CN100470958C - 在固定到基板时防止电连接器斜度的方法 - Google Patents

在固定到基板时防止电连接器斜度的方法 Download PDF

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CN100470958C
CN100470958C CNB200310102634XA CN200310102634A CN100470958C CN 100470958 C CN100470958 C CN 100470958C CN B200310102634X A CNB200310102634X A CN B200310102634XA CN 200310102634 A CN200310102634 A CN 200310102634A CN 100470958 C CN100470958 C CN 100470958C
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斯坦利·W·沃尔森
约瑟夫·B·叔艾
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Abstract

一种在固定到基板时防止电连接器斜度的方法，包括：提供具有质量大于第二部分的第一部分的电连接器；以及平衡所述电连接器的所述第一和第二部分，使在所述电连接器固定到基板时保持与所述基板基本平行。

Description

在固定到基板时防止电连接器斜度的方法
本申请是申请号为00134879.5、申请日为2000年10月19日、名称为“具有应力释放的电连接器”的申请的分案申请。
技术领域
本发明涉及电连接器。特别地，本发明涉及具有应力释放特征的电连接器。
背景技术
各种类型的电连接器依赖表面固定技术(SMT)将连接器触点固定到基层基板。SMT连接器比早期的连接器具有更多优点，如简化制造和降低成本。
虽然提供了这些优点，但使用SMT也会引起其它问题。例如，一个担忧涉及触点与基层基板之间的焊接点吸收例如由装运、操作、装配以及热循环引起的力的能力。这些环节中的任何一个损坏将使焊接点变得不稳定，对整个连接器产生不利影响。
球格阵列(BGA)技术是SMT的一种。概括地说，利用BGA的电连接器有一个内带触点的壳。可熔元件，典型的是焊接球，固定到每个触点。焊接球作为触点与基板表面之间的基本连接。逆流过程将焊接球熔化到基板。在逆流过程期间，发生BGA技术有益的“自对中”特征。特别地，作为焊接逆流，焊接表面张力有助于将连接器适当地与基层基板上的导电垫对齐。
对于SMT连接器，BGA连接器中的焊接点上的力也提出了一个担忧。由于BGA连接器的自对中能力，但是，许多使用在SMT连接器的解决方案不能用于BGA连接器。因此，需要开发为BGA连接器提供应力释放的技术。
本发明克服了早期开发中的上述限制，并为向BGA连接器提供应力释放提供了技术。特别地，本发明提供了具有可被插入到印刷电路板(PCB)通孔的保持柱的连接器体。该柱装配在通孔中而无须静配合。通过使连接器体和PCB吸收部分力，该柱转移了作用在触点和PCB垫之间的焊接点上的部分力。
发明内容
本发明的目的是提供具有应力释放特征的电连接器。
本发明的另一目的是提供具有应力释放特的球格阵列电连接器。
本发明的另一目的是向与连接器自对中能力兼容的球格阵列电连接器提供应力释放特征。
本发明的另一目的是提供以简化步骤制造的电连接器。
本发明的这些和其它目的通过可固定到基板的电连接器在本发明的一个方面中实现。电连接器包括一个壳，固定到壳并适于表面固定到基板的表面固定触点，以及固定到壳并适于固定到基板的非表面固定夹具。表面固定触点包括可熔元件，例如焊接球，多个焊接球可形成矩阵阵列。电连接器这样构造，使在其固定到基板时保持基本平行。电连接器还可包括固定到壳的支座。支座适于使壳与基板表面保留一定距离或限制表面固定触点与基板之间焊接点的扁度。支座可以是夹具的一部分。电连接器的非表面固定夹具可以是从壳向外延伸的柱并适于进入基板中的孔。
