CN101039548A - 阳极氧化金属基板模块 - Google Patents
阳极氧化金属基板模块 Download PDFInfo
- Publication number
- CN101039548A CN101039548A CNA2007100875234A CN200710087523A CN101039548A CN 101039548 A CN101039548 A CN 101039548A CN A2007100875234 A CNA2007100875234 A CN A2007100875234A CN 200710087523 A CN200710087523 A CN 200710087523A CN 101039548 A CN101039548 A CN 101039548A
- Authority
- CN
- China
- Prior art keywords
- metallic plate
- metal substrate
- substrate module
- anodized metal
- module according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 75
- 239000002184 metal Substances 0.000 title claims abstract description 75
- 239000000758 substrate Substances 0.000 title claims abstract description 71
- 230000004888 barrier function Effects 0.000 claims description 9
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000005855 radiation Effects 0.000 abstract description 5
- 230000003647 oxidation Effects 0.000 description 14
- 238000007254 oxidation reaction Methods 0.000 description 14
- 238000012546 transfer Methods 0.000 description 9
- 238000009413 insulation Methods 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- IYZWUWBAFUBNCH-UHFFFAOYSA-N 2,6-dichlorobiphenyl Chemical compound ClC1=CC=CC(Cl)=C1C1=CC=CC=C1 IYZWUWBAFUBNCH-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005094 computer simulation Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 150000002739 metals Chemical group 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/0058—Means for improving the coupling-out of light from the light guide varying in density, size, shape or depth along the light guide
- G02B6/0061—Means for improving the coupling-out of light from the light guide varying in density, size, shape or depth along the light guide to provide homogeneous light output intensity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
- G02B6/0053—Prismatic sheet or layer; Brightness enhancement element, sheet or layer
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0068—Arrangements of plural sources, e.g. multi-colour light sources
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0073—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
Abstract
Description
Claims (12)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2006-0025010 | 2006-03-17 | ||
KR1020060025010A KR100764388B1 (ko) | 2006-03-17 | 2006-03-17 | 양극산화 금속기판 모듈 |
KR1020060025010 | 2006-03-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101039548A true CN101039548A (zh) | 2007-09-19 |
CN101039548B CN101039548B (zh) | 2012-03-21 |
Family
ID=38517631
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007100875234A Active CN101039548B (zh) | 2006-03-17 | 2007-03-16 | 阳极氧化金属基板模块 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8058781B2 (zh) |
JP (2) | JP2007251176A (zh) |
KR (1) | KR100764388B1 (zh) |
CN (1) | CN101039548B (zh) |
TW (1) | TWI328666B (zh) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102388473A (zh) * | 2009-03-24 | 2012-03-21 | 金江 | 发光二极管封装 |
CN102494259A (zh) * | 2011-12-01 | 2012-06-13 | 深圳市华星光电技术有限公司 | 液晶显示装置的led灯条及背光模组 |
CN102867815A (zh) * | 2011-07-04 | 2013-01-09 | 三星电机株式会社 | 功率模块封装和用于制造该功率模块封装的方法 |
WO2014083714A1 (ja) * | 2012-11-27 | 2014-06-05 | シチズン電子株式会社 | 実装基板及びこの実装基板を用いた発光装置 |
CN105470378A (zh) * | 2015-12-29 | 2016-04-06 | 乐健科技(珠海)有限公司 | 高导热金属基板及其制作方法、led模组及其制作方法 |
WO2018121217A1 (zh) * | 2016-12-29 | 2018-07-05 | 比亚迪股份有限公司 | 散热基板及其制备方法和应用以及电子元器件 |
CN108257922A (zh) * | 2016-12-29 | 2018-07-06 | 比亚迪股份有限公司 | 一种散热基板及其制备方法和应用以及电子元器件 |
