CN100435438C - Header assembly having integrated cooling device - Google Patents

Header assembly having integrated cooling device Download PDF

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Publication number
CN100435438C
CN100435438C CNB038083868A CN03808386A CN100435438C CN 100435438 C CN100435438 C CN 100435438C CN B038083868 A CNB038083868 A CN B038083868A CN 03808386 A CN03808386 A CN 03808386A CN 100435438 C CN100435438 C CN 100435438C
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CN
China
Prior art keywords
base
platform
laser
head unit
cooling device
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Expired - Fee Related
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CNB038083868A
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Chinese (zh)
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CN1647334A (en
Inventor
P·K·罗森伯格
G·加雷塔
S·施亚费诺
J·斯图尔特
R·J·霍夫梅斯特
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Finisar Corp
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Finisar Corp
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Publication date
Priority claimed from US10/077,067 external-priority patent/US6586678B1/en
Priority claimed from US10/231,395 external-priority patent/US6703561B1/en
Application filed by Finisar Corp filed Critical Finisar Corp
Publication of CN1647334A publication Critical patent/CN1647334A/en
Application granted granted Critical
Publication of CN100435438C publication Critical patent/CN100435438C/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/02208Mountings; Housings characterised by the shape of the housings
    • H01S5/02212Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191Disposition
    • H01L2924/19101Disposition of discrete passive components
    • H01L2924/19107Disposition of discrete passive components off-chip wires
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/024Arrangements for thermal management
    • H01S5/02407Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02415Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element

Abstract

A header assembly 700 including a base 702 and a platform 800 extending through the base 702 and substantially perpendicular thereto. The platform 800 includes conductive pathways 806 that connect electrical components on either side of the base 702, and the conductive pathways cooperate to form a connector 900 at the first end of the platform 800. A laser 1002 is mounted on top of a thermoelectric cooler 900 that is directly joined to the second end of the platform 800.The laser 1002 and thermoelectric cooler 900 are enclosed in a hermetic chamber cooperatively defined by the base 702, the platform 800, and a cap that is joined to the base 702. A photodiode 1004 optically coupled with the laser 1002 and a thermistor thermally coupled with the laser 1002 cooperate with the thermoelectric cooler 900 and a control circuit to facilitate control of the performance of the laser 1002.

Description

Head unit with integrated cooling device
Technical field
The present invention relates generally to the field of electro-optical system and device.More particularly, embodiments of the invention relate to a kind of transistor header, and it comprises and causes improving the various electronic installations that are included in the described the transistor header for example reliability of laser and a plurality of features of performance.
Background technology
Transistor header or transistor outline package (" TO ") are widely used in the photoelectric field, and can be used in the various application.As an example, transistor header is used to protect responsive electric device sometimes, and make this device and element for example printed circuit board (PCB) (PCB) be electrically connected.About their structure, transistor header is made of columniform metab usually, has several and is substantially perpendicular to the conductive lead wire that described base extends by base fully.Glass capsulation between conductive lead wire and base provides machinery and environmental protection for the element that is included in the TO encapsulation, and makes the metal material electrical isolation of conductive lead wire and base.In general, a conductive lead wire is a ground lead, and it can directly be electrically connected with base.
Various types of devices are installed on a sidepiece of the base of head, and are linked to each other with described lead-in wire.In general, use a cap to seal the sidepiece of the base that this device is installed, make to form a chamber, it helps prevent pollution or destroys these devices.The specific characteristic of cap and head is generally relevant with the certain device on the base of using and be installed in head.For example, need install on head in the application of optics, cap is local transparent at least, makes the light signal that is produced by optics can see through the TO encapsulation.
Though it is useful having proved transistor header, general configuration has various an open questions still.The physical configuration of the conductive lead wire in the special and base of some problems with dispose relevant.For example, multiple factor causes controlling well the i.e. electrical impedance of the physical connection between a conductive lead wire and a submount material of glass/metal lead-in wire.One of them factor is for the diameter of the conductive lead wire that will be used, to have the available selection of quite limited quantity.In addition, the scope of the dielectric radio of the seal glass that generally uses in these structures is quite little.And, in some cases, proved that the control lead-in wire is quite difficult with respect to the position of the through hole in the base about the configuration of conductive lead wire.
Other problem in this field relates to electric and device electronics of those complexity, and they need being electrically connected of many insulation, so that operation correctly.In general, the attribute of this device and their parts for example shape and size be subjected to different shape factor, other dimensional requirement and the constraint of spatial limitation in device.In order to meet this form factor, dimensional requirement and spatial limitation, the diameter of general head is quite little, correspondingly, can be set at the quantity of the lead-in wire in the base, is called as I/O (I/O) density sometimes, and is also quite little.
Thereby, though the diameter of a base, thereby I/O density, can be increased to and be used to guarantee to meet being electrically connected of relevant apparatus and require required degree, but, the increase of base diameter is subjected to the very big restriction of form factor, dimensional requirement and the spatial limitation relevant with the device that wherein will use transistor header, even without being hindered fully.
The problem relevant with many transistor headers relates to such relation, and promptly quite the conductive lead wire of minority is relevant with the performance of the device that wherein uses transistor header.Specifically, some for example install semiconductor laser and more can operate effectively when its driving impedance and the impedance balance at two ends.Impedance matching usually by use additional electric device for example resistance, electric capacity and transmission line for example microstrip or strip line are realized.But, can supply to utilize unless in transistor header, have the conductive lead wire of sufficient amount, otherwise, these elements can not be used.Thereby the conductive lead wire noise spectra of semiconductor lasers of the limited quantity that has in general transistor header or the performance of other device have direct negative effect.
