CN100559280C - A kind of objective glass testing device and method - Google Patents
A kind of objective glass testing device and method Download PDFInfo
- Publication number
- CN100559280C CN100559280C CNB200710044558XA CN200710044558A CN100559280C CN 100559280 C CN100559280 C CN 100559280C CN B200710044558X A CNB200710044558X A CN B200710044558XA CN 200710044558 A CN200710044558 A CN 200710044558A CN 100559280 C CN100559280 C CN 100559280C
- Authority
- CN
- China
- Prior art keywords
- mask
- object lens
- work stage
- alignment patterns
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The invention provides a kind of object lens pick-up unit and method.Prior art is by carrying out object lens and detect and cause testing process complexity and inefficiency being coated with on the wafer of photoresistance multiexposure, multiple exposure.Object lens pick-up unit of the present invention comprises light source, mask platform, work stage, the object lens framework, be respectively applied for the mask platform drive unit and the work stage drive unit that drive mask platform and work stage motion, first and second masks that are separately positioned on mask platform and the work stage and have a plurality of corresponding alignment patterns, be used to survey through the light intensity of the alignment patterns on second mask and the detecting module of those alignment patterns positions, be used for first and second mask registration of controlling and driving and aim at back control work stage drive unit driving work stage and carrying out the control module of scanning motion, and be used for data run one handling procedure that scanning motion is detected processing module with the image quality parameter that obtains object lens to be detected at both.Adopt the present invention can simplify the measuring process of object lens.
Description
Technical field
The present invention relates to the check of object lens, particularly a kind of objective glass testing device and method.
Background technology
In field of semiconductor manufacture, photoetching is most important operation, existing industry uses single image-forming objective lens doubly to expose usually, and need to form the figure of required semiconductor devices by multiexposure, multiple exposure, in this process, alignment precision in the time of need guaranteeing at every turn to expose, and the image quality of alignment precision and photoetching projection objective lens is closely related.The image quality of photoetching projection objective lens is subjected to the influence of the image quality parameter of object lens, and wherein, this image quality parameter comprises objective lens magnification deviation, distortion parameter and curvature of field parameter, and the numerical value of image quality parameter is more little, and the image quality of projection objective is good more.
Projection objective can be designed very high image quality when design, but in the process that optics is processed and debug its quality of optical imaging is affected.So before projection objective was attached to litho machine, needing the image quality parameter to object lens was that magnification deviation, distortion parameter and curvature of field parameter detect.
Now use projection objective and mask that the wafer that is coated with photoresistance is carried out multiexposure, multiple exposure usually, obtain the parameter of projection objective then according to the figure after the exposure with alignment patterns.The patent No. is the United States Patent (USP) of US6947119, it provides a kind of method of above-mentioned objective lens, this method is main earlier by using 1 pair one wafer that is coated with photoresistance of mask with marker graphic as shown in Figure 1 to expose, wherein, adjacent two row of the test pattern on this mask 1 are respectively little closed square mark 10 and big hollow square mark 11, shadowing mask makes four little closed square marks 10 and two the big hollow square marks 11 (as shown in Figure 2) that only stay mask middle part then, use mask 1 after above-mentioned the covering in the enterprising line scanning exposure of the wafer that has exposed afterwards, form 7*18 little closed square mark 10 and be enclosed within figure square formation in the big hollow square 11.Last calculating according to formed figure square formation influences the image quality of projection objective image quality parameter.
But the above-mentioned patent No. is the method for objective lens of the United States Patent (USP) of US6947119 exists following problem: at first need through multiexposure, multiple exposure, so need carry out repeatedly the aligning between mask and the wafer, when particularly usefulness figure as shown in Figure 2 carries out scan exposure, its requirement to alignment precision is higher, so need the time of overspending accurately to aim at, so will make the testing process complexity and make detection efficiency low; In addition, the error of this multiexposure, multiple exposure can add up at double, so can the accuracy of test be impacted; Moreover this method can not be used for directly measuring the curvature of field of object lens.
Therefore, how to provide a kind of projection objective proving installation and method to come the image quality parameter that records projection objective of precise and high efficiency, become the technical matters that industry needs to be resolved hurrily.
