CN100468256C - Method for automatic configuration of a processing system - Google Patents
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- CN100468256C CN100468256C CNB200480001737XA CN200480001737A CN100468256C CN 100468256 C CN100468256 C CN 100468256C CN B200480001737X A CNB200480001737X A CN B200480001737XA CN 200480001737 A CN200480001737 A CN 200480001737A CN 100468256 C CN100468256 C CN 100468256C
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Abstract
A method of automatically configuring an Advanced Process Control (APC) system for a semiconductor manufacturing environment in which an auto-configuration script is generated for executing an auto-configuration program. The auto-configuration script activates default values for input to the auto-configuration program. The auto-configuration script is executed to generate an enabled parameter file output from the auto-configuration program. The enabled parameter file identifies parameters for statistical process control (SPC) chart generation.
Description
The application of this world requires the U.S. Provisional Application No.60/448 of submission on February 18th, 2003, the 319 U.S. Provisional Application No.60/491 that are entitled as " method of automatic configuration of system of processing " and submitted on July 31st, 2003,286 are entitled as the right of priority of " method of automatic configuration of system of processing ", quote its full content as a reference at this.
Cross reference to related application
The application relates to the U.S. Provisional Application No.60/414 of submission on September 30th, 2002,425 are entitled as " Method and apparatus for the monitoring and control of asemiconductor manufacturing process ", the U.S. Provisional Application No.60/393 that on July 3rd, 2002 submitted to, 091 is entitled as " Method for dynamic sensorconfiguration and runtime execution ", the U.S. Provisional Application No.60/383 that on May 29th, 2002 submitted to, 619 are entitled as " Method and apparatus for monitoringtool performance ", the U.S. Provisional Application No.60/374 that on April 23rd, 2002 submitted to, 486 are entitled as " Method and apparatus for simplified systemconfiguration ", the U.S. Provisional Application No.60/386 that on March 29th, 2002 submitted to, 162 are entitled as " Method for interaction with status and control apparatus ", the U.S. Provisional Application No.60/404 that on August 20th, 2002 submitted to, 412 are entitled as " Method forprocessing data based on the data content ", quote its full content as a reference at this.
Technical field
The present invention relates to the method for automatic configuration of system of processing, more particularly, relate to the method that automatic configuration is used for the system of processing of operation-operation (run-to-run) control.
Background technology
Computing machine generally is used to control, monitors and/or initialization manufacturing process, for example operation in the semiconductor manufacturing factory.Various I/O (I/O) equipment is used to control and monitor process flows, wafer state, and maintenance schedule.Exist in semiconductor manufacturing factory and finish from critical operations, for example material etches into the material deposition, and the various tool of these complex steps of equipment inspection.Most instruments are installed and are utilized display screen to finish, and described display screen is the part of the graphic user interface (GUI) that comprises the control computer of install software.The installation of semiconductor processing tools is a time-consuming process.
With regard to semiconductor machining, processing conditions changed along with the time.In many cases, simply with reference to the process data that shows, can not detect the variation of the process data of the deterioration that reflects processing characteristics.The prediction and the pattern-recognition that often need advanced technologies control (APC) to provide.
Facility control is realized by the many different control system with various controllers usually.Some control system can have man-machine interface, touch-screen for example, and other control system are only collected and show a certain state-variable.Surveillance must be able to be collected as the data of process control system tabulation.The data aggregation of surveillance must be handled the various data sets that comprise single argument data and multivariate data, comprise the various data processing of data analysis and data presentation, and/or comprise the various data selective powers of the ability of the state-variable that selection will be collected.If process data is shown automatically and detects, can be provided with and control the optimum process condition of production line of batch so by statistics technology controlling and process (SPC) chart.The poor efficiency supervision of facility can cause increasing the facility shut-down period of total production cost.
Summary of the invention
The method of automatic configuration of system of processing comprises that generation is used to carry out the auto-configuration script of auto configurator.Auto-configuration script activates the default value that is used for being input to auto configurator.Carry out auto-configuration script, so that produce the Parameter File of enabling from auto configurator output.Enable Parameter File identification and be used to add up the parameter that technology controlling and process (SPC) chart generates.
