CN100530580C - Repairing method for bad paster in mobile phone camera mould set - Google Patents
Repairing method for bad paster in mobile phone camera mould set Download PDFInfo
- Publication number
- CN100530580C CN100530580C CNB2006100884277A CN200610088427A CN100530580C CN 100530580 C CN100530580 C CN 100530580C CN B2006100884277 A CNB2006100884277 A CN B2006100884277A CN 200610088427 A CN200610088427 A CN 200610088427A CN 100530580 C CN100530580 C CN 100530580C
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- China
- Prior art keywords
- scaling powder
- paster
- chip
- phone camera
- baking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Abstract
This invention relates to a maintaining method for poor chips in the production of cell phone image modules, in which, the maintaining method includes: a, coating scaling powder: coating a scaling powder uniformly on the poor connection parts of chips, b, firing: firing the chips coated with scaling powder on a warm-up stand under 230-270deg.C, for 2-4 minutes to infiltrate it to the connection place to re-weld the corresponding elements, c, detecting: testing the above mentioned chips according to the requirement and qualified ones become the quality goods.
Description
Technical field
The invention provides a kind of general cell-phone camera module in process of production for the maintenance mode of the bad product of paster.
Background technology
Because developing rapidly of mobile phone market, the internal structure of mobile phone also is ever-changing, so the variations that also becomes such as the profile of the shooting module of mobile phone, connected modes thereupon.So in manufacture process, because the homework precision height is relatively stricter to the precision requirement of product, so the scrappage of bad product is than higher.In order to save production cost, improve and produce yield, the utilization of the present invention mode that scaling powder is also toasted on bad product is improved the yield of defective products.
In process of production,, thereby cause product that phenomenons such as noise are arranged,, can't take effective means that material is keeped in repair for the material of these problems because brilliant unit (accompanying drawing 1) can produce phenomenons such as short circuit, rosin joint with flexible circuit board (FPC) when paster.Existing operation gimmick is general to adopt following dual mode that defective products is keeped in repair: 1, pull down from flexible circuit board (FPC) plate crystalline substance is first, and FPC is cleaned, then paster again; 2, be judged to substandard product for this material, do to scrap processing.
The problem that this method exists is: 1, first from the process that flexible circuit board (FPC) plate is pulled down crystalline substance, because the characteristic-flexibility of itself, in the Reflow Soldering of high temperature, easy deformation causes the damage of damage of brilliant unit or flexible circuit board (FPC) sheet material easily, causes the secondary of product to scrap; 2, the labour extra to this problem input also can't deal with problems at last, not only wastes certain human resources and also can not get the effective utilization of resources, causes waste of material, consumptive material consumption power.
Summary of the invention
The objective of the invention is in order to address the above problem the method for maintaining of paster defective products during a kind of general cell-phone camera module of proposition is produced.No matter how the paster mode changes, can both solve with simple, effective and efficient manner for the defective products that is produced in its process, save production cost the purpose of enhancing productivity thereby reach.
According to design provided by the invention, the method for maintaining of paster defective products comprises in the production of cell-phone camera module:
A, prefluxing: on chip, the uniform brushing scaling powder in the position of components and parts bad connection;
B, baking: the chip that will brush scaling powder is placed on the pre-heating station and toasts, 230～270 ℃ of baking temperatures, and stoving time 2～4 minutes makes scaling powder infiltrate the junction, with the components and parts of correspondence firm welding again;
C, detection: on request the chip after the above-mentioned welding is again detected the qualified certified products that becomes.
Repeat above-mentioned operation a, b again to detecting underproof chip.
In bake process, after 2～3 minutes baking temperature is reduced 20～30 ℃ gradually in baking.
Advantage of the present invention is: traditional operation more complicated that brilliant unit is pulled down from flexible circuit board (FPC), and personnel's input ratio is more, behind employing the present invention, solves the input personnel of these defective productss as long as 1-2 people has saved employee's work rate greatly; Begin to keep in repair to EOT and keep in repair the used time as long as 6-8 minute from taking product, shortened man-hour greatly; Keep in repair used instrument and only need conventional scaling powder, pre-heating station, measurement jig and test computer, therefore dwindled maintenance cost, saved maintenance cost.
Description of drawings
Fig. 1 is brilliant first exterior view.
Fig. 2 is brilliant first ground plan.