本发明的这些和其它目的通过可固定到基板的球格阵列连接器在本发明的另一个方面中实现，球格阵列连接器包括一个壳和壳中的多个触点。球格阵列还包括多个固定到触点用于将连接器固定到基板的可熔元件，以及适于进入到基板的夹具。夹具固定到壳。球格阵列连接器还包括从壳延伸的支座并适于使壳和基板表面保留一定距离或限制逆流期间可熔元件的扁度。支座可以是夹具的一部分。夹具可以是从壳向外延伸的柱。可熔元件可以是焊接球。此外，球格阵列连接器可以这样构造，使它在固定到基板时保持基本平行。
本发明的这些和其它目的通过将电连接器固定到触点的方法在本发明中的另一个方面中实现。本方法包括提供基板，以及具有触点和夹具的电连接器。电连接器可以是球格阵列连接器。本方法还可包括将触点固定到基板，将夹具置于基板中，并将夹具固定到基板。这种固定可包括将夹具焊接到基板。本方法还可包括构造电连接器，使当它固定到基板时保持基本平行。同样，本方法包括在基板上平衡电连接器，这样电连接器在它们被固定期间保持与基板基本平行。此外，触点固定可在夹具固定之前出现。
本发明的这些和其它目的通过防止在电连接器固定到基板时电连接器的斜度的方法在本发明的另一个方面中实现。本方法包括提供具有比第二部分质量大的第一部分的电连接器，并平衡电连接器的第一和第二部分，使电连接器在其固定到基板时保持与基板基本平行。这种平衡可包括从电连接器第一部分移去材料和/或将材料加到电连接器的第二部分。电连接器可以是球格阵列连接器。
本发明的这些和其它目的可通过可固定到基板的电连接器在本发明的另一方面中实现。电连接器包括具有面向基板固定端的壳，以及多个固定到壳的触点。电连接器还包括多个可熔元件，每个可熔元件固定到多个触点的对应触点，以及从壳的固定端延伸一定距离的支座。该支座可允许可熔元件的部分扁度。可以选择该距离，以便限制逆流期间可熔元件的扁度，或防止邻近可熔元件之间的桥接。可熔元件可以是例如焊接球。
本发明的这些和其它目的通过改进的可固定到基板的球格阵列连接器在本发明的另一方面中实现。本改进包括适于进入基板中的开口的夹具。夹具可适于非静配合进入开口。
根据本发明的一个方面，这里提供一种用于防止电连接器固定到基板上有斜度的方法，包括以下步骤：提供一个电连接器壳体，该电连接器壳体具有第一部分，该第一部分的质量大于第二部分的质量；和在一个球格阵列上平衡所述电连接器的所述第一和第二部分的质量，其特征在于：所述的在一个球格阵列上平衡电连接器的第一和第二部分的质量的步骤还包括以下步骤：将材料加入到所述电连接器壳体的所述第二部分中，以使所述的电连接器被安装到基板上时保持基本上平行于所述的基板。
根据本发明的另一个方面，这里提供一种用于防止电连接器固定到基板上时有斜度的方法，包括以下步骤：提供一个电连接器壳体，该电连接器壳体具有第一部分，该第一部分的质量大于第二部分的质量；和在一个球格阵列上平衡所述电连接器的所述第一和第二部分的质量，其特征在于：所述的在一个球格阵列上平衡电连接器的第一和第二部分的质量的步骤还包括以下步骤：将材料从所述电连接器的所述第一部分中去除，以使所述的电连接器安装到基板上时基本上保持平行于所述的基板。
对于本领域的技术人员，参考说明书和附图，可使本发明的其它用途和优点变得更清楚。
附图说明
图1是本发明的第一替代实施例的分解顶部透视图；
图2A是图1中电连接器一个替换实施例的底部透视图；
图2B是图1中电连接器一个替换实施例的底部透视图；
图3是图1中电连接器部分切开图；
图4是本发明的第二替换实施例的顶部透视图；
图5是图4中电连接器的底部视图；
图6A是本发明的第三替换实施例的底部透视图；
图6B是图6中电连接器的部分切开图；
图7是修正的电连接器透视图，以根据本发明在逆流期间保证连接器保持与基板基本平行；以及
图8A-8C示出了部分基板，以便显示本发明连接器的自对中特性。
具体实施方式