In conjunction with above-mentioned, many obstruction use transistor header for example as another aspect of the required element of impedance matching, are available quite limited physical spaces on the head of standard.Specifically, the restriction of a reality has been forced in the quite little space on the base of head for the quantity of the element that can install therein.In order to overcome this restriction, some or all any additional elements that need use of installation on printed circuit board (PCB) that must generation,, wherein some are away from laser or other device of comprising in transistor header.But, this structure is not immaculate because the active device that components and parts are arranged in transistor header for example the performance of laser and integrated circuit is relevant with relevant electric physical proximity with electronic component to a certain extent.
But, be not limited only to how much consideration and restriction with the relevant problem of various typical transistor headers.Also have some other problems relevant with the heat of transistor header inside and component external generation.Specifically, transistor header and relevant parts thereof can produce very big heat during operation.Generally need reliably and fully to remove these heats, so that the performance of optimization means and useful life.
But, transistor header mainly for example is made of the Kovar material usually, and these materials especially are not good heat conductors.How the thermal conductivity of this difference does not alleviate the heat localization problem in the transistor header components, in fact, makes these problem worse.In the process of making great efforts to address this problem, once use various cooling technologies and device down, but only had limited success.
As an example, can use solid-state heat exchanger to be used to remove some heats from transistor header components.But, the efficient of this heat exchanger is because the following fact and being compromised: because for example its structure and/or different with respect to the physical location of the primary element that will be cooled, this heat exchanger experiences continually by general does not plan the passive heat loads forced by the secondary component or the transistor header structure of cools down.This passive heat loads is imposed to the heat that the primary element that makes minimizing to be cooled from needs effectively on the heat exchanger is removed effectively, thereby the performance of compromise primary element.
As mentioned above, the physical location of heat exchanger or other cooling device has multiple influence for the performance of the element that uses at present in transistor header.It is relevant with cold junction that the particular problem that occurs under the situation of the heat exchanger of thermoelectric (al) cooler (TEC) type and TEC have thermojunction.Specifically, if TEC is arranged in enough wet environment, cold junction may cause and condenses.This condensing can substantially influence the operation of element in transistor header or other position.
Another problem relevant with heat exchanger is that the size of general transistor header is subjected to the restriction of various factors, as previously mentioned.Thereby, though place the passive heat loads on the heat exchanger to be compensated at least in part by using relatively large heat exchanger, by form factor require and other consideration and force at the diameter constraint of transistor header and other constraint the full-size of heat exchanger proposed actual restriction.
At last, even when attempting to compensate the influencing of passive heat loads, can use big relatively heat exchanger, but heat exchanger for example TEC be used to improve transistor header components for example under the situation of the performance of laser, big heat exchanger existing problems.For example, because its sizable size, this heat exchanger is not suitable for the quick change that is implemented in laser performance required in many application, and this is because the temperature of this big heat exchanger raises and reduces all quite slow.In addition, if the heat exchanger distance lasers is far away relatively, then the performance of laser or other element will further be compromised, and this is because heat is the function of the distance between element and heat exchanger for the speed that laser or other element can transmit at least in part.
It seems from above-mentioned viewpoint, need a kind of transistor header here with feature of problem that can solve above-mentioned example and the other problem that does not spell out.A kind of transistor header of example should be realized quite high I/O density and not increase the relative diameter of transistor header.In addition, the transistor header of example should be constructed for accurately controlling considerably near the active element in the transistor header for example the various elements of laser electrical impedance and allow the position, and do not hinder applicable form factor or other how much and dimensional standard.At last, the transistor header of example should comprise the feature that makes it possible to help considerably to improve the managerial ability in transistor header.
Summary of the invention
In general, embodiments of the invention relate to a kind of transistor header, and it comprises and is used for strengthening various the electronic devices for example reliability of laser and the feature of performance that is included in transistor header.
In one embodiment, provide a kind of transistor header, it comprises columniform basically metab and the platform that is set up and passes through the both sides extension of described base basically along the direction perpendicular to base.Described platform by insulating material for example pottery constitute.Described platform seals for base, and the flat surface that is limited by platform on every side of base is constructed for receiving a plurality of electronic components.In addition, described platform comprises a plurality of conductive paths, and they extend between the two ends of platform, makes element electric interconnection each other on the opposite side of base.At an end of platform, provide one and some or all described conductive paths to be in the connector of electric connection.
In the embodiment of this example, a laser is set on the top of TEC, and described TEC is installed in again on the described platform.Cup with transparent part is positioned on the base, and itself and platform and base co-operation make to limit a closed chamber that surrounds laser and TEC.Power supply is provided for TEC by means of laser control system, and described laser control system is communicated by letter with being the luminous intensity measurement device that optics links to each other and being hot linked temperature-detecting device with laser with laser.
When operation, power supply is provided for laser by means of the connector on platform, thereby laser is luminous by the transparent part of cup.Luminous intensity measurement device and temperature-detecting device provide the data as the luminous intensity of the function of laser temperature, and give a control circuit that is used to regulate the power that offers TEC data passes, so as to the temperature of rising or reduction laser, so that satisfy the performance requirement of laser.
The aspect of these and other of embodiments of the invention is found out by following explanation and appended claim with will be more readily apparent from.