Description of drawings
In the accompanying drawing:
The schematic block diagram of advanced technologies control (APC) system in Fig. 1 graphic extension semiconductor fabrication environment;
Fig. 2 represents to describe the process flow diagram of the automatic configuration of APC according to an embodiment of the invention system;
Fig. 3 represents to describe the process flow diagram of the automatic generation of statistics technology controlling and process according to an embodiment of the invention (SPC) chart;
Fig. 4 represents to describe the process flow diagram of automatic calculating of the control limit of SPC chart according to an embodiment of the invention.
Embodiment
Fig. 1 represents the illustration block scheme of the APC system in the semiconductor fabrication environment.In the system of graphic extension, semiconductor fabrication environment 100 comprises semiconductor processing tools 100, a plurality of processing modules 120, PM1～PM4, sensor 130, sensor interface 140 and APC system 145.For example, sensor 130 can comprise optical emission spectrograph (OES) sensor that monitors condition of plasma, monitoring RF voltage of signals/current probe (VIP), and/or measure other technological parameter, pressure for example, the analog sensor of mass flowrate and temperature.APC system 145 can comprise interface server (IS) 150, APC server 160, client workstation 170, GUI 180 and database 190.The real-time storage device database that is called as " Hub " when for example, including among the IS 150.
In addition, for example, APC server 145 can couple with Intranet, and wherein Intranet also provides a kind of Internet server (not shown) that is used to enter the Internet.For example, Intranet can be at customer site, and for example the equipment manufacturers place provides interconnectivity.In addition, the long-range vendor site that is positioned at, but the computer system (not shown) remote access APC system 145 of equipment manufacturers for example.Remote computer system can be visited the data in the APC system, and provides control information by the Internet to APC system 145.
In the system of graphic extension, single instrument and four processing modules 120 are expressed together.APC system 145 can connect many machining tools, comprises the cluster tool with one or more processing modules.For example, these instruments can be used to realize etching, deposition, diffusion, coating, oxidation, cleaning, ashing, measurement, transfer, loading and unloading operation.In addition, APC system 145 can be from these machining tools, processing module and sensor collection, processing, preservation, demonstration, input and output data.
In addition, machining tool 110 can comprise a tool agent (not shown), it can be the software process of operation on instrument 110, and can be provided for making data acquisition and the synchronous event information of instrument processing, contextual information and beginning-stop timing order.In addition, APC system 145 can comprise a proxy client (not shown), and it can be the software process that can be used to provide to tool agent connection.
In the present embodiment, APC server 160 makes the configuration robotization of APC system, thereby can dispose and enable the automatic generation of statistics technology controlling and process (SPC) chart after installing immediately.During installation, the setter of software can be required to provide the information (for example IP address, numeral and the type of processing module 120) of relevant hardware configuration.During installation, system can be automatically configured to and carry out default data collection.Default configuration can allow data aggregation and all summaries (summary) CALCULATION OF PARAMETERS of all tool level trace (trace) parameter.On the other hand, default configuration also can comprise at least one external sensor.
After the installation, the APC system can be automatically configured to and utilize SPC batch (run) rule (rule) assessment to carry out fault detect.The available summary statistics of each of the trace parameters that each is available (mean value, standard deviation, minimum value, maximal value etc.) is to be used for the candidate that automatic SPC chart produces.Tool level trace parameters can comprise value measurement and state-variable report, for example for etch system, comprises specific gas flow rate, RF power, RF reflective power, peak-to-peak voltage, pressure, temperature etc.Available parameter and statistic to the mapping of enabling parameter based on setter or operator's suggestion with specific to the requirement of technology.
If the selection of parameter changes, can rerun automatic configuration in any time after installing so.
In case be mounted, so in working time,, can produce the SPC chart automatically so in case run into new method for making, so that follow the tracks of at processing step, controlled and not controlled (enabled) parameter of enabling during the RF step in the etch system for example.Controlled parameter comprises the trace parameters with set point.According to the percent that departs from set point or depart from the absolute value of set point, these parameters are controlled on instrument in certain tolerance limit.For the method for making and the processing step of appointment, it is 0 set point that some controlled parameters can have.In this case, can not use the percentile technology that departs from set point, because it requires divided by 0.Controlled parameter does not comprise the trace parameters that does not have set point.The value of these parameters generally depends on the set point of controlled parameter.In each chart that automatically produces, accumulated the wafer of configurable number, and if this parameter enabled automatic calculation flag, calculation control bound so automatically, and assess according to the SPC operation rule, chart is activated so that report to the police.
