CN101183156B - Manufacturing method of colourful optical filter - Google Patents
Manufacturing method of colourful optical filter Download PDFInfo
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- CN101183156B CN101183156B CN200610148615A CN200610148615A CN101183156B CN 101183156 B CN101183156 B CN 101183156B CN 200610148615 A CN200610148615 A CN 200610148615A CN 200610148615 A CN200610148615 A CN 200610148615A CN 101183156 B CN101183156 B CN 101183156B
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Abstract
The present invention provides the manufacturing method of a color filter. The method is as follows: a composite layer with the incompact structure is formed firstly; then the composite layer with theincompact structure is patterned; finally, a further treatment step is conducted, so the structure of the pattern composite layer with the incompact structure is compacted and the color filter is formed.
Description
Technical field
The present invention relates to a kind of semiconductor technology method, relate in particular to a kind of manufacturing method of color filters.
Background technology
Social now multimedia technology is quite flourishing, is indebted to the progress of semiconductor element or display device mostly.With regard to display, have that high image quality, space utilization efficient are good, the LCD of low consumpting power, advantageous characteristic such as radiationless becomes the main flow in market gradually.
LCD is made of display panel and backlight module, and wherein display panel comprises active array display base plate and colored filter.Colored filter is in order to the light that backlight module sent is filtered, and makes LCD have full-color function.
Colored filter can be divided into the optical filter and the optical filter with lamination layer structure of single rete usually.In general, the optical filter with lamination layer structure is to interlock by the rete with different refractivity to be formed by stacking, to reach the purpose that specific wavelength is filtered.Usually, the optical characteristics of composite bed is required as if meeting, and the temperature of its making is usually more than 150 degree Celsius.Yet, the composite bed that under hot environment, forms, its compact structure is difficult to etching, and the thickness of composite bed up to
(800nm), its etch-rate is low excessively, often makes etch process expend the too much time, has a strong impact on production capacity.
Summary of the invention
The purpose of this invention is to provide a kind of manufacturing method of color filters, it has required optical characteristics as the compact structure of the composite bed of optical filter, and is easy to etching, can shorten etching period effectively.
The present invention proposes a kind of manufacturing method of color filters, and the method is to form a composite bed earlier under lower temperature, and this loose composite bed of etch structures, then, carries out an annealing process again under higher temperature.
Described according to the embodiment of the invention, above-mentioned lower temperature is higher than 0 degree Celsius and is lower than 150 degree Celsius.Above-mentioned higher temperature be Celsius 300 the degree to 900 the degree, or Celsius 300 the degree to 400 the degree.
Described according to the embodiment of the invention, the employed gas of above-mentioned annealing process be selected from group that nitrogen, nitrogen and hydrogen, ammonia, ammonia and hydrogen forms one of them.The time of annealing process is 10 minutes to 4 hours.
Described according to the embodiment of the invention, above-mentioned composite bed comprises by titanium oxide layer and the silicon oxide layer stack layer, tantalum pentoxide layer and the silicon oxide layer that the form stack layer that the stack layer that forms or zinc sulfide layer and magnesium fluoride layer be staggeredly stacked and form that is staggeredly stacked that is staggeredly stacked.
The present invention proposes a kind of manufacturing method of color filters again, the method is to form loosely organized composite bed on substrate, then, the composite bed that etch structures is loose is to form a patterning composite bed, afterwards, carry out a treatment step again, so that the compact structureization of patterning first composite bed forms an optical filter, the loose composite bed of said structure is to form under a lower temperature; And treatment step is to carry out under a higher temperature.
Described according to the embodiment of the invention, above-mentioned lower temperature is higher than 0 degree Celsius and is lower than 150 degree Celsius.Above-mentioned higher temperature be Celsius 300 the degree to 900 the degree, or Celsius 300 the degree to 400 the degree.
Described according to the embodiment of the invention, above-mentioned treatment step comprises an annealing process.The employed gas of annealing process be selected from group that nitrogen, nitrogen and hydrogen, ammonia, ammonia and hydrogen forms one of them.The time of annealing process is 10 minutes to 4 hours.
Described according to the embodiment of the invention, the loose composite bed of said structure comprises titanium oxide layer and the silicon oxide layer stack layer, tantalum pentoxide layer and the silicon oxide layer that the form stack layer that the stack layer that forms or zinc sulfide layer and magnesium fluoride layer be staggeredly stacked and form that is staggeredly stacked that is staggeredly stacked.