Description of drawings
For understand be used to obtain of the present invention above-mentioned with other the advantage and the mode of feature, will carry out more specific description to the present invention of top brief description in conjunction with specific embodiment of the present invention, these embodiment are shown in the drawings.Should be appreciated that these accompanying drawings only represent typical embodiment of the present invention, therefore do not think to be used to limit scope of the present invention, will use accompanying drawing that the present invention is carried out explaining and illustrating in more detail more specifically below, wherein:
Figure 1A is the perspective view of various aspects of device-side of embodiment of the example of a head unit of expression;
Figure 1B is the perspective view of various aspects of connector side of embodiment of the example of a head unit of expression;
Fig. 2 A is the perspective view of various aspects of device-side of embodiment of another example of a head unit of expression;
Fig. 2 B is the perspective view of various aspects of connector side of embodiment of another example of a head unit of expression;
Fig. 3 A is the perspective view of various aspects of device-side of embodiment of another other example of a head unit of expression;
Fig. 3 B is the perspective view of various aspects of connector side of embodiment of another other example of a head unit of expression;
Fig. 4 A is the perspective view that comprises the embodiment of the example that is installed in the head that is set at the active device on the interior TEC of closed chamber;
Fig. 4 B is the bottom perspective view of the embodiment shown in Fig. 4 A;
Fig. 4 C is presentation graphs 4A, the sectional view of the various aspects of the embodiment of the example that 4B represents;
Fig. 4 D is the sectional view that the line 4D-4D along Fig. 4 C gets, and is illustrated in the various aspects of the layout of the example of TEC in the head unit;
Fig. 4 E is an end view, the various aspects of the electrical connection scheme of the example of an expression head unit and a printed circuit board (PCB);
Fig. 4 F represents that TEC wherein is set at the various aspects of another kind of platform/TEC structure of the outside of closed chamber; And
Fig. 5 is the schematic diagram of various aspects of embodiment of an example of expression laser control system.
Embodiment
Referring now to accompanying drawing,, wherein identical parts are represented with identical label.Should be appreciated that these accompanying drawings just schematically represent claimed embodiments of the invention, be not limited to scope of the present invention, thereby also needn't proportionally draw.
At first referring to Figure 1A and 1B, the perspective view of a presently preferred embodiment of a head unit of its expression is represented with label 200 on the whole.In an example shown, head unit 200 comprises cylindrical basically metab 10.Base 10 comprises two flanges 90, is used for control head device 200 and the angle of the socket (not shown) on a higher optical-mechanical means or the aligning of rotation.Base can be made of alloy 42, and it can be a ferroalloy, and cold-rolled steel, or Vacon VCF-25 alloy.Base 10 also comprises ceramic platform 70, and it vertically extends by base, as shown in the figure.Described ceramic platform seals base, thereby provides the protection of machinery and environment to being included in the interior element of TO encapsulation.
Sealing between base 10 and platform 70 is made of the glass-to-metal seal of electric insulation.In addition, platform 70 can comprise two additional top ceramic layers, so that the outermost conductor of electric insulation.Under this second kind of situation, can use metallic copper or scolder to seal platform 70 to metab.This method has overcome the major defect of glass, i.e. its low intensity, fragility and low thermal conductivity.
Platform 70 is constructed for being contained in a plurality of electric components 50 and 100 and active device 60 on the base.In an illustrated embodiment, active device 60 comprises semiconductor laser, and element 50 and 100 is resistance, electric capacity and inductance, and they are used for the driving impedance by means of element impedance balance laser.Because importantly will be accurately positioned for semiconductor laser, so platform 70 is accurately positioned perpendicular to base 10 perpendicular to base 10.
When active device 60 comprised semiconductor laser, active device 60 can cause the big skew of the direction of emitted laser bundle with respect to one of base 10 little offset.Vertically can realize by comprise a vertical pedestal feature in submount material accurately between platform and base is shown in Figure 1A.Vertical pedestal is holding a photodiode 30 in the embodiment shown in Figure 1A.This feature can or directly be utilized base to carry out the metal injection molding by machining, punching press and form, thereby accurate surface on the stable geometry is provided, and is used for mating with platform.
Platform 70 also comprises the conductive path 110 of a plurality of electric insulations, and they are by platform 70 and thereby by base 10 extensions.Conductive path 110 provides electric device on whole platform 70 or the electrical connection between the element.Conductive path 110 is not comprising connector of formation on that side of semiconductor laser 60, and this side is also referred to as " the connector side " of base.Notice that in conjunction with above-mentioned a side with base of active device 60 is called as " device-side " of base sometimes.
The connector that forms by conductive path 110 be used to make head unit 200 and second electric component for example printed circuit board (PCB) be electrically connected (for example being connected) by scolder, perhaps directly (for example connect) by scolder, perhaps indirectly, for example realize described connection by a flexible printed circuit.Semiconductor laser 60 is electrically connected by conductive path 110 and electric component 50 and 100.In one embodiment, platform 70 itself is the printed circuit board (PCB) that is formed with conductive path 110.
Use advanced ceramic material, for example comprise the ceramic material of aluminium nitride and beryllium oxide, make head unit 200 can be implemented in the lower thermal resistance between the external world that the inner device of encapsulation and heat finally be passed to basically.As what further describe in another embodiment of the present invention below, cooling device is thermoelectric (al) cooler (TEC) for example, heat pipe or metal heat sink can directly be installed on the platform, so as to provide very short heat passage between temperature sensor on the platform and the radiator in the outside of head unit.
As Figure 1A and Figure 1B further shown in, head unit 200 can also comprise two conductive lead wires 40 that run through the both sides of base 10 and extend.Conductive lead wire 40 is sealed on the base 10, thereby provides machinery and protection environment to the element that comprises in the TO between conductive lead wire 40 and base 10 encapsulation.Sealing between conductive lead wire 40 and base 10 is for example formed by glass known in the art or other compatible sealed insulating material.Conductive lead wire 40 also can be used to be positioned at device and the element on the opposite side of base.
In an illustrated embodiment, the side that conductive lead wire 40 at least never contains the base 10 of semiconductor laser 60 is stretched out by this way, makes head unit 200 to be electrically connected with the specific connector that for example is positioned on the printed circuit board (PCB).Be important to note that conductive path 110 and conductive lead wire 40 have identical functions, and the quantity of possible conductive path 110 is much larger than the possible quantity of conductive lead wire 40.Therefore, additional embodiments may comprise than shown in the more conductive path 110 of embodiment.
