CN101006748A - 硅电容器麦克风及制造方法 - Google Patents
硅电容器麦克风及制造方法 Download PDFInfo
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- CN101006748A CN101006748A CNA2005800283211A CN200580028321A CN101006748A CN 101006748 A CN101006748 A CN 101006748A CN A2005800283211 A CNA2005800283211 A CN A2005800283211A CN 200580028321 A CN200580028321 A CN 200580028321A CN 101006748 A CN101006748 A CN 101006748A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title abstract description 24
- 229910052710 silicon Inorganic materials 0.000 title abstract description 24
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- BZTYNSQSZHARAZ-UHFFFAOYSA-N 2,4-dichloro-1-(4-chlorophenyl)benzene Chemical compound C1=CC(Cl)=CC=C1C1=CC=C(Cl)C=C1Cl BZTYNSQSZHARAZ-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
材料 | 类型 | 组件 | 注释 |
1 | 0.5/0.5盎司DSTCu 5芯FR-4 | 底部(导电层非导电层1) | |
2 | 0.5/0.5盎司DSTCu 5芯FR-4 | 底部(导电层3和4;非导电层2) | |
3 | 106预浸料坯 | 用于层压材料1和材料2 | |
4 | 0.5/0.5盎司DSTCu 40芯FR-4 | 侧部 | 之后进行金属化 |
5 | 裸/0.5盎司Cu 2芯FR-4(2个) | 顶部(每个包括1导电层和1非导电层) | |
6 | 膨胀的PTFE | 环境屏障 |
步骤 | 类型 | 描述 | 注释 |
1 | 干燥膜导电层 | ||
2 | 曝光 | 掩模材料1(上导电层) | 在下导电层上形成接地面 |
3 | 显影 | ||
4 | 蚀刻Cu | 不对上导电层进行蚀刻 | |
5 | 剥掉干膜 |
步骤 | 类型 | 描述 | 注释 |
1 | 干燥膜导电层 | ||
2 | 曝光 | 掩模材料2(上导电层) | 在上导电层上形成接地面 |
3 | 显影 | ||
4 | 蚀刻Cu | 不对下导电层进行蚀刻 | |
5 | 剥掉干膜 |
步骤 | 类型 | 描述 | 注释 |
1 | 层压 | 使用材料3来层压材料1和2 | |
2 | 钻出通孔 | 钻头=0.025英寸 | |
3 | 直接金属化/喷溅铜 | 对通孔电镀 | |
4 | 加干膜(L1和L4) | ||
曝光 | 材料1和2层压的掩模(上导电层和下导电层) | 形成迹线和焊盘 | |
6 | 显影 | ||
7 | 电解Cu | 1.0mil | |
8 | 电解Sn | 按需 | |
9 | 剥掉干膜 | ||
10 | 蚀刻Cu | ||
11 | 蚀刻Cu | ||
12 | 在这里插入修整选项 | NG选项(见下表) | 用于预制(proof ofprinciple)的NG选项 |
13 | 仅干燥上导电层上的膜(覆盖层) | 2.5mil. | 上导电层上的最小厚度 |
14 | 曝光 | 材料1和2层压的掩模(上和下) | 该掩模限定了上导电层上的将容纳干膜焊掩模(覆盖层)的区域。底层没有施加至其的干膜。通过在顶部涂布来桥接电镀通孔。 |
15 | 显影 | ||
16 | 硬化 | 全硬化 | |
17 | 加工面板 | 加工头=按需 | 形成4”×4”的个体。符合完成尺寸。 |
步骤 | 类型 | 描述 | 注释 |
1 | 加工/打孔出开口的矩阵 | 加工头=0.031英寸 | 形成侧部 |
2 | 直接金属化/喷溅Cu | 最小0.25mil. | 形成侧部上的侧壁 |
3 | 加工面板 |
步骤 | 类型 | 描述 | 注释 |
1 | 对膜进行干燥 | 导电层 | |
2 | 曝光 | 掩模裸层 | 形成导电环 |
3 | 显影 | ||
4 | 硬化 | ||
5 | 钻出孔的矩阵 | 钻头0.025英寸 | 声口 |
6 | 层压 | 材料5的2片之间的PTFE(环境屏障) | 形成顶部 |
步骤 | 类型 | 描述 | 注释 |
1 | 将导电粘合剂筛选在材料4上 | ||
2 | 层压 | 具有侧部的底部 | 形成具有侧部(间隔物)的底部 |
3 | 添加换能器组件 | 硅模麦克风和集成电路 |
步骤 | 类型 | 描述 | 注释 |
1 | 将导电粘合剂筛选在顶部上 | ||
2 | 层压 | 底部和具有顶部的侧部 | 形成外罩 |
3 | 切成块 |
步骤 | 类型 | 描述 | 注释 |
1 | 浸入Ni(40-50微英寸) | ||
2 | 浸入Au(25-30微英寸) |
步骤 | 类型 |
1 | 对L2加掩模(使用厚干膜或高粘性切割带) |
2 | 浸入Ni(40-50微英寸) |
3 | 浸入Au(25-30微英寸) |
4 | 去除L2上的掩模 |
5 | 对L1加掩模(使用厚干膜或高粘性切割带)桥接由壁创建的腔 |
6 | 浸入Sn(100-250微英寸) |
7 | 去除L1上的掩模 |
步骤 | 类型 |
1 | 对L2加掩模(使用厚干膜或高粘性切割带) |
2 | 浸入Ag(40-50微英寸) |
3 | 去除L2上的掩模 |
4 | 对L1加掩模(使用厚干膜或高粘性切割带)桥接由壁创建的腔 |
5 | 浸入Sn(100-250微英寸) |
6 | 去除L1上的掩模 |
Claims (29)
Applications Claiming Priority (3)
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US10/921,747 US7434305B2 (en) | 2000-11-28 | 2004-08-19 | Method of manufacturing a microphone |
US10/921,747 | 2004-08-19 | ||
PCT/US2005/021276 WO2006023016A1 (en) | 2004-08-19 | 2005-06-15 | Silicon condenser microphone and manufacturing method |
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CN101006748A true CN101006748A (zh) | 2007-07-25 |
CN101006748B CN101006748B (zh) | 2012-04-04 |
Family
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CN2005800283211A Ceased CN101006748B (zh) | 2004-08-19 | 2005-06-15 | 制造多个单独的麦克风封装的方法 |
Country Status (6)
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US (30) | US7434305B2 (zh) |
EP (2) | EP1787491A1 (zh) |
JP (1) | JP2008510427A (zh) |
KR (1) | KR101141176B1 (zh) |
CN (1) | CN101006748B (zh) |
WO (1) | WO2006023016A1 (zh) |
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Families Citing this family (219)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7166910B2 (en) | 2000-11-28 | 2007-01-23 | Knowles Electronics Llc | Miniature silicon condenser microphone |
US8623710B1 (en) | 2000-11-28 | 2014-01-07 | Knowles Electronics, Llc | Methods of manufacture of bottom port multi-part surface mount silicon condenser microphone packages |
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US7795695B2 (en) | 2005-01-27 | 2010-09-14 | Analog Devices, Inc. | Integrated microphone |
DE102005008514B4 (de) * | 2005-02-24 | 2019-05-16 | Tdk Corporation | Mikrofonmembran und Mikrofon mit der Mikrofonmembran |
DE102005008512B4 (de) * | 2005-02-24 | 2016-06-23 | Epcos Ag | Elektrisches Modul mit einem MEMS-Mikrofon |
DE102005008511B4 (de) * | 2005-02-24 | 2019-09-12 | Tdk Corporation | MEMS-Mikrofon |
US20060233412A1 (en) * | 2005-04-14 | 2006-10-19 | Siemens Audiologische Technik Gmbh | Microphone apparatus for a hearing aid |
US7885423B2 (en) | 2005-04-25 | 2011-02-08 | Analog Devices, Inc. | Support apparatus for microphone diaphragm |
US7825484B2 (en) * | 2005-04-25 | 2010-11-02 | Analog Devices, Inc. | Micromachined microphone and multisensor and method for producing same |
US7449356B2 (en) * | 2005-04-25 | 2008-11-11 | Analog Devices, Inc. | Process of forming a microphone using support member |
US7202552B2 (en) | 2005-07-15 | 2007-04-10 | Silicon Matrix Pte. Ltd. | MEMS package using flexible substrates, and method thereof |
CN101238060A (zh) * | 2005-08-11 | 2008-08-06 | 皇家飞利浦电子股份有限公司 | 制造包括硅mems传声器的微电子封装的方法 |
US20070040231A1 (en) * | 2005-08-16 | 2007-02-22 | Harney Kieran P | Partially etched leadframe packages having different top and bottom topologies |
US7961897B2 (en) * | 2005-08-23 | 2011-06-14 | Analog Devices, Inc. | Microphone with irregular diaphragm |
US8477983B2 (en) * | 2005-08-23 | 2013-07-02 | Analog Devices, Inc. | Multi-microphone system |
JP4708134B2 (ja) * | 2005-09-14 | 2011-06-22 | 日東電工株式会社 | 通音膜、通音膜付き電子部品及びその電子部品を実装した回路基板の製造方法 |
DE102005050398A1 (de) * | 2005-10-20 | 2007-04-26 | Epcos Ag | Gehäuse mit Hohlraum für ein mechanisch empfindliches elektronisches Bauelement und Verfahren zur Herstellung |
DE102005053765B4 (de) * | 2005-11-10 | 2016-04-14 | Epcos Ag | MEMS-Package und Verfahren zur Herstellung |
DE102005053767B4 (de) * | 2005-11-10 | 2014-10-30 | Epcos Ag | MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau |
ATE471635T1 (de) * | 2006-03-30 | 2010-07-15 | Sonion Mems As | Akustischer einchip-mems-wandler und herstellungsverfahren |
JP4742972B2 (ja) * | 2006-04-27 | 2011-08-10 | オムロン株式会社 | マイクロフォンの製造方法 |
KR100722689B1 (ko) * | 2006-05-03 | 2007-05-30 | 주식회사 비에스이 | 부가적인 백 챔버를 갖는 실리콘 콘덴서 마이크로폰 |
KR100722686B1 (ko) * | 2006-05-09 | 2007-05-30 | 주식회사 비에스이 | 부가적인 백 챔버를 갖고 기판에 음향홀이 형성된 실리콘콘덴서 마이크로폰 |
KR100722687B1 (ko) * | 2006-05-09 | 2007-05-30 | 주식회사 비에스이 | 부가적인 백 챔버를 갖는 지향성 실리콘 콘덴서 마이크로폰 |
US7763488B2 (en) | 2006-06-05 | 2010-07-27 | Akustica, Inc. | Method of fabricating MEMS device |
US8344487B2 (en) * | 2006-06-29 | 2013-01-01 | Analog Devices, Inc. | Stress mitigation in packaged microchips |
KR100737726B1 (ko) | 2006-07-10 | 2007-07-10 | 주식회사 비에스이 | 멤스 마이크로폰 패키징 구조체 |
JP4951067B2 (ja) * | 2006-07-25 | 2012-06-13 | アナログ デバイシス, インコーポレイテッド | 複数のマイクロホンシステム |
TWI301823B (en) * | 2006-08-29 | 2008-10-11 | Ind Tech Res Inst | Package structure and packaging method of mems microphone |