During installation, setter provides the information relevant with the hardware configuration of instrument, comprises the type of module that is mounted.For example, can use many problems, and can point out setter to answer.The selection of the processing module of particular type is the automatic allocating default data collection plan of this processing module subsequently.The default data collection plan is with setter, the technologist, and the information that may also have technological requirement to provide is the basis.Be not that all parameters of stipulating in data collection plan all will be activated and be used for automatic SPC chart and produce.The tabulation of the parameter of enabling for automatic SPC charting can be provided by auto-configuration script, and based on the known practice or the technological requirement of the best.Auto-configuration script can the random time after installation be performed.
Known practice according to the best provides the acquiescence of enabling parameter to select.But, select a different set of automatic configuration data file that parameter provides of enabling by being utilized as, excel spreadsheet lattice for example, setter can cover default value.Enabling parameter is to produce those parameters of selecting for automatic SPC chart.
According in automatic configuration data file, for example dispose the selection of carrying out in the excel spreadsheet lattice (spreadsheet) automatically, be provided with by auto-configuration script (script) and enable/initial value of disable flag.
Flow process Figure 200 of these mutual relationships is described in Fig. 2 graphic extension.For example, by utilizing electrical form 210, setter can produce and comprise the automatic configuration data file of enabling parameter, and produces comma separated value (CSV) file 230 with the parameter of enabling 220.When carrying out auto-configuration script 250, auto configurator 240 reads the tabulation of enabling parameter 230, and the information that wherein provides in csv file 230 covers (override) default value, and parameter list 260 is enabled in generation in persistent database.
In addition, auto-configuration script can embody following one of arbitrarily: (1) please be summed to the relevant information of tool configuration of supporting this feature and needing; (2) according to the selection of the types of models of setter, the default data collection plan of disposing each processing module; (3) the best known practice that the default data collection plan is provided based on operator's (or setter); (4) provide the default data collection plan, so that comprise default data arrangement step; (5) according to module type and best known practice, utilize automatic configuration data file, excel spreadsheet lattice for example provide system to be chosen as that automatic SPC chart produces and the required information of parameter of enabling; (6) be provided at installation random time afterwards,, wherein can for example stipulate described one group of alternative parameter in the excel spreadsheet lattice in automatic configuration data file with one group of one group of possibility of enabling parameter of enabling parameter replacement acquiescence that the technology user provides; (7) be provided as in persistent database that automatic SPC chart produces and the availability of the parameter list enabled; And/or (8) provide the system-level mechanism of enabling/forbidding " the SPC chart produces automatically ".
The process flow diagram of the automatic generation method 300 of Fig. 3 graphic extension SPC chart.305, the SPC algorithm is activated automatically, 310, carries out producing mode query automatically; For example, can point out setter or operator to answer one or more problems.If not, method 300 is terminated 360 so.Automatically produce pattern if desired, determine 315 so, will produce those parameters of SPC chart for it automatically with identification.
320, the appropriateness (eligibility) of each parameter that assessment SPC chart produces.If a certain parameter is considered to unsuitable, solve next parameter 345 so.If a certain parameter is considered to suitable, inquire 325 so, to determine whether there is the SPC chart for this parameter.If not, produce the SPC chart 330 so, solve next parameter 345 subsequently.If the SPC chart exists, be attached to the SPC chart 335 these parameters so.
340, inquire, to determine whether there is control limit about the SPC chart of appointment.If control limit exists, solve next parameter 345 so.If control limit does not exist, inquire 350 so, have the data point of enough numbers of calculation control limit to determine the SPC chart.If, so in 355 calculation control limits.If not, solve next parameter 345 so.When checking last parameter 345, and when not having any other parameter, subsequently at 360 terminating methods 300.