Platform 70 also comprises step and the zone of groove arranged, and it makes to have the fixture of different-thickness and the metal pad on the pottery flushes.This makes it possible to use the shortest electric interconnection, and for example lead connects, and makes to have improved electric property and characteristic.
Use the signal strength signal intensity of photodiode 30 detection semiconductor lasers 60, and the control circuit (see figure 5) of this information being passed semiconductor laser 60 to passback.In an illustrated embodiment, photodiode can directly link to each other with conductive lead wire 40.Perhaps, photodiode can be directly installed on the platform identical with laser, and it is positioned at a position that groove is arranged with respect to light-emitting zone.This has the position of groove to use photodiode can catch the part of the light that is sent by laser, thereby makes photodiode carry out same function for monitoring.In another kind of structure, shown in Fig. 4 C, have an angled faceted monitor photodiodes 1004 and can be installed in the plane at laser diode rear.The light that angled facet is upwards sent by the rear portion facet of laser towards the deflection of the sensitizing range of detector.
The structure of the monitor photodiode of last joint discussion makes it possible to cancel conductive lead wire 40, help to simplify with the electrical connection of the conductive path 110 of platform 70 for example lead be connected.In another embodiment, by an optical element is set, be used for focusing on or changing direction of light on base, speculum for example, perhaps by directly forming and the coated substrate metal, so that an additional optical convergence to photodiode, increases the light collection of photodiode.
Shown in Figure 1A was further, base 10 comprised the part 45 of protrusion, and it is arranged to and is provided with or fixes a cap (not shown) releasedly above a side of base 10.A cap can be placed on the side of the base 10 that comprises semiconductor laser 60, is used to protect semiconductor laser 60 to avoid having the influence of destructive particle.For shown in embodiment, a kind of transparent cap is preferred, make laser can between cap and the base 10 the zone overflow.
Then referring to Fig. 2 A, 2B wherein shows the perspective view by another embodiment of the head unit of label 300 expressions.This embodiment represents flatly to be installed in the optical receiver 360 on the platform 70, and platform 70 divides the base 310 of head unit 300 vertically.Optical receiver can be photodetector or any other can receiving optical signals device.Optical receiver 360 is installed on the platform 370 flatly, is used to detect by the light signal of face from base 310 1 sides.Such optical receiver is called as " edge detection " detector sometimes.Base 310 and platform 370 are with reference to Figure 1A, and 1B is elaborated.Platform 370 contains electric device 350,400 on each side of base, be used for operational light receiver 360.Platform 370 also comprises conductive path 410, is used to be connected electrically in device or element on each side of base 310.This embodiment of head unit does not comprise conductive lead wire, so conductive path 410 realizations are all passed through in all electrical connections.
Then referring to Fig. 3 A, 3B wherein shows the perspective view of another embodiment of the head unit of representing with label 500.This embodiment also represents vertically to be installed in the optical receiver 530 on the base 510.Described optical receiver can be photodetector or any other device that can receiving optical signals.This is an optical receiver 530 that is used to detect from the light signal at the top of installing.Base 510 and platform 570 are with reference to Figure 1A, and 1B describes in detail.Platform 570 contains electric device 550,600 on each side of base, be used for operational light receiver 530.Platform 570 also comprises conductive path 510, is used to be connected electrically in device or element on each side of base 510.This embodiment of head unit does not comprise conductive lead wire, so conductive path 410 realizations are all passed through in all electrical connections.
Now diversion is arrived Fig. 4 A-4D, wherein show the various aspects of another embodiment of the head unit of representing with label 700.The embodiment of the head unit shown in Fig. 4 A-4D is similar to one or several embodiment shown in Figure 1A-3B in many aspects.Thereby the discussion of Fig. 4 A-4D will mainly concentrate on the aspect of some selections shown in it.Notice that head unit 700 is made of a transistor header in one embodiment of the invention.But, head unit 700 is not limited only to the embodiment of this example.
Shown in Fig. 4 A-4D, head unit 700 generally comprises base 702, wherein passes platform 800.Platform 800 can be made of printed circuit board (PCB), perhaps, as discussed herein, can be made up of other material and structure.Platform 800 is arranged to cooling device 900, and each device and circuit are installed thereon.Though noticing that it is opened here is called as " cooling " device 900, cooling device 900 can be used for heating and cooling off various components and parts according to the occasion of its type and its application.At last, be installed on the base 702 and and base 792 crew-served caps 704 be used to limit a closed chamber 706, the device and the circuit of its encapsulation cooling device 900 and installation.
Further describe as following, can use different devices to finish the function of the cooling device that discloses here.Thereby the embodiment of the cooling device that discloses here and discuss only is a kind of structure of the example as heat transfer unit (HTU).Accordingly, it should be understood that this structure that illustrates is an example here, and limit the scope of the invention never in any form.But, can use equally can realize effectively the function that discloses here any structure or the combination of structure.
Continue to note Fig. 4 A, 4B also notes Fig. 4 C simultaneously, and 4D further provides the details about the various aspects of platform 800.In an illustrated embodiment, platform 800 is substantially perpendicular to base 702 settings.Specifically, base 704 comprises device-side 702A and connector side 702B, makes the interior section 801A of platform 800 be set on the device-side 702A of base 700, and the exterior section 801B of platform 800 is set on the connector side 702B of base 702.But, this structure of platform 800 is exemplary, can use various other structures of the platform consistent with the requirement of application-specific 800.