KR100740463B1 (ko) * | 2006-09-09 | 2007-07-18 | 주식회사 비에스이 | 실리콘 콘덴서 마이크로폰 |
DE102006046292B9 (de) * | 2006-09-29 | 2014-04-30 | Epcos Ag | Bauelement mit MEMS-Mikrofon und Verfahren zur Herstellung |
TW200847827A (en) * | 2006-11-30 | 2008-12-01 | Analog Devices Inc | Microphone system with silicon microphone secured to package lid |
EP2123112A1 (en) * | 2006-12-15 | 2009-11-25 | The Regents of the University of California | Acoustic substrate |
JP2008160352A (ja) * | 2006-12-22 | 2008-07-10 | Yamaha Corp | 静電容量センサ |
ITMI20070099A1 (it) | 2007-01-24 | 2008-07-25 | St Microelectronics Srl | Dispositivo elettronico comprendente dispositivi sensori differenziali mems e substrati bucati |
KR100870991B1 (ko) | 2007-01-30 | 2008-12-01 | 주식회사 비에스이 | 세라믹 패키지를 이용한 콘덴서 마이크로폰 |
TW200904222A (en) * | 2007-02-26 | 2009-01-16 | Yamaha Corp | Sensitive silicon microphone with wide dynamic range |
JP2008278476A (ja) * | 2007-04-05 | 2008-11-13 | Yamaha Corp | コンデンサマイク装置のsn比改善方法およびコンデンサマイク装置並びにコンデンサマイク装置搭載機器 |
WO2008134530A2 (en) | 2007-04-25 | 2008-11-06 | University Of Florida Research Foundation, Inc. | A capacitive microphone with integrated cavity |
TWI370101B (en) * | 2007-05-15 | 2012-08-11 | Ind Tech Res Inst | Package and packaging assembly of microelectromechanical sysyem microphone |
TWI323242B (en) * | 2007-05-15 | 2010-04-11 | Ind Tech Res Inst | Package and packageing assembly of microelectromechanical system microphone |
US7694610B2 (en) * | 2007-06-27 | 2010-04-13 | Siemens Medical Solutions Usa, Inc. | Photo-multiplier tube removal tool |
JP5160984B2 (ja) * | 2007-07-18 | 2013-03-13 | 日東電工株式会社 | 防水通音膜、防水通音膜の製造方法およびそれを用いた電気製品 |
JP2009044600A (ja) * | 2007-08-10 | 2009-02-26 | Panasonic Corp | マイクロホン装置およびその製造方法 |
US20090175477A1 (en) * | 2007-08-20 | 2009-07-09 | Yamaha Corporation | Vibration transducer |
JP2009055198A (ja) * | 2007-08-24 | 2009-03-12 | Rohm Co Ltd | マイクロホン装置 |
JP2009055490A (ja) * | 2007-08-29 | 2009-03-12 | Rohm Co Ltd | マイクロホン装置 |
KR101008399B1 (ko) * | 2007-09-03 | 2011-01-14 | 주식회사 비에스이 | 내벽을 금속성 혹은 전도성 물질로 감싼 세라믹 패키지를이용한 콘덴서 마이크로폰 |
EP2043149A1 (en) * | 2007-09-27 | 2009-04-01 | Oticon A/S | Assembly comprising an electromagnetically screened smd component, method of manufacturing the same and use |
EP2252075A4 (en) * | 2008-02-08 | 2014-10-29 | Funai Electric Co | MICROPHONE UNIT |
EP2304968A2 (en) * | 2008-05-23 | 2011-04-06 | Analog Devices, Inc. | Wide dynamic range microphone |
DE112009002542A5 (de) | 2008-10-14 | 2011-09-08 | Knowles Electronics, Llc | Mikrofon mit einer Mehrzahl von Wandlerelementen |
US8325951B2 (en) * | 2009-01-20 | 2012-12-04 | General Mems Corporation | Miniature MEMS condenser microphone packages and fabrication method thereof |
US8472648B2 (en) * | 2009-01-20 | 2013-06-25 | General Mems Corporation | Miniature MEMS condenser microphone package and fabrication method thereof |
JP4637965B2 (ja) * | 2009-01-21 | 2011-02-23 | 日東電工株式会社 | 防水通音膜とその製造方法ならびにそれを用いた電気製品 |
JP2010183312A (ja) * | 2009-02-05 | 2010-08-19 | Funai Electric Co Ltd | マイクロホンユニット |
US8030722B1 (en) * | 2009-03-04 | 2011-10-04 | Amkor Technology, Inc. | Reversible top/bottom MEMS package |
US8115283B1 (en) | 2009-07-14 | 2012-02-14 | Amkor Technology, Inc. | Reversible top/bottom MEMS package |
JP4935846B2 (ja) * | 2009-03-31 | 2012-05-23 | ブラザー工業株式会社 | 画像処理装置 |
DE102009002559A1 (de) * | 2009-04-22 | 2010-10-28 | Robert Bosch Gmbh | Sensoranordnung |
US8158492B2 (en) | 2009-04-29 | 2012-04-17 | Freescale Semiconductor, Inc. | MEMS microphone with cavity and method therefor |
US8330239B2 (en) * | 2009-04-29 | 2012-12-11 | Freescale Semiconductor, Inc. | Shielding for a micro electro-mechanical device and method therefor |
US8155366B2 (en) * | 2009-05-15 | 2012-04-10 | Mwm Acoustics, Llc | Transducer package with interior support frame |
CN201438743U (zh) * | 2009-05-15 | 2010-04-14 | 瑞声声学科技(常州)有限公司 | 麦克风 |
US8571249B2 (en) * | 2009-05-29 | 2013-10-29 | General Mems Corporation | Silicon microphone package |
US7825509B1 (en) | 2009-06-13 | 2010-11-02 | Mwm Acoustics, Llc | Transducer package with transducer die unsupported by a substrate |
EP2271134A1 (en) * | 2009-07-02 | 2011-01-05 | Nxp B.V. | Proximity sensor comprising an acoustic transducer for receiving sound signals in the human audible range and for emitting and receiving ultrasonic signals. |
EP2269746B1 (en) | 2009-07-02 | 2014-05-14 | Nxp B.V. | Collapsed mode capacitive sensor |
CN101959106A (zh) * | 2009-07-16 | 2011-01-26 | 鸿富锦精密工业(深圳)有限公司 | 微机电系统麦克风的封装结构及其封装方法 |
US8987030B2 (en) * | 2009-08-13 | 2015-03-24 | Knowles Electronics, Llc | MEMS package and a method for manufacturing the same |
US9399574B2 (en) | 2009-08-13 | 2016-07-26 | Knowles Electronics Llc | MEMS package and a method for manufacturing the same |
TWI416696B (zh) * | 2009-09-28 | 2013-11-21 | Unimicron Technology Corp | 覆蓋構件及其製法暨具覆蓋構件之封裝結構及其製法 |
WO2011045778A1 (en) * | 2009-10-16 | 2011-04-21 | Kingspan Holdings (Irl) Limited | A composite panel |
KR101096544B1 (ko) * | 2009-11-18 | 2011-12-20 | 주식회사 비에스이 | 멤스 마이크로폰 패키지 및 패키징 방법 |
JP2011114506A (ja) * | 2009-11-26 | 2011-06-09 | Funai Electric Co Ltd | マイクロホンユニット |
US8577063B2 (en) * | 2010-02-18 | 2013-11-05 | Analog Devices, Inc. | Packages and methods for packaging MEMS microphone devices |
JP4947168B2 (ja) | 2010-02-24 | 2012-06-06 | オムロン株式会社 | 音響センサ |
CN102190282A (zh) * | 2010-03-03 | 2011-09-21 | 南茂科技股份有限公司 | 微机电芯片封装结构及其制造方法 |
US8368153B2 (en) * | 2010-04-08 | 2013-02-05 | United Microelectronics Corp. | Wafer level package of MEMS microphone and manufacturing method thereof |
DE102010018499A1 (de) | 2010-04-22 | 2011-10-27 | Schweizer Electronic Ag | Leiterplatte mit Hohlraum |
US8551799B2 (en) | 2010-05-06 | 2013-10-08 | Stmicroelectronics S.R.L. | Encapsulated micro-electro-mechanical device, in particular a MEMS acoustic transducer |
KR101362398B1 (ko) | 2012-07-10 | 2014-02-13 | 앰코 테크놀로지 코리아 주식회사 | 반도체 패키지 및 그 제조 방법 |
US8354747B1 (en) | 2010-06-01 | 2013-01-15 | Amkor Technology, Inc | Conductive polymer lid for a sensor package and method therefor |
US9420378B1 (en) * | 2010-07-12 | 2016-08-16 | Amkor Technology, Inc. | Top port MEMS microphone package and method |
JP2012039272A (ja) * | 2010-08-05 | 2012-02-23 | Funai Electric Co Ltd | マイクロホンユニット |
US8546903B2 (en) * | 2010-10-07 | 2013-10-01 | Texas Instruments Incorporated | Ionic isolation ring |
US9407997B2 (en) * | 2010-10-12 | 2016-08-02 | Invensense, Inc. | Microphone package with embedded ASIC |
US8618619B1 (en) | 2011-01-28 | 2013-12-31 | Amkor Technology, Inc. | Top port with interposer MEMS microphone package and method |
DE102011004577B4 (de) * | 2011-02-23 | 2023-07-27 | Robert Bosch Gmbh | Bauelementträger, Verfahren zur Herstellung eines solchen Bauelementträgers sowie Bauteil mit einem MEMS-Bauelement auf einem solchen Bauelementträger |
US8921955B1 (en) | 2011-02-24 | 2014-12-30 | Amkor Technology, Inc. | Semiconductor device with micro electromechanical system die |
US9013011B1 (en) | 2011-03-11 | 2015-04-21 | Amkor Technology, Inc. | Stacked and staggered die MEMS package and method |
