CN100508188C - A bar-shaped LED light source - Google Patents
A bar-shaped LED light source Download PDFInfo
- Publication number
- CN100508188C CN100508188C CNB2007100329038A CN200710032903A CN100508188C CN 100508188 C CN100508188 C CN 100508188C CN B2007100329038 A CNB2007100329038 A CN B2007100329038A CN 200710032903 A CN200710032903 A CN 200710032903A CN 100508188 C CN100508188 C CN 100508188C
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- Prior art keywords
- heat sink
- bar
- light source
- substrate
- chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a strip-shaped LED light source, the main component parts include a heat sink, a base plate, chips, inner lead wires and a package colloid; the heat sink is arranged on the base plate, the chip is arranged on the heat sink, an electrode which is connected with the chips and a circuit which maintains the mutual connections of the chips are arranged on the base plate; the invention is characterized in that the base plate takes a shape of strip, a sink hole is arranged on the base plate, the heat sink is embedded in the sink hole, the sink hole is a corresponding single strip-shaped structure or a strip-shaped structure which is formed by combining a plurality of sink hole structures, a plurality of chips are arranged on the heat sink, the package colloid packages a plurality of chips and the inner lead wires into a whole body by one-shot molding, and the surface of the package colloid is provided with an optical lens structure. The strip-shaped LED light source of the invention has even distribution of space light intensity, convenient application, low cost and good heat dissipation effect, thus the invention can be widely applied in various semiconductor lighting products.
Description
Technical field
Patent of the present invention relates to a kind of optical semiconductor source structure, particularly relates to a kind of good heat dissipation effect, cost is low, spatial light intensity is evenly distributed bar-shaped LED light source, can be widely used in the classes of semiconductors illuminating product.
Background technology
Semiconductor technology is breeding a new Industrial Revolution---the illumination revolution.5 years in 10 years, as the solid-state illumination lamp of new light sources, will engender each corner with light-emitting diode (LED) in traditional lighting market.Strip source more and more obtains the extensive use of every field as a staple product classification of semiconductor illuminating light source.Known strip source mainly contains following 3 kinds from the structure branch:
First kind is the light source that directly the LED components and parts is welded on the bar shaped substrate, and as shown in Figure 1, LED element 101 is welded direct on the substrate 102, connects each element by the circuit on the substrate and forms a kind of strip source.
Second kind is the mode of COB (Chip on board is bundled in the printed board), as shown in Figure 2, directly led chip 201 is tied on the substrate 202, adopts 203 pairs of chips 201 of packing colloid to encapsulate then, thereby forms a kind of strip source.
The third shown in Fig. 3-1, adopts packing colloid 304 with the 303 envelope shapes of the chip in entire emission chamber 301 and the reflection cavity, shown in Fig. 3-2 for directly to lay led chip 303 on the support 302 with bar shaped reflection cavity 301 then.
Above-mentioned known a kind of bar-shaped LED light source radiating effect is poor, the spatial light intensity skewness of its product.
Summary of the invention
Patent of the present invention provides a kind of good heat dissipation effect, cost is low, spatial light intensity is evenly distributed bar-shaped LED light source.
The present invention realizes above-mentioned purpose by following technical solution:
That a kind of bar-shaped LED light source, chief component comprise is heat sink, substrate, chip, lead, packing colloid, heat sink being arranged on the substrate, and chip mount is on heat sink, and described substrate is provided with the electrode that connects chip and keeps the interconnective circuit of chip chamber; It is characterized in that, described substrate is bar shaped, substrate is provided with counterbore, heat sink being embedded in the counterbore, counterbore should be the strip structure that single strip structure or a plurality of counter bore structure combine mutually, and described chip is a plurality of, is placed in the heat sink required form of going up and be arranged in as required, the packing colloid one-shot forming is packaged into one with a plurality of chips, lead, and the surface of packing colloid is set to corresponding optical lens structure.
As further specifying of such scheme, the hole perforated area is greater than last hole down in the described counter bore structure, and two holes are vertical perforation structure, adopts the step surface transition.
Described heat sink shape is corresponding with the structure of counterbore.
Described chip is " one " font single file or multirow and arranges by parallel with one another or be connected in series.
The upper surface packing colloid of described packing colloid is single bar shaped optical lens structure or the combination of a plurality of optical lens; As concavees lens structure etc.
Described number of chips is N, wherein N 〉=2.
Also lay electronic components such as the resistance of forming the light source module, electric capacity, drive IC on the described substrate, connect to form the light source module that can directly use with circuit on the substrate.