The present invention reintroduces a kind of manufacturing method of color filters.The method is to form the first loosely organized composite bed on substrate, and with its etching, to form a patterning first composite bed.Afterwards, on substrate, forming patterning second composite bed and patterning the 3rd composite bed according to said method.Afterwards, carry out a treatment step, so that the compact structureization of patterning first composite bed, patterning second composite bed and patterning the 3rd composite bed, forming one first optical filter, one second optical filter and one the 3rd optical filter respectively, loose first composite bed, second composite bed and the 3rd composite bed of said structure is to form under a lower temperature; And treatment step is to carry out under a higher temperature.
Described according to the embodiment of the invention, above-mentioned lower temperature is higher than 0 degree Celsius and is lower than 150 degree Celsius.Higher temperature is that 300 degree Celsius to 900 degree or Celsius 300 are spent to 400 degree.
Described according to the embodiment of the invention, above-mentioned treatment step comprises an annealing process.The employed gas of annealing process be selected from group that nitrogen, nitrogen and hydrogen, ammonia, ammonia and hydrogen forms one of them.The time of annealing process is 10 minutes to 4 hours.
Described according to the embodiment of the invention, loose first composite bed of said structure, loosely organized second composite bed and loosely organized the 3rd composite bed be respectively red rete, green rete or blue rete one of them.
Described according to the embodiment of the invention, loose first composite bed of said structure, loosely organized second composite bed and the 3rd loosely organized composite bed comprise titanium oxide layer and the silicon oxide layer stack layer, tantalum pentoxide layer and the silicon oxide layer that the form stack layer that the stack layer that forms or zinc sulfide layer and magnesium fluoride layer be staggeredly stacked and form that is staggeredly stacked that is staggeredly stacked respectively.
Because lamination layer structure is comparatively loose, when carrying out patterning, is easy to etching, therefore, the present invention can promote etched speed, shortens the time of technology.After etch process, the annealing process that is carried out then can reach required material behavior so that the structure of composite bed becomes comparatively fine and close.
For above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.
Description of drawings
Fig. 1 is the manufacturing process sectional view of the colored filter that illustrates according to the embodiment of the invention;
Fig. 2 A to Fig. 2 G is the manufacturing process sectional view of the colored filter that illustrates according to the embodiment of the invention.
The main element symbol description
100～106: step
200: substrate
202,206,212: composite bed
202a, 206a, 212a: patterning composite bed
202b, 206b, 212b: optical filter
204,208,214: patterning photoresist layer
Embodiment
Please refer to Fig. 1, manufacturing method of color filters of the present invention is earlier to form the comparatively loose composite bed of structure, step 102 under a lower temperature.Then, step 106 under higher temperature, is carried out a treatment step again, for example is an annealing process, so that the structure of composite bed becomes comparatively closely knit, forms needed colored filter.The composite bed that structure is comparatively loose for example is by titanium oxide layer and the silicon oxide layer stack layer, tantalum pentoxide layer and the silicon oxide layer that the form stack layer that the stack layer that forms or zinc sulfide layer and magnesium fluoride layer be staggeredly stacked and form that is staggeredly stacked that is staggeredly stacked.The temperature of its formation for example is to be higher than 0 degree Celsius and to be lower than 150 degree Celsius.Preferably annealing process is to spend between the 100 Celsius 0.Annealing process can reduce the suspension key (dangling bond) in the structure, makes structure become comparatively closely knit.The temperature of annealing process is different according to the field of colored filter application.In one embodiment, the technology of colored filter is to belong to FEOL, and then Tui Huo temperature for example is about 300 degree Celsius are spent to 900.In another embodiment, the technology of colored filter is to belong to last part technology, and then Tui Huo temperature for example is about 300 degree Celsius are spent to 400.The employed gas of annealing process be selected from group that nitrogen, nitrogen and hydrogen, ammonia, ammonia and hydrogen forms one of them.The time of annealing is 10 minutes to 4 hours.
Please refer to Fig. 1, when using, the step 104 of etching composite bed can be arranged in after the step 102 that forms loose composite bed, carries out implementing before the annealing process step 106.Because loosely organized composite bed is easy to etching, therefore, the etch-rate of composite bed can significantly promote.In one embodiment, the etch-rate of loose composite bed be 1600 dusts/minute, its with respect to the etch-rate that has formed composite bed under higher temperature now be 1400 dusts/minute, obviously promoted 15%.
Through experimental results show that, though the spectral characteristic at formed loose composite bed under the environment of lower temperature is different with the spectrum that has formed composite bed under higher temperature now, but, after carrying out etch process, the annealing process that is carried out really can be so that the spectral characteristic of final formed composite bed with to have the spectrum of formed composite bed under higher temperature now roughly the same, and can promote its transmittance for specific wavelength.In one embodiment, composite bed is after annealing, and its transmittance for specific wavelength can rise to 99.7% by 99.1%.
