CN100502066C - Light-radiating semiconductor component with a luminescence conversion element - Google Patents
Light-radiating semiconductor component with a luminescence conversion element Download PDFInfo
- Publication number
- CN100502066C CN100502066C CNB2006101016572A CN200610101657A CN100502066C CN 100502066 C CN100502066 C CN 100502066C CN B2006101016572 A CNB2006101016572 A CN B2006101016572A CN 200610101657 A CN200610101657 A CN 200610101657A CN 100502066 C CN100502066 C CN 100502066C
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- China
- Prior art keywords
- luminous
- semiconductor device
- light
- semiconductor body
- inverting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/32257—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
Abstract
Description
Claims (30)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19625622A DE19625622A1 (en) | 1996-06-26 | 1996-06-26 | Light radiating semiconductor constructional element |
DE19625622.4 | 1996-06-26 | ||
DE19638667.5 | 1996-09-20 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2003101181792A Division CN1534803B (en) | 1996-06-26 | 1997-06-26 | Luminous semiconductor device possessing luminous alteration element |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1881637A CN1881637A (en) | 2006-12-20 |
CN100502066C true CN100502066C (en) | 2009-06-17 |
Family
ID=7798103
Family Applications (9)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200610101860XA Expired - Lifetime CN1917240B (en) | 1996-06-26 | 1997-06-26 | Light-emitting semiconductor device possessing light-emitting conversion element |
CNB2005100917308A Expired - Lifetime CN100433382C (en) | 1996-06-26 | 1997-06-26 | Single covering element for semiconductor device outer case and apparatus containing the same |
CN200610101629.0A Expired - Lifetime CN1893136B (en) | 1996-06-26 | 1997-06-26 | Light radiating semiconductor device and arrangement containing same |
CNB2006100999783A Expired - Lifetime CN100557833C (en) | 1996-06-26 | 1997-06-26 | Luminous semiconductor device and the device that contains this luminous semiconductor device |
CNB2005100917280A Expired - Lifetime CN100565945C (en) | 1996-06-26 | 1997-06-26 | The semiconductor chip of divergent-ray and comprise the device of this semiconductor chip |
CNB2006100999800A Expired - Lifetime CN100514684C (en) | 1996-06-26 | 1997-06-26 | Light-emitting semiconductor device and device containing the same |
CNB2006101016572A Expired - Lifetime CN100502066C (en) | 1996-06-26 | 1997-06-26 | Light-radiating semiconductor component with a luminescence conversion element |
CNB2005100917295A Expired - Lifetime CN100442555C (en) | 1996-06-26 | 1997-06-26 | Light-radiating semiconductor and device containing with the same |
CNB2006101016500A Expired - Lifetime CN100435369C (en) | 1996-06-26 | 1997-06-26 | Light-emitting semiconductor device having radiation converting covering element |
Family Applications Before (6)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200610101860XA Expired - Lifetime CN1917240B (en) | 1996-06-26 | 1997-06-26 | Light-emitting semiconductor device possessing light-emitting conversion element |
CNB2005100917308A Expired - Lifetime CN100433382C (en) | 1996-06-26 | 1997-06-26 | Single covering element for semiconductor device outer case and apparatus containing the same |
CN200610101629.0A Expired - Lifetime CN1893136B (en) | 1996-06-26 | 1997-06-26 | Light radiating semiconductor device and arrangement containing same |
CNB2006100999783A Expired - Lifetime CN100557833C (en) | 1996-06-26 | 1997-06-26 | Luminous semiconductor device and the device that contains this luminous semiconductor device |
CNB2005100917280A Expired - Lifetime CN100565945C (en) | 1996-06-26 | 1997-06-26 | The semiconductor chip of divergent-ray and comprise the device of this semiconductor chip |
CNB2006100999800A Expired - Lifetime CN100514684C (en) | 1996-06-26 | 1997-06-26 | Light-emitting semiconductor device and device containing the same |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100917295A Expired - Lifetime CN100442555C (en) | 1996-06-26 | 1997-06-26 | Light-radiating semiconductor and device containing with the same |
