CN100576432C - Smart conditioner rinse station - Google Patents

Smart conditioner rinse station Download PDF

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Publication number
CN100576432C
CN100576432C CN200680009439A CN200680009439A CN100576432C CN 100576432 C CN100576432 C CN 100576432C CN 200680009439 A CN200680009439 A CN 200680009439A CN 200680009439 A CN200680009439 A CN 200680009439A CN 100576432 C CN100576432 C CN 100576432C
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China
Prior art keywords
adjustment part
inductor
adjusting mechanism
adjustment
rinse station
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CN101147232A (en
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A·耶尔马兹
L·卡鲁皮亚
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Applied Materials Inc
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Applied Materials Inc
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Abstract

The invention provides a kind of method and apparatus that is used to monitor the polishing pad adjusting mechanism.In an embodiment, the semiconductor substrate grinding system comprises a rinse station, a lapped face, an adjustment part and an adjusting mechanism.This adjusting mechanism alternative is positioned adjustment part for lapped face and rinse station top.And detect the primary importance and the second place of this adjustment part when providing at least one inductor and its to be configured to above being positioned at rinse station.

Description

Smart conditioner rinse station
Technical field
The embodiment of the invention roughly is about chemical machinery polishing system.Clearer and more definite, be method and apparatus about the lapped face adjusting mechanism of monitoring chemical machinery polishing system.
Background technology
Cmp is one of processing procedure commonly used of making the high density integrated circuit.Cmp contacts the lapped face that has grinding liquid by making base material, with the material layer planarization that will deposit on the semiconductor substrate.Via chemistry and mechanical motion, material can remove from substrate surface because of the lapped face that is contacted.
The grinding effect of desiring for reaching, lapped face be arrangement or adjustment periodically.Wherein a kind of adjustment processing procedure is to carry out on the polyurethane grinding pad, and it is the characteristic of design with recovery lapped face liquid-retentive, and the self-grind surface removes the assorted material of embedding.The another kind of processing procedure of adjusting normally carries out having on the lapped face of fixing abrasive grains, its grinding element in design presents structure (it comprises the polishing property grinding-material), the upper surface of self-grind material removes dietary fibres simultaneously, and flattens the structure that comprises lapped face, makes it to have even height.
In an embodiment, the lapped face adjuster comprises an interchangeable adjustment part, diamond disk (diamond disk) for example, and it can couple mutually with the adjustment head that moves on the lapped face.Adjustment part can descend when rotated and contact with lapped face.Adjust the roughly inswept spin finishing of head surface, to allow adjustment part adjust the presumptive area of lapped face.
Known adjuster utilizes the dividing plate of adjusting in the head to control the height of adjustment part usually.Chamber behind the dividing plate is understood pressurized usually and is fallen adjustment part, and in the adjustment period between compress the lapped face of grinding pad.After adjustment was finished, cavity was understood emptying, and passed through the auxiliary withdrawal adjustment part of upper spring bias voltage.
Pressurization and emptying chamber can cause dividing plate to repeat that mill is scraped and be lax.In addition, the rising of adjustment part and decline more can form stress to dividing plate.Yet elastic baffle all has useful life as all elastomeric materials.If do not keep in repair or change, the deterioration of final dividing plate can make the adjustment deleterious.For avoiding inevitable deterioration, dividing plate is changed with the interval of setting usually, for example carries out after previously selected adjustment period.Yet known method efficient is not good.Because of dividing plate sometimes still is in good condition when changing, forms meaningless shutdown and increase cost.Other the time, the dividing plate situation is not good but not to be changed yet, makes the adjustment deterioration of grinding pad.
Therefore, industry needs a kind of method and apparatus that is used to monitor the grinding pad adjusting mechanism.
Summary of the invention
The present invention provides a kind of method and apparatus that is used to monitor the grinding pad adjusting mechanism.In an embodiment, the equipment that is provided for monitoring adjuster is to comprise an inductor, and it is the effectiveness parameters that detects adjustment part with at the unassembled processing liner of adjustment part the time through settling.Effectiveness parameters may comprise downforce (downforce), power delivery or adjust the situation on surface and other may influence the parameter of adjusting usefulness.
In another embodiment, the semiconductor substrate grinding system comprises a rinse station, a lapped face, an adjustment part and an adjusting mechanism.This adjusting mechanism alternative is positioned at lapped face and rinse station top with adjustment part.And provide at least one inductor, and detect the primary importance and the second place of adjustment part when being configured to above being located at rinse station.
In another implemented aspect, the semiconductor substrate grinding system had a lapped face and an adjusting mechanism, and it is removable adjusts between the non-adjustment position of position and lapped face side in one of lapped face top.Inductor also provides to detect the effectiveness parameters of adjustment part when the non-adjustment position.
In another aspect of invention, provide a kind of method of calibrating the adjusting mechanism element.This method comprises the numerical value (metric) of induction adjusting mechanism effectiveness parameters, and judges whether the numerical value of being responded to drops in the processing procedure window.
In another embodiment, the method that is used to calibrate the element of adjusting mechanism comprises the adjustment part that starts adjusting mechanism, to be displaced between first and second position.Then, analysis makes the required time of adjustment part start between the primary importance and the second place.