Adopt a kind of bar-shaped LED light source provided by the invention to have following advantage:
1, good heat dissipation effect, heat sink bottom directly contacts with outside, and half encapsulating structure helps improving radiating effect;
2, cost is low, and the present invention is by type metal electrode on the substrate, and is simple in structure, and the accessory cost is low;
3, spatial light intensity evenly distributes, and the present invention adopts the light emitting structures of bar shaped optical lens or a plurality of optical lens combination, effective center brightness of having disperseed strip source, the strip source that provides a kind of spatial light intensity to be evenly distributed;
4, production efficiency height, heat sink easy for installation, the encapsulation one-shot forming, overall process can realize automated job;
5, use conveniently, product of the present invention can directly be assemblied in light fixture or other application product, and is compatible good.
Description of drawings
The strip source that welding LED element is formed on Fig. 1 substrate;
The strip source that Fig. 2 adopts the COB mode to make;
Fig. 3-Fig. 4 has the strip source (do not encapsulate or encapsulated) of reflection cavity;
Fig. 5 board structure schematic diagram;
Fig. 6 substrate cross-sectional view;
Fig. 7 base plate line arrangement mode schematic diagram;
The heat sink schematic diagram of Fig. 8 bar shaped;
Schematic diagram is finished in the binding of Fig. 9 chip;
Floor map is finished in the binding of Figure 10 chip;
The product structure schematic diagram that Figure 11 encapsulation is finished;
Figure 12 strip source module circuit connection diagram;
Figure 13 strip source modular circuit principle schematic.
Description of reference numerals: substrate 401, in the counter bore structure down hole 402, go up hole 403, step surface 404, circuit 405, heat sink 406, upper table surface 407, following table 408, chip 409, lead-in wire 410, packing colloid 411, upper surface 412, resistance 413
Embodiment
As Figure 11, shown in Figure 10, a kind of bar-shaped LED light source of the present invention, that chief component comprises is heat sink 406, substrate 401, chip 409, lead 410, packing colloid 411, heat sink 406 are arranged on the substrate 401, chip 409 is placed on heat sink 406, and substrate is provided with the electrode that connects chip 409 and keeps 409 interconnective circuits 405 of chip; Described substrate is bar shaped and is provided with counterbore, counterbore is single strip structure, described heat sink 406 shape is corresponding with the structure of counterbore, make heat sink 406 to be embedded in the counterbore, chip be a plurality of be placed on heat sink 406 and be " word " shape arrange, chip 409 is by parallel with one another or be connected in series, and circuit 405 is " one " font single file to be arranged, and also can be that many row's in-lines are arranged.Packing colloid 411 one-shot formings are packaged into one with a plurality of chips 409, lead 410, and the surface of packing colloid 411 is set to single bar shaped concavees lens structure.
As additional embodiments of the present invention, described counterbore can also be combined into bar shaped for a plurality of circular counter bore structural arrangement.The upper surface concavees lens of described packing colloid 411 can also be a plurality of concavees lens combinations, and its circuit also can adopt the mode of cross arrangement to arrange.
Encapsulating structure of the present invention can also directly be formed the light source module: will lay electronic components such as the resistance of forming the light source module, electric capacity, drive IC on the substrate, as shown in figure 12, a kind of strip source that directly is assemblied on the 24V power supply, light-emitting diode chip for backlight unit adopts the mode of series connection to interconnect by the circuit on the substrate, and connect a resistance 413, the light source module that composition can directly use, circuit theory diagrams as shown in figure 13.
Preparation process of the present invention is as follows:
1, the moulding of substrate, as Fig. 6, shown in Figure 5, wherein Fig. 6 is the generalized section of Fig. 5.Preparation has the substrate 401 of counter bore structure, and following hole 402 perforated areas are vertical strip structure greater than 403, two holes, last hole in the counter bore structure, adopt step surface 404 transition.As shown in Figure 7, substrate 401 surface printings have the electrode that connects chip and keep the interconnective circuit 405 of chip chamber;
2, the technology of forging and pressing is adopted in heat sink moulding, makes as shown in Figure 7 heat sink 406, is bar shaped, divide up and down two table tops 407 and 408,407 and 408 ledge structures of forming just with substrate on the counter bore structures of 402 and 403 compositions be complementary;
3, assembling: heat sink 406 assemblings embed in the counter bore structure of substrate 401;
4, chip binding: finish laying of chip 409, and finish the binding of lead-in wire 410, finish being electrically connected of circuit 405 on chip 409 and the substrate 401, schematic diagram such as Fig. 9 and shown in Figure 8, circuit connects as shown in figure 10;
5, encapsulation: packing colloid 411 is adopted the technology of plastic packaging chip 409 encapsulation are got up, as shown in figure 11, dress colloid 411 is the injection moulding one-shot forming, and upper surface 412 forms bar shaped concavees lens structure.