CNB2006101016500A Expired - Lifetime CN100435369C (en) | 1996-06-26 | 1997-06-26 | Light-emitting semiconductor device having radiation converting covering element |
Country Status (2)
Country | Link |
---|---|
CN (9) | CN1917240B (en) |
DE (1) | DE19625622A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI489055B (en) * | 2012-06-29 | 2015-06-21 | Advanced Optoelectronic Tech | Led light bar |
Families Citing this family (51)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19638667C2 (en) | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mixed-color light-emitting semiconductor component with luminescence conversion element |
KR100662955B1 (en) | 1996-06-26 | 2006-12-28 | 오스람 게젤샤프트 미트 베쉬랭크터 하프퉁 | Light-emitting semiconductor component with luminescence conversion element |
DE19803936A1 (en) * | 1998-01-30 | 1999-08-05 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Expansion-compensated optoelectronic semiconductor component, in particular UV-emitting light-emitting diode and method for its production |
DE19829197C2 (en) | 1998-06-30 | 2002-06-20 | Siemens Ag | Component emitting and / or receiving radiation |
DE19836943B9 (en) * | 1998-08-17 | 2008-01-31 | Osram Opto Semiconductors Gmbh | Photoluminescent layer in the optical and adjacent spectral regions |
US6204523B1 (en) * | 1998-11-06 | 2001-03-20 | Lumileds Lighting, U.S., Llc | High stability optical encapsulation and packaging for light-emitting diodes in the green, blue, and near UV range |
DE19934126A1 (en) * | 1999-07-23 | 2001-01-25 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Fluorescent oxide for forming white LEDs, includes cerium-activated garnet-based oxide with terbium addition |
DK1610593T4 (en) † | 1999-11-18 | 2020-05-11 | Signify North America Corp | Generating white light with light-emitting diodes of different spectrum |
WO2001059851A1 (en) * | 2000-02-09 | 2001-08-16 | Nippon Leiz Corporation | Light source |
JP4709458B2 (en) | 2000-02-23 | 2011-06-22 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Photoluminescence layer and method for forming the same |
DE10032453A1 (en) * | 2000-07-04 | 2002-01-24 | Vishay Semiconductor Gmbh | Radiation emitting component used for producing white light has pigments of one or more luminescent dyes arranged in and/or on a glass housing |
DE10109349B4 (en) * | 2001-02-27 | 2012-04-19 | Osram Opto Semiconductors Gmbh | Radiation-emitting semiconductor component |
DE10112542B9 (en) * | 2001-03-15 | 2013-01-03 | Osram Opto Semiconductors Gmbh | Radiation-emitting optical component |
US6841802B2 (en) | 2002-06-26 | 2005-01-11 | Oriol, Inc. | Thin film light emitting diode |
US7554258B2 (en) | 2002-10-22 | 2009-06-30 | Osram Opto Semiconductors Gmbh | Light source having an LED and a luminescence conversion body and method for producing the luminescence conversion body |
CN1754266A (en) | 2002-12-25 | 2006-03-29 | 独立行政法人科学技术振兴机构 | Light-emitting element device, light-receiving element device, optical device, fluoride crystals, production method of fluoride crystals, and crucible |
DE10261908B4 (en) * | 2002-12-27 | 2010-12-30 | Osa Opto Light Gmbh | Method for producing a conversion light-emitting element based on semiconductor light sources |
DE10305093A1 (en) * | 2003-02-07 | 2004-08-19 | BSH Bosch und Siemens Hausgeräte GmbH | Method and device for determining and monitoring contamination states of different liquids |
US7777235B2 (en) | 2003-05-05 | 2010-08-17 | Lighting Science Group Corporation | Light emitting diodes with improved light collimation |
US7633093B2 (en) | 2003-05-05 | 2009-12-15 | Lighting Science Group Corporation | Method of making optical light engines with elevated LEDs and resulting product |
US7528421B2 (en) | 2003-05-05 | 2009-05-05 | Lamina Lighting, Inc. | Surface mountable light emitting diode assemblies packaged for high temperature operation |
US7157745B2 (en) | 2004-04-09 | 2007-01-02 | Blonder Greg E | Illumination devices comprising white light emitting diodes and diode arrays and method and apparatus for making them |
US7622743B2 (en) * | 2003-11-04 | 2009-11-24 | Panasonic Corporation | Semiconductor light emitting device, lighting module, lighting apparatus, and manufacturing method of semiconductor light emitting device |