Fig. 3 is the schematic diagram of brilliant unit and flexible circuit board.
Fig. 4 is the schematic diagram of prefluxing on brilliant unit and the flexible circuit board.
Embodiment
Step 1, around the brilliant unit 1 of bad product, coat scaling powder 4 equably.
Step 5, the material after will toasting are placed on the special test tool and test.
Behind step 6, the EOT, take off product.For the product repeating step one of test crash, step 2, step 3 to step 5.
The product that step 7, test are passed through rolls off the production line as orthodox material.After the maintenance, test the product of twice failure and do to scrap processing.
The present invention mainly utilizes the meltable of scaling powder 4, at high temperature fully contact with scolding tin, make scolding tin fully dissolve, and on the solder joint 2 between brilliant unit 1 and the flexible circuit board 4 (FPC), retighten, make brilliant first 1 to contact better with flexible circuit board 4 (FPC).
On personnel's problem, the design is very simple, and can operate, and main purpose is to allow an employee that can not do maintenance also can keep in repair this defective products.Later in process of production, no matter how personnel change, always can operate, easy to learn.Enterprise staff all can be keeped in repair, realize online on-call maintenance at last.
In addition, the present invention has also considered factors such as many tool instruments:
It at first is the employed pre-heating station of maintenance.For more saving time, resource-saving more, pre-heating station used in the present invention is exactly a used common pre-heating station in the production process.When the used pre-heating station of production leaves unused, also can use, reach the purpose of making rational use of resources.
Next is exactly a measurement jig.Employed measurement jig is exactly to produce used measurement jig, and is feasible unified with the standard front and back that produce, and avoids taking place the inconsistent situation generation of testing standard.
This invention has been saved human resources greatly, has reduced scrap cost, has been improved the production yield of processing factory.And because simple to operate, it is also quite easy to learn.
Claims (2)
1, the method for maintaining of paster defective products is characterized in that during the cell-phone camera module was produced,
A, prefluxing: on chip, the uniform brushing scaling powder in the position of components and parts bad connection;
B, baking: the chip that will brush scaling powder is placed on the pre-heating station and toasts, 230～270 ℃ of baking temperatures, and stoving time 4 minutes makes scaling powder infiltrate the junction, with the components and parts of correspondence firm welding again; In bake process, after 2～3 minutes baking temperature is reduced 20～30 ℃ gradually in baking;
C, detection: on request the chip after the above-mentioned welding is again detected the qualified certified products that becomes.
2, the method for maintaining of paster defective products is characterized in that during the cell-phone camera module was produced according to claim 1, repeated above-mentioned operation a, b again to detecting underproof chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100884277A CN100530580C (en) | 2006-08-23 | 2006-08-23 | Repairing method for bad paster in mobile phone camera mould set |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100884277A CN100530580C (en) | 2006-08-23 | 2006-08-23 | Repairing method for bad paster in mobile phone camera mould set |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1913116A CN1913116A (en) | 2007-02-14 |
| CN100530580C true CN100530580C (en) | 2009-08-19 |
Family
ID=37721996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100884277A Expired - Fee Related CN100530580C (en) | 2006-08-23 | 2006-08-23 | Repairing method for bad paster in mobile phone camera mould set |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100530580C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105376948A (en) * | 2015-12-02 | 2016-03-02 | 深圳市建滔科技有限公司 | Full automatic manufacture method of intelligent main controller |
-
2006
- 2006-08-23 CN CNB2006100884277A patent/CN100530580C/en not_active Expired - Fee Related
Non-Patent Citations (6)
| Title |
|---|
| BGA封装技术及其返修工艺. 张塍.电子工艺技术，第26卷第1期. 2005 |
| BGA封装技术及其返修工艺. 张塍.电子工艺技术，第26卷第1期. 2005 * |
| VCD机接触不良的原因及检修. 梁树培.电子报. 2005 |
| VCD机接触不良的原因及检修. 梁树培.电子报. 2005 * |
| 关于SMT电路板焊装维修工艺的讨论. 葛杰.电子工艺技术，第19卷第3期. 1998 |
| 关于SMT电路板焊装维修工艺的讨论. 葛杰.电子工艺技术，第19卷第3期. 1998 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1913116A (en) | 2007-02-14 |
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Granted publication date: 20090819 Termination date: 20120823 |