For example, represent processing step, for example the parameter of the RF step in the etch process is attached to appropriate SPC chart automatically.If this chart does not exist, produce this chart so automatically, but do not control bound.New chart of every kind of combination results for module, method for making (recipe), parameter and processing step.Thereby, if have 10 parameters and all have 50 kinds of method for makings of 5 processing steps, this technology will produce 2500 SPC charts (number of the SPC chart of generation is that number that the number of parameter multiply by method for making multiply by the product that the number of the processing step in every kind of method for making obtains again) so.Automatically the SPC chart that produces must separate with the chart area of manual generation.The SPC chart that its control bound is not set does not experience the operation rule assessment, thereby does not produce any warning.So to each module, new method for making is enabled parameter and each processing step that runs into is produced a new chart each.The chart of Chan Shenging will be visited according to the mode identical with the SPC chart of manual generation by user's (utilizing GUI) like this.
Automatically other embodiment that produces the automatic configuration system of SPC chart for the single argument parameter of representing processing step can comprise following one of arbitrarily: (1) each processing step is defined as: " summary parameters value (for example, giving the forward direction RF power of bottom electrode) is greater than the step of threshold value therebetween "; (2) graphic user interface (GUI) can be used for allowing the user to select to be used for the summary parameters of definition process step; (3) GUI can be used for allowing the user to select threshold value; (4) in working time, when running into new method for making, if " automatically SPC chart produce " is " enabled ", and there be not (manually or automatically producing) in chart, can be each that represent the RF step so and enables parameter chart of generation automatically; (5) each enables the sign that parameter can have the manual or automatic limit setting of appointment; (6) if select " limit automatically ", so at the beginning, the SPC chart of generation can not have upper control limit or lower control limit, and the operation rule assessment can be disabled; (7) if select " manually limit ", can the limit about each chart that produces be set according to the value of in electrical form, importing so, and can be provided with, enable the operation rule assessment according to the operation rule assessment; (8) title of the SPC chart that produces automatically can be unique; (9) the SPC chart that produces like this can be suitable for utilizing the SPC chart GUI of standard to edit; (10) except the SPC chart, can produce plan of analysis and strategy automatically; (11) correlation analysis plan that produces like this and strategy can be suitable for utilizing the plan of analysis of standard and tactful GUI to edit; (12) user can separate the SPC chart of automatic generation and the chart area that manually produces; (13) user can distinguish the correlation analysis plan of automatic generation and strategy with the plan of analysis and the strategy that manually produce; And/or (14) warning of producing like this again according to about " RF step parameter " SPC chart default notification and intervention be set, produce notice and intervene.
Notice that the SPC chart that produces automatically appears in the analysis strategy according to the mode identical with the SPC chart of manual generation.In case produced, the filling of chart just takes place, and irrelevant with the state of " the SPC chart produces automatically " mark.Thereby, in case produced,, each SPC chart and analysis strategy are broken away from get in touch if no longer need to fill, GUI can provide and make plan of analysis and chart and analysis strategy break away from the means of getting in touch.
In order to simplify the automatic generation of SPC chart and control limit, can be according to the standard deviation of the point of distributing to this chart, automatic compute bound.In this example, represent a certain processing step, for example the parameter of the RF step in the etch system is attached to appropriate SPC chart automatically.In case the number of the point on the SPC chart reaches configurable value (for example being used to add up enough numbers of practice), calculate the mean value and the standard deviation of these points so automatically.Before calculating mean value and standard deviation, calculation routine is removed the point of not representing this data set automatically.The number of the point that existed before compute bound is stipulated by " the required number of the point before calculating automatically ", and is stipulated by parameter.The required number of point can obtain after installing or before installing, and perhaps comprises during installation the point that obtains during the pre-filling of database.For example, the pre-filling of database can take place in the instrument for saving historical data before installing in the APC system.Mean value of Ji Suaning and standard deviation are used to calculate the upper control limit and the lower control limit of SPC chart subsequently like this.
Two kinds of technology can be used for automatic calculation control limit, that is, and and with the percentile form of mean value with the form calculation control limit of the inclined to one side multiple of mean value plus-minus standard.The upper limit can be calculated as the percent that is higher than mean value, and for example 5%～10%, perhaps be calculated as the specified multiple (factor) that mean value adds standard deviation, for example 2～6 σ.Lower limit can be calculated as sub-average percent, and for example 5%～10%, perhaps be calculated as the specified multiple that mean value deducts standard deviation, for example 2～6 σ.Stipulate percent that will use or the multiple that will use by parameter, the means that the GUI screen can provide input and/or edit described percent and multiple.In addition, the warning limit also can provide on some SPC charts, and can determine in a comparable manner.
