CN101039548B - 阳极氧化金属基板模块 - Google Patents
阳极氧化金属基板模块 Download PDFInfo
- Publication number
- CN101039548B CN101039548B CN2007100875234A CN200710087523A CN101039548B CN 101039548 B CN101039548 B CN 101039548B CN 2007100875234 A CN2007100875234 A CN 2007100875234A CN 200710087523 A CN200710087523 A CN 200710087523A CN 101039548 B CN101039548 B CN 101039548B
- Authority
- CN
- China
- Prior art keywords
- metallic plate
- metal substrate
- substrate module
- anodized metal
- oxide film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 72
- 239000002184 metal Substances 0.000 title claims abstract description 72
- 239000000758 substrate Substances 0.000 title claims abstract description 67
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000005855 radiation Effects 0.000 abstract description 5
- 230000003647 oxidation Effects 0.000 description 14
- 238000007254 oxidation reaction Methods 0.000 description 14
- 238000012546 transfer Methods 0.000 description 9
- 230000004888 barrier function Effects 0.000 description 8
- 238000009413 insulation Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 6
- IYZWUWBAFUBNCH-UHFFFAOYSA-N 2,6-dichlorobiphenyl Chemical compound ClC1=CC=CC(Cl)=C1C1=CC=CC=C1 IYZWUWBAFUBNCH-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005094 computer simulation Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/0058—Means for improving the coupling-out of light from the light guide varying in density, size, shape or depth along the light guide
- G02B6/0061—Means for improving the coupling-out of light from the light guide varying in density, size, shape or depth along the light guide to provide homogeneous light output intensity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
- G02B6/0053—Prismatic sheet or layer; Brightness enhancement element, sheet or layer
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0068—Arrangements of plural sources, e.g. multi-colour light sources
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0073—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
Abstract
Description
Claims (8)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060025010A KR100764388B1 (ko) | 2006-03-17 | 2006-03-17 | 양극산화 금속기판 모듈 |
KR1020060025010 | 2006-03-17 | ||
KR10-2006-0025010 | 2006-03-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101039548A CN101039548A (zh) | 2007-09-19 |
CN101039548B true CN101039548B (zh) | 2012-03-21 |
Family
ID=38517631
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007100875234A Active CN101039548B (zh) | 2006-03-17 | 2007-03-16 | 阳极氧化金属基板模块 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8058781B2 (zh) |
JP (2) | JP2007251176A (zh) |
KR (1) | KR100764388B1 (zh) |
CN (1) | CN101039548B (zh) |
TW (1) | TWI328666B (zh) |
Families Citing this family (52)
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CN101611262B (zh) * | 2007-02-16 | 2011-01-26 | 夏普株式会社 | 背光装置和使用该背光装置的平面显示装置 |
US8854595B2 (en) | 2008-03-03 | 2014-10-07 | Manufacturing Resources International, Inc. | Constricted convection cooling system for an electronic display |
US8537302B2 (en) * | 2008-06-11 | 2013-09-17 | Manufacturing Resources International, Inc. | Liquid crystal display assembly comprising an LED backlight assembly and a movable element placed behind the LED backlight assembly having a hinge to allow access to a rear portion of the LED backlight assembly |
US8773633B2 (en) | 2008-03-03 | 2014-07-08 | Manufacturing Resources International, Inc. | Expanded heat sink for electronic displays |
US8654302B2 (en) | 2008-03-03 | 2014-02-18 | Manufacturing Resources International, Inc. | Heat exchanger for an electronic display |
US8497972B2 (en) | 2009-11-13 | 2013-07-30 | Manufacturing Resources International, Inc. | Thermal plate with optional cooling loop in electronic display |
US9173325B2 (en) | 2008-03-26 | 2015-10-27 | Manufacturing Resources International, Inc. | Heat exchanger for back to back electronic displays |
