CN101040162B - 带有具有沸腾增强作用的多重毛细结构的蒸汽室 - Google Patents

带有具有沸腾增强作用的多重毛细结构的蒸汽室 Download PDF

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CN101040162B
CN101040162B CN2005800347622A CN200580034762A CN101040162B CN 101040162 B CN101040162 B CN 101040162B CN 2005800347622 A CN2005800347622 A CN 2005800347622A CN 200580034762 A CN200580034762 A CN 200580034762A CN 101040162 B CN101040162 B CN 101040162B
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CN101040162A (zh
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萧永铭
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
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    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433Auxiliary members in containers characterised by their shape, e.g. pistons
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

本发明涉及一种带有具有沸腾增强作用的多重毛细结构的蒸汽室。传热装置包括蒸汽室,该蒸汽室具有可冷凝流体和与热源相耦合的蒸发区。在该蒸汽室内有沸腾增强作用的多重毛细结构。

Description

带有具有沸腾增强作用的多重毛细结构的蒸汽室
相关申请的相互引用
本申请要求发明人萧永铭于2004年12月1日提交的第60/632,704号美国专利申请的优先权并将其引入作为参考。
技术领域
本发明涉及一种传热装置,更具体地涉及用于传热装置的带有具有沸腾增强作用的多重毛细结构的蒸汽室。
背景技术
冷却或热去除已成为电子工业主要的障碍之一。随着集成度的增加,高性能的需求,以及多功能的应用,热消散也不断地增加。高性能传热装置的开发已经成为该工业的主要发展方向之一。
散热器经常用于将热从装置或者从系统排除至周围环境。散热器的性能是以热阻来表征,具有较低的热阻值代表具有较高的性能水平。散热器的热阻一般是由散热器内部的扩散热阻以及散热器表面和周围环境之间的对流热阻所组成。为将扩散热阻最小化,通常使用诸如铜和铝等高导热材料来制造散热器。不过,这种固体扩散机理已经不能满足新一代电子器件的更高的冷却要求。因此,已开发并评估了更高效的机制,其中蒸汽室是经常被考虑的机制之一。
蒸汽室是利用热管原理,让热由蒸发的工作流体携带,并由蒸汽流动来散布。最后蒸汽在低温的表面上冷凝,因而将热由蒸发表面(和热源间的界面)分布至冷凝表面(冷却的表面)。如果冷却表面的面积比蒸发表面的面积大很多,则由于相变(液体-蒸汽-液体)机理是在近等温条件下发生,可有效地实现热的散布。
发明内容
本发明的目的是提供了用于热去除/冷却应用的高性能蒸汽装置。该蒸汽装置的总体性能取决于参与蒸汽-液体循环(热散布机理(heat spreading mechanism))的每个组件的性能以及冷却端所涉及的装置的性能(对流机理)。为了具有高性能,必须实现两种机理。