Description of drawings
Therefore aforementioned feature of the present invention and aspect all can be obtained in more detail by the execution mode of preamble outline and with reference to the mode of embodiment and additional illustration and understand.Yet it should be noted that additional illustration is only for inventing general embodiment and should not being considered as scope restriction of the present invention, so other equivalent embodiment are also contained in the present invention.
Fig. 1 is the vertical view that adjusting mechanism has the exemplary grinding system of a rinse station embodiment.
Fig. 2 is the side cross-sectional view of adjusting mechanism and the rinse station embodiment of Fig. 1.
Fig. 3 A and 3B describe side-looking and the vertical view of a rinse station embodiment respectively.
Fig. 4 A, 4B and 4C are the methods that rinse station is used in explanation; And
Fig. 5 is the chart of rinse station sensitive time.
For ease of understanding, in the literary composition as far as possible with similar elements in the equal reference numbers sign picture.Should will be understood that the element in the embodiment of the present application also can be applicable to other embodiment under not describing in addition.
The main element symbol description
100 systems, 102 liquid conveying systems
104 factor interface, 108 mills
110 first mechanical arms, 112 card caskets
114 first transfer systems, 116 second mechanical arms
118 second transfer stations, 120 conveyers
124 of 122 support arms
126 grinding stations, 128 grinding-materials
130 platforms, 134 adjusting mechanisms
135 rinse stations, 140 bases
142 load cups, 144 input buffers
146 output buffers, 148 transfer station mechanical arms
150 liquid supplies, 152 support arm assemblies
202 assemblies of 160 controllers
204 strutting pieces, 206 support arms
208 elements, 210 actuators
212 bearings, 214 driving shafts
216 water, 218 pulleys
220 first ends, 222 conveyer belts
224 conduits, 226 liquid control systems
230 bodies, 232 mounting panels
234 nozzles, 236 fluid supplies
238 strutting pieces, 240 dividing plates
242 springs, 250 inductors
290 chambers, 292 PLC
302 support arms, 304 protuberances
306 supports, 310 elongate slots
312 first inductors, 314 dotted lines
316 second inductors, 318 parts
322 inductors, 324 second nozzles
330 inner edges, 390 inductors
502 state axles, 504 time shafts
508 second inductors
Embodiment
Fig. 1 is the vertical view of an exemplary grinding system 100, and it has rinse station 135 embodiment of the present invention.This grinding system 100 roughly comprises a factor interface 104, a cleaning part 106 and an abrasive article 108.Can benefit from two grinding systems of the present invention is that California holy Plutarch La La Applied Materials locks formula
Figure C20068000943900101
Chemical machinery polishing system and REFLEXION LKEcmp TMCan benefit from another grinding system of the present invention and be people such as being described in Birang leads card June 12 calendar year 2001 United States Patent (USP) the 6th, 244, No. 935 cases, title are in " Apparatusand Methods for Chemical Mechanical Polishing with an AdvanceablePolishing Sheet " literary composition.
Controller 160 also is provided with assistance system 100 controls and integration.Controller 160 comprises a CPU (CPU), memory body and support circuits (not shown) usually.This controller 160 is coupled to the different elements of system 100 to help control, processing such as for example planarization, cleaning and transmission.
In an embodiment, factor interface 104 comprises one first or interface machine people 110, and it is suitable for base material is sent to first transfer station 114 from one or more base material magazine 112.Second robot 116 is arranged between factor interface 104 and the abrasive article 108, and is to be provided with between second transfer station 118 that is provided with on first transfer station 114 that base material is transmitted in factor interface 104 and the abrasive article 108.Cleaning device 106 is arranged on or usually near factor interface 104 places, and is suitable for the preceding cleaning and the dry base material of being sent back to by abrasive article 108 that are returning (with interface machine people 110) base material magazine 112 in that base material is being sent.
Abrasive article 108 comprises that at least one grinding stations 126 and is located at the conveyer 120 on the pedestal 140.In embodiment shown in Figure 1, abrasive article 108 comprises three grinding stations 126, respectively has a platform 130, and in order to support grinding-material 128, base material is also handled thereon.
Conveyer 120 can support at least one grinding head 124, but its fixing base material during handling.In embodiment shown in Figure 1, conveyer 120 is rotating platforms, and grinding head 124 is supported on its four support arms 122.One support arm 122 of conveyer and excision are to present second transfer station 118.The base material that conveyer 120 helps to be retained in each grinding head 124 is displaced between second transfer station 118 and the grinding stations 126, and base material is handled between described station.Grinding head 124 and fixing base material when being configured in grinding.Grinding head 124 also is coupled to connecting gear, and wherein connecting gear is to be displaced between transmission war 118 and the grinding stations 126 in order to the base material that will be retained in the grinding head 124 through setting.And can benefit from a kind of grinding head of the present invention is TITANHEAD TMSubstrate carrier, it is gone on the market by Applied Materials.
Second transfer station 118 comprises a load cup 142, an input buffer 144, an output buffer 146 and a robot of transfer station 148.This input buffer 144 can be accepted the base material that is sent to abrasive article 108 by second robot 116.This robot of transfer station 148 can be sent to load cup 142 from input buffer 144 with base material.This load cup 142 can vertically be sent to base material grinding head 124 (but its fixing base material during processing procedure).Base material through grinding can be sent to load cup 142 by self-grind head 124, and then moves to output buffer 146 with robot of transfer station 148.Base material membership second robot 116 through grinding is sent to first transfer station 114 by output buffer 146, and then transmits by cleaning device 106.Can benefit from second transfer station of the present invention and be and be described on December 5th, 2000 by No. the 6th, 156,124, the United States Patent (USP) of card that Tobin leads, title is in " Wafer Transfer Station for a Chemical Mechanical Polisher " literary composition.
