can be widely used in the insulating material that requirement has the high dielectric constant and low dielectric loss performance, as high dielectric constant low dielectric dissipation insulating resin, high dielectric constant and low dielectric loss insulating laminated sheet, high dielectric constant and low dielectric loss insulating plastics or high dielectric constant and low dielectric loss electro-insulating rubber.Raw material sources are extensive, cost is low, technology is simple, be easy to industry enlarges production, practical.
The test of the resistance to settling of powder granule and method of calculation are among the present invention:
Measure the scattered insulating resin solution of 25ml in 25ml tool plug graduated cylinder, observe liquid layering place reading behind the 1h, and be calculated as follows:
The testing method of the specific inductivity of resin and dielectric loss is among the present invention:
Take by weighing the scattered resin solution of 150g, vacuum is taken out to desolvate and is obtained solvent-free product and be cooled to room temperature.Take by weighing the solvent-free product of 50g, add 10g, put into the mould of diameter 10cm, hot-forming (press temperature: 180 ℃; Pressing pressure: 10MPa).Compressing tablet solidifies 4h down at 180 ℃, is placed on and cools off 24h in the moisture eliminator.The relative permittivity of last test compressing tablet and dielectric loss (test frequency: 50Hz; Test voltage: 1kV).
The implementation result of this patent such as following table:
| The filler type | Resistance to settling (%) | Specific inductivity | Dielectric loss (%) | Remarks |
| Do not have | 100 | 4 | 0.6 | Pure E51 Resins, epoxy |
| Nanometer SrTiO 3Nanometer PbTiO 3Nanometer BaTiO 3 | 76～85 | 14～20 | 1.0～1.2 | Organism is not wrapped up on the inorganic filler particle surface; The volume ratio of mineral filler and insulating resin is 1: 1.5 |
| Micron BaTiO 3 | 20 | 19 | 1.2 | Micron order BaTiO 3, organism is not wrapped up on the surface; The volume ratio of mineral filler and insulating resin is 1: 1.5 |
| Nanometer BaTiO 3 | 80 | 20 | 1.2 | Nano level BaTiO 3, organism is not wrapped up on the surface; The volume ratio of mineral filler and insulating resin is 1: 1.5 |
| The Nano composite granules that this patent method is produced | 88～95 | 21～41 | 1.2～2.0 | The volume ratio of mineral filler and insulating resin is 1: 1.5; Resistance to settling is micron order BaTiO 3410%～475%, be nano level BaTiO 3103%～119%; The compound resin specific inductivity is micron order BaTiO 3105%～216%, be nano level BaTiO 3100%～205% |
Embodiment
Below by embodiment technical characterstic of the present invention is further illustrated.These embodiment only are used to help the purpose to the understanding of the technology of the present invention, are not able to this as the further restriction to protection domain of the present invention.
Embodiment 1
The 1g paracril is joined in the 100g acetone, be heated to 40 ℃, after the stirring and dissolving, adding the 100g average grain size is the SrTiO of 40nm
3Powder (powder density 4.8g/cm
3), dispersed with stirring is incubated 10 hours, vacuum filtration, and filter cake is dry 24h under 100 ℃, obtains having the Nano composite granules of core/shell structure; This Nano composite granules is scattered in (E51 epoxy resin content 30%, density 1.2g/cm after pure epoxy resin E51 solidifies in the 115g E51 Resins, epoxy acetone soln with high speed dispersor
3), finally be prepared into insulating resin with high dielectric constant and low dielectric loss performance.
Embodiment 2
The 1g paracril is joined in the 100g acetone, be heated to 45 ℃, after the stirring and dissolving, adding the 100g average grain size is the PbTiO of 50nm
3Powder (powder density 4.8g/cm
3), dispersed with stirring is incubated 12 hours, vacuum filtration, and filter cake is dry 24h under 80 ℃, obtains having the Nano composite granules of core/shell structure; This Nano composite granules is scattered in (E51 epoxy resin content 30%, density 1.2g/cm after pure epoxy resin E51 solidifies in the 115g E51 Resins, epoxy acetone soln with high speed dispersor under the rotating speed of 6000rpm
3), finally be prepared into insulating resin with high dielectric constant and low dielectric loss performance.
Embodiment 3
The 1g paracril is joined in the 100g acetone, be heated to 50 ℃, after the stirring and dissolving, adding the 100g average grain size is the BaTiO of 100nm
3Powder (powder density 5.2g/cm
3), dispersed with stirring is incubated 15 hours, vacuum filtration, and filter cake is dry 24h under 110 ℃, obtains having the Nano composite granules of core/shell structure; This Nano composite granules is scattered in (E51 epoxy resin content 30%, density 1.2g/cm after pure epoxy resin E51 solidifies in the 125g E51 Resins, epoxy acetone soln with high speed dispersor under the rotating speed of 6000rpm
3), finally be prepared into insulating resin with high dielectric constant and low dielectric loss performance.