本文描述的每一个替换实施例涉及具有应力释放特征的表面固定的电连接器。优选地，可熔元件，例如焊接球，用球格阵列(BGA)技术将触点固定到基板上的导电元件。因为BGA连接器可在逆流期间精确地相对于基板上的导电垫对准(称为“自对中”)，这里讨论的应力释放特征最好不干扰该需要的特性。插入逆流最好被用于将应力释放固定到基板。“插入”指在基板(如，电镀的通孔)内的开口中放入可熔材料(如，焊接黏胶)。下面将详细说明每个替换实施例。
图1-3显示电连接器300。连接器300是一个底板插头(backplaneheader)连接器，最好与底板插座连接器(如图5所述)匹配。连接器300可用于底板系统，例如连接子板与母板。
连接器300使用了美国专利申请号09/302,027中描述的许多特征，这里结合参考。因此，为了理解本发明只需对连接器300的某些特征作简要讨论。
连接器300包括带孔303的绝缘壳301，通过该孔接受信号触点305，对地触点307和对地罩309。信号触点305和对地触点307的匹配端通过壳301延伸并对应于匹配连接器(如图4所述)中引入开口的布置。对地罩309最好保留在壳301中，啮合对地触点307并在差动成对布置中用作包围信号触点305。
连接器300表面固定到基板325，最好利用在国际公开专利号WO98/15991中讨论的BGA技术。本发明的这一方面不同于美国专利申请系列号09/302,027中描述的通过孔固定触点。
在一种表面固定的可能方法中，连接器300可用锁住壳301的垫片311。垫片311有啮合壳301上适当的销结构的销臂313。另外，垫片311有开口317，通过它对应触点305，307的位置。特别地，触点305，307的末端通过开口317伸展。触点305，307的末端最好保留在开口317中，但可超过开口317伸展。
在相似于国际专利公开号WO98/15991中描述的方法中，垫片311的底表面上凹槽可接收在隔离胶作用期间提供的焊接黏胶(未示出)。随后，用焊接胶填充的凹槽现在可以接收并暂时保留可熔元件319。然后逆流作用将焊接球321熔合到触点305，307。但是，也可使用任何将可熔元件319固定到触点305，307的方法。
图2B提供了连接器300的一个替换实施例。如图2B所示，连接器300’的壳301’是单个一体结构。这将区别于连接器300，如图2A中所示，这里垫片311被作为壳301的隔离部分。
连接器300可固定到具有连接到适当轨迹(未示出)的导电垫327阵列的基板325，例如用于传输信号或接地之用。垫327对应于固定到连接器300上的触点305，307的可熔元件319的阵列。作为选择，垫327也可是通道或通路。
逆流过程，通常紧随将焊接球321熔合到触点305，307的逆流过程，将焊接球321熔合到垫327。通常，垫在其上有焊接黏胶326以接受并暂时将焊接球321固定到基板325。如前所述，在置于基板上的模板(未示出)两端的隔离胶在需要的位置上提供适当量的焊接黏胶。逆流过程将焊接球321熔合到基板325上的垫327，由此在触点305，307与基板325之间产生电路。
由于机械加载要求和底板连接器耐久性要求，连接器300可需要应力释放特征以保护焊接球321形成的焊接点。连接器300可使用插入逆流的夹具。壳301包括邻接四个角或在任何其它适当位置的柱323。
当装配时，柱323通过垫片311伸展并保留在基板325中的通孔328中。最好，柱323由可焊接材料制成，如金属或金属化塑料。重要的是，柱323的直径小于接受柱323的电镀通孔328的直径。换句话说，柱323在逆流步骤之前在通孔328中通常是不受约束的，这使焊接球321在逆流时无干扰自对中。尽管柱323能在通孔328中移动，但是柱323在基板325上放置连接器300时提供粗略对齐和导向。
将焊接球321固定到基板325的逆流过程最好也将柱323固定到基板325中的通孔328。由于有导电垫327，在隔离胶作用期间通孔328接收焊接黏胶329。逆流过程将柱323熔合到基板325。