蒸汽-冷凝循环包括冷凝液流动、沸腾、蒸汽流动以及冷凝的过程。在另一待审的专利申请中,我已经公开使用多重毛细(Multi-Wick,MW)结构,以改进蒸汽室内的冷凝液流动(美国专利申请号10/390773,将其引入作为参考)。具体而言,蒸汽室的尺寸与高热通量需求的结合产生一假象,即需要具有高毛细作用力(wicking-power)但同时又能提供足够升力(lift)的毛细结构(wicking structrue),以符合该装置的尺寸。通常能维持高流速并提供大的升力的毛细结构需要昂贵的加工工艺。实际上,只有加热(沸腾)区有高的毛细作用力需求,且该毛细作用力的需求随着离加热区的距离增加而降低。这是因为在热通量显著降低时发生冷凝,而且只有在冷凝液汇聚的蒸发区上必须维持高的冷凝液流速。因此,该毛细结构(称为多重毛细结构)可根据空间流速的需求而不同,以便更好地平衡作用于液体的力(毛细力、粘滞力和重力)。
由于当冷凝液接近沸腾区时将发生沸腾,因而本发明的目的是公开适于减少沸腾过热(沸腾表面和蒸汽间的温度差)的多重毛细结构。突出(protruded)的沸腾结构通常用于池型沸腾(poolboiling)中以减少沸腾过热。但是,由于液体池的长度通常比突出结构的长度大,因此该突出结构一般都全部浸没在液体池(液体池型沸腾)内。此外,当接近加热区的液体沸腾时,相邻的液体经由重力机制取代该液体。以蒸汽室来说,这不但阻止其以反重力方向运作,而且需要该室的一部分完全充满液体,这可能干扰蒸汽和/或冷凝液的流动过程。
在本发明中,通过具有沸腾增强作用(Boiling-Enhanced)的多重毛细结构(BEMW),使蒸汽室具有沸腾增强特征。借助该BEMW结构,使用具有空间变化的毛细作用力的毛细结构由冷凝区收集冷凝液,其中加热区(沸腾区)内的多种沸腾增强结构适于同时提供毛细作用力和沸腾增强。以此方式,该沸腾增强结构不会被完全浸没在液体池中,因此可在反重力方向运作。另外,该沸腾增强结构也可作为3-D桥连毛细物(wick),该结构可能提供或不提供结构支撑功能。在这种概念下,具有沸腾增强作用的多重毛细结构的某些方面可被认为是早期公开的多重毛细结构的亚类。
沸腾增强(BE)结构是突出的毛细物,该毛细物的毛细作用力比在冷凝位置更大。该突出的毛细物可以是鳍片(fin)形式,以便将液体在鳍片间由毛细作用运送向该鳍片顶端。除鳍片以外,该突出的毛细物也可以是针栅阵列(pin array)。鳍片之间或针栅之间的互连结构还可用来增加沸腾表面积。泡沫/多孔结构也能用在突出的毛细物中,以提供更大的沸腾表面积。在所有这些结构中,目的是提供从热源到较大沸腾表面的热传导途径,并用由复杂的毛细系统连续提供的冷凝液浸透该沸腾表面(没有完全浸没)。
为了能具有更多的灵活性并控制毛细作用力,可由多层(ML)结构来产生BEMW结构的部分结构,该多层结构是由相互叠置的多层材料组成。每一层不一定必须相同,且该毛细结构可以是联合起作用的多层结构的结果。例如,穿孔的多层铜片可配置于未开槽的铜表面上以形成带沟槽的毛细结构(groove wickingstructure)。类似地,铜板可配置于开槽的铜表面上可形成毛细芯(capillary wick)。因此,该多层毛细结构可通常由穿孔的板、开槽的板、网状层(mesh layer)、烧结层、实心板或上述材料的任意组合所组成。此外,每一层的图案可以具有空间变化特性,包含变化的穿孔图案,变化的狭缝间隔和/或方向,变化的孔隙率,变化的孔径,变化的网目尺寸以及上述特性的任何组合。