In an illustrated embodiment, platform 800 comprises first feedthrough 802, and it has one deck or which floor 804 the sandwich construction (seeing Fig. 4 A) that comprises conductive path 806.In general, conductive path 806 carries out telecommunication in the middle of allowing to be arranged on each element on the platform 800 or device (for clarity sake being removed), also makes this element and device and be not that other element and the device of the part of platform 800 carries out telecommunication simultaneously.In addition, on the connector side 702B of base 700, conductive path 806 co-operations and form connector 810 on the exterior section 810B that is positioned at platform 800.In general, connector 810 helps at head unit 700 and other element and device, such as but not limited to, carry out telecommunication between the printed circuit board (PCB) (Fig. 4 E).In one embodiment, connector 810 comprises an edge connector, but also can use the connector consistent with requirement application-specific any other form.As further discussing below, first feedthrough 802 can comprise otch 811 or other geometric properties, its make it possible to directly near one or several conductive path 806 on the internal layer that is set at first feedthrough 802 and and its be electrically connected.Remove outside first feedthrough 802, platform 800 also comprises second feedthrough 812 that links to each other with first feedthrough 802.Notice that first feedthrough 810 is removed outside the conductive path 806, can constitute by revolting heat conducting material basically, for example has the pottery of low thermal conductivity, for example aluminium oxide in an illustrated embodiment.In some cases, the pottery of low heat conductivity may for example aluminium nitride or beryllium oxide more need than the pottery of high thermal conductivity, this is because the pottery of this low heat conductivity has quite low cost, and utilize the material of this low heat conductivity, can easily be brazed on the various metals in the structure that for example can be used to head unit 700.In contrast, second feedthrough 812 in an illustrated embodiment is made of general material as heat conductor, for example metal.Various copper-tungstens are the examples that are applicable to the metal of this application.Thereby platform 800 generally is constructed for making up heat conducting element and non-heat conducting element, thereby produces about the wherein required effect or the result of the device of usage platform 800.
In conjunction with aforementioned, shall also be noted that pottery and metal are the material of some examples, anyly can help to realize that the materials with function that discloses or the combination of material all can be used here.In addition, other embodiments of the invention can be used conduction and the feedthrough non-conduction of different structure and quantity or have the feedthrough of other desirable characteristics.Thereby shown embodiment is some examples, and the limit should not limit the scope of the invention by any way.
About the structure of first feedthrough 802 and second feedthrough 812, their geometry generally can design as required, the feasible requirement that is suitable for application-specific or device.In the embodiment of the example shown in Fig. 4 A-4D, second feedthrough 812 and step 812A co-operation, step 812A is used for cooling device 900 is provided support, and further go through as following, thereby the device of guaranteeing to be installed on the cooling device 900 is positioned on desired position and the orientation.As further expression of Fig. 4 D, for example, second feedthrough 812 limits a semi-cylindrical bottom, shape with cap 704 is consistent basically for it, and contribute to the stability of cooling device 900 and sizable conduction quality is provided, be used for according to the heat conduction of using between help and cooling device 900 and other device.
As previously mentioned, platform 800 also is used for cooling device 900 is provided support.Once more attentiveness is focused on Fig. 4 A-4D now, the details about the various aspects of cooling device 900 is described.Specifically, provide the cooling device 900 that is directly installed on the platform 800.In the embodiment of an example, cooling device 900 comprises thermoelectric (al) cooler (TEC), its operation and function depend on peltier effect, and according to specific application requirements, the electric energy that wherein is applied on the TEC can cause that the part of the selection of TEC produces heat and cooling effect is provided.The constituent material that is used for the example of TEC includes but not limited to, bismuth-tellurides composition perhaps has other material of suitable thermoelectricity capability.
Notice that TEC only represents a kind of structure of example, also can use the cooling device of various other types that satisfy specific application requirements as requested.As an example, when what do not need one or several electronic device 1000 source temperature when control arranged, TEC can be replaced by the pad or the similar device of heat conduction, and described have source temperature control to describe in detail below.
Removing provides outside heating and the refrigerating function, and cooling device 900 also comprises secondary support 902, and it is supporting various electronic devices 1000, such as but not limited to resistance, electric capacity and inductance, and optics, for example speculum, laser and optical receiver.Thereby cooling device 900 and electronic device 1000 directly carry out hot link.
In the embodiment of an example, electronic device 1000 comprises laser 1002, for example semiconductor laser, perhaps other optical signal source.About some devices laser 1002 for example, cooling device 900 is set at least and is constructed for guaranteeing that laser 1002 is maintained at desired position and orientation.For example, in some embodiments of the invention, cooling device 900 is provided with like this, makes the emitting surface of laser 102 be fixed on the longitudinal axis A-A and and the described longitudinal axis A-A aligning (Fig. 4 C) of head unit 700.
Though attention comes reference laser diode 1002 here in conjunction with cooling device 900 use should be appreciated that it is exemplary using the embodiment of laser 102, can similarly use additional device or other device.Thereby scope of the present invention should not be interpreted as being only limited to the application of laser and laser.
Use among these embodiment of lasers 1002 at least some, the pair that photodiode 1004 and thermistor 1006 (Fig. 4 D) also are installed to cooling device 900 support on 902 or near.In general, photodiode 1004 and laser 1002 are optical coupled, make photodiode 1004 receive the light of at least a portion by laser 1002 emissions, so as to helping to collect the photoemissive light intensity data about laser 1002.In addition, thermistor 1006 and laser 1002 are thermal coupling, thereby make it possible to collect the temperature data about laser 1002.
In certain embodiments, photodiode 1004 comprises the monitor photodiodes of one 45 degree.Use such diode make relevant element for example laser 1002 and thermistor 1006 can be monitored, and can utilize lead to be connected on the same surface.In general, the monitor diode of 45 degree are provided with like this, make the light send from the back side of laser 1002 be refracted on the oblique surface of monitor diode, and are hunted down on the top surface of the sensitivity of monitor diode.In this way, monitor diode can detect the intensity of the light signal that is sent by laser.
Attention is used among the embodiment of laser 1002 at these, and cap 704 comprises an optically transparent part or window 704A, and the light signal that is sent by laser 1002 penetrates by described window.Similarly, comprise at electronic device 1000 under other the situation of optics, optical receiver for example, cap 704 comprises a window 704A equally, makes that optical receiver can receiving optical signals.As previously mentioned, the structure of cap 704 and configuration are generally selected as required, the feasible parameter that satisfies application-specific.