柱323用作连接器300的应力释放。不管是插入夹具，柱323允许焊接球321在逆流期间自对中。在逆流过程之前，柱323伸进填有焊接黏胶的通孔328，而焊接球321依赖导电垫327上的焊接黏胶326。在逆流过程的加热阶段，焊接黏胶326往往在焊接球321之前液化。
当变为液体时，焊接球321将相对于基板325上的导电垫327自对中。柱323，小于通孔328，允许连接器300运动而不受干扰。
在逆流过程结束时，柱323往往比焊接球321更慢冷却。结果，在这一区域焊料保持液态更长时间。这有益于插入夹具，而保留焊接球321的自对中特性。
图3是连接器300的部分切开图，提供更详细的柱323的构造和应用。如图3所述，柱323固定连接到连接器300，如在印刷焊接黏胶之后，将柱323的滚花部分置于壳301的开口中。当连接器300置于基板325上时，柱323通过在基板325中的通孔328。同样，焊接球321与基板325上的导电轨迹327平行。焊接球321依赖于置于导电轨迹327上的焊接黏胶326。同样，柱323保留在位于通孔328中的焊接黏胶329中。当连接器系统被加热时，焊接球321液化并与导电垫327电耦合，而柱323连接到通孔328内部。
该系统也可这样设计，当焊接球321熔合到导电垫327后，柱323固定到通孔328。这样，柱323也向连接器系统提供应力释放而不抑制BGA连接器的自对中特性。柱323和通孔328的直径被定量且匹配，以便减少对BGA连接技术的自对中功能的影响，同时保证焊接球321最初至少与导电垫327一部分啮合。同样，柱323凸进通孔328，这样在通孔328内部和上面形成优化的填料，而不限制自对中功能。柱323被定量，这样在固定过程中，不会有大量的焊接黏胶329从通孔328流出。例如，图3显示了柱323向通孔328伸展约半程。
图4和图5显示了电连接器400。插座底板连接器400使用了美国专利号6,116,926中描述的许多特征，这里结合参考。由于为理解本发明无需对连接器400的许多特征详细描述，下面仅简要描述这些特征。
连接器400是模块化的，由一系列子组件401形成。后绝缘壳403和前绝缘壳405能组合在一起并包围子组件401形成连接器400。前壳405包括从匹配连接器300(如图1所示)接受导电触点305，307的引入开口407。如所示，开口407形成差动对布置。
子组件401包含对地和信号触点(未示出)。对地和信号触点与匹配连接器300(如图1所示)的对应对地触点307和信号触点305匹配。与美国专利号6,116,926中所示的不同，连接器400的触点表面固定到基板(未示出)。
在表面固定的一种可能的方法中，连接器400可使用锁住壳401的垫片411。垫片411有啮合壳401上适当的销结构(未示出)的销臂(未示出)。另外，垫片411有开口413，通过它对应触点的位置。特别地，触点的末端通过开口413伸展。触点的末端最好保留在开口413中，但可超过开口413伸展。
在相似于国际专利公开号WO98/15991中描述的方法中，开口413可接收在隔离胶作用期间提供的焊接黏胶(未示出)。随后，现在用焊接胶填充的开口413可以接收并暂时保留可熔元件409。然后逆流作用将焊接球409熔合到触点。但是，任何将可熔元件409固定到触点的方法也可被使用。
如前述的实施例，连接器400可固定到具有连接到适当轨迹(未示出)的导电垫(未示出)阵列的基板(未示出)，例如用于传输信号或接地之用。垫对应于固定到连接器400上的触点的可熔元件409的阵列。作为选择，垫也可是通道或通路。
逆流过程，通常紧随将焊接球409熔合到触点的逆流过程，将焊接球409熔合到垫。通常，垫在其上有焊接黏胶(未示出)以接受并暂时将焊接球409固定到基板。如前所述，在置于基板上的模板(未示出)两端的隔离胶在需要的位置上提供适当量的焊接黏胶。逆流过程将焊接球409熔合到基板上的垫，由此在触点与基板之间产生电路。