US8447057B2 (en) | 2011-03-18 | 2013-05-21 | Analog Devices, Inc. | Packages and methods for packaging MEMS microphone devices |
US8625832B2 (en) | 2011-04-04 | 2014-01-07 | Invensense, Inc. | Packages and methods for packaging microphone devices |
US8536663B1 (en) | 2011-04-28 | 2013-09-17 | Amkor Technology, Inc. | Metal mesh lid MEMS package and method |
JP5799619B2 (ja) | 2011-06-24 | 2015-10-28 | 船井電機株式会社 | マイクロホンユニット |
US8948420B2 (en) * | 2011-08-02 | 2015-02-03 | Robert Bosch Gmbh | MEMS microphone |
US8724832B2 (en) | 2011-08-30 | 2014-05-13 | Qualcomm Mems Technologies, Inc. | Piezoelectric microphone fabricated on glass |
US8824706B2 (en) | 2011-08-30 | 2014-09-02 | Qualcomm Mems Technologies, Inc. | Piezoelectric microphone fabricated on glass |
WO2013052676A1 (en) | 2011-10-07 | 2013-04-11 | Analog Devices, Inc. | Systems and methods for air release in cavity packages |
US9029962B1 (en) | 2011-10-12 | 2015-05-12 | Amkor Technology, Inc. | Molded cavity substrate MEMS package fabrication method and structure |
KR101764314B1 (ko) * | 2011-10-24 | 2017-08-04 | 한국전자통신연구원 | 음향 센서 및 그 제조 방법 |
ITTO20110980A1 (it) | 2011-10-27 | 2013-04-28 | St Microelectronics Srl | Struttura incapsulante schermata e relativo metodo di fabbricazione |
EP2774390A4 (en) * | 2011-11-04 | 2015-07-22 | Knowles Electronics Llc | EMBEDDED DIELEKTRIKUM AS A BARRIER IN AN ACOUSTIC DEVICE AND METHOD OF MANUFACTURING |
EP2597895B1 (en) * | 2011-11-28 | 2016-04-13 | Sivantos Pte. Ltd. | Hearing instrument and method for manufacturing a hearing in-strument |
TWI504279B (zh) | 2011-12-01 | 2015-10-11 | Ind Tech Res Inst | Mems音波感測器及其製造方法 |
US9362209B1 (en) | 2012-01-23 | 2016-06-07 | Amkor Technology, Inc. | Shielding technique for semiconductor package including metal lid |
US9153543B1 (en) | 2012-01-23 | 2015-10-06 | Amkor Technology, Inc. | Shielding technique for semiconductor package including metal lid and metalized contact area |
CN202587367U (zh) * | 2012-02-21 | 2012-12-05 | 瑞声声学科技(深圳)有限公司 | 微电机系统麦克风 |
TWI448163B (zh) * | 2012-03-05 | 2014-08-01 | Merry Electronics Co Ltd | 駐極體電容麥克風 |
CA2865425C (en) | 2012-03-13 | 2016-11-29 | W.L. Gore & Associates, Inc. | Venting array and manufacturing method |
US8779535B2 (en) | 2012-03-14 | 2014-07-15 | Analog Devices, Inc. | Packaged integrated device die between an external and internal housing |
CN103313160B (zh) * | 2012-03-16 | 2017-11-21 | 美律电子(深圳)有限公司 | 薄形化微机电麦克风模块 |
US9238579B2 (en) | 2012-03-29 | 2016-01-19 | Robert Bosch Gmbh | Cavity package design |
US9061884B1 (en) | 2012-04-24 | 2015-06-23 | Amkor Technology, Inc. | Integrated circuit with efficient MEMS architecture |
RU2014127007A (ru) | 2012-04-26 | 2016-06-20 | Аризона Кемикал Компани, Ллс | Регенерирование отработанного асфальта |
DE102012207165A1 (de) * | 2012-04-30 | 2013-10-31 | Robert Bosch Gmbh | Mikro-elektromechanisches Bauelement, Chippackage mit mikro-elektromechanischem Bauelement und Verfahren zum Herstellen eines Chippackages mit einem mikro-elektromechanischen Bauelement |
US9402118B2 (en) | 2012-07-27 | 2016-07-26 | Knowles Electronics, Llc | Housing and method to control solder creep on housing |
US20140037120A1 (en) * | 2012-08-01 | 2014-02-06 | Knowles Electronics, Llc | Microphone Assembly |
US9491539B2 (en) | 2012-08-01 | 2016-11-08 | Knowles Electronics, Llc | MEMS apparatus disposed on assembly lid |
US8872288B2 (en) | 2012-08-09 | 2014-10-28 | Infineon Technologies Ag | Apparatus comprising and a method for manufacturing an embedded MEMS device |
US9181086B1 (en) | 2012-10-01 | 2015-11-10 | The Research Foundation For The State University Of New York | Hinged MEMS diaphragm and method of manufacture therof |
US9156680B2 (en) | 2012-10-26 | 2015-10-13 | Analog Devices, Inc. | Packages and methods for packaging |
US9079760B2 (en) * | 2012-12-17 | 2015-07-14 | Invensense, Inc. | Integrated microphone package |
US9343455B2 (en) | 2012-12-19 | 2016-05-17 | Knowles Electronics, Llc | Apparatus and method for high voltage I/O electro-static discharge protection |
US9676614B2 (en) | 2013-02-01 | 2017-06-13 | Analog Devices, Inc. | MEMS device with stress relief structures |
US8965027B2 (en) * | 2013-02-15 | 2015-02-24 | Invensense, Inc. | Packaged microphone with frame having die mounting concavity |
US8999757B2 (en) | 2013-03-04 | 2015-04-07 | Unisem (M) Berhad | Top port MEMS cavity package and method of manufacture thereof |
US9082883B2 (en) | 2013-03-04 | 2015-07-14 | Unisem (M) Berhad | Top port MEMS cavity package and method of manufacture thereof |
US9809448B2 (en) | 2013-03-13 | 2017-11-07 | Invensense, Inc. | Systems and apparatus having MEMS acoustic sensors and other MEMS sensors and methods of fabrication of the same |
US9467785B2 (en) | 2013-03-28 | 2016-10-11 | Knowles Electronics, Llc | MEMS apparatus with increased back volume |
US9301075B2 (en) * | 2013-04-24 | 2016-03-29 | Knowles Electronics, Llc | MEMS microphone with out-gassing openings and method of manufacturing the same |
DE102013106353B4 (de) * | 2013-06-18 | 2018-06-28 | Tdk Corporation | Verfahren zum Aufbringen einer strukturierten Beschichtung auf ein Bauelement |
US20140367810A1 (en) * | 2013-06-18 | 2014-12-18 | Knowles Electronics, Llc | Open Cavity Substrate in a MEMS Microphone Assembly and Method of Manufacturing the Same |
US9296607B2 (en) | 2013-07-22 | 2016-03-29 | Invensense, Inc. | Apparatus and method for reduced strain on MEMS devices |
US9299671B2 (en) | 2013-10-15 | 2016-03-29 | Invensense, Inc. | Integrated CMOS back cavity acoustic transducer and the method of producing the same |
US9264832B2 (en) * | 2013-10-30 | 2016-02-16 | Solid State System Co., Ltd. | Microelectromechanical system (MEMS) microphone with protection film and MEMS microphonechips at wafer level |
KR20150058780A (ko) | 2013-11-21 | 2015-05-29 | 삼성전기주식회사 | 마이크로폰 패키지 및 그 실장 구조 |
CN104768112A (zh) * | 2014-01-03 | 2015-07-08 | 钰太芯微电子科技(上海)有限公司 | 一种新型麦克风结构 |
US9307328B2 (en) | 2014-01-09 | 2016-04-05 | Knowles Electronics, Llc | Interposer for MEMS-on-lid microphone |
US20150217991A1 (en) * | 2014-01-31 | 2015-08-06 | Invensense, Inc. | Mems device with split pad package |
TWI552614B (zh) * | 2014-04-23 | 2016-10-01 | Taiwan Carol Electronics Co Ltd | Multi-tone microphone |
CN104113795B (zh) * | 2014-05-13 | 2018-01-02 | 冠研(上海)专利技术有限公司 | 配置有麦克风或麦克风阵列的免持听筒无线装置 |
US10138115B2 (en) * | 2014-08-06 | 2018-11-27 | Infineon Technologies Ag | Low profile transducer module |
WO2016029378A1 (en) * | 2014-08-27 | 2016-03-03 | Goertek. Inc | Mems device with valve mechanism |
US10167189B2 (en) | 2014-09-30 | 2019-01-01 | Analog Devices, Inc. | Stress isolation platform for MEMS devices |
US9554214B2 (en) | 2014-10-02 | 2017-01-24 | Knowles Electronics, Llc | Signal processing platform in an acoustic capture device |
EP3216229A1 (en) | 2014-11-06 | 2017-09-13 | Robert Bosch GmbH | Lead frame-based chip carrier used in the fabrication oe mems transducer packages |
TWI539831B (zh) * | 2014-12-05 | 2016-06-21 | 財團法人工業技術研究院 | 微機電麥克風封裝 |