Lapping liquid conveying system 102 comprises at least one grinding liquid supply 150, and it is couple at least one lapping liquid conveying arm assembly 152.Generally speaking, each grinding stations 126 is provided with conveying arm assembly 152 separately, and it is neighbouring to provide lapping liquid during grinding to be located in each platform 130.In embodiment illustrated in fig. 1, three grinding stations 126 respectively have a conveying arm assembly 152 that links to each other.
The platform 130 of each grinding stations 126 can support grinding-material 128.During handling, base material is in the environment of lapping liquid (being provided by conveying system 102) and abuts against grinding-material 128 by grinding head 124.Platform 130 is rotatable so that the grinding campaign of at least one part to be provided between base material and grinding-material 128.Perhaps, grinding motion can be by linearity, rail mounted, at random, rotate or the mode of other motions moves at least one of this grinding head 124 or grinding-material 128.
Grinding-material 128 can be formed by foamable polymer, for example polyurethane, conductive material, fixedly polishing property material or its composition.Fixedly polishing property material (fixed abrasive material) roughly comprises several polishing property elements, is located on the flexible backboard.In an embodiment, this polishing property element is to be floated in polymeric binder by the polishing property example of geometry and form.Grinding-material can be pad form or netted.
Adjusting mechanism 134 is provided in a side of contiguous each grinding stations 126 place, and is suitable for the grinding-material 128 on smooth or the adjustment platform 130.Each adjusting mechanism 134 be through be provided be displaced into do not contain grinding-material 128 and platform 130 a position (as shown in Figure 1) and between the adjustment position above the grinding-material 128.In this adjusted position, this adjusting mechanism 134 was to start engaging grinding-material 128, and made the surface of grinding-material 128 reach one can to form the state that institute's desire is ground the result.In the position that does not contain grinding-material 128 and platform 130, adjusting mechanism 134 is to engage with rinse station 135 through the location.
Fig. 2 is the sectional view that this adjusting mechanism 134 is bonded on the embodiment in this rinse station 135.This adjusting mechanism 134 roughly comprises an assembly 202, is coupled to strutting piece 204 with an arm 206.This strutting piece 204 is the bases 140 that are provided with by abrasive article 108.212 on bearing is located between base 140 and the strutting piece 204, in order to the rotation of strutting piece 204.Actuator 210 is coupled between this base 140 and this strutting piece 204, with the gyrobearing of control strutting piece 204.Actuator 210 (for example pneumatic cylinders, servomotor, motor-driven ball screw, harmonic drive or other be suitable for controlling the movement control elements of strutting piece 204 gyrobearings) can make support arm 206 that self-supporting part 204 extends around strutting piece 204 rotations, and an assembly 202 is laterally moved with respect to this grinding stations 126.Adjustment part 208 is to be coupled to an assembly 202 bottoms, and alternative compresses platform 130 to adjust grinding-material 128.
The height of adjustment part 208 is shown the mode of pressurization one expandable cavity chamber 290 (engaging with dividing plate 240 parts that are arranged in an assembly 202) greatly and is controlled.The spring of being located in the assembly 202 242 can provide biasing force, assists adjustment part 208 withdrawals with 290 emptyings of the chamber behind dividing plate 240 or when vacuumizing.The described example that is applicable to adjusting mechanism of the present invention is to be described in the Application No. 10/411st of people such as Lischka in application on April 10th, 2003, No. 752, title is in " Conditioner Mechanism for Chemical Mechanical Polishing " literary composition, and people such as Osterheld led the United States Patent (USP) the 6th of card on June 3rd, 2003,572, No. 446, title is in " Chemical Mechanical Polishing Pad Conditioning Elementwith Discrete Points and Compliant Membrane " literary composition.Though an adjustment shown in Figure 2 assembly 202 is a rotating barrier 240 and a spring 242, use an adjustment assembly 202 of other actuating mechanisms (for example whole baffle, conveyer belt, spring, actuator and fellow) also can in rinse station 135, adjust but should understand, hereinafter will further discuss.In addition, should understand the element that teaching herein also can be used for calibrating other process apparatus, for example dividing plate and/or the bladder in the grinding head 124, or other elements that can consume useful life.
But strutting piece 204 shade driving shafts 214, this driving shaft couples the motor 216 of base 140 belows, and the pulley 218 of extremely contiguous support arm 206 first ends 220.Conveyer belt 222 is to be located in the support arm 206, and operationally couples this pulley 218 and an assembly 202, uses so that motor 216 can selectivity rotation adjustment parts 208.Conveyer belt 222 can be any element that is suitable at motor 216 and 202 conveying rotary motions of an assembly.
Controlling liquid conduit 224 from liquid control system 226 is via strutting piece 204 and support arm 206 rotations, and is coupled to an assembly 202.This liquid control system 226 comprises a gas supply device and different control element (that is, valve, adjuster and fellow), to assist to apply and/or remove the fluid pressure of an assembly 202 chambers 290.In an embodiment, liquid control system 226 can provide air or nitrogen with the height of control adjustment part 208 with respect to platform 130 (or base 140), and in the adjustment period between control adjustment part 208 abut against 128 applied pressures of grinding-material (for example adjusting the decline power of head).