Colored filter of the present invention can be used for making Infrared optical filter (infrared filter), uv filter (ultraviolet filter), RGB colored filter (color filter) or CYM colored filter.Below only illustrate, but it is not in order to restriction the present invention with the RGB colored filter.
Fig. 2 A～Fig. 2 G is the making flow process sectional view according to the colored filter that the embodiment of the invention illustrated.At first, please refer to Fig. 2 A, substrate 200 is provided, substrate 200 for example is a silicon substrate, and has been formed with the semiconductor element of generally knowing (not illustrating) on the substrate 200.Then, under a lower temperature, for example be to be higher than 0 degree Celsius and to be lower than 150 degree Celsius, form the comparatively loose composite bed 202 of structure.This composite bed 202 can be to be staggeredly stacked with the rete that physical vaporous deposition or chemical vapour deposition technique will have a different refractivity to form the stack layer that thickness is about 8000 dusts.For instance, composite bed 202 for example is with the order of low-refraction to high index of refraction, and each rete is repeated to be formed on the substrate 200 in regular turn.Perhaps, in another embodiment, composite bed 202 also can be with the order of high index of refraction to low-refraction, and each rete is repeated to be formed on the substrate 200 in regular turn.Composite bed 202 for example is by titanium oxide layer and the silicon oxide layer stack layer, tantalum pentoxide layer and the silicon oxide layer that the form stack layer that the stack layer that forms or zinc sulfide layer and magnesium fluoride layer be staggeredly stacked and form that is staggeredly stacked that is staggeredly stacked.Composite bed 202 can be as red rete, green rete or blue rete one of them.In this embodiment, for red rete it is described with composite bed 202.
Then, please refer to Fig. 2 B, composite bed 202 is carried out Patternized technique, to form patterning composite bed 202a.Patternized technique is to form patterning photoresist layer 204 earlier on composite bed 202, then, carries out etch process with composite bed 202 patternings.Etch process for example is that the mixed gas formed with CFC or fluorocarbons and chlorine is as etching gas.
Then, please refer to Fig. 2 C, remove patterning photoresist layer 204.The method that removes photoresist layer 204 for example is the oxygen plasma ashing method.Then, on substrate 200, form the comparatively loose composite bed 206 of structure.Composite bed 206 for example is green rete, and the selection of its formation method and material can repeat no more in this with reference to above-mentioned composite bed.Then, on composite bed 206, form patterning photoresist layer 208, to cover the predetermined position that forms green color filter.
Then, please refer to Fig. 2 D, composite bed 206 is carried out etch process, to form patterning composite bed 206a.Etch process for example is that the mixed gas formed with CFC or fluorocarbons and chlorine is as etching gas.Then, remove patterning photoresist layer 208.The method that removes photoresist layer 208 for example is the oxygen plasma ashing method.
Then, please refer to Fig. 2 E, on substrate 200, form the comparatively loose composite bed 212 of structure.Composite bed 212 for example is blue rete, and the selection of its formation method and material can repeat no more in this with reference to above-mentioned composite bed.Then, on composite bed 212, form patterning photoresist layer 214, to cover the position of preboarding au bleu optical filter.
Afterwards, please refer to Fig. 2 F, composite bed 212 is carried out etch process, to form patterning composite bed 212a.Etch process for example is that the mixed gas formed with CFC or fluorocarbons and chlorine is as etching gas.Then, remove patterning photoresist layer 214.The method that removes photoresist layer 214 for example is the oxygen plasma ashing method.
Thereafter, please refer to Fig. 2 G, in the environment of higher temperatures, above-mentioned patterning composite bed 202a, 206a and 212a are carried out a treatment step, as annealing process, so that patterning composite bed 202a, 206a and 212a become structure comparatively fine and close optical filter 202b, 206b and 212b.When making filter technology is when belonging to last part technology, and the temperature of annealing for example is that 300 degree Celsius are to 900 degree.In another embodiment, making filter technology is to belong to FEOL, and then Tui Huo temperature for example is that 300 degree Celsius are to 400 degree.The employed gas of annealing process be selected from group that nitrogen, nitrogen and hydrogen, ammonia, ammonia and hydrogen forms one of them.The time of annealing is 10 minutes to 4 hours.
Special one carry be the production order of Red lightscreening plate, green color filter and blue color filter and non-limiting same as the previously described embodiments, visual demand and change order voluntarily.