US20160167948A1 (en) | 2014-12-15 | 2016-06-16 | W. L. Gore & Associates, Inc. | Vent Attachment System For Micro-Electromechanical Systems |
US10429509B2 (en) | 2014-12-24 | 2019-10-01 | Stmicroelectronics Pte Ltd. | Molded proximity sensor |
KR20160087693A (ko) | 2015-01-14 | 2016-07-22 | 삼성전기주식회사 | 마이크로폰 패키지 및 그 제조 방법 |
CN106412781A (zh) * | 2015-02-17 | 2017-02-15 | 美商楼氏电子有限公司 | 使用保护带的麦克风组件 |
US9800971B2 (en) | 2015-03-17 | 2017-10-24 | Knowles Electronics, Llc | Acoustic apparatus with side port |
US9728510B2 (en) | 2015-04-10 | 2017-08-08 | Analog Devices, Inc. | Cavity package with composite substrate |
DE102015107560A1 (de) * | 2015-05-13 | 2016-11-17 | USound GmbH | Schallwandleranordnung mit MEMS-Schallwandler |
US9883270B2 (en) * | 2015-05-14 | 2018-01-30 | Knowles Electronics, Llc | Microphone with coined area |
US10291973B2 (en) | 2015-05-14 | 2019-05-14 | Knowles Electronics, Llc | Sensor device with ingress protection |
US9811121B2 (en) * | 2015-06-23 | 2017-11-07 | Apple Inc. | Liquid-resistant acoustic device gasket and membrane assemblies |
US9794661B2 (en) | 2015-08-07 | 2017-10-17 | Knowles Electronics, Llc | Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package |
KR101657651B1 (ko) * | 2015-08-31 | 2016-09-19 | 주식회사 비에스이센서스 | 확장 백챔버 공간을 갖는 맴스 마이크로폰 패키지 및 그 제조방법 |
US10131538B2 (en) | 2015-09-14 | 2018-11-20 | Analog Devices, Inc. | Mechanically isolated MEMS device |
EP3360340B1 (en) | 2015-10-07 | 2019-12-04 | TDK Corporation | Top port microphone with enlarged back volume |
US9793237B2 (en) | 2015-10-19 | 2017-10-17 | Qorvo Us, Inc. | Hollow-cavity flip-chip package with reinforced interconnects and process for making the same |
US9799637B2 (en) * | 2016-02-12 | 2017-10-24 | Qorvo Us, Inc. | Semiconductor package with lid having lid conductive structure |
US20170240418A1 (en) * | 2016-02-18 | 2017-08-24 | Knowles Electronics, Llc | Low-cost miniature mems vibration sensor |
GB2547729B (en) * | 2016-02-29 | 2020-01-22 | Cirrus Logic Int Semiconductor Ltd | Integrated MEMS transducer and circuitry |
KR101807040B1 (ko) | 2016-05-26 | 2017-12-08 | 현대자동차 주식회사 | 마이크로폰 |
US10322928B2 (en) | 2016-11-29 | 2019-06-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Multi-layer sealing film for high seal yield |
FR3060844B1 (fr) * | 2016-12-15 | 2018-12-14 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Dispositif microelectronique acoustique |
WO2018136079A1 (en) | 2017-01-20 | 2018-07-26 | Hewlett-Packard Development Company, L.P. | Acoustic input devices comprising acoustic ports and transducers |
TWM543239U (zh) * | 2017-01-26 | 2017-06-11 | 日月光半導體製造股份有限公司 | 微機電封裝結構 |
US9932221B1 (en) | 2017-03-02 | 2018-04-03 | Amkor Technology, Inc. | Semiconductor package with multiple compartments |
US10497650B2 (en) | 2017-04-13 | 2019-12-03 | Amkor Technology, Inc. | Semiconductor device and manufacturing method thereof |
GB2561921A (en) * | 2017-04-28 | 2018-10-31 | Cirrus Logic Int Semiconductor Ltd | MEMS Device and process |
WO2018218073A1 (en) | 2017-05-25 | 2018-11-29 | Knowles Electronics, Llc | Microphone package for fully encapsulated asic and wires |
WO2019055437A1 (en) * | 2017-09-12 | 2019-03-21 | Knowles Electronics, Llc | MICROPHONE SET |
DE112018005378T5 (de) * | 2017-09-22 | 2020-06-18 | Robert Bosch Gesellschaft mit beschränkter Haftung | Mems-mikrofonsystem |
GB2567251B (en) * | 2017-10-05 | 2021-10-27 | Cirrus Logic Int Semiconductor Ltd | MEMS devices and processes |
US10373883B2 (en) | 2017-10-26 | 2019-08-06 | Advanced Semiconductor Engineering, Inc. | Semiconductor package device and method of manufacturing the same |
US10730743B2 (en) | 2017-11-06 | 2020-08-04 | Analog Devices Global Unlimited Company | Gas sensor packages |
KR20190060158A (ko) | 2017-11-24 | 2019-06-03 | (주)파트론 | 지향성 마이크로폰 |
CN107948781A (zh) * | 2017-11-27 | 2018-04-20 | 钰太芯微电子科技(上海)有限公司 | 一种新型麦克风结构及翻盖式电子设备 |
JP7200256B2 (ja) | 2018-01-24 | 2023-01-06 | シュアー アクイジッション ホールディングス インコーポレイテッド | 補正回路を有する指向性memsマイクロホン |
DE102018203098B3 (de) * | 2018-03-01 | 2019-06-19 | Infineon Technologies Ag | MEMS-Sensor |
TWM574274U (zh) * | 2018-08-20 | 2019-02-11 | 和碩聯合科技股份有限公司 | 收音電子裝置及其收音結構 |
DE102018216361B3 (de) | 2018-09-25 | 2020-01-23 | Infineon Technologies Ag | Vorrichtung zur unterdrückung von störstrahlung |
US10587942B1 (en) * | 2018-09-28 | 2020-03-10 | Apple Inc. | Liquid-resistant packaging for electro-acoustic transducers and electronic devices |
KR102085201B1 (ko) | 2018-11-15 | 2020-04-20 | (주)파트론 | 마이크로폰 장치 |
KR102085210B1 (ko) | 2018-11-15 | 2020-03-04 | (주)파트론 | 지향성 마이크로폰 장치 |
KR102106170B1 (ko) | 2018-12-14 | 2020-04-29 | (주)파트론 | 마이크로폰 패키지 및 그 제조방법 |
TWI732228B (zh) * | 2019-02-19 | 2021-07-01 | 美律實業股份有限公司 | 麥克風封裝結構 |
JP7292068B2 (ja) * | 2019-03-15 | 2023-06-16 | 新科實業有限公司 | 薄膜フィルタ、薄膜フィルタ基板、薄膜フィルタの製造方法および薄膜フィルタ基板の製造方法並びにmemsマイクロフォンおよびmemsマイクロフォンの製造方法 |
US11889670B2 (en) | 2019-04-12 | 2024-01-30 | Cochlear Limited | Electromagnetic interference shielding of MEMS microphone via printed circuit board |
US11587839B2 (en) | 2019-06-27 | 2023-02-21 | Analog Devices, Inc. | Device with chemical reaction chamber |
WO2020258171A1 (zh) * | 2019-06-27 | 2020-12-30 | 瑞声声学科技(深圳)有限公司 | 振动传感器和音频设备 |
CN110324767A (zh) * | 2019-06-28 | 2019-10-11 | 歌尔股份有限公司 | 一种微型过滤器及声学设备 |
DE102019125815A1 (de) | 2019-09-25 | 2021-03-25 | USound GmbH | Schallwandlereinheit zum Erzeugen und/oder Erfassen von Schallwellen im hörbaren Wellenlängenbereich und/oder im Ultraschallbereich |
EP4040477A4 (en) * | 2019-09-30 | 2023-11-15 | Kyocera Corporation | ELECTRONIC DEVICE COVER, HOUSING, ELECTRONIC DEVICE AND ELECTRONIC MODULE |
KR102293940B1 (ko) | 2019-10-21 | 2021-08-26 | (주)파트론 | 마이크로폰 패키지 |
KR102209688B1 (ko) | 2019-10-29 | 2021-01-29 | (주)파트론 | 지향성 마이크로폰 장치 |
US11417611B2 (en) | 2020-02-25 | 2022-08-16 | Analog Devices International Unlimited Company | Devices and methods for reducing stress on circuit components |
DE102020204773A1 (de) | 2020-04-15 | 2021-10-21 | Robert Bosch Gesellschaft mit beschränkter Haftung | Sensoranordnung, umfassend eine Mehrzahl von einzelnen und separaten Sensorelementen |
KR20210128734A (ko) | 2020-04-17 | 2021-10-27 | (주)파트론 | 마이크로폰 장치 |
US11259104B2 (en) | 2020-06-23 | 2022-02-22 | Knowles Electronics, Llc | Adapters for microphones and combinations thereof |
KR20220001373A (ko) | 2020-06-29 | 2022-01-05 | (주)파트론 | 마이크로폰 장치 |
US11912564B2 (en) * | 2020-07-31 | 2024-02-27 | Knowles Electronics, Llc | Sensor package including a substrate with an inductor layer |
KR102350882B1 (ko) | 2020-10-29 | 2022-01-13 | (주)다빛센스 | 마이크로폰 장치 |
US11805370B2 (en) | 2020-12-30 | 2023-10-31 | Knowles Electronics, Llc | Balanced armature receiver having diaphragm with elastomer surround |
DE102021109180A1 (de) | 2021-04-13 | 2022-10-13 | Tdk Corporation | Deckel, MEMS-Sensorbauelement und Herstellungsverfahren |
CN113132888B (zh) * | 2021-06-17 | 2021-08-24 | 甬矽电子(宁波)股份有限公司 | 硅麦系统封装结构和硅麦系统封装结构的制备方法 |
CN114095845B (zh) * | 2021-10-28 | 2023-11-17 | 中国电子科技集团公司第三研究所 | 低频mems矢量传声器及其制备方法 |
US11935695B2 (en) | 2021-12-23 | 2024-03-19 | Knowles Electronics, Llc | Shock protection implemented in a balanced armature receiver |