Adjustment part 108 can not move to rinse station 135 when using.Rinse station 135 roughly comprises a body 230, one or more inductor 250 and a wetting nozzle 234.In an embodiment, body 230 is to be placed on the base 140 with a strutting piece 238.Body 230 also can directly be coupled to strutting piece 238.Perhaps, body 230 can be coupled to strutting piece 238 via mounting panel 232.Removing of fluid discharge when making body 230 be higher than base 140 to help adjustment part 208 wetting and other chips hereinafter will further be discussed.
One or more inductor 250 and through being provided with to detect the numerical value of adjuster usefulness.Some adjuster usefulness numerical value that can be sensed comprise that adjuster downforce, the parameter of adjusting the surface, power delivery (for example being used for the adjuster rotation), sealing and dividing plate usefulness and wetting liquid flow and other fellows.In an embodiment, inductor 250 is to be configured to respect to the position of this assembly 202 in a plurality of predetermined extended position induction adjustment parts 208.Inductor 250 can be positioned any adjustment part 208 positions that are suitable for detecting the pre-position.Perhaps, one or more inductor can be positioned at the far-end of rinse station 135.For example, one or more inductor 250 can be positioned on an assembly 202, support arm 206, base 140 in or on, or other are fit to induction adjustment parts 208 places with respect to the position of an assembly 202.In embodiment illustrated in fig. 2, at least one inductor 250 is to be coupled to body 230.
Wetting nozzle 234 can provide clean liquid with working surface wetting or cleaning adjustment part 208 from fluid supply 236.Nozzle 234 is with 208 grades of effective wetting adjustment parts/or other elements of an assembly 202 through the location.In an embodiment, wetting nozzle 234 is to be positioned at mounting panel 232 places.
3A and 3B figure illustrate side-looking and the vertical view of an embodiment of rinse station 135 respectively.The body 230 of rinse station 135 comprises support arm 302 and support 306.Support arm 302 can any other mode be coupled to mounting panel 232, for example with several bolt (not shown).Support arm 302 comprises the inner edge 330 and the protuberance 304 of a tool profile.Inner edge 330 profiles through design with when Nie closes rinse station 135 (as shown in Figure 2) stay the space of adjustment part 208.Protuberance 304 can provide adjustment part 208 rigid stopping when dropping to rinse station 135.Therefore, when adjustment part 208 was positioned at rinse station 135, adjustment part 208 was arranged on the contiguous place of support arm 302 inner edges 330, and can contact protuberance 304 when descending.The profile of protuberance 304 should allow wetting arm 234 wetting adjustment parts 208 (that is, can expose the overwhelming majority of adjustment part 208 bottoms when removing protuberance 304).
Also alternatively, an inductor 250 that is used for calibrating adjuster usefulness can be the inductor 390 of being located at protuberance 304, and it is suitable for detecting the numerical value of adjusting downforce.Therefore, when abutting against protuberance 304 when adjustment part 208 actuatings, inductor 390 can be compared with the value of predicted value or processing procedure window, and the downforce numerical value index relevant with controller is provided.If the downforce responded to exceeds the processing procedure window and/or when being different value with predicted value, controller can be labeled as special situation, notifying operation person or interrupt process operations.The data that inductor 390 is provided also can be with the usefulness trending, to predict or to monitor useful life.In addition, downforce inductor 390 can by provide a period of time later the mode of the detection data that change of strength detect sealing and/or dividing plate leaks, pressure supply air flow and fellow.
Also alternatively, except that controller 160 calibration informations directly were provided, special-purpose power line carrier (PLC) 292 or other computing elements also can be monitored inductor 250.Power line carrier 292 can have an output that is coupled to controller 160, is that controller can trigger and stops or change adjusting and/or the potential adjuster usefulness incident of base material treatment to mark that those have discerned.
Also illustrate one or more inductor 250 in equally embodiment illustrated in fig. 2, comprise one first inductor 312, be located on support arm 302 inner edges 330; And one second inductor 316, be coupled to support arm 302 basal surfaces.Inductor 250 can comprise any suitable inductor, to detect the position of adjustment part 208.In an embodiment, first inductor 312 is a penetration (break-through) inductor, and it is configured to transmit and receiving beam (with dotted line 314 expressions), is positioned between the two an insert (that is, adjustment part 208) with induction.
In an embodiment, second inductor 316 is proximity sensing devices, is positioned at the below of protuberance 304 parts 318.This proximity sensing device or second inductor 316, can detect the part 318 1 preset distance places that are positioned at protuberance 304 or on adjustment part 208.
Inductor 312,316 roughly is coupled to the element that PLC 292 or other are suitable for record data (data that obtained by inductor), for example bar chart paper register (strip chart recorder) or memory module.By detecting adjustment part 208, can effectively carry out the various calibrations of adjusting mechanism 134, as hereinafter with further debater in the position in rinse station 135 different places.