It seems from top general discussion about the various electronic devices 1000 that can be used in combination with cooling device 900, now again attention mobility on the relation between this electronic device 1000 and the cooling device 900.In general, cooling device 900 can be used for from one or several electronic device 1000 for example laser 1002 remove or heat, perhaps it is added heat, so that reach required effect.As here further describing, as required, be used for from a device for example laser 1002 remove or can be used to control the performance of laser 1002 to its ability of adding heat.
In the embodiment of an example, according to application, the heating and cooling of electronic device 1000 are realized by the cooling device 900 that comprises TEC.The structure of electronic device 1000 and cooling device 900 and the various aspects of configuration are used to strengthen this target.For example, electronic device 1000 is directly mounted on the cooling device 900, and this makes to have quite short heat passage between electronic device 1000 and cooling device 900.In general, correspondingly increase in the efficient of transmitting heat between these elements this making than short heat passage relatively between the element.When the operation of related device and performance are very responsive for heat and variations in temperature, laser for example, this result is particularly useful.In addition, compare when being not this situation, quite Duan heat passage also makes it possible to realize quickly heat transmission, and the structure of this example can be used for keeping effectively and reliably the temperature of laser 1002 or other device.
Another aspect of at least some embodiment relate to cooling device 900 not only with respect to electronic device 1000 but also with respect to the position of other components and parts, and the structure of head unit 700.Specifically, because cooling device 900 is provided with like this, the feasible potentiality that the heat of cooling device 900 is transmitted, no matter be radiation, the conduction, or convection current, being subjected to suitable restriction, the passive heat load that is imposed on the cooling device 900 by described other element and structure is quite little.Notice that as expection here, " heat load of first source " generally refers to the heat that is passed to cooling device 900 by some such structures and device, described structure and device are not the devices that cooling device 900 will apply heat and cold influence to it.Thereby in the embodiment of this example, " passive " heat load refers to the quilt of removing outside those heat loads that applied by electronic device 1000 and forces at all heat loads on the cooling device 900.
Because the position of cooling device 900 former thereby cause that the relative minimizing of the heat load of its experience has different implicit meanings.For example, the heat load of minimizing means, and is not that this situation is compared, and can use less relatively cooling device 900.This is the result of a hope, especially therein in the application of for example head unit of limited space system.As another example, less relatively cooling device 900 when at least wherein cooling device 900 comprises TEC, illustrates that the quantity that is used to operate the required electrical power of cooling device 900 is less relatively.
Performance about another consideration of the position of cooling device 900 and laser 1002 that is provided with in closed chamber 706 and other electron component 1000 is relevant.Specifically, cooling device 900 for example comprises that the layout of TEC in closed chamber 706 that " cold " connects stoped the generation of condensing that is caused by cold connection basically and cause other element of head unit 700 and the destruction of device, if cooling device 900 is set at the outside of closed chamber 706, then may take place describedly to condense and destroy.
Remove by means of heat transfer effect that cooling device 900 can realize being set and at cooling device 900 be installed in outside the quite short heat passage between the electronic device that the pair of cooling device 900 supports, different improvement by means of to the geometry of cooling device 900 can realize heat transfer effect.In conjunction with aforementioned, general situation is by means of the size that increases cooling device 900, can increase the ability that cooling device 900 is handled heat greatly.
In this respect, it should be noted that, situation in many application is, the diameter of base 702 suffers restraints usually, so that be suitable for certain predetermined form factor or dimensional requirement, and described form factor and dimensional requirement correspondingly have some implication for the geometry and the dimensional configurations of cooling device 900.
For example, place diameter on the base 702 to require to can be used for limiting the total height and the width (for example seeing Fig. 4 D) of cooling device 900.But, in contrast, the total length of head unit 700 does not generally have such strictness restriction.Thereby some aspect of cooling device 900 is its length for example, can be conditioned as required, so that be suitable for the requirement of application-specific.For example, under the situation of TEC, the increase of described size is converted into the relevant increase of the heat that can be handled by cooling device 900.As previously mentioned, described heat treatment can comprise from one or several electronic component 1000 for example laser 1002 remove heat and it transmitted heat.
In addition, the various sizes of cooling device 900 and geometry can be changed, so that realize other thermal effect.For example, comprise at cooling device 900 under the situation of TEC that less relatively cooling device 900 will allow the comparatively faster change of temperature of electronic device mounted thereto 1000.Comprise at electronic device 1000 under the situation of laser that this ability is special needs, because it helps to control by this media of adjustment the performance of laser.
Consider the power requirement of cooling device 900 now, when it comprises TEC and electronic device 1000 at least, mention above that the operation of these devices generally depends on the supply of electrical power.In general, TEC must and platform 800 be electrically connected, make the power that is used to operate TEC that passes to platform 800 from the power supply (not shown) can be assigned to TEC.In addition, provide power by means of platform 800 to electronic device, thereby electronic device 1000 must link to each other with one or several conductive path 806 of platform 800.
Above-mentioned electrical connection can be implemented with many different modes with structure.The various aspects of the connectivity scenario of example such as Fig. 4 A are shown in 4B and the 4E.At first referring to Fig. 4 B, the pair of cooling device 900 supports 902 downside and links to each other by means of connector 816 and the conducting element 814 on being arranged on first feedthrough 802, and described connector 816 is such as but not limited to being the lead connection.Described conducting element 814 can be electrically connected with conductive path 806 (seeing Fig. 4 A) and the connector 810 selected, and their final sum power supply (not shown) link to each other.