In an alternative, for current substrate batch (substrate run), new upper control limit (UCL) and new lower control limit (LCL) are confirmed as the mark of the old value of last substrate batch, and the mark of aforesaid calculated value.For example, new control limit can comprise by utilizing the old value of current observation (being substrate batch), the calculated value of current observation (being substrate batch), and filter constants, use correcting filter, for example exponentially weighted moving average (EWMA) (EWMA) wave filter upgrades control limit, that is:
UCL
new＝(1-λ)UCL
old+λ(UCL
calculated) (1a)
LCL
new＝(1-λ)LCL
old+λ(LCL
calculated) (1b)
Wherein λ is EWMA filter coefficient (0≤λ≤1), UCL
OldAnd LCL
OldBe (outmoded) control limit value of last batch, UCL
CalculatedAnd LCL
CalculatedIt is current batch aforesaid calculation control limit value.Notice that new control limit value equals old control limit value when λ=0, when λ=1, the control limit value that new control limit value equals to calculate.
After control limit is determined, by parameter regulation operation rule assessment (will use which kind of operation rule).In case for given chart, upper control limit and lower limit are determined, so this chart is enabled the operation rule assessment.In addition, when for given chart, when high alarm setting and lower limit were determined, the operation rule assessment also can comprise the situation based on the warning limit.
Fig. 4 graphic extension represents to calculate automatically the process flow diagram of the method 400 of the control limit of specifying the SPC chart.405, start automatic computational algorithm.410, for the data that present in the SPC chart, calculating mean value and standard deviation.415, detect the data exception value, and if necessary, eliminate the data exception value 420.
425, the type of the definite control limit that will set up.If the use standard deviation utilizes UCL=mean value+factor * standard deviation calculation upper control limit (UCL) 430 so, utilize LCL=mean value-factor * standard deviation calculation lower control limit (LCL) 435; Wherein select the factor so that force the standard deviation of some, for example 3.If use the percent of mean value, utilize UCL=mean value+%* mean value calculation upper control limit (UCL) 440 so, utilize LCL=mean value-%* mean value calculation lower control limit (LCL) 445.In an alternative, as mentioned above, utilize the calculated value of above mentioned current substrate batch, the old value of last substrate batch, and EWMA wave filter for example can be provided with new control limit.
450, can enable operation rule, 455, computational algorithm is terminated automatically.In alternative, can use similar method to determine the warning limit.
Automatically other embodiment of automatic configuration system of SPC limit that calculates the parameter of a certain processing step of representative can comprise following one of arbitrarily: (1) is if " the SPC chart calculates automatically " sign is " enabling ", and in case the SPC chart has been accumulated configurable " counting ", the mean value of computational data collection and standard deviation so automatically automatically; (2) the automatic calculating of mean value and standard deviation can be got rid of and is confirmed as exceptional value, perhaps the point of representative data not; (3) required the counting of automatic calculating that triggers mean value and standard deviation can be stipulated by " counting " parameter; (4) GUI can be used for input " counting " parameter; (5) " counting " parameter of importing like this can be the number greater than 3; (6) multiply by standard deviation according to the percent of deviation average or according to a certain factor, compute bound automatically, which kind of calculating sign can will use by the parameter appointment; (7) if choice criteria deviation option, upper control limit can be calculated as " multiple " that mean value adds standard deviation so; (8) if choice criteria deviation option, lower control limit can be calculated as " multiple " that mean value deducts standard deviation so; (9) GUI can be used for importing " multiple " (or the factor) that will use in limit is calculated; (10) GUI can be used for importing " percent " that will use (%) in limit is calculated; (11) GUI can be used for selecting to use which kind of computing technique; (12) after having set control limit, can enable the operation rule assessment; (13) operation rule selects (will assess which operation rule) to be stipulated by parameter; (14) operation rule selects (will assess which operation rule) can be suitable for utilizing GUI to edit; And/or the limit that (15) are determined automatically can be suitable for utilizing standard SPC chart GUI to edit.Parameter can be for example single argument or multivariate.