DE102005020695B4 (en) * | 2004-04-30 | 2006-06-22 | Optotransmitter-Umweltschutz-Technologie E.V. | Radiation emitting device with variable spectral properties, superimposes beams from luminescent dyes with different absorption spectra excited by LEDs with different emission spectra |
DE102004042461A1 (en) | 2004-08-31 | 2006-03-30 | Novaled Gmbh | Top-emitting, electroluminescent device with frequency conversion centers |
EP1808909A1 (en) | 2006-01-11 | 2007-07-18 | Novaled AG | Electroluminescent light-emitting device |
DE102006015115A1 (en) * | 2006-03-31 | 2007-10-04 | Osram Opto Semiconductors Gmbh | Electronic module, has units and body covered with electrical insulating layer, where units have surfaces that are electrically conductive and connected by one unit with contact area of body and by path structure |
DE102007002003B4 (en) * | 2007-01-08 | 2013-11-21 | Johnson Controls Automotive Electronics Gmbh | Indicating instrument, in particular for a motor vehicle, and method for producing a display instrument |
DE102007057710B4 (en) * | 2007-09-28 | 2024-03-14 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Radiation-emitting component with conversion element |
DE102008006988A1 (en) | 2008-01-31 | 2009-08-06 | Osram Opto Semiconductors Gmbh | Optoelectronic component and method for producing an optoelectronic component |
DE102008026841A1 (en) * | 2008-02-22 | 2009-08-27 | Osram Opto Semiconductors Gmbh | Optoelectronic component |
DE102008020882A1 (en) * | 2008-04-25 | 2009-10-29 | Ledon Lighting Jennersdorf Gmbh | Light emitting device, has inhomogeneous light source and wavelength converting element positioned in relation to each other such that pre-defined optical characteristics of light is achieved by device |
DE102008025756B4 (en) * | 2008-05-29 | 2023-02-23 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | semiconductor device |
US7868340B2 (en) | 2008-05-30 | 2011-01-11 | Bridgelux, Inc. | Method and apparatus for generating white light from solid state light emitting devices |
DE102008045882A1 (en) * | 2008-09-04 | 2010-03-11 | Esw Gmbh | Dummy exploding |
DE102008057720A1 (en) * | 2008-11-17 | 2010-05-20 | Osram Opto Semiconductors Gmbh | Radiation emitting device i.e. white light emitting device, has radiation converting layer provided with organic radiation converting luminescent material and arranged at distance from radiation emitting functional layer |
KR100996446B1 (en) | 2010-05-24 | 2010-11-25 | 엘지이노텍 주식회사 | Light emitting device, method for fabricating the light emitting device and light emitting device package |
DE102010026343A1 (en) * | 2010-07-07 | 2012-03-29 | Osram Opto Semiconductors Gmbh | Component and method for manufacturing a device |
DE102010047156A1 (en) * | 2010-09-30 | 2012-04-05 | Osram Opto Semiconductors Gmbh | Optoelectronic component and method for producing an optoelectronic component |
DE102011003969B4 (en) | 2011-02-11 | 2023-03-09 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Process for producing an optoelectronic component |
DE102011001928A1 (en) * | 2011-04-08 | 2012-10-11 | Lumitech Produktion Und Entwicklung Gmbh | Color conversion element and lamp |
DE102011101052A1 (en) | 2011-05-09 | 2012-11-15 | Heraeus Materials Technology Gmbh & Co. Kg | Substrate with electrically neutral region |
DE102011078906A1 (en) * | 2011-07-11 | 2013-01-17 | Osram Opto Semiconductors Gmbh | METHOD FOR PRODUCING AN OPTOELECTRONIC SEMICONDUCTOR COMPONENT BY MEANS OF SPRAYING |
CN103764788B (en) * | 2011-08-04 | 2016-04-20 | 皇家飞利浦有限公司 | Photoconverter and the lighting unit comprising such photoconverter |
TWI626395B (en) * | 2013-06-11 | 2018-06-11 | 晶元光電股份有限公司 | Light emitting device |
JP6323650B2 (en) * | 2013-12-20 | 2018-05-16 | セイコーエプソン株式会社 | Surface emitting laser and atomic oscillator |
DE102014117764A1 (en) * | 2014-12-03 | 2016-06-09 | Osram Opto Semiconductors Gmbh | Radiation-emitting optoelectronic semiconductor component and method for its production |
KR102451208B1 (en) * | 2015-02-04 | 2022-10-06 | 메르크 파텐트 게엠베하 | Electro-Optical Switching Elements and Display Devices |