Then referring to Fig. 4 A, wherein provide details about the various aspects that are arranged on the secondary electrical connection of supporting the electronic component 1000 on 902.As previously mentioned and shown in Fig. 4 A, some embodiment of platform 800 comprise one or several otch 811 or other geometric properties, these features make it possible to electronic component 1000 for example laser 1002 be directly connected on one or several conductive path in first feedthrough 802 that is set at platform 800.This connection for example can for example connect lead or other suitable structure or device by means of connector 818 and realize.Remove outside the above-mentioned connection, shown in Fig. 4 E, some embodiments of the present invention also comprise flexible circuit 820 or similar device at least, and they are used for platform 800 and other device, for example printed circuit board (PCB) of electric interconnection head unit 700.
Referring now to Fig. 4 A-4D,, wherein provides details about each operating aspect of head unit 700.In general, by means of connector 810, conductive path 806 and connector 818 power supply is provided to laser 1002 and other electric component 1000.In response, laser 1002 emission light signals.Owing to the heat that the operation of laser 1002 and other electron component 1000 produces is removed continuously by cooling device, at least in head unit 700, use under the situation of laser 1002, described cooling device comprises TEC, and described heat is passed to second feedthrough 812 that cooling device 900 is installed on it.At last, second feedthrough 812 is the outside of the heat transferred that receives from cooling device 900 to head unit 700.
Because cooling device 900 is set in the closed chamber 706, the cold junction on the cooling device 900 that comprises TEC can not produce any undesirable condensing, and described condensing may be damaged other element or device of head unit 700.In addition, basically eliminated the passive heat loads on cooling device 900, described cooling device 900 and be coupled at the quite short heat passage that electronic component 1000 for example limits between laser 1002 and the cooling device 900, further strengthen the efficient of removing heat from described electronic component, thereby allowed to use less relatively cooling device 900.And as mentioned above, the cooling device 900 of relatively little size means that being used to operate cooling device 900 required power is relatively reduced.Describe in detail when the operating aspect of other of some embodiments of the invention is discussed below laser control system in addition.
Though in conjunction with Fig. 4 A-4D explanation, some effect can realize by cooling device 900 is arranged in the closed chamber 706 as the front, yet need cooling device is arranged on the outside of closed chamber in some cases.Some aspects of the embodiment of the example of this structure are shown in Fig. 4 F, and another embodiment of head unit represents with label 1100 among the figure.Because the embodiment at the head unit shown in Fig. 4 F is similar with one or several embodiment of head unit discussed above in many aspects, the discussion of Fig. 4 F will be primarily aimed at the aspect of some selection of the head unit 1100 shown in it.
Similar with other embodiment, head unit 1100 comprises that 1102, one platforms 1200 of base with device-side 1102A and connector side 1102B substantially perpendicularly pass described base.Platform 1200 comprises interior section 1202A and exterior section 1202B.The interior section 1202A of one or several electronic device 1300 and platform 1200 links to each other, and makes to be encapsulated in basically in the closed chamber 1104 that is limited by cap 1106 and base 1102.Comprise that at electronic device 1300 optics is for example under the situation of laser, cap 1106 can also comprise an optically transparent part or window 1106A, thereby makes light signal to be sent and to be received by one or several electronic device that is arranged in the closed chamber 1104.
Continuation is referring to Fig. 4 F, and platform 1200 also comprises first feedthrough 1204, electronic device 1300, the first feedthroughs is installed on it links to each other with second feedthrough 1206, and second feedthrough comprises interior section 1206A and exterior section 1206B.The exterior section 1206B of second feedthrough 1206 is hot link with cooling device 1400 again.In an illustrated embodiment, cooling device 1400 comprises TEC.But, also can use the cooling device of other type.
When operation, the heat that is produced by electronic device 1300 generally is passed to second feedthrough 1206 by conduction.This heat is removed from feedthrough 1206 by cooling device 1400 then, and in certain embodiments, cooling device comprises TEC.As the situation of other embodiment, if desired, also can use TEC to increase the heat of electronic device 1300.
Under the situation of location and setting like this, cooling device 1400 not only can be realized various thermal effects, for example the inside that is positioned at closed chamber 1104 or outside electronic device 1300 are removed or increased heat, and can also operate and handle passive heat loads, described passive heat loads be by the various elements of head unit 1500 for example structural detail apply, can be the heat load of conduction, convection current and/or radial pattern.As described in the discussion of other embodiment, some variablees, such as but not limited to, geometry, layout and the constituent material of platform 1200 and cooling device 1400 can be regulated as required, so that satisfy the requirement of application-specific.
As mentioned above, at least some embodiment of cold handler can usefully be used for the laser control system.Referring now to Fig. 5,, wherein shows the various aspects of embodiment of an example of the laser control system of representing with label 2000.
As shown in Figure 5, laser control system 2000 comprises temperature-detecting device 2002, thermistor for example, itself and for example semiconductor laser hot link of laser 2004.Laser control system 2000 also comprises luminous intensity checkout gear 2006, photodiode for example, and it optically is coupled with laser 2004.In addition, TEC 2008 and laser 2004 are hot link.In at least one embodiment, described hot link is to support to go up by the pair that laser 2004 is directly installed on TEC2008 to realize.Also comprise a control circuit 2010 through laser control system 2000, it is arranged to the input of reception from temperature-detecting device 2002 and luminous intensity checkout gear 2006, and is used for the power supply 2012 of communicating by letter with TEC2008 is sent control signal corresponding.
In general, the operation of laser control system 2000 is carried out according to following.Specifically, the intensity of the light signal that is sent by laser 2004 is carried out direct or indirect detection by luminous intensity checkout gear 2006.Then, luminous intensity checkout gear 2006 sends corresponding signal to control circuit 2010 termly.In at least some embodiment, the temperature of laser 2004 can be regulated by TEC2008, thereby reaches Wavelength stabilized.This can realize by means of control circuit 2010 and power supply 2012.