US11765509B1 (en) * | 2022-05-27 | 2023-09-19 | Aac Acoustic Technologies (Shenzhen) Co., Ltd. | MEMS device and electro-acoustic transducer |
Family Cites Families (238)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3012335A (en) * | 1957-11-16 | 1961-12-12 | Svenska Flaektfabriken Ab | Treating web-like material by a gaseous medium |
US3192086A (en) | 1960-06-16 | 1965-06-29 | Rca Corp | Methods for manufacturing multilayered monolithic ceramic bodies |
US3567844A (en) | 1969-06-23 | 1971-03-02 | Mc Donnell Douglas Corp | Terminal pad for perforated circuit boards and substrates |
US3735211A (en) | 1971-06-21 | 1973-05-22 | Fairchild Camera Instr Co | Semiconductor package containing a dual epoxy and metal seal between a cover and a substrate, and method for forming said seal |
US3735209A (en) | 1972-02-10 | 1973-05-22 | Motorola Inc | Semiconductor device package with energy absorbing layer |
US4127840A (en) | 1977-02-22 | 1978-11-28 | Conrac Corporation | Solid state force transducer |
JPS55112864U (zh) | 1979-02-02 | 1980-08-08 | ||
US4222277A (en) | 1979-08-13 | 1980-09-16 | Kulite Semiconductor Products, Inc. | Media compatible pressure transducer |
US4277814A (en) | 1979-09-04 | 1981-07-07 | Ford Motor Company | Semiconductor variable capacitance pressure transducer assembly |
JPS622879Y2 (zh) | 1981-03-25 | 1987-01-22 | ||
CA1165859A (en) | 1981-10-19 | 1984-04-17 | Guy J. Chaput | Electret microphone shield |
US4418248A (en) * | 1981-12-11 | 1983-11-29 | Koss Corporation | Dual element headphone |
US4558184A (en) | 1983-02-24 | 1985-12-10 | At&T Bell Laboratories | Integrated capacitive transducer |
US4533795A (en) | 1983-07-07 | 1985-08-06 | American Telephone And Telegraph | Integrated electroacoustic transducer |
JPS60111129A (ja) | 1983-11-21 | 1985-06-17 | Yokogawa Hokushin Electric Corp | 圧力センサ |
US4691363A (en) | 1985-12-11 | 1987-09-01 | American Telephone & Telegraph Company, At&T Information Systems Inc. | Transducer device |
US4643935A (en) | 1986-01-21 | 1987-02-17 | Burroughs Corporation | Epoxy-glass integrated circuit package having bonding pads in a stepped cavity |
JPS62173814A (ja) | 1986-01-28 | 1987-07-30 | Alps Electric Co Ltd | 弾性表面波素子搭載ユニツト |
JPH0726887B2 (ja) | 1986-05-31 | 1995-03-29 | 株式会社堀場製作所 | コンデンサマイクロフオン型検出器用ダイアフラム |
JPS63275926A (ja) | 1987-05-07 | 1988-11-14 | Fuji Electric Co Ltd | 半導体圧力センサ |
NL8702589A (nl) | 1987-10-30 | 1989-05-16 | Microtel Bv | Elektro-akoestische transducent van de als elektreet aangeduide soort, en een werkwijze voor het vervaardigen van een dergelijke transducent. |
US5293781A (en) | 1987-11-09 | 1994-03-15 | California Institute Of Technology | Tunnel effect measuring systems and particle detectors |
JPH01169333A (ja) | 1987-12-25 | 1989-07-04 | Hitachi Ltd | 半導体圧力変換器 |
US4825335A (en) | 1988-03-14 | 1989-04-25 | Endevco Corporation | Differential capacitive transducer and method of making |
US4891686A (en) | 1988-04-08 | 1990-01-02 | Directed Energy, Inc. | Semiconductor packaging with ground plane conductor arrangement |
US4984268A (en) | 1988-11-21 | 1991-01-08 | At&T Bell Laboratories | Telephone handset construction |
DE3903229A1 (de) | 1989-02-03 | 1990-08-09 | Vdo Schindling | Elektronischer schaltkreis |
JPH036099A (ja) | 1989-06-02 | 1991-01-11 | Canon Inc | 電子機器の実装構造 |
US5202652A (en) | 1989-10-13 | 1993-04-13 | Hitachi, Ltd. | Surface acoustic wave filter device formed on a plurality of piezoelectric substrates |
US5146435A (en) | 1989-12-04 | 1992-09-08 | The Charles Stark Draper Laboratory, Inc. | Acoustic transducer |
DE4000903C1 (zh) | 1990-01-15 | 1990-08-09 | Robert Bosch Gmbh, 7000 Stuttgart, De | |
US5101543A (en) | 1990-07-02 | 1992-04-07 | Gentex Corporation | Method of making a variable capacitor microphone |
JP2673993B2 (ja) | 1990-07-02 | 1997-11-05 | 日本無線株式会社 | 表面弾性波装置 |
JPH0465643A (ja) | 1990-07-05 | 1992-03-02 | Mitsubishi Electric Corp | 半導体圧力センサ及びその製造方法 |
JPH0799420B2 (ja) | 1990-07-13 | 1995-10-25 | アルプス電気株式会社 | 強誘電性液晶素子 |
US5153379A (en) | 1990-10-09 | 1992-10-06 | Motorola, Inc. | Shielded low-profile electronic component assembly |
US5216278A (en) | 1990-12-04 | 1993-06-01 | Motorola, Inc. | Semiconductor device having a pad array carrier package |
US5189777A (en) | 1990-12-07 | 1993-03-02 | Wisconsin Alumni Research Foundation | Method of producing micromachined differential pressure transducers |
JP2772739B2 (ja) | 1991-06-20 | 1998-07-09 | いわき電子株式会社 | リードレスパッケージの外部電極構造及びその製造方法 |
US5241133A (en) | 1990-12-21 | 1993-08-31 | Motorola, Inc. | Leadless pad array chip carrier |
WO1992016095A1 (en) | 1991-03-04 | 1992-09-17 | Motorola, Inc. | Shielding apparatus for non-conductive electronic circuit package |
US5178015A (en) | 1991-07-22 | 1993-01-12 | Monolithic Sensors Inc. | Silicon-on-silicon differential input sensors |
FI109960B (fi) | 1991-09-19 | 2002-10-31 | Nokia Corp | Elektroninen laite |
JPH0590872A (ja) | 1991-09-27 | 1993-04-09 | Sumitomo Electric Ind Ltd | 表面弾性波素子 |
US5237235A (en) | 1991-09-30 | 1993-08-17 | Motorola, Inc. | Surface acoustic wave device package |
US5257547A (en) | 1991-11-26 | 1993-11-02 | Honeywell Inc. | Amplified pressure transducer |
US5490220A (en) | 1992-03-18 | 1996-02-06 | Knowles Electronics, Inc. | Solid state condenser and microphone devices |
FR2697675B1 (fr) | 1992-11-05 | 1995-01-06 | Suisse Electronique Microtech | Procédé de fabrication de transducteurs capacitifs intégrés. |
US5531787A (en) | 1993-01-25 | 1996-07-02 | Lesinski; S. George | Implantable auditory system with micromachined microsensor and microactuator |
US5475606A (en) * | 1993-03-05 | 1995-12-12 | International Business Machines Corporation | Faraday cage for a printed circuit card |
US5477008A (en) | 1993-03-19 | 1995-12-19 | Olin Corporation | Polymer plug for electronic packages |
US6262477B1 (en) | 1993-03-19 | 2001-07-17 | Advanced Interconnect Technologies | Ball grid array electronic package |
US5459368A (en) | 1993-08-06 | 1995-10-17 | Matsushita Electric Industrial Co., Ltd. | Surface acoustic wave device mounted module |
US5502344A (en) | 1993-08-23 | 1996-03-26 | Rohm Co., Ltd. | Packaged piezoelectric oscillator incorporating capacitors and method of making the same |
JP3461204B2 (ja) | 1993-09-14 | 2003-10-27 | 株式会社東芝 | マルチチップモジュール |
US5736783A (en) | 1993-10-08 | 1998-04-07 | Stratedge Corporation. | High frequency microelectronics package |
JPH07111254A (ja) | 1993-10-12 | 1995-04-25 | Sumitomo Electric Ind Ltd | 半導体装置の製造方法 |
EP0660119B1 (en) | 1993-12-27 | 2003-04-02 | Hitachi, Ltd. | Acceleration sensor |
CN1516251A (zh) | 1994-03-18 | 2004-07-28 | �������ɹ�ҵ��ʽ���� | 半导体组件的制造方法及半导体组件 |
JP3352084B2 (ja) | 1994-03-18 | 2002-12-03 | 日立化成工業株式会社 | 半導体素子搭載用基板及び半導体パッケージ |
JPH07303022A (ja) | 1994-05-09 | 1995-11-14 | Murata Mfg Co Ltd | 弾性表面波装置 |
US5587214A (en) | 1994-05-13 | 1996-12-24 | Media Solutions, Inc. | Laminated thermal transfer printable labels |