所述蒸汽室可根据不同应用以不同的形式实施。最简单的实施形式是平板状热散布器(flat heat-spreader),在该热散布器中,将来自热源的热量散布到其它端,该其它端可以与鳍片或其它冷却系统存在接触。另一形式是散热器(heat sink),在该散热器中,所述蒸汽室的一部分可以与实心鳍片存在热接触,或者该蒸汽室可以由功能性连接的基底室和鳍片室组成。在后一形式中,另外的实心鳍片可与部分鳍片室存在接触,以将对流表面最大化。对于有空间约束的应用来说,所述蒸汽室可以是夹在印刷电路板(特别对于子板)上的夹子(蒸汽夹(Vaporclip))形式。所述蒸汽室也可以箱(casing)(蒸汽箱(Vaporcase))的形式实施,电子器件可功能性配置于该箱内。另外,所述蒸汽室可以柜(cabinet)的形式实施,蒸汽箱可功能性配置于该柜内。
由于高度改进了内热阻,还必须改进对流热阻;否则总体性能仍然会被对流热阻所限制。鳍片结构可以从平板状鳍片、针状鳍片、穿孔的鳍片和多孔鳍片等形式变化。鳍片和蒸汽室间的界面呈功能性接触。将所述鳍片结构与所述蒸汽室连接的方法可以是使用或不使用粘接材料的任何方法。没有涉及粘接材料的方法可以是扩散结合(diffusive bonding)、焊接(welding),或者本领域中公知的任何结合方法。使用粘接材料的结合方法可以是粘合剂结合(adhesive bonding)、软焊(soldering)、硬焊(brazing)、焊接,或者本领域中公知的任何结合方法。另外,所述方法也可以是上述方法的组合。为了更好的功能接触,可在鳍片的结合位置使用“J”腿,以产生更好的结合质量和接触面积。
此外,根据应用的不同,冷却介质可以是空气、水或制冷剂。对于液体冷却,与蒸汽室进行热交换的部分可以是开口壳型(open shell type)、串联流动型(serial flow type)、并联流动型(parallel flow type)或上述形式的任意组合。
根据不同的应用需求与约束,所述蒸汽室可以用金属、塑料和/或复合材料制成。所述蒸汽室表面也可以与不同的材料存在功能性接触,该不同的材料例如塑料、金属涂层(metal coating)、石墨层、金刚石、碳-纳米管(carbon-nanotube)和/或本领域公知的任何高导热材料。
附图说明
图1A为平板状蒸汽室实施例的侧面剖视图。
图1B为平板状蒸汽室实施例的剖视图。
图1C为与基本毛细物集成的沸腾增强结构的示意图。
图1D为与蒸汽室底板集成的沸腾增强结构的示意图。
图2A为平板鳍片型沸腾增强结构的等轴视图。
图2B为针状鳍片型沸腾增强结构的等轴视图。
图2C为具有突出物的平板鳍片型沸腾增强结构的等轴视图。
图2D为多孔型沸腾增强结构的等轴视图。
图3A为具有延伸的沸腾增强结构的平板状蒸汽室的侧面剖视图。
图3B为具有部分延伸的沸腾增强结构的平板状蒸汽室的侧面剖视图。
图4A为具有沸腾增强作用的多重毛细结构的多层结构实施例的等轴视图。
图4B为由多层结构形成的毛细通道(capillary channel)的剖视图。
图5A为由多层结构形成的深沟槽结构的剖视图。
图5B为由多层结构形成的不规则沟槽结构的剖视图。
图6A为具有空间变化狭缝和穿孔图案的多层毛细结构的等轴视图。
图6B为具有适于液体流动的毛细平面的多层毛细结构的剖面侧视图。
图6C为具有钉状特征的平板的等轴视图。
图7A为应用网状结构的多层毛细结构的剖视图。
图7B为应用烧结层的多层毛细结构的剖视图。
图8为以散热器形式实施的蒸汽室的剖视图。
图9为具有实心鳍片和鳍片室的蒸汽散热器的等轴视图。
图10为具有水平方向的实心鳍片的蒸汽散热器的等轴视图。
图11为仅具有实心鳍片的蒸汽散热器的侧视图。
图12为具有交错的鳍片结构的蒸汽散热器的等轴视图。
图13为具有可变间隔的鳍片结构的蒸汽散热器的等轴视图。
图14为具有穿孔的鳍片的蒸汽散热器的侧视图。
图15A为具有带流体-偏转结构的鳍片的蒸汽散热器的侧视图。
图15B为具有流动-偏转板的鳍片的等轴视图。