CN108257929A (zh) * | 2016-12-29 | 2018-07-06 | 比亚迪股份有限公司 | 一种散热基板及其制备方法和应用以及电子元器件 |
Families Citing this family (42)
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RU2419740C1 (ru) * | 2007-02-16 | 2011-05-27 | Шарп Кабусики Кайся | Устройство подсветки и устройство плоского дисплея, использующее его |
US8854595B2 (en) | 2008-03-03 | 2014-10-07 | Manufacturing Resources International, Inc. | Constricted convection cooling system for an electronic display |
US8497972B2 (en) | 2009-11-13 | 2013-07-30 | Manufacturing Resources International, Inc. | Thermal plate with optional cooling loop in electronic display |
US8773633B2 (en) | 2008-03-03 | 2014-07-08 | Manufacturing Resources International, Inc. | Expanded heat sink for electronic displays |
US8537302B2 (en) * | 2008-06-11 | 2013-09-17 | Manufacturing Resources International, Inc. | Liquid crystal display assembly comprising an LED backlight assembly and a movable element placed behind the LED backlight assembly having a hinge to allow access to a rear portion of the LED backlight assembly |
US8654302B2 (en) | 2008-03-03 | 2014-02-18 | Manufacturing Resources International, Inc. | Heat exchanger for an electronic display |
US9173325B2 (en) | 2008-03-26 | 2015-10-27 | Manufacturing Resources International, Inc. | Heat exchanger for back to back electronic displays |
US8693185B2 (en) | 2008-03-26 | 2014-04-08 | Manufacturing Resources International, Inc. | System and method for maintaining a consistent temperature gradient across an electronic display |
KR100998010B1 (ko) * | 2008-04-28 | 2010-12-03 | 삼성엘이디 주식회사 | 발광소자 패키지 및 그 제조방법 |
JP2010073767A (ja) * | 2008-09-17 | 2010-04-02 | Jtekt Corp | 多層回路基板 |
US8749749B2 (en) | 2008-12-18 | 2014-06-10 | Manufacturing Resources International, Inc. | System for cooling an electronic image assembly with manifolds and ambient gas |
US10827656B2 (en) | 2008-12-18 | 2020-11-03 | Manufacturing Resources International, Inc. | System for cooling an electronic image assembly with circulating gas and ambient gas |
KR101092262B1 (ko) * | 2009-04-10 | 2011-12-12 | 광전자 주식회사 | 웨이퍼 가공 기법을 이용한 엘이디모듈 제조 방법 |
EP2273182B1 (de) * | 2009-07-07 | 2018-12-19 | Siteco Beleuchtungstechnik GmbH | Dreidimensionales LED-Trägerelement mit thermischer Leitfähigkeit |
KR101055558B1 (ko) * | 2010-01-11 | 2011-08-08 | 삼성전기주식회사 | 방열기판 및 그 제조방법 |
JP2012033853A (ja) | 2010-04-28 | 2012-02-16 | Fujifilm Corp | 絶縁性光反射基板 |
WO2012008569A1 (ja) * | 2010-07-15 | 2012-01-19 | シャープ株式会社 | 放熱板、電子機器 |
US8889517B2 (en) * | 2012-04-02 | 2014-11-18 | Jds Uniphase Corporation | Broadband dielectric reflectors for LED with varying thickness |
US9099626B2 (en) * | 2012-04-02 | 2015-08-04 | Jds Uniphase Corporation | Broadband dielectric reflectors for LED |
AT512525B1 (de) | 2012-05-04 | 2013-09-15 | Mikroelektronik Ges Mit Beschraenkter Haftung Ab | Leiterplatte, insbesondere für ein Leistungselektronikmodul, umfassend ein elektrisch leitfähiges Substrat |
JP2014072314A (ja) * | 2012-09-28 | 2014-04-21 | Toyota Industries Corp | 半導体装置、及び半導体装置の製造方法 |
KR101868077B1 (ko) | 2012-10-16 | 2018-06-18 | 매뉴팩처링 리소시스 인터내셔널 인코포레이티드 | 전자 디스플레이용 후방 팬 냉각 어셈블리 |
US10524384B2 (en) | 2013-03-15 | 2019-12-31 | Manufacturing Resources International, Inc. | Cooling assembly for an electronic display |
US9648790B2 (en) | 2013-03-15 | 2017-05-09 | Manufacturing Resources International, Inc. | Heat exchanger assembly for an electronic display |
AU2014287438B2 (en) | 2013-07-08 | 2017-09-28 | Manufacturing Resources International, Inc. | Figure eight closed loop cooling system for electronic display |