Claims (15)
1. manufacturing method of color filters comprises:
On substrate, form loosely organized composite bed;
This this loosely organized composite bed of etching is to form the patterning composite bed; And
Carry out annealing process, so that the compact structureization of this patterning composite bed forms optical filter,
Wherein this this loosely organized composite bed is to form under the lower temperature and this annealing process is to carry out under higher temperature.
2. manufacturing method of color filters as claimed in claim 1, wherein this lower temperature is higher than 0 degree Celsius and is lower than 150 degree Celsius.
3. manufacturing method of color filters as claimed in claim 1, wherein this higher temperature is that 300 degree Celsius are to 900 degree.
4. manufacturing method of color filters as claimed in claim 1, wherein this higher temperature is that 300 degree Celsius are to 400 degree.
5. manufacturing method of color filters as claimed in claim 1, wherein the employed gas of this annealing process be selected from group that nitrogen, nitrogen and hydrogen, ammonia, ammonia and hydrogen forms one of them.
6. manufacturing method of color filters as claimed in claim 1, wherein the time of this annealing process is 10 minutes to 4 hours.
7. manufacturing method of color filters as claimed in claim 1, wherein this this loosely organized composite bed comprises titanium oxide layer and the silicon oxide layer stack layer, tantalum pentoxide layer and the silicon oxide layer that the form stack layer that the stack layer that forms or zinc sulfide layer and magnesium fluoride layer be staggeredly stacked and form that is staggeredly stacked that is staggeredly stacked.
8. manufacturing method of color filters comprises:
On substrate, form the first loosely organized composite bed;
This this loosely organized first composite bed of etching is to form patterning first composite bed;
On this substrate, form the second loosely organized composite bed;
This this loosely organized second composite bed of etching is to form patterning second composite bed;
On this substrate, form the 3rd loosely organized composite bed;
This 3rd loosely organized composite bed of etching is to form patterning the 3rd composite bed; And
Carry out annealing process, so that the compact structureization of this patterning first composite bed, this patterning second composite bed and this patterning the 3rd composite bed, forming first optical filter, second optical filter and the 3rd optical filter respectively,
Wherein this this loosely organized first composite bed, this second loosely organized composite bed and this 3rd loosely organized composite bed are to be to carry out under higher temperature at formation and this annealing process under the lower temperature.
9. manufacturing method of color filters as claimed in claim 8, wherein this lower temperature is higher than 0 degree Celsius and is lower than 150 degree Celsius.
10. manufacturing method of color filters as claimed in claim 8, wherein this higher temperature is that 300 degree Celsius are to 900 degree.
11. manufacturing method of color filters as claimed in claim 8, wherein this higher temperature is that 300 degree Celsius are to 400 degree.
12. manufacturing method of color filters as claimed in claim 8, wherein the employed gas of this annealing process be selected from group that nitrogen, nitrogen and hydrogen, ammonia, ammonia and hydrogen forms one of them.
13. manufacturing method of color filters as claimed in claim 8, wherein the time of this annealing process is 10 minutes to 4 hours.
14. manufacturing method of color filters as claimed in claim 8, wherein this first loosely organized composite bed, this second loosely organized composite bed and this 3rd loosely organized composite bed be respectively red rete, green rete or blue rete one of them.
15. manufacturing method of color filters as claimed in claim 8, wherein this first loosely organized composite bed, this second loosely organized composite bed and this 3rd loosely organized composite bed comprise titanium oxide layer and the silicon oxide layer stack layer, tantalum pentoxide layer and the silicon oxide layer that the form stack layer that the stack layer that forms or zinc sulfide layer and magnesium fluoride layer be staggeredly stacked and form that is staggeredly stacked that is staggeredly stacked respectively.
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| CN200610148615A CN101183156B (en) | 2006-11-14 | 2006-11-14 | Manufacturing method of colourful optical filter |
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| CN200610148615A CN101183156B (en) | 2006-11-14 | 2006-11-14 | Manufacturing method of colourful optical filter |
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| CN101183156B true CN101183156B (en) | 2010-05-19 |
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| CN102331596B (en) * | 2011-10-09 | 2013-12-04 | 华映视讯（吴江）有限公司 | Colored resin composition and method for forming multicolor optical filter |
| CN102520466B (en) * | 2011-11-28 | 2013-12-18 | 上海新华灯具厂 | Selective coating for blocking blue light source and manufacture method and application thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5930046A (en) * | 1997-02-13 | 1999-07-27 | Optical Coating Laboratory, Inc. | Low net stress multilayer thin film coatings |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5930046A (en) * | 1997-02-13 | 1999-07-27 | Optical Coating Laboratory, Inc. | Low net stress multilayer thin film coatings |
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| Title |
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| JP特开平10-115711A 1998.05.06 |
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