US8693185B2 (en) | 2008-03-26 | 2014-04-08 | Manufacturing Resources International, Inc. | System and method for maintaining a consistent temperature gradient across an electronic display |
KR100998010B1 (ko) | 2008-04-28 | 2010-12-03 | 삼성엘이디 주식회사 | 발광소자 패키지 및 그 제조방법 |
JP2010073767A (ja) * | 2008-09-17 | 2010-04-02 | Jtekt Corp | 多層回路基板 |
US10827656B2 (en) | 2008-12-18 | 2020-11-03 | Manufacturing Resources International, Inc. | System for cooling an electronic image assembly with circulating gas and ambient gas |
US8749749B2 (en) | 2008-12-18 | 2014-06-10 | Manufacturing Resources International, Inc. | System for cooling an electronic image assembly with manifolds and ambient gas |
CN102388473A (zh) * | 2009-03-24 | 2012-03-21 | 金江 | 发光二极管封装 |
KR101092262B1 (ko) * | 2009-04-10 | 2011-12-12 | 광전자 주식회사 | 웨이퍼 가공 기법을 이용한 엘이디모듈 제조 방법 |
DE102010017711A1 (de) * | 2009-07-07 | 2011-01-13 | Siteco Beleuchtungstechnik Gmbh | Dreidimensionales LED-Trägerelement mit thermischer Leitfähigkeit |
KR101055558B1 (ko) * | 2010-01-11 | 2011-08-08 | 삼성전기주식회사 | 방열기판 및 그 제조방법 |
JP2012033853A (ja) | 2010-04-28 | 2012-02-16 | Fujifilm Corp | 絶縁性光反射基板 |
WO2012008569A1 (ja) * | 2010-07-15 | 2012-01-19 | シャープ株式会社 | 放熱板、電子機器 |
KR101321277B1 (ko) * | 2011-07-04 | 2013-10-28 | 삼성전기주식회사 | 전력 모듈 패키지 및 그 제조방법 |
CN102494259A (zh) * | 2011-12-01 | 2012-06-13 | 深圳市华星光电技术有限公司 | 液晶显示装置的led灯条及背光模组 |
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US8889517B2 (en) * | 2012-04-02 | 2014-11-18 | Jds Uniphase Corporation | Broadband dielectric reflectors for LED with varying thickness |
AT512525B1 (de) * | 2012-05-04 | 2013-09-15 | Mikroelektronik Ges Mit Beschraenkter Haftung Ab | Leiterplatte, insbesondere für ein Leistungselektronikmodul, umfassend ein elektrisch leitfähiges Substrat |
JP2014072314A (ja) * | 2012-09-28 | 2014-04-21 | Toyota Industries Corp | 半導体装置、及び半導体装置の製造方法 |
US10660245B2 (en) | 2012-10-16 | 2020-05-19 | Manufacturing Resources International, Inc. | Back pan cooling assembly for electronic display |
CN104813493A (zh) * | 2012-11-27 | 2015-07-29 | 西铁城电子株式会社 | 安装基板及使用该安装基板的发光装置 |
US9648790B2 (en) | 2013-03-15 | 2017-05-09 | Manufacturing Resources International, Inc. | Heat exchanger assembly for an electronic display |
WO2014150036A1 (en) | 2013-03-15 | 2014-09-25 | Manufacturing Resources International, Inc. | Cooling system for an electronic display |
AU2014287438B2 (en) | 2013-07-08 | 2017-09-28 | Manufacturing Resources International, Inc. | Figure eight closed loop cooling system for electronic display |
AU2015229457B2 (en) | 2014-03-11 | 2018-11-22 | Manufacturing Resources International, Inc. | Hybrid Rear Cover and Mounting Bracket for Electronic Display |
ES2733122T3 (es) | 2014-04-30 | 2019-11-27 | Mri Inc | Conjunto de pantalla electrónica adosada |
CN105848404B (zh) * | 2015-01-14 | 2019-04-19 | 南京德朔实业有限公司 | 电动工具及其电路板 |
US9723765B2 (en) | 2015-02-17 | 2017-08-01 | Manufacturing Resources International, Inc. | Perimeter ventilation system for electronic display |
CN105470378B (zh) * | 2015-12-29 | 2018-05-25 | 乐健科技(珠海)有限公司 | 高导热金属基板及其制作方法、led模组及其制作方法 |
ES2909480T3 (es) | 2016-03-04 | 2022-05-06 | Mri Inc | Sistema de refrigeración para conjunto de pantalla de doble cara |
CN108257923A (zh) * | 2016-12-29 | 2018-07-06 | 比亚迪股份有限公司 | 一种散热基板及其制备方法和应用以及电子元器件 |
CN108257929B (zh) * | 2016-12-29 | 2020-06-19 | 比亚迪股份有限公司 | 一种散热基板及其制备方法和应用以及电子元器件 |
CN108257922A (zh) * | 2016-12-29 | 2018-07-06 | 比亚迪股份有限公司 | 一种散热基板及其制备方法和应用以及电子元器件 |
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US10485113B2 (en) | 2017-04-27 | 2019-11-19 | Manufacturing Resources International, Inc. | Field serviceable and replaceable display |
US10559965B2 (en) | 2017-09-21 | 2020-02-11 | Manufacturing Resources International, Inc. | Display assembly having multiple charging ports |
US10602626B2 (en) | 2018-07-30 | 2020-03-24 | Manufacturing Resources International, Inc. | Housing assembly for an integrated display unit |