Embodiment 4
The 1g paracril is joined in the 100g acetone, be heated to 40 ℃, after the stirring and dissolving, adding the 100g average grain size is the BaTiO of 80nm
3Powder (powder density 5.0g/cm
3), dispersed with stirring is incubated 10 hours, vacuum filtration, and filter cake is dry 24h under 120 ℃, obtains having the Nano composite granules of core/shell structure; This Nano composite granules is scattered in (E51 epoxy resin content 30%, density 1.2g/cm after pure epoxy resin E51 solidifies in the 120g E51 Resins, epoxy acetone soln with high speed dispersor under the rotating speed of 6000rpm
3), finally be prepared into insulating resin with high dielectric constant and low dielectric loss performance.
Embodiment 5
The 1g paracril is joined in the 100g acetone, be heated to 40 ℃, after the stirring and dissolving, adding the 100g average grain size is the BaTiO of 50nm
3Powder (powder density 4.8g/cm
3), dispersed with stirring is incubated 10 hours, vacuum filtration, and filter cake is dry 24h under 120 ℃, obtains having the Nano composite granules of core/shell structure; This Nano composite granules is scattered in (E51 epoxy resin content 30%, density 1.2g/cm after pure epoxy resin E51 solidifies in the 115g E51 Resins, epoxy acetone soln with high speed dispersor under the rotating speed of 6000rpm
3), finally be prepared into insulating resin with high dielectric constant and low dielectric loss performance.
Embodiment 6
The 1g chloroprene rubber is joined in the 100g acetone, be heated to 40 ℃, after the stirring and dissolving, adding the 100g average grain size is the BaTiO of 80nm
3Powder (powder density 5.0g/cm
3), dispersed with stirring is incubated 10 hours, vacuum filtration, and filter cake is dry 24h under 120 ℃, obtains having the Nano composite granules of core/shell structure; This Nano composite granules is scattered in (E51 epoxy resin content 30%, density 1.2g/cm after pure epoxy resin E51 solidifies in the 120g E51 Resins, epoxy acetone soln with high speed dispersor under the rotating speed of 6000rpm
3), finally be prepared into insulating resin with high dielectric constant and low dielectric loss performance.
Embodiment 7
The 1g urethanes is joined in the 100g acetone, be heated to 40 ℃, after the stirring and dissolving, add the BaTiO of 100g average grain size 80nm
3Powder (powder density 5.0g/cm
3), dispersed with stirring is incubated 10 hours, vacuum filtration, and filter cake is dry 24h under 120 ℃, obtains having the Nano composite granules of core/shell structure; This Nano composite granules is scattered in (E51 epoxy resin content 30%, density 1.2g/cm after pure epoxy resin E51 solidifies in the 120g E51 Resins, epoxy acetone soln with high speed dispersor under the rotating speed of 6000rpm
3), finally be prepared into insulating resin with high dielectric constant and low dielectric loss performance.
Embodiment 8
The 2g paracril is joined in the 200g acetone, be heated to 40 ℃, after the stirring and dissolving, add the BaTiO of 100g average grain size 80nm
3Powder (powder density 5.0g/cm
3), dispersed with stirring is incubated 10 hours, vacuum filtration, and filter cake is dry 24h under 120 ℃, obtains having the Nano composite granules of core/shell structure; This Nano composite granules is scattered in (E51 epoxy resin content 30%, density 1.2g/cm after pure epoxy resin E51 solidifies in the 120g E51 Resins, epoxy acetone soln with high speed dispersor under the rotating speed of 6000rpm
3), finally be prepared into insulating resin with high dielectric constant and low dielectric loss performance.
Embodiment 9
The 3g paracril is joined in the 300g acetone, be heated to 40 ℃, after the stirring and dissolving, add the BaTiO of 100g average grain size 80nm
3Powder (powder density 5.0g/cm
3), dispersed with stirring is incubated 10 hours, vacuum filtration, and filter cake is dry 24h under 120 ℃, obtains having the Nano composite granules of core/shell structure; This Nano composite granules is scattered in (E51 epoxy resin content 30%, density 1.2g/cm after pure epoxy resin E51 solidifies in the 120g E51 Resins, epoxy acetone soln with high speed dispersor under the rotating speed of 7000rpm
3), finally be prepared into insulating resin with high dielectric constant and low dielectric loss performance.