如连接器300，连接器400可要求应力释放特征以保护在触点和基板上垫之间形成的焊接点。如连接器300，连接器400利用插入可焊接的夹具。壳401可包括邻接四个角或在任何其它适当位置的柱415。当装配时，柱415通过垫片411伸展并保留在基板中的通孔(未示出)中。最好，柱415由可焊接材料制成，如金属或金属化塑料。重要的是，柱415的直径小于通孔的直径。换句话说，柱415在逆流之前在通孔中通常是不受约束的。如下面讨论，这使焊接球409在逆流时自对中而没有干扰。不管柱415移进通孔中的能力，但是柱415的确在基板上放置连接器400时提供了粗略对齐和导向。事实上，柱415和PCB通孔被定量以保证焊接球409起始至少与焊接垫的一部分啮合。
使用的逆流过程将焊接球409固定到基板最好也将柱415固定到基板中的通孔。由于有导电垫，在隔离胶作用期间通孔接受焊接黏胶。逆流过程将柱415熔合到基板。
柱415用作连接器400的应力释放。不管是插入夹具，柱415允许焊接球409在逆流期间自对中。在逆流之前，柱415伸进填有焊接黏胶的通孔，而焊接球409依赖导电垫上的焊接黏胶。在逆流的加热阶段，焊接黏胶往往在焊接球409之前液化。
当变为液体时，焊接球409将相对于基板上的导电垫自对中。柱415，小于通孔，允许连接器400运动而不受影响。
在逆流结束时，柱415往往比焊接球409更慢冷却。结果，在这一区域焊接停留更长时间。这有益于插入夹具，而保留焊接球409的自对中特性。
图6A和6B显示了电连接器500。特别地，图6A提供了电连接器500的底透视图，而图6B提供了连接器的部分切开图。连接器500，虽然大体相似于连接器300，最好用在如连接器500重量可扁平焊接球521并在邻近焊接球521之间造成桥接的情况。
因此，连接器500的壳501可包括保持柱525，以及或作为柱523的替代。不同于柱523，柱525有一个不能进入电镀通孔528的台肩526。台肩526当焊接球521液化时使连接器500离开基板527以防止桥接。换句话说，适当的柱525作为支座并防止由于连接器500重量使焊接球扁平。如柱523，柱525可由可焊接材料制成。最好，台肩526允许球一定扁度(例如，高至约40％，最好约为30％)以保证与PCB垫适当的焊接点。台肩526也可防止例如由于连接器不均匀平衡引起的基板527上连接器500的倾斜。柱525末端可进入电镀通孔528并作为夹具。
图7是本发明如何保证BGA连接器在能力期间保持基本平行的另一个例子。参考连接器300，400和500所讨论的，BGA连接器通过加热焊接球直至焊接熔化并熔合到基板的导电轨迹被连接到基板。焊接的表面张力对中基板轨迹上的连接器。在连接器设计要求连接器重量不是均匀平衡布置的情况中，连接器可以在能力期间相对于基板倾斜。在逆流期间，连接器较重部分比较轻部分可能更扁平焊接球。结果，焊接球的某些部分可能不能与基板正常接触，可能在小于标定机械力下造成焊接点失败。同样，邻近崩溃的焊接球桥接。本发明保证BGA连接器在逆流期间保持与基板基本平行。
如图7所示，连接器701部分(为清楚起见，用虚线显示)可被增加和/或移去以使连接器701质量在球格阵列上均匀平衡。特别地，部分702可从壳701较重部分移去。部分703和704可加到壳701的较轻部分。虽然图7显示了部分702-704处于一定位置，应该理解，部分702-704的位置以及大小和重量取决于连接器701的物理特性而变化。
虽然图7显示了通过修正连接器的物理特性平衡基板上连接器701，但应该理解，本发明不限于此。本发明可利用许多技术来实现这种平衡。例如，在逆流期间向连接器701某些区域施加外力。确定这种力的大小，以便克服由球格阵列上连接器不平衡造成的连接器701和基板之间的倾斜关系。在另一个实施例中，类似的力可被施加到基板，以及连接器或不是连接器。因此，本发明包括克服在球格阵列上连接器固有的不平衡任何技术，并使连接器在逆流后与连接的基板基本平行。
图8A-8C显示了基板800的一部分，并显示了在逆流过程期间本发明连接器自对中特性。首先，图8A显示了没有连接器焊接在其上的基板800。基板800包括电镀通孔801，焊接垫802，以及导电轨迹805(为清楚起见，仅显示从某垫802伸展)。焊接垫802被采用以接受连接器(例如，如图3所示)上的可熔元件，而导电路径805沿基板800载有信号。通孔801用于接受连接器上夹具。