US6191928B1 (en) | 1994-05-27 | 2001-02-20 | Littelfuse, Inc. | Surface-mountable device for protection against electrostatic damage to electronic components |
US5452268A (en) | 1994-08-12 | 1995-09-19 | The Charles Stark Draper Laboratory, Inc. | Acoustic transducer with improved low frequency response |
US5545912A (en) | 1994-10-27 | 1996-08-13 | Motorola, Inc. | Electronic device enclosure including a conductive cap and substrate |
JP3171043B2 (ja) | 1995-01-11 | 2001-05-28 | 株式会社村田製作所 | 弾性表面波装置 |
JPH08233848A (ja) | 1995-02-28 | 1996-09-13 | Mitsubishi Electric Corp | 半導体センサ |
US5506919A (en) | 1995-03-27 | 1996-04-09 | Eastman Kodak Company | Conductive membrane optical modulator |
JP3308759B2 (ja) | 1995-04-10 | 2002-07-29 | 日本電気株式会社 | 弾性表面波装置 |
US5659195A (en) * | 1995-06-08 | 1997-08-19 | The Regents Of The University Of California | CMOS integrated microsensor with a precision measurement circuit |
US5729605A (en) * | 1995-06-19 | 1998-03-17 | Plantronics, Inc. | Headset with user adjustable frequency response |
US6242802B1 (en) | 1995-07-17 | 2001-06-05 | Motorola, Inc. | Moisture enhanced ball grid array package |
JPH09107192A (ja) | 1995-10-09 | 1997-04-22 | Kitagawa Ind Co Ltd | プリント基板およびケース兼用プリント基板ならびに携帯型通信機器 |
US5903552A (en) * | 1995-10-18 | 1999-05-11 | Telefonaktiebolaget Lm Ericsson | Discriminating between channels in wireless communication systems |
EP0774888B1 (en) | 1995-11-16 | 2003-03-19 | Matsushita Electric Industrial Co., Ltd | Printed wiring board and assembly of the same |
JP3294490B2 (ja) | 1995-11-29 | 2002-06-24 | 株式会社日立製作所 | Bga型半導体装置 |
JP3432982B2 (ja) | 1995-12-13 | 2003-08-04 | 沖電気工業株式会社 | 表面実装型半導体装置の製造方法 |
US5748758A (en) | 1996-01-25 | 1998-05-05 | Menasco, Jr.; Lawrence C. | Acoustic audio transducer with aerogel diaphragm |
JPH09222372A (ja) | 1996-02-19 | 1997-08-26 | Mitsubishi Electric Corp | 半導体式センサ |
JPH09232904A (ja) | 1996-02-28 | 1997-09-05 | Oki Electric Ind Co Ltd | Sawフィルタ用セラミックパッケージ |
US5886846A (en) * | 1996-03-13 | 1999-03-23 | Syquest Technology, Inc. | Method for applying optimal seeking technique to disk file with excessive repeatable runout |
US5888845A (en) | 1996-05-02 | 1999-03-30 | National Semiconductor Corporation | Method of making high sensitivity micro-machined pressure sensors and acoustic transducers |
US5761053A (en) | 1996-05-08 | 1998-06-02 | W. L. Gore & Associates, Inc. | Faraday cage |
JP2867954B2 (ja) | 1996-05-20 | 1999-03-10 | 日本電気株式会社 | チップ型半導体装置の製造方法 |
JPH09318650A (ja) | 1996-05-27 | 1997-12-12 | Matsushita Electric Works Ltd | センサ装置及びその製造方法 |
US5790679A (en) * | 1996-06-06 | 1998-08-04 | Northern Telecom Limited | Communications terminal having a single transducer for handset and handsfree receive functionality |
JP3209120B2 (ja) | 1996-06-12 | 2001-09-17 | 松下電工株式会社 | 圧力センサ |
US5939968A (en) | 1996-06-19 | 1999-08-17 | Littelfuse, Inc. | Electrical apparatus for overcurrent protection of electrical circuits |
US5889872A (en) * | 1996-07-02 | 1999-03-30 | Motorola, Inc. | Capacitive microphone and method therefor |
US5838551A (en) | 1996-08-01 | 1998-11-17 | Northern Telecom Limited | Electronic package carrying an electronic component and assembly of mother board and electronic package |
US6140144A (en) | 1996-08-08 | 2000-10-31 | Integrated Sensing Systems, Inc. | Method for packaging microsensors |
JPH1061513A (ja) | 1996-08-15 | 1998-03-03 | Mitsubishi Electric Corp | 燃料タンク用圧力検出装置 |
US5776798A (en) | 1996-09-04 | 1998-07-07 | Motorola, Inc. | Semiconductor package and method thereof |
US5854846A (en) * | 1996-09-06 | 1998-12-29 | Northrop Grumman Corporation | Wafer fabricated electroacoustic transducer |
US5981314A (en) | 1996-10-31 | 1999-11-09 | Amkor Technology, Inc. | Near chip size integrated circuit package |
US6962829B2 (en) | 1996-10-31 | 2005-11-08 | Amkor Technology, Inc. | Method of making near chip size integrated circuit package |
US5740261A (en) * | 1996-11-21 | 1998-04-14 | Knowles Electronics, Inc. | Miniature silicon condenser microphone |
JP3576727B2 (ja) | 1996-12-10 | 2004-10-13 | 株式会社デンソー | 表面実装型パッケージ |
US6119920A (en) | 1996-12-20 | 2000-09-19 | Rf Monolithics, Inc. | Method of forming an electronic package with a solder seal |
US5999821A (en) | 1997-01-29 | 1999-12-07 | Motorola, Inc. | Radiotelephone having a user interface module |
FI970409A (fi) | 1997-01-31 | 1998-08-01 | Nokia Mobile Phones Ltd | Menetelmä mikrofonin suojaamiseksi ulkoisilta häiriötekijäiltä ja mikrofonin häiriösuojus |
US5870482A (en) | 1997-02-25 | 1999-02-09 | Knowles Electronics, Inc. | Miniature silicon condenser microphone |
US5923995A (en) | 1997-04-18 | 1999-07-13 | National Semiconductor Corporation | Methods and apparatuses for singulation of microelectromechanical systems |
US6117705A (en) | 1997-04-18 | 2000-09-12 | Amkor Technology, Inc. | Method of making integrated circuit package having adhesive bead supporting planar lid above planar substrate |
US6144738A (en) * | 1997-05-05 | 2000-11-07 | Nortel Networks Corporation | Telephone handset with enhanced handset/handsfree receiving and alerting audio quality |
US6118881A (en) | 1997-05-13 | 2000-09-12 | Lucent Technologies Inc. | Reduction of flow-induced microphone noise |
US5895229A (en) | 1997-05-19 | 1999-04-20 | Motorola, Inc. | Microelectronic package including a polymer encapsulated die, and method for forming same |
US5831262A (en) | 1997-06-27 | 1998-11-03 | Lucent Technologies Inc. | Article comprising an optical fiber attached to a micromechanical device |
US5898574A (en) | 1997-09-02 | 1999-04-27 | Tan; Wiling | Self aligning electrical component |
JPH1188992A (ja) * | 1997-09-03 | 1999-03-30 | Hosiden Corp | 集積型容量性変換器及びその製造方法 |
TW387198B (en) * | 1997-09-03 | 2000-04-11 | Hosiden Corp | Audio sensor and its manufacturing method, and semiconductor electret capacitance microphone using the same |
US5939784A (en) | 1997-09-09 | 1999-08-17 | Amkor Technology, Inc. | Shielded surface acoustical wave package |
US6002949A (en) * | 1997-11-18 | 1999-12-14 | Nortel Networks Corporation | Handset with a single transducer for handset and handsfree functionality |
JP3652488B2 (ja) | 1997-12-18 | 2005-05-25 | Tdk株式会社 | 樹脂パッケージの製造方法 |
JPH11201846A (ja) | 1998-01-12 | 1999-07-30 | Mitsubishi Electric Corp | 半導体圧力検出装置 |
JPH11239037A (ja) | 1998-02-20 | 1999-08-31 | Nec Corp | 弾性表面波装置 |
US6282072B1 (en) | 1998-02-24 | 2001-08-28 | Littelfuse, Inc. | Electrical devices having a polymer PTC array |
US6052464A (en) | 1998-05-29 | 2000-04-18 | Motorola, Inc. | Telephone set having a microphone for receiving or an earpiece for generating an acoustic signal via a keypad |
US6552469B1 (en) | 1998-06-05 | 2003-04-22 | Knowles Electronics, Llc | Solid state transducer for converting between an electrical signal and sound |
FI105880B (fi) | 1998-06-18 | 2000-10-13 | Nokia Mobile Phones Ltd | Mikromekaanisen mikrofonin kiinnitys |
US6428650B1 (en) | 1998-06-23 | 2002-08-06 | Amerasia International Technology, Inc. | Cover for an optical device and method for making same |
US6389145B2 (en) * | 1998-07-24 | 2002-05-14 | Agere Systems Guardian Corp. | Methods and apparatus for controlling the output of moving armature transducers |