Summary of the invention
The object of the present invention is to provide a kind of object lens pick-up unit and method, by described device and method need not to expose and on a large scale in accurately locate, can simplify testing process, and improve detection efficiency.
The object of the present invention is achieved like this: a kind of object lens pick-up unit, the image quality parameter that is used for objective lens, it comprises light source, mask platform, work stage, is used to place the object lens framework of object lens to be detected, is respectively applied for the mask platform drive unit and the work stage drive unit that drive mask platform and work stage motion, this object lens pick-up unit also comprises: first mask and second mask, it is separately positioned on this mask platform and this work stage and has the alignment patterns of a plurality of correspondences, and moves with this mask platform and this work stage respectively; Detecting module is arranged under this second mask, is used to survey through the light intensity of the alignment patterns on this second mask and the position of those alignment patterns; Control module, be used to control that mask platform drive unit and work stage drive unit drive the motion of mask platform and work stage respectively so that first mask and second mask registration, and in a predeterminable area, carry out scanning motion in control work stage drive unit driving work stage after first and second mask registration; Processing module, data run one handling procedure that is used for detecting module is surveyed when work stage is carried out scanning motion is to obtain the image quality parameter of object lens to be detected.
In above-mentioned object lens pick-up unit, this detecting module comprises light intensity probe unit and position detection unit, wherein, this light intensity probe unit is used to survey the light intensity through the alignment patterns on this second mask, and this position detection unit is used to survey the position of the alignment patterns on this second mask.
In above-mentioned object lens pick-up unit, the quantity of this light intensity probe unit is identical with alignment patterns quantity on second mask, and the alignment patterns on this light intensity probe unit and second mask is corresponding one by one.
In above-mentioned object lens pick-up unit, these object lens to be detected have a nominal magnification.
In above-mentioned object lens pick-up unit, this first mask becomes a predetermined ratio with alignment patterns on second mask, and this predetermined ratio equals the nominal magnification of object lens.
In above-mentioned object lens pick-up unit, this predeterminable area covers all alignment patterns on first mask by space real image that object lens became.
In above-mentioned object lens pick-up unit, this image quality parameter comprises magnification deviation, distortion parameter and curvature of field parameter.
The present invention also provides a kind of method that above-mentioned object lens pick-up unit carries out the object lens check of using, and this method may further comprise the steps: (1) is arranged on object lens to be detected on this object lens framework, and the unlatching light source makes the alignment patterns process object lens imaging on first mask; (2) control mask platform drive unit and work stage drive unit drives mask platform and work stage motion respectively so that first mask and second mask registration; (3) control work stage drive unit driving work stage is carried out scanning motion in this predeterminable area; (4) when carrying out scanning motion, work stage surveys through the light intensity of the alignment patterns on this second mask and the position of this alignment patterns; (5) with data run one handling procedure that detected to obtain the image quality parameter of object lens to be detected.
With in the prior art by carrying out multiexposure, multiple exposure at the wafer that is coated with photoresistance, detecting lens according to the skew of formed alignment patterns then compares, object lens pick-up unit of the present invention and method are by being provided with first and second mask with a plurality of corresponding alignment patterns respectively on mask platform and work stage, drive work stage then and carry out the position that the space real image of the alignment patterns on first mask is caught in scanning motion, go out the image quality parameter of object lens according to this space real image and ideal image position calculation, so can avoid repeatedly aligning and consequent cumulative errors in the exposure process, reduction is to the range of movement and the positioning requirements of work stage, simplified testing process greatly, improve detection efficiency, saved the detection cost.
Description of drawings
Object lens pick-up unit of the present invention and method are provided by following embodiment and accompanying drawing.
Fig. 1 is the front view of the mask that exposes in the prior art;
Fig. 2 is the front view of the mask after the crested in the prior art;
Fig. 3 is the composition structural representation of object lens pick-up unit of the present invention;
Fig. 4 is the front view of first mask of the present invention;
Fig. 5 is the enlarged diagram of the alignment patterns on first mask;
Fig. 6 is the process flow diagram of object lens detection method of the present invention.
Embodiment
Below will be described in further detail object lens pick-up unit of the present invention and method.