Embodiment 10
The 4g paracril is joined in the 300g acetone, be heated to 40 ℃, after the stirring and dissolving, add the BaTiO of 100g average grain size 80nm
3Powder (powder density 5.0g/cm
3), dispersed with stirring is incubated 10 hours, vacuum filtration, and filter cake is dry 24h under 120 ℃, obtains having the Nano composite granules of core/shell structure; This Nano composite granules is scattered in (E51 epoxy resin content 30%, density 1.2g/cm after pure epoxy resin E51 solidifies in the 120g E51 Resins, epoxy acetone soln with high speed dispersor under the rotating speed of 7000rpm
3), finally be prepared into insulating resin with high dielectric constant and low dielectric loss performance.
Embodiment 11
The 5g paracril is joined in the 300g acetone, be heated to 40 ℃, after the stirring and dissolving, add the BaTiO of 100g average grain size 80nm
3Powder (powder density 5.0g/cm
3), dispersed with stirring is incubated 10 hours, vacuum filtration, and filter cake is dry 24h under 120 ℃, obtains having the Nano composite granules of core/shell structure; This Nano composite granules is scattered in (E51 epoxy resin content 30%, density 1.2g/cm after pure epoxy resin E51 solidifies in the 120g E51 Resins, epoxy acetone soln with high speed dispersor under the rotating speed of 8000rpm
3), finally be prepared into insulating resin with high dielectric constant and low dielectric loss performance.
Embodiment 12
The 6g paracril is joined in the 300g acetone, be heated to 40 ℃, after the stirring and dissolving, add the BaTiO of 100g average grain size 80nm
3Powder (powder density 5.0g/cm
3), dispersed with stirring is incubated 10 hours, vacuum filtration, and filter cake is dry 24h under 120 ℃, obtains having the Nano composite granules of core/shell structure; This Nano composite granules is scattered in (E51 epoxy resin content 30%, density 1.2g/cm after pure epoxy resin E51 solidifies in the 120g E51 Resins, epoxy acetone soln with high speed dispersor under the rotating speed of 8000rpm
3), finally be prepared into insulating resin with high dielectric constant and low dielectric loss performance.
Embodiment 13
The 7g paracril is joined in the 300g acetone, be heated to 40 ℃, after the stirring and dissolving, add the BaTiO of 100g average grain size 80nm
3Powder (powder density 5.0g/cm
3), dispersed with stirring is incubated 10 hours, vacuum filtration, and filter cake is dry 24h under 120 ℃, obtains having the Nano composite granules of core/shell structure; This Nano composite granules is scattered in (E51 epoxy resin content 30%, density 1.2g/cm after pure epoxy resin E51 solidifies in the 120g E51 Resins, epoxy acetone soln with high speed dispersor under the rotating speed of 8000rpm
3), finally be prepared into insulating resin with high dielectric constant and low dielectric loss performance.
Embodiment 14
The 8g paracril is joined in the 300g acetone, be heated to 40 ℃, after the stirring and dissolving, add the BaTiO of 100g average grain size 80nm
3Powder (powder density 5.0g/cm
3), dispersed with stirring is incubated 10 hours, vacuum filtration, and filter cake is dry 24h under 120 ℃, obtains having the Nano composite granules of core/shell structure; This Nano composite granules is scattered in (E51 epoxy resin content 30%, density 1.2g/cm after pure epoxy resin E51 solidifies in the 120g E51 Resins, epoxy acetone soln with high speed dispersor under the rotating speed of 8000rpm
3), finally be prepared into insulating resin with high dielectric constant and low dielectric loss performance.
Embodiment 15
The 9g paracril is joined in the 300g acetone, be heated to 40 ℃, after the stirring and dissolving, add the BaTiO of 100g average grain size 80nm
3Powder (powder density 5.0g/cm
3), dispersed with stirring is incubated 10 hours, vacuum filtration, and filter cake is dry 24h under 120 ℃, obtains having the Nano composite granules of core/shell structure; This Nano composite granules is scattered in (E51 epoxy resin content 30%, density 1.2g/cm after pure epoxy resin E51 solidifies in the 120g E51 Resins, epoxy acetone soln with high speed dispersor under the rotating speed of 8000rpm
3), finally be prepared into insulating resin with high dielectric constant and low dielectric loss performance.
Embodiment 16
The 10g paracril is joined in the 300g acetone, be heated to 40 ℃, after the stirring and dissolving, add the BaTiO of 100g average grain size g0nm
3Powder (powder density 5.0g/cm
3), dispersed with stirring is incubated 10 hours, vacuum filtration, and filter cake is dry 24h under 120 ℃, obtains having the Nano composite granules of core/shell structure; This Nano composite granules is scattered in (E51 epoxy resin content 30%, density 1.2g/cm after pure epoxy resin E51 solidifies in the 120g E51 Resins, epoxy acetone soln with high speed dispersor under the rotating speed of 8000rpm
3), finally be prepared into insulating resin with high dielectric constant and low dielectric loss performance.