Support 306 is to be coupled to support arm 302 adjustably in any appropriate manner, for example, passes through the mode of elongate slot 310 with screw or bolt (not shown).The adjustment of support 306 can make in the support 306 the support protuberance 308 that forms align with the protuberance 304 of support arm 302, in order to the Area of bearing of adjustment part 208 extensions that an assembly 202 is provided when being positioned at rinse station 135.Uneven strength was applied to the described element of an assembly 202 when the Area of bearing that extends can be avoided adjustment part decline and abut against protuberance 304.
In another embodiment, inductor 390 can be configured to point out the numerical value of adjustment part 208 surface appearances.For example, inductor 390 can be the coarse inductor that detects the adjustment part surface appearance.In another embodiment, but inductor 390 can be the camera of the surface appearance of vision monitoring adjustment part 208.It should be understood that from the image on adjustment part 208 surfaces and can make electronic analysis,, for example lack diamond or abrasive material and fellow to judge the adjustment situation.The also configurable numeric representation to provide adjustment part 208 to cut down (cut rate) of inductor 390 also is provided.
Wetting nozzle 234 is to provide wetting and/or cleaning solution gives adjustment part 208 basal surfaces and/or an assembly 202 through the location.In an embodiment, this wetting nozzle 234 is (for example to close with screw thread Nie) in a suitable manner to be coupled to mounting panel 232.The configuration of nozzle 234 and position and through selecting, with on the adjustment part 208 that when an assembly 202 is arranged in rinse station 135, flow of liquid can be led desired the position.234 at nozzle is coupled to fluid source 236.Be understood that wetting nozzle 234 also can be coupled to the different elements of grinding system 100, for example base 140, as long as it is to be installed in to be suitable for distributing the wetting and/or cleaning solution position to an adjustment part 208 and/or an assembly 202.
Also alternatively, also can form extra nozzle, and be coupled to fluid supply 236 in element 320 or rinse station 135 other positions.For example, in 3A and 3B figure illustrated embodiment, second nozzle 324 be formed in the mounting panel 232 and through the location with around adjustment part 208 and/or the wetting and/or cleaning solution of an assembly 202 sprayings.
In an embodiment, an inductor 250 that is used to calibrate adjuster can be through the location to detect cleaning solution flowing to rinse station 135.For example, in Fig. 3 B illustrated embodiment, inductor 322 (for example flow inductor) can be connected with the catheter interface that provides liquid to nozzle 234, and is configured to provide the mobile numerical value in the rinse station 135, in order to whether adjustment part 208 is offered PLC 292 as carrying out wetting indication as expecting.
In another embodiment again, be used to adjust can the locating of inductor 250 of adjustment part to detect rotatablely moving of adjustment part.For example, in Fig. 2 B illustrated embodiment, inductor 252 (for example rotary inductive device) can be connected with conveyer belt 222 and/or an assembly 202 or other element interfaces, and be configured to provide the numeric representation of adjustment part 208 rotations, offer PLC 292 in order to the indication that adjustment part 208 is rotated in a predefined manner.
In operation, adjusting mechanism 134 can rotate so that an assembly 202 and adjustment part 208 are placed on rinse station 135 tops.Nozzle 322 and 324 can be supplied cleaning solution, to remove adjustment part 208 and/or an assembly 202 lip-deep any chips (for example, slurry, particulate matter and fellow).
Adjustment part 208 more can descend via pressurised chamber 290 with the protuberance 304,308 (as shown in Figure 2) of contact rinse station 135.When adjustment part 208 descended, the corresponding data when PLC 292 can write down adjustment part 208 contact protuberances 304 was as second inductor, 316 measured persons.
Recorded data when passing through first inductor 312 and second inductor 316 by comparing adjustment part 208 just can obtain adjustment part 208 and be moved down in the time of a known distance (that is, between the inductor 312,316).Time can be carried out chart a plurality of cycle periods with time scheduled volume comparison or time and declared and order, and starts moving down of adjustment part 208 with monitoring period trend.
Adjustment part also can utilize one or more parameter to obtain with respect to the mobile calibration of rinse station 135, time between for example adjustment part warm-up movement (that is pressurization of chamber 290), in the chamber pressure of differing heights and/or change speed and fellow.In addition, also can monitor cleannes, infringement and/or the wearing and tearing of adjuster basal surface.Moreover, the operation aspect of adjuster (for example downforce, the speed of rotation, reduction rate and cleannes etc.) all can with the processing procedure window relatively, to allow adjuster can remake cleaning or, unusual to avoid processing procedure adjusting the surface treatment of lapped face previous crops.
For example, Fig. 4 A describes to be used to monitor the method 400 of adjusting mechanism, and this method is to describe with Fig. 2 and Fig. 3 A-B apparatus shown.Method 400 originates in step 402, and adjustment part 208 is that mode with pressurised chamber 290 is to dropping to rinse station 135 in this step.This method continues in step 404 place, notes and falls the required time of adjustment part 208 to the preset distance of protuberance 304.The time of being write down may be for carrying out the time between chamber pressurization and the triggering inductor.
In an embodiment, step 404 comprises time step 406, when first inductor 312 is sensed adjustment part 208 (for example, when the reflector of adjustment part 208 blocking-up first inductor 312 and receiver between light beam 314) allow timer pick up counting.In inferior step 408 place, timer can stop timing when second inductor 316 detects adjustment part 208 on the protuberance 304.Perhaps, can the record start time in step 406 place and in the step 408 place end of record time, deduct just can the descend required time of adjustment part 208 of zero-time with the termination time.