In addition, temperature-detecting device 2002 is positioned and disposes the temperature that is used for Laser Measurement device 2004, and sends corresponding signal termly to control circuit 2010.According to the input from temperature-detecting device 2002 and 2006 receptions of luminous intensity checkout gear, control circuit 2010 can be by means of the temperature of power supply 2012 and TEC2008 change laser 2004.
Specifically, TEC2008 can be arranged to and increase and remove heat from laser 2004, thereby, the temperature that laser control system 2000 can change and keep laser 2004 according to the needs or the requirement of application-specific.Thereby control circuit 2010 and TEC2008 co-operation are used to control direction and the quantity of hot-fluid with respect to laser 2004.In this way, can regulate each operating parameter of the signal that sends by laser 2004 as required.
In other words, the embodiment of laser control system 2000 not only can keep active device for example the temperature of laser 2004 at one below the critical value, in described critical value, it is bad that the performance of laser 2004 begins to become, and reliability becomes problem, and the embodiment of laser control system 2000 can also be independent of ambient temperature conditions control active device for example the temperature of laser 2004 be set-point, make and realize some target, for example under the situation of the operation of laser 2004, be used to realize Wavelength stabilized.
Do not break away from design of the present invention or essential characteristic, the present invention can use other particular form and implement.It is illustrative and nonrestrictive that described embodiment is considered in all respects.Therefore, scope of the present invention is defined by the following claims and can't help top explanation and limit.All meaning and interior changes of scope that drop on the equivalence of claim all are included in the scope of the present invention.

Claims (18)

1. transistor header device that is used to hold electric component comprises:
By the base that metal material is made, wherein said base has device side and component side: and
Platform, its device side and component side by described base vertically extends, and wherein said platform also comprises at least one conductive path that extends by described platform, at least a portion of the connector on the component side of described at least one conductive path formation base.
2. transistor header device as claimed in claim 1 is characterized in that, described transistor header device also comprises the lead-in wire that device side that at least one passes through base and component side extend, and wherein said at least one lead-in wire seals for described base.
3. transistor header device as claimed in claim 1 is characterized in that, described base also comprises the device that is used at a described head of socket interior orientation.
4. transistor header device as claimed in claim 1 is characterized in that, described base also comprises the device that is used for receiving a cap above device side.
5. transistor header device as claimed in claim 1 is characterized in that, described transistor header device also is included in a cap that seals on the device side of base.
6. transistor header device as claimed in claim 1 is characterized in that described platform comprises insulating material.
7. transistor header device as claimed in claim 6 is characterized in that, described insulating material is a pottery.
8. transistor header device as claimed in claim 1 also comprises the laser that is installed on the described platform.
9. transistor header device as claimed in claim 8 also comprises the photodetector that is used to monitor described laser.
10. head unit comprises:
Base, it is made of metal material, and has device-side and connector side;
Platform, its device-side and connector side by base is extended, and be in vertical direction with respect to base, described platform has the exterior section of the connector side of the interior section of device-side of proximate base and proximate base, and described platform comprises at least one conductive path that extends by described platform; And cooling device, it directly links to each other with the interior section of described platform.
11. head unit as claimed in claim 10 is characterized in that, described platform comprises first feedthrough, and it has the hot property that makes its heat conduction, and second feedthrough, and it has makes its athermanous hot property.
12. head unit as claimed in claim 10 is characterized in that, described cooling device comprises thermoelectric (al) cooler.
13. head unit as claimed in claim 10 also comprises a cap, itself and described base co-operation are used to limit one and seal the interior section of described platform and the closed chamber of described cooling device.
14. head unit as claimed in claim 10 also comprises the electronic device that is directly installed on the described cooling device.
15. head unit as claimed in claim 10 also comprises the Optical devices that are directly installed on the described cooling device, described Optical devices are selected from the group that is made of light sending device and optical pickup apparatus.
16. head unit as claimed in claim 10, it is characterized in that, described platform comprises the material of the first kind, the material of the described first kind has the hot property that makes its heat conduction, described platform also comprises the material of second type, and the material of described second type has makes its athermanous hot property.
17. head unit as claimed in claim 10 is characterized in that, described cooling device is electrically connected with at least one conductive path of described platform at least indirectly.
18. head unit as claimed in claim 10 is characterized in that, described platform also comprises the connector that is positioned at the outside of described platform and links to each other with at least one conductive path at least indirectly.
CNB038083868A 2002-02-14 2003-02-11 Header assembly having integrated cooling device Expired - Fee Related CN100435438C (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US10/077,067 US6586678B1 (en) 2002-02-14 2002-02-14 Ceramic header assembly
US10/077,067 2002-02-14
US10/231,395 US6703561B1 (en) 2001-09-06 2002-08-29 Header assembly having integrated cooling device
US10/231,395 2002-08-29

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EP1605560B1 (en) 2004-02-25 2016-08-03 OSRAM Opto Semiconductors GmbH Lightemitting semiconductor device and method for temperature stabilisation
JP5385116B2 (en) * 2009-12-17 2014-01-08 日本電信電話株式会社 Optical module
EP3410165B1 (en) 2016-02-26 2021-01-06 Huawei Technologies Co., Ltd. Optical assembly packaging structure, optical assembly, optical module and related devices and systems
FR3065348B1 (en) 2017-04-12 2022-06-24 Safran Electronics & Defense ELECTRONIC MODULE WITH IMPROVED PROTECTION AGAINST HUMIDITY
US10374386B1 (en) * 2018-06-07 2019-08-06 Finisar Corporation Chip on carrier

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WO2003069749A1 (en) 2003-08-21
CA2476195A1 (en) 2003-08-21
EP1483816A4 (en) 2006-08-30
JP2005518100A (en) 2005-06-16
EP1483816A1 (en) 2004-12-08
AU2003209132A1 (en) 2003-09-04

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