图16为显示具有J腿的鳍片的图示。
图17为具有针状鳍片的蒸汽散热器的等轴视图。
图18为具有多孔块状(porous block)结构的蒸汽散热器的等轴视图。
图19A为箱型的蒸汽室实施例的剖面侧视图。
图19B为热管组合件的图示。
图20A为具有鳍片室的蒸汽箱的等轴视图。
图20B为具有实心鳍片的蒸汽箱的等轴视图。
图21为柜型的蒸汽室实施例的剖面侧视图。
图22为夹子形式的蒸汽室实施例的侧视图。
图23A为外壳型液体冷却构形的等轴视图。
图23B为串联流动的液体冷却构形的等轴视图。
图23C为并联流动的液体冷却构形的等轴视图。
图23D为具有液体冷却管的蒸汽室的等轴视图,该液体冷却管穿入该室内。
图23E为显示在蒸汽室内部的液体冷却管的等轴视图。
图24为用聚合物/复合材料制成的蒸汽室的等轴视图。
具体实施方式
图1说明平板状蒸汽室100的实施例,该蒸汽室由底板111、顶板112、四片侧壁113、基本毛细结构121,以及沸腾增强结构130组成。当热量由热源(电子设备)101注入时,由沸腾增强结构130产生蒸汽。由于沸腾(BE)结构130以垂直于蒸汽室底板111的方向将液体向上拉(由基本毛细结构121朝向BE结构130的顶部),沸腾表面的面积增加,从而蒸发量增加且沸腾热通量降低。因此,可以减少沸腾过热。此BE结构130可以是基本毛细结构121的集成部分(如图1C所示),或是底板111的集成部分(如图1D所示)。另一方面,BE结构130也能作为附加组件来附着安装。BE结构130的尺寸可以小于,大于,或者与热源101的尺寸相同。BE结构130可以是平板状鳍片131(图2A),针状鳍片132(图2B),具有突出物133的平板状鳍片131(如图2C),或是导热的多孔/泡沫结构134(图2D)。BE结构130可以全部与顶板112存在功能性接触131(图3A),以便提供3-D桥连毛细功能并使冷凝液从顶板112直接流动。或者,如图3B所示,仅BE结构131的一部分130可以与顶板112存在功能性接触135。
为了具有更多的灵活性并控制毛细作用力,部分BEMW结构可以通过多层(ML)结构来制造。图4显示一多层结构,其中实心板270配置于沟槽底板280上,以产生毛细通道281(图4B)。此实心板270具有开口,以容纳BE结构130(图4A)。通过堆栈多层的板,可形成不同的毛细通道或沟槽。图5A显示具有大的深度与宽度比例的沟槽201,可通过在板220上方堆栈三片具有狭缝221的板220而形成沟槽201。类似地,可以通过在两片相同的具有较宽狭缝221的板220上方堆栈一片具有较窄狭缝231的板230而形成具有不规则截面的不规则沟槽201。参照图6,具有空间变化图案的狭缝241和穿孔242的板240可以用来制造多重毛细结构的部分结构,通过产生通道241,能使汇聚的液体流动并允许蒸汽由242逸出。钉状特征211(图6C)也可以与堆垛的板240一起使用,形成薄的毛细平面(thin capillary plane)202,以进一步提供对毛细作用力的控制。除了板以外,多层结构也可以使用网状结构250(图7A)或者烧结层260(图7B)。
蒸汽室可以用不同的形式实施,以满足不同应用的需求。除了图1A的平面热散布器形式以外,也可以采取散热器400(图8)的形式,在图8中,基底室410与鳍片室440存在功能性接触。与图1A类似,BE结构430可配置于底板411上,以及基本毛细结构421可配置于剩下的表面上,一起形成具有沸腾增强作用的多重毛细结构。因为在鳍片室440内的蒸汽腔441不能太狭窄(蒸汽阻力),因此(对于特定的几何约束来说)限制了可允许的鳍片室数目。为进一步增加总的对流表面积,实心鳍片450可以和鳍片室440一起使用,如图9所示。这些实心鳍片可以用于不同的方向(图10),以便将传热系数最大化。实心鳍片可以是简单的平板型鳍片450(图11)、交错的平板型鳍片455(图12)、具有可变间距454的交错的平板型鳍片455(图13)、穿孔451的鳍片(图14)、具有流动偏转结构452的鳍片(图15)以促进冲撞/湍流效应、具有J腿453的鳍片以增加结合效率(图16)、针状鳍片460(图17)和/或为多孔块状470(图18)。