In other embodiment, inductor 312,316 can detect the interval location of adjustment part 208.For example, the configurable required time that rises an assembly 202 with record of inductor 312,316 or this method.What also can carry out in addition is that inductor 252 can be in order to detect the rotation of adjustment part 208.Rise, descend or the required time of rotation adjustment part 208 by record, can monitor the situation of dividing plate, spring or other elements of an assembly 202 of adjusting mechanism 134.
In another example, Fig. 4 B is a method 410 of describing to be used to monitor adjusting mechanism, and it is with reference to the equipment shown in Fig. 2 and Fig. 3 A-B.This method 410 originates in step 412, that is, for example, when storing the required time of decline adjustment part 208 in the database.Secondly, in step 414 place, analyze the required time of decline adjustment part 208.The required time of decline adjustment part 208 can many different modes analyses.For example, in inferior step 416 place, the required time of an assembly that descends can a plurality of circulations carry out the figure list deciding, changes with decision or 208 required times of monitoring decline adjustment part.Perhaps also combinatively be that inferior step 418 can compare with the required time that adjustment part 208 drops to a predetermined critical.
Then, in step 420 place, according to the analysis decision action process of step 414.For example, in step 422 place, can make decision with the dividing plate 240 of reparation or replacement head assembly 202.Perhaps, assay value can point out that also dividing plate 240 still is in receptive phase and can continues use, as follows shown in the step 424.The decision that step 420 place is done also can be carried out by different way.
For example, in the embodiment that decline adjustment part 208 required times are judged with a plurality of cyclograms (as in inferior step 416), can make decision according to the slope variation of diagram curve, curve can point out that dividing plate 240 situations have the tendency of quick deterioration.Perhaps, before inferior step 418 is carried out, the predetermined critical value and the required time of decline adjustment part 208 can be made comparisons, when surpassing critical value, point out that the deterioration of dividing plate 240 reaches the replacing point that needs replacement with required time at decline adjustment part 208.
The step 412 and time step 416 that should will be understood that method 410 also can be ignored.For example, method 410 can only comprise makes comparisons the required time and the predetermined critical of decline adjustment part 208 (as step 418), and need not with reference to previous numerical value, therefore, also need not to store the required time of decline adjustment part 208 or to the list deciding of mapping several circulation timeis.
Fig. 4 C is the flow chart of the method 440 of another monitoring adjusting mechanism.This method 440 originates in step 412, promptly detects the numeric representation of adjusting mechanism 134 calibrations.Numerical value can provide and give controller 160 and/or PLC 292, and it is responsible for monitoring the usefulness of adjuster function and/or one or more inductor, as mentioned before.In step 444 place, analyze the numerical value and/or the information that obtain by inductor.Assay value can comprise judging whether calibration drops in the processing procedure form, judge whether need to safeguard, the rate of wear of decision element, according to rate of wear judge gained maintenance, judge whether adjustment part 208 need change, judge whether power delivery portion (for example conveyer belt, bearing etc.) needs repairing, judges whether adjustment part 208 should do cleaning again, whether the cleaning of judging adjustment part according to predetermined operation and judge and adjust to operate whether need retardation or change.Should will be understood that many other usefulness/adjuster state index also should be monitored.In step 446 place,, just need to revise at step 448 place if assay value points out that second value exceeds requirement or drops on processing procedure outside window.The example of corrective action comprises that sign need be safeguarded and/or change element, adjusts downforce, adjusts rotating speed, the fine setting liner adjust flow process with the reduction rate of dealing with adjuster, mediation liquid line, again clean adjustment part, prediction further maintenance demand and indicate possible adjustment and reach the fellow unusually.If point out that in the assay value at step 446 place usefulness drops in the requirement, method will be back to step 442 and sentence lasting monitoring adjusting mechanism 134.
Fig. 5 illustrates the chart of inductor select time, and expression can be monitored, the extra parameter of record or pictorialization, and the further possibility of the key element of calibration adjusting mechanism 134.Fig. 5 also illustrates the numerical digit state, promptly first inductor (line 506), second inductor (line 508) and pressure instruction (line 510) through after a while " unlatchings " or " closing " state (along spools 502) of (along axle 504).
Pressure instruction is pressurization or emptying dividing plate 240 pressure to rise or the instruction of decline adjustment part 208.Chart can originate in adjustment part 208 declines arbitrarily and storing abuts against protuberance 304 parts.In times 520 place, the pressure instruction state transfers unlatching to by closing, and depends on the instruction of rising adjustment part 208.In times 522 place, the state of second inductor 316 is transferred to by unlatching closes, and expression adjustment part 208 has begun to rise and no longer be positioned on the protuberance 304.In times 524 place, the state of first inductor 312 transfers unlatching to by closing, and expression adjustment part 208 is to pass through first inductor 312.
Time span between the change state of the change state of pressure instruction and second inductor 316 is denoted as T1.T1 represents to carry out 208 instructions of rise adjustment part and adjustment part 208 is lifted time quantum spent during protuberance 304.Time span between the change state of the change state of pressure instruction and first inductor 312 then is denoted as T2.T2 represents to carry out rise adjustment part 208 and adjustment part 208 arrives near spent time quantum during the place, top position of first inductor 312.Time difference between T2 and T1 just can point out adjustment part 208 be displaced into protuberance 304 lower position and near the actual required time between the top position of first inductor 312.