On the other hand, automatic configuration system can provide the automatic generation ability of the SPC chart of continuous stability step duration.The stability step duration comprises that the condition that allows in the processing module became stable stability step before the processing beginning.The duration of stability step is a variable, depends on method for making setting and process module state.Tool recipe specifies special process parameter, for example the pressure in the etch system becomes stable maximum time length.Because in stability step, trace parameters constantly changes, so the step summary parameters of standard (mean value, standard deviation, minimum value, maximal value) almost is not worth.
Can give tacit consent to " stability step duration " SPC chart that comprises each module." stability step " SPC chart acquiescence interrelates with " stability step duration " parameter of each module.Control limit is by " stability step " SPC chart regulation of each module.
Other embodiment that the continuous stability step duration automatically produces the automatic configuration system of SPC chart can comprise following one of arbitrarily: below (1), stability step is defined as " summary parameters value (for example, giving the forward direction RF power of bottom electrode) is less than threshold value " therebetween; (2) GUI can be suitable for allowing the user to select to be used for the definition process step, for example the summary parameters of the RF step in the etch system; (3) GUI can be suitable for allowing the user to select threshold value; (4) system can have and produces the duration represent stability step, and is the ability of the single parameter of unit definition duration of becoming stability step with the second; (5),, can produce the new summary variable of the duration of representing stability step, and the result can be attached to the summary reckoner for the stability step of each selection in working time; (6) the stability step duration of selecting like this can be stored in persistent database and the memory database; (7) can produce a SPC chart of each processing module, so that put up the stability step duration; (8) each stability step duration parameter is attached in " stability step duration " SPC chart of each processing module the control that is provided with by " stability step duration " sign; (9) lower control limit of this chart and upper control limit are given tacit consent to the limit in acquiescence " stability step duration " the SPC chart that can be provided with for this purpose and produce; (10) GUI can be used for allowing the user to change the lower control limit and the upper control limit of " stability step duration " SPC chart; (11) contextual information (instrument, processing module, method for making, step, parameter, value, date) that sends to each point of " stability step duration " SPC chart can obtain from the SPC graph table database; (12) contextual information that sends to each point of " stability step duration " SPC chart can be seen from the SPC chart; (13) in working time, each point of violating the SPC operation rule can produce " alarm "; (14) the available intervention that this alarm is carried out and notice can with current SPC intervene with notify identical; (15) alarm can comprise the contextual information of the wafer that causes alarm; And/or (16) acquiescence is intervened and notice can be stipulated by " acquiescence intervention and the notice of stability step duration " SPC chart.The SPC chart can be single argument or multivariate data.
On the other hand, automatic configuration system can provide the ability of the SPC chart of automatic generation JUST PROCESS step duration.If select in enabling parameter list, a chart appears producing in each non-zero that can be parameter " JUST PROCESS " so.On the principle, can exist and the as many JUST PROCESS time of step.In the practice, as many 3 JUST PROCESS times that generally can exist and in process recipes, write down.In the practice of reality, every kind of method for making can have only a JUST PROCESS time, because in fact, recipe step is only used an operation, the etching work procedure that for example has end-point detection usually.When JUST PROCESS was 0, it means did not have end points to be called.In this case, the JUSTPROCESS parameter is ignored by this feature.If be activated, can be the SPC chart of each non-zero JUST PROCESS parameter generating that finds in working time so.The lower control limit of this chart and upper control limit acquiescence can be provided with the limit in acquiescence " JUSTPROCESS " the SPC chart that produces for this purpose.In the SPC chart to be single argument or multivariate data.