除了散热器形式400(图8)以外,蒸汽室可以箱500(图19和20)、柜600(图21)或者夹子700(图22)的形式实施。对于箱型500(图19A),可以有需要被冷却并可安装在印刷电路板504上的多个电子组件501、502、503。印刷电路板可功能性地配置在箱500的底部505上。需要被冷却的组件可以如电子组件501与蒸汽室510的基板511直接接触,或者通过其它传导介质581与蒸汽室510的基板511存在功能性接触,或者也可通过其它热管组合件580与蒸汽室510的基板511存在功能性接触,热管组合件580可由热管584以及和热管584功能性耦合的传导介质582和583组成(图19B)。所有的耦合面(内部组件耦合或外部耦合)可涉及热界面物质(thermal interfacial material)以确保良好的功能性接触。另外,用于箱型的鳍片可以是鳍片室540(图20A)或是实心元件550(图20B)。将在所述组件和箱之间的相同应用实施到另一个系统(箱和柜),可以采用柜型。如图21所示,蒸汽箱500可功能性地配置于蒸汽柜600的架子621上。通过另一蒸汽室690,可实现与箱的蒸汽室610的功能性耦合。实心-块-热管组合件680也可以用于这样的功能性耦合,组合件680可由实心块682、683和热管684组成。最后,蒸汽室可采取夹子700的形式实施(图22),在夹子中,蒸汽室(夹子形式)710与电子组件701和/或印刷电路板704存在功能性接触。鳍片750可以和蒸汽室710存在功能性接触,以增加总的对流表面积。
除空气以外,冷却介质还可以是液体(例如水或制冷剂),其以具有入口711和出口712的外壳710形式,将来自蒸汽室400的热量去除,或者以液体冷却管的形式将来自蒸汽室400的热量去除,该液体冷却管以串联(图23B)或并联(图23C)方式与鳍片结构存在功能性接触。或者如图23D中,液体冷却管713可穿入蒸汽室400,直接将来自蒸汽室400内的热量去除。管713(图23E)的表面可以具有毛细物,例如沟槽,以便使冷凝的液体更顺畅地流回蒸发区。
蒸汽室800(图24)可以用金属材料,聚合物和/或复合材料制成。如果来自热源的热通量很高,可引入高导热材料890作为基底室810的分离部件。如果使用聚合物,金属涂层或者本领域中的任何其它材料可配置于内表面,以避免蒸汽和/或空气渗漏。为更进一步改进蒸汽室的传热性能,外部的高导热材料涂层可应用于基底室和/或鳍片室(未显示)。该涂层可以是石墨、金属、金刚石、碳-钠米管或者本领域中公知的任何材料。
已描述了多个实施方案。然而,可以理解在不偏离本发明的精神和范围的情况下可进行多种修改。因此,其它示例性实施方案在所附的权利要求范围内。

Claims (22)

1.传热装置,包括:
至少一个含有可冷凝流体的蒸汽室,所述至少一个蒸汽室包括蒸发区,所述蒸发区配置为与热源耦合以便蒸发所述可冷凝流体,将已蒸发的所述可冷凝流体以冷凝液的形式收集在所述至少一个蒸汽室内的表面上;以及
具有沸腾增强作用的多重毛细结构,包含配置于所述至少一个蒸汽室内的多个互相连接的毛细结构,其使所述冷凝液容易流向所述蒸发区并减少相关的沸腾过热,
其中所述具有沸腾增强作用的多重毛细结构具有空间变化的毛细结构,其根据所述冷凝液流向所述蒸发区过程中所述冷凝液的空间流动需求而变化。