In times 526 place, the state of pressure instruction is to be transferred to by unlatching closing, and depends on 208 instructions of decline adjustment part.In times 528 place, the state of first inductor 312 is to be transferred to by unlatching closing, expression adjustment part 208 first inductor 312 of not reacceesing that descended.In times 530 place, the state of second inductor 316 transfers unlatching to by closing, and expression adjustment part 208 has contacted protuberance 304.
Time span between the change state of the change state of pressure instruction and first inductor 312 is denoted as T3.T3 is meant that decline adjustment part 208 and adjustment part 208 are certainly near spent time quantum between the position decrement phase of first inductor 312.The change state of the change state of pressure instruction and second inductor 316 is denoted as T4.T4 represent to descend 208 grades of adjustment parts 208 of adjustment part arrive on the protuberance 304 during spent time quantum.Time difference between T4 and T3 represents that adjustment part 208 is displaced near time quantum actual required between the top position of first inductor 312 and the lower position on the protuberance 304.
Whether the figure list deciding of a period of time all can be monitored and/or do to any one of these time spans or combination, described as preamble Fig. 4 A and Fig. 4 B, need repairing or change to judge dividing plate 240.Perhaps, also can monitor other motions (for example rotation of an assembly 202), with the state of key element that calibration is desired.
Therefore, preamble has disclosed the method and apparatus of monitoring one adjusting mechanism.In an embodiment, and provide intelligent rinse station with cleaning adjusting mechanism when not using, and the key element of calibration adjusting mechanism, for example dividing plate, spring and fellow.Adjusting mechanism adjustable a period of time makes comparisons with detection trend or with predetermined critical, with the degradation that detects adjusting mechanism usefulness and avoid improper adjustment.Though aforementioned device and method are to describe with reference to adjusting mechanism, be understood that so aforementioned teaching also can do to change with the key element in monitoring or the calibration other system.
Though preamble is about embodiments of the invention, so other and further embodiment also can be in not changing down departing from the invention essence spirit, and its scope should be defined by claim hereinafter.

Claims (29)

1. semiconductor substrate grinding system comprises:
Lapped face;
Adjustment part;
Adjusting mechanism is used for selectivity this adjustment part is positioned this lapped face top; And
At least one inductor, to respond to the parameter of this adjusting mechanism, wherein this parameter can be pointed out the usefulness of this adjustment part through the location for it, wherein at least one inductor is arranged in the rinse station.
2. the system as claimed in claim 1, wherein this at least one inductor is the primary importance when being configured to detect this adjustment part and being arranged at this rinse station top and the second place of vertical shift.
3. the system as claimed in claim 1 is characterized in that,
This rinse station is from this lapped face horizontally set, and this adjusting mechanism more is configured to selectivity adjustment part is positioned near contiguous this rinse station.
4. system as claimed in claim 3, wherein this rinse station more comprises:
Wetting nozzle, it is configured to liquid spray on this adjustment part.
5. the system as claimed in claim 1, wherein this at least one inductor more comprises:
First inductor, it is configured to detect the primary importance of this adjustment part; And
Second inductor, it is configured to detect the second place from this primary importance vertical shift of this adjustment part.
6. the system as claimed in claim 1, wherein this at least one inductor is the rotation that is configured to detect this adjustment part.
7. the system as claimed in claim 1, wherein this at least one inductor is the downforce that is configured to detect this adjustment part.
8. the system as claimed in claim 1, wherein this at least one inductor is the numeric representation that is configured to provide the adjustment surface of this adjustment part.
9. system as claimed in claim 8, wherein the numeric representation on this adjustment surface is at least one of reduction rate, cleannes, adjustment part abrasion or infringement degree.
10. system as claimed in claim 4, wherein this at least one inductor is to be configured to provide the numeric representation of liquid of this wetting nozzle of flowing through.
11. the system as claimed in claim 1, it more comprises:
Controller is coupled to this at least one inductor, and it also comprises the instruction that several are used to calibrate this adjustment part state.
12. the semiconductor substrate grinding system with lapped face comprises:
Adjusting mechanism, be located at above this lapped face the adjustment position and near the non-adjustment position of this lapped face one side between move, this adjusting mechanism has an adjustment part, in order to adjust this lapped face; And
Rinse station from this lapped face horizontally set, and is positioned at below the non-adjustment position of this adjustment part, and this rinse station comprises;
Body;
First inductor is arranged in this rinse station, is coupled to this body, and it also is configured to detect the primary importance of this adjustment part; And
Second inductor is coupled to this body, and it also is configured to detect the second place from this primary importance vertical shift of this adjustment part.
13. system as claimed in claim 12, it more comprises:
Nozzle is located in this rinse station, and arranges in order to liquid is directed at the basal surface of this adjustment part.
14. system as claimed in claim 13, it more comprises:
The 3rd inductor is configured to provide the numeric representation of liquid of this nozzle of flowing through.
15. system as claimed in claim 13, it more comprises:
The 3rd inductor is configured to provide the numeric representation of this adjustment part downforce.
16. system as claimed in claim 13, it more comprises:
The 3rd inductor is configured to provide the numeric representation of this adjustment part rotation.