Referring to Fig. 3, object lens pick-up unit 3 of the present invention is used to detect object lens 40 to be detected, and described object lens pick-up unit 3 comprises light source 30, object lens framework 31, mask platform 32, work stage 33, mask platform drive unit 34, work stage drive unit 35, first mask 36, second mask 37, detecting module 38, control module 39 and processing module 310.
Described object lens to be detected 40 have nominal magnification and image quality parameter maximal value, wherein, described image quality parameter maximal value is to estimate just the image quality parameter of object lens that can't detected its image quality problem by the proofer, when the image quality parameter of object lens all can be estimated its image quality problem of discovery by the proofer during greater than described image quality parameter maximal value, when the image quality parameter of object lens during, all can not detect its image quality problem by proofer's range estimation less than described image quality parameter maximal value; The image quality parameter maximal value of described object lens comprises magnification deviation maximal value Mmax, distortion parameter maximal value Dmax and curvature of field parameter maximal value Nmax.In the present embodiment, described nominal magnification is 4.
Below the above-mentioned member of object lens pick-up unit 3 of the present invention is elaborated.
Light source 30 is used to provide the test light source of objective lens 40, and existing normally used light source 30 is a ultraviolet source.
Object lens framework 31 is used to place object lens 40 to be detected.
Mask platform 32 and work stage 33 are separately positioned on object lens framework 31 both sides, and mask platform 32 is arranged on the side near light source 30.
Mask platform drive unit 34 and work stage drive unit 35 are respectively applied for driving mask platform 32 and work stage 33 is moved in three dimensions.
Referring to Fig. 4, shown the front view of first mask 36, as shown in the figure, have 81 alignment patterns 36a on first mask 36.
Referring to Fig. 5, the enlarged drawing that has shown alignment patterns 36a, as shown in the figure, described alignment patterns 36a1 is the enlarged drawing when cross for alignment patterns 36a is embodied as, the enlarged drawing when alignment patterns 36a2 comprises a vertical raster and a horizontal grating for alignment patterns 36a is embodied as.
Quantity, distribution and the shape of the alignment patterns on second mask 37 is all identical with first mask 36, so no longer the alignment patterns on second mask 37 is described in detail at this.
In the present embodiment, described first mask 36 and second mask 37 adopt identical materials to make.Described first mask 36 equals the desirable object lens imaging of nominal magnification by actual magnification and the alignment patterns on second mask 37 fits like a glove.
Detecting module 38, be arranged on described second mask 37 times, be used to survey the position of the light intensity that sees through the alignment patterns on described second mask 37 and described alignment patterns (promptly the alignment patterns on first mask is by space real image that object lens became), described detecting module 38 comprises light intensity probe unit (not shown) and position detection unit (not shown), the quantity of described light intensity probe unit is identical with alignment patterns quantity on second mask, and the alignment patterns on the described light intensity probe unit and second mask is corresponding one by one, wherein, described position detection unit is used to survey the position of described alignment patterns (promptly the alignment patterns on first mask is by space real image that object lens became), and described light intensity probe unit is used to survey the light intensity that sees through described alignment patterns.
Control module 39, be used to control mask platform drive unit 34 and work stage drive unit 35 and drive 33 motions of mask platform 32 and work stage respectively so that first mask 36 is aimed at second mask 37, and aim at back control work stage drive unit 35 at both and drive work stage 33 and in a predeterminable area, carry out scanning motion, when described first mask 36 equal by actual magnification the desirable object lens imaging of nominal magnification when identical with the alignment patterns on second mask 37 described first mask 36 aim at second mask 37.
At this, described predeterminable area is a rectangular parallelepiped zone, and it covers the space real image that all the alignment patterns 36a on first mask 36 are become by object lens 40, the size of described predeterminable area is determined according to image quality parameter maximal value, promptly determine by magnification deviation maximal value Mmax, distortion parameter maximal value Dmax and curvature of field parameter maximal value Nmax, the height of this rectangular parallelepiped is greater than Nmax, and the size that the length and width of this rectangular parallelepiped are high guarantees that at least the actual imaging position of alignment patterns of first mask is in this rectangular parallelepiped zone.