2.如权利要求1所述的传热装置,其中所述具有沸腾增强作用的多重毛细结构的至少一部分是通过多层结构形成的,所述多层结构包含如下的至少一种:板、所述至少一个蒸汽室的表面内的至少一个沟槽、烧结层以及多孔层。
3.如权利要求2所述的传热装置,其中所述多孔层包括网。
4.如权利要求1所述的传热装置,其中所述具有沸腾增强作用的多重毛细结构包括如下的至少一种:至少一个鳍片、至少一个针栅、板、网、所述至少一个蒸汽室的表面内的沟槽、粉末毛细物以及泡沫毛细物。
5.如权利要求1所述的传热装置,其中所述空间变化的毛细结构包括数量随空间变化的毛细结构。
6.如权利要求1所述的传热装置,其中所述具有沸腾增强作用的多重毛细结构包括至少一个毛细结构桥,所述毛细结构桥使所述具有沸腾增强作用的多重毛细结构的多个部分互相连接,以便使所述冷凝液容易在所述具有沸腾增强作用的多重毛细结构的所述多个部分之间流动。
7.如权利要求6所述的传热装置,其中所述毛细结构桥包含用于所述至少一个蒸汽室的内部支撑结构。
8.如权利要求1所述的传热装置,其中所述具有沸腾增强作用的多重毛细结构包括具有可变孔隙率的毛细结构。
9.如权利要求1所述的传热装置,其中所述至少一个蒸汽室的某些部分与至少一个鳍片存在功能性接触。
10.如权利要求9所述的传热装置,其中所述至少一个蒸汽室包括基底室与鳍片室。
11.如权利要求10所述的传热装置,其中所述至少一个鳍片与所述鳍片室存在功能性接触。
12.如权利要求1所述的传热装置,其中所述至少一个蒸汽室具有基本上呈夹子形的构形。
13.如权利要求1所述的传热装置,其中所述至少一个蒸汽室形成箱型罩的一部分。
14.如权利要求1所述的传热装置,其中所述至少一个蒸汽室形成柜型罩的一部分。
15.如权利要求1所述的传热装置,其中所述至少一个蒸汽室与冷却液存在功能性接触。
16.如权利要求1所述的传热装置,其中所述至少一个蒸汽室的部分结构是由如下材料中的至少一种制成:金属、塑料、金属包被的塑料、石墨、金刚石以及碳-纳米管。
17.如权利要求1所述的传热装置,其中所述至少一个蒸汽室包括内部支撑结构,以避免所述至少一个蒸汽室坍塌。
18.如权利要求6所述的传热装置,其中所述桥连结构由如下的至少一种组成:鳍片、针栅、鳍片或针栅之间的互连结构和多孔结构;以及其中所述桥连结构的至少一部分足够接近于一部分的所述冷凝表面,以便能够使冷凝液功能性返回。
19.如权利要求18所述的传热装置,其中所述多孔结构包括泡沫和网。
20.传递来自热源的热量的方法,包括:
在热装置内接受来自热源的热量,所述热装置包含:
至少一个含有可冷凝流体的蒸汽室,所述至少一个蒸汽室包括蒸发区,所述蒸发区配置为与所述热源耦合;以及
具有沸腾增强作用的多重毛细结构,包含配置于所述至少一个蒸汽室内的多个互相连接的毛细结构,其用于使所述冷凝液容易流向所述蒸发区,并且降低相关的沸腾过热,
其中所述具有沸腾增强作用的多重毛细结构具有空间变化的毛细结构,其根据所述冷凝液流向所述蒸发区过程中所述冷凝液的空间流动需求而变化;以及
蒸发在所述至少一个蒸汽室中的所述可冷凝流体,将已蒸发的所述可冷凝流体以冷凝液的形式收集在所述至少一个蒸汽室内的表面上。
21.如权利要求20所述的方法,其中所述具有沸腾增强作用的多重毛细结构的至少一部分是通过多层结构形成的,所述多层结构包含如下的至少一种:板、所述至少一个蒸汽室的表面内的至少一个沟槽、烧结层以及多孔层。
22.如权利要求21所述的方法,其中所述多孔层包括网。
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HK1106576A1 (en) 2008-03-14
WO2006058494A1 (en) 2006-06-08
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