17. a rinse station that is used for an adjusting mechanism comprises:
Body is configured to combine with the adjustment part of this adjusting mechanism;
Wetting nozzle is arranged in this body, and is configured to when this adjustment part combines with rinse station liquid spray on this adjustment part; And
At least one inductor is coupled to this body, and is configured to detect the effectiveness parameters of this adjustment part.
18. rinse station as claimed in claim 17, wherein this at least one inductor more comprises strength inductor, flow detection inductor, reduction rate inductor, rotary inductive device or is suitable for providing in the inductor of this adjustment part image at least one.
19. rinse station as claimed in claim 17, wherein this at least one inductor more comprises:
First inductor is configured to detect the primary importance of this adjustment part; And
Second inductor is configured to detect the second place from this primary importance vertical shift of this adjustment part.
20. the semiconductor grinding system with lapped face comprises:
Adjusting mechanism moves in the adjustment position above this lapped face and between near the non-adjustment position of this lapped face one side, and this adjusting mechanism has the adjustment part that is used to adjust this lapped face;
Rinse station from this lapped face horizontally set, and is positioned at below the non-adjustment position of this abrasive article, and this rinse station comprises at least:
Body;
Wetting arm has a nozzle, in order to liquid spray on this adjustment part;
First inductor is coupled to this body, and is configured to detect the primary importance of this adjustment part; And
Second inductor is coupled to this body, and is configured to detect the second place of this adjustment part; And
Controller is coupled to this first inductor and second inductor, and this controller has several in order to calibrate the instruction that this adjustment part moves.
21. a method that is used to calibrate the element of adjusting mechanism comprises:
Start the adjustment part of this adjusting mechanism, to reach in primary importance from moving between the second place of this primary importance vertical shift; And
Use is arranged in the rinse station inductor analysis this adjustment part is moved required start-up time between this primary importance and the second place.
22. method as claimed in claim 21, wherein this analytical procedure more comprises:
Should start-up time and the scheduled time make comparisons.
23. method as claimed in claim 21, wherein this analytical procedure more comprises:
Judge whether need safeguard this adjusting mechanism by trend or deviation that the historical data base of start-up time is obtained.
24. a method that is used to calibrate the element of adjusting mechanism comprises:
The adjusting mechanism that will be positioned at non-adjustment position is connected with one or more inductor interface, and wherein this one or more inductor is arranged in the rinse station that is provided with near this adjusting mechanism;
Obtain the numeric representation of this adjusting mechanism usefulness by this one or more inductor; And
Judge whether this usefulness numerical value drops in the processing procedure window.
25. method as claimed in claim 24, wherein obtaining more of the numeric representation of this adjusting mechanism usefulness comprises:
Detect the rotation of this adjusting mechanism.
26. method as claimed in claim 24, wherein obtaining more of the numeric representation of this adjusting mechanism usefulness comprises:
Detection enters the flowing of cleaning solution of this adjusting mechanism.
27. method as claimed in claim 24, wherein obtaining more of the numeric representation of this adjusting mechanism usefulness comprises:
Detect the downforce of this adjusting mechanism.
28. method as claimed in claim 24, wherein obtaining more of the numeric representation of this adjusting mechanism usefulness comprises:
Detect the reduction rate of this adjusting mechanism.
29. method as claimed in claim 24, wherein obtaining more of the numeric representation of this adjusting mechanism usefulness comprises:
Assess the adjustment surface of the adjustment part of this adjusting mechanism.
CN200680009439A 2005-05-26 2006-01-10 Smart conditioner rinse station Expired - Fee Related CN100576432C (en)

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Publication number Priority date Publication date Assignee Title
CN101797717B (en) * 2009-02-10 2011-12-07 和舰科技(苏州)有限公司 Device and method for detecting upper/lower positions of sink of chemical machinery grinding machine
CN103286693A (en) * 2013-05-31 2013-09-11 上海集成电路研发中心有限公司 Grinding fluid distribution arm
SG11202008881QA (en) * 2018-03-13 2020-10-29 Applied Materials Inc Consumable part monitoring in chemical mechanical polisher

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6244935B1 (en) * 1999-02-04 2001-06-12 Applied Materials, Inc. Apparatus and methods for chemical mechanical polishing with an advanceable polishing sheet
US6319105B1 (en) * 1998-06-09 2001-11-20 Ebara Corporation Polishing apparatus
EP1270148A1 (en) * 2001-06-22 2003-01-02 Infineon Technologies SC300 GmbH & Co. KG Arrangement and method for conditioning a polishing pad
US20030013394A1 (en) * 2001-06-29 2003-01-16 Choi Jae Hoon Polishing pad conditioner for semiconductor polishing apparatus and method of monitoring the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6319105B1 (en) * 1998-06-09 2001-11-20 Ebara Corporation Polishing apparatus
US6244935B1 (en) * 1999-02-04 2001-06-12 Applied Materials, Inc. Apparatus and methods for chemical mechanical polishing with an advanceable polishing sheet
EP1270148A1 (en) * 2001-06-22 2003-01-02 Infineon Technologies SC300 GmbH & Co. KG Arrangement and method for conditioning a polishing pad
US20030013394A1 (en) * 2001-06-29 2003-01-16 Choi Jae Hoon Polishing pad conditioner for semiconductor polishing apparatus and method of monitoring the same

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