US5977626A (en) | 1998-08-12 | 1999-11-02 | Industrial Technology Research Institute | Thermally and electrically enhanced PBGA package |
GB9818474D0 (en) | 1998-08-26 | 1998-10-21 | Hughes John E | Multi-layer interconnect package for optical devices & standard semiconductor chips |
DK173789B1 (da) * | 1998-10-05 | 2001-10-22 | Kirk Acoustics As | Elektroakustisk kommunikationsenhed |
JP2000121469A (ja) | 1998-10-16 | 2000-04-28 | Mitsubishi Electric Corp | 圧力センサ |
US6088463A (en) | 1998-10-30 | 2000-07-11 | Microtronic A/S | Solid state silicon-based condenser microphone |
US6108184A (en) | 1998-11-13 | 2000-08-22 | Littlefuse, Inc. | Surface mountable electrical device comprising a voltage variable material |
US6534340B1 (en) | 1998-11-18 | 2003-03-18 | Analog Devices, Inc. | Cover cap for semiconductor wafer devices |
JP3472493B2 (ja) | 1998-11-30 | 2003-12-02 | ホシデン株式会社 | 半導体エレクトレットコンデンサーマイクロホン |
US6078245A (en) | 1998-12-17 | 2000-06-20 | Littelfuse, Inc. | Containment of tin diffusion bar |
US6339365B1 (en) | 1998-12-29 | 2002-01-15 | Kabushiki Kaisha Toshiba | Surface acoustic wave device comprising first and second chips face down bonded to a common package ground |
JP4199867B2 (ja) | 1999-01-06 | 2008-12-24 | 北陸電気工業株式会社 | 半導体圧力センサ装置 |
US7003127B1 (en) | 1999-01-07 | 2006-02-21 | Sarnoff Corporation | Hearing aid with large diaphragm microphone element including a printed circuit board |
WO2000042636A2 (en) | 1999-01-12 | 2000-07-20 | Teledyne Technologies Incorporated | Micromachined device and method of forming the micromachined device |
JP2000277970A (ja) | 1999-03-24 | 2000-10-06 | Matsushita Electric Ind Co Ltd | 磁気遮蔽装置およびこれを備えた携帯情報機器 |
US6157546A (en) | 1999-03-26 | 2000-12-05 | Ericsson Inc. | Shielding apparatus for electronic devices |
CN1198489C (zh) * | 1999-04-09 | 2005-04-20 | 松下电器产业株式会社 | 高频组件的制造方法 |
JP2000307289A (ja) | 1999-04-19 | 2000-11-02 | Nec Corp | 電子部品組立体 |
JP3571575B2 (ja) | 1999-04-30 | 2004-09-29 | シャープ株式会社 | 携帯電話機 |
US6136419A (en) | 1999-05-26 | 2000-10-24 | International Business Machines Corporation | Ceramic substrate having a sealed layer |
JP3873145B2 (ja) | 1999-05-27 | 2007-01-24 | 京セラ株式会社 | 半導体素子収納用パッケージ |
JP2000357937A (ja) | 1999-06-17 | 2000-12-26 | Murata Mfg Co Ltd | 弾性表面波装置 |
JP3462806B2 (ja) | 1999-08-06 | 2003-11-05 | 三洋電機株式会社 | 半導体装置およびその製造方法 |
CA2315417A1 (en) | 1999-08-11 | 2001-02-11 | Hiroshi Une | Electret capacitor microphone |
US6522762B1 (en) * | 1999-09-07 | 2003-02-18 | Microtronic A/S | Silicon-based sensor system |
EP1219136B1 (en) | 1999-09-06 | 2003-06-18 | SonionMEMS A/S | A pressure transducer |
US6829131B1 (en) | 1999-09-13 | 2004-12-07 | Carnegie Mellon University | MEMS digital-to-acoustic transducer with error cancellation |
JP3618063B2 (ja) | 1999-09-29 | 2005-02-09 | 京セラ株式会社 | 半導体素子収納用パッケージ |
GB2355128B (en) * | 1999-10-08 | 2003-04-09 | Nokia Mobile Phones Ltd | Portable electronics device |
US6404100B1 (en) | 1999-10-18 | 2002-06-11 | Kabushiki Kaisha Toshiba | Surface acoustic wave apparatus and method of manufacturing the same |
US6324907B1 (en) | 1999-11-29 | 2001-12-04 | Microtronic A/S | Flexible substrate transducer assembly |
US6526653B1 (en) | 1999-12-08 | 2003-03-04 | Amkor Technology, Inc. | Method of assembling a snap lid image sensor package |
JP2001208626A (ja) | 2000-01-24 | 2001-08-03 | Mitsubishi Electric Corp | 半導体圧力センサ装置 |
US6479320B1 (en) | 2000-02-02 | 2002-11-12 | Raytheon Company | Vacuum package fabrication of microelectromechanical system devices with integrated circuit components |
AU2001245295A1 (en) * | 2000-02-17 | 2001-08-27 | Millennum Pharmaceuticals, Inc. | Methods and compositions for the identification, assessment, prevention and therapy of human cancers |
US6656768B2 (en) * | 2001-02-08 | 2003-12-02 | Texas Instruments Incorporated | Flip-chip assembly of protected micromechanical devices |
JP2001308217A (ja) | 2000-04-27 | 2001-11-02 | Kyocera Corp | 半導体装置 |
US6876052B1 (en) | 2000-05-12 | 2005-04-05 | National Semiconductor Corporation | Package-ready light-sensitive integrated circuit and method for its preparation |
AU2001263463A1 (en) | 2000-06-06 | 2001-12-17 | Sawtek, Inc. | System and method for array processing of surface acoustic wave devices |
GB2364198A (en) * | 2000-06-30 | 2002-01-16 | Nokia Mobile Phones Ltd | Transducer mounting and housing for an electronic device |
JP3386043B2 (ja) | 2000-08-09 | 2003-03-10 | 株式会社村田製作所 | 弾性表面波デバイス |
EP1469701B1 (en) | 2000-08-11 | 2008-04-16 | Knowles Electronics, LLC | Raised microstructures |
US6535460B2 (en) | 2000-08-11 | 2003-03-18 | Knowles Electronics, Llc | Miniature broadband acoustic transducer |
US6439869B1 (en) | 2000-08-16 | 2002-08-27 | Micron Technology, Inc. | Apparatus for molding semiconductor components |
US7092539B2 (en) | 2000-11-28 | 2006-08-15 | University Of Florida Research Foundation, Inc. | MEMS based acoustic array |
US8623710B1 (en) * | 2000-11-28 | 2014-01-07 | Knowles Electronics, Llc | Methods of manufacture of bottom port multi-part surface mount silicon condenser microphone packages |
US7166910B2 (en) * | 2000-11-28 | 2007-01-23 | Knowles Electronics Llc | Miniature silicon condenser microphone |
US7439616B2 (en) | 2000-11-28 | 2008-10-21 | Knowles Electronics, Llc | Miniature silicon condenser microphone |
US7434305B2 (en) * | 2000-11-28 | 2008-10-14 | Knowles Electronics, Llc. | Method of manufacturing a microphone |
US6441503B1 (en) | 2001-01-03 | 2002-08-27 | Amkor Technology, Inc. | Bond wire pressure sensor die package |
US6847090B2 (en) | 2001-01-24 | 2005-01-25 | Knowles Electronics, Llc | Silicon capacitive microphone |
US20020106091A1 (en) | 2001-02-02 | 2002-08-08 | Furst Claus Erdmann | Microphone unit with internal A/D converter |
US6859542B2 (en) | 2001-05-31 | 2005-02-22 | Sonion Lyngby A/S | Method of providing a hydrophobic layer and a condenser microphone having such a layer |
US6483037B1 (en) | 2001-11-13 | 2002-11-19 | Motorola, Inc. | Multilayer flexible FR4 circuit |
WO2003047307A2 (en) * | 2001-11-27 | 2003-06-05 | Corporation For National Research Initiatives | A miniature condenser microphone and fabrication method therefor |
JP2003235087A (ja) * | 2002-02-08 | 2003-08-22 | Goro Yamauchi | 防水型マイクロホン用風防 |
JP3686047B2 (ja) | 2002-03-29 | 2005-08-24 | 沖電気工業株式会社 | 半導体装置の製造方法 |
US6621392B1 (en) * | 2002-04-25 | 2003-09-16 | International Business Machines Corporation | Micro electromechanical switch having self-aligned spacers |
US6850133B2 (en) | 2002-08-14 | 2005-02-01 | Intel Corporation | Electrode configuration in a MEMS switch |
US6781231B2 (en) * | 2002-09-10 | 2004-08-24 | Knowles Electronics Llc | Microelectromechanical system package with environmental and interference shield |
US7142682B2 (en) | 2002-12-20 | 2006-11-28 | Sonion Mems A/S | Silicon-based transducer for use in hearing instruments and listening devices |
DE10303263B4 (de) | 2003-01-28 | 2012-01-05 | Infineon Technologies Ag | Mikrophonanordnung |