DE102018121324A1 (en) * | 2018-08-31 | 2020-03-05 | Osram Opto Semiconductors Gmbh | Sol gels as binders for the production of conversion elements |
CN111312881A (en) * | 2020-02-27 | 2020-06-19 | 盐城东山精密制造有限公司 | Integrally formed LED device and manufacturing method thereof |
DE102020206897A1 (en) | 2020-06-03 | 2021-12-09 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | OPTOELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING AN OPTOELECTRONIC COMPONENT |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3316109A (en) * | 1963-03-11 | 1967-04-25 | Westinghouse Electric Corp | Coating composition |
US3440471A (en) * | 1966-03-16 | 1969-04-22 | Gen Telephone & Elect | Electroluminescent cell matrix material of improved stability |
JPS48102585A (en) * | 1972-04-04 | 1973-12-22 | ||
US3774086A (en) * | 1972-09-25 | 1973-11-20 | Gen Electric | Solid state lamp having visible-emitting phosphor at edge of infrated-emitting element |
US4599537A (en) * | 1982-04-30 | 1986-07-08 | Shigeaki Yamashita | IR light emitting apparatus with visible detection means |
US4479886A (en) * | 1983-08-08 | 1984-10-30 | Gte Products Corporation | Method of making cerium activated yttrium aluminate phosphor |
IT1183061B (en) * | 1984-07-31 | 1987-10-05 | Zambon Spa | COMPOUNDS EQUIPPED WITH ANTI-ALLERGIC ACTIVITY |
DE3804293A1 (en) * | 1988-02-12 | 1989-08-24 | Philips Patentverwaltung | Arrangement containing an electroluminescent or laser diode |
DE9013615U1 (en) * | 1990-09-28 | 1990-12-06 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt, De | |
JPH04186679A (en) * | 1990-11-16 | 1992-07-03 | Daido Steel Co Ltd | Light-emitting diode |
JP2666228B2 (en) * | 1991-10-30 | 1997-10-22 | 豊田合成株式会社 | Gallium nitride based compound semiconductor light emitting device |
JPH05152609A (en) * | 1991-11-25 | 1993-06-18 | Nichia Chem Ind Ltd | Light emitting diode |
US5379186A (en) * | 1993-07-06 | 1995-01-03 | Motorola, Inc. | Encapsulated electronic component having a heat diffusing layer |
JPH0738150A (en) * | 1993-07-22 | 1995-02-07 | Toshiba Corp | Semiconductor light emitting device |
JPH0799345A (en) * | 1993-09-28 | 1995-04-11 | Nichia Chem Ind Ltd | Light emitting diode |
JPH07176794A (en) * | 1993-12-17 | 1995-07-14 | Nichia Chem Ind Ltd | Planar light source |
CN2184257Y (en) * | 1994-02-21 | 1994-11-30 | 中国科学院半导体研究所 | Coupler for semi-conductor light emission and testing |
JP3116727B2 (en) * | 1994-06-17 | 2000-12-11 | 日亜化学工業株式会社 | Planar light source |
CN1108819A (en) * | 1994-10-26 | 1995-09-20 | 欧姆龙株式会社 | Semiconductor shining unit and optical device using semiconductor shining unit |
-
1996
- 1996-06-26 DE DE19625622A patent/DE19625622A1/en not_active Ceased
-
1997
- 1997-06-26 CN CN200610101860XA patent/CN1917240B/en not_active Expired - Lifetime
- 1997-06-26 CN CNB2005100917308A patent/CN100433382C/en not_active Expired - Lifetime
- 1997-06-26 CN CN200610101629.0A patent/CN1893136B/en not_active Expired - Lifetime
- 1997-06-26 CN CNB2006100999783A patent/CN100557833C/en not_active Expired - Lifetime
- 1997-06-26 CN CNB2005100917280A patent/CN100565945C/en not_active Expired - Lifetime
- 1997-06-26 CN CNB2006100999800A patent/CN100514684C/en not_active Expired - Lifetime
- 1997-06-26 CN CNB2006101016572A patent/CN100502066C/en not_active Expired - Lifetime
- 1997-06-26 CN CNB2005100917295A patent/CN100442555C/en not_active Expired - Lifetime
- 1997-06-26 CN CNB2006101016500A patent/CN100435369C/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI489055B (en) * | 2012-06-29 | 2015-06-21 | Advanced Optoelectronic Tech | Led light bar |
Also Published As
Publication number | Publication date |
---|---|
CN1722486A (en) | 2006-01-18 |
CN1881637A (en) | 2006-12-20 |
CN100514684C (en) | 2009-07-15 |
CN1913183A (en) | 2007-02-14 |
CN100435369C (en) | 2008-11-19 |
CN1917240B (en) | 2012-05-23 |
CN100557833C (en) | 2009-11-04 |
CN1983651A (en) | 2007-06-20 |
CN1738067A (en) | 2006-02-22 |
CN100565945C (en) | 2009-12-02 |
CN1893136B (en) | 2014-03-12 |
DE19625622A1 (en) | 1998-01-02 |
CN1917240A (en) | 2007-02-21 |
CN1905226A (en) | 2007-01-31 |
CN100433382C (en) | 2008-11-12 |
CN100442555C (en) | 2008-12-10 |
CN1893136A (en) | 2007-01-10 |
CN1722485A (en) | 2006-01-18 |
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