Claims (6)
1, a kind of bar-shaped LED light source, that chief component comprises is heat sink, substrate, chip, lead, packing colloid, heat sink being arranged on the substrate, chip mount are on heat sink, and described substrate is provided with the electrode that connects chip and keeps the interconnective circuit of chip chamber; It is characterized in that, described substrate is bar shaped, substrate is provided with counterbore, heat sink being embedded in the counterbore, counterbore should be single strip structure mutually, and described chip is a plurality of, is placed in the heat sink required form of going up and be arranged in as required, the packing colloid one-shot forming is packaged into one with a plurality of chips, lead, and the surface of packing colloid is set to corresponding optical lens structure; The hole perforated area is greater than last hole down in the described counter bore structure, and two holes are vertical perforation structure, adopt the step surface transition, and described heat sink shape is corresponding with the structure of counterbore.
2, as right 1 described a kind of bar-shaped LED light source, it is characterized in that described chip by parallel with one another or be connected in series, be " one " font single file or multirow and arrange.
3, as right 1 described a kind of bar-shaped LED light source, the upper surface optical lens that it is characterized in that described packing colloid is single bar shaped optical lens structure or the combination of a plurality of optical lens.
4,, it is characterized in that the single bar shaped optical lens structure optical lens of upper surface of described packing colloid is the concavees lens structure as right 1 described a kind of bar-shaped LED light source.
5,, it is characterized in that described number of chips is N, wherein N 〉=2 as right 1 or 2 described a kind of bar-shaped LED light sources.
6, as right 1 or 2 described a kind of bar-shaped LED light sources, it is characterized in that also laying on the described substrate resistance, electric capacity, the drive IC electron-like element of forming the light source module, connect to form the light source module that can directly use with circuit on the substrate.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100329038A CN100508188C (en) | 2007-12-27 | 2007-12-27 | A bar-shaped LED light source |
| PCT/CN2008/000381 WO2009082864A1 (en) | 2007-12-27 | 2008-02-22 | A led light source with the shape of a bar |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100329038A CN100508188C (en) | 2007-12-27 | 2007-12-27 | A bar-shaped LED light source |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101217142A CN101217142A (en) | 2008-07-09 |
| CN100508188C true CN100508188C (en) | 2009-07-01 |
Family
ID=39623534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2007100329038A Active CN100508188C (en) | 2007-12-27 | 2007-12-27 | A bar-shaped LED light source |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN100508188C (en) |
| WO (1) | WO2009082864A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010115296A1 (en) * | 2009-04-10 | 2010-10-14 | 佛山市国星光电股份有限公司 | Radiation substrate for power led and power led production and manufacturing method thereof |
| CN102032485B (en) * | 2009-09-29 | 2013-10-30 | 丰田合成株式会社 | Lighting device |
| CN101997269B (en) * | 2010-09-15 | 2012-02-08 | 山东华光光电子有限公司 | Method for manufacturing semiconductor laser bar |
| CN106097907A (en) * | 2016-07-30 | 2016-11-09 | 深圳浩翔光电技术有限公司 | A kind of waterproof and dustproof COB lamp bar screen for LED display |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1298059C (en) * | 2004-11-29 | 2007-01-31 | 深圳市淼浩高新科技开发有限公司 | Packaging structure of mosaic power type LED light source |
| CN2812306Y (en) * | 2005-08-02 | 2006-08-30 | 徐泓 | Large power LED package structure |
| CN2845171Y (en) * | 2005-08-10 | 2006-12-06 | 凯鼎科技股份有限公司 | The encapsulating structure of light-emittingdiode |
| US20070063213A1 (en) * | 2005-09-21 | 2007-03-22 | Lighthouse Technology Co., Ltd. | LED package |
| CN1983593B (en) * | 2005-12-15 | 2010-05-12 | 傅立铭 | High-power active thin light-emitting diode |
-
2007
- 2007-12-27 CN CNB2007100329038A patent/CN100508188C/en active Active
-
2008
- 2008-02-22 WO PCT/CN2008/000381 patent/WO2009082864A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| CN101217142A (en) | 2008-07-09 |
| WO2009082864A1 (en) | 2009-07-09 |
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