图8B显示该过程中的下一步骤，即基板800顶上带焊接球803和夹具804(为清楚起见，用虚线显示)的连接器定位。如图8B所示，连接器在相对于基板800最坏情况下被定位，这样焊接球803和夹具804分别离焊接垫802中心和通孔801最远。图8C显示了该过程中的下一步骤，即焊接球803的逆流和接受通孔中的焊接黏胶以及夹具804。如图8C所示，虽然焊接球803和夹具804起始定位在最坏的情况(如图8B中所示)，但是连接器的自对中特性移动焊接球803和夹具804，这样它们分别在焊接垫802上和通孔801中对中。因此，不管连接器在基板800上的起始定位，逆流过程的自对中特性允许焊接球802和夹具804分别在焊接垫802上和通孔801中对中。
虽然结合各种特征的优选实施例已描述了本发明，但是可以理解，可以使用其它类似的实施例或经修正和变形完成本发明相似的功能而不偏离。因此，本发明不限于任何单个实施例，而根据所附权利要求书更广泛地给予解释。

Claims (2)

1、一种用于防止电连接器固定到基板上有斜度的方法，包括以下步骤：
提供一个电连接器壳体，该电连接器壳体具有第一部分和第二部分，该第一部分的质量大于该第二部分的质量；和
在一个球格阵列上平衡所述电连接器的所述第一部分和所述第二部分的质量，其特征在于：
所述的在一个球格阵列上平衡电连接器的所述第一部分和所述第二部分的质量的步骤还包括以下步骤：
将材料加入到所述电连接器壳体的所述第二部分中，以使所述的电连接器被安装到基板上时保持基本上平行于所述的基板。
2、一种用于防止电连接器固定到基板上时有斜度的方法，包括以下步骤：
提供一个电连接器壳体，该电连接器壳体具有第一部分和第二部分，该第一部分的质量大于该第二部分的质量；和
在一个球格阵列上平衡所述电连接器的所述第一部分和所述第二部分的质量，其特征在于：
所述的在一个球格阵列上平衡电连接器的所述第一部分和所述第二部分的质量的步骤还包括以下步骤：
将材料从所述电连接器壳体的所述第一部分中去除，以使所述的电连接器安装到基板上时基本上保持平行于所述的基板。
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EP1146596A2 (en) 2001-10-17
JP2001160435A (ja) 2001-06-12
CN1529387A (zh) 2004-09-15
DE60019527T2 (de) 2006-04-27
US6544046B1 (en) 2003-04-08
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EP1094547B1 (en) 2005-04-20
CN1297266A (zh) 2001-05-30
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DE60019527D1 (de) 2005-05-25
TW484251B (en) 2002-04-21
ATE314744T1 (de) 2006-01-15
EP1094547A2 (en) 2001-04-25
CN1211895C (zh) 2005-07-20
CN1297265A (zh) 2001-05-30
DE60025159T2 (de) 2006-08-17
JP2001160436A (ja) 2001-06-12
EP1094547A3 (en) 2001-10-04
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TW531948B (en) 2003-05-11
DE60025654D1 (de) 2006-04-06

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