Described control module 39 is when control work stage drive unit 35 begins to drive work stage 33 carry out scanning motion in described predeterminable area, send one and start trigger pip to detecting module 38, detecting module 38 begins to survey through the light intensity of the alignment patterns on second mask 37 and the position of described alignment patterns, when described control module 39 is carried out the scanning motion end in control work stage drive unit 35 driving work stage 33 in described predeterminable area, send one and stop trigger pip to detecting module 38, detecting module 38 stops to survey through the light intensity of the alignment patterns on second mask 37 and the position of described alignment patterns.
Processing module 310, data run one handling procedure that is used for detecting module 38 is detected when predeterminable area carries out scanning motion in work stage 33 is to obtain the image quality parameter of object lens to be detected, wherein, the high light of light that described handling procedure is found out each alignment patterns that sees through second mask 37 earlier is strong, wherein, the described strong pairing position of high light is the actual imaging position of the alignment patterns on first mask, goes out the magnification deviation according to the actual imaging position of all alignment patterns and the ideal image position calculation of the alignment patterns on described first mask 36 afterwards, distortion parameter and curvature of field parameter.
After first mask 36 of said lens pick-up unit 1 and second mask 37 are separately positioned on mask platform 32 and the work stage 33, bring into use object lens pick-up unit 3 of the present invention to treat objective lens and detect.
Referring to Fig. 6, in conjunction with referring to Fig. 3, object lens detection method of the present invention is at first carried out step S60, and described object lens 40 to be detected are arranged on the described object lens framework 31.
Then continue step S61, open light source 30 and make the alignment patterns 36a scioptics 40 on first mask 36 be imaged on work stage 33 sides.Referring to Fig. 5, alignment patterns 36a can be embodied as the figure shown in 36a1 and 36a2, and alignment patterns 36a is embodied as 36a2 in the present embodiment.
Then continue step S62, control mask platform drive unit 34 and work stage drive unit 35 drive mask platform 32 respectively and work stage 33 is moved so that first mask 36 is aimed at second mask 37.
Then continue step S63, control work stage drive unit 34 drives work stage 33 and carry out scanning motion in a predeterminable area.
Then continue step S64, when work stage is carried out scanning motion, survey through the light intensity of the alignment patterns on described second mask 37 and the position of described alignment patterns.
Then continue step S65, with data run one handling procedure that detected to obtain the image quality parameter of object lens to be detected.
In the present embodiment, the high light strong pairing location parameter (i.e. the space real image of 81 of this first mask 36 alignment patterns) of described handling procedure is found out earlier 81 alignment patterns that see through second mask 37 in the data of being surveyed light in whole predeterminable area, curvature of field parameter is that the Z durection component according to this location parameter obtains, detailed process is as follows: because the space real image of 81 alignment patterns of first mask 36 is in different Z to height, so when work stage scans, the Z of each alignment patterns space real image highly determines, the filed curvature situation that Z height by these 81 alignment patterns just can draw object lens promptly draws curvature of field parameter, and described curvature of field parameter is minimum and maximum value poor of Z durection component of space real image of 81 alignment patterns of this first mask 36.
And when calculating magnification deviation and distortion parameter, need to calculate by the horizontal level deviation of space real image and desirable picture.When driving work stage and in predeterminable area, scanning the space real image of 81 alignment patterns on this first mask 36, just can obtain the horizontal level parameter of 81 space real images, and the horizontal level that 81 desirable pictures are the alignment patterns on the mask 37 is knownly (not need accurate measurement, because the influence to magnification is very little), so can calculate the horizontal level deviation E (n) of space real image and desirable picture.
Because object lens relatively are concerned about the distortion of 3 rank usually, so need specially three rank distortion factors to be obtained.
At first, the position deviation that defines alignment patterns relative reference center on first mask 36 is L (n), then shown in the following formula of relation of position deviation E (n), L (n), magnification deviation and distortion parameter:
E(n)＝M×L(n)+D3×L(n)^3+D(n) (1)
Wherein, the span of N is from 1 to 81, and it represents the numbering of alignment patterns; M represents the enlargement ratio of object lens; D3 represents 3 rank distortion factors of object lens; D (n) represents the residual distortion of n alignment patterns; The position deviation of n alignment patterns relative reference center of L (n) expression.