EP3468321B1 (en) | 2014-03-11 | 2021-04-28 | Manufacturing Resources International, Inc. | Method for mounting a display to a wall |
EP3138372B1 (en) | 2014-04-30 | 2019-05-08 | Manufacturing Resources International, INC. | Back to back electronic display assembly |
CN105848404B (zh) * | 2015-01-14 | 2019-04-19 | 南京德朔实业有限公司 | 电动工具及其电路板 |
US9723765B2 (en) | 2015-02-17 | 2017-08-01 | Manufacturing Resources International, Inc. | Perimeter ventilation system for electronic display |
KR102104342B1 (ko) | 2016-03-04 | 2020-04-24 | 매뉴팩처링 리소시스 인터내셔널 인코포레이티드 | 양면 표시장치 조립체를 위한 냉각 시스템 |
CA3059972C (en) | 2017-04-27 | 2022-01-11 | Manufacturing Resources International, Inc. | System and method for preventing display bowing |
US10485113B2 (en) | 2017-04-27 | 2019-11-19 | Manufacturing Resources International, Inc. | Field serviceable and replaceable display |
US10559965B2 (en) | 2017-09-21 | 2020-02-11 | Manufacturing Resources International, Inc. | Display assembly having multiple charging ports |
US10602626B2 (en) | 2018-07-30 | 2020-03-24 | Manufacturing Resources International, Inc. | Housing assembly for an integrated display unit |
US11096317B2 (en) | 2019-02-26 | 2021-08-17 | Manufacturing Resources International, Inc. | Display assembly with loopback cooling |
US10795413B1 (en) | 2019-04-03 | 2020-10-06 | Manufacturing Resources International, Inc. | Electronic display assembly with a channel for ambient air in an access panel |
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-
2006
- 2006-03-17 KR KR1020060025010A patent/KR100764388B1/ko active IP Right Grant
-
2007
- 2007-03-14 TW TW096108709A patent/TWI328666B/zh active
- 2007-03-16 US US11/723,059 patent/US8058781B2/en active Active
- 2007-03-16 JP JP2007067887A patent/JP2007251176A/ja not_active Abandoned
- 2007-03-16 CN CN2007100875234A patent/CN101039548B/zh active Active
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2011
- 2011-05-02 JP JP2011103288A patent/JP5246970B2/ja active Active
Cited By (11)
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CN102388473A (zh) * | 2009-03-24 | 2012-03-21 | 金江 | 发光二极管封装 |
CN102867815A (zh) * | 2011-07-04 | 2013-01-09 | 三星电机株式会社 | 功率模块封装和用于制造该功率模块封装的方法 |
CN102494259A (zh) * | 2011-12-01 | 2012-06-13 | 深圳市华星光电技术有限公司 | 液晶显示装置的led灯条及背光模组 |
WO2014083714A1 (ja) * | 2012-11-27 | 2014-06-05 | シチズン電子株式会社 | 実装基板及びこの実装基板を用いた発光装置 |
CN105470378A (zh) * | 2015-12-29 | 2016-04-06 | 乐健科技(珠海)有限公司 | 高导热金属基板及其制作方法、led模组及其制作方法 |
CN105470378B (zh) * | 2015-12-29 | 2018-05-25 | 乐健科技(珠海)有限公司 | 高导热金属基板及其制作方法、led模组及其制作方法 |
WO2018121217A1 (zh) * | 2016-12-29 | 2018-07-05 | 比亚迪股份有限公司 | 散热基板及其制备方法和应用以及电子元器件 |
CN108257922A (zh) * | 2016-12-29 | 2018-07-06 | 比亚迪股份有限公司 | 一种散热基板及其制备方法和应用以及电子元器件 |
CN108257923A (zh) * | 2016-12-29 | 2018-07-06 | 比亚迪股份有限公司 | 一种散热基板及其制备方法和应用以及电子元器件 |
CN108257929A (zh) * | 2016-12-29 | 2018-07-06 | 比亚迪股份有限公司 | 一种散热基板及其制备方法和应用以及电子元器件 |
CN108257929B (zh) * | 2016-12-29 | 2020-06-19 | 比亚迪股份有限公司 | 一种散热基板及其制备方法和应用以及电子元器件 |
Also Published As
Publication number | Publication date |
---|---|
KR100764388B1 (ko) | 2007-10-05 |
TW200809131A (en) | 2008-02-16 |
JP5246970B2 (ja) | 2013-07-24 |
CN101039548B (zh) | 2012-03-21 |
US8058781B2 (en) | 2011-11-15 |
KR20070094384A (ko) | 2007-09-20 |
JP2007251176A (ja) | 2007-09-27 |
JP2011193015A (ja) | 2011-09-29 |
TWI328666B (en) | 2010-08-11 |
US20070217221A1 (en) | 2007-09-20 |
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