Automatically other embodiment of automatic configuration system that produces the SPC chart of JUST PROCESS step duration can comprise following one of arbitrarily: below (1), JUST PROCESS is defined by each step record parameter value once, with the indication invoked time of end points, in the APC system, exist and 24 such parameters of the maximum number correspondence of the step that on current tool software, allows; (2) GUI can be suitable for allowing the user to select the enable parameter of JUST PROCESS as automatic SPC chart generation; (3),, can produce a SPC chart for each non-vanishing step of JUSTPROCESS parameter in working time; (4) the JUST PROCESS duration of selecting like this can be stored in persistent database and the memory database; (5) GUI can be suitable for allowing the user to change the lower control limit and the upper control limit of " JUST PROCESS " SPC chart; (6) contextual information (instrument, processing module, method for making, step, parameter, value, date) that sends to each point of " JUST PROCESS " SPC chart can obtain from the SPC graph table database; (7) contextual information that sends to each point of JUST PROCESS SPC chart can be seen from the SPC chart; (8) in working time, each point of violating the SPC operation rule can produce " alarm "; (9) the available intervention that this alarm is carried out and notice can with conventional SPC intervene with notify identical; (10) alarm can comprise the contextual information of the wafer that causes alarm; And/or (11) acquiescence is intervened and notice can be stipulated by " acquiescence intervention and the notice of JUST PROCESS ".
Though top describes illustration embodiment more of the present invention in detail, but those skilled in the art is easy to recognize that in illustration embodiment many modifications all are possible, and can essence not break away from instruction of the present invention and advantage.Therefore, scope intention of the present invention comprises the modification that all are such.
Claims (35)
1, a kind of is the method for semiconductor machining environment automatic configuration system, comprising:
Generation is used to carry out the auto-configuration script of auto configurator, and wherein said auto-configuration script activates the default value that is used for being input to auto configurator;
Carry out described auto-configuration script, so that produce the Parameter File of enabling from described auto configurator output, the wherein said Parameter File of enabling is discerned the parameter that is used to add up the generation of process-control chart table;
Enable at least one statistics technology controlling and process chart of parameter generating at least one is described, when wherein said generation comprises the described auto-configuration script of each execution, produce described statistics technology controlling and process chart automatically; And
Produce at least one the control limit in described at least one statistics technology controlling and process chart, when wherein said generation comprises the described auto-configuration script of each execution, calculate described control limit automatically.
2, in accordance with the method for claim 1, also comprise:
Generation is configured to the automatic configuration data file that read by described auto configurator, and wherein said automatic configuration data file comprises at least one of enabling in the parameter list and covers the sign of described default value.
3, in accordance with the method for claim 1, wherein said control limit comprises at least one in upper control limit and the lower control limit.
4, in accordance with the method for claim 1, wherein in case in described statistics technology controlling and process chart, reach requisite number destination data point, the described control limit of so automatic calculating.
5, in accordance with the method for claim 4, the abnormity point in the wherein said requisite number destination data point is removed.
6, in accordance with the method for claim 4, wherein, calculate described control limit according to the percent of the mean value of requisite number destination data point described in the described statistics technology controlling and process chart.
7, in accordance with the method for claim 4, wherein, calculate described control limit according to the product of the standard deviation of requisite number destination data point described in a certain factor and the described statistics technology controlling and process chart.
8, in accordance with the method for claim 6, wherein said upper control limit UCL is determined that by UCL=mean value+percent * mean value described lower control limit LCL is determined by LCL=mean value-percent * mean value.
9, in accordance with the method for claim 7, wherein said upper control limit UCL is determined that by UCL=mean value+factor * standard deviation described lower control limit LCL is determined by LCL=mean value-factor * standard deviation.
10, in accordance with the method for claim 8, wherein said percent is stipulated by the user.
11, in accordance with the method for claim 10, wherein utilize electrical form to stipulate described percent.
12, in accordance with the method for claim 10, wherein utilize GUI to stipulate described percent.
13, in accordance with the method for claim 9, the wherein said factor is stipulated by the user.
14, in accordance with the method for claim 13, wherein utilize electrical form to stipulate the described factor.
15, in accordance with the method for claim 13, wherein utilize GUI to stipulate the described factor.
16, in accordance with the method for claim 4, wherein the described required number of data point is stipulated by the user.
17, in accordance with the method for claim 16, wherein utilize the described required number at electrical form stated number strong point.
18, in accordance with the method for claim 16, wherein utilize the described required number at GUI stated number strong point.
19, in accordance with the method for claim 4, wherein said requisite number destination data point is included in the many data points that obtain during the pre-filling of APC system.
20, in accordance with the method for claim 7, also comprise:
Dispose the operation rule assessment of described at least one statistics technology controlling and process chart; With
Enable described operation rule assessment.