Horizontal level deviation and their position substitution formula (1) in mask of 81 alignment patterns can be obtained following system of equations:
E(1)＝M×L(1)+D3×L(1)^3
E(2)＝M×L(2)+D3×L(2)^3
E(3)＝M×L(3)+D3×L(3)^3
E(4)＝M×L(4)+D3×L(4)^3
……………
Above system of equations is carried out least square fit, can obtain optimum M_GLC and D3_GLC.
Use this M_GLC and D3_GLC substitution formula (1) to ask the residual error size of each point then, solution procedure is shown in following system of equations in detail:
D(1)＝E(1)-M_GLC×L(1)+D3_GLC×L(1)^3
D(2)＝E(2)-M_GLC×L(2)+D3_GLC×L(2)^3
D(3)＝E(3)-M_GLC×L(3)+D3_GLC×L(3)^3
D(4)＝E(4)-M_GLC×L(4)+D3_GLC×L(4)^3
…………………
So just can obtain M_GLC, the residual error D (n) of D3_GLC and each point, the magnification deviation of object lens is got M_GLC exactly, and distortion parameter is got the maximal value among all D3 * L (n)+D (n).
In sum, object lens pick-up unit of the present invention and method are by being provided with first and second mask with a plurality of corresponding alignment patterns respectively on mask platform and work stage, drive work stage then and carry out the position that the space real image of the alignment patterns on first mask is caught in scanning motion, go out the image quality parameter of object lens according to this space real image and ideal image position calculation, so can avoid repeatedly aligning and consequent cumulative errors in the exposure process, reduction is to the range of movement and the positioning requirements of work stage, simplified testing process greatly, improve detection efficiency, saved the detection cost.
Claims (6)
1, a kind of object lens pick-up unit, the image quality parameter that is used for objective lens, it comprises light source, mask platform, work stage, be used to place the object lens framework of object lens to be detected, be respectively applied for the mask platform drive unit and the work stage drive unit that drive mask platform and work stage motion, it is characterized in that, this object lens pick-up unit also comprises: first mask and second mask, it is separately positioned on this mask platform and this work stage and has the alignment patterns of a plurality of correspondences, and move with this mask platform and this work stage respectively, this first mask becomes a predetermined ratio with alignment patterns on second mask, and this predetermined ratio equals the nominal magnification of described object lens; Detecting module is arranged under this second mask, is used to survey through the light intensity of the alignment patterns on this second mask and the position of those alignment patterns; Control module, be used to control that mask platform drive unit and work stage drive unit drive the motion of mask platform and work stage respectively so that first mask and second mask registration, and in a predeterminable area, carry out scanning motion in control work stage drive unit driving work stage after first and second mask registration; Processing module, data run one handling procedure that is used for detecting module is surveyed when work stage is carried out scanning motion is to obtain the image quality parameter of object lens to be detected.
2, object lens pick-up unit as claimed in claim 1, it is characterized in that, this detecting module comprises light intensity probe unit and position detection unit, wherein, this light intensity probe unit is used to survey the light intensity through the alignment patterns on this second mask, and this position detection unit is used to survey the position of the alignment patterns on this second mask.
3, object lens pick-up unit as claimed in claim 2 is characterized in that, the quantity of this light intensity probe unit is identical with alignment patterns quantity on second mask, and the alignment patterns on this light intensity probe unit and second mask is corresponding one by one.
4, object lens pick-up unit as claimed in claim 1 is characterized in that, this predeterminable area covers all alignment patterns on first mask by space real image that object lens became.
5, object lens pick-up unit as claimed in claim 1 is characterized in that, this image quality parameter comprises magnification deviation, distortion parameter and curvature of field parameter.