US11096317B2 (en) | 2019-02-26 | 2021-08-17 | Manufacturing Resources International, Inc. | Display assembly with loopback cooling |
US10795413B1 (en) | 2019-04-03 | 2020-10-06 | Manufacturing Resources International, Inc. | Electronic display assembly with a channel for ambient air in an access panel |
US11477923B2 (en) | 2020-10-02 | 2022-10-18 | Manufacturing Resources International, Inc. | Field customizable airflow system for a communications box |
US11470749B2 (en) | 2020-10-23 | 2022-10-11 | Manufacturing Resources International, Inc. | Forced air cooling for display assemblies using centrifugal fans |
US11778757B2 (en) | 2020-10-23 | 2023-10-03 | Manufacturing Resources International, Inc. | Display assemblies incorporating electric vehicle charging equipment |
US11966263B2 (en) | 2021-07-28 | 2024-04-23 | Manufacturing Resources International, Inc. | Display assemblies for providing compressive forces at electronic display layers |
US11919393B2 (en) | 2021-08-23 | 2024-03-05 | Manufacturing Resources International, Inc. | Display assemblies inducing relatively turbulent flow and integrating electric vehicle charging equipment |
US11744054B2 (en) | 2021-08-23 | 2023-08-29 | Manufacturing Resources International, Inc. | Fan unit for providing improved airflow within display assemblies |
US11762231B2 (en) | 2021-08-23 | 2023-09-19 | Manufacturing Resources International, Inc. | Display assemblies inducing turbulent flow |
US11968813B2 (en) | 2021-11-23 | 2024-04-23 | Manufacturing Resources International, Inc. | Display assembly with divided interior space |
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JPS5145763A (en) * | 1974-10-18 | 1976-04-19 | Hitachi Ltd | Zetsuenso ojusuru aishikairoyokinzokukiban |
JPS6260286A (ja) * | 1985-09-10 | 1987-03-16 | 松下電工株式会社 | プリント配線板 |
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JPS63107483U (zh) * | 1986-12-29 | 1988-07-11 | ||
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JP2000353826A (ja) | 1999-06-09 | 2000-12-19 | Sanyo Electric Co Ltd | 混成集積回路装置および光照射装置 |
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JP2002329822A (ja) * | 2001-04-24 | 2002-11-15 | Signality System Engineering Co Ltd | 複合要素を有する金属基板 |
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JP2004241416A (ja) * | 2003-02-03 | 2004-08-26 | Alps Electric Co Ltd | 電子回路ユニットおよびその製造方法 |
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JP2005268634A (ja) * | 2004-03-19 | 2005-09-29 | Kyoshin Kagi Kofun Yugenkoshi | 置き換え可能な発光ダイオード装置のモールディング構造 |
US7036219B2 (en) * | 2004-04-01 | 2006-05-02 | Feng Chia University | Method for manufacturing a high-efficiency thermal conductive base board |
KR100593943B1 (ko) * | 2005-04-30 | 2006-06-30 | 삼성전기주식회사 | 발광 다이오드 패키지의 제조 방법 |
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-
2006
- 2006-03-17 KR KR1020060025010A patent/KR100764388B1/ko active IP Right Grant
-
2007
- 2007-03-14 TW TW096108709A patent/TWI328666B/zh active
- 2007-03-16 CN CN2007100875234A patent/CN101039548B/zh active Active
- 2007-03-16 JP JP2007067887A patent/JP2007251176A/ja not_active Abandoned
- 2007-03-16 US US11/723,059 patent/US8058781B2/en active Active
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- 2011-05-02 JP JP2011103288A patent/JP5246970B2/ja active Active
Patent Citations (1)
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CN1608326A (zh) * | 2001-12-29 | 2005-04-20 | 杭州富阳新颖电子有限公司 | 发光二极管及其发光二极管灯 |
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Publication number | Publication date |
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JP2011193015A (ja) | 2011-09-29 |
JP2007251176A (ja) | 2007-09-27 |
CN101039548A (zh) | 2007-09-19 |
TW200809131A (en) | 2008-02-16 |
KR20070094384A (ko) | 2007-09-20 |
US20070217221A1 (en) | 2007-09-20 |
KR100764388B1 (ko) | 2007-10-05 |
JP5246970B2 (ja) | 2013-07-24 |
US8058781B2 (en) | 2011-11-15 |
TWI328666B (en) | 2010-08-11 |
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