US7501703B2 (en) * | 2003-02-28 | 2009-03-10 | Knowles Electronics, Llc | Acoustic transducer module |
US7382048B2 (en) | 2003-02-28 | 2008-06-03 | Knowles Electronics, Llc | Acoustic transducer module |
US20040253760A1 (en) | 2003-06-13 | 2004-12-16 | Agency For Science, Technology And Research | Method to fabricate a highly perforated silicon diaphragm with controlable thickness and low stress |
US7233679B2 (en) * | 2003-09-30 | 2007-06-19 | Motorola, Inc. | Microphone system for a communication device |
US6936918B2 (en) | 2003-12-15 | 2005-08-30 | Analog Devices, Inc. | MEMS device with conductive path through substrate |
JP4261374B2 (ja) * | 2004-01-09 | 2009-04-30 | 富士フイルム株式会社 | 積層構造体及びその製造方法、並びに、超音波トランスデューサ |
JP2005203889A (ja) | 2004-01-13 | 2005-07-28 | Fujitsu Media Device Kk | 弾性表面波デバイス |
KR100709463B1 (ko) | 2004-02-16 | 2007-04-18 | 주식회사 하이닉스반도체 | 나노 튜브 셀을 이용한 메모리 장치 |
JP3875240B2 (ja) | 2004-03-31 | 2007-01-31 | 株式会社東芝 | 電子部品の製造方法 |
US7929714B2 (en) | 2004-08-11 | 2011-04-19 | Qualcomm Incorporated | Integrated audio codec with silicon audio transducer |
DE102004058879B4 (de) | 2004-12-06 | 2013-11-07 | Austriamicrosystems Ag | MEMS-Mikrophon und Verfahren zur Herstellung |
JP2006198520A (ja) | 2005-01-20 | 2006-08-03 | Canon Inc | フィルターならびに該フィルターを用いた液体吐出ヘッド |
DE102005008512B4 (de) | 2005-02-24 | 2016-06-23 | Epcos Ag | Elektrisches Modul mit einem MEMS-Mikrofon |
JP4377838B2 (ja) | 2005-03-31 | 2009-12-02 | 株式会社日立製作所 | ペダル装置及びそれを備えた自動車 |
US7280855B2 (en) | 2005-06-28 | 2007-10-09 | Research In Motion Limited | Microphone coupler for a communication device |
US7297567B2 (en) | 2006-01-10 | 2007-11-20 | Knowles Electronics, Llc. | Method for singulating a released microelectromechanical system wafer |
DE602007005405D1 (de) | 2006-01-26 | 2010-05-06 | Sonion Mems As | Elastomerschild für Miniaturmikrofone |
US7436054B2 (en) * | 2006-03-03 | 2008-10-14 | Silicon Matrix, Pte. Ltd. | MEMS microphone with a stacked PCB package and method of producing the same |
US20070215962A1 (en) | 2006-03-20 | 2007-09-20 | Knowles Elecronics, Llc | Microelectromechanical system assembly and method for manufacturing thereof |
US8264387B2 (en) * | 2006-03-31 | 2012-09-11 | Silicon Laboratories Inc. | Transceiver having multiple signal processing modes of operation |
US20080142475A1 (en) | 2006-12-15 | 2008-06-19 | Knowles Electronics, Llc | Method of creating solid object from a material and apparatus thereof |
US20080217709A1 (en) | 2007-03-07 | 2008-09-11 | Knowles Electronics, Llc | Mems package having at least one port and manufacturing method thereof |
WO2009016587A1 (en) | 2007-08-02 | 2009-02-05 | Nxp B.V. | Electro-acoustic transducer comprising a mems sensor |
KR101008399B1 (ko) * | 2007-09-03 | 2011-01-14 | 주식회사 비에스이 | 내벽을 금속성 혹은 전도성 물질로 감싼 세라믹 패키지를이용한 콘덴서 마이크로폰 |
US8450817B2 (en) | 2008-08-14 | 2013-05-28 | Knowles Electronics Llc | Microelectromechanical system package with strain relief bridge |
DE112009002542A5 (de) | 2008-10-14 | 2011-09-08 | Knowles Electronics, Llc | Mikrofon mit einer Mehrzahl von Wandlerelementen |
US8457332B2 (en) | 2009-01-07 | 2013-06-04 | Knowles Electronics, Llc | Microphone and orientation sensor assembly |
DE112010002028T5 (de) | 2009-05-18 | 2012-08-02 | Knowles Electronics, Llc | Mikrofon mit verringerter Schwingungsempfindlichkeit |
US8987030B2 (en) | 2009-08-13 | 2015-03-24 | Knowles Electronics, Llc | MEMS package and a method for manufacturing the same |
US9399574B2 (en) | 2009-08-13 | 2016-07-26 | Knowles Electronics Llc | MEMS package and a method for manufacturing the same |
EP2432249A1 (en) | 2010-07-02 | 2012-03-21 | Knowles Electronics Asia PTE. Ltd. | Microphone |
US20120161258A1 (en) | 2010-12-28 | 2012-06-28 | Loeppert Peter V | Package with a cmos die positioned underneath a mems die |
US8781140B2 (en) | 2011-04-15 | 2014-07-15 | Knowles Electronics, Llc | Compact, highly integrated microphone assembly |
US8879767B2 (en) | 2011-08-19 | 2014-11-04 | Knowles Electronics, Llc | Acoustic apparatus and method of manufacturing |
US8969980B2 (en) | 2011-09-23 | 2015-03-03 | Knowles Electronics, Llc | Vented MEMS apparatus and method of manufacture |
US20130177192A1 (en) | 2011-10-25 | 2013-07-11 | Knowles Electronics, Llc | Vented Microphone Module |
EP2774390A4 (en) | 2011-11-04 | 2015-07-22 | Knowles Electronics Llc | EMBEDDED DIELEKTRIKUM AS A BARRIER IN AN ACOUSTIC DEVICE AND METHOD OF MANUFACTURING |
US8995694B2 (en) | 2012-02-01 | 2015-03-31 | Knowles Electronics, Llc | Embedded circuit in a MEMS device |
US9485560B2 (en) | 2012-02-01 | 2016-11-01 | Knowles Electronics, Llc | Embedded circuit in a MEMS device |
US9402118B2 (en) | 2012-07-27 | 2016-07-26 | Knowles Electronics, Llc | Housing and method to control solder creep on housing |
US9491539B2 (en) | 2012-08-01 | 2016-11-08 | Knowles Electronics, Llc | MEMS apparatus disposed on assembly lid |
US20140064546A1 (en) | 2012-08-01 | 2014-03-06 | Knowles Electronics, Llc | Microphone assembly |
US20140037120A1 (en) | 2012-08-01 | 2014-02-06 | Knowles Electronics, Llc | Microphone Assembly |
US9078063B2 (en) | 2012-08-10 | 2015-07-07 | Knowles Electronics, Llc | Microphone assembly with barrier to prevent contaminant infiltration |
US9137595B2 (en) | 2012-11-14 | 2015-09-15 | Knowles Electronics, Llc | Apparatus for prevention of pressure transients in microphones |
US20140133686A1 (en) | 2012-11-14 | 2014-05-15 | Knowles Electronics, Llc | Apparatus to prevent excess movement of mems components |
US9343455B2 (en) | 2012-12-19 | 2016-05-17 | Knowles Electronics, Llc | Apparatus and method for high voltage I/O electro-static discharge protection |
US20140291783A1 (en) | 2013-03-21 | 2014-10-02 | Knowles Electronics, Llc | Cover for a mems microphone |
US9467785B2 (en) | 2013-03-28 | 2016-10-11 | Knowles Electronics, Llc | MEMS apparatus with increased back volume |
US9301075B2 (en) | 2013-04-24 | 2016-03-29 | Knowles Electronics, Llc | MEMS microphone with out-gassing openings and method of manufacturing the same |
US20150117681A1 (en) | 2013-10-30 | 2015-04-30 | Knowles Electronics, Llc | Acoustic Assembly and Method of Manufacturing The Same |
US20150139428A1 (en) | 2013-11-20 | 2015-05-21 | Knowles IPC (M) Snd. Bhd. | Apparatus with a speaker used as second microphone |
US20150172825A1 (en) | 2013-12-13 | 2015-06-18 | Knowles Electronics, Llc | Method and Apparatus for an Acoustic Device Having a Coating |
US9307328B2 (en) | 2014-01-09 | 2016-04-05 | Knowles Electronics, Llc | Interposer for MEMS-on-lid microphone |
WO2015112498A1 (en) | 2014-01-21 | 2015-07-30 | Knowles Electronics, Llc | Microphone apparatus and method to provide extremely high acoustic overload points |
-
2004
- 2004-08-19 US US10/921,747 patent/US7434305B2/en not_active Expired - Lifetime
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2005
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- 2007-04-30 US US11/741,881 patent/US8018049B2/en active Active
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2014
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