Embodiment 17
The 1g paracril is joined in the 300g acetone, be heated to 40 ℃, after the stirring and dissolving, add the BaTiO of 100g average grain size 80nm
3Powder (powder density 5.0g/cm
3), dispersed with stirring is incubated 10 hours, vacuum filtration, and filter cake is dry 24h under 120 ℃, obtains having the Nano composite granules of core/shell structure; This Nano composite granules is scattered in (phenol formaldehyde resin content 30%, density 1.12g/cm after virgin resin solidifies in the 112g phenol formaldehyde resin acetone soln with high speed dispersor under the rotating speed of 8000rpm
3), finally be prepared into insulating resin with high dielectric constant and low dielectric loss performance.
Embodiment 18
The 1g paracril is joined in the 300g acetone, be heated to 40 ℃, after the stirring and dissolving, add the BaTiO of 100g average grain size 80nm
3Powder (powder density 5.0g/cm
3), dispersed with stirring is incubated 10 hours, vacuum filtration, and filter cake is dry 24h under 120 ℃, obtains having the Nano composite granules of core/shell structure; This composite particles is scattered in the 116g benzoxazine colophony with high speed dispersor under the rotating speed of 8000rpm (resin content 30%, virgin resin solidify back density 1.16g/cm
3) in the acetone soln, finally be prepared into insulating resin with high dielectric constant and low dielectric loss performance.
Claims (6)
1. the manufacture method of a high dielectric constant low dielectric dissipation insulating resin is characterized in that comprising the following steps:
(1) preparation nanometer core/shell structure composite particles: get 0.1～10 weight part organism, add in 100～300 weight part acetone, be heated to 20～60 ℃, after the stirring and dissolving, add the ferroelectric body material of 100 weight part nano levels, dispersed with stirring, be incubated 10～15 hours, vacuum filtration, filter cake promptly makes the Nano composite granules with core/shell structure 80～120 ℃ of dryings;
Described organism is paracril, chloroprene rubber or urethanes;
(2) preparation insulating resin: the Nano composite granules with core/shell structure that will make is scattered in resol or the Resins, epoxy under the rotating speed of 6000～8000rpm and makes the volumn concentration of Nano composite granules in resin with high speed dispersor is 10%～40%, promptly is prepared into the insulating resin with high dielectric constant and low dielectric loss performance.
2. by the manufacture method of the described high dielectric constant low dielectric dissipation insulating resin of claim 1, it is characterized in that: the ferroelectric body material of described nano level is nano level metatitanic acid barium, nano level metatitanic acid strontium or nano grade titanium lead plumbate.
3. by the manufacture method of claim 1 or 2 described high dielectric constant low dielectric dissipation insulating resins, it is characterized in that: described resol is phenol formaldehyde resin or benzoxazine colophony.
4. by the manufacture method of claim 1 or 2 described high dielectric constant low dielectric dissipation insulating resins, it is characterized in that: described Resins, epoxy is bisphenol A type epoxy resin.
5. by the manufacture method of claim 1 or 2 described high dielectric constant low dielectric dissipation insulating resins, it is characterized in that: the average grain size of the ferroelectric body material of described nano level is 30～100nm.
6. by the manufacture method of the described high dielectric constant low dielectric dissipation insulating resin of claim 1, it is characterized in that: described organism is solid-state paracril, chloroprene rubber or urethanes.
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| CNB2006100214947A CN100424124C (en) | 2006-07-28 | 2006-07-28 | Manufacturing method of high dielectric constant low dielectric dissipation insulating resin |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103059364A (en) * | 2012-11-14 | 2013-04-24 | 安徽江威精密制造有限公司 | Cold-resistant rubber wrapping material for capacitor housing |
| CN103101252B (en) * | 2013-01-23 | 2016-04-13 | 陕西生益科技有限公司 | The preparation method of a kind of high-k, low-loss CEM-3 copper-clad plate |
| CN104403262B (en) * | 2014-11-06 | 2016-09-07 | 上海复合材料科技有限公司 | A kind of high-dielectric and low-loss phenolic glass fiber composite and preparation method thereof |
| CN110669182B (en) * | 2019-10-10 | 2020-11-20 | 深圳市峰泳科技有限公司 | Polymer-based dielectric material and preparation method thereof |
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| US6616794B2 (en) * | 1998-05-04 | 2003-09-09 | Tpl, Inc. | Integral capacitance for printed circuit board using dielectric nanopowders |
| US7008981B2 (en) * | 2003-12-23 | 2006-03-07 | Industrial Technology Reserarch Institute | Organic-inorganic hybrid compositions with high dielectric constant and high thermal stability, and cured compositions thereof |
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| CN1903923A (en) | 2007-01-31 |
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