6, a kind of object lens method of inspection of using object lens pick-up unit as claimed in claim 1, it is characterized in that, this method may further comprise the steps: (1) is arranged on object lens to be detected on this object lens framework, and the unlatching light source makes the alignment patterns process object lens imaging on first mask; (2) control mask platform drive unit and work stage drive unit drives mask platform and work stage motion respectively so that first mask and second mask registration; (3) control work stage drive unit driving work stage is carried out scanning motion in this predeterminable area; (4) when carrying out scanning motion, work stage surveys through the light intensity of the alignment patterns on this second mask and the position of this alignment patterns; (5) with data run one handling procedure that detected to obtain the image quality parameter of object lens to be detected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200710044558XA CN100559280C (en) | 2007-08-03 | 2007-08-03 | A kind of objective glass testing device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200710044558XA CN100559280C (en) | 2007-08-03 | 2007-08-03 | A kind of objective glass testing device and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101135858A CN101135858A (en) | 2008-03-05 |
| CN100559280C true CN100559280C (en) | 2009-11-11 |
Family
ID=39159999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB200710044558XA Active CN100559280C (en) | 2007-08-03 | 2007-08-03 | A kind of objective glass testing device and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100559280C (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4573252B2 (en) * | 2008-11-06 | 2010-11-04 | キヤノンマーケティングジャパン株式会社 | Alignment system, alignment system control method, program, and measuring apparatus |
| CN102375329B (en) * | 2010-08-20 | 2013-04-10 | 上海微电子装备有限公司 | Test mask and method for measuring exposure system parameters therewith |
| CN102692820B (en) * | 2011-03-21 | 2014-12-17 | 上海微电子装备有限公司 | Device and method for measuring projection lens distortion |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4792693A (en) * | 1985-09-19 | 1988-12-20 | Nikon Corporation | Step-and-repeat exposure method |
-
2007
- 2007-08-03 CN CNB200710044558XA patent/CN100559280C/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4792693A (en) * | 1985-09-19 | 1988-12-20 | Nikon Corporation | Step-and-repeat exposure method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101135858A (en) | 2008-03-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6538721B2 (en) | Scanning exposure apparatus | |
| CN107957659B (en) | Mask and wafer defect detection orthogonality compensation method | |
| KR960011563A (en) | Projection exposure system | |
| EP1950794A1 (en) | Optical characteristic measuring method, exposure method, device manufacturing method, inspecting apparatus and measuring method | |
| US9915878B2 (en) | Exposure apparatus, exposure method, and device manufacturing method | |
| CN103744271A (en) | Laser direct-writing system and photolithography method | |
| JP3211491B2 (en) | Projection exposure apparatus and semiconductor manufacturing method and apparatus using the same | |
| JP2009244831A (en) | Maskless exposure method | |
| JP2006300676A (en) | Flatness anomaly detecting technique and exposing device | |
| KR20180132104A (en) | Projection-type exposure apparatus and method | |
| US5666205A (en) | Measuring method and exposure apparatus | |
| CN100559280C (en) | A kind of objective glass testing device and method | |
| US20190293924A1 (en) | Method and device for exposure of photosensitive layer | |
| KR101764169B1 (en) | Maskless exposure apparatus and method for getting spot beam position using the same | |
| CN106324996B (en) | Litho machine original position multi channel imaging quality detection device and method | |
| CN102207695A (en) | Alignment system and alignment method for photolithographic device | |
| TWI501049B (en) | Method and device for measuring the relative local position error of one of the sections of an object that is exposed section by section | |
| JP2006165216A (en) | Evaluation method, scanning exposure method and scanning exposure device | |
| CN111694226B (en) | Levelness measuring method and direct imaging device | |
| JP2013236074A (en) | Surface position measuring device, exposure equipment, and device manufacturing method | |
| US9424636B2 (en) | Method for measuring positions of structures on a mask and thereby determining mask manufacturing errors | |
| CN101140423B (en) | Transmission aligning mark combination used for mask alignment and mask alignment method thereof | |
| JP2007027219A (en) | Optimizing method and display method | |
| CN105988302B (en) | Method for leveling the method for validation test and calibrating lithographic projection apparatus | |
| CN112859545A (en) | Position calibration device and method for exposure lens |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 201203 Zhangjiang High Tech Park, Shanghai, Zhang Dong Road, No. 1525 Patentee after: Shanghai microelectronics equipment (Group) Limited by Share Ltd Address before: 201203 Zhangjiang High Tech Park, Shanghai, Zhang Dong Road, No. 1525 Patentee before: Shanghai Micro Electronics Equipment Co., Ltd. |