21, in accordance with the method for claim 20, wherein said operation rule assessment is disposed by the user.
22, in accordance with the method for claim 21, wherein utilize electrical form to stipulate the described factor.
23, in accordance with the method for claim 21, wherein utilize GUI to stipulate the described factor.
24, in accordance with the method for claim 4, wherein determine the control limit of described automatic calculating, and use it for the old control limit of renewal from last substrate batch for current substrate batch.
25, in accordance with the method for claim 24, wherein new control limit equals (1-λ)
*Described old control limit+λ
*(control limit of described automatic calculating), described λ is a filter constants, value is 0～1.
26, in accordance with the method for claim 8, wherein determine described definite upper control limit UCL, and use it for the old upper control limit of renewal from last substrate batch for current substrate batch.
27, in accordance with the method for claim 9, wherein determine described definite upper control limit UCL, and use it for the old upper control limit of renewal from last substrate batch for current substrate batch.
28, in accordance with the method for claim 26, wherein new upper control limit equals (1-λ)
*Described old upper control limit+λ
*(described definite upper control limit), described λ is a filter constants, value is 0～1.
29, in accordance with the method for claim 27, wherein new upper control limit equals (1-λ)
*Described old upper control limit+λ
*(described definite upper control limit), described λ is a filter constants, value is 0～1.
30, in accordance with the method for claim 8, wherein determine described definite lower control limit LCL, and use it for the old lower control limit of renewal from last substrate batch for current substrate batch.
31, in accordance with the method for claim 9, determine described definite lower control limit LCL for current substrate batch in being total to, and use it for the old lower control limit of renewal from last substrate batch.
32, in accordance with the method for claim 30, wherein new lower control limit equals (1-λ)
*Described old lower control limit+λ
*(described definite lower control limit), described λ is a filter constants, value is 0～1.
33, according to the described method of claim 31, wherein new lower control limit equals (1-λ)
*Described old lower control limit+λ
*(described definite lower control limit), described λ is a filter constants, value is 0～1.
34, in accordance with the method for claim 1, but wherein by described at least one the statistics technology controlling and process chart of the Internet remote access.
35, in accordance with the method for claim 1, wherein by the addressable described control limit in the Internet.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US44831903P | 2003-02-18 | 2003-02-18 | |
| US60/448,319 | 2003-02-18 | ||
| US60/491,286 | 2003-07-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1723423A CN1723423A (en) | 2006-01-18 |
| CN100468256C true CN100468256C (en) | 2009-03-11 |
Family
ID=35912863
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB200480001737XA Expired - Fee Related CN100468256C (en) | 2003-02-18 | 2004-02-12 | Method for automatic configuration of a processing system |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN100468256C (en) |
| TW (1) | TWI234056B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI618939B (en) * | 2016-03-17 | 2018-03-21 | 鴻海精密工業股份有限公司 | A system and a method for detecting industrial equipment |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104750049B (en) * | 2013-12-31 | 2018-05-08 | 北京北方华创微电子装备有限公司 | The method and system of gas circuit configuration processing in semiconductor manufacturing |
| CN107871698A (en) * | 2017-11-07 | 2018-04-03 | 君泰创新（北京）科技有限公司 | Process establishment, acquisition, guard method and the device of manufacture of solar cells equipment |
| EP3657281B1 (en) * | 2018-11-26 | 2022-11-30 | ASML Netherlands B.V. | Control strategy evaluation tool for a semiconductor manufacturing process and its user interface |
| US11302545B2 (en) * | 2020-03-20 | 2022-04-12 | Nanya Technology Corporation | System and method for controlling semiconductor manufacturing equipment |
| US11675340B2 (en) * | 2020-04-08 | 2023-06-13 | Nanya Technology Corporation | System and method for controlling semiconductor manufacturing apparatus |
| CN113126485A (en) * | 2021-04-21 | 2021-07-16 | 长鑫存储技术有限公司 | Parameter dynamic control method and device, electronic equipment and storage medium |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN1723423A (en) | 2006-01-18 |
| TWI234056B (en) | 2005-06-11 |
| TW200424816A (en) | 2004-11-16 |
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